Wafer position adjustment method, device, electronic equipment and storage medium

Abstract

The present invention discloses a method, device, electronic device and storage medium for adjusting the position of a wafer, and relates to the field of wafer processing technology. The method comprises: transmitting an infrared sensor matrix of a first dimension to a wafer turntable through an infrared sensor array; determining the first coordinate information of a target buckle in the infrared sensor matrix of the first dimension, and if it is determined that the first coordinate information does not meet the preset coordinate information, transmitting an infrared sensor matrix of a second dimension to the wafer turntable through the infrared sensor array; determining the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension; determining the rotation angle of the wafer turntable based on each coordinate information, and rotating the wafer turntable based on the rotation angle. The scheme of the present invention can adjust the position of the wafer, and can prevent the wafer buckle from damaging the manipulator of the robot arm.

Description

Technical Field

[0001] The present invention relates to the field of wafer processing technology, and in particular to a method, device, electronic equipment and storage medium for adjusting a wafer position. Background Art

[0002] Wafers are circular sheets made of high-purity silicon, which are the basic materials for manufacturing semiconductor devices. The wafer production process starts with silicon purification, which is made into single-crystal silicon rods through a series of complex processes, and then cut into thin slices and polished to form wafers. Common specifications for wafer diameters include 150 mm, 200 mm, and 300 mm. The larger the size, the more chips can be manufactured on each wafer.

[0003] When the wafer is undergoing physical vapor deposition, the motor drives the wafer disk to rotate so that the target material is evenly distributed on the wafer. After the physical vapor deposition operation is completed, the angle position of the wafer turntable is not fixed. In the process of removing the wafer by the robotic arm, it is easy for the wafer buckle to damage the robotic arm's manipulator.

[0004] How to adjust the wafer position after the wafer turntable stops rotating to prevent the wafer buckle from damaging the robot arm is a key research issue in the industry. Summary of the invention

[0005] The present invention provides a method, device, electronic device and storage medium for adjusting the position of a wafer, so as to adjust the position of the wafer after the wafer turntable stops rotating, so as to prevent the wafer buckle from damaging the manipulator of a robot arm, thereby improving the service life of the wafer processing device.

[0006] According to one aspect of the present invention, a method for adjusting the position of a wafer is provided, which is applied to a wafer processing system, wherein the wafer processing system comprises: a wafer turntable, the wafer turntable is rotated by a motor, and a target wafer is rotated along with the wafer turntable based on at least three buckles; an infrared sensor array is deployed above the wafer turntable, and the infrared sensor array is used to emit infrared sensor matrices of different dimensions; the method comprises:

[0007] In response to a rotation stop instruction of the wafer turntable, an infrared sensor matrix of a first dimension is emitted to the wafer turntable through an infrared sensor array;

[0008] Determine the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, and if it is determined that the first coordinate information does not meet the preset coordinate information, transmit the infrared sensor matrix of the second dimension to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension;

[0009] Determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension;

[0010] The rotation angle of the wafer turntable is determined based on the second coordinate information and each of the third coordinate information, and the wafer turntable is rotated based on the rotation angle.

[0011] According to another aspect of the present invention, a wafer position adjustment device is provided, which is deployed in a wafer processing system, wherein the wafer processing system comprises: a wafer turntable, wherein the wafer turntable is rotated by a motor control, and the target wafer is rotated along with the wafer turntable based on at least three buckles; an infrared sensor array is deployed above the wafer turntable, wherein the infrared sensor array is used to emit infrared sensor matrices of different dimensions; the device comprises:

[0012] A first-dimensional infrared sensing matrix determination module, configured to respond to a rotation stop instruction of the wafer turntable and transmit a first-dimensional infrared sensing matrix to the wafer turntable through an infrared sensor array;

[0013] The infrared sensor matrix determination module of the second dimension is used to determine the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, and if it is determined that the first coordinate information does not meet the preset coordinate information, the infrared sensor matrix of the second dimension is emitted to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension;

[0014] A third coordinate information determination module, used to determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension;

[0015] The rotation angle determination module is used to determine the rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information, and rotate the wafer turntable based on the rotation angle.

[0016] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0017] at least one processor; and

[0018] a memory communicatively connected to the at least one processor; wherein,

[0019] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the wafer position adjustment method described in any embodiment of the present invention.

