Heat dissipation assembly, electronic equipment and manufacturing method of heat dissipation assembly

Abstract

The embodiment of the invention provides a heat dissipation assembly, electronic equipment and a manufacturing method of the heat dissipation assembly. The heat dissipation assembly comprises at least two heat dissipation pieces and a connecting piece, the at least two heat dissipation pieces are communicated to form a circulation channel, or the at least two heat dissipation pieces are respectively provided with a circulation channel, the connecting piece comprises a connecting part, the connecting piece is respectively connected with the at least two heat dissipation pieces through the connecting part, and the connecting piece comprises a flexible material; the connecting piece is configured to be at least partially overlapped with the orthographic projection of the hinge of the electronic equipment in the thickness direction. The connecting piece can be bent along with folding of the foldable electronic equipment or flattened along with unfolding of the foldable electronic equipment, so that the heat dissipation assembly can be arranged in at least two main bodies of the foldable electronic equipment, and the coverage area of the heat dissipation assembly is increased.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic equipment, and in particular to a heat dissipation component, electronic equipment, and a method for manufacturing the heat dissipation component. Background Art

[0002] Mobile phones and other electronic devices have become indispensable items in people's daily lives. During the use of electronic devices, components such as motherboards and battery capacitors are prone to heat up, affecting the performance of electronic devices.

[0003] In the related art, in order to reduce the temperature of electronic devices, an ultra-thin vapor chamber is arranged at the heat source of the electronic devices, and the electronic devices are cooled by evaporating the working medium in the vapor chamber. However, in foldable electronic devices, the vapor chamber cannot be folded and can only be arranged in a middle frame of the foldable device. The arrangement area of ​​the vapor chamber is small, and the heat dissipation effect on the foldable electronic devices is poor. Summary of the invention

[0004] In view of this, the present disclosure provides a heat dissipation component, an electronic device and a method for manufacturing the heat dissipation component, which have better heat dissipation effect.

[0005] Specifically, the following technical solutions are included:

[0006] In a first aspect, an embodiment of the present disclosure provides a heat dissipation assembly, comprising at least two heat dissipation members and a connection member;

[0007] The at least two heat sinks are connected to each other through the connecting member to form a circulation channel, or the at least two heat sinks are respectively provided with a circulation channel, and the connecting member includes a connecting portion, and the connecting member is respectively connected to the at least two heat sinks through the connecting portion;

[0008] The circulation channel is filled with a heat dissipation medium, the connecting member comprises a flexible material, and the connecting member is configured to at least partially overlap with the orthographic projection of the hinge of the electronic device along the thickness direction.

[0009] Optionally, the at least two heat dissipating elements are connected via the connecting element to form a circulation channel.

[0010] Optionally, the connecting member further includes a first shell, the first shell is a hollow structure, and the connecting parts are arranged at opposite ends of the first shell.

[0011] Optionally, the heat sink includes a second shell, the second shell is a hollow structure, and a connected and enclosed space is provided in the first shell and the second shell to form the circulation channel.

[0012] Optionally, the second shell is provided with a limiting portion, and the connecting portion is connected to the limiting portion of the second shell.

[0013] Optionally, the connecting portion surrounds the limiting portion;

[0014] Alternatively, the limiting portion surrounds the connecting portion.

[0015] Optionally, the heat dissipation assembly further includes a fastener, and the connecting portion and the limiting portion of the second shell are connected via the fastener.

[0016] Optionally, one of the connecting portion and the limiting portion is a protrusion, and the other of the connecting portion and the limiting portion is a slot, and the protrusion is located in the slot.

[0017] Optionally, the connecting member further includes a supporting portion, wherein the supporting portion is disposed in the hollow structure of the first shell and is connected to at least one inner wall of the first shell along a thickness direction.

[0018] Optionally, the connecting member further comprises: a liquid wick, wherein the liquid wick is located in the first shell and connected to at least one inner wall of the first shell along the thickness direction.

[0019] Optionally, the support portion and the liquid absorbent core are connected to the inner wall of the same side of the first shell, and one end of the support portion passes through the liquid absorbent core.

[0020] Optionally, at least a portion of at least one surface of the connecting member along the thickness direction has a texture structure.

[0021] Optionally, the texture structure comprises a plurality of protrusions, the plurality of protrusions extending along the rotation axis of the hinge; and / or,

[0022] The texture structure includes a plurality of recesses extending along a rotation axis of the hinge.

[0023] Optionally, the circulation channel includes an evaporation section and a condensation section.

[0024] Optionally, a reflux wick and a support portion are provided in the evaporation section, the support portion is connected to at least one inner wall of the evaporation section along the thickness direction, and the reflux wick is connected to one inner wall of the evaporation section along the thickness direction.

[0025] Optionally, a condensation wick and a support portion are provided in the condensation section, the support portion is connected to at least one inner wall of the condensation section along the thickness direction, and the condensation wick is connected to the inner walls of the condensation section on two opposite sides along the thickness direction.

