Flexible circuit board processing method, device, equipment, computer device and flexible circuit board

Abstract

The application relates to a flexible circuit board processing method, device, equipment, computer device and flexible circuit board. The method comprises the following steps: obtaining a target circuit processing pattern, the target circuit processing pattern comprises a target cutting line, the target cutting line is divided into a plurality of cutting line segments by at least one connecting part; laser cutting is performed on a to-be-processed flexible circuit board along each cutting line segment, waste and a target flexible circuit board connected by the connecting part are formed; laser cutting is performed on each connecting part, so that the waste is separated from the target flexible circuit board, and the target flexible circuit board is obtained. The processing precision can be improved by using the method.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a method, apparatus, equipment, computer equipment, and flexible circuit board for processing flexible circuit boards. Background Technology

[0002] Flexible printed circuit boards (FPCBs) are circuit boards made of flexible substrates, characterized by their thinness, flexibility, and foldability. In the cutting and processing of FPCBs, the FPCB is typically placed on a honeycomb board, held in place by negative pressure, and then cut using precision cutting equipment.

[0003] However, with the miniaturization and precision of electronic products, the circuit structures on flexible circuit boards are becoming increasingly smaller, demanding higher cutting precision. The honeycomb board's adhesion to these small structures is difficult to distribute evenly, leading to unstable adhesion or localized deformation. This can cause the circuit board to shift or the material to not be cut through during the cutting process, resulting in insufficient processing precision to meet product requirements. Summary of the Invention

[0004] Therefore, it is necessary to provide a flexible circuit board processing method, apparatus, equipment, computer equipment, and flexible circuit board that can improve processing accuracy in response to the above-mentioned technical problems.

[0005] In a first aspect, this application provides a method for processing a flexible printed circuit board, the method comprising:

[0006] Obtain the target circuit processing pattern, which includes the target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0007] Laser cutting is performed along each cutting line segment to form waste material and the target flexible circuit board that are interconnected by connecting parts;

[0008] Laser cutting is performed on each connection part to separate the waste material from the target flexible circuit board, thus obtaining the target flexible circuit board.

[0009] In one embodiment, the target circuit pattern further includes a material region, which includes at least one of a strip-shaped region and an arc-shaped region.

[0010] The connecting part is located in the middle of the elongated area and on at least one corresponding target cutting line in the arc-shaped area.

[0011] In one embodiment, the length of the connector is 200-350 μm.

[0012] In one embodiment, the target cutting line includes multiple local line segments in a preset direction, which is either horizontal or vertical; multiple connecting parts are arranged alternately on the multiple local line segments in the preset direction.

[0013] In one embodiment, before obtaining the target line processing pattern, the method further includes:

[0014] Obtain the initial circuit processing pattern and the processing characteristics information of the flexible circuit board to be processed. The initial circuit processing pattern includes the initial cutting lines.

[0015] Determine the spacing between adjacent connecting parts based on processing characteristic information;

[0016] Based on the interval distance, multiple connecting parts are set on the initial cutting line to obtain the target line processing pattern.

[0017] In one embodiment, before laser cutting the flexible circuit board to be processed along each cutting line segment to form waste material and the target flexible circuit board interconnected by the connecting portion, the method further includes:

[0018] The flexible circuit board to be processed is adsorbed onto a circular hole fixture, wherein the circular hole fixture includes multiple adsorption holes with a diameter of less than or equal to 300 μm.

[0019] In one embodiment, the target circuit pattern also includes a material area;

[0020] The adsorption pores are positioned opposite the material region, and the diameter of the adsorption pores is less than or equal to the minimum width of the material region.

[0021] In one embodiment, the flexible circuit board to be processed is laser-cut along each cutting line segment to form waste material and the target flexible circuit board interconnected by connecting parts, including:

[0022] Detect the distance between each cutting line segment and its adjacent and parallel cutting line segments;

[0023] Each cut line segment is laser-cut in order of increasing spacing to form waste material and target flexible circuit board that are interconnected by connecting parts.

[0024] Secondly, this application also provides a flexible circuit board processing apparatus, the apparatus comprising:

[0025] The acquisition module is used to acquire the target circuit processing pattern, which includes the target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0026] The first cutting module is used to perform laser cutting along each cutting line segment of the flexible circuit board to be processed, forming waste material and target flexible circuit board that are interconnected by the connecting part;

[0027] The second cutting module is used to laser cut each connecting part so that the waste material is separated from the target flexible circuit board and the target flexible circuit board is obtained.

[0028] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0029] Obtain the target circuit processing pattern, which includes the target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0030] Laser cutting is performed along each cutting line segment to form waste material and the target flexible circuit board that are interconnected by connecting parts;

[0031] Laser cutting is performed on each connection part to separate the waste material from the target flexible circuit board, thus obtaining the target flexible circuit board.

[0032] Fourthly, this application also provides a laser processing device that uses the above-described flexible circuit board processing method to perform laser processing on flexible circuit boards.

