Electronic equipment and heat dissipation assembly

Abstract

The embodiment of the invention provides electronic equipment and a heat dissipation assembly, and relates to the field of electronic equipment. The electronic equipment comprises a heat dissipation assembly and a shell assembly, wherein the heat dissipation assembly is stacked on the shell assembly in the thickness direction; the shell assembly comprises at least two main bodies and a hinge, and the two adjacent main bodies are movably connected to the two opposite sides of the hinge. The heat dissipation assembly comprises at least two heat dissipation parts and a bendable part; the at least two heat dissipation parts are communicated to form a circulation channel, or the at least two heat dissipation parts are respectively provided with a circulation channel; the circulation channel is filled with heat dissipation media, the two adjacent heat dissipation parts cover the two adjacent bodies respectively, and orthographic projections of the bendable parts and the hinges in the thickness direction are at least partially overlapped. The bendable part can be bent along with the folding of the foldable electronic equipment or flattened along with the unfolding of the foldable electronic equipment, so that the heat dissipation assembly can be arranged in at least two main bodies of the foldable electronic equipment, and the coverage area of the heat dissipation assembly is increased.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic equipment, and in particular to an electronic equipment and a heat dissipation component. Background Art

[0002] Mobile phones and other electronic devices have become indispensable items in people's daily lives. During the use of electronic devices, components such as motherboards and battery capacitors are prone to heat up, affecting the performance of electronic devices.

[0003] In the related art, in order to reduce the temperature of electronic devices, an ultra-thin vapor chamber is set at the heat source of the electronic device, and the heat is quickly taken away by evaporating the working fluid in the evaporation zone, and the condensed working fluid is returned to the evaporation zone to achieve efficient heat dissipation. However, in foldable electronic devices, the vapor chamber can only be arranged in a middle frame of the foldable device because it cannot be folded. The heat dissipation area of ​​the vapor chamber is small, which affects the heat dissipation effect. Summary of the invention

[0004] In view of this, the present disclosure provides an electronic device and a heat dissipation component, which have better heat dissipation effect.

[0005] Specifically, the following technical solutions are included:

[0006] An embodiment of the present disclosure provides an electronic device, comprising a heat dissipation component and a housing component, wherein the heat dissipation component is stacked on the housing component along a thickness direction;

[0007] The housing assembly comprises: at least two main bodies and a hinge, wherein two adjacent main bodies are movably connected to opposite sides of the hinge;

[0008] The heat dissipation assembly includes at least two heat dissipation parts and a bendable part;

[0009] The at least two heat dissipating parts are connected to form a circulation channel, or the at least two heat dissipating parts are respectively provided with a circulation channel;

[0010] The circulation channel is filled with a heat dissipation medium, two adjacent heat dissipation parts are respectively covered on two adjacent main bodies, and the orthographic projections of the bendable part and the hinge along the thickness direction at least partially overlap.

[0011] Optionally, two adjacent heat dissipation portions are connected via the bendable portion to form a circulation channel.

[0012] Optionally, the bendable portion includes: a flexible first shell, and the first shell is connected to the heat dissipation portion.

[0013] Optionally, at least a portion of the first shell is a hollow structure, and a portion of the circulation channel passes through the hollow structure.

[0014] Optionally, the bendable portion further includes: a supporting portion, wherein the supporting portion is disposed in the hollow structure of the first shell and connected to at least one inner wall of the first shell along a thickness direction.

[0015] Optionally, the bendable portion further comprises: a liquid absorbent core, wherein the liquid absorbent core is located in the first shell of the bendable portion and is connected to at least one inner wall of the first shell along the thickness direction.

[0016] Optionally, the support portion and the liquid absorbent core are connected to the inner wall of the same side of the first shell, and one end of the support portion passes through the liquid absorbent core.

[0017] Optionally, at least one surface of at least part of the bendable portion along the thickness direction has a texture structure.

[0018] Optionally, the texture structure comprises a plurality of protrusions, the plurality of protrusions extending along the rotation axis of the hinge; and / or,

[0019] The texture structure includes a plurality of recesses extending along a rotation axis of the hinge.

[0020] Optionally, the cross-sectional shape of the texture structure in a plane perpendicular to the rotation axis of the hinge is corrugated, fin-shaped or sawtooth-shaped.

[0021] Optionally, the circulation channel includes an evaporation section and a condensation section.

[0022] Optionally, a reflux wick and a support portion are provided in the evaporation section, the support portion is connected to at least one inner wall of the evaporation section along the thickness direction, and the reflux wick is connected to one inner wall of the evaporation section along the thickness direction.

[0023] Optionally, a condensation wick and a support portion are provided in the condensation section, the support portion is connected to at least one inner wall of the condensation section along the thickness direction, and the condensation wick is connected to the inner walls of the condensation section on two opposite sides along the thickness direction.

[0024] Optionally, the circulation channel further includes a first connecting section, and two ends of the first connecting section are respectively connected to the air outlet end of the evaporation section and the air inlet end of the condensation section.

[0025] Optionally, a first guide absorbent core and a support portion are provided in the first connecting section, the support portion is connected to at least one inner wall of the first connecting section along the thickness direction, and the first guide absorbent core is connected to one inner wall of the first connecting section.

[0026] Optionally, the circulation channel further includes a second connecting section, and two ends of the second connecting section are respectively connected to the air inlet end of the evaporation section and the air outlet end of the condensation section.

[0027] Optionally, a second guide absorbent core and a support portion are provided in the second connecting segment, the support portion is connected to at least one inner wall of the second connecting segment along the thickness direction, and the second guide absorbent core is connected to inner walls on opposite sides of the second connecting segment.

[0028] Optionally, the circulation channel further includes a compensation section, wherein the compensation section is located between the second connecting section and the evaporation section, and a sealed liquid wick is disposed in the compensation section, and the sealed liquid wick fills the compensation section.

[0029] Optionally, the heat dissipation assembly further includes a baffle, which is located in the circulation channel and between the evaporation section and the condensation section.

[0030] Optionally, the barrier portion includes a Tesla valve; or the barrier portion is filled with a liquid wick.

[0031] Optionally, the electronic device further includes a screen assembly, a mainboard and a battery cover;

[0032] The screen assembly is covered on the at least two main bodies along the thickness direction, the battery cover is covered on the side of the housing assembly away from the screen assembly, and the main board is located between the at least two main bodies and the battery cover;

[0033] The heat dissipation component is disposed at at least one of the following locations:

[0034] The heat dissipation component is located between the screen component and the housing component;

[0035] The heat dissipation component is located between the mainboard and the housing component;

[0036] The heat dissipation component is arranged on the battery cover.

[0037] Optionally, the heat dissipation part includes: a second shell, the second shell is a hollow structure, a connected and enclosed space is provided in the first shell and the second shell to form the circulation channel, and the first shell and the second shell are an integrated structure or a split structure.

[0038] Optionally, at least one side edge of the first shell is provided with an overlapping portion, and the second shell is provided with a limiting portion, and the overlapping portion is connected to the limiting portion of the second shell.

[0039] Optionally, the overlapping portion of the first shell is connected to the limiting portion of the second shell via a fastener.

