Electronic equipment

Abstract

The embodiment of the invention provides electronic equipment. The electronic equipment comprises an equipment shell, a heat dissipation shell, a plugging piece, a fan and a heating device. Wherein the heat dissipation shell is arranged on the equipment shell, the heat dissipation shell is provided with an air duct, and the air duct is provided with an air inlet and an air outlet. The draught fan is arranged towards the air channel, and under driving of the draught fan, airflow can enter the heat dissipation shell from the air inlet, flow in the heat dissipation shell along the air channel and finally flow out of the heat dissipation shell from the air outlet. The plugging piece is movably connected with the heat dissipation shell, and the plugging piece and the heat dissipation shell have a first position relation and a second position relation. When the plugging piece and the heat dissipation shell are in the first position relation, the plugging piece avoids at least part of the air inlets and at least part of the air outlets. And when the blocking piece and the heat dissipation shell are in the second position relation, the blocking piece blocks the air inlet and the air outlet.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] As the functions of electronic devices increase, their application scenarios are becoming more and more diverse. In scenarios where electronic devices run 3D software, game software, video editing software, etc., the power consumption of the device chip will increase significantly. As power consumption increases, the device chip will also generate a large amount of heat. If the heat generated by the device chip cannot be dissipated in time, it may cause thermal failure of the entire device, resulting in device freezes, internal chip circuit damage and other problems, affecting user health. In the prior art, the heat dissipation efficiency of the device chip is low and cannot meet the heat dissipation requirements in special scenarios, thereby increasing the probability of the device failing due to thermal failure. Summary of the invention

[0003] An embodiment of the present application provides an electronic device, which includes a heat dissipation housing and a fan disposed in the heat dissipation housing, so as to improve the heat dissipation effect of a heat generating device in the electronic device.

[0004] An embodiment of the present application provides an electronic device, which includes a device housing, a heat dissipation housing, a fan and a heating device. The heat dissipation housing is arranged in the device housing, and the heat dissipation housing has an air duct, and the air duct has an air inlet and an air outlet. The fan is located in the above-mentioned air duct, and driven by the fan, the airflow can enter the heat dissipation housing from the air inlet, flow along the air duct inside the heat dissipation housing, and finally flow out of the heat dissipation housing from the air outlet. The heating device is located in the device housing, and the heating device is thermally connected to the above-mentioned air duct. When the airflow passes through the air duct, the heating device can exchange heat with the airflow, thereby reducing the temperature.

[0005] In addition to the above components, the electronic device also includes a blocking piece, which is movably connected to the heat dissipation housing, and the blocking piece and the heat dissipation housing have a first position relationship and a second position relationship. When the blocking piece and the heat dissipation housing are in the first position relationship, the blocking piece avoids at least part of the air inlet and at least part of the air outlet, so that the air inlet and the air outlet are in a ventilation state. When the blocking piece and the heat dissipation housing are in the second position relationship, the blocking piece blocks the air inlet and the air outlet, so that the air inlet and the air outlet are in a blocked state. By controlling the relative movement of the blocking piece and the heat dissipation housing, the air inlet and the air outlet can be switched between the above-mentioned ventilation state and the blocked state.

[0006] In specific applications, in scenarios where the heat generating device generates more heat, the blocking member and the heat dissipation housing can be adjusted to the first position relationship, so that the air inlet and the air outlet are in a ventilation state, and then the heat generating device is cooled and dissipated by air after the fan is turned on. In scenarios where the heat generating device generates less heat, the blocking member and the heat dissipation housing can be adjusted to the second position relationship, so that the air inlet and the air outlet are in a blocked state, preventing dust and water vapor in the external environment from entering the electronic device, thereby improving the dust and water resistance of the electronic device.

[0007] In some embodiments, the electronic device further includes a heat-conducting component, which is heat-conductingly connected to a heating device in the electronic device, and the heat-conducting component is at least partially located in the air duct. The heat-conducting component can conduct the heat generated by the heating device to the air duct, so that this part of the heat can be dissipated into the external environment along with the flow of air. Moreover, with the connection of the heat-conducting component, the arrangement of the heating device is more flexible. For example, the heating device can be arranged near the air duct or far away from the air duct.

[0008] When the air duct is specifically set, the heat dissipation housing may have multiple air ducts, and each air duct may be provided with at least one fan. For any two of the above-mentioned multiple air ducts, the extension paths of the two air ducts are different, and the air inlets of the two air ducts may be the same or different. Similarly, the air outlets of the two air ducts may be the same or different. Specifically, for the convenience of description, the above-mentioned two air ducts are respectively recorded as the first air duct and the second air duct. In one possible setting, the first air duct and the second air duct have the same air inlet, and the first air duct and the second air duct have different air outlets. In another possible setting, the first air duct and the second air duct have different air inlets, and the first air duct and the second air duct have the same air outlet. In another possible setting, the first air duct and the second air duct have different air inlets, and the first air duct and the second air duct also have different air outlets.

[0009] When forming the above-mentioned air duct, a plurality of partitions may be provided in the heat dissipation housing, and the air duct may be surrounded by the plurality of partitions. Alternatively, a ventilation duct may be provided in the heat dissipation housing, and the air duct may be formed by the ventilation duct. Of course, the air duct may also be formed in other ways, which are not listed one by one in this application. The above-mentioned air duct may guide the airflow to flow along a set path, thereby improving the heat dissipation effect of the heating device. Moreover, the above-mentioned air duct may be isolated from the internal environment of the device housing, thereby improving the dustproof and waterproof performance of the device housing.

[0010] When the heat dissipation shell is specifically set, the heat dissipation shell can protrude from the surface of the device shell, and the heat dissipation shell is provided with a transparent window, which allows light to pass through. In a possible setting form, the heat dissipation shell includes a side wall and a top wall, wherein the side wall of the heat dissipation shell is connected to the device shell, and the top wall of the heat dissipation shell is provided with the above-mentioned transparent window. In addition, the above-mentioned electronic device also includes a camera module, the camera module has a light incident surface, and at least part of the projection of the light incident surface along the third direction is located within the projection of the transparent window along the third direction. The above-mentioned third direction is perpendicular to the plane where the transparent window is located. During the operation of the camera module, light in the external environment can be incident on the light incident surface through the transparent window, and enter the interior of the camera module from the light incident surface, and form an image after image processing. When the transparent window is specifically set, a transparent film can be provided at the transparent window to prevent external dust and water vapor from entering.

[0011] In the above technical solution, the heat dissipation housing forms a housing cavity on the side facing the device housing. The housing cavity can be used to accommodate a fan, or to arrange an air duct, so that the fan, air duct, etc. do not occupy the internal space of the device housing, or only occupy a small space of the device housing. The housing cavity can also provide a portion of additional accommodation space for some components with complex structures in the device housing. For example, when specifically arranging the camera module, at least part of the camera module can be located in the housing cavity, so that the camera module has a larger installation space, and it is also possible to use a camera module with better performance and more complex structure, so as to improve the shooting quality of the electronic device.

[0012] When the air inlet and the air outlet are arranged on the wall surface of the heat dissipation housing, the air inlet and the air outlet can be arranged on the side wall. Alternatively, one of the air inlet and the air outlet can be arranged on the side wall, and the other can be arranged on the top wall. For example, the air inlet can be arranged on the top wall, and the air outlet can be arranged on the side wall.

[0013] In a specific technical solution, the heat dissipation housing has a plurality of air inlets and a plurality of air outlets, wherein the plurality of air inlets are arranged at intervals along a first direction, and the plurality of air outlets are arranged at intervals along a second direction. The blocking member includes a first blocking member and a second blocking member, wherein the first blocking member extends along a first direction, and the first blocking member has a plurality of first vents along the first direction, and a first spacing portion is provided between two adjacent first vents. The second blocking member extends along a second direction, and the second blocking member has a plurality of second vents along the second direction, and a second spacing portion is provided between two adjacent second vents.

