Electronic device

Abstract

The invention discloses an electronic device, comprising: a body provided with an air inlet and an air outlet; the circuit board assembly is arranged in the body, a first air duct and a second air duct are arranged on the two opposite sides of the circuit board assembly correspondingly, the first air duct communicates with the air inlet and the air outlet, the second air duct communicates with the air inlet and the air outlet, and the circuit board assembly comprises a circuit board, a first heat source and a second heat source; the first heat source and the second heat source are respectively arranged on two sides of the circuit board, the first heat source is arranged in the first air duct, and the second air duct is used for radiating the second heat source; and the air supply piece is used for supplying air to the first air duct and the second air duct.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] In related technologies, heat dissipation is an essential key structure or important indicator of electronic equipment. At present, the main built-in heat dissipation structures used are active heat dissipation structures and passive heat dissipation structures, such as Figure 1 As shown, currently electronic equipment relies on a closed air duct 5' formed by a bracket upper cover 3' and a bracket lower cover 4', and uses a fan to send air into the air duct 5' so that the airflow flows along the direction indicated by the arrow in the air duct 5' to achieve heat dissipation, wherein the air duct 5' and the heat source 20' on the circuit board assembly 2' are isolated by the bracket lower cover 4', and the side of the heat source 20' close to the display screen 1' still needs to use a heat conducting structure such as a heat spreader to dissipate heat, resulting in low overall heat conduction efficiency. Summary of the invention

[0003] The present application aims to provide an electronic device, which at least solves the problem of low heat dissipation efficiency of the electronic device.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] An embodiment of the present application proposes an electronic device, including: a main body, the main body is provided with an air inlet and an air outlet; a circuit board assembly, arranged in the main body, the circuit board assembly is respectively provided with a first air duct and a second air duct on two opposite sides, the first air duct is connected with the air inlet and the air outlet, and the second air duct is connected with the air inlet and the air outlet, the circuit board assembly includes a circuit board, a first heat source and a second heat source, the first heat source and the second heat source are respectively arranged on two sides of the circuit board, the first heat source is arranged in the first air duct, and the second air duct is used to dissipate heat from the second heat source; an air supply member, the air supply member is used to supply air to the first air duct and the second air duct.

[0006] In an embodiment of the present application, an electronic device includes a body, a circuit board assembly and an air supply member. The circuit board assembly includes a circuit board and a first heat source and a second heat source arranged on both sides of the circuit board. The first air duct and the second air duct are respectively arranged on opposite sides of the circuit board assembly. When the air supply member is turned on, the air flow can enter the first air duct and the second air duct from the air inlet on the body, and then flow out of the body from the air outlet. The first heat source is directly arranged in the first air duct, so that the air flow entering the first air duct can promptly take away the heat generated by the first heat source when it is working, thereby improving the cooling effect and heat dissipation efficiency of the first heat source. The second air duct is used to dissipate the heat of the second heat source, so that the heat sources on both sides of the circuit board assembly can achieve passive heat dissipation, thereby improving the heat dissipation effect and heat dissipation efficiency of the circuit board assembly. In addition, the electronic device proposed in the present application realizes the air supply of the first air duct and the second air duct through the same air supply member, thereby improving the utilization rate of the air supply member.

[0007] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 It is a schematic diagram of the structure of an electronic device in the related art.

[0010] Reference numerals:

[0011] 1' display screen, 2' circuit board assembly, 20' heat source, 3' bracket upper cover, 4' bracket lower cover, 5' air duct.

[0012] Figure 2 is one of the structural schematic diagrams of an electronic device according to an embodiment of the present application;

[0013] Figure 3 is a second structural schematic diagram of an electronic device according to an embodiment of the present application;

[0014] Figure 4 yes Figure 3 A cross-sectional view of the electronic device along the line AA of the illustrated embodiment;

[0015] Figure 5 is a third structural schematic diagram of an electronic device according to an embodiment of the present application;

[0016] Figure 6 is a schematic structural diagram of a second bracket and an air supply member according to an embodiment of the present application;

[0017] Figure 7 is a fourth structural schematic diagram of an electronic device according to an embodiment of the present application;

[0018] Figure 8 yes Figure 3 A BB-sectional view of the electronic device of the illustrated embodiment;

[0019] Fig. 9 yes Figure 3 Another cross-sectional view of the electronic device along the line AA of the illustrated embodiment;

[0020] Fig.10 yes Figure 3 Another cross-sectional view of the electronic device along line BB of the illustrated embodiment.

[0021] Reference numerals:

[0022] 1 body, 10 frame, 102 sound leakage prevention hole, 104 ash storage groove, 106 air inlet, 108 air outlet, 1080 gap, 1082 opening, 11 first bracket, 110 air outlet duct, 111 first through hole, 113 fourth through hole, 114 first heat conducting member, 116 second heat conducting member, 117 sink, 118 sixth through hole, 12 first air duct, 13 second air duct, 14 first dustproof net, 140 first net body, 142 first sealing pad, 15 second dustproof net, 16 third dustproof net, 160 second net body, 162 second sealing pad, 17 4 dustproof nets, 18 third sealing member, 19 second bracket, 190 mounting cavity, 191 second through hole, 192 third through hole, 193 plate body, 194 second enclosure, 195 first enclosure, 196 first guide block, 197 first sealing member, 198 second sealing member, 2 display screen, 3 circuit board assembly, 30 circuit board, 302 fifth through hole, 32 first heat source, 34 second heat source, 36 first shielding member, 38 second shielding member, 4 battery, 5 air supply member, 6 adhesive member, 60 through hole, 62 notch, 64 second guide block, 7 receiver, 8 back cover assembly. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0024] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects.

[0025] In the description of the present application, it should be understood that the terms "thickness", "front", "back", "horizontal", "top", "bottom", "inside", "outside", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Combine the following Figure 2-Figure 10 An electronic device according to an embodiment of the present application is described.

[0028] like Figure 2 , Figure 3 and Figure 4 As shown, according to some embodiments of the present application, the electronic device includes: a main body 1, the main body 1 is provided with an air inlet 106 and an air outlet 108; a circuit board assembly 3, arranged in the main body 1, the circuit board assembly 3 is respectively provided with a first air duct 12 and a second air duct 13 on two opposite sides, the first air duct 12 is connected with the air inlet 106 and the air outlet 108, the second air duct 13 is connected with the air inlet 106 and the air outlet 108, the circuit board assembly 3 includes a circuit board 30, a first heat source 32 and a second heat source 34, the first heat source 32 and the second heat source 34 are respectively arranged on both sides of the circuit board 30, the first heat source 32 is arranged in the first air duct 12, and the second air duct 13 is used to dissipate heat from the second heat source 34; an air supply member, the air supply member is used to supply air to the first air duct 12 and the second air duct 13.