[0026] Optionally, the circulation channel further includes a first connecting section, and two ends of the first connecting section are respectively connected to the air outlet end of the evaporation section and the air inlet end of the condensation section.

[0027] Optionally, a first guide absorbent core and a support portion are provided in the first connecting section, the support portion is connected to at least one inner wall of the first connecting section along the thickness direction, and the first guide absorbent core is connected to one inner wall of the first connecting section.

[0028] Optionally, the circulation channel further includes a second connecting section, and two ends of the second connecting section are respectively connected to the air inlet end of the evaporation section and the air outlet end of the condensation section.

[0029] Optionally, a second guide absorbent core and a support portion are provided in the second connecting segment, the support portion is connected to at least one inner wall of the second connecting segment along the thickness direction, and the second guide absorbent core is connected to inner walls on opposite sides of the second connecting segment.

[0030] Optionally, the circulation channel further includes a compensation section, wherein the compensation section is located between the second connecting section and the evaporation section, and a sealed liquid wick is disposed in the compensation section, and the sealed liquid wick fills the compensation section.

[0031] Optionally, the heat dissipation assembly further includes a baffle, which is located in the circulation channel and between the evaporation section and the condensation section.

[0032] Optionally, the barrier portion includes a Tesla valve; or the barrier portion is filled with a liquid wick.

[0033] In a second aspect, an embodiment of the present disclosure further provides an electronic device, comprising the heat dissipation assembly and the housing assembly described in the first aspect above;

[0034] The housing assembly includes at least two main bodies and a hinge, and two adjacent main bodies are movably connected to opposite sides of the hinge;

[0035] Two adjacent heat sinks are respectively covered on two adjacent main bodies, and the orthographic projections of the connecting member and the hinge along the thickness direction at least partially overlap.

[0036] Optionally, the electronic device further includes a screen assembly, a mainboard and a battery cover;

[0037] The screen assembly is covered on the at least two main bodies along the thickness direction, the battery cover is covered on the side of the housing assembly away from the screen assembly, and the main board is located between the at least two main bodies and the battery cover;

[0038] The heat dissipation component is disposed at at least one of the following locations:

[0039] The heat dissipation component is located between the screen component and the housing component;

[0040] The heat dissipation component is located between the mainboard and the housing component;

[0041] The heat dissipation component is arranged on the battery cover.

[0042] In a third aspect, an embodiment of the present disclosure further provides a method for manufacturing a heat dissipation assembly, the method being used to manufacture the heat dissipation assembly described in the first aspect, comprising:

[0043] Etching the substrate into a first sheet and a second sheet;

[0044] Welding the first sheet body and the second sheet body together to form at least two heat sinks with a hollow structure;

[0045] Connecting at least two of the heat sinks to the connecting parts of the connecting member respectively;

[0046] Inject heat dissipation medium into the circulation channel of the heat dissipation element.

[0047] The beneficial effects of the technical solution provided by the embodiments of the present disclosure include at least:

[0048] In the heat dissipation assembly provided by the embodiment of the present disclosure, two heat dissipators are used to form a circulation channel, and the circulation channel is filled with a heat dissipation medium, so that the electronic device can be circulated and cooled. The connecting member includes a flexible material, and the connecting member is respectively connected to the two heat dissipators through a connecting portion. The connecting member is configured to overlap at least partially with the orthographic projection of the hinge of the electronic device along the thickness direction. The connecting member can be bent as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation assembly can be set in at least two bodies of the foldable electronic device, increasing the coverage area of ​​the heat dissipation assembly, which is conducive to improving the heat dissipation effect of the heat dissipation assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0050] Figure 1 A schematic diagram of a heat dissipation assembly provided in an embodiment of the present disclosure;

[0051] Figure 2 A partial cross-sectional view of a heat dissipation assembly provided in an embodiment of the present disclosure;

[0052] Figure 3 A partial cross-sectional view of another heat dissipation assembly provided in an embodiment of the present disclosure;

[0053] Figure 4A partial cross-sectional view of another heat dissipation assembly provided in an embodiment of the present disclosure;

[0054] Figure 5 An exploded view of a heat dissipation assembly provided in an embodiment of the present disclosure;

[0055] Figure 6 for Figure 5 A cross-sectional view of the heat dissipation assembly at AA is shown;

[0056] Figure 7 for Figure 5 A cross-sectional view of the heat dissipation assembly at BB is shown;

[0057] Figure 8 for Figure 5 A cross-sectional view of the heat dissipation assembly at CC is shown;

[0058] Fig. 9 for Figure 5 A cross-sectional view of the heat dissipation assembly at DD is shown;

[0059] Fig.10 for Figure 5 A cross-sectional view of the heat dissipation assembly at EE is shown;

[0060] Fig.11 A schematic diagram of an electronic device provided by an embodiment of the present disclosure;

[0061] Fig.12 A schematic diagram of another electronic device provided by an embodiment of the present disclosure;

[0062] Fig.13 A schematic diagram of another electronic device provided by an embodiment of the present disclosure;

[0063] Fig.14 A flow chart of a method for manufacturing a heat dissipation assembly provided in an embodiment of the present disclosure.