[0014] During the specific connection, the heat dissipation housing and the above-mentioned first blocking member can be connected by sliding along the first direction, and the heat dissipation housing and the above-mentioned second blocking member can be connected by sliding along the second direction. By making the heat dissipation housing and the above-mentioned blocking member slide relative to each other, the positional relationship between the heat dissipation housing and the above-mentioned blocking member can be adjusted, thereby changing the ventilation conditions of the air inlet and the air outlet. Specifically, during the relative sliding of the blocking member and the heat dissipation housing, when the blocking member and the heat dissipation housing are in the first positional relationship, the air inlet and the first vent are at least partially overlapped, and the air outlet and the second vent are at least partially overlapped. At this time, both the air inlet and the air outlet are in a ventilation state. When the blocking member and the heat dissipation housing are in the second positional relationship, the first partition blocks the air inlet, and the second partition blocks the air outlet. At this time, both the air inlet and the air outlet are in a blocked state.

[0015] In another specific technical solution, the heat dissipation housing has a first central axis, and the air inlet and the air outlet are arranged circumferentially around the first central axis. The blocking member is an annular structure, and the annular structure is arranged around the first central axis. The annular structure has a plurality of vents, and the plurality of vents are arranged in sequence along the circumferential direction, and a spacer is provided between two adjacent vents.

[0016] When specifically connected, the blocking member and the heat dissipation housing can be rotatably connected, so that the blocking member and the heat dissipation housing can rotate relative to each other around the first central axis. During the relative rotation of the blocking member and the heat dissipation housing around the first central axis, the positional relationship between the blocking member and the heat dissipation housing will change, and the ventilation conditions of the air inlet and the air outlet will also change.

[0017] Specifically, the plurality of vents include a third vent and a fourth vent, and the partition includes a third partition and a fourth partition. When the blocking member and the heat dissipation housing have a first positional relationship, the third vent and the air inlet at least partially overlap, and the fourth vent and the air outlet at least partially overlap, and at this time, the air inlet and the air outlet are both in a ventilated state. When the blocking member and the heat dissipation housing have a second positional relationship, the third partition blocks the air inlet, and the fourth partition blocks the air outlet, and at this time, the air inlet and the air outlet are both in a blocked state.

[0018] In another specific technical solution, the heat dissipation housing has a first central axis, and the air inlet and the air outlet are arranged circumferentially around the first central axis. The blocking member is an annular structure, the annular structure is arranged around the first central axis, and the annular structure and the heat dissipation housing are slidably connected along the first central axis. That is to say, driven by an external force, the annular structure and the heat dissipation housing can perform lifting and lowering movements along the first central axis, and the annular structure and the heat dissipation housing have a first positional relationship and a second positional relationship. When the blocking member and the heat dissipation housing have a first positional relationship, the annular structure avoids the air inlet and the air outlet, and at this time, the air inlet and the air outlet are both in a ventilation state. When the blocking member and the heat dissipation housing have a second positional relationship, the annular structure blocks the air inlet and the air outlet, and at this time, the air inlet and the air outlet are both in a blocked state.

[0019] In order to drive the heat dissipation shell and the blocking piece to move relative to each other, the electronic device also includes a driving component, which can be connected to the heat dissipation shell or the blocking piece to drive the two to move relative to each other. In a specific technical solution, the driving component is connected to the blocking piece, and the driving component is used to drive the blocking piece to move, so that the blocking piece avoids at least part of the air inlet and at least part of the air outlet, or the blocking piece completely blocks the air inlet and the air outlet. When the above-mentioned blocking piece is specifically arranged, the heat dissipation shell can be made to protrude from the surface of the device shell, and the heat dissipation shell forms a receiving cavity on one side of the device shell, so that the above-mentioned blocking piece is arranged in the receiving cavity. By arranging the blocking piece in the receiving cavity, the blocking piece can be prevented from being exposed to the external environment, which is conducive to ensuring the cleanliness of the gap between the blocking piece and the heat dissipation shell, so that it is relatively smooth when the blocking piece and the heat dissipation shell are driven to move relative to each other. In addition, after the blocking piece is arranged inside the heat dissipation shell, the appearance of the electronic device can be improved.

[0020] During use of the above-mentioned electronic device, by adjusting the sealing member and the heat dissipation housing to a first position relationship and starting the fan, airflow can enter the heat dissipation housing, thereby cooling the heating device in an air-cooled heat dissipation mode. In specific implementation, the electronic device can automatically run the above-mentioned air-cooled heat dissipation mode in a variety of ways. In a possible technical solution, the electronic device also includes a controller and an operating unit, and the controller and the operating unit, the drive assembly and the fan are respectively connected. The operating unit has a first trigger state, and the controller is used to control the drive assembly to drive the heat dissipation housing and the sealing member to move relative to each other when the operating unit is in the first trigger state, so that the heat dissipation housing and the sealing member are in a first position relationship, and the fan is started.

[0021] In specific settings, the operating unit may be a control bar located on the housing frame, and when the heating device needs to dissipate heat, the user may press the control bar to switch to the first trigger state. Alternatively, the operating unit may be a control window located on the touch screen of the electronic device, and when the heating device needs to dissipate heat, the user may click the window to switch to the first trigger state.

[0022] During the implementation of the above technical solution, the user needs to subjectively judge whether it is necessary to run the air-cooling heat dissipation mode to dissipate the heat of the heating device. When the user believes that it is necessary to run the air-cooling heat dissipation mode to dissipate the heat of the heating device, the user can trigger the operating part to put the operating part in the first trigger state, so that the controller can control the driving component to drive the sealing part and the heat dissipation shell to move relative to each other, so that the heat dissipation shell and the sealing part are in a first position relationship, and control the fan to start.

[0023] In another possible technical solution, a detection component may be provided to detect a first operating index of the heating device. When the first operating index is greater than a first threshold, it indicates that the heating device generates a lot of heat and needs to operate an air-cooling mode to dissipate heat from the heating device. In a specific implementation, the detection component is connected to a controller. The controller is used to control the drive component to drive the heat dissipation housing and the blocking member to move relative to each other when the first operating index is greater than the first threshold, so that the heat dissipation housing and the blocking member are in a first position relationship, and start the fan. The first operating index includes but is not limited to a power consumption index or a temperature index of the heating device.

[0024] In another possible technical solution, the heat generating device is specifically a chip, and the chip is used to carry the operation of the first application. During the operation of the first application, the chip will generate more heat, and it is necessary to run the air cooling mode to dissipate the heat of the chip. In specific implementation, the controller is used to control the drive component to drive the heat dissipation housing and the blocking member to move relative to each other when the first application is in operation, so that the heat dissipation housing and the blocking member are in a first position relationship, and the fan is started. The first application includes but is not limited to 3D modeling, games, video editing and other applications.

[0025] In specific implementation, when any one of the following conditions is met: "the operating unit is in the first trigger state", "the detection component detects that the first operating indicator is greater than the first threshold value", and "the first application is in the running state", the controller can control the driving component to cause the driving component to drive the heat dissipation shell and the sealing part to move relative to each other, thereby making the heat dissipation shell and the sealing part in a first position relationship, and starting the fan to thereby perform air cooling on the heat generating device.

[0026] During use of the electronic device, the electronic device can also be automatically turned off the air-cooling heat dissipation mode in a variety of ways. For example, the operating unit also has a second trigger state, and the controller is used to control the drive component to drive the heat dissipation housing and the blocking member to move relative to each other when the operating unit is in the second trigger state, so that the heat dissipation housing and the blocking member are in a second position relationship, and the fan is turned off. For another example, the controller can also be used to control the drive component to drive the heat dissipation housing and the blocking member to move relative to each other when the first operating index is less than or equal to the first threshold value ... application is in a stopped state, so that the heat dissipation housing and the blocking member are in a second position relationship, and the fan is turned off.

[0027] In specific implementation, the controller can control the driving component to drive the heat dissipation shell and the blocking part to move relative to each other when "the operating part is in the second trigger state", "the detection component detects that the first operating indicator is less than or equal to the first threshold value" and "the first application is in the closed state" are satisfied at the same time, so that the heat dissipation shell and the blocking part are in the second position relationship, and the fan is turned off, thereby stopping the air cooling of the heat generating device.