[0040] In a second aspect, an embodiment of the present disclosure provides a heat dissipation component, comprising at least two heat dissipation parts and a bendable part, wherein the at least two heat dissipation parts are connected to form a circulation channel, or the at least two heat dissipation parts are respectively provided with circulation channels, and the circulation channels are filled with a heat dissipation medium, and the bendable part is configured to at least partially overlap with the orthographic projection of the hinge of the electronic device along the thickness direction.

[0041] Optionally, two adjacent heat dissipation portions are connected via the bendable portion to form a circulation channel.

[0042] Optionally, the bendable portion includes: a flexible first shell, and the first shell is connected to the heat dissipation portion.

[0043] Optionally, at least a portion of the first shell is a hollow structure, and a portion of the circulation channel passes through the hollow structure.

[0044] Optionally, the bendable portion further includes: a supporting portion, wherein the supporting portion is disposed in the hollow structure of the first shell and connected to at least one inner wall of the first shell along a thickness direction.

[0045] Optionally, the bendable portion further comprises: a liquid absorbent core, wherein the liquid absorbent core is located in the first shell of the bendable portion and is connected to at least one inner wall of the first shell along the thickness direction.

[0046] Optionally, the support portion and the liquid absorbent core are connected to the inner wall of the same side of the first shell, and one end of the support portion passes through the liquid absorbent core.

[0047] Optionally, at least one surface of at least part of the bendable portion along the thickness direction has a texture structure.

[0048] Optionally, the texture structure comprises a plurality of protrusions, the plurality of protrusions extending along the rotation axis of the hinge; and / or,

[0049] The texture structure includes a plurality of recesses extending along a rotation axis of the hinge.

[0050] Optionally, the cross-sectional shape of the texture structure in a plane perpendicular to the rotation axis of the hinge is corrugated, fin-shaped or sawtooth-shaped.

[0051] Optionally, the circulation channel includes an evaporation section and a condensation section.

[0052] Optionally, a reflux wick and a support portion are provided in the evaporation section, the support portion is connected to at least one inner wall of the evaporation section along the thickness direction, and the reflux wick is connected to one inner wall of the evaporation section along the thickness direction.

[0053] Optionally, a condensation wick and a support portion are provided in the condensation section, the support portion is connected to at least one inner wall of the condensation section along the thickness direction, and the condensation wick is connected to the inner walls of the condensation section on two opposite sides along the thickness direction.

[0054] Optionally, the circulation channel further includes a first connecting section, and two ends of the first connecting section are respectively connected to the air outlet end of the evaporation section and the air inlet end of the condensation section.

[0055] Optionally, a first guide absorbent core and a support portion are provided in the first connecting section, the support portion is connected to at least one inner wall of the first connecting section along the thickness direction, and the first guide absorbent core is connected to one inner wall of the first connecting section.

[0056] Optionally, the circulation channel further includes a second connecting section, and two ends of the second connecting section are respectively connected to the air inlet end of the evaporation section and the air outlet end of the condensation section.

[0057] Optionally, a second guide absorbent core and a support portion are provided in the second connecting segment, the support portion is connected to at least one inner wall of the second connecting segment along the thickness direction, and the second guide absorbent core is connected to inner walls on opposite sides of the second connecting segment.

[0058] Optionally, the circulation channel further includes a compensation section, wherein the compensation section is located between the second connecting section and the evaporation section, and a sealed liquid wick is disposed in the compensation section, and the sealed liquid wick fills the compensation section.

[0059] Optionally, the heat dissipation assembly further includes a baffle, which is located in the circulation channel and between the evaporation section and the condensation section.

[0060] Optionally, the barrier portion includes a Tesla valve; or the barrier portion is filled with a liquid wick.

[0061] Optionally, the heat dissipation assembly further includes: a second shell, the second shell is a hollow structure, a connected and enclosed space is provided in the first shell and the second shell to form the circulation channel, and the first shell and the second shell are an integral structure or a split structure.

[0062] Optionally, at least one side edge of the first shell is provided with an overlapping portion, and the second shell is provided with a limiting portion, and the overlapping portion is connected to the limiting portion of the second shell.

[0063] Optionally, the overlapping portion of the first shell is connected to the limiting portion of the second shell via a fastener.

[0064] The beneficial effects of the technical solution provided by the embodiments of the present disclosure include at least:

[0065] In the electronic device provided by the embodiment of the present disclosure, two heat dissipation parts are used to form a circulation channel, and the circulation channel is filled with a heat dissipation medium, so that the electronic device can be circulated and dissipated. The orthographic projections of the bendable part and the hinge along the thickness direction at least partially overlap, and the bendable part can bend as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation component can be arranged in at least two bodies of the foldable electronic device, increasing the coverage area of ​​the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0067] Figure 1 A schematic diagram of an electronic device provided by an embodiment of the present disclosure;

[0068] Figure 2 A schematic diagram of a bendable portion of a heat dissipation assembly provided in an embodiment of the present disclosure;

[0069] Figure 3 A schematic diagram of another bendable portion of a heat dissipation assembly provided in an embodiment of the present disclosure;

[0070] Figure 4 A schematic diagram of another electronic device provided by an embodiment of the present disclosure;

[0071] Figure 5 A schematic diagram of another electronic device provided by an embodiment of the present disclosure;

[0072] Figure 6 An exploded diagram of an electronic device provided in an embodiment of the present disclosure;

[0073] Figure 7 An exploded diagram of another electronic device provided by an embodiment of the present disclosure;

[0074] Figure 8 A partial cross-sectional view of a heat dissipation assembly provided in an embodiment of the present disclosure;

[0075] Fig. 9 A schematic diagram of a heat dissipation assembly provided by an embodiment of the present disclosure;

[0076] Fig.10 for Fig. 9 A cross-sectional view of the heat dissipation assembly at AA is shown;

[0077] Fig.11 for Fig. 9 A cross-sectional view of the heat dissipation assembly at BB is shown;

[0078] Fig.12 for Fig. 9 A cross-sectional view of the heat dissipation assembly at CC is shown;

[0079] Fig.13 for Fig. 9 A cross-sectional view of the heat dissipation assembly at DD is shown;

[0080] Fig.14 for Fig. 9 A cross-sectional view of the heat dissipation assembly at EE is shown;

[0081] Fig.15 A schematic diagram of the structure of another heat dissipation assembly provided in an embodiment of the present disclosure;

[0082] Fig.16 A schematic diagram of the structure of another heat dissipation assembly provided in an embodiment of the present disclosure.

[0083] The reference numerals in the figures represent respectively:

[0084] 1-heat sink; 2-housing assembly; 21-main body; 22-hinge; 3-screen assembly; 4-mainboard; 5-battery cover; 11-heat sink; 12-circulation channel; 13-bendable part; 14-support part; 15-blocking part;

[0085] 101-evaporation section; 102-condensation section; 103-first connection section; 104-second connection section; 105-compensation section; 131-texture structure; 132-convex part; 133-first shell; 134-liquid wick; 135-concave part; 111-second shell; 211-fixing part; 001-upper shell; 002-lower shell;

[0086] 1011-reflux absorbent core; 1021-condensation absorbent core; 1031-first guide absorbent core; 1041-second guide absorbent core; 1051-sealed absorbent core; 1111-limiting portion; 1331-overlapping portion.

