Heat dissipation device and electronic equipment

Abstract

The invention relates to the technical field of heat dissipation design of electronic equipment, in particular to a heat dissipation device and the electronic equipment, the heat dissipation device is used for being arranged in a box body of the electronic equipment, the heat dissipation device comprises a device body and a heat dissipation mechanism arranged on the device body, and the heat dissipation mechanism comprises a heat conduction plate and an air cooling assembly; the heat conduction plate is used for being attached to a board card module in the box body, and the air cooling assembly is arranged on the heat conduction plate; a heat dissipation air channel communicated with the outside is arranged in the box body, the air cooling assembly is located on the heat dissipation air channel, and the air cooling assembly can drive airflow in the heat dissipation air channel to flow, so that the airflow exchanges heat with the heat conduction plate and the air cooling assembly, and the board card module is cooled. The space occupied by the heat dissipation device is greatly reduced, so that enough setting space is provided for module interconnection and a power supply backboard of the electronic equipment, and the equipment can ensure enough board card interconnection resources.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation design of electronic equipment, and in particular to a heat dissipation device and electronic equipment. Background Art

[0002] With the rapid development of electronic technology and the gradual increase in industrial demand, the heat consumption of electronic equipment has gradually increased. The natural heat dissipation on the surface of the equipment can no longer meet the heat dissipation needs, and it is necessary to further add heat dissipation structures to improve the heat dissipation effect.

[0003] Common electronic devices, such as air-cooled VPX chassis, dissipate heat by opening a heat dissipation duct on the chassis and placing multiple heat dissipation fins in the heat dissipation duct. A fan is set on the chassis to match the heat dissipation duct to drive the air flow through the heat dissipation fins to achieve heat dissipation. In order to ensure the heat dissipation effect, the air duct space usually needs to be designed to be large enough to allow sufficient air flow through the heat dissipation fins. However, this causes the heat dissipation structure to occupy a larger space inside the box, resulting in a reduction in the space inside the box that can be used to set up functional modules such as boards, and the available space inside the device is limited, which not only compresses the circuit interconnection resources of the device, but also limits the functional improvement of the device. Summary of the invention

[0004] In order to solve the above technical problem or at least partially solve the above technical problem, the present disclosure provides a heat dissipation device and an electronic device.

[0005] In a first aspect, the present disclosure provides a heat dissipation device, which is used to be arranged in a box of an electronic device;

[0006] The heat dissipation device comprises a device body and a heat dissipation mechanism arranged on the device body, the heat dissipation mechanism comprises a heat conduction plate and an air cooling component, the heat conduction plate is used to be attached to the board module in the box, and the air cooling component is arranged on the heat conduction plate;

[0007] The box body has a heat dissipation duct connected to the outside, the air cooling component is located on the heat dissipation duct, and the air cooling component can drive the air flow in the heat dissipation duct to enable the air flow to exchange heat with the heat conduction plate and the air cooling component to cool the board module.

[0008] Optionally, the air cooling component includes a fan, and the fan is arranged on the heat conduction plate;

[0009] An air-cooling radiator is arranged at the outlet of the fan, and the air-cooling radiator forms an air flow inlet and an air flow outlet, and both the air flow inlet and the air flow outlet are communicated with the heat dissipation air duct.

[0010] Optionally, a heat exchange structure is further provided on the heat conduction plate, and the heat exchange structure is extended in a direction away from the heat conduction plate, and at least a part of the heat exchange structure is located on the heat dissipation duct.

[0011] Optionally, the heat exchange structure is extended along the length direction or width direction of the heat conduction plate;

[0012] And / or, there are multiple heat exchange structures, and all of the heat exchange structures are arranged at intervals along the length direction or width direction of the heat conduction plate.

[0013] Optionally, the heat exchange structure includes a heat pipe, and the heat pipe is arranged on a side of the heat conduction plate facing away from the board module;

[0014] The heat pipe is filled with a working medium for heat exchange.

[0015] Optionally, the air cooling component includes a fan, and the fan is arranged on the heat conduction plate;

[0016] The heat dissipation device further comprises an electrical connection mechanism electrically connected to the fan, and the electrical connection mechanism is used to be electrically connected to a power supply mechanism of the electronic equipment.

[0017] Optionally, the electrical connection mechanism includes a circuit board and a heat sink connector disposed on the circuit board, the fan is electrically connected to the circuit board via a wire, and the heat sink connector is used for detachable connection to a power supply mechanism of the electronic device.