[0064] The reference numerals in the figures represent respectively:

[0065] 100-heat dissipation assembly; 200-housing assembly; 1-heat dissipation element; 2-connector; 3-screen assembly; 4-mainboard; 5-battery cover; 001-first sheet; 002-second sheet;

[0066] 10-circulation channel; 11-second shell; 20-connecting part; 21-first shell; 22-supporting part; 23-liquid absorbent core; 24-texture structure; 201-main body; 202-hinge; 111-limiting part; 110-slot; 210-protrusion; 101-evaporation section; 102-condensation section; 103-first connecting section; 104-second connecting section; 105-compensation section; 106-blocking part; 1011-reflux liquid absorbent core; 1021-condensation liquid absorbent core; 1031-first guide liquid absorbent core; 1041-second guide liquid absorbent core; 1051-sealed liquid absorbent core.

[0067] The above drawings show clear embodiments of the present disclosure, which will be described in more detail below. These drawings and text descriptions are not intended to limit the scope of the present disclosure in any way, but to illustrate the concepts of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0069] The present disclosure provides a heat dissipation component. Figure 1 Schematic diagram of a heat dissipation assembly provided in an embodiment of the present disclosure. Figure 1 As shown, the heat dissipation assembly includes at least two heat dissipating elements 1 and a connecting element 2. At least two heat dissipating elements 1 are connected to form a circulation channel 10, or at least two heat dissipating elements 1 are respectively provided with a circulation channel 10, and the connecting element 2 includes a connecting portion 20, and the connecting element 2 is respectively connected to the at least two heat dissipating elements 1 through the connecting portion 20. The circulation channel 10 is filled with a heat dissipation medium, and the connecting element 2 includes a flexible material, and the connecting element 2 is configured to at least partially overlap with the orthographic projection of the hinge of the electronic device along the thickness direction.

[0070] In the heat dissipation assembly provided by the embodiment of the present disclosure, two heat dissipators 1 are used to form a circulation channel 10, and the circulation channel 10 is filled with a heat dissipation medium, so that the electronic device can be circulated and cooled. The connector 2 includes a flexible material, and the connector 2 is respectively connected to the two heat dissipators 1 through a connecting portion 20. The connector 2 is configured to at least partially overlap with the orthographic projection of the electronic device hinge along the thickness direction. The connector 2 can be bent as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation assembly can be set in at least two bodies of the foldable electronic device, increasing the coverage area of ​​the heat dissipation assembly, which is conducive to improving the heat dissipation effect of the heat dissipation assembly.

[0071] In order to make the technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0072] like Figure 1 As shown, the heat dissipation assembly provided by the embodiment of the present disclosure includes at least two heat sinks 1 and a connector 2, the two ends of the connector 2 are respectively connected to the at least two heat sinks 1, and the at least two heat sinks 1 are connected through the connector 2 to form a circulation channel 10, or at least two heat sinks 1 are respectively provided with a circulation channel 10. The circulation channel 10 is filled with a heat dissipation medium, and the heat dissipation medium can circulate in the circulation channel 10, thereby dissipating heat from the heating element in the electronic device. The heat dissipation medium is affected by the temperature of the heating element of the electronic device and is in a liquid and / or gaseous state in the circulation channel 10.

[0073] Alternatively, see Figure 1 At least two heat sinks 1 are respectively connected to the connecting member 2, so that at least two heat sinks 1 form a circulation channel through the connecting member 2.

[0074] For example, see Figure 1 The heat dissipation assembly includes two heat sinks 1 and two connectors 2, each connector 2 has a first end and a second end opposite to each other, and the connecting portion 20 is respectively located at the first end and the second end, and the two ends of one heat sink 1 are respectively connected to the first ends of the two connectors 2 through the connecting portion 20, and the two ends of another heat sink 1 are respectively connected to the second ends of the two connectors 2 through the connecting portion 20. The orthographic projections of the connector 2 and the hinge of the electronic device along the thickness direction at least partially overlap, and the connector 2 includes a flexible material, which can be bent as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation assembly can be arranged in at least two bodies of the foldable electronic device, increasing the coverage area of ​​the heat dissipation assembly. The heat dissipation medium in the circulation channel 10 can exist in a gaseous form in a high temperature environment and in a liquid form in a low temperature environment, and can circulate in the circulation channel 10 to dissipate heat for the electronic device.

