Display panel and display device

Abstract

The embodiment of the invention provides a display panel and a display device, relates to the technical field of display, and is used for improving the visible light and infrared light transmittance of an FDC area and improving the shooting quality of a camera. The display panel is provided with a display area. The display area comprises a main display area and an auxiliary display area located on at least one side of the main display area. The display panel comprises a substrate and a packaging layer located on one side of the substrate. The packaging layer comprises a first sub-part located in an auxiliary display area and a second sub-part located in a main display area. Wherein the material of the first sub-part comprises at least one of epoxy resin and silicon resin; and the material of the second sub-part comprises an inorganic material. The display panel is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is a technology that uses luminescent materials to emit light under the drive of electric current to achieve display. Among them, the high-performance full-screen partially transparent new display direction represented by active-driven organic light-emitting diode (Active Matrix OLED, AMOLED) technology is accelerating its entry into the smart terminal market such as high-end smartphones and wearable devices with its unique performance advantages in display performance, lightness, and bendability. In the full-screen partially transparent new display direction, the specific representative is the Full Display with Camera (FDC) technology. FDC technology refers to the technical solution of canceling the camera hole of the front camera on the original screen and building the front camera under the display screen. Compared with the bangs screen and water drop screen on the market now, a true full screen without holes is realized.

[0003] In the FDC OLED display substrate, the visible light and infrared light transmittance in the FDC area is low, which affects the camera's shooting quality. Summary of the invention

[0004] The purpose of the embodiments of the present disclosure is to provide a display panel and a display device, which are used to improve the visible light and infrared light transmittance in the FDC area and improve the shooting quality of the camera.

[0005] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0006] On the one hand, a display panel is provided, which has a display area; the display area includes: a main display area and a sub-display area located on at least one side of the main display area; the display panel includes: a substrate and an encapsulation layer located on one side of the substrate, the encapsulation layer includes: a first sub-portion located in the sub-display area and a second sub-portion located in the main display area; wherein the material of the first sub-portion includes: at least one of epoxy resin and silicone resin; the material of the second sub-portion includes: an inorganic material.

[0007] In the above display panel, epoxy resin and silicone resin have high light transmittance. Therefore, using epoxy resin and / or silicone resin as the material of the first sub-portion of the secondary display area can improve the visible light transmittance and infrared light transmittance of the secondary display area, thereby improving the shooting quality of the camera under the screen. Since inorganic materials have a good packaging effect, the material of the second sub-portion located in the main display area includes inorganic materials, which can ensure that the reliability of the packaging of the main display area is strong.

[0008] In some embodiments, the display panel further includes: an organic layer, an inorganic layer and a metal layer located between the substrate and the encapsulation layer; the secondary display area includes: a light-transmitting area, a pixel area and a connecting area located between the light-transmitting area and the pixel area; the pixel area is provided with sub-pixels; in the secondary display area, the organic layer includes: a portion located in the light-transmitting area, a portion located in the pixel area and a portion located in the connecting area, the inorganic layer includes: a portion located in the pixel area and a portion located in the connecting area, and the metal layer includes: a portion located in the pixel area and a portion located in the connecting area.

[0009] In some embodiments, the organic layer includes at least one of a first planarization layer, a second planarization layer, and a pixel definition layer.

[0010] In some embodiments, the thickness of the first planarization layer located in the light-transmitting area is greater than the thickness of the first planarization layer located in the connection area; the thickness of the second planarization layer located in the light-transmitting area is less than or equal to the thickness of the second planarization layer located in the connection area; the thickness of the pixel defining layer located in the light-transmitting area is greater than the thickness of the pixel defining layer located in the connection area.

[0011] In some embodiments, in the light-transmitting area, the substrate includes: a first flexible layer, a first barrier layer, a second flexible layer, and a second barrier layer, which are sequentially arranged in a direction close to the first sub-portion; or, in the light-transmitting area, the substrate includes: a first flexible layer, a first barrier layer, and a second flexible layer, which are sequentially arranged in a direction close to the first sub-portion.

[0012] In some embodiments, a thickness of a portion of the second barrier layer located in the light-transmitting region is less than or equal to a thickness of the second barrier layer located in the connecting region.

[0013] In some embodiments, the secondary display area includes: a light-transmitting area, a pixel area and a connecting area located between the light-transmitting area and the pixel area; the pixel area is provided with sub-pixels; the first sub-portion only covers the pixel area; or, the first sub-portion covers the secondary display area.

[0014] In some embodiments, the thickness of the first sub-portion is in the range of 50 μm to 200 μm.

[0015] In some embodiments, the display panel further includes: a transition zone between the main display area and the auxiliary display area; the transition zone is provided with a plurality of isolation columns, and the isolation columns surround the auxiliary display area; the first sub-portion is abutted against the isolation columns closest to the auxiliary display area.

[0016] In some embodiments, a distance between the isolation column closest to the main display area and the main display area is greater than or equal to 600 μm.

[0017] In some embodiments, the second sub-portion includes a first inorganic encapsulation film, an organic encapsulation film, and a second inorganic encapsulation film arranged in sequence in a direction away from the substrate; the distance between the boundary of the organic encapsulation film and the isolation column closest to the main display area is greater than or equal to 60 μm.

[0018] In some embodiments, the number of the isolation columns is 4.