[0018] Optionally, the device body includes a cover plate and a mounting frame, the heat conduction plate is arranged on the mounting frame; the box body has a mounting opening for placing the heat dissipation device, the cover plate is arranged at the mounting opening, and an exhaust port for communicating with the heat dissipation air duct is formed on the cover plate;

[0019] And / or, the heat dissipation device includes a locking mechanism movably connected to the device body, the box body has a mounting groove for placing the heat dissipation device, and the locking mechanism can be moved relative to the device body toward the groove wall of the mounting groove until it abuts against the groove wall of the mounting groove, so as to fix the heat dissipation device relative to the box body.

[0020] In a second aspect, the present disclosure further provides an electronic device, which comprises a housing, a board module and the heat dissipation device as described above, wherein the board module and the heat dissipation device are both arranged in the housing;

[0021] The box body is provided with an installation chamber for placing the heat dissipation device, and the installation chamber is located on one side of the board module; a mounting opening connected to the installation chamber is provided on a lateral side of the box body, and an air inlet connected to the installation chamber is provided at a bottom position of the box body corresponding to the installation chamber.

[0022] Optionally, the installation chamber includes a plurality of installation slots matching the heat dissipation device, and each of the installation slots is arranged along the extension direction of the side wall of the board module;

[0023] There are multiple heat dissipation devices, and each heat dissipation device is correspondingly arranged in one of the installation slots.

[0024] Optionally, a guide structure is provided on the groove wall of the mounting groove along the extending direction of the mounting groove, a sliding portion is provided at a position of the heat dissipation device corresponding to the guide structure, and the heat dissipation device is slidably connected to the box body through the sliding portion and the guide structure;

[0025] And / or, the heat dissipation device also includes an electrical connection mechanism electrically connected to the fan of the air-cooling component, and the electrical connection mechanism is used to be electrically connected to the power supply mechanism of the electronic equipment; the electrical connection mechanism includes a first guide member, and a second guide member matching the first guide member is arranged at the position corresponding to the first guide member in the installation groove, and the heat dissipation device is positioned relative to the box body by the first guide member and the second guide member.

[0026] Compared with the prior art, the technical solution provided by the present invention has the following advantages:

[0027] The heat dissipation device and electronic device provided in the present embodiment are provided with a heat dissipation mechanism, and the heat dissipation mechanism includes a heat conduction plate and an air cooling component, wherein the heat conduction plate is in contact with the board module inside the housing, so that the heat conduction plate can exchange heat with the board module, that is, the heat on the board module can be transferred to the heat conduction plate, on this basis, the air cooling component is provided on the heat conduction plate and is located on the heat dissipation duct in the housing, the air cooling component can drive the air flow in the heat dissipation duct to exchange heat with the air cooling component, and since the air cooling component can exchange heat with the heat conduction plate, the board module is cooled. Compared with the heat dissipation method of setting a large space duct and heat dissipation fins of the traditional heat dissipation device, the heat conduction plate can be attached to the board module, which greatly reduces the space occupied by the heat dissipation device, thereby providing sufficient setting space for module interconnection and power supply backplane of the electronic device, so that the device can ensure sufficient board interconnection resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0030] Figure 1 It is a structural schematic diagram of the heat dissipation device according to an embodiment of the present disclosure;

[0031] Figure 2 It is a structural schematic diagram of the other side of the heat dissipation device according to the embodiment of the present disclosure;

[0032] Figure 3 A schematic structural diagram of the heat dissipation device according to an embodiment of the present disclosure from another perspective;

[0033] Figure 4 It is a structural schematic diagram of the locking mechanism of the heat dissipation device according to an embodiment of the present disclosure in an unlocked state;

[0034] Figure 5 It is a structural schematic diagram of the locking mechanism of the heat dissipation device according to an embodiment of the present disclosure in a locked state;

[0035] Figure 6 It is a structural schematic diagram of the heat exchange structure of the heat dissipation device according to an embodiment of the present disclosure;

[0036] Figure 7 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure;

[0037] Figure 8 A structural schematic diagram of the electronic device described in an embodiment of the present disclosure from another perspective.