[0075] In some embodiments of the present disclosure, Figure 1 As shown, the connector 2 includes a flexible first shell 21, the first shell 21 is a hollow structure, the connecting parts 20 are arranged at opposite ends of the first shell 21, and the first shell 21 is connected to the heat sink 1 through the connecting parts 20. The hollow structure of the first shell 21 is used to connect two adjacent heat sinks 1, so as to connect the circulation channels 10 in the two adjacent heat sinks 1 to each other.

[0076] Alternatively, if Figure 1As shown, the connector 2 further includes a support portion 22, which is disposed in the hollow structure of the first shell 21 and connected to at least one inner wall of the first shell 21 along the thickness direction. Preferably, both ends of the support portion 22 are respectively connected to the inner walls of two opposite sides of the first shell 21 along the thickness direction. The support portion 22 is used to support the hollow structure inside the shell 21 to prevent the connector 2 from being deformed or collapsed.

[0077] In some embodiments of the present disclosure, Figure 1 As shown, the connector 2 further includes a liquid wick 23, which is located in the first shell 21 of the connector 2 and connected to at least one inner wall of the first shell 21 along the thickness direction. The liquid wick 23 is used to absorb the liquid heat dissipation medium in the connector 2, so that the heat dissipation medium can easily flow through the connector 2, and prevent the heat dissipation medium from gathering in the hollow structure of the connector 2 and blocking the circulation channel 10.

[0078] Alternatively, see Figure 1 The support portion 22 and the liquid absorbent core 23 are connected to the inner wall on the same side of the first shell 21, and one end of the support portion 22 passes through the liquid absorbent core 23. During the bending and deformation of the connecting member 2, the deformation degrees of the two opposite sides of the first shell 21 along the thickness direction are different. The support portion 22 and the liquid absorbent core 23 are connected to the inner wall on the same side of the first shell 21, which can reduce the mutual squeezing and friction between the support portion 22 and the liquid absorbent core 23, and avoid the support portion 22 and the liquid absorbent core 23 from being damaged during the multiple bending and deformation of the connecting member 2, which is conducive to improving the service life of the connecting member 2.

[0079] Exemplarily, the two ends of the support portion 22 are respectively connected to the inner walls on opposite sides of the thickness direction of the first shell 21, the wick 23 is respectively connected to the inner walls on opposite sides of the thickness direction of the first shell 21, and the two ends of the support portion 22 pass through the wick 23 respectively.

[0080] In some embodiments of the present disclosure, Figure 1 As shown, at least one surface of at least a portion of the connector 2 along the thickness direction has a texture structure 24. Exemplarily, the texture structure 24 is located on a side of the first housing 21 away from the hinge of the electronic device, and the texture structure 24 can increase the surface area of ​​the first housing 21, adjust the surface shape of the first housing 21 when the connector 2 is bent and deformed, thereby improving the fatigue strength of the connector 2.

[0081] Optionally, the texture structure 24 includes a plurality of convex portions, and the plurality of convex portions extend along the rotation axis of the hinge. The extension directions of the plurality of convex portions are parallel to each other, for example, the plurality of convex portions may be strips extending along the rotation axis of the hinge. When the connector 2 is bent, the plurality of convex portions located on the surface of the first shell 21 away from the hinge can be close to each other, and the plurality of convex portions located on the surface of the first shell 21 close to the hinge can be away from each other, so as to improve the deformation range and bending fatigue strength of the shell 21.

[0082] And / or, the texture structure 24 includes a plurality of recesses, and the plurality of recesses extend along the rotation axis of the hinge. The plurality of recesses extend along the rotation axis of the hinge, for example, the plurality of recesses may be strips extending along the rotation axis of the hinge. When the connector 2 is bent, the width of the plurality of recesses on the surface of the first shell 21 away from the hinge decreases, and the width of the plurality of recesses on the surface of the first shell 21 close to the hinge increases, so as to improve the deformation range and bending fatigue strength of the shell 21.

[0083] In some embodiments of the present disclosure, the cross-sectional shape of the texture structure 24 in a plane perpendicular to the rotation axis of the hinge is a corrugated shape, a fin shape, or a sawtooth shape.

[0084] Figure 2 A partial cross-sectional view of a heat dissipation assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 2 As shown, the heat sink 1 includes a second shell 11, the second shell 11 is a hollow structure, and a communicating and enclosed space is provided in the first shell 21 and the second shell 11 to form a circulation channel 10. The first shell 21 and the second shell 11 are split structures, and the material of the second shell 11 is different from that of the first shell 21. For example, the material of the second shell 11 is metal or alloy material, such as copper, stainless steel and other materials with good thermal conductivity, and the material of the first shell 21 is rubber, plastic and other non-metallic flexible materials.