[0019] In some embodiments, in the direction from the main display area to the auxiliary display area, the four isolation columns are respectively: a first isolation column, a second isolation column, a third isolation column and a fourth isolation column; the size range of the first isolation column in the first direction is 1.9μm to 2.1μm, and the size range of the second isolation column, the third isolation column and the fourth isolation column in the first direction is 3μm to 4μm; wherein the first direction is perpendicular to the substrate.

[0020] In some embodiments, the display panel further includes: a first gate dielectric layer, a second gate dielectric layer, and an interlayer dielectric layer located between the substrate and the encapsulation layer; between the third isolation column and the fourth isolation column, the first gate dielectric layer, the second gate dielectric layer, and the interlayer dielectric layer are all disconnected.

[0021] In another aspect, a display device is provided, comprising: a display panel as described in any of the above embodiments, and an optical element; the optical element is located in a secondary display area of ​​the display panel and on a non-light emitting side of the display panel.

[0022] The above-mentioned display device has the same structure and beneficial technical effects as the display panels provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0024] Figure 1 is a structural diagram of a display device according to some embodiments of the present disclosure;

[0025] Figure 2 is another structural diagram of a display device according to some embodiments of the present disclosure;

[0026] Figure 3 is another structural diagram of a display device according to some embodiments of the present disclosure;

[0027] Figure 4 Based on Figure 3 An enlarged view of the display device at B shown;

[0028] Figure 5 Based on Figure 4 A cross-sectional view of the display panel along section line CC is shown;

[0029] Figure 6 Based on Figure 4 Another cross-sectional view of the display panel along the cross-sectional line CC shown;

[0030] Figure 7 is a simulated light transmittance diagram of the secondary display area according to some embodiments of the present disclosure;

[0031] Figure 8 is a structural diagram of a display panel according to some embodiments of the present disclosure;

[0032] Fig. 9 Based on Figure 4 Another cross-sectional view of the display panel along the cross-sectional line CC shown;

[0033] Fig.10 Based on Figure 4 Another cross-sectional view of the display panel along the cross-sectional line CC shown;

[0034] Fig.11 is another simulated light transmittance diagram of the secondary display area according to some embodiments of the present disclosure;

[0035] Fig.12 Based on Figure 8 An enlarged view of position E of the display panel shown;

[0036] Fig.13 Based on Fig.12 The display panel is shown in a cross-sectional view along the section line FF. DETAILED DESCRIPTION

[0037] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0038] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0039] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0040] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0041] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0042] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0043] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0044] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0045] like Figure 1As shown, some embodiments of the present disclosure provide a display device 1000, which can be any display device that displays either motion (e.g., video) or fixed (e.g., still images) and whether text or images. More specifically, it is expected that the display device 1000 of the embodiment can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, TV monitors, flat panel displays, computer monitors, car displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photos, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0046] like Figure 2 As shown, the display device 1000 includes a display panel 100 and a cover plate 200 .

[0047] In some examples, the display panel 100 may be an organic light-emitting diode display panel (OLED). The cover plate 200 is located on the light-emitting side of the display panel 100, and the cover plate 200 protects the display panel 100 from damage such as external bumps. The material of the cover plate 200 may be glass.

[0048] In some examples, such as Figure 2 As shown, the display device 1000 may further include an optical element 300, such as an under-screen camera (Full Display with Camera, FDC for short), an under-screen fingerprint recognition sensor, an infrared transmitting device, an infrared receiving device, etc., so that the display device 1000 can realize a variety of different functions such as taking pictures, recording videos, fingerprint recognition, and facial recognition (Face ID).

[0049] like Figure 3 As shown, the display device 1000 may further include: an integrated circuit 400. The integrated circuit 400 is connected to the display panel 100 and is used to transmit a display driving signal and the like to the display panel 100.

[0050] For example, Figure 2 and Figure 3 As shown, the display panel 100 has a display area A and a peripheral area D. The display area A is the area of ​​the display panel 100 used to display images, and the peripheral area D is used to place structures such as drive circuits that provide electrical signals (such as scan signals, data signals, etc.) to sub-pixels.

[0051] Exemplarily, the peripheral area D is arranged around the display area A. The peripheral area D is provided with a barrier dam M, for example, the barrier dam M surrounds the display area A, the barrier dam M includes a first barrier dam M1 and a second barrier dam M2, and the first barrier dam M1 is closer to the display area A than the second barrier dam M2. The distance between the first barrier dam M1 and the display area A is greater than or equal to 900 μm.

[0052] For example, the display area A may be in the shape of a rectangle or a rounded rectangle, etc. A rounded rectangle means that all four corners of the rectangle are rounded.

[0053] The display area A includes a main display area A1 and a subsidiary display area A2 , and the subsidiary display area A2 is located at least on one side of the main display area A.

[0054] For example, the shape of the auxiliary display area A2 can be circular, elliptical, rectangular, etc.

[0055] For example, the auxiliary display area A2 is located on one side or multiple sides of the main display area A1.

[0056] For example, when the display area A is in the shape of a rectangle, the sub-display area A2 can be located at any position in the middle of the rectangle, or the sub-display area A2 can be located near any corner of the rectangle, or the sub-display area A2 can be located near any side of the rectangle.