[0020] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the wafer position adjustment method described in any embodiment of the present invention when executed.

[0021] According to another aspect of the present invention, a computer program product is provided, comprising a computer program, wherein when the computer program is executed by a processor, the method for adjusting the wafer position according to any embodiment of the present invention is implemented.

[0022] The technical solution of the embodiment of the present invention is to respond to the rotation stop instruction of the wafer turntable, transmit the infrared sensor matrix of the first dimension to the wafer turntable through the infrared sensor array; determine the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, if it is determined that the first coordinate information does not meet the preset coordinate information, transmit the infrared sensor matrix of the second dimension to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension; determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension; determine the rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information, and rotate the wafer turntable based on the rotation angle, so that the wafer position can be adjusted after the rotation of the wafer turntable stops, which can prevent the wafer buckle from damaging the manipulator of the robot arm, thereby improving the service life of the wafer processing device.

[0023] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 is a flow chart of a method for adjusting a wafer position provided according to Embodiment 1 of the present invention;

[0026] Figure 2 is a structural schematic diagram of a wafer processing system provided according to Embodiment 1 of the present invention;

[0027] Figure 3 is a schematic diagram of an infrared sensor matrix provided according to Embodiment 1 of the present invention;

[0028] Figure 4 is a flow chart of a method for adjusting the position of a wafer provided according to a second embodiment of the present invention;

[0029] Figure 5 is a schematic diagram of an infrared sensor matrix of a first dimension provided according to Embodiment 2 of the present invention;

[0030] Figure 6 is a schematic diagram of a calculation process of a first rotation angle provided according to a second embodiment of the present invention;

[0031] Figure 7 is a flow chart of another wafer position adjustment method provided according to the second embodiment of the present invention;

[0032] Figure 8 is a schematic structural diagram of a wafer position adjustment device provided according to a third embodiment of the present invention;

[0033] Fig. 9 It is a structural schematic diagram of an electronic device for implementing the wafer position adjustment method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0035] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0036] Embodiment 1

[0037] Figure 1 It is a flow chart of a wafer position adjustment method provided according to the first embodiment of the present invention. This embodiment is applicable to the situation where the wafer position is adjusted after the wafer turntable stops rotating. The method can be executed by a wafer position adjustment device. The wafer position adjustment device can be implemented in the form of hardware and / or software. The wafer position adjustment device can be deployed in a wafer processing system.

[0038] In this embodiment, the wafer processing system includes: a wafer turntable, which is rotated by a motor and causes the target wafer to rotate along with the wafer turntable based on at least three buckles; an infrared sensor array is deployed above the wafer turntable, and the infrared sensor array is used to emit infrared sensor matrices of different dimensions.

[0039] For example, Figure 2 It is a structural schematic diagram of a wafer processing system provided according to Example 1 of the present invention, wherein 210 is a wafer turntable, 220 is a target wafer, wherein the target wafer can be a wafer of any size, which is not limited in this embodiment; 230 is an infrared sensor array, which can be composed of a plurality of infrared sensors, for example, 32 or 64, etc., which is not limited in this embodiment; it can be understood that the dimension of the infrared sensor matrix emitted by the infrared sensor array can be 8*8, 64*64 or 128*128, etc., which is not limited in this embodiment.

[0040] In an optional implementation of this embodiment, the wafer processing system may further include a robot arm 240, which can move freely and install or remove the target wafer through a robot at the end; it should be noted that Figure 2 The positions of the buckles are not shown, which is not a limitation of this embodiment.

[0041] Specifically, refer to Figure 1, the wafer position adjustment method includes:

[0042] Step 110 , in response to a rotation stop instruction of the wafer turntable, emitting an infrared sensor matrix of a first dimension to the wafer turntable through an infrared sensor array.

[0043] Optionally, in this embodiment, when the wafer turntable drives the target wafer to rotate, completes physical and chemical deposition, and makes the target material evenly distributed on the surface of the target wafer, the motor controls the rotation speed of the wafer turntable to decrease until the wafer turntable stops rotating.

[0044] In an optional implementation of the present embodiment, after determining that the rotation speed of the wafer turntable is 0, that is, the wafer turntable stops rotating, a first-dimensional infrared sensor matrix can be further emitted to the wafer turntable through the infrared sensor array; wherein the first-dimensional infrared sensor matrix can be a lower-dimensional sensor matrix, for example, 6*6 or 8*8, etc., which is not limited in the present embodiment.