[0029] In an embodiment of the present application, an electronic device includes a body 1, a circuit board assembly 3 and an air supply member. The circuit board assembly 3 includes a circuit board 30 and a first heat source 32 and a second heat source 34 arranged on both sides of the circuit board 30. The first air duct 12 and the second air duct 13 are respectively arranged on opposite sides of the circuit board assembly 3. When the air supply member is turned on, the air flow can enter the first air duct 12 and the second air duct 13 from the air inlet 106 on the body 1, and then flow out of the body 1 from the air outlet 108. Among them, the first heat source 32 is directly arranged in the first air duct 12, so that the air flow entering the first air duct 12 can promptly take away the heat generated by the first heat source 32 when working, thereby improving the cooling effect and heat dissipation efficiency of the first heat source 32. The second air duct 13 is used to dissipate heat for the second heat source 34, so that the heat sources on both sides of the circuit board assembly 3 can realize active heat dissipation, thereby improving the heat dissipation effect and heat dissipation efficiency of the circuit board assembly 3. In addition, the electronic device proposed in the present application realizes the air supply of the first air duct 12 and the second air duct 13 through the same air supply member, thereby improving the utilization rate of the air supply member.

[0030] It can be understood that the air supply member supplies air to the first air duct 12 and the second air duct 13, and the air supply member supplies air to one of the first air duct 12 and the second air duct 13, and the first air duct 12 is connected to the second air duct 13 through a connecting structure, so that the airflow enters the other of the first air duct 12 and the second air duct 13, and then the airflow generated after the air supply member is turned on can flow to the first air duct 12 and the second air duct 13; of course, the air supply member can also be provided with two air outlet structures, and the two air outlet structures are respectively connected to the first air duct 12 and the second air duct 13, so as to realize the air supply member supplying air to the first air duct 12 and the second air duct 13.

[0031] It can be understood that the first heat source 32 and the second heat source 34 are elements that generate heat during the operation of the electronic device, such as an integrated circuit or other devices on the circuit board 30, or other elements in the electronic device, such as cameras, motors, batteries and other heat generating mechanisms.

[0032] Optionally, the air supply member includes a fan.

[0033] like Figure 8 As shown, according to some embodiments of the present application, optionally, the main body 1 includes: a frame 10; a first bracket 11, the frame 10 is arranged around the first bracket 11, and the circuit board assembly 3 is arranged on one side of the first bracket 11; a second bracket 19, arranged on the side of the circuit board 30 away from the first bracket 11, and the second bracket 19 and the circuit board 30 together enclose a first air duct 12; a display screen 2, arranged on the other side of the first bracket 11, and the display screen 2 and the first bracket 11 together enclose an outlet air duct 110, and the first air duct 12 and the second air duct 13 are both connected to the air outlet 108 through the outlet air duct.

[0034] In this embodiment, the body 1 includes a frame 10, a first bracket 11, a second bracket 19 and a display screen 2. The frame 10 is arranged around the first bracket 11, the circuit board assembly 3 is arranged on one side of the first bracket 11, and the display screen 2 is arranged on the other side of the first bracket 11. The second bracket 19 is arranged on the side of the circuit board 30 away from the first bracket 11 and encloses a first air duct 12 with the circuit board 30, so that the first heat source 32 is directly arranged in the first air duct 12, so that the airflow entering the first air duct 12 can promptly take away the heat generated by the first heat source 32 when working, thereby improving the cooling effect and heat dissipation efficiency of the first heat source 32. In addition, by enclosing the first air duct 12 for heat dissipation by the second bracket 19 and the circuit board 30, the occupation of the internal space of the electronic device by the heat dissipation air duct is reduced, which is conducive to the lightweight design of the electronic device.

[0035] like Figure 6As shown, according to some embodiments of the present application, optionally, the second bracket 19 includes: a plate body 193; a first enclosure 195, which is surrounded by one side of the plate body 193, and the end of the first enclosure 195 away from the plate body 193 is in contact with the circuit board 30, the plate body 193, the first enclosure 195 and the circuit board 30 together enclose a first air duct 12, and the first bracket 11 and the circuit board 30 are both provided with a first through hole 111, and the first air duct 12 is connected to the air outlet duct 110 through the first through hole 111.

[0036] In this embodiment, the second bracket 19 includes a plate body 193 and a first enclosure 195. The end of the first enclosure 195 away from the plate body 193 contacts the circuit board 30, so that the plate body 193, the first enclosure 195 and the circuit board 30 enclose the first air duct 12. Through this arrangement, the first air duct 12 is relatively closed, which can prevent the airflow entering the first air duct 12 from flowing to other areas in the body 1, thereby preventing the dust and water vapor carried in the airflow from affecting the operation of the electronic device. Among them, the first air duct 12 is connected to the air outlet duct 110 through the first via 111 to achieve the discharge of hot air, thereby ensuring the heat dissipation effect.

[0037] It is understandable that the first through hole 111 on the first bracket 11 and the first through hole 111 on the circuit board 30 are arranged opposite to each other and are connected to each other so as to realize the connection between the first air duct 12 and the air outlet duct 110 .

[0038] like Figure 5 and Figure 6 As shown, according to some embodiments of the present application, optionally, the second bracket 19 also includes: at least one first guide block 196, which is provided on the plate body 193 and is located in the first air duct 12, and the first guide block 196 is arranged opposite to the first heat source 32, and is used to guide the airflow entering the first air duct 12.

[0039] In this embodiment, the second bracket 19 also includes at least one first guide block 196, at least one first guide block 196 is connected to the plate body 193 and is located in the first air duct 12, and the first guide block 196 can guide the airflow entering the first air duct 12, so that the airflow can fully pass through the location of the first heat source 32, thereby achieving sufficient heat exchange with the first heat source 32, and improving the heat dissipation effect and heat dissipation efficiency of the first heat source 32.

[0040] Optionally, the first guide block 196 is arc-shaped, S-shaped or ring-shaped, so that the airflow fully passes through the area where the first heat source 32 is located, thereby increasing the heat exchange area between the airflow and the first heat source 32, thereby improving the exchange efficiency.

[0041] Optionally, when the first guide block 196 is arc-shaped, one end of the first guide block 196 is arranged opposite to the air inlet 106, and the other end is arranged opposite to the air outlet position of the first air duct 12 (for example, the first through hole 111).