[0085] In some embodiments of the present disclosure, Figure 2 As shown, the second shell 11 is provided with a limiting portion 111, and the connecting portion 20 is connected to the limiting portion 111 of the second shell 11. Specifically, the connecting portion 20 and the limiting portion 111 are respectively annular, and are respectively connected to the ends of the first shell 21 and the second shell 11, the limiting portion 111 surrounds the outside of the connecting portion 20, and the connecting portion 20 is connected to the limiting portion 11. Specifically, the connecting portion 20 and the limiting portion 111 can be sealed and connected by welding or bonding.

[0086] Figure 3 A partial cross-sectional view of another heat dissipation assembly provided in an embodiment of the present disclosure. Figure 3As shown, the connecting portion 20 and the limiting portion 111 are respectively ring-shaped, the connecting portion 20 surrounds the limiting portion 111 , and the connecting portion 20 is connected to the limiting portion 111 .

[0087] In some embodiments of the present disclosure, Figure 3 As shown, the heat dissipation assembly further includes a fastener 12, and the connecting portion 20 of the first housing 21 is connected to the limiting portion 111 of the second housing 11 through the fastener 12. Exemplarily, the fastener 12 is a colloid, which is used to bond the connecting portion 20 to the limiting portion 111. Alternatively, the fastener 12 is a rubber sleeve, which is sleeved outside the gap where the connecting portion 20 and the limiting portion 111 are connected to seal the first housing 21 and the second housing 11.

[0088] Figure 4 A partial cross-sectional view of another heat dissipation assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 4 As shown, one of the connecting portion 20 and the limiting portion 111 is a protrusion 210, and the other of the connecting portion 20 and the limiting portion 111 is a slot 110, and the protrusion 210 is located in the slot 110. The protrusion 210 and the slot 110 are interference fit, or a colloid is provided in the slot 110, and the protrusion 210 is bonded to the slot 110 through the colloid.

[0089] Figure 5 An exploded view of a heat dissipation assembly provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Figure 2 As shown, the circulation channel 10 includes an evaporation section 101 and a condensation section 102. The evaporation section 101 is configured to be close to the heating element of the electronic device, and the condensation section 102 is configured to be far away from the heating element of the electronic device, so that the heat dissipation medium can circulate and flow between the evaporation section 101 and the condensation section 102 to dissipate heat.

[0090] In some embodiments of the present disclosure, Figure 5 As shown, the circulation channel 10 further includes a first connecting section 103, and both ends of the first connecting section 103 are respectively connected to the gas outlet end of the evaporation section 101 and the gas inlet end of the condensation section 102. The first connecting section 103 passes through the connecting piece 2 to transport the gaseous heat dissipation medium in the evaporation section 101 to the condensation section 102, and the gaseous heat dissipation medium is cooled into liquid in the first connecting section 103 and the condensation section 102.

[0091] In some embodiments of the present disclosure, Fig.10 As shown, the circulation channel 10 further includes a second connecting section 104, and the two ends of the second connecting section 104 are respectively connected to the air inlet end of the evaporation section 101 and the air outlet end of the condensation section 102. The second connecting section 104 passes through the connecting member 2 to transport the liquid heat dissipation medium in the condensation section 102 to the evaporation section 101, so that the heat dissipation medium circulates in the circulation channel 10 to dissipate heat for the heating element of the electronic device.

[0092] In some embodiments of the present disclosure, Fig.10 As shown, the heat dissipation assembly further includes a baffle 106, which is located in the circulation channel 10 and between the evaporation section 101 and the condensation section 102. Specifically, the baffle 106 is located in the first connection section 103, and is used to block the gaseous heat dissipation medium from entering the condensation section 102, and prevent the liquid heat dissipation medium from flowing back into the evaporation section 101 through the first connection section 103, thereby reducing the temperature of the condensation section 102, so that the gaseous heat dissipation medium can be condensed into liquid faster in the forward circulation process.

[0093] Optionally, the barrier 106 includes a Tesla valve, or a liquid wick is filled in the barrier 106. It should be noted that the embodiment of the present disclosure does not specifically limit the specific type of the barrier 106, and the above description of the barrier 105 is only an example and not a limitation.

[0094] Figure 6 for Figure 2 The cross-sectional view of the heat dissipation assembly at AA shown in FIG. Figure 6 As shown, a first guiding absorbent core 1031 and a support portion 22 are provided in the first connecting section 103, the support portion 22 is connected to at least one inner wall of the first connecting section 103 along the thickness direction, the first guiding absorbent core 1031 is connected to one inner wall of the first connecting section 103, and the thickness of the first guiding absorbent core 1031 is 0.01mm-0.3mm. Exemplarily, the two ends of the support portion 22 are respectively connected to the inner walls of both sides of the first connecting section 103 along the thickness direction.

[0095] Alternatively, if Figure 6 As shown, the second shell 11 includes an upper sheet 001 and a lower sheet 002 , the upper sheet 001 and the lower sheet 002 have the same shape, the upper sheet 001 is covered on the lower sheet 002 , and the edge area of ​​001 is welded to the lower sheet 002 to form a circulation channel 10 .