[0028] In a specific arrangement, the electronic device further comprises a display screen, which is arranged on the surface of the housing. Since the side of the housing away from the display screen has a larger installation space, the heat dissipation housing can be arranged on the side of the housing away from the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram of the overall structure of an electronic device provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of the overall structure of another electronic device provided in an embodiment of the present application;

[0031] Figure 3 An AA cross-sectional view of an electronic device provided in an embodiment of the present application;

[0032] Figure 4 An AA cross-sectional view of another electronic device provided in an embodiment of the present application;

[0033] Figure 5 A schematic diagram of the layout of the air duct provided in the embodiment of the present application;

[0034] Figure 6 Another schematic diagram of the layout of the air duct provided in the embodiment of the present application;

[0035] Figure 7A schematic diagram of a combination of a blocking member and a heat dissipation housing provided in an embodiment of the present application;

[0036] Figure 8 A schematic diagram of another combination of a blocking member and a heat dissipation housing provided in an embodiment of the present application;

[0037] Fig. 9 A schematic diagram of another combination of a sealing member and a heat dissipation housing provided in an embodiment of the present application.

[0038] Reference numerals:

[0039] 1-device housing; 2-heat dissipation housing; 21-side wall; 22-top wall; 201-air duct; 202-air inlet; 203-air outlet; 204-transparent window; 3-fan; 4-heat conduction component; 41-base plate; 42-heat dissipation fins; 43-heat pipe; 5-sealing member; 51-first sealing member; 52-second sealing member; 501-first vent; 502-second vent; 503-third vent; 504-fourth vent; 511-first partition; 512-second partition; 513-third partition; 514-fourth partition; 6-heating device; 7-camera module; 701-light incident surface. DETAILED DESCRIPTION

[0040] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0041] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be used as limitations on the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0042] References to "one embodiment" or "some embodiments" etc. described in the specification of the present application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in the specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0043] In addition, in the specification of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] In order to facilitate the understanding of the electronic device provided by the embodiment of the present application, its application scenario is first introduced below. The electronic device described in the present application can be specifically a mobile phone, a tablet computer, an electronic paper book, etc. The electronic device can have multiple functions, such as communication, entertainment, camera and other functions. In addition, with the development of technology, the functions of electronic devices are also being continuously optimized to meet the higher requirements of consumers. There are various electronic devices arranged inside the electronic device, such as chips, batteries and sensors, etc. These electronic devices can ensure that the electronic device realizes the corresponding functions under normal working conditions and enable users to obtain a good user experience. One factor affecting the normal operation of electronic devices is the overheating problem of electronic devices. When the electronic device generates more heat and the heat dissipation efficiency is low, the heat cannot be exported in time, so that the temperature of the electronic device is high, and the performance and service life of the electronic device will be reduced, thereby affecting the normal operation of the electronic device. To this end, the present application provides an electronic device, which includes a heat dissipation housing and a fan arranged in the heat dissipation housing, which can solve the heat dissipation problem of some electronic devices in the electronic device. The following is an example of the electronic device in the technical solution of the present application, which is described in conjunction with the accompanying drawings.

[0045] Figure 1 The overall structure diagram of an electronic device provided in an embodiment of the present application is as follows: Figure 1 As shown, in one embodiment, the electronic device includes a device housing 1 and a heat dissipation housing 2. Among them, the device housing 1 is a housing structure with a containing space, and the device housing 1 can accommodate some electronic devices provided to realize various functions of the electronic device. The heat dissipation housing 2 is arranged in the device housing 1. In an optional embodiment, from the appearance, the surface of the heat dissipation housing 2 can be flush with the surface of the device housing 1, or it can protrude from the surface of the device housing 1. During the preparation process, the heat dissipation housing 2 and the device housing 1 can be prepared by an integral molding process. Specifically, the above-mentioned integral molding process includes but is not limited to a stamping process, an injection molding process, etc. Alternatively, in other embodiments, the heat dissipation housing 2 and the device housing 1 can also be prepared separately and connected by a connecting structure. For example, the heat dissipation housing 2 and the device housing 1 can be bonded by an adhesive layer; for another example, the heat dissipation housing 2 and the device housing 1 can also be fixed by fasteners or snap-on structures.

[0046] The position of the heat dissipation housing 2 is not limited. In order to allow the heat dissipation housing 2 to have a larger installation space, the heat dissipation housing 2 can be arranged on the side of the device housing 1 with a larger area during layout. In a specific embodiment, the electronic device includes a display screen, and the display screen is located on the surface of the device housing 1. When the heat dissipation housing 2 is specifically arranged, the heat dissipation housing 2 can be arranged on the side of the device housing 1 away from the display screen.

[0047] Please continue to refer to Figure 1 In one embodiment, the heat dissipation housing 2 protrudes from the surface of the device housing 1, and the orthographic projection of the outer peripheral contour of the heat dissipation housing 2 on the surface of the device housing 1 is a circle. Figure 2 The overall structure diagram of another electronic device provided in the embodiment of the present application is as follows: Figure 2 As shown, in another embodiment, the heat dissipation housing 2 also protrudes from the surface of the device housing 1, and the orthographic projection of the outer contour of the heat dissipation housing 2 on the surface of the device housing 1 is a rectangle. In other embodiments, in addition to the above shapes, the orthographic projection of the outer contour of the heat dissipation housing 2 on the surface of the design housing 1 can also be other shapes, which are not listed one by one in this application.

[0048] Figure 3 An AA cross-sectional view of an electronic device provided in an embodiment of the present application is shown in FIG. Figure 3 As shown, in one embodiment, the electronic device further includes a heating device 6, and the heating device 6 is disposed in the device housing 1. The heating device 6 refers to a type of electronic device that generates a lot of heat during the operation of the electronic device. If the heat generated by the heating device 6 is not removed in time, the normal operation of the heating device 6 may be affected, thereby causing the electronic device to malfunction. Specifically, the heating device 6 includes but is not limited to a chip or a battery.

[0049] Please continue to refer to Figure 3In the above embodiment, the heat dissipation housing 2 has an air duct 201 inside, and the air duct 201 has an air inlet 202 and an air outlet 203. In addition, the above electronic device further includes a fan 3, which is arranged in the heat dissipation housing 2, and the fan 3 is arranged toward the air duct 201. When the fan 3 is specifically installed, the fan 3 can be installed at both ends of the air duct 201, or the fan 3 can be installed in the air duct 201 and located between the two ends of the air duct 201. Driven by the fan 3, the airflow can enter the heat dissipation housing 2 from the air inlet 202, flow along the air duct 201 inside the heat dissipation housing 2, and finally flow out of the heat dissipation housing 2 from the air outlet 203. The above air duct 201 is thermally connected to the heating device 6 in the device housing 1. When airflow passes through the air duct 201, the airflow can exchange heat with the heating device 6, so that the temperature of the heating device 6 is reduced, thereby achieving the effect of heat dissipation for the heating device 6. In addition, since the air inlet 202 , the air outlet 203 and the air duct 201 are all arranged on the heat dissipation housing 2 , the flow path of the airflow is relatively short, thereby reducing wind resistance, accelerating the circulation of the airflow, and improving the heat dissipation effect of the heating device 6 .