[0087] The above drawings show clear embodiments of the present disclosure, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0088] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0089] Figure 1 Schematic diagram of an electronic device provided by an embodiment of the present disclosure. Figure 1 As shown, the electronic device includes a heat dissipation component 1 and a housing component 2, and the heat dissipation component 1 is stacked on the housing component 2 along the thickness direction. The housing component 2 includes at least two main bodies 21 and a hinge 22, and two adjacent main bodies 21 are movably connected to opposite sides of the hinge 22. The heat dissipation component 1 includes at least two heat dissipation parts 11 and a bendable part 13, at least two heat dissipation parts 11 are connected to form a circulation channel 12, or at least two heat dissipation parts 11 are respectively provided with a circulation channel 12, and the circulation channel 12 is filled with a heat dissipation medium, and two adjacent heat dissipation parts 11 are respectively covered on two adjacent main bodies 21, and the orthographic projections of the bendable part 13 and the hinge 22 along the thickness direction at least partially overlap.

[0090] In the electronic device provided by the embodiment of the present disclosure, the two heat dissipation parts 11 are used to form a circulation channel 12, and the circulation channel 12 is filled with a heat dissipation medium, so that the heat dissipation of the heating element in the electronic device can be circulated. The orthographic projections of the bendable part 13 and the hinge 22 along the thickness direction at least partially overlap, and the bendable part 13 can be bent as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation component 1 can be set in at least two main bodies 21 of the foldable electronic device, increasing the coverage area of ​​the heat dissipation component.

[0091] In order to make the technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0092] See also Figure 1 The electronic device provided by the embodiment of the present disclosure includes a heat dissipation component 1 and a shell component 2, the shell component 2 includes a hinge 22 and two main bodies 21, the two main bodies 21 are movably connected to the opposite sides of the hinge 22, the heat dissipation component 1 includes at least two heat dissipation parts 11 and a bendable part 13, the at least two heat dissipation parts 11 are respectively covered on the two main bodies 21, the bendable parts 13 are respectively connected to the at least two heat dissipation parts 11, and the orthographic projections of the bendable parts 13 and the hinge 22 along the thickness direction at least partially overlap.

[0093] In the embodiments of the present disclosure, the electronic device may be a foldable electronic device or an accessory of an electronic device, for example, the foldable electronic device may be a foldable screen mobile phone or a laptop computer, etc.; the accessory of the electronic device may be an accessory with a heat dissipation function, such as a keyboard protective cover or a heat dissipation protective cover, etc. It should be noted that the embodiments of the present disclosure do not specifically limit the specific type of the electronic device.

[0094] In some embodiments of the present disclosure, Figure 1 As shown, two adjacent heat dissipation parts 11 are connected through a bendable part 13 to form a circulation channel 12. Exemplarily, the heat dissipation component 1 has two heat dissipation parts 11, and the two ends of the two heat dissipation parts 11 are connected through the bendable part 13, so as to form an annular circulation channel 12. The circulation channel 12 is filled with a heat dissipation medium, and the heat dissipation medium can circulate in the circulation channel 12, so as to dissipate heat from the heating element in the electronic device. The heat dissipation medium is affected by the temperature of the heating element of the electronic device and is in a liquid and / or gaseous state in the circulation channel 12.

[0095] Figure 2 A schematic diagram of a bendable portion 13 of a heat dissipation assembly 1 provided in an embodiment of the present disclosure. Optionally, as Figure 2 As shown, the bendable portion 13 includes a flexible first shell 133, and the first shell 133 is connected to the heat dissipation portion 11. The first shell 133 can bend when the hinge 22 rotates, so that two adjacent heat dissipation portions 11 are moved closer to each other or farther away from each other.

[0096] In some embodiments of the present disclosure, Figure 2 As shown, at least part of the first shell 133 is a hollow structure, and part of the circulation channel 12 passes through the hollow structure. The hollow structure of the first shell 133 is used to connect the ends of two adjacent heat dissipation parts 11, so that the circulation channels 12 in the two adjacent heat dissipation parts 11 are connected to each other.

[0097] And / or, at least two heat dissipation parts 11 are connected via the bendable part 13 , and two adjacent heat dissipation parts 11 are respectively provided with a circulation channel 12 , and the heat dissipation medium in the two adjacent heat dissipation parts 11 can circulate in the respective circulation channels 12 .

[0098] It is understandable that the heat dissipation parts located at different main bodies can be respectively provided with independent circulation channels 12, or the channels of the heat dissipation parts located at different main bodies can be connected through the folding part to form a circulation channel, or the above two methods can be combined and used.

[0099] like Figure 2As shown, the bendable portion 13 further includes a support portion 14, which is disposed in the hollow structure of the first shell 133 and connected to at least one inner wall of the first shell 133 along the thickness direction. Preferably, both ends of the support portion 14 are respectively connected to the inner walls of two opposite sides of the first shell 133 along the thickness direction. The support portion 14 is used to support the hollow structure inside the shell 133 to prevent the bendable portion 13 from being deformed or collapsed.

[0100] In some embodiments of the present disclosure, Figure 2 As shown, the bendable portion 13 further includes a liquid wick 134, which is located in the first shell 133 of the bendable portion 13 and connected to at least one inner wall of the first shell 133 along the thickness direction. The liquid wick 134 is used to absorb the liquid heat dissipation medium in the bendable portion 13, so that the heat dissipation medium can easily flow through the bendable portion 13, and prevent the heat dissipation medium from gathering in the hollow structure of the bendable portion 13.

[0101] Alternatively, see Figure 2 The support portion 14 and the liquid absorbent core 134 are connected to the inner wall of the same side of the first shell 133, and one end of the support portion 14 passes through the liquid absorbent core 134. The inner wall where the support portion 14 and the liquid absorbent core 134 are connected to the first shell 133 is located on the side close to the hinge 22. When the bendable portion 13 is bent and deformed, the deformation degree of the side of the first shell 133 close to the hinge 22 is small, so as to reduce the mutual squeezing and friction between the support portion 14 and the liquid absorbent core 134, avoid the support portion 14 and the liquid absorbent core 134 from being damaged during the process of multiple bending and deformation of the bendable portion 13, which is conducive to improving the service life of the bendable portion 13.

[0102] In some embodiments of the present disclosure, Figure 2 As shown, at least one surface of at least a portion of the bendable portion 13 along the thickness direction has a texture structure 131. Exemplarily, the texture structure 131 is located on the surface of the first shell 133 away from the hinge 22, and the texture structure 131 can increase the surface area of ​​the first shell 133, and adjust the surface shape of the first shell 133 when the bendable portion 13 is bent and deformed, thereby improving the fatigue strength of the bendable portion 13.

[0103] For details, see Figure 2 The texture structure 131 includes a plurality of convex portions 132, and the plurality of convex portions 132 extend along the rotation axis of the hinge 22. The extension directions of the plurality of convex portions 132 are parallel to each other, for example, the plurality of convex portions 132 may be strip-shaped and extend along the rotation axis of the hinge 22. When the bendable portion 13 is bent, the plurality of convex portions 132 located on the surface of the first shell 133 away from the hinge 22 can approach each other, and the plurality of convex portions 132 located on the surface of the first shell 133 close to the hinge 22 can move away from each other, so as to improve the deformation range and bending fatigue strength of the shell 133.

