A COB-based LED light-emitting panel and its manufacturing method

Abstract

The present invention discloses an LED light-emitting panel based on COB packaging and a manufacturing method thereof, wherein the LED light-emitting panel has a simple structure and is easy to implement. The arrangement of the unit peripheral wall portion of the first insulating material layer is convenient for enclosing each LED light-emitting unit area to form an independent color mixing space, thereby avoiding light color crosstalk between the LED light-emitting unit areas and having good practicality. The arrangement of the first raised portion in the unit peripheral wall portion is used to separate the two soldering pads of the same LED chip and to facilitate the bottom of the LED chip to be supported thereon, which plays a separating and supporting role, so that when the LED chip is soldered, the solder on the two soldering pads of the same LED chip is not easy to be short-circuited due to pressure, thereby having good practicality, and the solder can easily fill the gap between the soldering pad and the first raised portion and force out the air between them, thereby improving the mounting and welding effect, thereby having good practicality. The arrangement of the second raised portion is used to separate the soldering pads between adjacent LED chips. In this way, during implementation, the solder on the soldering pads between adjacent LED chips is not easy to be short-circuited due to pressure, which is conducive to ensuring the quality of the finished product and having good practicality.

Description

Technical Field

[0001] The invention relates to a COB package-based LED light-emitting panel and a manufacturing method thereof. Background Art

[0002] Mini LED displays generally utilize the COB packaging process. While the existing Mini LED COB packaging process boasts the advantages of high efficiency and suitability for mass production, it also suffers from defects such as light-color crosstalk, pixel color loss, and display "caterpillar" effects that impact product quality. These defects arise because the COB packaging process fails to provide independent color mixing space for the individual pixels comprised of the LED RGB tri-color chips. This is affected by the color mixing effect of the surrounding pixel-emitting chips. Furthermore, residual flux residue and residual gas remain on the bottom of the LED chip after COB packaging. If the LED chip is not tightly sealed around the perimeter, the LED chip electrodes are susceptible to corrosion and damage, resulting in defective products. Therefore, it is necessary to address these issues. Summary of the Invention

[0003] The present invention overcomes the deficiencies of the above-mentioned technologies and provides an LED light-emitting panel based on COB packaging and a manufacturing method thereof.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A COB package-based LED light-emitting panel includes a PCB board 1, a circuit layer 2 and a first insulating material layer 3 are provided on the PCB board 1, the first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing each LED light-emitting unit area, the circuit layer 2 is provided with a plurality of solder pads 21 located in the area enclosed by the unit peripheral wall portion 31 for electrically connecting a plurality of LED chips 4, the first insulating material layer 3 also includes a solder pad 21 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two solder pads 21 of the same LED chip 4 and facilitating connection The bottom of the LED chip 4 supports the first protrusion 32 thereon, the top height of the first protrusion 32 is higher than the top height of the soldering pad 21, and the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall body 31. The first insulating material layer 3 also includes a plurality of second protrusions 33 located in the area surrounded by the unit peripheral wall body 31 and connected to the unit peripheral wall body 31 and / or connected to the first protrusion 32 for separating the soldering pads 21 between adjacent LED chips 4, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall body 31.

[0006] Preferably, the first insulating material layer 3 further includes a first connecting portion 301 for connecting a plurality of adjacent unit peripheral wall portions 31 together.

[0007] Preferably, a connection hole 11 connected to the first connection portion 301 is provided on the back side of the PCB board 1 , and the connection hole 11 is filled with a second connection portion 302 connected to the first connection portion 301 .

[0008] Preferably, the connection hole 11 on the back side of the PCB board 1 is a countersunk hole.

[0009] Preferably, the first insulating material layer 3 is an insulating plastic layer.

[0010] Preferably, the first insulating material layer 3 is made of black PPA material.

[0011] Preferably, the number of the solder pads 21 in the area of ​​the peripheral wall portion 31 of each unit is 6 and distributed in 3*2 horizontal rows, and a flip-chip LED chip is connected between the left and right solder pads 21 in each row.

[0012] This case also protects a method for manufacturing a COB-based LED light-emitting panel, which includes the following steps:

[0013] Step 1: Prepare a PCB board 1 with a required circuit layer 2 and required solder pads 21;

[0014] Step 2: Install an injection molding mold on the PCB board 1, and then perform injection molding to form a first insulating material layer 3 and then demold the mold, wherein the first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing each LED light-emitting unit area, a first protrusion 32 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two solder pads 21 of the same LED chip 4 and facilitating support for the bottom of the LED chip 4 thereon, and a second protrusion 33 for separating the solder pads 21 between adjacent LED chips 4, wherein the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall portion 31, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall portion 31;

[0015] Step 3: Use a machine to apply solder to the pad 21, then connect the LED chip 4 and make the bottom of the LED chip 4 supported on the first protrusion 32 at the corresponding position, and finally perform a die bonding process.