[0033] Fifthly, this application also provides a flexible circuit board, which is manufactured using the flexible circuit board processing method described above.

[0034] Sixthly, this application also provides a laser processing system, including a controller and the aforementioned laser processing equipment, wherein the controller is used for:

[0035] Obtain the target circuit processing pattern, which includes the target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0036] Control the laser processing equipment to perform laser cutting along each cutting line segment of the flexible circuit board to be processed, forming waste material and the target flexible circuit board that are interconnected by the connecting parts;

[0037] The laser processing equipment is controlled to perform laser cutting on each connecting part so that the waste material is separated from the target flexible circuit board, and the target flexible circuit board is obtained.

[0038] In a seventh aspect, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the following steps:

[0039] Obtain the target circuit processing pattern, which includes the target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0040] Laser cutting is performed along each cutting line segment to form waste material and the target flexible circuit board that are interconnected by connecting parts;

[0041] Laser cutting is performed on each connection part to separate the waste material from the target flexible circuit board, thus obtaining the target flexible circuit board.

[0042] Eighthly, this application also provides a computer program product, including a computer program that, when executed by a processor, performs the following steps:

[0043] Obtain the target circuit processing pattern, which includes the target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0044] Laser cutting is performed along each cutting line segment to form waste material and the target flexible circuit board that are interconnected by connecting parts;

[0045] Laser cutting is performed on each connection part to separate the waste material from the target flexible circuit board, thus obtaining the target flexible circuit board.

[0046] The aforementioned flexible circuit board processing method, apparatus, equipment, computer equipment, and flexible circuit board first obtain a target circuit processing pattern, which includes target cutting lines. These cutting lines are divided into multiple cutting segments by at least one connecting part. Then, the flexible circuit board to be processed is laser-cut along each cutting segment, forming waste material and the target flexible circuit board interconnected by the connecting parts. Next, each connecting part is laser-cut to separate the waste material from the target flexible circuit board, resulting in the target flexible circuit board. In this way, during the cutting process along the cutting segments, the connecting parts provide auxiliary support for the small structures formed during cutting, enhancing local support. This allows the small structures formed during the flexible circuit board cutting process to be more stably held and less prone to displacement, thereby reducing the impact of the pre-formed small structures on subsequent processing, reducing cutting errors, and minimizing incomplete cuts, thus effectively improving processing accuracy. After the small structures are largely formed, the connecting parts are disconnected, achieving separation of the waste material and the target flexible circuit board, thereby obtaining a high-precision target flexible circuit board. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is a flowchart illustrating a flexible circuit board fabrication method in one embodiment;

[0049] Figure 2 This is a schematic diagram of the target circuit processing pattern in one embodiment;

[0050] Figure 3 This is a schematic diagram of the target circuit processing pattern in another embodiment;

[0051] Figure 4 This is a structural block diagram of a flexible circuit board processing apparatus in one embodiment;

[0052] Figure 5 This is a schematic diagram of the structure of a laser processing device in one embodiment;

[0053] Figure 6 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0055] Flexible printed circuit boards (FPCBs) are circuit boards made with flexible substrates, characterized by their thinness, flexibility, and foldability. As electronic products evolve towards miniaturization, lightweighting, and high performance, FPCBs are finding increasingly widespread applications in smartphones, wearable devices, and other fields. In recent years, FPCB technology has continuously advanced, resulting in higher circuit precision and more complex circuit structures, which in turn makes the processing requirements for FPCBs even more stringent.

[0056] In the cutting and processing of flexible circuit boards, using jigs for fixation can provide stronger fixing force and prevent the workpiece from shifting or vibrating during the cutting process. However, for flexible circuit boards with complex structures or precision components on the surface, jigs cannot be used for fixation. In this case, honeycomb panels are usually used for adsorption fixation.

[0057] Honeycomb panels are devices that use vacuum adsorption to fix workpieces. Their surface is covered with uniformly distributed small holes, providing uniform adsorption force to ensure the stability of the circuit board during cutting. However, with the miniaturization and precision of electronic products, the circuit structures on flexible circuit boards are becoming increasingly smaller. The width of the circuit structure and the distance between circuits have shrunk to 100-200μm, and the requirements for cutting precision of flexible circuit boards are becoming increasingly higher. The thinness, flexibility, bendability, and foldability of flexible circuit boards can cause them to shift during the cutting process. As they deform under external force, even if the material itself has been processed, the deformed part may still cause the unprocessed parts to move and deform, resulting in the actual cutting trajectory deviating from the preset trajectory or incomplete cutting of some areas. Moreover, the smaller the structure, the more significant the degree of shift and deformation.

[0058] In addition, the pore size of honeycomb panels is usually above 350μm, and it is difficult for the adsorption force of small structures with a width of 100-200μm to be evenly distributed. This will also lead to unstable adsorption of small structures, thereby aggravating the offset and deformation of flexible circuit boards and their small structures during the cutting process, resulting in situations such as cutting off from the preset trajectory or incomplete cutting of materials, making it impossible to meet the processing accuracy requirements of products.