[0057] The display area A may include at least one auxiliary display area A2. Figure 2 As shown, the number of the auxiliary display area A2 can be one. Figure 3 As shown, the number of auxiliary display areas A2 may also be two or more.

[0058] Exemplarily, in the display panel 100 , the portions located in the main display area A1 and the auxiliary display area A2 can both be used for image display.

[0059] Exemplarily, the light transmittance of the auxiliary display area A2 is greater than the light transmittance of the main display area A1.

[0060] Exemplarily, the optical element 300 is located on the non-light-exiting side of the display panel 100 , and is located in the auxiliary display area A2 of the display panel 100 .

[0061] The light-emitting side of the display panel 100 refers to a side of the display panel 100 that can display images. The non-light-emitting side of the display panel 100 refers to a side opposite to the light-emitting side of the display panel 100 .

[0062] Exemplarily, when the optical element 300 is working, it is necessary for light to be able to pass through the secondary display area A2, for example, the light emitted by the optical element 300 can be emitted to the outside through the secondary display area A2, and / or the external light can be irradiated onto the optical element 300 through the secondary display area A2, so that the corresponding function of the optical element 300 can be activated. Since the light transmittance of the secondary display area A2 is greater than that of the main display area A1, the light is less lost after passing through the secondary display area A2, thereby avoiding affecting the function of the optical element 300.

[0063] Exemplarily, taking the optical element 300 as a camera, when the camera is working, external light can pass through the portion of the display panel 100 located in the auxiliary display area A2. In this way, the camera can collect the light to achieve the function of taking pictures or recording videos. For example, when the camera is working (for example, a user takes a selfie), the auxiliary display area A2 can present a black screen, and the main display area A1 presents the user's selfie picture, which clearly shows the location of the camera. Alternatively, the auxiliary display area A2 and the main display area A1 present the user's selfie picture as a whole, without showing the location of the camera.

[0064] Exemplarily, when the camera is not working, the portions of the display panel 100 located in the auxiliary display area A2 and the main display area A1 can both be displayed, so that the display panel 100 and the display device 1000 as a whole can display the picture.

[0065] Exemplarily, taking the optical element 300 as an infrared receiving device and an infrared emitting device, during the process of facial recognition performed by the display device 1000, the infrared emitting device emits light, such as infrared light, to the light-emitting side of the display panel 100 through the portion of the display panel 100 located in the sub-display area A2. If there is an object with a relatively high temperature (for example, a human face) on the light-emitting side of the display panel 100, the object can reflect at least a portion of the infrared light back to the display panel 100, and the light is incident on the infrared receiving device through the portion of the display panel 100 located in the sub-display area A2. The infrared receiving device performs facial recognition based on the received infrared light.

[0066] In some embodiments, Figure 4 and Figure 5 As shown, Figure 4 Based on Figure 3 The enlarged view of the display device 1000 at point B is shown. Figure 5 Based on Figure 4 The display panel 100 is a cross-sectional view along the section line CC. The auxiliary display area A2 of the display panel 100 includes: a light-transmitting area A21, a pixel area A22 and a connecting area A23 between the light-transmitting area A21 and the pixel area A22. A plurality of sub-pixels P are arranged in the pixel area A22.

[0067] in, Figure 5 , Figure 6 , Fig. 9 and Fig.10 are cross-sectional views obtained along a cross-sectional line of the display panel 100 of four structures respectively, Figure 5 , Figure 6 , Fig. 9 and Fig.10 The position of the corresponding cross-section line in the display panel 100 is Figure 4 The position of the cross-section line CC in the display panel 100 is shown to be the same.

[0068] Exemplarily, the plurality of sub-pixels P include: a red sub-pixel P1, a green sub-pixel P2, and a blue sub-pixel P3. The red sub-pixel P1, the green sub-pixel P2, and the blue sub-pixel P3 form a pixel unit.

[0069] Exemplarily, the sub-pixel P includes a light-emitting device, and the display panel 100 further includes a pixel driving circuit, which is used to drive the light-emitting device to emit light.

[0070] In some embodiments, Figure 5 and Figure 6 As shown, the display panel 100 includes: a substrate 101, a shielding layer 102, a third blocking layer 103, a buffer layer (not shown in the figure), a semiconductor layer (not shown in the figure), a first gate dielectric layer (not shown in the figure), a first gate metal layer (not shown in the figure), a second gate dielectric layer (not shown in the figure), a second gate metal layer (not shown in the figure), an interlayer dielectric layer 104, a first source-drain metal layer 105, a passivation layer 106, a first planarization layer 107, a second source-drain metal layer 108, a second planarization layer 109, a first electrode layer 110, a pixel defining layer 111, a second electrode layer 112, an encapsulation layer 113, a light shielding layer 114 and an optical adhesive layer 115, which are stacked in sequence.

[0071] For example, Fig.13 As shown, the substrate 101 includes: glass (not shown in the figure), and a first flexible layer 14, a first barrier layer 13, a second flexible layer 12, and a second barrier layer 11 stacked on one side of the glass. The material of the first flexible layer 14 and the material of the second flexible layer 12 include at least one of polyimide (PI) and polyethylene terephthalate, and the material of the first barrier layer 13 and the material of the second barrier layer 11 include at least one of silicon nitride (SiNx) and silicon oxide (SiOx).