[0045] Step 120, determining the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, if it is determined that the first coordinate information does not meet the preset coordinate information, emitting the infrared sensor matrix of the second dimension to the wafer turntable through the infrared sensor array.

[0046] Wherein, the second dimension is greater than the first dimension; for example, if the first dimension is 8*8, the second dimension may be 16*16 or 64*64, etc., which is not limited in this embodiment. Figure 3 is a schematic diagram of an infrared sensor matrix provided according to the first embodiment of the present invention; it can be seen that the infrared sensor matrix is ​​composed of a plurality of grids, such as Figure 3 The dimension of the infrared sensor matrix in is 8*8, and the total number of grids is 64.

[0047] In this embodiment, the target buckle in this embodiment may be any buckle that prevents the target wafer from falling off, and this embodiment does not limit it.

[0048] Optionally, in this embodiment, after emitting the infrared sensor matrix of the first dimension to the wafer turntable through the infrared sensor array, the first coordinate information of the target buckle within the infrared sensor matrix of the first dimension can be further determined. Exemplarily, in this embodiment, the first coordinate information can be determined based on the coordinate information of the target grid within the infrared sensor matrix of the first dimension where the target buckle is located.

[0049] Furthermore, it can be further determined whether the first coordinate information satisfies the preset coordinate information. It should be noted that in this embodiment, the preset coordinate information is not a fixed coordinate point, but the angle between the target buckle and the robot arm during the process of grabbing the target wafer by the robot arm. Exemplarily, the angle can be 90 degrees, 180 degrees, 270 degrees or 360 degrees, etc., which is not limited in this embodiment.

[0050] In an optional implementation of the present embodiment, after determining the first coordinate information of the target buckle, the angle between the manipulator and the target buckle when the manipulator grabs the target wafer can be further determined based on the first coordinate information. If the angle between the two is determined to be 180 degrees, it is considered that the manipulator will not touch the target buckle when grabbing the target wafer, and will not damage the manipulator.

[0051] In another optional implementation of this embodiment, if the angle between the two is determined to be 110 degrees, it is considered that the robot will touch the target buckle when grabbing the target wafer, which will damage the robot. At this time, it is necessary to transmit an infrared sensor matrix of a second dimension larger than the first dimension to the wafer turntable through an infrared sensor array, for example, 32*32 or 64*64, etc., which is not limited in this embodiment.

[0052] Optionally, in this embodiment, if it is determined that the first coordinate information satisfies preset coordinate information, the target wafer is removed based on the robot arm.

[0053] The advantage of this setting is that if it is determined that the first coordinate information of the target buckle meets the preset coordinate information, it can be assumed that the robot will not touch the target buckle when grabbing the target wafer, the robot will not be damaged, and the target wafer can be grabbed quickly.

[0054] Step 130: Determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension.

[0055] Optionally, in this embodiment, after emitting an infrared sensor matrix of a second dimension greater than the first dimension to the wafer turntable through the infrared sensor array, second coordinate information of the target buckle within the infrared sensor matrix of the second dimension can be further determined.

[0056] In an optional implementation of this embodiment, after determining the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, the coordinate information of other buckles in the wafer processing system except the target buckle in the infrared sensor matrix of the second dimension can be further obtained.

[0057] It should be noted that, in this embodiment, the method for determining the second coordinate information and the third coordinate information is consistent with the method for determining the first coordinate information, which will not be described in detail in this embodiment and is not a limitation of this embodiment.

[0058] Step 140: determine a rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information, and rotate the wafer turntable based on the rotation angle.

[0059] Optionally, in this embodiment, after determining the second coordinate information and each third coordinate information, the rotation angle of the wafer turntable can be further determined based on the second coordinate information and each third coordinate information, and the rotation angle can be sent to the motor in the wafer processing system so that the motor drives the wafer turntable to rotate based on the rotation angle.

[0060] In an optional implementation of this embodiment, the rotation angle of the wafer turntable can be determined based on the second coordinate information and the third coordinate information respectively. Further, the average value of each rotation angle can be determined, and the average rotation angle is determined as the angle that the wafer turntable needs to rotate.