[0104] Figure 3 Schematic diagram of another bendable portion 13 of the heat dissipation assembly 1 provided in an embodiment of the present disclosure. Figure 3 The texture structure 131 includes a plurality of recesses 135, and the plurality of recesses 135 extend along the rotation axis of the hinge 22. The plurality of recesses 135 extend along the rotation axis of the hinge 22, for example, the plurality of recesses 135 may be in the shape of strips extending along the rotation axis of the hinge 22. When the bendable portion 13 is bent, the width of the plurality of recesses 135 located on the surface of the first shell 133 away from the hinge 22 is reduced, and the width of the plurality of recesses 135 located on the surface of the first shell 133 close to the hinge 22 is increased, so as to improve the deformation range and bending fatigue strength of the shell 133.

[0105] In some embodiments of the present disclosure, the cross-sectional shape of the texture structure 131 in a plane perpendicular to the rotation axis of the hinge 22 is a corrugated shape, a fin shape, or a sawtooth shape.

[0106] Figure 4 Schematic diagram of another electronic device provided by an embodiment of the present disclosure. Figure 4 As shown, the heat dissipation assembly 1 includes at least two heat dissipation parts 11 and at least two bendable parts 13, wherein one heat dissipation part 11 is located on one side close to the upper edge of one main body 21, and the area of ​​the heat dissipation part 11 is small, and the other heat dissipation part 11 is located in the middle area of ​​the other main body 21, and the area of ​​the heat dissipation part 11 is large, and one bendable part 13 is respectively connected to one end of the two heat dissipation parts 11, and the other bendable part 13 is respectively connected to the other end of the two heat dissipation parts 11. At least two heat dissipation parts 11 and at least two bendable parts 13 form a ring around the elongated gap, so as to fix the heat dissipation assembly 1 and dissipate heat for the heating element arranged at a specific position of the main body 21.

[0107] And / or, at least two heat dissipation parts 11 and at least two bendable parts 13 form a flat plate-shaped heat dissipation component 1, and no through-hole structure is provided in the heat dissipation component 1, and a barrier structure is provided in the middle area of ​​the heat dissipation component 1 to form a circulation channel 12 inside the heat dissipation component 1. In some embodiments, the housing component 2 includes a plurality of main bodies 21 and a plurality of hinges 22, each hinge 22 is located between two adjacent main bodies 21, and is movably linked to the main bodies 21. The heat dissipation component 1 includes a plurality of heat dissipation parts 11 and a plurality of bendable parts 13, each heat dissipation part 11 is provided in a main body 21, each bendable part 13 is located between two adjacent heat dissipation parts 11, and overlaps with the projection of the hinge 22 in the thickness direction.

[0108] Figure 5 A schematic diagram of another electronic device provided by an embodiment of the present disclosure. Figure 5As shown, the heat dissipation assembly 1 includes at least two heat dissipation parts 11 and at least two bendable parts 13, at least two bendable parts 13 are located in the middle of the heat dissipation assembly 1, and overlap with the projection of the hinge 22 in the thickness direction, and two adjacent heat dissipation parts 11 are respectively connected to the two ends of the bendable parts 13. A fixing part 211 is provided on the main body 21, and at least two heat dissipation parts 11 are respectively connected to the fixing part 211, so that the heat dissipation assembly 1 is fixed in the main body 21. Exemplarily, the fixing part 211 is a skirt overlap structure, and the heat dissipation assembly 1 is fixedly connected to the main body 21 through the skirt overlap structure.

[0109] Figure 6 An exploded diagram of an electronic device provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 5 As shown, the electronic device further includes a screen assembly 3, a main board 4 and a battery cover 5. The screen assembly 3 is covered on at least two main bodies 21 along the thickness direction, the battery cover 5 is covered on the side of the housing assembly 2 away from the screen assembly 3, and the main board 4 is located between the at least two main bodies 21 and the battery cover 5. The heat dissipation assembly 1 is located between the screen assembly 3 and the housing assembly 2 to dissipate heat from the screen assembly 3.

[0110] Figure 7 An exploded diagram of another electronic device provided by an embodiment of the present disclosure. Figure 7 As shown, the heat dissipation component 1 is located between the mainboard 4 and the housing component 2 to dissipate heat for the mainboard 4 .

[0111] And / or, the heat dissipation component 1 is disposed on the battery cover 5 to dissipate heat from the battery of the electronic device.

[0112] Figure 8 A partial cross-sectional view of a heat dissipation assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 8 As shown, the heat dissipation part 11 includes: a second shell 111, the second shell 111 is a hollow structure, the first shell 133 and the second shell 111 are provided with a connected and closed space to form a circulation channel 12, and the first shell 133 and the second shell 111 are an integrated structure or a split structure. Further, the material of the second shell 111 is the same as or different from the material of the first shell 133, for example: the material of the second shell 111 and the material of the first shell 133 are both metal or alloy materials, such as copper, stainless steel and other materials with good thermal conductivity.

[0113] In some embodiments of the present disclosure, Figure 8 As shown, at least one side edge of the first shell 133 is provided with a lap portion 1331, and the second shell 111 is provided with a limiting portion 1111, and the lap portion 1331 is connected to the limiting portion 1111 of the second shell 111. Specifically, the lap portion 1331 and the limiting portion 1111 can be sealed and connected by welding or bonding.

[0114] Optionally, the overlap portion 1331 of the first shell 133 is connected to the limiting portion 1111 of the second shell 111 through a fastener. Exemplarily, the fastener is a colloid, which is used to bond the overlap portion 1331 to the limiting portion 1111. Or the fastener is a rubber sleeve, which is sleeved outside the limiting portion 1111 to seal and connect the first shell 133 and the second shell 111.

[0115] Fig. 9 Schematic diagram of a heat dissipation assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Fig. 9 As shown, the circulation channel 12 includes an evaporation section 101 and a condensation section 102. The evaporation section 101 is configured to be close to the heating element of the electronic device, and the condensation section 102 is configured to be far away from the heating element of the electronic device, so that the heat dissipation medium can circulate and flow between the evaporation section 101 and the condensation section 102 to dissipate heat.

[0116] Optionally, the evaporation section 101 is located in one heat dissipation part 11, and the condensation section 102 is located in another heat dissipation part 11, so that the evaporation section 101 and the condensation section 102 are spaced a long distance apart to increase the temperature difference between the evaporation section 101 and the condensation section 102, which is beneficial to the conversion of the heat dissipation medium between gas and liquid, thereby improving the heat dissipation effect of the heat dissipation component 1.

[0117] In some embodiments of the present disclosure, Fig. 9 As shown, the circulation channel 12 further includes a first connecting section 103, and both ends of the first connecting section 103 are respectively connected to the air outlet end of the evaporation section 101 and the air inlet end of the condensation section 102. The first connecting section 103 passes through the bendable portion 13 to transport the gaseous heat dissipation medium in the evaporation section 101 to the condensation section 102, and the gaseous heat dissipation medium is cooled into liquid in the first connecting section 103 and the condensation section 102.