[0072] Exemplarily, an a-Si layer is further disposed between the first barrier layer 13 and the second flexible layer 12 , and the thickness of the a-Si layer is, for example, 4 nm.

[0073] For example, Fig.13As shown, the encapsulation layer 113 includes: a first inorganic encapsulation film 113 a , an organic encapsulation film 113 b , and a second inorganic encapsulation film 113 c which are sequentially stacked in a direction away from the substrate 101 .

[0074] Among them, the semiconductor layer, the first gate dielectric layer, the first gate metal layer, the second gate dielectric layer, the second gate metal layer, the interlayer dielectric layer 104, the first source and drain metal layer 105, the passivation layer 106, the first planarization layer 107, and the second source and drain metal layer 108 are used to form a pixel driving circuit, and the pixel driving circuit includes a transistor.

[0075] The first electrode layer 110, the second electrode layer 112, and the light emitting layer between the first electrode layer 110 and the second electrode layer 112 form a light emitting device. The first electrode layer 110 includes a first electrode of the light emitting device, and the second electrode layer 112 includes a second electrode of the light emitting device.

[0076] Exemplarily, the first electrode is either an anode or a cathode, and the second electrode is the other of the anode and the cathode; the embodiments of the present disclosure are exemplarily described with the first electrode being the anode and the second electrode being the cathode, but the embodiments of the present disclosure are not limited thereto.

[0077] The light-emitting principle of a light-emitting device is to use a circuit connected by an anode and a cathode to inject holes into the light-emitting layer using the anode and to inject electrons into the light-emitting layer using the cathode. The electrons and holes formed form excitons in the light-emitting layer, and the excitons return to the ground state through radiation transition and emit photons.

[0078] In some examples, such as Figure 5 As shown, in the connection area A23, the display panel 100 includes: a substrate 101, a blocking layer 102, a third blocking layer 103, a buffer layer, a first gate dielectric layer, a second gate dielectric layer, an interlayer dielectric layer 104, a first source-drain metal layer 105, a passivation layer 106, a first planarization layer 107, a second source-drain metal layer 108, a second planarization layer 109, a pixel defining layer 111, a second electrode layer 112, an encapsulation layer 113, a shading layer 114 and an optical adhesive layer 115 which are stacked in sequence.

[0079] In the light-transmitting area A21, the display panel 100 includes: a substrate 101, a third barrier layer 103, a buffer layer, a first gate dielectric layer, a second gate dielectric layer, an interlayer dielectric layer 104, a passivation layer 106, a first planarization layer 107, a second planarization layer 109, a pixel defining layer 111, a second electrode layer 112, an encapsulation layer 113 and an optical adhesive layer 115 which are stacked in sequence.

[0080] The display panel 100 provided in this embodiment is a backplane built-in display panel 100, and the transistor connected to the light-emitting device of the auxiliary display area A2 is built-in the auxiliary display area A2.

[0081] In some examples, such as Figure 6 As shown, in the connection area A23, the display panel 100 includes: a substrate 101, a third barrier layer 103, a buffer layer, a first gate dielectric layer, a second gate dielectric layer, an interlayer dielectric layer 104, a first source-drain metal layer 105, a passivation layer 106, a first planarization layer 107, a second source-drain metal layer 108, a second planarization layer 109, a first electrode layer 110, a pixel defining layer 111, a second electrode layer 112, an encapsulation layer 113, a light shielding layer 114 and an optical adhesive layer 115, which are stacked in sequence.

[0082] In the light-transmitting area A21, the display panel 100 includes: a substrate 101, a third barrier layer 103, a buffer layer, a first gate dielectric layer, a second gate dielectric layer, an interlayer dielectric layer 104, a passivation layer 106, a first planarization layer 107, a second planarization layer 109, a pixel defining layer 111, a second electrode layer 112, an encapsulation layer 113 and an optical adhesive layer 115 which are stacked in sequence.

[0083] The display panel 100 provided in this embodiment is a backplane external display panel 100, and the transistor connected to the light-emitting device of the auxiliary display area A2 is arranged in the main display area A1 (such as Figure 2 shown).

[0084] like Figure 5 and Figure 6 As shown, the film layer stacking materials and the thickness of the film layers in the light-transmitting area A21 of the display panel 100 are shown in Table 1.

[0085] Table 1 Film materials and film thickness of light-transmitting area A21

[0086] Film Material Thickness / nm Encapsulation layer SiNx / IJP / SiONx 1000 / 12000 / 600 Second electrode layer Mg:Ag 14 Pixel Definition Layer PI 1000 Second planarization layer PI 2000 First planarization layer PI 1500 Passivation layer SiNx 250 Interlayer dielectric layer SiOx / SiNx 300 / 200 The second gate dielectric layer SiNx 130 First gate dielectric layer SiOx 120 Buffer layer SiOx / SiNx 100 / 300 Second barrier layer <![CDATA[SiO2]]> 500 Second flexible layer PI 6000 First barrier layer <![CDATA[SiO2]]> 600 First flexible layer PI 10000

[0087] Wherein, IJP represents an organic encapsulation film 113b (such as Fig.13 shown).