[0059] In one exemplary embodiment, such as Figure 1 As shown, a flexible printed circuit board (FPCB) processing method is provided. This method is applied to laser processing equipment. This embodiment uses the execution subject of the method as the terminal for illustration. The terminal can be the laser processing equipment, or other terminals capable of controlling the laser processing equipment, such as various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. The laser processing equipment can be a device capable of cutting and processing flexible printed circuit boards using a high-energy-density laser beam. IoT devices can be smart speakers, smart TVs, smart air conditioners, smart in-vehicle devices, projection devices, etc. Portable wearable devices can be smartwatches, smart bracelets, head-mounted devices, etc. Head-mounted devices can be virtual reality (VR) devices, augmented reality (AR) devices, smart glasses, etc. It is understood that the execution subject of this method can also be a server, or a system including both a terminal and a server, and is implemented through the interaction between the terminal and the server.

[0060] In this embodiment, the method includes the following steps S10-S30. Wherein:

[0061] Step S10: Obtain the target circuit processing pattern. The target circuit processing pattern includes the target cutting line, which is divided into multiple cutting line segments by at least one connecting part.

[0062] Flexible circuit boards can refer to circuit boards made of flexible substrates, which are characterized by being thin, flexible, and foldable.

[0063] The target circuit processing drawing refers to a technical document used to guide the cutting process of flexible circuit boards. It uses graphics, symbols, and annotations to represent the cutting path, waste area, circuit board area, and related processing parameters to ensure the accuracy and efficiency of the cutting process. Flexible circuit board cutting generates waste, which refers to the material removed from the flexible circuit board. After removing the waste, the target flexible circuit board forming the circuit structure is obtained. The waste area refers to the area corresponding to the waste in the target circuit processing drawing, and the circuit board area refers to the area corresponding to the target flexible circuit board in the target circuit processing drawing. The target circuit processing drawing can be designed and drawn in advance according to the actual needs and processing requirements of the product; this embodiment does not impose any limitations on this.

[0064] The target circuit processing drawing must include at least the target cutting line. The target cutting line can refer to the line clearly marked in the target circuit processing drawing that indicates the path along which the cutting tool needs to cut, and is used to separate the circuit board area and the waste area.

[0065] In some feasible implementations, the target cutting line can be the outline of the waste area. Depending on the actual condition of the waste, the target cutting line can be a regular or irregular ring shape, with the waste area located inside the target cutting line and the circuit board area located outside the target cutting line. It is understood that, due to the increasing complexity of circuits, the target circuit pattern may include multiple target cutting lines, each surrounding a waste area, while areas not surrounded by any target cutting line are connected to form the circuit board area.

[0066] As an example, such as Figure 2 As shown, Figure 2 This is a schematic diagram of the target circuit processing pattern in one embodiment. Figure 2 The dashed line in the image represents the target cutting line 202. Figure 2 The target circuit processing pattern shown contains eight target cutting lines 202. Each target cutting line 202 encloses a waste area 204, and the area where the target cutting lines 202 connect to each other forms the circuit board area 206. After cutting along the target cutting lines 202, the waste corresponding to the waste area 204 can be removed from the flexible circuit board. After removing the waste, the target flexible circuit board can be obtained.

[0067] Each target cutting line can have at least one connecting part, and each connecting part can divide the target cutting line into two segments. By setting one or more connecting parts, the target cutting line can be divided into multiple segments, each of which is a cutting line segment. As an example, refer to... Figure 3 , Figure 3 The dashed line in the diagram represents the cutting line segment 302, and the short solid line connecting the cutting line segment 302 represents the connecting part 304. The cutting line segment 302 and the connecting part 304 are connected end to end to form the target cutting line.

[0068] Both the cutting segment and the connecting part are part of the target cutting line and both need to be cut. The difference between them lies in the order of cutting and their length. The length of the cutting segment is much longer than that of the connecting part, which is prone to errors during the cutting process due to material displacement and deformation. Therefore, the cutting is performed first along the cutting segment, and the uncut connecting part connects the scrap material and the target flexible circuit board after the cutting segment is cut, providing support for both and limiting the deformation of the flexible circuit board under external forces during subsequent cutting. The connecting part is shorter, so it is disconnected after all the cutting segments have been cut. Disconnecting the connecting part has a smaller impact on the overall processing accuracy.

[0069] Step S20: Laser cut the flexible circuit board to be processed along each cutting line segment to form waste material and target flexible circuit board that are interconnected by the connecting part.

[0070] Among them, flexible circuit boards to be processed can refer to flexible circuit boards that need to be cut and processed.