[0096] In some embodiments of the present disclosure, Figure 5 As shown, the circulation channel 10 further includes a compensation section 105 , and the compensation section 105 is located between the second connecting section 104 and the evaporation section 101 . Figure 7 for Figure 2 The cross-sectional view of the heat dissipation component at BB is shown. Figure 7As shown, the circulation channel 10 further includes a compensation section 105, which is located between the second connecting section 104 and the evaporation section 101. A sealed liquid wick 1051 is provided in the compensation section 105, and the sealed liquid wick 1051 fills the compensation section 105. Specifically, the compensation section 105 is located at one end of the second connecting section 104 close to the evaporation section 101, and the compensation section 105 is used to block the gaseous heat dissipation medium generated in the evaporation section 101, so that the gaseous heat dissipation medium can enter the condensation section 102 through the first connecting section 103, thereby preventing the heat dissipation medium from flowing back.

[0097] Figure 8 for Figure 2 The cross-sectional view of the heat dissipation assembly at CC shown in FIG. Figure 8 As shown, a condensation wick 1021 and a support portion 22 are provided in the condensation section 102, the support portion 22 is connected to at least one inner wall of the condensation section 102 along the thickness direction, the condensation wick 1021 is connected to the inner walls of the opposite sides of the condensation section 102 along the thickness direction, and the thickness of the condensation wick 1021 is 0.01mm-0.3mm. Exemplarily, the two ends of the support portion 22 are respectively connected to the inner walls of the two sides of the condensation section 102 along the thickness direction.

[0098] Fig. 9 for Figure 2 sectional view of the heat dissipation assembly at DD. In some embodiments of the present disclosure, Fig. 9 As shown, a second guiding absorbent core 1041 and a support portion 22 are provided in the second connecting section 104, the support portion 22 is connected to at least one inner wall of the second connecting section 104 along the thickness direction, the second guiding absorbent core 1041 is connected to the inner walls of the opposite sides of the second connecting section 104, and the thickness of the second guiding absorbent core 1041 is 0.05mm-1mm. Exemplarily, the two ends of the support portion 22 are respectively connected to the inner walls of the two sides of the second connecting section 104 along the thickness direction.

[0099] Fig.10 for Figure 2 A cross-sectional view of the heat dissipation assembly at EE is shown. In some embodiments of the present disclosure, Fig.10 As shown, a reflux wick 1011 and a support portion 22 are provided in the evaporation section 101, the support portion 22 is connected to at least one inner wall of the evaporation section 101 along the thickness direction, the reflux wick 1011 is connected to one inner wall of the evaporation section 101 along the thickness direction, and the thickness of the reflux wick 1011 is 0.03mm-0.3mm. Exemplarily, the two ends of the support portion 22 are respectively connected to the inner walls of both sides of the evaporation section 101 along the thickness direction.

[0100] In addition, an embodiment of the present disclosure further provides an electronic device, Fig.11Schematic diagram of an electronic device provided by an embodiment of the present disclosure. Fig.11 As shown, the electronic device includes the above-mentioned heat dissipation component 100 and shell component 200, the shell component 200 includes at least two main bodies 201 and a hinge 202, two adjacent main bodies 201 are movably connected to the opposite sides of the hinge 202, two adjacent heat dissipation components 1 are respectively covered on the two adjacent main bodies 201, and the positive projections of the connecting component 2 and the hinge 202 along the thickness direction at least partially overlap.

[0101] In the electronic device provided by the embodiment of the present disclosure, at least two heat sinks 1 and a connector 2 are used to form a circulation channel 10, and the circulation channel 10 is filled with a heat dissipation medium, so that the heat dissipation of the heating element in the electronic device can be circulated. The orthographic projections of the connector 2 and the hinge 202 along the thickness direction at least partially overlap, and the connector 2 can be bent as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation assembly 100 can be arranged in at least two main bodies 201 of the foldable electronic device, increasing the coverage area of ​​the heat dissipation assembly.

[0102] In the embodiments of the present disclosure, the electronic device may be a foldable electronic device or an accessory of an electronic device, for example, the foldable electronic device may be a foldable screen mobile phone or a laptop computer, etc.; the accessory of the electronic device may be an accessory with a heat dissipation function, such as a keyboard protective cover or a heat dissipation protective cover, etc. It should be noted that the embodiments of the present disclosure do not specifically limit the specific type of the electronic device.

[0103] Fig.12 A schematic diagram of another electronic device provided in an embodiment of the present disclosure. In some embodiments of the present disclosure, such as Fig.12 As shown, the electronic device also includes a screen assembly 3, a main board 4 and a battery cover 5. The screen assembly 3 is covered on at least two main bodies 201 along the thickness direction. The battery cover 5 is covered on the side of the shell assembly 200 away from the screen assembly 3. The main board 4 is located between the at least two main bodies 201 and the battery cover 5. The heat dissipation assembly 100 is located between the main board 4 and the shell assembly 200 to dissipate heat for the main board 4.