[0038] Among them, 1. heat dissipation device; 11. heat conduction plate; 12. air cooling component; 121. mounting seat; 122. fan; 123. air cooling radiator; 13. cover plate; 131. exhaust port; 14. mounting frame; 15. locking mechanism; 151. fixing block; 152. axial slider; 153. radial slider; 154. long screw; 16. electrical connection mechanism; 161. circuit board; 162. heat dissipation device connector; 163. first guide member; 17. heat pipe; 17a. condensation section; 17b. insulation section; 17c. heat absorption section; 171. shell; 172. capillary absorption layer; 173. cooling medium; 2. box body; 21. mounting chamber; 22. air inlet; 23. guide groove; 3. board module; 4. connector; 5. second guide member. DETAILED DESCRIPTION

[0039] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0040] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0041] With the rapid development of electronic technology and the gradual increase in industrial demand, the heat consumption of electronic equipment has also gradually increased. The natural heat dissipation on the surface of the equipment can no longer meet the heat dissipation needs, and it is necessary to further add a heat dissipation structure to improve the heat dissipation effect. On this basis, a heat sink used with a fan is a commonly used effective heat dissipation solution.

[0042] The current development of electronic equipment is gradually tending towards miniaturization, refinement and modularization, and the requirements for maintainability are also increasing. In common electronic equipment, such as the VPX (referring to the high-speed serial bus standard) chassis, the left and right sides are usually functional boards, and the middle of the chassis is hollowed out to form a heat dissipation duct. Heat dissipation fins are set in the duct. At the same time, an axial fan is installed in the middle of the front panel of the chassis, and a vent is opened at the back. The cooling air enters the chassis from the vent on the back panel, passes through the heat dissipation fins, and is discharged to the outside of the chassis by the fan.

[0043] However, since the common air-cooled VPX chassis usually adopts CNC processing, the spacing and thickness of the heat sink fins cannot be made smaller, resulting in a large air duct space. In addition, due to the need to avoid the air duct, large-area holes and slots are opened in the module interconnection and power supply backplane of the chassis, resulting in the compression of the functional board interconnection resources on the left and right sides. In other words, the heat dissipation structure needs to occupy a large space inside the chassis, resulting in a reduction in the space inside the chassis that can be used to set up functional modules such as boards, and the space available inside the device is limited, which not only compresses the board interconnection resources of the device, but also limits the functional improvement of the device. In addition, the heat dissipation components are designed to be scattered, large in size, and cumbersome to operate, which is not conducive to the maintenance and replacement of heat dissipation components.

[0044] In view of the above defects, this embodiment provides a heat dissipation device and an electronic device. By improving the structure of the heat dissipation device, the space inside the chassis of the electronic device occupied by the heat dissipation device is reduced while ensuring the heat dissipation effect, thereby providing sufficient space for the motherboard circuit of the electronic device. Specifically, the specific structural setting method of the heat dissipation device and the electronic device is described in the following embodiments.

[0045] like Figure 1-8 As shown, this embodiment provides a heat dissipation device 1, which is used to be arranged in a box 2 of an electronic device.

[0046] An electronic device, such as a VPX chassis, includes a housing 2, a board module 3 and a heat sink 1. The board module 3 and the heat sink 1 are both arranged inside the housing 2 of the electronic device. The board module 3 includes a module box and a plurality of functional boards, and all functional boards are arranged in a set direction in the module box. Exemplarily, the number of board modules 3 may be multiple, and the plurality of board modules 3 may be arranged on the left and right sides of the housing 2, or only on one side of the housing 2. The heat sink 1 is located in the housing 2 and is arranged close to the board module 3. The module box of the board module 3 may be formed by a wall panel arranged inside the housing 2, and the interior of the housing 2 may be partitioned by arranging a plurality of wall panels to achieve a modular design.

[0047] The heat dissipation device 1 includes a device body and a heat dissipation mechanism disposed on the device body. The heat dissipation mechanism includes a heat conduction plate 11 and an air cooling component 12. The heat conduction plate 11 is used to be attached to the board module 3 in the box body 2. The air cooling component 12 is disposed on the heat conduction plate 11. Furthermore, the box body 2 has a heat dissipation duct connected to the outside. The air cooling component 12 is located on the heat dissipation duct. The air cooling component 12 can drive the air flow in the heat dissipation duct to exchange heat between the air flow and the heat conduction plate 11 and the air cooling component 12, thereby cooling the board module 3.

[0048] In specific implementation, the heat conduction plate 11 is attached to one side of the module box of the board module 3, so the heat on the board module 3 will be transferred to the heat conduction plate 11. On this basis, the air cooling component 12 is arranged on the side of the heat conduction plate 11 facing away from the board module 3 to drive the air flow in the heat dissipation duct, that is, the air flow can pass through the air cooling component 12, thereby exchanging heat with the air cooling component 12. In other words, the heat on the board module 3 will be transferred to the heat conduction plate 11, and the heat on the heat conduction plate 11 will be further transferred to the air cooling component 12. When the air flow passes through the air cooling component 12, the air flow can exchange heat with the air cooling component 12, so that the heat on the board module 3 is finally taken away by the air flow after passing through the heat conduction plate 11 and the air cooling component 12 in sequence, and then the heat is discharged to the outside of the box 2 of the electronic device, so as to achieve cooling and heat exchange of the board module 3.