[0016] Preferably, in step one, a plurality of connection holes 11 connected to the front side are provided on the back side of the PCB board 1, and the position of the connection holes 11 is the feed port during injection molding in step two. After the injection molding is completed, a first connection portion 301 connected to the first insulating material layer 3 is formed on the connection hole 11.

[0017] Preferably, the connecting hole 11 is a countersunk hole.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The structure of the LED light-emitting panel in this case is simple and easy to implement. The arrangement of the unit peripheral wall portion of the first insulating material layer is convenient for enclosing each LED light-emitting unit area to form an independent color mixing space, thereby avoiding light color crosstalk between the LED light-emitting unit areas, and has good practicality. The arrangement of the first raised portion in the unit peripheral wall portion is used to separate the two solder pads of the same LED chip and facilitate the bottom of the LED chip to be supported thereon. It plays a role of separation and support, so that when soldering the LED chip, the solder on the two solder pads of the same LED chip is not easy to short-circuit due to pressure, and has good practicality. In addition, the solder can easily fill the gap between the solder pad and the first raised portion and force out the air between them, thereby improving the mounting and soldering effect, and has good practicality. The arrangement of the second raised portion is used to separate the solder pads between adjacent LED chips. In this way, during implementation, the solder on the solder pads between adjacent LED chips is not easy to short-circuit due to pressure, which is conducive to ensuring the quality of the finished product and has good practicality.

[0020] 2. In this case, a manufacturing method of an LED light-emitting panel based on COB packaging is easy to implement. The first insulating material layer is formed by mold injection molding, which is easy to implement. Compared with the technical solution of applying ink or brushing ink, it is easy to form the required parts of different heights by mold injection molding; the arrangement of the first protrusion in the outer peripheral wall of the unit described in this case is used to separate the two solder pads of the same LED chip and facilitate the bottom of the LED chip to support it. It plays a separating and supporting role, so that when soldering the LED chip, the solder on the two solder pads of the same LED chip is not easy to short-circuit due to pressure, which is practical, and the solder can easily fill the gap between the solder pad and the first protrusion and force out the air between them, thereby improving the mounting welding effect, which is practical; the arrangement of the second protrusion is used to separate the solder pads between adjacent LED chips. In this way, during implementation, the solder on the solder pads between adjacent LED chips is not easy to short-circuit due to pressure, which is conducive to ensuring the quality of the finished product and has good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is one of the structural diagrams of this case.

[0022] Figure 2This is the second structural diagram of this case.

[0023] Figure 3 This is the third structural diagram of this case.

[0024] Figure 4 This is the fourth structural diagram of this case.

[0025] Figure 5 This is the fifth structural diagram of this case. DETAILED DESCRIPTION

[0026] The following examples further illustrate the features of the present invention and other related features to facilitate understanding by those skilled in the art:

[0027] like Figures 1 to 5 As shown, an LED light-emitting panel based on COB packaging includes a PCB board 1, on which a circuit layer 2 and a first insulating material layer 3 are provided. The first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing each LED light-emitting unit area. The circuit layer 2 is provided with a plurality of solder pads 21 located in the area enclosed by the unit peripheral wall portion 31 for electrically connecting a plurality of LED chips 4. The first insulating material layer 3 also includes a solder pad 21 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating and facilitating the electrical connection of two solder pads 21 of the same LED chip 4. The first protrusion 32 is provided for supporting the bottom of the LED chip 4, the top height of the first protrusion 32 is higher than the top height of the soldering pad 21, and the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall body 31. The first insulating material layer 3 also includes a plurality of second protrusions 33 located in the area surrounded by the unit peripheral wall body 31 and connected to the unit peripheral wall body 31 and / or connected to the first protrusion 32 for separating the soldering pads 21 between adjacent LED chips 4, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall body 31.