[0104] Fig.13 A schematic diagram of another electronic device provided by an embodiment of the present disclosure. Fig.13 As shown, the heat dissipation component 100 is located between the screen component 3 and the housing component 200 to dissipate heat for the screen component 3. Alternatively, the heat dissipation component 100 is disposed on the battery cover 5 to dissipate heat for the battery of the electronic device.

[0105] The disclosed embodiment also provides a method for manufacturing a heat dissipation assembly. Fig.14 A flow chart of a method for manufacturing a heat dissipation assembly provided in an embodiment of the present disclosure. The method is used to manufacture the heat dissipation assembly, comprising:

[0106] S1, etching the substrate into a first sheet 001 and a second sheet 002;

[0107] S2, welding the first sheet 001 and the second sheet 002 together to form at least two heat sinks 1 with a hollow structure;

[0108] S3, connecting at least two heat sinks 1 to the connecting portions 20 of the connecting member 2 respectively;

[0109] S4, injecting heat dissipation medium into the circulation channel 10 of the heat dissipation element 1.

[0110] In the manufacturing method of the heat dissipation assembly provided by the embodiment of the present disclosure, at least two heat dissipating members 1 and a connecting member 2 form a circulation channel 10, and a heat dissipation medium is filled in the circulation channel 10, so that the heat dissipation assembly can circulate and dissipate heat for the heating element in the electronic device. The connecting member 2 can be bent as the foldable electronic device is folded or flattened as the foldable electronic device is unfolded, so that the heat dissipation assembly can be arranged in at least two bodies of the foldable electronic device, increasing the coverage area of ​​the heat dissipation assembly.

[0111] It should be noted that the "several" and "at least one" mentioned in this article refer to one or more, and "multiple" and "at least two" refer to two or more. "And / or" describes the association relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0112] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0113] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0114] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0115] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present disclosure.

[0116] The above descriptions are merely embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A heat dissipation component, characterized in that: It comprises at least two heat sinks (1) and a connecting member (2); The at least two heat sinks (1) are connected to form a circulation channel (10), or the at least two heat sinks (1) are respectively provided with a circulation channel (10), the connecting member (2) comprises a connecting portion (20), and the connecting member (2) is respectively connected to the at least two heat sinks (1) via the connecting portion (20); The circulation channel (10) is filled with a heat dissipation medium, the connecting piece (2) comprises a flexible material, and the connecting piece (2) is configured to at least partially overlap with the orthographic projection of the hinge of the electronic device along the thickness direction.

2. The heat dissipation assembly according to claim 1, characterized in that: The at least two heat dissipating elements (1) are connected via the connecting element (2) to form a circulation channel (10).

3. The heat dissipation assembly according to claim 2, characterized in that: The connecting member (2) further comprises a first shell (21), the first shell (21) being a hollow structure, and the connecting portion (20) being arranged at two opposite ends of the first shell (21).

4. The heat dissipation assembly according to claim 3, characterized in that: The heat sink (1) comprises a second shell (11), the second shell (11) is a hollow structure, and a communicating and sealed space is provided inside the first shell (21) and the second shell (11) to form the circulation channel (10).

5. The heat dissipation assembly according to claim 4, characterized in that: The second shell (11) is provided with a limiting portion (111), and the connecting portion (20) is connected to the limiting portion (111) of the second shell (11).

6. The heat dissipation assembly according to claim 5, characterized in that: The connecting portion (20) surrounds the limiting portion (111); Alternatively, the limiting portion (111) surrounds the outside of the connecting portion (20).

7. The heat dissipation assembly according to claim 5, characterized in that: It also comprises a fastener (12), and the connecting portion (20) is connected to the limiting portion (111) of the second shell (11) via the fastener (12).

8. The heat dissipation assembly according to claim 5, characterized in that: One of the connecting portion (20) and the limiting portion (111) is a protrusion (210), and the other of the connecting portion (20) and the limiting portion (111) is a slot (110), and the protrusion (210) is located in the slot (110).

9. The heat dissipation assembly according to claim 3, characterized in that: The connecting member (2) further comprises a supporting portion (22), wherein the supporting portion (22) is disposed in the hollow structure of the first shell (21) and is connected to at least one inner wall of the first shell (21) along the thickness direction.

10. The heat dissipation assembly according to claim 9, characterized in that: The connecting member (2) further comprises: a liquid absorbent core (23), wherein the liquid absorbent core (23) is located inside the first shell (21) and is connected to at least one inner wall of the first shell (21) along the thickness direction.

11. The heat dissipation assembly according to claim 10, characterized in that: The support portion (22) and the liquid absorbent core (23) are connected to the inner wall of the same side of the first shell (21), and one end of the support portion (22) passes through the liquid absorbent core (23).