[0049] Since the heat conducting plate 11 and the board module 3 are attached to each other, heat exchange can be achieved at the position where the heat conducting plate 11 and the board module 3 are attached, and the airflow in the heat dissipation duct can directly flow through the heat dissipation device 1, so that the heat dissipation effect on the board module 3 can be achieved through the heat dissipation device 1. Compared with the traditional method of arranging heat dissipation fins in the heat dissipation duct, a large space is not required, and only sufficient thickness space is required for attaching the heat dissipation device 1.

[0050] The heat dissipation device 1 provided in the present embodiment is provided with a heat dissipation mechanism, and the heat dissipation mechanism includes a heat conduction plate 11 and an air cooling component 12, wherein the heat conduction plate 11 is in contact with the board module 3 inside the housing 2, so that the heat conduction plate 11 can exchange heat with the board module 3, that is, the heat on the board module 3 can be transferred to the heat conduction plate 11, on this basis, the air cooling component 12 is provided on the heat conduction plate 11 and is located on the heat dissipation duct in the housing 2, the air cooling component 12 can drive the air flow in the heat dissipation duct to exchange heat with the air cooling component 12, because the air cooling component 12 can exchange heat with the heat conduction plate, thereby achieving the cooling of the board module 3, compared with the heat dissipation method of setting a large space duct and heat dissipation fins of the traditional heat dissipation device, the space occupied by the heat dissipation device is greatly reduced, thereby providing sufficient setting space for the module interconnection and power supply backplane of the electronic device, and the device can ensure sufficient board interconnection resources.

[0051] In addition, since the air-cooling component 12, the heat conduction plate 11, etc. form an integral heat dissipation device 1, that is, such an arrangement can realize a modular design of the heat dissipation device 1, and is convenient for corresponding loading and unloading with the box body 2, it replaces the traditional dispersed fan components and heat dissipation fins, and integrates the structure, thereby reducing the types of spare parts, simplifying the spare parts structure, and realizing the modularization, standardization, and serialization of the heat dissipation device 1, which effectively solves the problems of dispersed design, poor reliability, and cumbersome and time-consuming maintenance operations of traditional heat dissipation solutions.

[0052] See also Figure 7 and Figure 8 As shown, for the above heat dissipation device 1, this embodiment further provides an electronic device, which includes a box 2, a board module 3 and the above heat dissipation device 1, wherein the board module 3 and the heat dissipation device 1 are both arranged in the box 2. The electronic device can be a server group or a VPX chassis. In this embodiment, the electronic device is described as a VPX chassis as an example.

[0053] In some embodiments, the box body 2 is provided with an installation chamber 21 for placing the heat dissipation device 1, and the installation chamber 21 is located on one side of the board module 3. A mounting port connected to the installation chamber 21 is provided on one lateral side of the box body 2, and an air inlet 22 connected to the installation chamber 21 is provided at the bottom position of the box body 2 corresponding to the installation chamber 21.

[0054] By opening a mounting port connected to the mounting chamber 21 on one lateral side of the box 2, the heat dissipation device 1 can be placed inside the box 2 more conveniently, and the air outlet of the heat dissipation duct can be formed directly through the mounting port. The air inlet 22 is arranged at the bottom of the box 2. Compared with the traditional method of opening a vent on the rear panel of the box 2, the air duct can be prevented from occupying the rear space of the box 2, thereby being more conducive to the circuit interconnection between the functional boards.

[0055] In some embodiments, the installation chamber 21 includes a plurality of installation slots matching the heat sink 1, each of which is arranged along the extension direction of the side wall of the board module 3. In addition, there are a plurality of heat sinks 1, each of which is arranged in a corresponding installation slot.

[0056] Exemplarily, the installation chamber 21 can be set as a guide groove structure, and the guide groove 23 at the bottom or top of the installation chamber 21 can form a corresponding installation groove. The guide groove 23 is in the shape of a long strip that matches the heat dissipation device 1, and is a groove formed by the combination of the long strip structure and the side wall of the module box of the board module 3. The guide groove 23 can form a supporting surface to support the heat dissipation device 1. A supporting base is provided at the bottom of the box body 2, and a certain gap is provided between the supporting base and the ground, so as to reserve a certain space for ensuring air intake at the air inlet 22. Furthermore, the back panel of the box body 2 and the side wall structure of the two board module 3 boxes, as well as the guide groove 23 structure at the top of the box body 2 together form a closed air duct.