[0042] like Figure 4 As shown, according to some embodiments of the present application, optionally, the second bracket 19 also includes: a second enclosure 194, which is arranged on one side of the plate body 193, and the end of the second enclosure 194 away from the plate body is in contact with the circuit board 30, the plate body, the second enclosure 194 and the circuit board 30 together enclose an installation cavity 190, the installation cavity 190 is provided with a second through hole 191 and a third through hole 192, the second through hole 191 is arranged opposite to and communicated with the air inlet 106, the third through hole 192 is communicated with the first air duct 12 and the second air duct 13, and the air supply member 5 is arranged in the installation cavity 190.

[0043] In this embodiment, the end of the second enclosure 194 away from the plate body 193 contacts the circuit board 30, so that the plate body 193, the second enclosure 194 and the circuit board 30 enclose the installation cavity 190 for installing the air supply member 5, so that the air supply member 5 and the second bracket 19 are integrated, which is convenient for the assembly of parts and improves the assembly efficiency. At the same time, the installation cavity 190 is provided with a second through hole 191 and a third through hole 192. The installation cavity 190 is connected with the air inlet 106 through the second through hole 191, and is connected with the first air duct 12 and the second air duct 13 through the third through hole 192. When the air supply member 5 is working, the airflow enters the installation cavity 190 from the air inlet 106 through the second through hole 191, and then enters the first air duct 12 and the second air duct 13 through the third through hole 192, which can prevent the dust or water vapor carried by the airflow generated when the air supply member 5 is working from entering other spaces in the body 1, thereby preventing the dust or water vapor from affecting the operation of other electronic components.

[0044] It can be understood that the second enclosure 194 is arranged on one side of the plate body 193, so that the second enclosure 194 and the plate body 193 can enclose a space, and then when the end of the second enclosure 194 away from the plate body 193 contacts the first bracket 11, an installation cavity 190 can be formed; correspondingly, the first enclosure 195 is arranged on one side of the plate body 193, so that the first enclosure 195 and the plate body 193 can enclose a space, and then when the end of the first enclosure 195 away from the plate body 193 contacts the first bracket 11, a first air duct 12 can be formed.

[0045] It should be noted that the installation cavity 190 is connected to the first air duct 12 and the second air duct 13 through the third via hole 192. The first air duct 12 and the second air duct 13 can be connected to the third via hole 192 through independent air ducts, or the third via hole 192 is connected to the first air duct 12, and the first air duct 12 is connected to the second air duct 13.

[0046] like Figure 6 As shown, according to some embodiments of the present application, optionally, the second bracket 19 also includes: a first seal 197, provided between the second enclosure 194 and the first bracket 11, for sealing the gap between the second enclosure 194 and the first bracket 11; and / or a second seal 198, provided between the first enclosure 195 and the first bracket 11, for sealing the gap between the first enclosure 195 and the first bracket 11.

[0047] In this embodiment, the second bracket 19 also includes a first seal 197 and / or a second seal 198. The first seal 197 is arranged between the second enclosure 194 and the first bracket 11, thereby sealing the gap between the second enclosure 194 and the first bracket 11, avoiding air leakage from the gap between the two, and further avoiding air flow from the gap into other spaces in the main body 1 to affect the operation of the electronic equipment; the second seal 198 is arranged between the first enclosure 195 and the first bracket 11, thereby sealing the gap between the first enclosure 195 and the first bracket 11, avoiding air leakage from the gap between the two, and further avoiding air flow from the gap into other spaces in the main body 1 to affect the operation of the electronic equipment.

[0048] Optionally, the first sealing member 197 and / or the second sealing member 198 is a soft adhesive structure, such as double-sided adhesive, silicone, etc.

[0049] According to some embodiments of the present application, optionally, the main body 1 further includes: a first dustproof net 14 disposed between the air inlet 106 and the second through hole 191 ; and / or a second dustproof net 15 shielding the first through hole 111 .

[0050] In this embodiment, if Figure 4 and Fig. 9 As shown, a first dustproof net 14 is provided between the air inlet 106 and the second through hole 191, which can prevent dust outside the electronic device from entering the body 1 through the air inlet 106, thereby achieving a dustproof function and ensuring the normal operation and service life of the electronic device. Figure 8 As shown, the electronic device also includes a second dustproof net 15, which blocks the first through hole 111 and can filter the airflow entering the outlet duct 110 from the first air duct 12, thereby preventing dust from entering the area between the display screen 2 and the first bracket 11, thereby preventing dust from affecting the operation of the display screen 2.

[0051] Optionally, the second dustproof net 15 is located between the circuit board 30 and the first bracket 11 .

[0052] Optionally, the second dustproof net 15 has a sealing cushion, which is disposed around the first through hole 111 to seal the gap between the circuit board 30 and the first bracket 11 at the first through hole 111 .

[0053] like Figure 4 and Fig. 9 As shown, according to some embodiments of the present application, optionally, the first dustproof net 14 includes: a first net body 140, blocking between the air inlet 106 and the second through hole 191; a first sealing gasket 142, connected to the first net body 140, and arranged between the frame 10 and the second bracket 19, the first sealing gasket 142 is arranged around the air inlet 106 and the second through hole 191, and is used to seal the gap between the frame 10 and the second bracket 19.

[0054] In this embodiment, the first dustproof net 14 includes a first net body 140 and a first sealing gasket 142. The first net body 140 is shielded between the air inlet 106 and the second through hole 191 to prevent dust from entering the body 1. The first sealing gasket 142 is connected to the first net body 140, located between the frame 10 and the second bracket 19, and surrounded by the second through hole 191 and the air inlet 106, so as to seal the gap between the frame 10 and the second bracket 19, and prevent the airflow from entering the body 1 through the air inlet 106 and then flowing to other areas in the body 1 through the gap between the frame 10 and the second bracket 19, thereby preventing the dust or water vapor carried by the airflow from affecting the operation of other electronic components, so that the first dustproof net 14 proposed in this application can achieve both dustproof and sealing.

[0055] Optionally, the first sealing pad 142 includes a sealing cushion, which may be, but is not limited to, a sealing member such as a double-sided tape or silicone.

[0056] like Figure 4 As shown, according to some embodiments of the present application, optionally, the display screen 2 and the first bracket 11 enclose a second air duct 13, and a fourth via hole 113 is provided on the circuit board 30 and the first bracket 11, and the fourth via hole 113 connects the first air duct 12 and the second air duct 13, so that the second air duct 13 is connected to the air inlet 106 through the fourth via hole 113, and the second heat source is arranged opposite to the second air duct 13.