[0071] For example, before cutting the flexible circuit board, the flexible circuit board to be processed can be picked up manually, by a robot, or by a robotic arm, and then fixed in place. After fixing the flexible circuit board, the laser processing equipment can be controlled to process the flexible circuit board according to the target circuit pattern. That is, the laser processing equipment is controlled to emit a laser beam onto the flexible circuit board and to cut the flexible circuit board along the cutting line segment, resulting in waste material and the target flexible circuit board that are connected by connecting parts.

[0072] Step S30: Laser cutting is performed on each connecting part to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

[0073] For example, after all the cutting lines have been cut, the laser is controlled to cut each connecting part. After the connecting part is cut off, the waste material connected to the connecting part is separated from the target flexible circuit board. The separated waste material is removed to obtain the target flexible circuit board.

[0074] In the aforementioned flexible circuit board processing method, the target circuit processing pattern is first obtained. This pattern includes target cutting lines, which are divided into multiple cutting segments by at least one connecting part. Then, the flexible circuit board to be processed is laser-cut along each cutting segment, forming waste material and the target flexible circuit board interconnected by the connecting parts. Next, each connecting part is laser-cut to separate the waste material from the target flexible circuit board, resulting in the target flexible circuit board. In this way, during the cutting process along the cutting segments, the connecting parts provide auxiliary support for the small structures formed during cutting, enhancing local support. This allows the small structures formed during the flexible circuit board cutting process to be more stably held in place, reducing the likelihood of displacement and minimizing the impact of the pre-formed small structures on subsequent processing. This reduces cutting errors and the possibility of incomplete cuts, effectively improving processing accuracy. After the small structures are largely formed, the connecting parts are disconnected, achieving separation of the waste material and the target flexible circuit board, thus obtaining a high-precision target flexible circuit board.

[0075] In an exemplary embodiment, the target circuit pattern further includes a material region, which includes at least one of an elongated region and an arc-shaped region;

[0076] The connecting part is located in the middle of the elongated area and on at least one corresponding target cutting line in the arc-shaped area.

[0077] The material area can refer to the part of the target circuit pattern that will not be eliminated by the laser.

[0078] Elongated regions refer to portions of a material whose aspect ratio exceeds a preset threshold. Because their length is much greater than their width or thickness, elongated structures experience a significant reduction in support after their outline is cut off, making them prone to stress concentration and thus more susceptible to deformation, especially in the central region.

[0079] A curved region refers to a region in a material whose outline is curved. Due to the large change in curvature, the supporting force in a curved region is significantly reduced after its outline is cut off. Under stress, it is prone to stress concentration and thus more susceptible to deformation.

[0080] In this embodiment, by providing connecting parts in the middle and curved corner areas of the elongated region, auxiliary support can be provided for the elongated region and curved corner area, thereby enhancing local rigidity, reducing deformation and vibration, and thus improving the stability and accuracy of processing.

[0081] In an exemplary embodiment, the length of the connector is 200-350 μm, for example, 200 μm, 250 μm, 300 μm, 350 μm, etc.

[0082] If the connector is too short, it will not provide sufficient support. If the connector is too long, it may still cause significant cutting errors during subsequent cutting, resulting in the target flexible circuit board's accuracy failing to meet actual requirements. A connector length of 200-350μm provides sufficient support, preventing deformation and misalignment during flexible circuit board cutting, while also effectively reducing cutting errors and improving processing accuracy.

[0083] In an exemplary embodiment, the target cutting line includes multiple local line segments in a preset direction, which is either horizontal or vertical; multiple connecting portions are arranged alternately on the multiple local line segments in the preset direction.

[0084] Among them, a local line segment can refer to a line segment extending along the same direction on the target cutting line, and a preset direction can refer to a direction perpendicular to the extension direction of the local line segment. For example, if the local line segment extends horizontally, the preset direction can be vertical; if the local line segment extends vertically, the preset direction can be horizontal.

[0085] like Figure 3 As shown, multiple connecting parts are staggered on multiple local line segments in a preset direction. This can refer to the connecting parts on two adjacent local line segments in the preset direction being positioned differently in their extension directions. Since the cutting of flexible circuit boards is usually to form circuits, the resulting structures are mostly slender. Deformation and offset are usually caused by insufficient support in their extension direction. Therefore, setting connecting parts along their extension direction can significantly increase the support force, effectively avoid deformation and offset, and improve processing accuracy. Slender structures are prone to bending deformation, especially in the middle section. By staggering the support points, firstly, the bending moment can be more effectively distributed, improving the overall elastic modulus and stability; secondly, if the connectors on multiple local line segments are symmetrically arranged, the support force is concentrated in the same position, and more connectors are needed to achieve the same bending resistance, while the staggered arrangement can effectively reduce the number of connectors and improve processing efficiency; thirdly, to ensure that the connectors can be completely cut through, the connectors and their surroundings will inevitably be repeatedly subjected to laser heat. The staggered arrangement of the connectors can increase the distance between the connectors, thereby reducing the heat concentration of the laser spot and avoiding damage to the flexible circuit board caused by the concentrated heat of the laser spot, thus improving the processing quality.