[0061] The technical solution of this embodiment is to respond to the rotation stop instruction of the wafer turntable by emitting an infrared sensor matrix of a first dimension to the wafer turntable through an infrared sensor array; determine the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, and if it is determined that the first coordinate information does not meet the preset coordinate information, emit an infrared sensor matrix of a second dimension to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension; determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension; determine the rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information, and rotate the wafer turntable based on the rotation angle, so that the position of the wafer can be adjusted after the rotation of the wafer turntable stops, which can prevent the wafer buckle from damaging the manipulator of the robot arm, thereby increasing the service life of the wafer processing device.

[0062] Embodiment 2

[0063] Figure 4 1 is a flow chart of a wafer position adjustment method provided according to Embodiment 2 of the present invention. This embodiment is a further refinement of the above technical solution. The technical solution in this embodiment can be combined with various optional solutions in one or more of the above embodiments. Figure 4 As shown, the method includes:

[0064] Step 410: In response to a rotation stop instruction of the wafer turntable, an infrared sensor matrix of a first dimension is emitted to the wafer turntable through an infrared sensor array.

[0065] Step 420: Determine first coordinate information of the target buckle within the infrared sensor matrix of the first dimension.

[0066] Optionally, in this embodiment, after the infrared sensor matrix of the first dimension is emitted to the wafer turntable through the infrared sensor array, the first coordinate information of the target buckle within the infrared sensor matrix of the first dimension can be further determined.

[0067] In an optional implementation of the present embodiment, determining the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension may include: determining the target grid of the infrared sensor matrix of the first dimension where the target buckle falls; determining the coordinates of the target grid based on the infrared sensor matrix of the first dimension, and determining the coordinates of the target grid as the first coordinate information.

[0068] Optionally, in this embodiment, after the infrared sensor array transmits the infrared sensor matrix of the first dimension to the wafer turntable, it is possible to further determine that the target buckle falls on the target grid of the infrared sensor matrix of the first dimension; further, the coordinates of the target grid in the infrared sensor matrix of the first dimension can be determined, and the coordinates are determined as the first coordinate information of the target; illustratively, Figure 5 is a schematic diagram of the infrared sensor matrix of the first dimension provided according to the second embodiment of the present invention; in this embodiment, the uppermost red dot is determined as the target buckle, and the coordinates of the target grid where the target buckle falls in the infrared sensor matrix of the first dimension can be expressed as (4, 8).

[0069] Optionally, in this embodiment, after determining the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, it may also include: determining the target angle formed by the target buckle and the robot arm when grasping the target wafer based on the first coordinate information; if the target angle meets the set angle threshold, it is determined that the first coordinate information meets the preset coordinate information; otherwise, it is determined that the first coordinate information does not meet the preset coordinate information.

[0070] The set angle threshold is 90 degrees, 180 degrees, 270 degrees or 360 degrees.

[0071] In an optional implementation of this embodiment, after determining the first coordinate information of the target buckle, the target angle between the manipulator of the robot arm and the target buckle when grasping the target wafer can be further determined based on the first coordinate information; illustratively, the posture of the manipulator when grasping the target wafer can be determined according to the design and grasping requirements of the manipulator; for example, if the manipulator is a claw-type design, the direction of the claw is consistent with the opening direction of the target buckle; if it is a suction cup type, the suction cup surface is perpendicular to the surface of the target wafer. Further, the posture of the manipulator when grasping the target wafer can be determined, such as the angle between the normal vector of the manipulator and the line connecting the target grid and the center of the circle, and the angle can be determined as the target angle.

[0072] In this embodiment, after determining the target angle, it can be further determined whether the target angle meets the set angle threshold; if it is determined that the target angle meets the set angle threshold, it can be determined that the first coordinate information of the target buckle meets the preset coordinate information.

[0073] Exemplarily, if the target angle is 90 degrees, then it can be determined that the target angle meets the set angle threshold, that is, the first coordinate information of the target buckle meets the preset coordinate information; if the target angle is 130 degrees, then it can be determined that the target angle does not meet the set angle threshold, that is, the first coordinate information of the target buckle does not meet the preset coordinate information.

[0074] Step 430: If it is determined that the first coordinate information does not satisfy the preset coordinate information, an infrared sensor matrix of a second dimension is emitted to the wafer turntable through an infrared sensor array.

[0075] Step 440: Determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension.