[0057] In this embodiment, the display screen 2 and the first bracket 11 enclose the second air duct 13, the first air duct 12 and the second air duct 13 are connected through the fourth through hole 113, and the second heat source is arranged opposite to the second air duct 13. When the air supply member 5 is turned on, the airflow enters the first air duct 12 through the air inlet 106, and a part of the airflow dissipates the heat of the first heat source 32 in the first air duct 12 and then flows out of the body 1 through the air outlet 110 through the air outlet 108, and the other part of the airflow flows into the second air duct 13 on the other side of the first bracket 11 through the fourth through hole 113, and the heat of the second heat source 34 is transferred to the second air duct 13 through the first bracket 11, and then taken away by the cooling air in the second air duct 13, and flows out of the body 1 through the air outlet 108 through the air outlet 110, so as to achieve the heat dissipation of the second heat source 34. The electronic device proposed in the present application realizes the air supply of the first air duct 12 and the second air duct 13 through the same air supply member 5, thereby realizing the heat dissipation of the first heat source 32 and the second heat source 34 on the opposite sides of the circuit board 30, thereby improving the utilization rate of the air supply member 5 and the heat dissipation effect of the first heat source 32 and the second heat source 34. In addition, the first air duct 12 is formed by the second bracket 19 and the circuit board 30, and the second air duct 13 is formed by the first bracket 11 and the display screen 2, and no other components need to be added, thereby avoiding the space occupation problem caused by the setting of the heat dissipation air duct, and realizing the light and thin design of the electronic device.

[0058] It can be understood that, along the thickness direction of the electronic device, the first heat source 32 is arranged on the side of the circuit board 30 away from the first bracket 11 , and the second heat source 34 is arranged on the side of the circuit board 30 facing the first bracket 11 .

[0059] It is understandable that the fourth via hole 113 on the circuit board 30 and the fourth via hole 113 on the first bracket 11 are arranged opposite to each other and are connected to each other, so as to achieve the connection between the first air duct 12 and the second air duct 13 .

[0060] Optionally, when the air supply member 5 is turned on, the airflow enters the installation cavity 190 from the air inlet 106 through the second through hole 191, and then enters the first air duct 12 through the third through hole 192. A part of the airflow fully passes through the first heat source 32 under the action of the first guide block 196 in the first air duct 12 to achieve heat exchange with the first heat source 32, and then flows into the air outlet duct 110, and flows out of the air outlet 108 through the air outlet duct 110; another part of the airflow enters the second air duct 13 through the fourth through hole 113. Since the second heat source 34 is located on the side of the circuit board 30 close to the first bracket 11, the heat of the second heat source 34 is transferred to the second air duct 13 through the first bracket 11, and the air flow in the second air duct 13 is carried out of the air outlet 108 by the air outlet duct 110.

[0061] According to some embodiments of the present application, optionally, the fourth through hole 113 is located on a side of the first air duct 12 close to the air inlet 106 .

[0062] In this embodiment, the fourth through hole 113 is located on the side of the first air duct 12 close to the air inlet 106, which can prevent the hot air flow after heat exchange with the first heat source 32 in the first air duct 12 from flowing into the second air duct 13, ensuring that cold air enters the second air duct 13, thereby ensuring the heat dissipation effect of the second heat source 34.

[0063] Optionally, when the second bracket 19 also encloses the installation cavity 190 with the circuit board 30, and the installation cavity 190 is provided with a second through hole 191 and a third through hole 192, the air supply member 5 is arranged in the installation cavity 190, the second through hole 191 is arranged opposite to and communicated with the air inlet 106, and the third through hole 192 is communicated with the first air duct 12, wherein the fourth through hole 113 is arranged close to the third through hole 192 to prevent the airflow entering the first air duct 12 from entering the second air duct 13 after exchanging heat with the first heat source 32.

[0064] like Figure 4 As shown, according to some embodiments of the present application, optionally, a first heat conductor 114 is provided between the second heat source 34 and the first bracket 11 .

[0065] In this embodiment, a first heat conductor 114 is provided between the second heat source 34 and the first bracket 11 , so that the heat generated by the second heat source 34 is quickly transferred to the second air duct 13 through the first heat conductor 114 , thereby improving the heat dissipation effect of the second heat source 34 .

[0066] Optionally, the first heat-conducting member 114 includes any one of a thermally conductive gel, a heat spreader, and a graphite heat dissipation film.

[0067] like Figure 7 As shown, according to some embodiments of the present application, optionally, the electronic device also includes: an adhesive member 6, bonded between the display screen 2 and the first bracket 11, the adhesive member 6 is provided with a through hole 60 and a notch 62, and the notch 62 is connected to the through hole 60; the first bracket 11 and the display screen 2 enclose a second air duct 13 through the through hole 60, and the first bracket 11 and the display screen 2 enclose an outlet air duct 110 through the notch 62.

[0068] In this embodiment, the display screen 2 is fixed to the first bracket 11 by means of an adhesive 6, wherein a through hole 60 and a notch 62 are provided on the adhesive 6, and the through hole 60 and the notch 62 can form an escape space, thereby allowing a certain gap to exist between the first bracket 11 and the display screen 2, so that an air duct is formed. Specifically, the first bracket 11 encloses a second air duct 13 with the display screen 2 through the area where the through hole 60 is located, and can enclose an outlet air duct 110 with the display screen 2 through the notch 62, while ensuring the heat dissipation effect on the second heat source 34, reducing the occupation of the internal space of the electronic device, and facilitating the miniaturization design of the electronic device.

[0069] Optionally, the adhesive member 6 includes double-sided sealant.

[0070] like Figure 7 As shown, according to some embodiments of the present application, optionally, the adhesive member 6 includes: at least one second guide block 64 , and the at least one second guide block 64 is disposed in the second air duct 13 to guide the airflow entering the second air duct 13 .

[0071] In this embodiment, the adhesive 6 includes a second guide block 64 arranged in the second air duct 13. The second guide block 64 can guide the airflow in the second air duct 13 so that the airflow flows fully, ensuring that the airflow covers all areas in the second air duct 13, and then cools the heat generated by the second heat source 34 by air cooling, thereby improving the heat dissipation effect of the second heat source 34.

[0072] like Figure 4 As shown, according to some embodiments of the present application, optionally, the main body 1 further includes: a third dustproof net 16 , which is disposed between the fourth through hole 113 of the circuit board 30 and the fourth through hole 113 of the first bracket 11 .

[0073] In this embodiment, the main body 1 also includes a third dustproof net 16, which is arranged between the fourth through hole 113 of the circuit board 30 and the fourth through hole 113 of the first bracket 11, and is used to prevent dust or water vapor from entering other locations inside the electronic device through the second air duct 13.

[0074] like Figure 4 As shown, according to some embodiments of the present application, optionally, the third dustproof net 16 includes: a second net body 160, blocking between the fourth via hole 113 of the circuit board 30 and the fourth via hole 113 of the first bracket 11; a second sealing gasket 162, connected to the second net body 160, and the second sealing gasket 162 is connected to the circuit board 30 or the first bracket 11 and is arranged around the fourth via hole 113.