[0088] In some embodiments, Figure 5 and Figure 6 As shown, the aperture ratio of the secondary display area A2 ranges from 30% to 60%, and the resolution (Pixels Per Inch, PPI) of the secondary display area A2 ranges from 100 to 200. The aperture ratio of the secondary display area A2 refers to the ratio of the area of ​​the light-transmitting area A21 to the area of ​​the secondary display area A2. Figure 7 is a simulated light transmittance diagram of the auxiliary display area A2 according to some embodiments of the present disclosure. The film layer structure of the auxiliary display area A2 of the display panel 100 is as follows: Figure 5 and Figure 6 shown.

[0089] from Figure 7 It can be seen that at a wavelength of 940nm, the infrared light transmittance is 17%, that is, the infrared light transmittance of the sub-display area A2 is 17%; in the wavelength range of 380nm to 780nm, the visible light transmittance is 24%, that is, the visible light transmittance of the sub-display area A2 is 24%; in the wavelength range of 380nm to 1000nm, the full-band transmittance is 24%.

[0090] Exemplarily, the light transmittance of the light-transmitting area A21 = the simulated light transmittance of the auxiliary display area A2 x the aperture ratio of the auxiliary display area A2.

[0091] Then, the visible light transmittance of the light-transmitting area A21 is: 24% x 30% = 7.2%, 24% x 40% = 9.6% and 24% x 60% = 14.4%. Therefore, the visible light transmittance of the light-transmitting area A21 ranges from 7.2% to 14.4%.

[0092] The infrared light transmittance of the light-transmitting area A21 is: 17% x 30% = 5.1%, 17% x 40% = 6.8% and 17% x 60% = 10.2%. Therefore, the infrared light transmittance of the light-transmitting area A21 ranges from 5.1% to 10.2%.

[0093] In some embodiments, taking the aperture ratio of the secondary display area A2 as 30% to 40% as an example, the requirement for visible light transmittance and infrared light transmittance is 20% to 30%. That is to say, without increasing the aperture ratio of the secondary display area A2, it is necessary to increase the visible light transmittance and infrared light transmittance of the secondary display area A2.

[0094] In some examples, such as Figure 5 The backplane built-in display panel 100 shown, in order to improve the visible light transmittance and infrared light transmittance of the sub-display area A2, reduces the number of designed display pixel units in the sub-display area A2, reduces the pixel density of the sub-display area A2, increases the aperture ratio, increases the visible light transmittance and infrared transmittance, and improves the shooting quality of the camera under the screen, without changing the pixel density of other areas. However, reducing the pixel density of the sub-display area A2 will affect the display effect of the sub-display area A2. And this solution is also difficult to meet the requirements of higher infrared transmittance and sensitivity for facial recognition. When the pixel density needs to be increased, it is even more difficult to meet the requirements of visible light transmittance and infrared transmittance.

[0095] In some examples, such as Figure 6The backplane external display panel 100 shown in the figure can improve the visible light transmittance and infrared light transmittance of the secondary display area A2 by optimizing the pixel space arrangement of the secondary display area A2 without reducing the pixel density of the secondary display area A2, thereby improving the visible light transmittance and infrared light transmittance and realizing a high-resolution, non-differential full-screen display. However, how to optimize the pixel space arrangement and film stacking design of the secondary display area A2 to improve the visible light transmittance and increase the amount of light entering the secondary display area A2 is of great significance.

[0096] Based on this, Figure 8 and Fig. 9 As shown, an embodiment of the present disclosure provides a display panel 100, wherein the encapsulation layer 113 of the display panel 100 includes a first sub-portion 1131 located in the auxiliary display area A2 and a second sub-portion 1132 located in the main display area A1, and the material of the first sub-portion 1131 includes: at least one of epoxy resin and silicone resin; the material of the second sub-portion 1132 includes: an inorganic material.

[0097] For example, Fig.13 As shown, the material of the second sub-section 1132 includes: a first inorganic encapsulation film 113a, an organic encapsulation film 113b, and a second inorganic encapsulation film 113c which are sequentially stacked in a direction away from the substrate 101. For example, the materials of the first inorganic encapsulation film 113a and the second inorganic encapsulation film 113c include: at least one of silicon nitride and silicon oxynitride, the materials of the first inorganic encapsulation film 113a and the second inorganic encapsulation film 113c are inorganic materials, and the organic encapsulation film 113b is formed by inkjet printing (IJP).

[0098] Since inorganic materials have a good packaging effect, the material of the second sub-portion 1132 located in the main display area A1 includes inorganic materials, which can ensure that the packaging of the main display area A1 has a strong reliability.

[0099] Epoxy resin has high light transmittance, mechanical properties and adhesive properties, and its refractive index reaches 1.58; silicone resin has high refractive index and high transmittance, for example, the refractive index of silicone resin is greater than 1.53, and the transmittance of silicone resin is greater than 99%. Since epoxy resin and silicone resin have high light transmittance, using epoxy resin and silicone resin as the material of the first sub-section 1131 of the secondary display area A2 can improve the visible light transmittance and infrared light transmittance of the secondary display area A2, thereby improving the shooting quality of the under-screen camera.

[0100] In some examples, such as Fig. 9 As shown, the display panel 100 further includes: an organic layer, an inorganic layer and a metal layer located between the substrate 101 and the encapsulation layer 113 .