[0076] Optionally, in this embodiment, determining the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension may include: determining the reference grid of the infrared sensor matrix of the second dimension where the target buckle falls; determining the coordinates of the reference grid based on the infrared sensor matrix of the second dimension, and determining the coordinates of the reference grid as the second coordinate information; determining the relevant grids of the infrared sensor matrix of the second dimension where other buckles except the target buckle fall; determining the coordinates of each of the relevant grids based on the infrared sensor matrix of the second dimension, and determining the coordinates of each of the relevant grids as the third coordinate information.

[0077] Optionally, in this embodiment, after determining that the first coordinate information of the target buckle does not meet the preset coordinate information, the reference grid of the infrared sensor matrix of the second dimension where the target buckle falls can be further determined; further, the coordinates of the reference grid can be determined based on the infrared sensor matrix of the second dimension, and the coordinates of the reference grid can be determined as the second coordinate information of the target buckle; further, the relevant grids of the infrared sensor matrix of the second dimension where other buckles except the target buckle fall can also be determined; the coordinates of each of the relevant grids are determined based on the infrared sensor matrix of the second dimension, and the coordinates of each of the relevant grids are determined as the third coordinate information.

[0078] Step 450: determine a rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information, and rotate the wafer turntable based on the rotation angle.

[0079] Optionally, in this embodiment, after the second coordinate information and each third coordinate information of the infrared sensor matrix of the second dimension are determined, the rotation angle of the wafer turntable can be further determined based on the second coordinate information and each third coordinate information.

[0080] In an optional implementation of the present embodiment, determining the rotation angle of the wafer turntable based on the second coordinate information and each third coordinate information may include: determining the target coordinate information of the target buckle, and determining the first rotation angle based on the target coordinate information and the second coordinate information; determining the reference coordinate information of other buckles, and determining each second rotation angle based on the reference coordinate information and the third coordinate information; determining the rotation angle of the wafer turntable based on the first rotation angle and each second rotation angle.

[0081] Optionally, in this embodiment, after determining the second coordinate information and each third coordinate information of the infrared sensor matrix of the second dimension, the target coordinate information of the target buckle can be determined, and the first rotation angle can be determined based on the target coordinate information and the second coordinate information; it can be understood that the target coordinate information of the target buckle is the coordinate information of the target buckle that satisfies the preset coordinate information; exemplarily, Figure 6 is a schematic diagram of a calculation process of a first rotation angle according to the second embodiment of the present invention. Figure 6 As shown, the second coordinate information of the target buckle is (16, 60), and the target coordinate information is (32, 64), so the first rotation angle can be ; Correspondingly, the second rotation angles can be obtained respectively according to the above method.

[0082] Further, an average value of the first rotation angle and each of the second rotation angles may be determined; and the average value may be determined as the rotation angle of the wafer turntable.

[0083] In another optional implementation of this embodiment, after determining the first rotation angle and each second rotation angle, the median of the first rotation angle and each second rotation angle may be determined, and the median is determined as the rotation angle of the wafer turntable.

[0084] The scheme of this embodiment is to determine the target grid of the infrared sensor matrix of the first dimension where the target buckle falls; determine the coordinates of the target grid based on the infrared sensor matrix of the first dimension, and determine the coordinates of the target grid as the first coordinate information; if it is determined that the first coordinate information does not meet the preset coordinate information, continue to determine the reference grid of the infrared sensor matrix of the second dimension where the target buckle falls; determine the coordinates of the reference grid based on the infrared sensor matrix of the second dimension, and determine the coordinates of the reference grid as the second coordinate information; determine the relevant grids of the infrared sensor matrix of the second dimension where other buckles except the target buckle fall; determine the relevant grids of the infrared sensor matrix of the second dimension based on the infrared sensor matrix of the second dimension The external sensing matrix determines the coordinates of each of the related grids, and determines the coordinates of each of the related grids as the third coordinate information. Further, the target coordinate information of the target buckle can be determined, and the first rotation angle can be determined based on the target coordinate information and the second coordinate information; the reference coordinate information of other buckles can be determined, and each second rotation angle can be determined based on the reference coordinate information and the third coordinate information; the rotation angle of the wafer turntable is determined based on the first rotation angle and each second rotation angle. After the wafer turntable stops rotating, the position of the wafer can be adjusted to prevent the wafer buckle from damaging the manipulator of the robot arm, thereby increasing the service life of the wafer processing device.