[0075] In this embodiment, the third dustproof net 16 includes a second net body 160 and a second sealing gasket 162. The second net body 160 is shielded between the fourth through hole 113 of the circuit board 30 and the fourth through hole 113 of the first bracket 11 to prevent dust from entering the body 1. The second sealing gasket 162 is connected to the second net body 160, located between the circuit board 30 and the first bracket 11, and surrounded by the fourth through hole 113, so as to achieve the sealing of the gap between the circuit board 30 and the first bracket 11, prevent the airflow from flowing from the gap between the circuit board 30 and the first bracket 11 to other areas in the body 1, and further prevent the dust or water vapor carried by the airflow from affecting the operation of other electronic components, so that the second dustproof net 15 proposed in this application can achieve both dustproof and sealing.

[0076] Optionally, the second sealing pad 162 includes a sealing cushion, which may be, but is not limited to, a sealing member such as a double-sided tape or silicone.

[0077] like Fig. 9 and Fig.10 As shown, according to some embodiments of the present application, optionally, a second air duct 13 is enclosed between the circuit board 30 and the first bracket 11, and a fifth through hole 302 is provided on the circuit board 30, and the fifth through hole 302 connects the first air duct 12 and the second air duct 13, so that the second air duct 13 is connected to the air inlet 106 through the first air duct 12, and the second heat source 34 is located in the second air duct 13; a sixth through hole 118 is provided on the first bracket 11, and the second air duct 13 is connected to the air outlet duct 110 through the sixth through hole 118.

[0078] In this embodiment, the circuit board 30 and the first bracket 11 enclose the second air duct 13, the fifth through hole 302 on the circuit board 30 connects the first air duct 12 and the second air duct 13, the sixth through hole 118 on the first bracket 11 connects the second air duct 13 and the air outlet duct 110, and the second heat source 34 is directly arranged in the second air duct 13. When the air supply member 5 is turned on, a part of the air flow in the first air duct 12 realizes the heat dissipation of the first heat source 32, and the other part of the air flow enters the second air duct 13 through the fifth through hole 302 to realize the heat dissipation of the second heat source 34 in the second air duct 13. The electronic device proposed in this application realizes the air supply of the first air duct 12 and the second air duct 13 at the same time through the same air supply member 5, and then realizes the active heat dissipation of the first heat source 32 and the second heat source 34 at the same time, thereby improving the utilization rate of the air supply member 5. In addition, the second heat source 34 is directly arranged in the second air duct 13, further improving the heat dissipation effect of the second heat source 34.

[0079] According to some embodiments of the present application, optionally, the fifth through hole 302 is located on a side of the first air duct 12 close to the air inlet 106 .

[0080] In this embodiment, the fifth through hole 302 is located on the side of the first air duct 12 close to the air inlet 106, which can ensure that the airflow entering the second air duct 13 is cold air, and prevent the hot air flow after heat exchange with the first heat source 32 in the first air duct 12 from entering the second air duct 13, thereby improving the heat dissipation effect of the second heat source 34.

[0081] Optionally, when the second bracket 19 also encloses the installation cavity 190 with the circuit board 30, and the installation cavity 190 is provided with a second through hole 191 and a third through hole 192, the air supply member 5 is arranged in the installation cavity 190, the second through hole 191 is arranged opposite to and connected with the air inlet 106, and the third through hole 192 is connected with the first air duct 12, wherein the fifth through hole 302 is arranged close to the third through hole 192 to prevent the airflow entering the first air duct 12 from exchanging heat with the first heat source 32 and then entering the second air duct 13.

[0082] Optionally, when the air supply member 5 is turned on, the airflow enters the installation cavity 190 from the air inlet 106 through the second through hole 191, and then enters the first air duct 12 through the third through hole 192. A part of the airflow fully passes through the first heat source 32 under the action of the first guide block 196 in the first air duct 12 to achieve heat exchange with the first heat source 32, and then flows into the air outlet duct 110, and flows out of the air outlet 108 through the air outlet duct 110; the other part of the airflow enters the second air duct 13 through the fifth through hole 302, cools down the second heat source 34 in the second air duct 13, and then flows to the air outlet duct 110 through the sixth through hole 118, and then flows out of the electronic device from the air outlet 108.

[0083] like Fig. 9 As shown, according to some embodiments of the present application, optionally, a second heat conducting member 116 is provided between the display screen 2 and the first bracket 11 .

[0084] In this embodiment, a second heat conductor 116 is provided between the display screen 2 and the first bracket 11, so that the heat generated by the second heat source 34 can be transferred to the location of the display screen 2 through the first bracket 11 and the second heat conductor 116, thereby performing passive heat dissipation, thereby improving the heat dissipation effect of the second heat source 34.

[0085] Optionally, the second heat-conducting member 116 includes any one of a thermally conductive gel, a heat spreader, and a graphite heat dissipation film.

[0086] like Fig. 9 As shown, according to some embodiments of the present application, optionally, a sink groove 117 is provided on a side of the first bracket 11 facing the circuit board 30 , the second heat source 34 is accommodated in the sink groove 117 , and the circuit board 30 and the sink groove 117 enclose a second air duct 13 .

[0087] In this embodiment, a groove 117 is provided on the first bracket 11, and the groove 117 is used to accommodate the second heat source 34. At the same time, the circuit board 30 can enclose the second air duct 13 with the groove 117, which can not only achieve heat dissipation of the second heat source 34, but also avoid occupying the thickness direction of the electronic device.

[0088] It can be understood that the recess 117 is recessed from the first bracket 11 toward a direction away from the circuit board 30 .

[0089] like Fig.10 As shown, according to some embodiments of the present application, optionally, the main body 1 also includes: a fourth dustproof net 17 , covering the sixth through hole 118 .

[0090] In this embodiment, the body 1 further includes a fourth dustproof net 17 , which blocks the sixth through hole 118 to prevent dust from entering the gap between the display screen 2 and the first bracket 11 through the sixth through hole 118 .

[0091] like Fig.10 As shown, according to some embodiments of the present application, optionally, the body 1 further includes: a third sealing member 18 , which is disposed between the circuit board 30 and the first bracket 11 and surrounds the sink 117 .

[0092] In this embodiment, a third seal 18 is provided between the circuit board 30 and the first bracket 11. The third seal 18 is arranged around the sink 117 to achieve sealing between the circuit board 30 and the first bracket 11 to prevent airflow from entering other areas of the electronic device through the gap between the two.