[0118] In some embodiments of the present disclosure, Fig. 9 As shown, the circulation channel 12 further includes a second connecting section 104, and the two ends of the second connecting section 104 are respectively connected to the air inlet end of the evaporation section 101 and the air outlet end of the condensation section 102. The second connecting section 104 passes through the bendable portion 13 to transport the liquid heat dissipation medium in the condensation section 102 to the evaporation section 101, so that the heat dissipation medium circulates in the circulation channel 12 to dissipate heat for the heating element of the electronic device.

[0119] In some embodiments of the present disclosure, Fig. 9As shown, the heat dissipation assembly 1 further includes a baffle 15, which is located in the circulation channel 12 and between the evaporation section 101 and the condensation section 102. Specifically, the baffle 15 is located in the first connection section 103, and is used to block the gaseous heat dissipation medium from entering the condensation section 102, and prevent the liquid heat dissipation medium from flowing back into the evaporation section 101 through the first connection section 103, thereby reducing the temperature of the condensation section 102, so that the gaseous heat dissipation medium can be condensed into liquid more quickly in the forward circulation process.

[0120] Optionally, the barrier 15 includes a Tesla valve, or the barrier 15 is filled with a liquid wick 134. It should be noted that the embodiment of the present disclosure does not specifically limit the specific type of the barrier 15, and the above description of the barrier 15 is only an example and not a limitation.

[0121] Fig.10 for Fig. 9 The cross-sectional view of the heat dissipation assembly at AA shown in FIG. Fig.10 As shown, a first guiding absorbent core 1031 and a support portion 14 are provided in the first connecting section 103, the support portion 14 is connected to at least one inner wall of the first connecting section 103 along the thickness direction, the first guiding absorbent core 1031 is connected to one inner wall of the first connecting section 103, and the thickness of the first guiding absorbent core 1031 is 0.01mm-0.3mm. The first guiding absorbent core 1031 is used to absorb the heat dissipation medium condensed in the first connecting section 103 to prevent the heat dissipation medium from condensing into large volume droplets and clogging the first connecting section 103. Exemplarily, the two ends of the support portion 14 are respectively connected to the inner walls of the first connecting section 103 along the thickness direction.

[0122] In some embodiments of the present disclosure, Fig. 9 As shown, the circulation channel 12 further includes a compensation section 105 , and the compensation section 105 is located between the second connecting section 104 and the evaporation section 101 . Fig.11 for Fig. 9 The cross-sectional view of the heat dissipation assembly at BB is shown in FIG. Fig.11 As shown, a sealed liquid wick 1051 is provided in the compensation section 105, and the sealed liquid wick 1051 fills the compensation section 105. Specifically, the compensation section 105 is located at one end of the second connecting section 104 close to the evaporation section 101, and the compensation section 105 is used to block the gaseous heat dissipation medium generated in the evaporation section 101, so that the gaseous heat dissipation medium can enter the condensation section 102 through the first connecting section 103, thereby preventing the heat dissipation medium from flowing back.

[0123] Alternatively, if Fig.11As shown, the second shell 111 includes an upper shell 001 and a lower shell 002 . The upper shell 001 is covered on the lower shell 002 and is welded to the lower shell 002 to form a circulation channel 12 .

[0124] Fig.12 for Fig. 9 The cross-sectional view of the heat dissipation assembly at CC shown in FIG. Fig.12 As shown, a condensation wick 1021 and a support portion 14 are provided in the condensation section 102, the support portion 14 is connected to at least one inner wall of the condensation section 102 along the thickness direction, the condensation wick 1021 is connected to the inner walls of the opposite sides of the condensation section 102 along the thickness direction, and the thickness of the condensation wick 1021 is 0.01mm-0.3mm. Exemplarily, the two ends of the support portion 14 are respectively connected to the inner walls of the two sides of the condensation section 102 along the thickness direction.

[0125] Fig.13 for Fig. 9 sectional view of the heat dissipation assembly at DD. In some embodiments of the present disclosure, Fig.13 As shown, a second guiding absorbent core 1041 and a support portion 14 are provided in the second connecting segment 104, the support portion 14 is connected to at least one inner wall of the second connecting segment 104 along the thickness direction, the second guiding absorbent core 1041 is connected to the inner walls of the opposite sides of the second connecting segment 4, and the thickness of the second guiding absorbent core 1041 is 0.05mm-1mm. Exemplarily, the two ends of the support portion 14 are respectively connected to the inner walls of the two sides of the second connecting segment 104 along the thickness direction.

[0126] Fig.14 for Fig. 9 A cross-sectional view of the heat dissipation assembly at EE is shown. In some embodiments of the present disclosure, Fig.14 As shown, a reflux wick 1011 and a support portion 14 are provided in the evaporation section 101, the support portion 14 is connected to at least one inner wall of the evaporation section 101 along the thickness direction, the reflux wick 1011 is connected to one inner wall of the evaporation section 101 along the thickness direction, and the thickness of the reflux wick 1011 is 0.03mm-0.3mm. Exemplarily, the two ends of the support portion 14 are respectively connected to the inner walls of both sides of the evaporation section 101 along the thickness direction.

[0127] In the electronic device provided by the embodiment of the present disclosure, a liquid absorption core is provided in the evaporation section 101, the condensation section 102, the first connection section 103 and the second connection section 104 to prevent the droplets of the heat dissipation medium from directly adhering to the inner wall of the circulation channel 12 under low temperature conditions, thereby aggravating the deformation of the heat dissipation component 1 caused by thermal expansion and contraction, and causing leakage problems at the connection between the first shell 133 and the second shell 111 and at the connection between the upper shell 001 and the lower shell 002.

[0128] On the other hand, an embodiment of the present disclosure further provides a heat dissipation component, which is the heat dissipation component 1 in any of the above-mentioned electronic devices. Fig. 9 A schematic diagram of a heat dissipation assembly provided in an embodiment of the present disclosure, such as Fig. 9 As shown, the heat dissipation assembly includes at least two heat dissipation parts 11 and a bendable part 13, at least two heat dissipation parts 11 are connected to form a circulation channel 12, or at least two heat dissipation parts 11 are respectively provided with a circulation channel 12, the circulation channel 12 is filled with a heat dissipation medium, and the bendable part 13 is configured to at least partially overlap with the orthographic projection of the hinge of the electronic device along the thickness direction.

[0129] In the heat dissipation assembly provided by the embodiment of the present disclosure, two heat dissipation parts 11 are used to form a circulation channel 12, and the circulation channel 12 is filled with a heat dissipation medium, so that the heat dissipation of the heating element in the electronic device can be circulated. The bendable part 13 is configured to overlap at least partially with the orthographic projection of the hinge along the thickness direction. The bendable part 13 can be bent as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation assembly can be arranged in at least two main bodies 21 of the foldable electronic device, increasing the coverage area of ​​the heat dissipation assembly.

[0130] In some embodiments of the present disclosure, Fig. 9 As shown, two adjacent heat dissipation portions 11 are connected via a bendable portion 13 to form a circulation channel 12 .

[0131] In some embodiments of the present disclosure, the bendable portion 13 and the above Figure 2 The bendable portion of the heat dissipation assembly in has the same structure. Specifically, Figure 2 As shown, the bendable portion 13 includes a flexible first shell 133 , and the first shell 133 is connected to the heat dissipation portion 11 .