[0086] In one exemplary embodiment, before obtaining the target circuit processing pattern, the method further includes:

[0087] Obtain the initial circuit processing pattern and the processing characteristics information of the flexible circuit board to be processed. The initial circuit processing pattern includes the initial cutting lines.

[0088] Determine the spacing between adjacent connecting parts based on processing characteristic information;

[0089] Based on the interval distance, multiple connecting parts are set on the initial cutting line to obtain the target line processing pattern.

[0090] Among them, the processing characteristic information can refer to the physical and chemical property data of the flexible circuit board to be processed, which may include at least one of elastic modulus, strength, stiffness, and absorption rate of laser energy. These data have a certain impact on the effect of laser processing and the final performance of the target flexible circuit board.

[0091] The initial cutting line can refer to a cutting line that has not yet been segmented according to the connecting part. In some feasible embodiments, the initial cutting line can be the outline of the waste area. The initial circuit processing drawing can refer to a circuit processing drawing that has drawn the initial cutting line but has not yet set the connecting part.

[0092] Multiple connecting parts can be set on each initial cutting line. The interval between adjacent connecting parts can refer to the distance along the initial cutting line between two adjacent connecting parts set on the same initial cutting line. In some feasible embodiments, the interval distance can be a range of interval distances. When setting connecting parts, it is only necessary to ensure that the actual interval distance is within this range, which can improve the flexibility of setting connecting parts.

[0093] For example, before cutting, an initial circuit processing pattern can be designed and drawn according to the actual needs and processing requirements of the product. Then, the material of the flexible circuit board to be processed is determined, and the processing characteristics information of the material is queried. Then, the interval distance between adjacent connecting parts can be calculated according to the preset interval distance algorithm and the processing characteristics information. The preset interval distance algorithm can be determined in advance based on big data or test results, etc., and this embodiment does not limit it. Then, according to the calculated interval distance, multiple connecting parts are set on the initial circuit processing pattern to obtain the target circuit processing pattern.

[0094] In some feasible implementations, the processing characteristic information may include the elastic modulus. The spacing between adjacent connections may be positively correlated with the elastic modulus of the flexible circuit board to be processed. That is, the larger the elastic modulus of the material, the longer the spacing can be; the smaller the elastic modulus of the material, the shorter the spacing needs to be set in order to effectively prevent the flexible circuit board to be processed from deforming or shifting during the cutting process.

[0095] In this embodiment, by adaptively adjusting the spacing between adjacent connecting parts according to the processing characteristics of the flexible circuit board to be processed, the applicability of this processing method can be effectively expanded, and high-precision laser cutting processing of flexible circuit boards of different materials can be achieved.

[0096] In an exemplary embodiment, before laser cutting the flexible circuit board to be processed along each cutting line segment to form waste material and the target flexible circuit board interconnected by the connecting portion, the method further includes:

[0097] The flexible circuit board to be processed is adsorbed onto a circular hole fixture, wherein the circular hole fixture includes multiple adsorption holes with a diameter of less than or equal to 300 μm.

[0098] It should be noted that the pore size of honeycomb panels is usually above 350μm, and the adsorption force on fine structures with a width of 100-200μm is difficult to be evenly distributed. This will also lead to unstable adsorption on fine structures, thereby aggravating the offset and deformation of the flexible circuit board and its fine structures during the cutting process. This can result in the cutting deviating from the preset trajectory or the material not being cut through, making it impossible to meet the processing accuracy requirements of the product.

[0099] Among them, the circular hole fixture can refer to a template or frame with multiple circular adsorption holes. The design of these adsorption holes can match specific marks or features on the flexible circuit board. When in use, the flexible circuit board can be placed on the circular hole fixture and aligned through the adsorption holes. It can also be combined with technologies such as vacuum adsorption to further stabilize the position of the circuit board. In this way, during laser cutting operations, errors caused by the movement of the circuit board can be effectively avoided, thereby improving production efficiency and product quality.

[0100] The adsorption hole is a circular through-hole on a round hole fixture. During the cutting process, the round hole fixture can be connected to a vacuum system. After the vacuum system is activated, negative pressure is generated through the adsorption hole, which tightly adsorbs the flexible circuit board attached to the adsorption hole onto the surface of the round hole fixture. The larger the diameter of the adsorption hole, the more areas cannot be completely covered. These areas suspended above the adsorption hole are flexible and lack support, making them easily deformed under high vacuum.

[0101] When the pore size of the adsorption holes is less than or equal to 300 μm, the outer periphery of the adsorption holes can provide high support for the flexible circuit board, effectively reducing the deformation of the flexible circuit board due to adsorption. When the flexible circuit board requires greater support, the pore size of the adsorption holes can be reduced, and the pore size can be set to 250 μm, 200 μm, 150 μm, 100 μm, 50 μm, etc.

[0102] In some feasible embodiments, the pore size of the adsorption pore is 150-300 μm, for example, 150 μm, 200 μm, 250 μm, 300 μm, etc.