[0093] Optionally, the third sealing member 18 includes a sealing gasket, such as double-sided tape, silicone, etc.

[0094] like Figure 8 and Fig.10 As shown, according to some embodiments of the present application, optionally, there is a gap 1080 between the end of the display screen 2 and the frame 10, and the air outlet 108 includes the gap 1080; and / or the air outlet 108 includes a through opening 1082 arranged on one side of the frame 10; and / or the air inlet 106 is arranged on the other side of the frame 10.

[0095] In this embodiment, the air outlet 108 can be formed at the gap 1080 between the display screen 2 and the frame 10, so that the frame 10 does not need to be destroyed, thereby ensuring the structural strength of the frame 10; the air outlet 108 can also be set on the frame 10 and located on one side of the frame 10 to ensure the air volume and thus ensure the heat dissipation effect. The air inlet 106 is set on the other side of the frame 10.

[0096] Optionally, the air inlet 106 and the air outlet 108 are respectively located on two opposite sides of the body 1 .

[0097] like Figure 7 , Figure 8 and Fig.10 As shown, according to some embodiments of the present application, optionally, the electronic device also includes: a receiver 7, which is arranged on the first bracket 11, the frame 10 is provided with an anti-leakage sound hole 102, the anti-leakage sound hole 102 is connected to the receiver 7, the air outlet 108 and the anti-leakage sound hole 102 are symmetrically arranged on one side of the frame 10, or the air outlet 108 is the anti-leakage sound hole 102.

[0098] In this embodiment, the electronic device also includes a receiver 7, and the receiver 7 is correspondingly provided with a sound leakage prevention hole 102. The air outlet 108 can be arranged on the same side of the frame 10 as the sound leakage prevention hole 102 and be symmetrically arranged to enhance the aesthetics of the electronic device, or the air outlet 108 is directly constructed as the sound leakage prevention hole 102 to reduce damage to the sound leakage prevention hole 102.

[0099] Optionally, the sound leakage prevention hole 102 is provided with a dust collecting groove 104. When the air outlet 108 and the sound leakage prevention hole 102 are arranged on the same side of the frame 10 and are symmetrically arranged, the dust collecting groove 104 can be connected to the air outlet 108 so that the air outlet 108 can collect dust through the dust collecting groove 104 to prevent dust from clogging the air duct.

[0100] like Figure 8 and Fig.10 As shown, according to some embodiments of the present application, optionally, it also includes: a first shielding member 36, which is covered on the first heat source 32 and sealed to the circuit board 30; and a second shielding member 38, which is covered on the second heat source 34 and sealed to the circuit board 30.

[0101] In this embodiment, the first heat source 32 is sealed by a first shielding cover, and the second heat source 34 is sealed by a second shielding cover. On the one hand, it can prevent dust and water vapor in the airflow from affecting the operation of the first heat source 32 or the second heat source 34. On the other hand, the first heat source 32 and the second heat source 34 can transfer heat through the corresponding first shielding cover and the second shielding cover to achieve heat dissipation.

[0102] Optionally, the first shielding cover and the second shielding cover are made of aluminum material with high thermal conductivity, and shielding parts such as radio frequency can be used.

[0103] In specific applications, the present application aims to provide a sandwich-surrounding air duct heat dissipation structure (for example, the rear air duct and the front air duct perform sandwich-type lamination heat dissipation on the front and rear heat sources on the middle PCB board), and the rear heat source air duct is formed by directly sealing the upper cover of the bracket (for example, the second bracket 19) with the printed circuit board (Printed Circuit Board, PCB), directly dissipating the heat of the rear heat source (for example, the first heat source 32), reducing the occupation of the overall space by the rear bracket and the loss of heat dissipation efficiency; utilizing the gap between the touch screen (for example, the display screen 2) and the body 1, and sealing the touch screen double-sided adhesive (for example, the adhesive 6) to achieve heat dissipation of the front heat source (for example, the second heat source 34), improve the utilization rate of heat dissipation of the fan (for example, the air supply part 5), or add an air duct structure (for example, the second air duct 13) to replace the VC (Vapor Chamber, vacuum chamber heat sink heat dissipation technology) heat sink or graphite heat dissipation film and other passive heat dissipation materials or structures. The present application achieves the effect of optimizing space and improving heat dissipation efficiency, while also saving part of the passive heat dissipation structure. In addition, fan heat dissipation and passive heat dissipation can be effectively combined to maximize heat dissipation efficiency.

[0104] According to one embodiment of the present application, the electronic device includes:

[0105] Back cover assembly 8: attached to the main body 1 with double-sided tape.

[0106] PCB assembly: includes a PCB board, a front heat source, a rear heat source and a shielding bracket for protecting them (such as a first shielding member 36 and a second shielding member 38), a battery 4 and a sub-board structure.

[0107] The rear support assembly (eg, the second support 19) includes a sealing auxiliary material and an external dustproof auxiliary material.

[0108] Main body 1: includes dustproof nets attached thereto (eg, a first dustproof net 14, a second dustproof net 15, a third dustproof net 16 and a fourth dustproof net 17).

[0109] And mechanisms such as a receiver 7, a fan (such as an air supply member 5), a touch screen double-sided tape (such as an adhesive member 6), and a touch screen module (such as a display screen 2).

[0110] like Figure 4 As shown, the main body 1 is provided with an opening (for example, an air inlet 106), and the rear bracket is provided with a rear bracket opening (for example, a second through hole 191) corresponding to the opening on the main body 1. Air enters the electronic device through the air inlet 106 and the rear bracket opening. The main body 1 and the rear bracket are sealed by a dustproof net structure (for example, a first dustproof net 14). The dustproof net has a cushion structure (which can be but is not limited to double-sided tape, silicone and other sealing materials or structures), which pre-presses or bonds the main body 1 and the rear bracket to prevent water or dust from entering the interior of the device through the gap between the two.

[0111] The fan is assembled on the rear bracket, and the fan is wrapped by the rear bracket on all sides in the horizontal direction to limit, fix and protect the fan. The rear bracket frame around the fan is sealed with the main body 1 along the Z direction (for example, the thickness direction of the electronic device) through a sealing pad (for example, the first sealing member 197) to prevent water vapor entering through the air inlet 106 from entering the interior of the device. The cooling air generated by the fan enters the interior of the device through the bracket through holes (for example, the third through holes 192) to dissipate heat from heat sources (for example, the first heat source 32 and the second heat source 34).