[0057] In some embodiments, a guide structure is provided on the groove wall of the installation groove along the extension direction of the installation groove, and a sliding part is provided at the position of the heat dissipation device 1 corresponding to the guide structure. The heat dissipation device 1 is slidably connected to the box body 2 through the sliding part and the guide structure.

[0058] In a specific implementation, since the long strip structure and the side wall of the module box of the board module 3 enclose a groove, the groove structure can form a guide structure on the box body 2. Correspondingly, the heat conduction plate 11 is supported and fixed by the groove, so the top and bottom of the heat conduction plate 11 can form the sliding part of the heat dissipation device 1.

[0059] In some embodiments, the device body includes a cover plate 13 and a mounting frame 14, the heat conduction plate 11 is arranged on the mounting frame 14, the cover plate 13 is covered at the mounting opening on the box body 2, and an exhaust port 131 for communicating with the heat dissipation air duct is formed on the cover plate 13. This arrangement can facilitate the installation of the heat conduction plate 11 on the device body, and enable the cover plate 13 to cover the mounting opening on the box body 2, so as to ensure that the appearance of the chassis is smooth and has no gaps, to a certain extent, to prevent dust from entering the interior of the box body 2, and at the same time ensure that the structure outside the inlet and outlet of the air duct is closed. Exemplarily, the size of the cover plate 13 can be adapted to the size of the mounting opening, or slightly larger than the mounting opening.

[0060] See also Figure 2 As shown, in some embodiments, the back of the heat conduction plate 11 is a flat surface to ensure the fit between the board module 3 and avoid generating a large contact thermal resistance. The flatness of the heat conduction plate 11 can be better than 0.1mm / 100mm*100mm, and the roughness can be better than 0.4um. In some embodiments, the device body also includes a handle, which is set on the cover 13 to facilitate the operator to pull or take and put the heat dissipation device 1. Exemplarily, the handle is fixed to the cover 13 by screws,

[0061] In some embodiments, the housing 2 is further provided with a mounting groove for mounting the heat sink 1. The heat sink 1 includes a locking mechanism 15 movably connected to the device body. The locking mechanism 15 can move relative to the mounting body toward the groove wall of the mounting groove until it abuts against the groove wall of the mounting groove, so that the heat sink 1 is fixed relative to the housing 2. The locking mechanism 15 is provided to fix the heat sink 1 relative to the mounting groove after the heat sink 1 is inserted into the mounting groove, that is, it will not fall out of the mounting groove, thereby ensuring the stability of the heat sink 1 when in use.

[0062] See also Figure 4 and Figure 5 As shown, the locking mechanism 15 can be arranged at the upper and lower ends of the mounting frame 14, and the locking mechanism 15 can be specifically a wedge-shaped locking device, which is composed of a fixing block 151, an axial slider 152, a radial slider 153 and a long screw 154. When the tightening screw connected to the long screw 154 is screwed, the long screw 154 rotates immediately, and driven by the rotation of the long screw 154, the axial slider 152 pushes the radial slider 153 to move in the axial direction, and the radial slider 153 correspondingly moves radially, that is, the radial slider 153 can move toward the groove wall of the mounting groove, that is, move toward the groove wall of the guide groove 23, until it abuts against the groove wall of the guide groove 23, thereby achieving the purpose of locking. For example, an operating hole is reserved on the cover plate 13, and the locking screw on the locking mechanism 15 can be directly tightened through the operating hole, so as to facilitate the operation of the installer.

[0063] In some embodiments, the air cooling assembly 12 drives the airflow through the fan 122, and the heat dissipation device 1 further includes an electrical connection mechanism 16 electrically connected to the fan 122, and the electrical connection mechanism 16 is used to be electrically connected to the power supply mechanism of the electronic device. By providing the electrical connection mechanism 16, the fan 122 of the air cooling assembly 12 can be electrically connected to the power supply mechanism of the electronic device, thereby realizing power supply to the fan 122. In addition, in some embodiments, the fan 122 can also be electrically connected to the control system of the electronic device, thereby realizing control operation of the fan 122 through the control system.