[0103] The smaller the pore size of the adsorption holes, the greater the support force for the flexible circuit board, making it less prone to deformation and displacement during cutting. However, if the pore size is too small, insufficient adsorption force may occur, leading to reduced adsorption stability. An adsorption hole diameter in the range of 150-300μm ensures sufficient support for the flexible circuit board, preventing deformation and displacement during cutting, while also guaranteeing adequate adsorption force to improve adsorption stability. This reduces cutting errors and the likelihood of incomplete cuts, effectively improving processing accuracy.

[0104] In some feasible implementations, each waste area and each circuit board area corresponds to at least one adsorption hole. This ensures that both the waste area and the circuit board area are adsorbed during the cutting process and do not fall off the fixture, thereby preventing waste from interfering with subsequent cutting processes.

[0105] For example, before cutting the flexible circuit board, the flexible circuit board to be processed can be picked up manually, by a robot or a robotic arm, and placed on a round hole fixture. The vacuum system connected to the round hole fixture is then turned on, and negative pressure is generated through the adsorption holes, thereby adsorbing the flexible circuit board to be processed onto the round hole fixture.

[0106] In this embodiment, compared to adsorption through large-diameter holes in the honeycomb board, reducing the diameter of the adsorption holes on the circular hole fixture effectively improves the uniformity of the adsorption force distribution, enhances local support, and reduces vibration and deformation caused by the interaction between the tool and the workpiece during cutting. This allows the small structures formed during the flexible circuit board cutting process to be more stably adsorbed, reducing the likelihood of displacement and minimizing the impact of these pre-formed structures on subsequent processing, thus reducing cutting errors and incomplete cuts, and effectively improving the processing accuracy of the flexible circuit board. Adsorption through large-diameter holes in the honeycomb board resulted in a 50-60µm error after deformation measurement, which did not meet product accuracy requirements. By reducing the diameter of the adsorption holes and adding a connecting part, the error in the straightness of the finished product cut can be effectively controlled within 10µm.

[0107] In one exemplary embodiment, the target circuit pattern further includes a material area;

[0108] The adsorption pores are positioned opposite the material region, and the diameter of the adsorption pores is less than or equal to the minimum width of the material region.

[0109] The material area can refer to the portion of the target circuit pattern that will not be removed by the laser. The material area can include waste areas and circuit board areas. The waste area can refer to the area corresponding to waste in the target circuit pattern. The circuit board area can refer to the area corresponding to the target flexible circuit board in the target circuit pattern.

[0110] In some feasible implementations, the target cutting line can be the outline of the waste area. Depending on the actual condition of the waste, the target cutting line can be a regular or irregular ring shape. The area inside the target cutting line is the waste area. After cutting along the target cutting line, the material corresponding to the waste area, i.e., the waste, can be removed from the flexible circuit board to be processed. The area outside the target cutting line is the circuit board area. It is understood that, due to the increasing complexity of circuits, the target circuit processing pattern may include multiple target cutting lines, each target cutting line surrounding a waste area. The areas not surrounded by any target cutting line are connected to form the circuit board area. After removing all the waste, the material corresponding to the remaining circuit board area is the target circuit board.

[0111] Whether it is a waste area or a circuit board area, when its outline is cut but not completely cut, it is more likely to deform under the action of external force, thereby affecting the processing accuracy of itself and other material areas connected to it in subsequent processing.

[0112] If the aperture of the adsorption hole is small and can completely cover each waste area and circuit board area, the outer periphery of the adsorption hole can provide high support for the flexible circuit board, thereby effectively reducing the displacement or deformation of the flexible circuit board due to adsorption. Therefore, when designing a circular hole fixture, the minimum width of the material area in the target circuit processing drawing can be detected first. Then, the aperture of the adsorption hole of the circular hole fixture should be less than or equal to the minimum width of the material area, and the adsorption hole should be set opposite to the material area. This ensures that the adsorption hole can completely cover each waste area and circuit board area.

[0113] In this embodiment, by making the diameter of the adsorption hole less than or equal to the minimum width of the material area, and by setting the adsorption hole opposite to the material area, it can be ensured that the adsorption hole can be completely covered by each waste area and circuit board area. In this way, the outer periphery of the adsorption hole can provide high support for the flexible circuit board, thereby effectively reducing the displacement or deformation of the flexible circuit board due to adsorption, reducing cutting errors, and reducing the situation of incomplete cutting, thereby effectively improving processing accuracy.

[0114] In some feasible embodiments, the flexible circuit board to be processed is laser-cut along each cutting line segment to form waste material and the target flexible circuit board interconnected by connecting parts, including steps S21 to S22, wherein:

[0115] Step S21: Detect the interval distance between each cutting line segment and adjacent and parallel cutting line segments;

[0116] Step S22: Laser cut each cut line segment in order of increasing interval distance to form waste material and target flexible circuit board that are interconnected by the connecting part.