[0132] In some embodiments of the present disclosure, Figure 2 As shown, at least part of the first shell 133 is a hollow structure, and part of the circulation channel 12 passes through the hollow structure. The hollow structure of the first shell 133 is used to connect the ends of two adjacent heat dissipation parts 11, so that the circulation channels 12 in the two adjacent heat dissipation parts 11 are connected to each other.

[0133] Alternatively, at least two heat dissipation parts 11 are connected via the bendable part 13 , and two adjacent heat dissipation parts 11 are respectively provided with a circulation channel 12 , and the heat dissipation medium in the two adjacent heat dissipation parts 11 can circulate in the respective circulation channels 12 .

[0134] like Figure 2As shown, the bendable portion 13 further includes a supporting portion 14 , which is disposed in the hollow structure of the first shell 133 and connected to at least one inner wall of the first shell 133 along the thickness direction.

[0135] In some embodiments of the present disclosure, Figure 2 As shown, the bendable portion 13 further includes a liquid absorbent core 134 , which is located in the first shell 133 of the bendable portion 13 and connected to at least one inner wall of the first shell 133 along the thickness direction.

[0136] Alternatively, see Figure 2 The support portion 14 and the absorbent core 134 are connected to the inner wall of the same side of the first shell 133 , and one end of the support portion 14 passes through the absorbent core 134 .

[0137] In some embodiments of the present disclosure, Figure 2 As shown, at least a portion of at least one surface of the bendable portion 13 along the thickness direction has a texture structure 131 .

[0138] For details, see Figure 2 The texture structure 131 includes a plurality of protrusions 132 , and the plurality of protrusions 132 extend along the rotation axis of the hinge 22 .

[0139] Alternatively, see Figure 3 The texture structure 131 includes a plurality of recesses 135 extending along the rotation axis of the hinge 22 .

[0140] In some embodiments of the present disclosure, the cross-sectional shape of the texture structure 131 in a plane perpendicular to the rotation axis of the hinge is a corrugated shape, a fin shape, or a sawtooth shape.

[0141] In some embodiments of the present disclosure, the structure of the connection between the heat dissipation portion 11 and the bendable portion 13 is similar to the above Figure 8 The structure is the same as in. Specifically, Figure 8 As shown, the heat dissipation part 11 includes: a second shell 111, the second shell 111 is a hollow structure, the first shell 133 and the second shell 111 are provided with a connected and closed space to form a circulation channel 12, and the first shell 133 and the second shell 111 are an integrated structure or a split structure. The material of the second shell 111 and the material of the first shell 133 can be the same or different. For example, the material of the second shell 111 and the material of the first shell 133 are both metal or alloy materials, such as copper, stainless steel and other materials with good thermal conductivity.

[0142] In some embodiments of the present disclosure, Figure 8As shown, at least one side edge of the first shell 133 is provided with a lap portion 1331, and the second shell 111 is provided with a limiting portion 1111, and the lap portion 1331 is connected to the limiting portion 1111 of the second shell 111. Specifically, the lap portion 1331 and the limiting portion 1111 can be sealed and connected by welding or bonding.

[0143] Optionally, the overlap portion 1331 of the first shell 133 is connected to the limiting portion 1111 of the second shell 111 through a fastener. Exemplarily, the fastener is a colloid, which is used to bond the overlap portion 1331 to the limiting portion 1111. Or the fastener is a rubber sleeve, which is sleeved outside the limiting portion 1111 to seal and connect the first shell 133 and the second shell 111.

[0144] The structure of the heat dissipation assembly provided in the embodiment of the present disclosure can be similar to the above Figure 9-Figure 14 The heat sink components are the same as those in Fig. 9 As shown, the circulation channel 12 includes an evaporation section 101 and a condensation section 102 .

[0145] In some embodiments of the present disclosure, Fig. 9 As shown, the circulation channel 12 further includes a first connecting section 103 , and two ends of the first connecting section 103 are respectively connected to the air outlet end of the evaporation section 101 and the air inlet end of the condensation section 102 .

[0146] In some embodiments of the present disclosure, Fig. 9 As shown, the circulation channel 12 further includes a second connecting section 104 , and two ends of the second connecting section 104 are respectively connected to the air inlet end of the evaporation section 101 and the air outlet end of the condensation section 102 .

[0147] In some embodiments of the present disclosure, Fig. 9 As shown, the heat dissipation assembly further includes a baffle 15 , which is located in the circulation channel 12 and between the evaporation section 101 and the condensation section 102 .

[0148] Exemplarily, the barrier 15 includes a Tesla valve, or the barrier 15 is filled with a liquid wick 134. It should be noted that the disclosed embodiment does not specifically limit the specific type of the barrier 15, and the above description of the barrier 15 is only an example and not a limitation.

[0149] Fig.10 for Fig. 9 The cross-sectional view of the heat dissipation assembly at AA shown in FIG. Fig.10As shown, a first guide absorbent core 1031 and a support portion 14 are provided in the first connecting segment 103. The support portion 14 is connected to at least one inner wall of the first connecting segment 103 along the thickness direction. The first guide absorbent core 1031 is connected to one inner wall of the first connecting segment 103. The thickness of the first guide absorbent core 1031 is 0.01 mm-0.3 mm.

[0150] In some embodiments of the present disclosure, Fig. 9 As shown, the circulation channel 12 further includes a compensation section 105 , and the compensation section 105 is located between the second connecting section 104 and the evaporation section 101 . Fig.11 for Fig. 9 The cross-sectional view of the heat dissipation assembly at BB is shown in FIG. Fig.11 As shown, a sealed liquid absorbent core 1051 is disposed in the compensation section 105 , and the sealed liquid absorbent core 1051 fills the compensation section 105 .

[0151] Fig.12 for Fig. 9 The cross-sectional view of the heat dissipation assembly at CC shown in FIG. Fig.12 As shown, a condensation wick 1021 and a support portion 14 are provided in the condensation section 102. The support portion 14 is connected to at least one side of the inner wall of the condensation section 102 along the thickness direction. The condensation wick 1021 is connected to the inner walls of the opposite sides of the condensation section 102 along the thickness direction. The thickness of the condensation wick 1021 is 0.01mm-0.3mm.

[0152] Fig.13 for Fig. 9 sectional view of the heat dissipation assembly at DD. In some embodiments of the present disclosure, Fig.13 As shown, a second guide absorbent core 1041 and a support portion 14 are provided in the second connecting segment 104. The support portion 14 is connected to at least one inner wall of the second connecting segment 104 along the thickness direction. The second guide absorbent core 1041 is connected to the inner walls of the opposite sides of the second connecting segment 4. The thickness of the second guide absorbent core 1041 is 0.05 mm-1 mm.

[0153] Fig.14 for Fig. 9 A cross-sectional view of the heat dissipation assembly at EE is shown. In some embodiments of the present disclosure, Fig.14 As shown, a reflux wick 1011 and a support portion 14 are provided in the evaporation section 101. The support portion 14 is connected to at least one inner wall of the evaporation section 101 along the thickness direction. The reflux wick 1011 is connected to one inner wall of the evaporation section 101 along the thickness direction. The thickness of the reflux wick 1011 is 0.03mm-0.3mm.