[0064] Exemplarily, the electrical connection mechanism 16 includes a circuit board 161 and a heat sink connector 162 disposed on the circuit board 161. The fan 122 is electrically connected to the circuit board 161 through a wire, and the heat sink connector 162 is used for detachable connection with the power supply mechanism of the electronic device. In specific implementation, the heat sink connector 162 can be a VPX connector, and correspondingly, a connector 4 is also disposed at the position of the corresponding heat sink connector 162 of the box 2 to facilitate docking connection of the heat sink connector 162 on the heat sink 1. Exemplarily, the circuit board 161 can be fixed to the support column of the heat conduction plate 11 or the mounting frame 14 by screws, and the power supply line of the fan 122 is welded to the circuit board 161 and electrically connected to the heat sink connector 162.

[0065] The heat dissipation device 1 provided in the present embodiment realizes a detachable connection between the heat dissipation device 1 and the chassis by docking the heat dissipation device 1 and the case 2 through the heat dissipation device connector 162 and the connector 4 of the power supply mechanism to achieve a plug-in connection, that is, a wiring-free connection between the heat dissipation device 1 and the chassis is realized, which not only enables quick disassembly and assembly, but also does not require powering off the device when the heat dissipation device 1 needs to be removed, thereby ensuring the normal operation of the equipment and low maintenance costs.

[0066] In some embodiments, the electrical connection mechanism 16 further includes a first guide member 163, and a second guide member 5 matching the first guide member 163 is provided at a position in the installation groove corresponding to the first guide member 163, and the heat dissipation device 1 is positioned relative to the box body 2 by the first guide member 163 and the second guide member 5. By providing the first guide member 163 and the second guide member 5, the electrical connection mechanism 16 and the power supply mechanism of the electronic device can be accurately aligned and plugged to ensure the connection effect and avoid damage to the connector 4 structure due to inaccurate alignment at the connection position.

[0067] Exemplarily, the first guide member 163 of the electrical connection mechanism 16 is a guide sleeve, and the second guide member 5 in the installation groove is a guide pin. In specific implementation, after the heat sink 1 is pushed into the box body 2 along the guide groove 23, the second guide member 5 on the back plate of the box body 2 is inserted into the first guide member 163 of the heat sink 1, and is positioned and plugged with the electrical connection mechanism 16, thereby ensuring the electrical connection between the electrical connection mechanism 16 and the power supply mechanism of the electronic device, so as to realize power supply and control of the fan 122.

[0068] In some embodiments, the number of the first guide member 163 and the number of the second guide member 5 can be correspondingly set to be multiple, so as to further improve the matching and positioning effect between the electrical connection mechanism 16 of the heat dissipation device 1 and the box body 2.

[0069] See also Figure 1 and Figure 3 As shown, in some embodiments, the fan 122 of the air cooling assembly 12 is disposed on the heat conduction plate 11. An air cooling radiator 123 is disposed at the outlet of the fan 122, and the air cooling radiator 123 forms an air flow inlet and an air flow outlet, and both the air flow inlet and the air flow outlet are connected to the heat dissipation duct.

[0070] In a specific implementation, an air flow channel is formed inside the air-cooled radiator 123, and an air flow inlet and an air flow outlet are formed at both ends of the air flow channel. A plurality of fin structures can be arranged on the inner wall of the air flow channel, and the heat on the heat conduction plate 11 can be transferred to the air-cooled radiator 123. When the air flow passes through the fin structure, heat exchange occurs with the fin structure, thereby taking away the heat on the fin.

[0071] Since the traditional heat dissipation device needs to ensure a sufficiently large air volume when setting the heat dissipation fins, that is, it is necessary to use a fan with a large air volume, so the fan will generate a large noise. However, the heat dissipation device 1 provided in this embodiment realizes heat exchange with the air flow through the air cooling component radiator 123, so there is no need for an excessively large air volume, and the fan 122 can use a small fan, which further avoids the problem of generating a large noise.

[0072] For example, the fan 122 can be installed near the exhaust port 131 to better discharge the hot air after heat exchange in the heat dissipation duct. For example, the fan 122 can also be fixed to the heat conduction plate 11 by bolts to facilitate disassembly when the fan 122 needs to be replaced.

[0073] See also Figure 1 , Figure 3 and Figure 6As shown, in some embodiments, a heat exchange structure is further provided on the heat conduction plate 11, and the heat exchange structure is extended in a direction away from the heat conduction plate 11, and at least a part of the heat exchange structure is located on the heat dissipation air duct. The provision of the heat exchange structure can further increase the heat dissipation area of ​​the heat conduction plate 11, and at least a part of the heat exchange structure is located on the heat dissipation air duct, so that the air cooling structure can achieve a better heat dissipation effect on the heat conduction plate 11 by flowing through the heat exchange structure.