[0050] In order to transfer the heat generated by the heating device 6 to the air duct 201, the heating device 6 has a variety of possible arrangements. In one possible arrangement, a portion of the heating device 6 may be arranged in the air duct 201, so that the airflow can flow over the surface of the heating device 6 in the process of passing through the air duct 201, and then directly exchange heat with the heating device 6. In another possible arrangement, the heating device 6 may also be arranged outside the air duct 201, and the heating device 6 and the outer wall of the air duct 201 are thermally connected, so that the airflow can indirectly exchange heat with the heating device 6 through the wall of the air duct 201 in the process of passing through the air duct 201. In yet another possible arrangement, Figure 3 As shown, the electronic device may further include a heat-conducting component 4, and the heat-conducting component 4 is connected to the heating device 6 by heat conduction, so that the heat generated by the heating device 6 can be conducted to the heat-conducting component 4. In order to allow the heat-conducting component 4 to transfer heat to the airflow in the air duct 201, at least part of the heat-conducting component 4 may be located in the air duct 201, or at least part of the heat-conducting component 4 may also be connected to the outer wall of the air duct 201 by heat conduction. Under the above arrangement, the heat generated by the heating device 6 may be conducted to the air duct 201 by the heat-conducting component 4, and then dissipated to the external environment by the airflow. In a specific embodiment, the heat-conducting component 4 may be understood as a radiator connected to the heating device 6 by heat conduction. The arrangement of the heat-conducting component 4 may make the installation position of the heating device 6 more flexible, for example, the heating device 6 may be installed at a position close to the air duct 201, or may be installed at a position far away from the air duct 201.

[0051] In a specific embodiment, the structure of the heat-conducting component 4 has multiple options. For example, in one possible structure, the heat-conducting component 4 includes a substrate 41 and a plurality of heat-dissipating fins 42 disposed on the surface of the substrate 41. The substrate 41 is thermally connected to the heating device 6, and at least part of the heat-dissipating fins 42 is located in the air duct 201. The heat-dissipating fins 42 have a large heat exchange area. When the airflow flows through the air duct 201, the airflow can exchange heat with the heat-dissipating fins 42, so that the temperature of the heating device 6 is reduced. In another possible structure, such as Figure 3 As shown, the heat conducting component 4 includes a substrate 41, a heat dissipation fin 42 and a heat pipe 43, one end of the heat pipe 43 is connected to the heating device 6, and the other end is connected to the substrate 41. The heat dissipation fin 42 is arranged on the surface of the substrate 41, and at least part of the heat dissipation fin 42 is located in the air duct 201. The heat pipe 43 can conduct the heat generated by the heating device 6 to the heat dissipation fin 42, and the heat dissipation fin 42 exchanges heat with the airflow to achieve the purpose of heat dissipation for the heating device 6. The above-mentioned heat pipe 43 is generally composed of a tube shell, a porous capillary core and a working medium. The end of the heat pipe 43 connected to the heating device 6 is the evaporation end, and the end connected to the substrate 41 is the condensation end. When the evaporation end is heated, the liquid working medium in the porous capillary core evaporates rapidly to become a gaseous state, and the gaseous working medium flows to the condensation end under a small pressure difference, and recondenses into a liquid state after releasing heat at the condensation end. The liquid working medium flows back to the evaporation end under the action of capillary force, completing a cycle. During the reciprocating circulation of the working medium between the evaporation end and the condensation end, the heat generated by the heating device 6 is continuously transferred to the substrate 41 , and the substrate 41 then transfers the heat to the airflow through the heat dissipation fins 42 , thereby achieving the effect of heat dissipation for the heating device 6 .

[0052] Of course, the heat conducting component 4 may also have other structures, which are not listed one by one in this application.

[0053] Figure 4 The AA cross-sectional view of another electronic device provided in an embodiment of the present application is as follows: Figure 4 As shown, in another embodiment, the heat dissipation housing 2 protrudes from the surface of the device housing 1, and the heat dissipation housing 2 is provided with a transparent window 204, which allows light to pass through. A transparent film can be provided at the transparent window 204 to prevent external dust and water vapor from entering the interior of the electronic device. In addition, the above-mentioned electronic device also includes a camera module 7, the camera module 7 has a light incident surface 701, and at least part of the projection of the light incident surface 701 along the third direction Z is located within the projection of the transparent window 204 along the third direction Z. The above-mentioned third direction Z is perpendicular to the plane where the transparent window 204 is located. During the operation of the camera module 7, light in the external environment can be incident on the light incident surface 701 through the transparent window 204, and enter the interior of the camera module 7 from the light incident surface 701, and form an image after image processing.

[0054] Continue to refer Figure 2 The heat dissipation housing 2 includes a side wall 21 and a top wall 22, wherein the side wall 21 and the top wall 22 are connected, and the side wall 21 is also connected to the device housing 1. The transparent window 204 can be specifically arranged on the top wall 22 of the heat dissipation housing 2, and the third direction Z is specifically the thickness direction of the electronic device. In addition, the side wall 21 and the top wall 22 can also enclose a receiving cavity, which can be used to receive the fan 3, and can also be used to form the air duct 201, so that the fan 3 and the air duct 201 and other components do not occupy the internal space of the device housing 1, or the fan 3 and the air duct 201 and other components only occupy a small space of the device housing 1, which is conducive to achieving the design requirements of the device housing 1 to be thin. At the same time, when installing the camera module 7, at least part of the camera module 7 can also be accommodated in the above-mentioned receiving cavity, so that the camera module 7 has a larger installation space, and it is also possible to use a camera module 7 with better performance and more complex structure, so as to improve the shooting quality of the electronic device.

[0055] It is understandable that when the specific layout is carried out, the air duct 201 can avoid the above-mentioned camera module 7, and the airflow in the air duct 201 can be isolated from the camera module 7 to prevent water vapor and the like from diffusing into the interior of the camera module 7 and affecting the normal operation of the camera module 7.

[0056] When the air inlet 202 and the air outlet 203 are arranged on the wall surface of the heat dissipation housing 2, there are multiple possible arrangements. In one possible arrangement, the air inlet 202 and the air outlet 203 can be arranged on the side wall 21. By arranging the air inlet 202 and the air outlet 203 on the side wall 21, on the one hand, it is helpful to reduce wind resistance and make the air flow path smoother; on the other hand, it can make full use of the area of ​​the side wall 21 of the heat dissipation housing 2 and improve the overall appearance. In another possible arrangement, one of the air inlet 202 and the air outlet 203 can be arranged on the side wall 21, and the other can be arranged on the top wall 22. For example, the air inlet 202 can be arranged on the top wall 22, and the air outlet 203 can be arranged on the side wall 21. In another possible arrangement, the air inlet 202 and the air outlet 203 can also be arranged on the top wall 22.

[0057] Specifically, when forming the air duct 201 in the heat dissipation housing 2, a plurality of partitions may be provided in the heat dissipation housing 2, and the partitions may be used to enclose the air duct 201. Alternatively, a ventilation duct may be provided in the heat dissipation housing 2, and the air duct 201 may be formed by the ventilation duct. The air duct 201 may guide the airflow to flow along a set path, thereby improving the heat dissipation effect of the heating element 6. Furthermore, the air duct 201 may be isolated from the internal environment of the device housing 1, thereby improving the dustproof and waterproof performance of the device housing 1.

[0058] The number of air ducts 201 is not limited, and can be one or more. For any air duct 201, the number of air inlets 202 of the air duct 201 can be one or more, which is not limited in this application. Similarly, the number of air outlets 203 of the air duct 201 can be one or more, which is not limited in this application. It can be understood that the above-mentioned air duct 201 can have both an air inlet 202 or an air outlet 203 with a larger opening, and can also have multiple air inlets 202 with smaller openings or multiple air outlets 203 with smaller openings. When the above-mentioned air duct 201 has multiple air inlets 202 with smaller openings or multiple air outlets 203 with smaller openings, two adjacent air inlets 202 are spaced apart, and two adjacent air outlets 203 are spaced apart.

[0059] Figure 5 A schematic diagram of the layout of the air duct provided in the embodiment of the present application is shown as follows: Figure 5 As shown, in one embodiment, the heat dissipation housing 2 has an air duct 201 , and an air inlet 202 and an air outlet 203 of the air duct 201 are arranged on two opposite sides of the heat dissipation housing 2 .