12. The heat dissipation assembly according to any one of claims 1 to 11, characterized in that: At least one surface of at least part of the connecting member (2) along the thickness direction has a texture structure (24).

13. The heat dissipation assembly according to claim 12, characterized in that: The texture structure (24) comprises a plurality of protrusions extending along the rotation axis of the hinge; and / or, The texture structure (24) includes a plurality of recesses extending along the rotation axis of the hinge.

14. The heat dissipation assembly according to any one of claims 1 to 11, characterized in that: The circulation channel (10) comprises an evaporation section (101) and a condensation section (102).

15. The heat dissipation assembly according to claim 14, characterized in that: A reflux liquid wick (1011) and a support portion (22) are provided in the evaporation section (101); the support portion (22) is connected to at least one inner wall of the evaporation section (101) along the thickness direction; and the reflux liquid wick (1011) is connected to one inner wall of the evaporation section (101) along the thickness direction.

16. The heat dissipation assembly according to claim 14, characterized in that: The condensation section (102) is provided with a condensation absorbent core (1021) and a support portion (22), wherein the support portion (22) is connected to at least one side of the inner wall of the condensation section (102) along the thickness direction, and the condensation absorbent core (1021) is connected to the inner walls of the condensation section (102) on two opposite sides along the thickness direction.

17. The heat dissipation assembly according to claim 14, characterized in that: The circulation channel (10) further comprises a first connecting section (103), the two ends of which are respectively connected to the air outlet end of the evaporation section (101) and the air inlet end of the condensation section (102).

18. The heat dissipation assembly according to claim 17, characterized in that: A first liquid-guiding absorbent core (1031) and a supporting portion (22) are provided in the first connecting section (103); the supporting portion (22) is connected to at least one inner wall of the first connecting section (103) along the thickness direction; and the first liquid-guiding absorbent core (1031) is connected to one inner wall of the first connecting section (103).

19. The heat dissipation assembly according to claim 14, characterized in that: The circulation channel (10) further comprises a second connecting section (104), the two ends of which are respectively connected to the air inlet end of the evaporation section (101) and the air outlet end of the condensation section (102).

20. The heat dissipation assembly according to claim 19, characterized in that: A second guide absorbent core (1041) and a support portion (22) are provided in the second connecting section (104); the support portion (22) is connected to at least one inner wall of the second connecting section (104) along the thickness direction; and the second guide absorbent core (1041) is connected to the inner walls of the second connecting section (104) on two opposite sides.

21. The heat dissipation assembly according to claim 14, characterized in that: The circulation channel (10) further comprises a compensation section (105), wherein the compensation section (105) is located between the second connecting section (104) and the evaporation section (101), and a sealed liquid wick (1051) is arranged in the compensation section (105), and the sealed liquid wick (1051) fills the compensation section (105).

22. The heat dissipation assembly according to claim 14, characterized in that: The heat dissipation component further comprises a baffle (106), wherein the baffle (106) is located in the circulation channel (10) and between the evaporation section (101) and the condensation section (102).

23. The heat dissipation assembly according to claim 22, characterized in that: The baffle (106) includes a Tesla valve; or the baffle (106) is filled with a liquid wick (23).

24. An electronic device, characterized in that: Comprising the heat dissipation assembly (100) and the housing assembly (200) according to any one of claims 1 to 23; The housing assembly (200) comprises at least two main bodies (201) and a hinge (202), and two adjacent main bodies (201) are movably connected to opposite sides of the hinge (202); The two adjacent heat sinks (1) are respectively covered on the two adjacent main bodies (201), and the orthographic projections of the connecting member (2) and the hinge (202) along the thickness direction at least partially overlap.

25. The electronic device according to claim 24, characterized in that: It also includes a screen assembly (3), a main board (4) and a battery cover (5); The screen assembly (3) is covered on the at least two main bodies (201) along the thickness direction, the battery cover (5) is covered on the side of the housing assembly (200) away from the screen assembly (3), and the main board (4) is located between the at least two main bodies (201) and the battery cover (5); The heat dissipation component (100) is arranged at at least one of the following positions: The heat dissipation component (100) is located between the screen component (3) and the housing component (2); The heat dissipation component (100) is located between the mainboard (4) and the housing component (2); The heat dissipation component (100) is arranged on the battery cover (5).

26. A method for manufacturing a heat dissipation component, characterized in that: The method is used to manufacture the heat dissipation assembly according to any one of claims 1 to 23, comprising: Etching the substrate into a first sheet (001) and a second sheet (002); The first sheet (001) and the second sheet (002) are connected by welding to form at least two heat sinks (1) having a hollow structure; Connecting at least two of the heat sinks (1) to the connecting portions (20) of the connecting member (2) respectively; A heat dissipation medium is injected into the circulation channel (10) of the heat dissipation element (1).

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