[0074] For example, the heat exchange mechanism may be a convex strip or a sheet-like structure protruding from the surface of the heat conduction plate 11, as long as the surface area of ​​the heat conduction plate 11 located on the heat dissipation duct can be further increased.

[0075] In some embodiments, the heat exchange structure can be extended along the length direction or width direction of the heat conduction plate 11. In this way, the heat exchange structure can achieve a relatively uniform heat exchange effect on the heat conduction plate 11. The length direction of the heat conduction plate 11 is the vertical height direction when the electronic device is placed on a horizontal ground and the heat conduction plate 11 is arranged in a vertical direction. The width direction of the heat conduction plate 11 is the thickness direction of the electronic device.

[0076] In some embodiments, the number of heat exchange structures may also be set to multiple, and all heat exchange structures are arranged at intervals along the length direction or width direction of the heat conduction plate 11. In this way, the heat exchange structure can achieve a better heat exchange effect on the heat conduction plate 11, and at the same time, the heat dissipation capacity at multiple positions of the heat conduction plate 11 can be further guaranteed. In specific implementation, the position of the heat exchange structure can be flexibly set according to the heat dissipation requirements to further improve the heat dissipation effect of the heat exchange structure on the heat conduction plate 11.

[0077] See also Figure 1 and Figure 3 As shown, the heat exchange structure includes a heat pipe 17, which is arranged on the side of the heat conduction plate 11 facing away from the board module 3, and the heat pipe 17 is filled with a working medium 173 for heat exchange. By setting the heat exchange structure as the heat pipe 17 and filling the heat pipe 17 with the working medium 173 for heat exchange, the heat on the heat conduction plate 11 can be transferred to the position of the air-cooled radiator 123 more quickly through the heat pipe 17, so that the heat dissipation capacity of the heat dissipation device 1 is further improved. Exemplarily, the heat pipe and the heat conduction plate 11 can be connected together by welding to minimize thermal resistance.

[0078] See also Figure 6 As shown, the heat pipe 17 is configured to include a shell 171 and a capillary liquid absorption layer 172. The shell 171 can be made of copper, for example. The working medium 173 inside the heat pipe can be pure water, for example. The capillary liquid absorption layer 172 is a capillary wick sintered from copper powder. Figure 6The curve a in the middle represents the flow curve of the working medium 173 .

[0079] In specific implementation, after the heat pipe is evacuated to a negative pressure, it is filled with an appropriate amount of working medium 173 for sealing, which can reduce the boiling point of the working medium 173. The heat pipe includes a condensation section 17a, an insulation section 17b and a heat absorption section 17c, wherein the portion away from the air cooling component 12 is the heat absorption section 17c, and the portion located near the air cooling component 12 is the condensation section 17a. When the heat absorption section 17c of the heat pipe is heated, the internal working medium 173 will evaporate and vaporize, and the vapor will move toward the condensation section 17a under the action of the pressure difference, and condense into liquid in the condensation section 17a through the action of the air cooling component 12, and the liquid returns to the heat absorption section 17c under the capillary force of the liquid absorption layer, and the cycle is repeated, so that the heat on the heat absorption plate is transferred to the position of the air cooling component 12.

[0080] Since the heat pipe relies on the phase change of the internal working medium 173 to achieve heat transfer, the heat pipe has high thermal conductivity and isothermal properties. Of course, in other embodiments, the heat pipe and the cooling medium 173 can also be combined in other ways, such as an aluminum heat pipe shell and ammonia as the cooling medium 173.

[0081] In other embodiments, the heat exchange structure may also adopt other types of settings, such as setting the heat exchange structure as a circulating heat exchange tube, and the direction may pass through the position of the air-cooled radiator. The heat exchange tube is filled with coolant, and the coolant can exchange heat with the heat conduction plate 11, and then transport the heat to the position of the air-cooled radiator 123, and exchange heat with the airflow through the air-cooled radiator 123. Such a setting can enable the heat dissipation device 1 to achieve a combination of air cooling and liquid cooling, which can further improve the heat dissipation capacity of the heat dissipation device 1 and make the heat dissipation efficiency higher.

[0082] In specific implementation, the coolant can be selected to have a stronger heat exchange effect, and the heat exchange tube can be made of a material with better thermal conductivity, such as a copper tube, to further improve the heat exchange effect.

[0083] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0084] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device is used to be arranged in a box (2) of an electronic device; The heat dissipation device comprises a device body and a heat dissipation mechanism arranged on the device body, the heat dissipation mechanism comprises a heat conduction plate (11) and an air cooling component (12), the heat conduction plate (11) is used to be attached to the board module (3) in the box (2), and the air cooling component (12) is arranged on the heat conduction plate (11); The housing (2) has a heat dissipation duct connected to the outside, and the air cooling component (12) is located on the heat dissipation duct. The air cooling component (12) can drive the air flow in the heat dissipation duct so that the air flow exchanges heat with the heat conduction plate (11) and the air cooling component (12) to cool the board module (3).

