Circuit board punching processing method and circuit board punching device

By converting the data of the circuit board and the pad into a coordinate plane, and calculating the position of the drilling point, forming connected guide grooves and suctioning, the problem of metal debris and powder adhesion during the circuit board drilling process is solved, and the drilling accuracy and finished product quality are improved.

CN119855048APending Publication Date: 2025-04-18KUSN HULI MICROELECTRONICS
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Patent Information

Application Number
CN202510049367.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-13
Publication Date
2025-04-18

AI Technical Summary

Technical Problem

During the drilling process of circuit boards, the metal debris and powder generated are attached to the hole walls of the plug holes, affecting the drilling accuracy and the processing quality of the finished circuit board.

Method used

By converting the circuit board data into a first coordinate plane and combining the pad plate data into a second coordinate plane, the position of the punching point on the pad plate is simulated and calculated, forming a first guide groove and a second guide groove that is connected, synchronously suctioning the notch of the second guide groove to remove metal debris and powder.

Benefits of technology

It effectively avoids metal debris and powder adhering to the hole wall of the plug-in hole, improves the drilling accuracy of the plug-in holes on the circuit board, and ensures the processing quality of the finished circuit board.

✦ Generated by Eureka AI based on patent content.

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    Figure CN119855048A_ABST
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Abstract

The invention belongs to the technical field of circuit board manufacturing, and discloses a circuit board punching processing method and a circuit board punching device.The circuit board punching processing method comprises the steps that circuit board data is converted into a first coordinate plane, and a plurality of points to be punched on a circuit board are marked as a plurality of first coordinate points in the first coordinate plane; converting the base plate data into a second coordinate plane; the first coordinate plane is placed on the second coordinate plane in a simulated mode, and a plurality of punching points on the base plate are calculated according to the first coordinate points; drilling is conducted on the multiple punching points, and a first guide groove is correspondingly formed in the base plate; a second guide groove communicating with the first guide groove is machined, and the second guide groove extends to the side face of the base plate; and the circuit board is placed on the base plate, a plurality of points to be punched are punched, and the notch of the second guide groove is sucked synchronously. According to the circuit board punching machining method, metal scraps and powder generated in the circuit board punching process can be sucked, the precision of the insertion hole is guaranteed, and then the quality of the finished circuit board is guaranteed.
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