[0028] As described above, the structure of the LED light-emitting panel in this case is simple and easy to implement. The setting of the unit peripheral wall portion 31 of the first insulating material layer 3 is convenient for enclosing each LED light-emitting unit area to form an independent color mixing space, thereby avoiding light color crosstalk between the LED light-emitting unit areas, and has good practicality. The setting of the first protrusion 32 in the unit peripheral wall portion 31 is used to separate the two soldering pads 21 of the same LED chip 4 and facilitate the bottom of the LED chip 4 to support it. It plays a separating and supporting role, so that when soldering the LED chip 4, the solder on the two soldering pads 21 of the same LED chip 4 is not easy to short-circuit due to pressure, and has good practicality. The solder can easily fill the gap between the soldering pad 21 and the first protrusion 32 and force out the air between them, thereby improving the mounting welding effect, and has good practicality. The setting of the second protrusion 33 is used to separate the soldering pads 21 between adjacent LED chips 4. In this way, during implementation, the solder on the soldering pads 21 between adjacent LED chips 4 is not easy to short-circuit due to pressure, which is conducive to ensuring the quality of the finished product and has good practicality.

[0029] As described above, when the packaging is completed, the area surrounded by the unit peripheral wall portion 31 is filled with packaging glue or the entire surface of the LED light-emitting panel is covered with packaging glue, so as to make the product packaging more reliable and stable.

[0030] like Figure 3 As shown, in a specific implementation, the first insulating material layer 3 further includes a first connecting portion 301 for connecting a plurality of adjacent unit peripheral wall portions 31 together, which is beneficial to enhancing the connection stability.

[0031] like Figure 3 、 Figure 4 As shown, in a specific implementation, a connection hole 11 connected to the first connection part 301 is provided on the back of the PCB board 1, and the connection hole 11 is filled with a second connection part 302 connected to the first connection part 301, which is beneficial to enhance the connection stability and reduce the falling off of the unit outer wall part 31 and the first connection part 301.

[0032] As described above, in a specific implementation, the connection hole 11 on the back side of the PCB board 1 is a countersunk hole.

[0033] As described above, in a specific implementation, the first insulating material layer 3 is an insulating plastic layer, which can be injection molded, and preferably uses black PPA material.

[0034] As described above, in specific implementation, the number of the solder pads 21 in the area of ​​the peripheral wall portion 31 of each unit is 6 and distributed in 3*2 horizontal rows, and a flip-chip LED chip is connected between the left and right solder pads 21 in each row.

[0035] As mentioned above, this case also discloses a method for manufacturing an LED light-emitting panel based on COB packaging, which includes the following steps:

[0036] Step 1: Prepare a PCB board 1 with a required circuit layer 2 and required solder pads 21;

[0037] Step 2: Install an injection molding mold on the PCB board 1, and then perform injection molding to form a first insulating material layer 3 and then demold the mold, wherein the first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing each LED light-emitting unit area, a first protrusion 32 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two solder pads 21 of the same LED chip 4 and facilitating support for the bottom of the LED chip 4 thereon, and a second protrusion 33 for separating the solder pads 21 between adjacent LED chips 4, wherein the top height of the first protrusion 32 is lower than the top height of the unit peripheral wall portion 31, and the top height of the second protrusion 33 is lower than the top height of the unit peripheral wall portion 31;

[0038] Step 3: Use a machine to apply solder to the pad 21, then connect the LED chip 4 and make the bottom of the LED chip 4 supported on the first protrusion 32 at the corresponding position, and finally perform a die bonding process.

[0039] As described above, the manufacturing method of the LED light-emitting panel based on COB packaging in this case is easy to implement. The first insulating material layer 3 is formed by mold injection molding, which is easy to implement. Compared with the technical solution of applying ink or brushing ink, the required parts of different heights can be easily formed by mold injection molding. The first protrusion 32 in the unit peripheral wall 31 in this case is provided to separate the two solder pads 21 of the same LED chip 4 and facilitate the bottom of the LED chip 4 to be supported thereon. It plays a separating and supporting role, so that when soldering the LED chip 4, the solder on the two solder pads 21 of the same LED chip 4 is not easily short-circuited due to pressure, which is good practicality. In addition, the solder can easily fill the gap between the solder pad 21 and the first protrusion 32 and force out the air between them, thereby improving the mounting and soldering effect, which is good practicality. The second protrusion 33 is provided to separate the solder pads 21 between adjacent LED chips 4. In this way, during implementation, the solder on the solder pads 21 between adjacent LED chips 4 is not easily short-circuited due to pressure, which is conducive to ensuring the quality of the finished product and has good practicality.

[0040] As described above, in step one, a number of connection holes 11 connected to the front side of the PCB board 1 are subsequently provided on the back side. The position of the connection holes 11 is the feed port during injection molding in step two. After the injection molding is completed, a first connection portion 301 connected to the first insulating material layer 3 is formed on the connection hole 11, which is beneficial to enhancing the stability of the first insulating material layer 3.