[0060] Figure 6 Another schematic diagram of the layout of the air duct provided in the embodiment of the present application is as follows: Figure 6 As shown, in one embodiment, the heat dissipation housing 2 has a plurality of air ducts 201, and each air duct 201 is provided with at least one fan 3. During the use of the electronic device, the fans 3 in the plurality of air ducts 201 can all be turned on, so that air flows through each air duct 201. The fans 3 in some of the air ducts 201 can also be selectively turned on, and the fans 3 in some of the air ducts 201 can be turned off. Alternatively, the fans 3 in the plurality of air ducts 201 can all be turned off. The opening and closing of the fan 3 can be specifically configured according to the heat generation of the heating device 6, so that the heat dissipation capacity of the heat dissipation housing 2 matches the heat generation of the heating device 6.

[0061] Among the multiple air ducts 201 included in the heat dissipation housing 2, the extension path of each air duct 201 is different, and the air inlets 202 of different air ducts 201 can be the same or different. Similarly, the air outlets 203 of different air ducts 201 can be the same or different. For the convenience of description, any two air ducts 201 among the multiple air ducts 201 are represented by the first air duct and the second air duct. In a possible setting, the first air duct and the second air duct have the same air inlet 202, and the first air duct and the second air duct have different air outlets 203. The above setting can also be understood as that the air inlet 202 of the first air duct and the air inlet 202 of the second air duct are arranged at the same position of the heat dissipation housing 2, and overlap; the air outlet 203 of the first air duct and the air outlet 203 of the second air duct are arranged at different positions of the heat dissipation housing 2. During the heat dissipation process, driven by the fan 3, the airflow in the external environment can enter the heat dissipation shell 2 through the same air inlet 202, and then be divided into two streams, one airflow enters the first air duct, and the other airflow enters the second air duct. The two airflows flow along different paths and finally flow out of the heat dissipation shell 2 through different air outlets 203.

[0062] In another possible arrangement, the first air duct and the second air duct have different air inlets 202, and the first air duct and the second air duct have the same air outlet 203. The above arrangement can also be understood as that the air inlet 202 of the first air duct and the air inlet 202 of the second air duct are arranged at different positions of the heat dissipation housing 2, and the air outlet 203 of the first air duct and the air outlet 203 of the second air duct are arranged at the same position of the heat dissipation housing 2, and overlap. During the heat dissipation process, driven by the fan 3, two air flows in the external environment enter the heat dissipation housing 2 from different air inlets 202, and then flow along the first air duct and the second air duct respectively, and finally, the above two air flows flow out of the heat dissipation housing 2 through the same air outlet 203.

[0063] In another possible arrangement, the first air duct and the second air duct have different air inlets 202, and the first air duct and the second air duct also have different air outlets 203. The above arrangement can also be understood as that the air inlet 202 of the first air duct and the air inlet 202 of the second air duct are arranged at different positions of the heat dissipation housing 2, and the air outlet 203 of the first air duct and the air outlet 203 of the second air duct are also arranged at different positions of the heat dissipation housing 2. During the heat dissipation process, driven by the fan 3, two air flows in the external environment enter the heat dissipation housing 2 from different air inlets 202, and then flow along the first air duct and the second air duct respectively, and finally, the above two air flows flow out of the heat dissipation housing 2 through different air outlets 203.

[0064] During specific configuration, the air inlet 202 , the air outlet 203 and the extension path of the air duct 201 may be arranged according to the overall structure distribution of the electronic device.

[0065] It is understandable that in the scenario of heat dissipation of the heating device 6, the air inlet 202 and the air outlet 203 are both in a ventilation state, so that under the drive of the fan 3, the air flow can pass through the heat dissipation housing 2, and then exchange heat with the heating device 6 to form air-cooled heat dissipation. In other scenarios, the heat generation of the heating device 6 is less, and the heat can be dissipated to the external environment through the device housing 1, without opening the air inlet 202 and the air outlet 203 for air-cooled heat dissipation. In the above scenarios, in order to ensure the dustproof and waterproof performance of the electronic equipment, the air inlet 202 and the air outlet 203 can be blocked to prevent dust, water vapor, etc. from entering the interior of the electronic equipment.

[0066] Figure 7 A schematic diagram of a combination of a blocking member and a heat dissipation housing provided in an embodiment of the present application is shown in FIG. Figure 7 As shown, in one embodiment, the electronic device further includes a blocking member 5, and the blocking member 5 is movably connected to the heat dissipation housing 2. The blocking member 5 and the heat dissipation housing 2 can move relative to each other, so that the relative positions of the blocking member 5 and the heat dissipation housing 2 change, and the air inlet 202 and the air outlet 203 are in a ventilation state or a blocking state. When the air inlet 202 and the air outlet 203 are in a ventilation state, the airflow in the external environment can enter the air duct 201 through the air inlet 202, and can flow out of the air duct 201 through the air outlet 203. When the air inlet 202 and the air outlet 203 are in a blocking state, the airflow in the external environment cannot enter the air duct 201 through the air inlet 202, and the airflow in the air duct 201 cannot flow out through the air outlet 203.

[0067] In specific implementation, the blocking member 5 is movably connected to the heat dissipation housing 2, and the blocking member 5 and the heat dissipation housing 2 have a first position relationship and a second position relationship. When the blocking member 5 and the heat dissipation housing 2 are in the first position relationship, the blocking member 5 can avoid at least part of the air inlet 202 and at least part of the air outlet 203, so that the air inlet 202 and the air outlet 203 are in a ventilation state. That is to say, when the blocking member 5 and the heat dissipation housing 2 are in the first position relationship, at least part of the air inlet 202 is not blocked by the blocking member 5, so that the air duct 201 and the external environment can be connected; at least part of the air outlet 203 is not blocked by the blocking member 5, so that the air duct 201 and the external environment can be connected. When the blocking member 5 and the heat dissipation housing 2 are in the second position relationship, the blocking member 5 can completely block the air inlet 202 and the air outlet 203, so that the air inlet 202 and the air outlet 203 are in a blocked state. In the process of using the electronic device, the positional relationship between the blocking member 5 and the heat dissipation housing 2 can be adjusted according to the specific application scenario, so that the air inlet 202 and the air outlet 203 can be switched between the ventilation state and the blocking state. For example, in a scenario where the heating device 6 generates more heat, the blocking member 5 and the heat dissipation housing 2 can be adjusted to the first positional relationship, so that the air inlet 202 and the air outlet 203 are in the ventilation state, thereby performing air cooling and heat dissipation for the heating device 6. In a scenario where the heating device 6 generates less heat, the blocking member 5 and the heat dissipation housing 2 can be adjusted to the second positional relationship, so that the air inlet 202 and the air outlet 203 are in the blocking state, thereby improving the dustproof and waterproof performance of the electronic device.

[0068] When specifically setting the connection relationship between the blocking member 5 and the heat dissipation housing 2, the blocking member 5 and the heat dissipation housing 2 can be connected by sliding, or by rotation, or by other active connection, which is not limited in this application. When specifically setting the driving form of the blocking member 5 and the heat dissipation housing 2, the blocking member 5 and the heat dissipation housing 2 can be set to be manually driven, that is, a force can be applied to the blocking member 5 or the heat dissipation housing 2 manually to make the blocking member 5 and the heat dissipation housing 2 move relative to each other. A driving component can also be set to connect the driving component to the blocking member 5, or to connect the driving component to the heat dissipation housing 2, so that the blocking member 5 and the heat dissipation housing 2 move relative to each other under the drive of the above-mentioned driving component.

[0069] As for the blocking member 5, the blocking member 5 includes a variety of possible structures, for example, the blocking member 5 can be a strip structure or a ring structure. Of course, the blocking member 5 can also be other structures, which are not listed one by one in this application.

[0070] like Figure 7As shown, in one embodiment, the heat dissipation housing 2 has a plurality of air inlets 202, and the plurality of air inlets 202 are arranged at intervals along the first direction OM. The blocking member 5 includes a first blocking member 51, which is movably connected to the heat dissipation housing 2, and is used to avoid the plurality of air inlets 202 or block the plurality of air inlets 202. When the first blocking member 51 is specifically set, the first blocking member 51 includes a variety of possible structures. In one possible structure, the first blocking member 51 also extends along the first direction OM, and the first blocking member 51 has a plurality of first vents 501 along the first direction OM, and a first spacing portion 511 is provided between two adjacent first vents 501. The first blocking member 51 can be specifically a first strip structure, and the extension direction of the first strip structure is the same as the arrangement direction of the air inlets 202, both of which are the first direction OM, and the first strip structure also has first vents 501 and first spacing portions 511 alternately arranged in sequence along the first direction OM.