[0101] Exemplarily, the material of the organic layer includes organic material, and the organic layer includes: a first planarization layer 107, a second planarization layer 109 and a pixel defining layer 111; the material of the inorganic layer includes inorganic material, and the inorganic layer includes: a third blocking layer 103, a buffer layer, a first gate dielectric layer, a second gate dielectric layer, an interlayer dielectric layer 104, and a passivation layer 106; the material of the metal layer includes metal, and the metal layer includes: a first source and drain metal layer 105, a second source and drain metal layer 108 and a second electrode layer 112.

[0102] like Figure 4 and Fig. 9 As shown, in the secondary display area A2, the organic layer includes: a portion located in the light-transmitting area A21, a portion located in the pixel area A22, and a portion located in the connection area A23; the inorganic layer includes: a portion located in the pixel area A22 and a portion located in the connection area A23; and the metal layer includes: a portion located in the pixel area A22 and a portion located in the connection area A23.

[0103] That is to say, compared with the organic layer, the light transmittance of the inorganic layer and the metal layer is poor. Compared with the pixel area A22 and the connection area A23, there is no inorganic layer and metal layer that affect the light transmittance between the substrate 101 and the encapsulation layer 113 of the light-transmitting area A21, and only an organic layer is set, which can increase the light transmittance of the light-transmitting area A21, improve the visible light transmittance and infrared light transmittance of the secondary display area A2, and thus improve the shooting quality of the under-screen camera.

[0104] In some embodiments, the organic layer may include: a first planarization layer 107, a second planarization layer 109 and a pixel defining layer 111. In other embodiments, the organic layer may include: at least one of the first planarization layer 107, the second planarization layer 109 and the pixel defining layer 111, which is not limited here.

[0105] In some embodiments, Fig. 9 and Fig.10 As shown, the thickness d11 of the first planarization layer 107 located in the light-transmitting area A21 is greater than the thickness d12 of the first planarization layer 107 located in the connection area A23; the thickness d21 of the second planarization layer 109 located in the light-transmitting area A21 is less than or equal to the thickness d22 of the second planarization layer 109 located in the connection area A23; the thickness d31 of the pixel defining layer 111 located in the light-transmitting area A21 is greater than the thickness d32 of the pixel defining layer 111 located in the connection area A23.

[0106] By configuring that the thickness d11 of the portion of the first planarization layer 107 located in the light-transmitting area A21 is greater than the thickness d12 of the portion of the first planarization layer 107 located in the connection area A23, the thickness d21 of the portion of the second planarization layer 109 located in the light-transmitting area A21 is less than or equal to the thickness d22 of the portion of the second planarization layer 109 located in the connection area A23, and the thickness d31 of the portion of the pixel defining layer 111 located in the light-transmitting area A21 is greater than the thickness d32 of the portion of the pixel defining layer 111 located in the connection area A23, the light transmittance of the light-transmitting area A21 can be improved, for details, refer to Fig.11 Another simulated transmittance diagram of the auxiliary display area A2 is introduced and will not be described in detail here.

[0107] In some embodiments, Fig. 9 , Fig.10 and Fig.13 As shown, in the light-transmitting area A21, the substrate 101 includes: a first flexible layer 14, a first blocking layer 13, a second flexible layer 12 and a second blocking layer 11 which are sequentially arranged in a direction close to the first sub-portion 1131; or, in the light-transmitting area A21, the substrate 101 includes: a first flexible layer 14, a first blocking layer 13 and a second flexible layer 12 which are sequentially arranged in a direction close to the first sub-portion 1131.

[0108] The light transmittance of the second blocking layer 11 is lower than that of the organic layer, and the second blocking layer 11 may not be provided in the light-transmitting area A21 to further improve the light transmittance of the light-transmitting area A21.

[0109] In some embodiments, Fig.10 As shown, the thickness d41 of the portion of the second barrier layer 11 located in the light-transmitting area A21 is less than or equal to the thickness d42 of the portion of the second barrier layer 11 located in the connecting area A23.

[0110] That is to say, Fig.10 and Fig.13 As shown, in the light-transmitting area A21, the substrate 101 includes: a first flexible layer 14, a first barrier layer 13, a second flexible layer 12, and a second barrier layer 11, which are sequentially arranged in a direction close to the first sub-portion 1131, and a thickness d41 of the portion of the second barrier layer 11 located in the light-transmitting area A21 is less than or equal to a thickness d42 of the portion of the second barrier layer 11 located in the connection area A23. That is, compared with the thickness d41 of the portion of the second barrier layer 11 located in the light-transmitting area A21 being equal to the thickness d42 of the portion of the second barrier layer 11 located in the connection area A23, by reducing the thickness d41 of the portion of the second barrier layer 11 located in the light-transmitting area A21, the light transmittance of the light-transmitting area A21 can be further improved.

[0111] In some examples, such as Fig. 9 and Fig.10As shown, the film material and the thickness of the film in the light-transmitting area A21 of the display panel 100 are shown in Table 2.