[0041] As described above, the connecting hole 11 is a countersunk hole, so that the first connecting portion 301 therein is not easy to move toward the other end and fall out.

[0042] As mentioned above, this case protects an LED light-emitting panel based on COB packaging and its manufacturing method. All technical solutions that are identical or similar to the structure of this case should be deemed to fall within the scope of protection of this case.

Claims

1. A LED light-emitting panel based on COB packaging, characterized in that The invention comprises a PCB board (1), wherein the PCB board (1) is provided with a circuit layer (2) and a first insulating material layer (3), wherein the first insulating material layer (3) comprises a unit peripheral wall portion (31) for enclosing a LED light-emitting unit area, wherein the circuit layer (2) is provided with a plurality of solder pads (21) located in the area enclosed by the unit peripheral wall portion (31) for electrically connecting a plurality of LED chips (4), and wherein the first insulating material layer (3) further comprises a solder pad located in the area enclosed by the unit peripheral wall portion (31) and connected to the unit peripheral wall portion (31) for separating two solder pads (21) of the same LED chip (4) and facilitating the connection of the LED chip (4). The bottom supports a first protrusion (32) thereon, the top height of the first protrusion (32) being higher than the top height of the soldering pad (21), and the top height of the first protrusion (32) being lower than the top height of the unit peripheral wall portion (31), the first insulating material layer (3) further comprising a plurality of second protrusions (33) located in an area surrounded by the unit peripheral wall portion (31) and connected to the unit peripheral wall portion (31) and / or connected to the first protrusion (32) for separating the soldering pads (21) between adjacent LED chips (4), the top height of the second protrusion (33) being lower than the top height of the unit peripheral wall portion (31).

2. The LED light emitting panel based on COB packaging according to claim 1, characterized in that The first insulating material layer (3) further comprises a first connecting portion (301) for connecting a plurality of adjacent unit peripheral wall portions (31) together.

3. The LED light emitting panel based on COB packaging according to claim 2, characterized in that A connection hole (11) connected to the first connection part (301) is provided on the back of the PCB board (1), and the connection hole (11) is filled with a second connection part (302) connected to the first connection part (301).

4. The LED light emitting panel based on COB packaging according to claim 3, characterized in that The connection hole (11) on the back side of the PCB board (1) is a countersunk hole.

5. The LED light emitting panel based on COB packaging according to claim 1, characterized in that The first insulating material layer (3) is an insulating plastic layer.

6. The LED light emitting panel based on COB packaging according to claim 5, characterized in that The first insulating material layer (3) is made of black PPA material.

7. The LED light emitting panel based on COB packaging according to claim 1, characterized in that The solder pads (21) in the area of ​​the peripheral wall portion (31) of each unit are 6 in number and distributed in 3*2 horizontal rows, and a flip-chip LED chip is connected between the left and right solder pads (21) in each row.

8. A method for manufacturing a LED light-emitting panel based on COB packaging, characterized in that The following steps are included: Step 1: Prepare a PCB board (1), wherein the PCB board (1) has a required circuit layer (2) and required solder pads (21); Step 2: Installing an injection molding mold on the PCB board (1), then performing injection molding, and demoulding after forming a first insulating material layer (3), wherein the first insulating material layer (3) includes a unit peripheral wall portion (31) for enclosing each LED light-emitting unit area, a first protrusion (32) located in the area enclosed by the unit peripheral wall portion (31) and connected to the unit peripheral wall portion (31) for separating two solder pads (21) of the same LED chip (4) and facilitating the bottom of the LED chip (4) to be supported thereon, and a second protrusion (33) for separating the solder pads (21) between adjacent LED chips (4), wherein the top height of the first protrusion (32) is lower than the top height of the unit peripheral wall portion (31), and the top height of the second protrusion (33) is lower than the top height of the unit peripheral wall portion (31); Step 3: Use a machine to apply solder to the pad (21), then connect the LED chip (4) and make the bottom of the LED chip (4) supported on the first protrusion (32) at the corresponding position, and finally perform a die-bonding process.

9. The method for manufacturing a COB-based LED light-emitting panel according to claim 8, characterized in that In step 1, a plurality of connection holes (11) are provided on the back side of the PCB board (1) so as to be connected to the front side. The connection holes (11) are located at the feed inlet during the injection molding in step 2. After the injection molding is completed, a first connection portion (301) connected to the first insulating material layer (3) is formed on the connection holes (11).

10. The method for manufacturing a COB-based LED light-emitting panel according to claim 9, characterized in that The connecting hole (11) is a countersunk hole.

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