[0154] Fig.15This is a schematic diagram of the structure of another heat dissipation assembly provided in an embodiment of the present disclosure. Fig.15 As shown, the heat dissipation assembly includes at least two heat dissipation parts 11 and at least two bendable parts 13, wherein one heat dissipation part 11 is located on one side close to the upper edge of one main body 21, and the area of ​​the heat dissipation part 11 is smaller, and the other heat dissipation part 11 is located in the middle area of ​​the other main body 21, and the area of ​​the heat dissipation part 11 is larger. The heat dissipation part 11 with a smaller area is provided with an evaporation section, and the heat dissipation part 11 with a larger area is provided with a condensation section, so that the cooling speed of the heat dissipation medium in the circulation channel 12 can be increased.

[0155] In some embodiments, the heat dissipation assembly 1 includes multiple heat dissipation parts 11 and multiple bendable parts 13, each heat dissipation part 11 is arranged in a main body of the electronic device, each bendable part 13 is located between two adjacent heat dissipation parts 11, and overlaps with the projection of the hinge of the electronic device in the thickness direction.

[0156] Fig.16 A schematic diagram of the structure of another heat dissipation assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Fig.16 As shown, the heat dissipation assembly includes at least two heat dissipation parts 11 and at least two bendable parts 13, the two bendable parts 13 are located in the middle of the heat dissipation assembly, and are configured to overlap with the projection of the hinge of the electronic device in the thickness direction, and two adjacent heat dissipation parts 11 are respectively connected to the two ends of the bendable parts 13. The two heat dissipation parts 11 can be evenly arranged in the two bodies of the electronic device, so as to dissipate heat for the heating element in any body.

[0157] It should be noted that the "several" and "at least one" mentioned in this article refer to one or more, and "multiple" and "at least two" refer to two or more. "And / or" describes the association relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0158] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0159] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0160] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0161] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present disclosure.

[0162] The above descriptions are merely embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. An electronic device, characterized in that: It comprises a heat dissipation component (1) and a shell component (2), wherein the heat dissipation component (1) is stacked on the shell component (2) along the thickness direction; The housing assembly (2) comprises: at least two main bodies (21) and a hinge (22), wherein two adjacent main bodies (21) are movably connected to opposite sides of the hinge (22); The heat dissipation assembly (1) comprises at least two heat dissipation parts (11) and a bendable part (13); The at least two heat dissipation parts (11) are connected to form a circulation channel (12), or the at least two heat dissipation parts (11) are respectively provided with a circulation channel (12); The circulation channel (12) is filled with a heat dissipation medium, the two adjacent heat dissipation parts (11) are respectively covered on the two adjacent main bodies (21), and the orthographic projections of the bendable part (13) and the hinge (22) along the thickness direction at least partially overlap.

2. The electronic device according to claim 1, characterized in that: Two adjacent heat dissipation portions (11) are connected via the bendable portion (13) to form a circulation channel (12).

3. The electronic device according to claim 2, characterized in that: The bendable portion (13) comprises: a flexible first shell (133), wherein the first shell (133) is connected to the heat dissipation portion (11).

4. The electronic device according to claim 3, characterized in that: At least a portion of the first shell (133) is a hollow structure, and a portion of the circulation channel (12) passes through the hollow structure.

5. The electronic device according to claim 4, characterized in that: The bendable portion (13) further comprises: a support portion (14), wherein the support portion (14) is disposed in the hollow structure of the first shell (133) and is connected to at least one inner wall of the first shell (133) along the thickness direction.

6. The electronic device according to claim 5, characterized in that: The bendable portion (13) further comprises: a liquid absorbent core (134), wherein the liquid absorbent core (134) is located in the first shell (133) of the bendable portion (13) and is connected to at least one inner wall of the first shell (133) along the thickness direction.

7. The electronic device according to claim 6, characterized in that: The support portion (14) and the liquid absorbent core (134) are connected to the inner wall of the same side of the first shell (133), and one end of the support portion (14) passes through the liquid absorbent core (134).

8. The electronic device according to claim 1, characterized in that: At least one surface of at least a portion of the bendable portion (13) along the thickness direction has a texture structure (131).

9. The electronic device according to claim 8, characterized in that: The texture structure (131) includes a plurality of protrusions (132), and the plurality of protrusions (132) extend along the rotation axis of the hinge (22); and / or, The texture structure (131) includes a plurality of recesses (135) extending along the rotation axis of the hinge (22).

10. The electronic device according to claim 8, characterized in that: The cross-sectional shape of the texture structure (131) in a plane perpendicular to the rotation axis of the hinge (22) is corrugated, fin-shaped or sawtooth-shaped.

11. The electronic device according to any one of claims 1 to 10, characterized in that: The circulation channel (12) comprises an evaporation section (101) and a condensation section (102).

12. The electronic device according to claim 11, characterized in that: A reflux liquid wick (1011) and a support portion (14) are provided in the evaporation section (101); the support portion (14) is connected to at least one inner wall of the evaporation section (101) along the thickness direction; and the reflux liquid wick (1011) is connected to one inner wall of the evaporation section (101) along the thickness direction.

13. The electronic device according to claim 11, characterized in that: The condensation section (102) is provided with a condensation absorbent core (1021) and a support portion (14), wherein the support portion (14) is connected to at least one side of the inner wall of the condensation section (102) along the thickness direction, and the condensation absorbent core (1021) is connected to the inner walls of the condensation section (102) on two opposite sides along the thickness direction.

14. The electronic device according to claim 11, characterized in that: The circulation channel (12) further comprises a first connecting section (103), the two ends of which are respectively connected to the air outlet end of the evaporation section (101) and the air inlet end of the condensation section (102).

15. The electronic device according to claim 14, characterized in that: A first liquid-guiding absorbent core (1031) and a support portion (14) are provided in the first connecting section (103); the support portion (14) is connected to at least one inner wall of the first connecting section (103) along the thickness direction; and the first liquid-guiding absorbent core (1031) is connected to one inner wall of the first connecting section (103).

16. The electronic device according to claim 11, characterized in that: The circulation channel (12) further comprises a second connecting section (104), the two ends of which are respectively connected to the air inlet end of the evaporation section (101) and the air outlet end of the condensation section (102).

17. The electronic device according to claim 16, characterized in that: A second liquid-guiding absorbent core (1041) and a supporting portion (14) are provided in the second connecting section (104); the supporting portion (14) is connected to at least one inner wall of the second connecting section (104) in the thickness direction; and the second liquid-guiding absorbent core (1041) is connected to the inner walls of the second connecting section (4) on two opposite sides.

18. The electronic device according to claim 17, characterized in that: The circulation channel (12) further comprises a compensation section (105), wherein the compensation section (105) is located between the second connecting section (104) and the evaporation section (101), and a sealed liquid wick (1051) is arranged in the compensation section (105), and the sealed liquid wick (1051) fills the compensation section (105).

19. The electronic device according to claim 11, characterized in that: The heat dissipation assembly (1) further comprises a baffle (15), wherein the baffle (15) is located in the circulation channel (12) and between the evaporation section (101) and the condensation section (102).

20. The electronic device according to claim 19, characterized in that The baffle (15) includes a Tesla valve; or the baffle (15) is filled with a liquid wick (134).