[0112] Part of the cooling air enters the rear air duct (e.g., the first air duct 12) formed by the rear bracket and the PCB board through the air duct (e.g., the installation cavity 190). The rear air duct is formed by the Z-direction gap between the rear bracket and the PCB board. The sealing cushions (e.g., the second sealing member 198) on the surrounding bones of the PCB board and the rear bracket are sealed to form a closed cavity to prevent water vapor and the like from entering other positions of the device. In the rear air duct, rear heat sources such as IC (Integrated Circuit) devices that are patched on the rear end of the PCB (close to the side of the rear cover assembly 8) are isolated from water vapor and wind from the air duct by a closed rear shielding member (e.g., the first shielding member 36) to prevent water vapor and the like from entering other positions of the device.

[0113] like Figure 4 and Figure 5As shown, the cooling wind generated by the fan enters the rear air duct through the bracket through hole (such as the third through hole 192), and is diverted by the rear bracket guide block (such as the first guide block 196). After being diverted through the rear channel, the cooling wind fully cools and dissipates the rear shielding member wrapped around the rear heat source, and finally enters the outlet air duct 110 through the outlet through hole (such as the first through hole 111). The rear shielding member is made of aluminum with a high thermal conductivity, and the rear shielding member can reuse the shielding member structure such as radio frequency inside the electronic device. While playing a protective and shielding role, it can effectively conduct the heat from the rear heat source, and effectively protect against water vapor from the air duct, and avoid the failure of the heat source mechanism due to liquid ingress.

[0114] Rear bracket assembly description: Figure 6 The rear bracket assembly for assembling the fan includes a first seal 197, a second seal 198 and a rear bracket, wherein the rear bracket is provided with a guide block, the shape of the guide block is not limited to an arc, and may be an S-shaped, annular or other structure that can guide the cooling air; the second seal 198 is pasted on the surrounding frame of the rear bracket (such as the first surrounding plate 195), and forms a complete sealed cavity structure with the PCB board, namely the rear air duct.

[0115] Another part of the cooling air passes through the air inlet holes on the main body 1 and the PCB board (for example, the fourth through hole 113) and enters the front air duct (for example, the second air duct 13). The PCB board and the main body 1 are sealed and dustproof along the Z direction by an inner dustproof net (for example, the second dustproof net 15), wherein the inner dustproof net includes a dustproof net and a sealing cushion structure. The dustproof net is used to prevent dust from entering the interior of the device from the outside through the front air duct. The sealing cushion structure pre-compresses and seals the Z-direction gap between the PCB board and the main body 1 to prevent water vapor and the like from entering other positions inside the device through the gap between the two.

[0116] The front air duct is the gap between the touch screen module and the body 1, and the front air duct cavity is formed by the touch screen double-sided adhesive. The heat generated by the front heat source (such as the second heat source 34) is transferred to the front air duct through the front shielding member (such as the second shielding member 38), the thermal conductive gel, and finally through the body 1. Figure 7 As shown (the touch screen module is in an exploded view), after the cooling air from the air inlet hole (for example, the fourth hole 113) enters the front air duct, the airflow is guided by the guide block (for example, the second guide block 64) formed by the double-sided adhesive of the touch screen, so that the cooling air flows fully, ensuring that all areas of the front air duct are covered, and the heat from the front heat source is cooled by air.

[0117] like Figure 7 and Figure 8As shown, the hot air formed by cooling the front air duct flows through the air outlet duct 110 formed by the touch screen double-sided adhesive seal and the touch screen module and the body 1, and then flows to the outside of the device through the micro-slit structure or air outlet 108 on the exterior surface of the touch screen module and the body 1. The hot air from the rear air duct flows into the air outlet duct 110 through the air outlet holes (such as the first hole 111) on the PCB board and the body 1, wherein the air outlet holes between the PCB board and the body 1 are sealed by the inner dustproof net, wherein the inner dustproof net includes a dustproof net and a sealing cushion structure, the dustproof net is dustproof to prevent dust from the outside from entering the inside of the device through the front wind, and the sealing cushion structure pre-compresses and seals the Z-direction gap between the PCB board and the body 1 to prevent water vapor and other structures from entering other positions inside the device through the gap between the two.

[0118] Optionally, the air outlet 108 can be shared with the sound leakage prevention hole 102 in the receiver 7, or designed to be a symmetrical structure with the same structure, so as to avoid the inharmonious appearance after adding the air outlet 108, improve the appearance of the electronic device, and at the same time, the dust storage groove 104 in the micro-slit of the receiver 7 can be reused to prevent the air outlet duct 110 from clogging the channel due to dust accumulation.

[0119] The beneficial effects of this embodiment are as follows: by directly sealing the rear bracket and the PCB board to form an air duct cavity (such as the first air duct 12), the equipment space is saved, the heat dissipation path is reduced, and the heat dissipation efficiency is effectively improved. The front air duct formed between the touch screen module and the first bracket 11 can make the air cooling and heat dissipation act on the heat source at the touch screen end, which can save passive heat dissipation materials or structures such as VC heat spreader and graphite heat dissipation film at the touch screen end; and this utilizes the gap between the touch screen module and the main body 1, saving space for placing passive heat dissipation materials and improving the space utilization of the whole machine. In addition, the front and rear heat sources on the middle PCB board are sandwiched and laminated through the rear air duct and the front air duct, and at the same time, combined with the guide structure, the air cooling and heat dissipation area is maximized, so that the heat source is in a surround air cooling and heat dissipation environment, and the heat dissipation effect is improved.

[0120] According to one embodiment of the present application, Fig. 9 and Fig.10 As shown, the rear air duct in this embodiment is the same as the previous embodiment.

[0121] The front air duct (e.g., the second air duct 13) is as follows: the cooling air generated by the fan passes through the bracket via (e.g., the third via 192), and then enters the front air duct through the air inlet via (e.g., the fifth via 302) on the PCB. The front air duct is composed of the Z-direction gap between the PCB board and the body 1. The periphery of the front air duct is formed by the surrounding bone of the body 1 through the sealing cushion and the PCB board pre-pressed and sealed to form a closed air duct structure. The sealing cushion (e.g., the third seal 18) can prevent the wind and water vapor in the air duct structure from entering other positions of the device. At the same time, the gap between the touch screen module and the first bracket 11 is filled with a conventional VC heat spreader or a graphite heat dissipation film as a passive heat dissipation structure.

[0122] The heat dissipation of the front heat source can be conducted to the front air duct through the front shielding member, and the heat can be conducted to the VC heat spreader or graphite heat dissipation film through the thermal conductive gel and the back of the main body 1 for passive heat dissipation. At the same time, the heat of the front heat source entering the front air duct through the shielding member can be simultaneously dissipated by the cooling air generated by the fan for air cooling.