2. The heat dissipation device according to claim 1, characterized in that: The air cooling component (12) comprises a fan (122), and the fan (122) is arranged on the heat conduction plate (11); An air-cooling radiator (123) is provided at the outlet of the fan, and the air-cooling radiator (123) forms an air flow inlet and an air flow outlet, and both the air flow inlet and the air flow outlet are connected to the heat dissipation duct.

3. The heat dissipation device according to claim 1, characterized in that: A heat exchange structure is also provided on the heat conduction plate (11), the heat exchange structure is extended in a direction away from the heat conduction plate (11), and at least a part of the heat exchange structure is located on the heat dissipation duct.

4. The heat dissipation device according to claim 3, characterized in that: The heat exchange structure is extended along the length direction or the width direction of the heat conduction plate (11); And / or, there are multiple heat exchange structures, and all of the heat exchange structures are arranged at intervals along the length direction or width direction of the heat conduction plate (11).

5. The heat dissipation device according to claim 3, characterized in that: The heat exchange structure comprises a heat pipe (17), and the heat pipe (17) is arranged on a side of the heat conduction plate (11) facing away from the board module (3); The heat pipe (17) is filled with a working medium (173) for heat exchange.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The air cooling component (12) comprises a fan (122), and the fan (122) is arranged on the heat conduction plate (11); The heat dissipation device further comprises an electrical connection mechanism (16) electrically connected to the fan (122), and the electrical connection mechanism (16) is used to be electrically connected to a power supply mechanism of the electronic equipment.

7. The heat dissipation device according to claim 6, characterized in that: The electrical connection mechanism (16) comprises a circuit board (161) and a heat sink connector (162) arranged on the circuit board (161); the fan (122) is electrically connected to the circuit board (161) via a wire; and the heat sink connector (162) is used for detachably connecting to a power supply mechanism of the electronic device.

8. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The device body comprises a cover plate (13) and a mounting frame (14), the heat conduction plate (11) being arranged on the mounting frame (14); the box body (2) is provided with a mounting opening for placing the heat dissipation device, the cover plate (13) is arranged on the mounting opening, and an exhaust port (131) for communicating with the heat dissipation air duct is formed on the cover plate (13); And / or, the heat dissipation device comprises a locking mechanism (15) movably connected to the device body, the box body (2) has a mounting groove for placing the heat dissipation device, and the locking mechanism (15) can be moved relative to the device body in the direction toward the groove wall of the mounting groove until it abuts against the groove wall of the mounting groove, so that the heat dissipation device is fixed relative to the box body (2).

9. An electronic device, characterized in that: It comprises a box (2), a board module (3) and a heat dissipation device according to any one of claims 1 to 8, wherein the board module (3) and the heat dissipation device are both arranged in the box (2); The box body (2) is provided with an installation chamber (21) for placing the heat dissipation device, and the installation chamber (21) is located on one side of the board module (3); a mounting opening connected to the installation chamber (21) is provided on one lateral side of the box body (2), and an air inlet (22) connected to the installation chamber (21) is provided at a bottom position of the box body (2) corresponding to the installation chamber (21).

10. The electronic device according to claim 9, characterized in that: The installation chamber (21) comprises a plurality of installation slots matching the heat dissipation device, and each of the installation slots is arranged along the extension direction of the side wall of the board module (3); There are multiple heat dissipation devices, and each heat dissipation device is correspondingly arranged in one of the installation slots.

11. The electronic device according to claim 10, characterized in that: A guide structure is provided on the groove wall of the installation groove and is arranged along the extension direction of the installation groove; a sliding portion is provided at a position of the heat dissipation device corresponding to the guide structure; and the heat dissipation device is slidably connected to the box body (2) via the sliding portion and the guide structure; And / or, the heat dissipation device also includes an electrical connection mechanism (16) electrically connected to the fan (121) of the air-cooling component (12), and the electrical connection mechanism (16) is used to be electrically connected to the power supply mechanism of the electronic equipment; the electrical connection mechanism (16) includes a first guide member (163), and a second guide member (5) matching the first guide member (163) is provided at a position in the installation groove corresponding to the first guide member (163), and the heat dissipation device is positioned relative to the box body (2) by the first guide member (163) and the second guide member (5).

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