[0071] When the ventilation state and the blocking state of the air inlet 202 are switched, the first blocking member 51 and the heat dissipation housing 2 can be connected by sliding along the first direction OM, so that the first blocking member 51 and the heat dissipation housing 2 can slide relative to each other along the first direction OM. During the sliding process, the positional relationship between the first blocking member 51 and the heat dissipation housing 2 will change, and the first vent 501 and the air inlet 202 may have overlapping areas or may not have overlapping areas. Specifically, when the blocking member 5 and the heat dissipation housing 2 have the first positional relationship, the first vent 501 and the air inlet 202 at least partially overlap. At this time, driven by the fan 3, the airflow in the external environment can pass through the overlapping part of the first vent 501 and the air inlet 202 to enter the interior of the heat dissipation housing 2, so that the air inlet 202 is in the ventilation state. When the blocking member 5 and the heat dissipation housing 2 have the second positional relationship, the first vent 501 and the air inlet 202 are completely staggered, and at this time, the first spacer 511 blocks the air inlet 202. The first spacer 511 isolates the internal environment of the heat dissipation housing 2 from the external environment, so that the air inlet 202 is in a blocked state.

[0072] Please continue to refer to Figure 7 In the above embodiment, the heat dissipation housing 2 also has a plurality of air outlets 203, and the plurality of air outlets 203 are arranged at intervals along the second direction ON. The blocking member 5 includes the first blocking member 51 and a second blocking member 52. The function of the second blocking member 52 is similar to that of the first blocking member 51. Specifically, the second blocking member 52 is used to avoid the plurality of air outlets 203 of the heat dissipation housing 2 or to block the plurality of air outlets 203 of the heat dissipation housing 2.

[0073] When the second blocking member 52 is specifically arranged, the second blocking member 52 includes a variety of possible structures. In one possible structure, the second blocking member 52 extends along the second direction ON, and the second blocking member 52 has a plurality of second vents 502 along the second direction ON, and a second spacer 512 is provided between two adjacent second vents 502. The second blocking member 52 may specifically be a second strip structure, the extension direction of the second strip structure is the same as the arrangement direction of the air outlet 203, both of which are the second direction ON, and the second strip structure also has second vents 502 and second spacers 512 alternately arranged in sequence along the second direction ON.

[0074] When the ventilation state and the blocking state of the air outlet 203 are switched, the second blocking member 52 and the heat dissipation housing 2 can be connected by sliding along the second direction ON, so that the second blocking member 52 and the heat dissipation housing 2 can slide relative to each other along the second direction ON. During the sliding process, the positional relationship between the second blocking member 52 and the heat dissipation housing 2 will change, and the second vent 502 and the air outlet 203 may have overlapping areas or may not have overlapping areas. Specifically, when the blocking member 5 and the heat dissipation housing 2 have a first positional relationship, the second vent 502 and the air outlet 203 at least partially overlap, so that the air outlet 203 is in a ventilation state. When the blocking member 5 and the heat dissipation housing 2 have a second positional relationship, the second vent 502 and the air outlet 203 are completely staggered. At this time, the second spacer 512 blocks the air outlet 203, so that the air outlet 203 is in a blocked state.

[0075] The first direction OM and the second direction ON may be the same direction or different directions. Figure 6 In the illustrated embodiment, the first direction OM and the second direction ON are the same direction. The heat dissipation housing 2 is a rectangular structure, and the air inlet 202 and the air outlet 203 are arranged on opposite sides of the heat dissipation housing 2. Driven by the fan 3, the airflow can flow in opposite directions and penetrate the heat dissipation housing 2, which is beneficial to reduce wind resistance and shorten the flow path of the airflow.

[0076] In the above-mentioned blocking member 5, the first blocking member 51 and the second blocking member 52 can be independent of each other, or they can be connected as a whole through a connecting member, so as to achieve synchronous movement. By setting a connecting member to connect the first blocking member 51 and the second blocking member 52 as a whole, the air inlet 202 and the air outlet 203 can be switched to the ventilation state synchronously, or the air inlet 202 and the air outlet 203 can be switched to the blocking state synchronously, so that the states of the air inlet 202 and the air outlet 203 are consistent. In a specific implementation, the above-mentioned first blocking member 51 and the second blocking member 52 can share a set of drive components, thereby reducing the number of drive components set, improving control accuracy, and saving occupied space.

[0077] It is worth noting that in the above embodiment, the heat dissipation housing 2 may have one air duct 201 or multiple air ducts 201. When the heat dissipation housing 2 has one air duct 201, one end of the air duct 201 has multiple air inlets 202, and the multiple air inlets 202 are arranged at intervals along the first direction OM. The other end of the air duct 201 has multiple air outlets 203, and the multiple air outlets 203 are arranged at intervals along the second direction ON. The first blocking member 51 can block or avoid the air inlet 202 of the above air duct 201, and the second blocking member 52 can block or avoid the air outlet 203 of the above air duct 201. When the heat dissipation housing 2 has multiple air ducts 201, each air duct 201 may have one or more air inlets 202, and may have one or more air outlets 203, and the air inlets 202 of the above multiple air ducts 201 are arranged at intervals along the first direction OM, and the air outlets 203 of the above multiple air ducts 201 are arranged at intervals along the second direction ON. The first blocking member 51 can block or avoid the air inlets 202 of the above-mentioned multiple air ducts 201 at the same time, and the second blocking member 52 can block or avoid the air outlets 203 of the above-mentioned multiple air ducts 201 at the same time.

[0078] Figure 8 Another schematic diagram of the combination of the blocking member and the heat dissipation housing provided in the embodiment of the present application is shown in FIG. Figure 8 As shown, in one embodiment, the heat dissipation housing 2 has a first central axis, and the air inlet 202 and the air outlet 203 are arranged circumferentially around the first central axis. Specifically, the heat dissipation housing 2 includes a side wall 21 and a top wall 22, and the air inlet 202 and the air outlet 203 are located on the side wall 21. The blocking member 5 is an annular structure, and the annular structure is arranged around the first central axis. The annular structure has a plurality of vents, and the plurality of vents are arranged in sequence along the circumferential direction, and there is a spacer between two adjacent vents.

[0079] When switching the ventilation state and the blocking state of the air inlet 202, the blocking member 5 and the heat dissipation housing 2 can be connected by rotation, so that the blocking member 5 and the heat dissipation housing 2 can rotate relative to each other around the first central axis. During the relative rotation of the blocking member 5 and the heat dissipation housing 2 around the first central axis, the positional relationship between the blocking member 5 and the heat dissipation housing 2 will change, and the overlap between the above-mentioned vent and the air inlet 202 and the overlap between the vent and the air outlet 203 will also change. Please continue to refer to Figure 8In the embodiment shown, the plurality of vents include a third vent 503 and a fourth vent 504, and the partition includes a third partition 513 and a fourth partition 514. When the blocking member 5 and the heat dissipation housing 2 are in a first positional relationship, the third vent 503 and the air inlet 202 at least partially overlap, so that the air inlet 202 is in a ventilation state. In addition, the fourth vent 504 and the air outlet 203 at least partially overlap, so that the air outlet 203 is in a ventilation state. When the blocking member 5 and the heat dissipation housing 2 are in a second positional relationship, the third vent 503 and the air inlet 202 are completely staggered, at which time, the third partition 513 blocks the air inlet 202, so that the air inlet 202 is in a blocked state. In addition, the fourth vent 504 and the air outlet 203 are completely staggered, at which time, the fourth partition 514 blocks the air outlet 203, so that the air outlet 203 is in a blocked state.