[0123] like Fig.10 As shown, the hot air in the front channel after working can be discharged through the air outlet hole (such as the sixth hole 118) of the body 1 to the touch screen surface, and finally conducted to the outside of the whole device through the air outlet duct 110. The air outlet hole is sealed and dustproof with an internal dustproof net to prevent external dust from entering the interior of the device.

[0124] Beneficial effects of this embodiment:

[0125] By utilizing the gap between the PCB board and the main body 1 to form a sealed air duct, combined with a passive heat dissipation structure such as a VC heat spreader or a graphite heat dissipation film, the heat dissipation effect on the front heat source of the equipment is enhanced, and the heat dissipation effect is maximized by combining active heat dissipation with a fan and a passive heat dissipation structure.

[0126] Similar designs can also be used for other PCBs such as antenna boards. At the same time, the heat source mechanism is not limited to the mechanism on the PCB board, and can be other heat-generating mechanisms such as cameras, motors, batteries 4, etc. in terminal equipment or electronic devices.

[0127] Optionally, the electronic device includes a mobile phone, a wearable device, a tablet computer, etc.

[0128] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0129] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A body, wherein the body is provided with an air inlet and an air outlet; A circuit board assembly is arranged in the body, and a first air duct and a second air duct are respectively arranged on opposite sides of the circuit board assembly, the first air duct is connected to the air inlet and the air outlet, and the second air duct is connected to the air inlet and the air outlet, the circuit board assembly includes a circuit board, a first heat source and a second heat source, the first heat source and the second heat source are respectively arranged on both sides of the circuit board, the first heat source is arranged in the first air duct, and the second air duct is used to dissipate heat from the second heat source; An air supply member is used to supply air to the first air duct and the second air duct.

2. The electronic device according to claim 1, characterized in that: The body comprises: Frame; A first bracket, wherein the frame is disposed around the first bracket, and the circuit board assembly is disposed on one side of the first bracket; A second bracket is disposed on a side of the circuit board away from the first bracket, and the second bracket and the circuit board enclose the first air duct; A display screen is arranged on the other side of the first bracket, and the display screen and the first bracket enclose an air outlet duct, and the first air duct and the second air duct are both connected to the air outlet through the air outlet duct.

3. The electronic device according to claim 2, characterized in that: The second bracket comprises: plate body; A first enclosure is arranged on one side of the plate body, and one end of the first enclosure away from the plate body contacts the circuit board. The plate body, the first enclosure and the circuit board together enclose the first air duct. The first bracket and the circuit board are both provided with a first through hole, and the first air duct is connected to the air outlet duct through the first through hole.

4. The electronic device according to claim 3, characterized in that: The second bracket also includes: At least one first guide block is arranged on the plate body and located in the first air duct. The first guide block is arranged opposite to the first heat source and is used for guiding the airflow entering the first air duct.

5. The electronic device according to claim 3, characterized in that: The second bracket also includes: A second enclosure is arranged on one side of the plate body, and one end of the second enclosure away from the plate body contacts the circuit board. The plate body, the second enclosure and the circuit board together enclose an installation cavity. The installation cavity is provided with a second through hole and a third through hole. The second through hole is arranged opposite to and communicated with the air inlet, and the third through hole is communicated with the first air duct and the second air duct. The air supply member is arranged in the installation cavity.

6. The electronic device according to claim 5, characterized in that: The second bracket also includes: A first sealing member is provided between the second enclosure plate and the first bracket, and is used to seal a gap between the second enclosure plate and the first bracket; and / or The second sealing member is disposed between the first enclosure plate and the first bracket and is used for sealing the gap between the first enclosure plate and the first bracket.

7. The electronic device according to claim 5, characterized in that: The body also includes: A first dustproof net is provided between the air inlet and the second through hole; and / or The second dustproof net covers the first through hole.

8. The electronic device according to any one of claims 2 to 7, characterized in that: The display screen and the first bracket together enclose the second air duct; The circuit board and the first bracket are both provided with a fourth via hole, the fourth via hole connecting the first air duct and the second air duct, so that the second air duct is connected with the air inlet through the fourth via hole, and the second heat source is arranged opposite to the second air duct.

9. The electronic device according to claim 8, characterized in that: The fourth through hole is located on a side of the first air duct close to the air inlet; and / or A first heat conductor is provided between the second heat source and the first bracket.

10. The electronic device according to claim 8, characterized in that: Also includes: An adhesive member, bonded between the display screen and the first bracket, the adhesive member is provided with a through hole and a notch, and the notch is connected to the through hole; The first bracket and the display screen form the second air duct through the through hole, and the first bracket and the display screen form the air outlet duct through the notch.

11. The electronic device according to claim 10, characterized in that: The adhesive member comprises: At least one second guide block is disposed in the second air duct and is used for guiding the airflow entering the second air duct.

12. The electronic device according to claim 8, characterized in that: The body also includes: The third dustproof net is arranged between the fourth through hole of the circuit board and the fourth through hole of the first bracket.

13. The electronic device according to any one of claims 2 to 7, characterized in that: The circuit board and the first bracket together enclose the second air duct; A fifth via hole is provided on the circuit board, the fifth via hole is connected to the first air duct and the second air duct, so that the second air duct is connected to the air inlet through the first air duct, and the second heat source is located in the second air duct; The first bracket is provided with a sixth through hole, and the second air duct is connected with the air outlet duct through the sixth through hole.

14. The electronic device according to claim 13, characterized in that: The fifth through hole is located on a side of the first air duct close to the air inlet; and / or A second heat conducting member is disposed between the display screen and the first bracket.

15. The electronic device according to claim 13, characterized in that: A sinking groove is provided on a side of the first bracket facing the circuit board, the second heat source is accommodated in the sinking groove, and the circuit board and the sinking groove together enclose the second air duct.

16. The electronic device according to claim 15, characterized in that: The body also includes: a fourth dustproof net, covering the sixth through hole; and / or The third sealing member is arranged between the circuit board and the first bracket and surrounds the sink.

17. The electronic device according to any one of claims 2 to 7, characterized in that: There is a gap between the end of the display screen and the frame, and the air outlet includes the gap; and / or The air outlet comprises a through opening provided on one side of the frame; and / or The air inlet is arranged on the other side of the frame.

18. The electronic device according to any one of claims 2 to 7, characterized in that: Also includes: The receiver is arranged on the first bracket, the frame is provided with a sound leakage prevention hole, the sound leakage prevention hole is connected to the receiver, the air outlet and the sound leakage prevention hole are symmetrically arranged on one side of the frame, or the air outlet is the sound leakage prevention hole.

19. The electronic device according to any one of claims 1 to 7, characterized in that: Also includes: A first shielding member, covering the first heat source and sealedly connected to the circuit board; The second shielding member is disposed on the second heat source and is sealed and connected to the circuit board.

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