[0085] In order to better understand the wafer position adjustment method involved in this embodiment, an example is used below to illustrate it; Figure 7 is a flow chart of another wafer position adjustment method provided according to the second embodiment of the present invention;

[0086] Step 710: Initialize the number of grids of the array sensor and determine the landing position of each buckle.

[0087] Step 720: Whether the motor stops;

[0088] If stop executing step 730;

[0089] Otherwise, execute step 721.

[0090] Step 721, control the motor to stop rotating.

[0091] Step 730: Whether the coordinate information of the target buckle meets the preset coordinate information;

[0092] If yes, execute step 731;

[0093] Otherwise, execute step 740.

[0094] Step 731, directly control the motor to reset to the standard position, and the process ends.

[0095] Step 740: Whether the target buckle is on the edge of the grid;

[0096] If yes, execute step 741;

[0097] Otherwise, execute step 750.

[0098] Step 741, subdivide the number of grids of the array sensor, and determine the position of the grid where each buckle falls.

[0099] Step 750: Collect the position information of the three buckles, and calculate the rotation angle according to each position information.

[0100] The present invention can be dynamically set according to the required accuracy, and can automatically increase the accuracy when encountering special circumstances; it can eliminate failures caused by wafer finger impact damage and save costs; at the same time, there are only three wafer buckle points, the calculation complexity is low and the performance is high, and the angles calculated for the grids where the three wafer buckles are located are averaged, which increases robustness.

[0101] Embodiment 3

[0102] Figure 8 : is a schematic diagram of the structure of a wafer position adjustment device provided according to the third embodiment of the present invention. The device can be deployed in a wafer processing system, the wafer processing system comprising: a wafer turntable, the wafer turntable is rotated by a motor control, and based on at least three buckles, the target wafer rotates with the wafer turntable; an infrared sensor array is deployed above the wafer turntable, the infrared sensor array is used to emit infrared sensor matrices of different dimensions; Figure 8 As shown, the device includes: a first-dimensional infrared sensor matrix determination module 810, a second-dimensional infrared sensor matrix determination module 820, a third coordinate information determination module 830 and a rotation angle determination module 840.

[0103] The infrared sensing matrix determining module 810 of the first dimension is used to transmit the infrared sensing matrix of the first dimension to the wafer turntable through the infrared sensor array in response to the rotation stop instruction of the wafer turntable;

[0104] The second-dimensional infrared sensor matrix determination module 820 is used to determine the first coordinate information of the target buckle in the first-dimensional infrared sensor matrix, and if it is determined that the first coordinate information does not meet the preset coordinate information, the second-dimensional infrared sensor matrix is ​​emitted to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension;

[0105] A third coordinate information determination module 830, used to determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension;

[0106] The rotation angle determination module 840 is used to determine the rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information, and rotate the wafer turntable based on the rotation angle.

[0107] The scheme of this embodiment is to respond to the rotation stop instruction of the wafer turntable by the infrared sensor matrix determination module of the first dimension, and transmit the infrared sensor matrix of the first dimension to the wafer turntable through the infrared sensor array; determine the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension by the infrared sensor matrix determination module of the second dimension, if it is determined that the first coordinate information does not meet the preset coordinate information, then transmit the infrared sensor matrix of the second dimension to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension; determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension by the third coordinate information determination module; determine the rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information by the rotation angle determination module, and rotate the wafer turntable based on the rotation angle, so that the position of the wafer can be adjusted after the rotation of the wafer turntable stops, so as to prevent the wafer buckle from damaging the manipulator of the robot arm, thereby improving the service life of the wafer processing device.

[0108] In an optional implementation of this embodiment, the wafer processing system further includes: a robotic arm; the robotic arm is used to take out the target wafer after the target wafer is processed;

[0109] Correspondingly, the wafer position adjustment device further includes: a wafer grabbing module, which removes the target wafer based on the robot arm if it is determined that the first coordinate information satisfies the preset coordinate information.

[0110] In an optional implementation of this embodiment, the second-dimensional infrared sensor matrix determination module 820 is specifically used to determine the target grid of the infrared sensor matrix of the first dimension where the target buckle falls;

[0111] The coordinates of the target grid are determined based on the infrared sensing matrix of the first dimension, and the coordinates of the target grid are determined as first coordinate information.