[0080] During the relative rotation of the blocking member 5 and the heat dissipation housing 2, any one of the vents may at least partially overlap with the air inlet 202 at a certain moment, and may also at least partially overlap with the air outlet 203. Therefore, the third vent 503 and the fourth vent 504 refer to two different vents in general, and are not specified as two specific vents. Similarly, any one of the partitions may be used to block the air inlet 202 at a certain moment, and may also be used to block the air outlet 203. Therefore, the third partition 513 and the fourth partition 514 refer to two different partitions in general, and are not specified as two specific partitions.

[0081] Fig. 9 Another schematic diagram of the combination of the blocking member and the heat dissipation housing provided in the embodiment of the present application is shown in FIG. Fig. 9 As shown, in one embodiment, the structure of the heat dissipation housing 2 and Figure 8 The structures of the heat dissipation housing 2 shown are basically the same, both of which have a first central axis OP, and the air inlet 202 and the air outlet 203 are arranged circumferentially around the first central axis OP, and the air inlet 202 and the air outlet 203 can be specifically located on the side wall 21 of the heat dissipation housing 2. Figure 8 The structures of the blocking member 5 shown are similar and different. The similarity is that both are annular structures, and the annular structures are arranged around the first central axis OP. The difference is that: Fig. 9In the illustrated embodiment, the annular structure does not have a vent. Based on the difference in structure, the annular structure and the heat dissipation housing 2 can be slidably connected along the first central axis OP. In other words, the relative movement of the annular structure and the heat dissipation housing 2 is a lifting movement along the first central axis OP, so that when the blocking member 5 and the heat dissipation housing 2 have a first positional relationship, the annular structure can avoid the air inlet 202 and the air outlet 203; when the blocking member 5 and the heat dissipation housing 2 have a second positional relationship, the annular structure can block the air inlet 202 and the air outlet 203.

[0082] In the above embodiments, the blocking member 5 can be relatively displaced against the surface of the heat dissipation housing 2, and avoid or block the air inlet 202 and the air outlet 203. Of course, in addition to the above connection method, the blocking member 5 and the heat dissipation housing 2 can also have other connection methods, which are not listed one by one in this application.

[0083] In a specific structure of the heat dissipation housing 2, the heat dissipation housing 2 protrudes from the surface of the device housing 1, and the heat dissipation housing 2 has a receiving cavity on the side facing the device housing 1. The blocking member 5 can be located in the receiving cavity or outside the receiving cavity. In some embodiments, the blocking member 5 can be arranged in the receiving cavity to avoid the blocking member 5 being exposed to the external environment, which is conducive to ensuring the cleanliness of the connection between the blocking member 5 and the heat dissipation housing 2, so that the relative movement between the blocking member 5 and the heat dissipation housing 2 is smoother. In addition, by arranging the blocking member 5 in the heat dissipation housing 2, the appearance of the electronic device can also be improved.

[0084] In the above embodiment, in order to drive the blocking member 5 and the heat dissipation housing 2 to move relative to each other, the electronic device may further include a driving component, which is connected to the blocking member 5. The driving component is used to drive the blocking member 5 to move, so that the blocking member 5 avoids the air inlet 202 and the air outlet 203, or blocks the air inlet 202 and the air outlet 203. In a specific embodiment, the driving component includes a motor, and the motor can provide a driving force to drive the blocking member 5 and the heat dissipation housing 2 to move relative to each other. The type of motor is not limited, and the motor can be a linear motor, which can drive the blocking member 5 to move linearly relative to the heat dissipation housing 2. The motor can also be a rotary motor, and a transmission member can be provided between the rotary motor and the blocking member 5. In one embodiment, the transmission member can transmit the torque of the motor to the blocking member 5, so that the blocking member 5 can rotate relative to the heat dissipation housing 2. In another embodiment, the transmission member can also convert the torque of the motor into thrust or tension, so that the blocking member 5 can move linearly relative to the heat dissipation housing 2.

[0085] In some embodiments, the electronic device may further include a controller, and the controller is connected to the drive assembly and the fan 3. In some scenarios where the heat generating device 6 needs to be cooled by air, the controller may be used to control the drive assembly to drive the blocking member 5 and the heat dissipation housing 2 to move relative to each other, so that the blocking member 5 and the heat dissipation housing 2 are in a first position relationship, and the air inlet 202 and the air outlet 203 are in a ventilation state accordingly. In addition, in the above scenario, the controller may also be used to control the start of the fan 3 to provide power for the flow of air. Conversely, when the heat generating device 6 does not need to be cooled by air, the controller may be used to control the drive assembly to drive the blocking member 5 and the heat dissipation housing 2 to move relative to each other, so that the blocking member 5 and the heat dissipation housing 2 are in a second position relationship, and the air inlet 202 and the air outlet 203 are in a blocked state accordingly. In addition, the controller may also be used to control the fan 3 to shut down.

[0086] Specifically, different trigger conditions can be set to trigger the controller, so that the controller controls the drive assembly and the fan 3 in the above manner. For example, in a possible triggering mode, the electronic device also includes an operating unit, and the operating unit is connected to the above controller. The operating unit has a first trigger state and a second trigger state. When the heating device 6 needs to be cooled by air, the operating unit can be placed in the first trigger state. When the heating device 6 does not need to be cooled by air, the operating unit can be placed in the second trigger state. The controller is used to control the drive assembly to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other when the operating unit is in the first trigger state, so that the heat dissipation housing 2 and the blocking member 5 are in a first position relationship, and start the fan 3. At this time, the air inlet 202 and the air outlet 203 of the heat dissipation housing 2 are both in a ventilation state. Under the drive of the fan 3, the air flow can enter the heat dissipation housing 2 and cool the heating device 6. The controller is also used to control the drive assembly to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other when the operating unit is in the second trigger state, so that the heat dissipation housing 2 and the blocking member 5 are in a second position relationship, and the fan 3 is turned off. At this time, the air inlet 202 and the air outlet 203 of the heat dissipation housing 2 are both in a blocked state, which can prevent external water vapor, dust, etc. from entering the heat dissipation housing 2, achieving a waterproof and dustproof effect.

[0087] When the operating unit is specifically configured, the operating unit includes a variety of possible forms. For example, the operating unit may be a control button located on the housing frame, and the first trigger state and the second trigger state of the operating unit may be switched by pressing the control bar. For another example, the operating unit may also be a control window located on the touch screen of the electronic device, and the first trigger state and the second trigger state of the operating unit may be switched by clicking the control window.

[0088] For another example, in another possible triggering mode, the electronic device further includes a detection component, which is connected to the above-mentioned controller. Specifically, the above-mentioned detection component is used to detect a first operating index of the heating device 6. The first operating index includes but is not limited to a power consumption index or a temperature index of the heating device 6. The controller is used to control the drive component to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other when the first operating index is greater than the first threshold value, so that the heat dissipation housing 2 and the blocking member 5 are in a first position relationship, and start the fan 3. At this time, the air inlet 202 and the air outlet 203 of the heat dissipation housing 2 are both in a ventilation state. Driven by the fan 3, the air flow can enter the heat dissipation housing 2 and cool the heating device 6. In addition, the controller is also used to control the drive component to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other when the first operating index is less than or equal to the first threshold value, so that the heat dissipation housing 2 and the blocking member 5 are in a second position relationship, and the fan 3 is turned off. At this time, the air inlet 202 and the air outlet 203 of the heat dissipation housing 2 are both in a blocked state, thereby preventing external water vapor, dust, etc. from entering the heat dissipation housing 2, achieving a waterproof and dustproof effect.

[0089] For another example, in other possible triggering modes, the heating device 6 may be a chip, and the chip is used to carry the operation of the first application. The first application includes but is not limited to applications such as three-dimensional modeling, games, or video editing. The first application has a running state and a stopped state. When the first application is in the running state, it will lead to an increase in chip power consumption, which will increase the heat generated by the chip and increase the temperature.