[0117] It should be noted that during laser cutting along the cutting lines, as more and more cutting segments are severed, the supporting force on the material area decreases and the stress becomes more uneven, making it more prone to deformation. On the other hand, under the same supporting force and the same external force, the smaller the structure, the more easily it deforms.

[0118] For example, before performing flexible circuit board cutting, the interval distance corresponding to each cutting line segment can be detected. The interval distance corresponding to each cutting line segment refers to the interval distance between each cutting line segment and its adjacent and parallel cutting line segments. Then, the processing order of the cutting line segments is determined by the order of the interval distances from smallest to largest. During the flexible circuit board cutting process, after fixing the flexible circuit board to be processed, the laser processing equipment can be controlled to emit a laser towards the flexible circuit board to be processed, and the laser can be controlled to cut the flexible circuit board to be processed along the corresponding cutting line segments according to the processing order based on the interval distance accuracy, thereby obtaining waste material and target flexible circuit board connected to each other by the connecting part.

[0119] Understandably, if there are multiple adjacent and parallel cutting segments, the initial interval distance between each adjacent and parallel cutting segment can be determined first. Then, the minimum value or the sum of the initial interval distances can be used as the final interval distance for sorting. For example, the interval distance between cutting segment L1 and the adjacent and parallel cutting segment to its left is 1, and the interval distance between cutting segment L2 and the adjacent and parallel cutting segment above it is 2, and the interval distance between cutting segment L2 and the adjacent and parallel cutting segment below it is 5. Since the minimum initial interval distance for L1 is 1 and the minimum initial interval distance for L2 is 2, it can be determined that the processing order of L1 is before L2. Alternatively, since the sum of the initial interval distances for L1 is 3 and the sum of the initial interval distances for L2 is 7, it can be determined that the processing order of L1 is before L2.

[0120] In this embodiment, optimizing the cutting sequence can effectively improve processing accuracy. Specifically, in the initial stage of processing when the supporting force is high and the overall stability is good, prioritizing the processing of areas with smaller intervals can effectively improve the processing accuracy of fine structures. In the later stage of processing, when the supporting force and stability decrease, areas with larger intervals are then processed. Because large structures themselves have strong resistance to deformation, even if the supporting conditions weaken, high processing accuracy can still be maintained.

[0121] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0122] Based on the same inventive concept, this application also provides a laser processing apparatus for implementing the flexible circuit board processing method described above. The solution provided by this apparatus is similar to the implementation described in the above method; therefore, the specific limitations in one or more laser processing apparatus embodiments provided below can be found in the limitations of the flexible circuit board processing method described above, and will not be repeated here.

[0123] In one exemplary embodiment, such as Figure 4 As shown, a flexible circuit board processing apparatus is provided, comprising:

[0124] The acquisition module 402 is used to acquire the target circuit processing pattern, which includes a target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0125] The first cutting module 404 is used to perform laser cutting along each cutting line segment of the flexible circuit board to be processed, forming waste material and target flexible circuit board that are connected to each other through the connecting part.

[0126] The second cutting module 406 is used to perform laser cutting on each connecting part so that the waste material is separated from the target flexible circuit board and the target flexible circuit board is obtained.

[0127] In one exemplary embodiment, the flexible circuit board processing apparatus further includes a setting module, which, before acquiring the target circuit processing pattern, is used to:

[0128] Obtain the initial circuit processing pattern and the processing characteristics information of the flexible circuit board to be processed. The initial circuit processing pattern includes the initial cutting lines.

[0129] Determine the spacing between adjacent connecting parts based on processing characteristic information;

[0130] Based on the interval distance, multiple connecting parts are set on the initial cutting line to obtain the target line processing pattern.

[0131] In one exemplary embodiment, the flexible circuit board processing apparatus further includes an adsorption module, which is used to: Before laser cutting the flexible circuit board to be processed along each cutting line segment to form waste material and the target flexible circuit board interconnected by connecting portions, the adsorption module is configured to:

[0132] The flexible circuit board to be processed is adsorbed onto a circular hole fixture, wherein the circular hole fixture includes multiple adsorption holes with a diameter of less than or equal to 300 μm.

[0133] In one exemplary embodiment, the first cutting module 404 is further configured to:

[0134] Detect the distance between each cutting line segment and its adjacent and parallel cutting line segments;

[0135] Each cut line segment is laser-cut in order of increasing spacing to form waste material and target flexible circuit board that are interconnected by connecting parts.

[0136] In one exemplary embodiment, such as Figure 5 As shown, a laser processing device is provided, including a circular hole fixture 502, a laser 504, and a displacement device 506. The circular hole fixture 502 includes multiple adsorption holes, the diameter of which is less than or equal to 300 μm.

[0137] The circular hole fixture 502 is configured to adsorb the flexible circuit board 508 to be processed.

[0138] Laser 504 is configured to emit a laser, which is used to cut the flexible circuit board 508 to be processed.