[0112] Table 2 Film materials and film thickness of light-transmitting area A21

[0113] Film Material Thickness / nm Pixel Definition Layer PI 1000 Second planarization layer PI 2000 First planarization layer PI 1500 Second barrier layer <![CDATA[SiO2]]> 100 Second flexible layer PI 6000 First barrier layer <![CDATA[SiO2]]> 600 First flexible layer PI 10000

[0114] Exemplarily, the aperture ratio of the auxiliary display area A2 ranges from 30% to 60%, and the resolution (Pixels Per Inch, PPI) of the auxiliary display area A2 ranges from 100 to 200. Fig.11 is another simulated transmittance diagram of the auxiliary display area A2 according to some embodiments of the present disclosure. The structure of the auxiliary display area A2 of the display panel 100 is as follows: Fig. 9 and Fig.10 shown.

[0115] from Fig.11 It can be seen that at a wavelength of 940nm, the infrared light transmittance is 89%, that is, the infrared light transmittance of the sub-display area A2 is 89%; in the wavelength range of 380nm to 780nm, the visible light transmittance is 62%, that is, the visible light transmittance of the sub-display area A2 is 62%; in the wavelength range of 380nm to 1000nm, the full-band transmittance is 70%.

[0116] Exemplarily, the light transmittance of the light-transmitting area A21 = the simulated light transmittance of the auxiliary display area A2 x the aperture ratio of the auxiliary display area A2.

[0117] Then, the visible light transmittance of the light-transmitting area A21 is: 62% x 30% = 18.6%, 62% x 40% = 24.8% and 62% x 60% = 37.2%. Therefore, the visible light transmittance of the light-transmitting area A21 ranges from 18.6% to 37.2%.

[0118] The infrared light transmittance of the light-transmitting area A21 is: 89% x 30% = 26.7%, 89% x 40% = 35.6% and 89% x 60% = 53.4%. Therefore, the infrared light transmittance of the light-transmitting area A21 ranges from 26.7% to 53.4%.

[0119] Depend on Fig.11 It can be seen that by setting the film layer stacking structure of the light-transmitting area A21 provided by the embodiment of the present invention, the visible light transmittance and infrared light transmittance of the sub-display area A2 are improved without reducing the pixel density of the sub-display area A2 and without changing the aperture ratio of the sub-display area A2, thereby improving the shooting quality of the under-screen camera.

[0120] In some embodiments, Fig. 9 and Fig.10As shown, the film layer stacking structure of the light-transmitting area A21 can be arranged as a backplane-embedded display panel 100 or a backplane-external display panel 100.

[0121] For example, Fig. 9 As shown, in the connection area A23 of the backplane built-in display panel 100, the display panel 100 includes: a substrate 101, a blocking layer 102, a third blocking layer 103, a buffer layer, a first gate dielectric layer, a second gate dielectric layer, an interlayer dielectric layer 104, a first source-drain metal layer 105, a passivation layer 106, a first planarization layer 107, a second source-drain metal layer 108, a second planarization layer 109, a pixel defining layer 111, a second electrode layer 112, an encapsulation layer 113, a shading layer 114 and an optical adhesive layer 115 which are stacked in sequence.

[0122] For example, Fig.10 As shown, in the connection area A23 of the backplane external display panel 100, the display panel 100 includes: a substrate 101, a third barrier layer 103, a buffer layer, a first gate dielectric layer, a second gate dielectric layer, an interlayer dielectric layer 104, a first source-drain metal layer 105, a passivation layer 106, a first planarization layer 107, a second source-drain metal layer 108, a second planarization layer 109, a pixel defining layer 111, a second electrode layer 112, an encapsulation layer 113, a light shielding layer 114 and an optical adhesive layer 115 which are stacked in sequence.

[0123] In some embodiments, Figure 4 As shown, the auxiliary display area A2 includes: a light-transmitting area A21, a pixel area A22 and a connecting area A23 located between the light-transmitting area A21 and the pixel area A22; the pixel area A22 is provided with sub-pixels P; and the first sub-portion 1131 only covers the pixel area A22.

[0124] Exemplarily, an independent pixel package is formed by a dispensing process to achieve setting the first sub-portion 1131 only in the pixel area A22.

[0125] In other embodiments, such as Figure 4 and Fig. 9 As shown, the first sub-portion 1131 covers the auxiliary display area A2. Exemplarily, the first sub-portion 1131 is formed by a coating process, and the first sub-portion 1131 covers the auxiliary display area A2.

[0126] In some embodiments, Fig.10 As shown, the thickness d5 of the first sub-portion 1131 ranges from 50 μm to 200 μm.

[0127] Exemplarily, the thickness d5 of the first sub-portion 1131 is 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 100μm, 110μm, 115μm, 130μm, 150μm, 160μm, 175μm, 185μm, 195μm or 200μm, etc., but is not limited here.

[0128] By setting the thickness d5 of the first sub-portion 1131 to be in the range of 50 μm to 200 μm, the first sub-portion 1131 has a better packaging effect on the auxiliary display area A2 of the display panel 100 , thereby protecting the display panel 100 from corrosion by water and oxygen, and improving the life of the display panel 100 .

[0129] In some embodiments, Figure 4 As shown, in the orthographic projection onto the substrate 101 , the shape of the light-transmitting area A21 is circular, square, polygonal, etc., which is not limited here.

[0130] In the embodiment of the present disclosure, the shape of the light-transmitting area A21 is a square, but the present disclosure is not limited thereto.