[0090] The controller is used to control the drive assembly to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other when the first application is in the above-mentioned running state, so that the heat dissipation housing 2 and the blocking member 5 are in a first position relationship, and the fan 3 is started. At this time, the air inlet 202 and the air outlet 203 of the heat dissipation housing 2 are both in a ventilation state. Driven by the fan 3, the air flow can enter the heat dissipation housing 2 and cool down the heating element 6. In addition, the controller is also used to control the drive assembly to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other when the first application is in a closed state, so that the heat dissipation housing 2 and the blocking member 5 are in a second position relationship, and the fan 3 is turned off.

[0091] During the use of the electronic device, when any one of the following conditions is met: "the operation unit is in the first trigger state", "the detection component detects that the first operating index is greater than the first threshold value", and "the first application is in the running state", the controller can control the drive component to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other, so that the heat dissipation housing 2 and the blocking member 5 are in the first position relationship, and the fan 3 is started, thereby cooling the heat generating device 6 with air. When the following conditions are met at the same time: "the operation unit is in the second trigger state", "the detection component detects that the first operating index is less than or equal to the first threshold value", and "the first application is in the closed state", the controller can control the drive component to drive the heat dissipation housing 2 and the blocking member 5 to move relative to each other, so that the heat dissipation housing 2 and the blocking member 5 are in the second position relationship, and the fan 3 is turned off, thereby stopping cooling the heat generating device 6 with air.

[0092] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An electronic device, characterized in that: Including equipment housing, heat dissipation housing, blocking parts, fans and heating components; The heat dissipation housing is arranged on the device housing, the heat dissipation housing has an air duct, and the air duct has an air inlet and an air outlet; the fan is arranged toward the air duct; The blocking member is movably connected to the heat dissipation housing, and the blocking member and the heat dissipation housing have a first positional relationship and a second positional relationship; When the blocking member and the heat dissipation housing are in the first position relationship, the blocking member avoids at least part of the air inlet and at least part of the air outlet; when the blocking member and the heat dissipation housing are in the second position relationship, the blocking member blocks the air inlet and the air outlet; The heating device is located in the device housing, and the heating device is thermally connected to the air duct.

2. The electronic device according to claim 1, wherein: The electronic device further comprises a heat-conducting component, the heat-conducting component is thermally connected to the heating device, and the heat-conducting component is at least partially located in the air duct.

3. The electronic device according to claim 1 or 2, characterized in that: The heat dissipation housing has a plurality of the air ducts, and each of the air ducts is provided with at least one fan; The plurality of air ducts include a first air duct and a second air duct, the first air duct and the second air duct have the same air inlet, and the first air duct and the second air duct have different air outlets; Alternatively, the first air duct and the second air duct have different air inlets, and the first air duct and the second air duct have the same air outlet; Alternatively, the first air duct and the second air duct have different air inlets, and the first air duct and the second air duct have different air outlets.

4. The electronic device according to any one of claims 1 to 3, characterized in that: A plurality of partitions are arranged in the heat dissipation housing, and the plurality of partitions surround the air duct, or a ventilation pipeline is arranged in the heat dissipation housing, and the ventilation pipeline forms the air duct.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The heat dissipation housing protrudes from the surface of the device housing, and a transparent window is provided on the wall surface of the heat dissipation housing; the electronic device further comprises a camera module, the camera module has a light incident surface, and at least a portion of the projection of the light incident surface along the third direction is located within the projection of the transparent window along the third direction; The third direction is perpendicular to the plane where the transparent window is located.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The heat dissipation housing protrudes from the surface of the device housing, the heat dissipation housing comprises a side wall and a top wall connected to each other, and the side wall is connected to the device housing; At least one of the air inlet and the air outlet is disposed on the side wall.

7. The electronic device according to any one of claims 1 to 6, characterized in that: There are multiple air inlets, and the multiple air inlets are arranged at intervals along the first direction; there are multiple air outlets, and the multiple air outlets are arranged at intervals along the second direction; The blocking member includes a first blocking member and a second blocking member, the first blocking member extends along the first direction, and the first blocking member has a plurality of first vents along the first direction, and a first spacing portion is provided between two adjacent first vents; The second blocking member extends along the second direction, and the second blocking member has a plurality of second vents along the second direction, and a second spacing portion is provided between two adjacent second vents; When the blocking member and the heat dissipation housing have the first positional relationship, the air inlet and the first vent at least partially overlap, and the air outlet and the second vent at least partially overlap; When the blocking member and the heat dissipation housing have the second positional relationship, the first partition blocks the air inlet, and the second partition blocks the air outlet.

8. The electronic device according to any one of claims 1 to 6, characterized in that: The heat dissipation housing has a first central axis, and the air inlet and the air outlet are arranged circumferentially around the first central axis; The blocking member is an annular structure, and the annular structure is arranged around the first central axis; the annular structure has a plurality of vents, and the plurality of vents are sequentially arranged at intervals along the circumferential direction, and a spacing portion is provided between two adjacent vents; The plurality of vents include a third vent and a fourth vent, and when the blocking member and the heat dissipation housing have the first positional relationship, the third vent and the air inlet at least partially overlap, and the fourth vent and the air outlet at least partially overlap; The partition includes a third partition and a fourth partition. When the blocking member and the heat dissipation housing have the second positional relationship, the third partition blocks the air inlet, and the fourth partition blocks the air outlet.

9. The electronic device according to any one of claims 1 to 6, characterized in that: The heat dissipation housing has a first central axis, and the air inlet and the air outlet are arranged circumferentially around the first central axis; the blocking member is an annular structure, the annular structure is arranged around the first central axis, and the annular structure and the heat dissipation housing are slidably connected along the first central axis; When the blocking member and the heat dissipation housing have the first positional relationship, the annular structure avoids the air inlet and the air outlet; When the blocking member and the heat dissipation housing have the second positional relationship, the annular structure blocks the air inlet and the air outlet.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The electronic device also includes a driving component, which is connected to the blocking member; the driving component is used to drive the blocking member to move, so that the blocking member avoids at least part of the air inlet and at least part of the air outlet, or causes the blocking member to block the air inlet and the air outlet.

11. The electronic device according to claim 10, characterized in that: The electronic device further comprises a controller and an operating unit, wherein the controller and the operating unit, the driving component and the fan are respectively connected; The operating part has a first trigger state, and the controller is used to control the driving assembly to drive the blocking member to move relative to the heat dissipation shell when the operating part is in the first trigger state, so that the heat dissipation shell and the blocking member are in the first position relationship, and start the fan.

12. The electronic device according to claim 10 or 11, characterized in that: The electronic device further comprises a controller and a detection component, wherein the controller is connected to the detection component, the drive component and the fan respectively; The detection component is used to detect a first operating indicator of the heating device; The controller is used for controlling the driving assembly to drive the blocking member to move relative to the heat dissipation shell when the first operating index is greater than a first threshold value, so that the heat dissipation shell and the blocking member are in the first position relationship, and starting the fan.

13. The electronic device according to any one of claims 10 to 12, characterized in that: The electronic device further includes a controller, and the controller is connected to the driving component and the fan respectively; the heating device is a chip, and the chip is used to carry the operation of the first application; The controller is used to control the driving assembly to drive the blocking member to move relative to the heat dissipation shell when the first application is in operation, so that the heat dissipation shell and the blocking member are in the first position relationship, and start the fan.

14. The electronic device according to any one of claims 10 to 13, characterized in that: The electronic device further comprises a controller, an operating unit and a detection component, and the controller is connected to the operating unit, the detection component, the driving component and the fan respectively; The operating part has a second trigger state; the detection component is used to detect a first operating indicator of the heating device; The heat generating device is a chip, and the chip is used to carry the operation of the first application program; The controller is used to control the driving component to drive the blocking member to move relative to the heat dissipation shell, so that the heat dissipation shell and the blocking member are in the second position relationship and turn off the fan when the operating part is in the second trigger state, the first operating index is less than or equal to the first threshold, and the first application is in a stopped state.

15. The electronic device according to any one of claims 1 to 14, characterized in that: The electronic device further comprises a display screen, which is arranged on the surface of the device housing; the heat dissipation housing is located on a side of the device housing away from the display screen.

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