[0139] The displacement device 506 is configured to control the laser to perform laser cutting along each cutting line segment on the flexible circuit board to be processed, forming waste material and the target flexible circuit board that are connected to each other through the connecting parts; the connecting parts are laser cut so that the waste material is separated from the target flexible circuit board to obtain the target flexible circuit board.

[0140] In one exemplary embodiment, a laser processing system is provided, including a controller and the aforementioned laser processing equipment, wherein the controller is used for:

[0141] Obtain the target circuit processing pattern, which includes the target cutting line. The target cutting line is divided into multiple cutting line segments by at least one connecting part.

[0142] Laser cutting is performed along each cutting line segment to form waste material and the target flexible circuit board that are interconnected by connecting parts;

[0143] Laser cutting is performed on each connection part to separate the waste material from the target flexible circuit board, thus obtaining the target flexible circuit board.

[0144] In one exemplary embodiment, the controller may also implement the steps in the above-described method embodiments.

[0145] In one exemplary embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 6 As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a flexible circuit board fabrication method. The display unit is used to form a visually visible image and can be a display screen, projection device, or virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0146] Those skilled in the art will understand that Figure 6 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0147] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0148] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0149] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0150] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0151] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0152] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0153] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for processing flexible printed circuit boards, characterized in that, The method includes: Obtain a target circuit processing pattern, the target circuit processing pattern includes a target cutting line, the target cutting line is divided into multiple cutting line segments by at least one connecting part, the target cutting line includes multiple local line segments in a preset direction, the multiple connecting parts are staggered on the multiple local line segments in the preset direction, and the connecting parts on two adjacent local line segments in the preset direction are at different positions in the extension direction of the connecting parts; Laser cutting is performed along each of the cutting lines to form waste material and target flexible circuit board that are interconnected by connecting parts. The target flexible circuit board includes the circuit structure formed by the cutting. Each of the connecting portions is laser-cut to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

2. The method according to claim 1, characterized in that, The target line processing pattern also includes a material area, which includes at least one of a strip-shaped area and an arc-shaped area; The connecting portion is disposed in the middle of the elongated region and on at least one corresponding target cutting line in the arc-shaped region.

3. The method according to claim 1, characterized in that, The length of the connecting part is 200-350μm.

4. The method according to claim 1, characterized in that, The preset direction is either horizontal or vertical.

5. The method according to claim 1, characterized in that, Before obtaining the target circuit processing drawings, the following steps are also included: Obtain the initial circuit processing pattern and the processing characteristics information of the flexible circuit board to be processed, wherein the initial circuit processing pattern includes the initial cutting lines; The spacing between adjacent connecting parts is determined based on the processing characteristic information; Based on the specified interval, multiple connecting parts are set on the initial cutting line to obtain the target line processing pattern.

6. The method according to claim 1, characterized in that, Before laser cutting the flexible circuit board to be processed along each of the cutting lines to form waste material and the target flexible circuit board interconnected by the connecting parts, the process further includes: The flexible circuit board to be processed is adsorbed onto a circular hole fixture, wherein the circular hole fixture includes multiple adsorption holes, and the diameter of the adsorption holes is less than or equal to 300 μm.

7. The method according to claim 6, characterized in that, The target circuit processing pattern also includes a material area; The adsorption pores are positioned opposite to the material region, and the diameter of the adsorption pores is less than or equal to the minimum width of the material region.

8. The method according to any one of claims 1 to 7, characterized in that, The process of laser cutting the flexible circuit board to be processed along each of the cutting lines to form waste material and the target flexible circuit board interconnected by connecting parts includes: Detect the spacing between each of the cutting line segments and adjacent and parallel cutting line segments; Each of the cut segments is laser-cut in order of increasing spacing to form waste material and target flexible circuit boards that are interconnected by connecting parts.

9. A flexible circuit board processing apparatus, characterized in that, The device includes: The acquisition module is used to acquire a target circuit processing pattern, the target circuit processing pattern including a target cutting line, the target cutting line being divided into multiple cutting line segments by at least one connecting part, the target cutting line including multiple local line segments in a preset direction, the multiple connecting parts being staggered on the multiple local line segments in the preset direction, and the connecting parts on two adjacent local line segments in the preset direction being at different positions in the extension direction of the connecting parts; The first cutting module is used to perform laser cutting along each of the cutting lines to form waste material and target flexible circuit board connected to each other by connecting parts. The target flexible circuit board includes an elongated circuit structure. The second cutting module is used to perform laser cutting on each of the connecting parts so that the waste material is separated from the target flexible circuit board, thereby obtaining the target flexible circuit board.

10. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 8.

11. A laser processing device, characterized in that, The laser processing equipment uses the method described in any one of claims 1 to 8 to perform laser processing on the flexible circuit board.

12. A flexible circuit board, characterized in that, The flexible circuit board is processed using the method described in any one of claims 1 to 8.

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