21. The electronic device according to any one of claims 1 to 10, characterized in that: It also includes a screen assembly (3), a main board (4) and a battery cover (5); The screen assembly (3) is covered on the at least two main bodies (21) along the thickness direction, the battery cover (5) is covered on the side of the housing assembly (2) away from the screen assembly (3), and the main board (4) is located between the at least two main bodies (21) and the battery cover (5); The heat dissipation component (1) is arranged at at least one of the following positions: The heat dissipation component (1) is located between the screen component (3) and the housing component (2); The heat dissipation component (1) is located between the mainboard (4) and the housing component (2); The heat dissipation component (1) is arranged on the battery cover (5).

22. The electronic device according to any one of claims 3 to 7, characterized in that: The heat dissipation part (11) comprises: The second shell (111) is a hollow structure, a connected and enclosed space is provided inside the first shell (133) and the second shell (111) to form the circulation channel (12), and the first shell (133) and the second shell (111) are an integrated structure or a split structure.

23. The electronic device according to claim 22, characterized in that: At least one side edge of the first shell (133) is provided with a lap portion (1331), and the second shell (111) is provided with a limiting portion (1111), and the lap portion (1331) is connected to the limiting portion (1111) of the second shell (111).

24. The electronic device according to claim 23, characterized in that: The overlapping portion (1331) of the first shell (133) is connected to the limiting portion (1111) of the second shell (111) via a fastener.

25. A heat dissipation component, characterized in that: The invention comprises at least two heat dissipation parts (11) and a bendable part (13), wherein the at least two heat dissipation parts (11) are connected to form a circulation channel (12), or the at least two heat dissipation parts (11) are respectively provided with a circulation channel (12), wherein the circulation channel (12) is filled with a heat dissipation medium, and the bendable part (13) is configured to at least partially overlap with the orthographic projection of a hinge of the electronic device in the thickness direction.

26. The heat dissipation assembly according to claim 25, characterized in that: Two adjacent heat dissipation portions (11) are connected via the bendable portion (13) to form a circulation channel (12).

27. The heat dissipation assembly according to claim 26, characterized in that: The bendable portion (13) comprises: a flexible first shell (133), wherein the first shell (133) is connected to the heat dissipation portion (11).

28. The heat dissipation assembly according to claim 27, characterized in that: At least a portion of the first shell (133) is a hollow structure, and a portion of the circulation channel (12) passes through the hollow structure.

29. The heat dissipation assembly according to claim 28, characterized in that: The bendable portion (13) further comprises: a support portion (14), wherein the support portion (14) is disposed in the hollow structure of the first shell (133) and is connected to at least one inner wall of the first shell (133) along the thickness direction.

30. The heat dissipation assembly according to claim 29, characterized in that: The bendable portion (13) further comprises: a liquid absorbent core (134), wherein the liquid absorbent core (134) is located in the first shell (133) of the bendable portion (13) and is connected to at least one inner wall of the first shell (133) along the thickness direction.

31. The heat dissipation assembly according to claim 30, characterized in that: The support portion (14) and the liquid absorbent core (134) are connected to the inner wall of the same side of the first shell (133), and one end of the support portion (14) passes through the liquid absorbent core (134).

32. The heat dissipation assembly according to claim 25, characterized in that: At least one surface of at least a portion of the bendable portion (13) along the thickness direction has a texture structure (131).

33. The heat dissipation assembly according to claim 32, characterized in that: The texture structure (131) comprises a plurality of protrusions (132), wherein the plurality of protrusions (132) extend along the rotation axis of the hinge; and / or, The texture structure (131) includes a plurality of recesses (135) extending along the rotation axis of the hinge.

34. The heat dissipation assembly according to claim 32, characterized in that: The cross-sectional shape of the texture structure (131) in a plane perpendicular to the rotation axis of the hinge is corrugated, fin-shaped or sawtooth-shaped.

35. The heat dissipation assembly according to any one of claims 25 to 34, characterized in that: The circulation channel (12) comprises an evaporation section (101) and a condensation section (102).

36. The heat dissipation assembly according to claim 35, characterized in that: A reflux liquid wick (1011) and a support portion (14) are provided in the evaporation section (101); the support portion (14) is connected to at least one inner wall of the evaporation section (101) along the thickness direction; and the reflux liquid wick (1011) is connected to one inner wall of the evaporation section (101) along the thickness direction.

37. The heat dissipation assembly according to claim 35, characterized in that: The condensation section (102) is provided with a condensation absorbent core (1021) and a support portion (14), wherein the support portion (14) is connected to at least one side of the inner wall of the condensation section (102) along the thickness direction, and the condensation absorbent core (1021) is connected to the inner walls of the condensation section (102) on two opposite sides along the thickness direction.

38. The heat dissipation assembly according to claim 35, characterized in that: The circulation channel (12) further comprises a first connecting section (103), the two ends of which are respectively connected to the air outlet end of the evaporation section (101) and the air inlet end of the condensation section (102).

39. The heat dissipation assembly according to claim 38, characterized in that: A first liquid-guiding absorbent core (1031) and a support portion (14) are provided in the first connecting section (103); the support portion (14) is connected to at least one inner wall of the first connecting section (103) along the thickness direction; and the first liquid-guiding absorbent core (1031) is connected to one inner wall of the first connecting section (103).

40. The heat dissipation assembly according to claim 35, characterized in that: The circulation channel (12) further comprises a second connecting section (104), the two ends of which are respectively connected to the air inlet end of the evaporation section (101) and the air outlet end of the condensation section (102).

41. The heat dissipation assembly according to claim 40, characterized in that: A second liquid-guiding absorbent core (1041) and a supporting portion (14) are provided in the second connecting section (104); the supporting portion (14) is connected to at least one inner wall of the second connecting section (104) in the thickness direction; and the second liquid-guiding absorbent core (1041) is connected to the inner walls of the second connecting section (104) on two opposite sides.

42. The heat dissipation assembly according to claim 40, characterized in that: The circulation channel (12) further comprises a compensation section (105), wherein the compensation section (105) is located between the second connecting section (104) and the evaporation section (101), and a sealed liquid wick (1051) is arranged in the compensation section (105), and the sealed liquid wick (1051) fills the compensation section (105).

43. The heat dissipation assembly according to claim 35, characterized in that: It also includes a baffle (15), which is located in the circulation channel (12) and between the evaporation section (101) and the condensation section (102).

44. The heat dissipation assembly according to claim 43, characterized in that: The baffle (15) includes a Tesla valve; or the baffle (15) is filled with a liquid wick (134).

45. The heat dissipation assembly according to any one of claims 27 to 31, characterized in that: Also includes: The second shell (111) is a hollow structure, a connected and enclosed space is provided inside the first shell (133) and the second shell (111) to form the circulation channel (12), and the first shell (133) and the second shell (111) are an integrated structure or a split structure.

46. ​​The heat dissipation assembly according to claim 45, characterized in that: At least one side edge of the first shell (133) is provided with a lap portion (1331), and the second shell (111) is provided with a limiting portion (1111), and the lap portion (1331) is connected to the limiting portion (1111) of the second shell (111).

47. The heat dissipation assembly according to claim 46, characterized in that: The overlapping portion (1331) of the first shell (133) is connected to the limiting portion (1111) of the second shell (111) via a fastener.

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