[0112] In an optional implementation of this embodiment, the second-dimensional infrared sensor matrix determination module 820 is further specifically used to determine a target angle formed by the target buckle and the robot arm when grabbing the target wafer based on the first coordinate information;

[0113] If the target angle satisfies the set angle threshold, determining that the first coordinate information satisfies the preset coordinate information;

[0114] Otherwise, determining that the first coordinate information does not satisfy the preset coordinate information;

[0115] The set angle threshold is 90 degrees, 180 degrees, 270 degrees or 360 degrees.

[0116] In an optional implementation of this embodiment, the third coordinate information determination module 830 is specifically used to determine the reference grid of the infrared sensor matrix in the second dimension where the target buckle falls;

[0117] Determine the coordinates of the reference grid based on the infrared sensing matrix of the second dimension, and determine the coordinates of the reference grid as second coordinate information;

[0118] Determine the relevant grids of the infrared sensor matrix of the second dimension where other buckles except the target buckle fall;

[0119] The coordinates of each of the related grids are determined based on the infrared sensing matrix of the second dimension, and the coordinates of each of the related grids are determined as third coordinate information.

[0120] In an optional implementation of this embodiment, the rotation angle determination module 840 is specifically used to determine the target coordinate information of the target buckle, and determine the first rotation angle based on the target coordinate information and the second coordinate information;

[0121] Determine reference coordinate information of other buckles, and determine each second rotation angle based on the reference coordinate information and the third coordinate information;

[0122] The rotation angle of the wafer turntable is determined based on the first rotation angle and each of the second rotation angles.

[0123] In an optional implementation of this embodiment, the rotation angle determination module 840 is further specifically configured to determine an average value of the first rotation angle and each of the second rotation angles;

[0124] The average value is determined as the rotation angle of the wafer turntable.

[0125] The wafer position adjustment device provided in the embodiment of the present invention can execute the wafer position adjustment method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0126] Embodiment 4

[0127] Fig. 9 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0128] like Fig. 9 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. The input / output (I / O) interface 15 is also connected to the bus 14.

[0129] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0130] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a method for adjusting the position of a wafer, which can be applied to a wafer processing system, the wafer processing system comprising: a wafer turntable, the wafer turntable is rotated by a motor control, and the target wafer is rotated with the wafer turntable based on at least three buckles; an infrared sensor array is deployed above the wafer turntable, and the infrared sensor array is used to emit infrared sensing matrices of different dimensions; the method for adjusting the position of the wafer comprises: in response to a rotation stop instruction of the wafer turntable, emitting an infrared sensing matrix of a first dimension to the wafer turntable through the infrared sensor array; determining the position of the target buckle in the wafer turntable; The first coordinate information in the infrared sensor matrix of the first dimension is determined. If it is determined that the first coordinate information does not meet the preset coordinate information, the infrared sensor matrix of the second dimension is emitted to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension; the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension are determined; the rotation angle of the wafer turntable is determined based on the second coordinate information and each of the third coordinate information, and the wafer turntable is rotated based on the rotation angle.

[0131] In some embodiments, the method for adjusting the wafer position may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the method for adjusting the wafer position described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to execute the method for adjusting the wafer position in any other appropriate manner (e.g., by means of firmware).

[0132] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0133] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0134] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, device, or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0135] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0136] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0137] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0138] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0139] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

[0140] An embodiment of the present invention further provides a computer program product, including a computer program, which, when executed by a processor, implements the database detection method provided in any embodiment of the present application.

[0141] In the process of implementation, the computer program product can be written in one or more programming languages ​​or a combination thereof to perform the computer program code of the present invention, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or completely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, using an Internet service provider to connect through the Internet).

[0142] It should be noted that in the embodiments of the present application, certain software, components, models and other existing solutions in the industry may be mentioned, and they should be regarded as exemplary. Their purpose is only to illustrate the feasibility of implementing the technical solution of the present application, but it does not mean that the applicant has or will necessarily use the solution.

[0143] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for adjusting the position of a wafer, characterized in that: Applied to a wafer processing system, the wafer processing system comprises: a wafer turntable, the wafer turntable is rotated by a motor control, and based on at least three buckles, a target wafer is rotated along with the wafer turntable; an infrared sensor array is deployed above the wafer turntable, and the infrared sensor array is used to emit infrared sensor matrices of different dimensions; the wafer position adjustment method comprises: In response to a rotation stop instruction of the wafer turntable, emitting an infrared sensing matrix of a first dimension to the wafer turntable through an infrared sensor array; Determine the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, and if it is determined that the first coordinate information does not meet the preset coordinate information, transmit the infrared sensor matrix of the second dimension to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension; Determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension; The rotation angle of the wafer turntable is determined based on the second coordinate information and each of the third coordinate information, and the wafer turntable is rotated based on the rotation angle.

2. The method for adjusting the wafer position according to claim 1, characterized in that: The wafer processing system further includes: a robotic arm; the robotic arm is used to take out the target wafer after the target wafer is processed; Accordingly, the method further includes: If it is determined that the first coordinate information satisfies the preset coordinate information, the target wafer is removed based on the robot arm.

3. The method for adjusting the wafer position according to claim 1, characterized in that: The determining of the first coordinate information of the target buckle in the infrared sensing matrix of the first dimension includes: Determine the target grid of the infrared sensor matrix of the first dimension where the target buckle falls; The coordinates of the target grid are determined based on the infrared sensing matrix of the first dimension, and the coordinates of the target grid are determined as first coordinate information.

4. The method for adjusting the wafer position according to claim 3, characterized in that: After determining the first coordinate information of the target buckle in the infrared sensing matrix of the first dimension, the method further includes: Determine a target angle formed by the target buckle and the robot arm when grabbing the target wafer based on the first coordinate information; If the target angle satisfies the set angle threshold, determining that the first coordinate information satisfies the preset coordinate information; Otherwise, determining that the first coordinate information does not satisfy the preset coordinate information; The set angle threshold is 90 degrees, 180 degrees, 270 degrees or 360 degrees.

5. The method for adjusting the wafer position according to claim 1, characterized in that: The determining of the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension, includes: Determine the reference grid of the infrared sensor matrix in the second dimension where the target buckle falls; Determine the coordinates of the reference grid based on the infrared sensing matrix of the second dimension, and determine the coordinates of the reference grid as second coordinate information; Determine the relevant grids of the infrared sensor matrix of the second dimension where other buckles except the target buckle fall; The coordinates of each of the related grids are determined based on the infrared sensing matrix of the second dimension, and the coordinates of each of the related grids are determined as third coordinate information.

6. The method for adjusting the wafer position according to claim 1, characterized in that: Determining the rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information includes: Determine target coordinate information of the target buckle, and determine a first rotation angle based on the target coordinate information and the second coordinate information; Determine reference coordinate information of other buckles, and determine each second rotation angle based on the reference coordinate information and the third coordinate information; The rotation angle of the wafer turntable is determined based on the first rotation angle and each of the second rotation angles.

7. The method for adjusting the wafer position according to claim 6, characterized in that: The determining the rotation angle of the wafer turntable based on the first rotation angle and each of the second rotation angles includes: determining an average value of the first rotation angle and each of the second rotation angles; The average value is determined as the rotation angle of the wafer turntable.

8. A wafer position adjustment device, characterized in that: Deployed in a wafer processing system, the wafer processing system includes: a wafer turntable, the wafer turntable is rotated by a motor, and based on at least three buckles, the target wafer rotates with the wafer turntable; an infrared sensor array is deployed above the wafer turntable, and the infrared sensor array is used to emit infrared sensor matrices of different dimensions; the wafer position adjustment device includes: A first-dimensional infrared sensing matrix determination module, configured to respond to a rotation stop instruction of the wafer turntable and transmit a first-dimensional infrared sensing matrix to the wafer turntable through an infrared sensor array; The infrared sensor matrix determination module of the second dimension is used to determine the first coordinate information of the target buckle in the infrared sensor matrix of the first dimension, and if it is determined that the first coordinate information does not meet the preset coordinate information, the infrared sensor matrix of the second dimension is emitted to the wafer turntable through the infrared sensor array; wherein the second dimension is greater than the first dimension; A third coordinate information determination module, used to determine the second coordinate information of the target buckle in the infrared sensor matrix of the second dimension, and the third coordinate information of other buckles except the target buckle in the infrared sensor matrix of the second dimension; The rotation angle determination module is used to determine the rotation angle of the wafer turntable based on the second coordinate information and each of the third coordinate information, and rotate the wafer turntable based on the rotation angle.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the wafer position adjustment method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the wafer position adjustment method according to any one of claims 1 to 7 when executed.

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