[0131] like Figure 8 , Fig.12 and Fig.13 As shown, Fig.12 Based on Figure 8 The enlarged view of the display panel 100 at point E is shown. Fig.13 Based on Fig.12 The display panel 100 is shown in a cross-sectional view along the section line FF. The display panel 100 further includes a transition area A3 located between the main display area A1 and the auxiliary display area A2. The structural arrangement of the transition area A3 is provided below to further improve the packaging reliability of the display panel 100.

[0132] In some embodiments, Fig.12 and Fig.13 As shown, the transition area A3 is provided with a plurality of isolation columns 20, and the isolation columns 20 surround the auxiliary display area A2.

[0133] Exemplarily, the isolation column 20 includes: a first sublayer 20a, a second sublayer 20b and a third sublayer 20c arranged in sequence along a direction away from the substrate 101; the first sublayer 20a is arranged in the same layer as at least one of the buffer layer, the first gate dielectric layer, the second gate dielectric layer and the interlayer dielectric layer 104, the second sublayer 20b is arranged in the same layer as at least one of the first planarization layer 107, the second planarization layer 109 and the pixel defining layer 111, and the third sublayer 20c is arranged in the same layer as the second inorganic encapsulation film 113c.

[0134] Among them, the same layer setting refers to using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask to form a layer structure through a single patterning process. That is, one patterning process corresponds to one mask. Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses. This simplifies the manufacturing process, saves manufacturing costs, and improves production efficiency.

[0135] In some examples, such as Fig.13 As shown, the transition area A3 is provided with four isolation columns 20 , and from the main display area A1 to the auxiliary display area A2 , the four isolation columns 20 are respectively: a first isolation column 21 , a second isolation column 22 , a third isolation column 23 and a fourth isolation column 24 .

[0136] Four isolation columns 20 are arranged in the transition area A3 . The density of the isolation columns 20 arranged in the transition area A3 meets the packaging requirements, which can improve the packaging effect of the display panel 100 , protect the display panel 100 from corrosion by water and oxygen, and increase the life of the display panel 100 .

[0137] In some embodiments, Fig.13 As shown, the distance d6 between the isolation column 20 closest to the main display area A1 and the main display area A1 is greater than or equal to 600 μm.

[0138] Exemplarily, the isolation column 20 closest to the main display area A1 is the first isolation column 21, and the distance d6 between the first isolation column 21 and the main display area A1 is greater than or equal to 600 μm. For example, the cross-sectional structure of the first isolation column 21 is trapezoidal, and the distance d6 between the first isolation column 21 and the main display area A1 is the distance between the side of the first isolation column 21 closest to the substrate 101 facing the main display area A1 and the main display area A1.

[0139] In other examples, such as Figure 3 and Fig.13 As shown, the distance between the first barrier dam M1 and the display area A ranges from 400 μm to 700 μm, and the distance d6 between the isolation column 20 closest to the main display area A1 and the main display area A1 ranges from 300 μm to 400 μm. The distance d6 between the main display area A1 and the first isolation column 21 is smaller.

[0140] In the embodiment of the present disclosure, the distance d6 between the main display area A1 and the first isolation column 21 is increased by setting the distance d6 between the main display area A1 and the isolation column 20 closest to the main display area A1 to be greater than or equal to 600 μm, thereby improving the effectiveness of the display panel 100 packaging and increasing the life of the display panel 100.

[0141] In some embodiments, Fig.13 As shown, the second sub-portion 1132 includes a first inorganic encapsulation film 113a, an organic encapsulation film 113b and a second inorganic encapsulation film 113c arranged in sequence along a direction away from the substrate 101, and the distance d7 between the boundary L1 of the organic encapsulation film 113b and the isolation column 20 closest to the main display area A1 is greater than or equal to 60μm.

[0142] Exemplarily, the distance d7 between the boundary L1 of the organic packaging film 113b and the first isolation column 21 is greater than or equal to 60 μm, and the distance d7 between the boundary L1 of the organic packaging film 113b and the first isolation column 21 is the distance between the boundary L1 of the organic packaging film 113b and the first isolation column 21 closest to the substrate 101 and the side facing the main display area A1.

[0143] In some other examples, the distance d7 between the boundary L1 of the organic encapsulation film 113 b and the isolation column 20 closest to the main display area A1 is 35 μm, and the distance d7 between the organic encapsulation film 113 b and the first isolation column 21 is smaller.

[0144] In the embodiment of the present disclosure, the distance d7 between the boundary L1 of the organic encapsulation film 113b and the isolation column 20 closest to the main display area A1 is greater than or equal to 60 μm, so that the distance d7 between the organic encapsulation film 113b and the first isolation column 21 is large enough to improve the encapsulation effect of the display panel 100.

[0145] In some embodiments, Fig.13 As shown, the first sub-portion 1131 abuts against the isolation column 20 closest to the auxiliary display area A2.

[0146] Illustratively, a first sub-portion 1131 of the encapsulation layer 113 is formed in the secondary display area A2 through a coating process, and the first sub-portion 1131 is offset against the fourth isolation column 24. The first sub-portion 1131 can improve the visible light transmittance and infrared light transmittance of the secondary display area A2, thereby improving the shooting quality of the under-screen camera.

[0147] In some embodiments, Fig.13 As shown, the dimension d8 of the first isolation column 21 in the first direction Y ranges from 1.9 μm to 2.1 μm, and the dimensions d9 of the second isolation column 22 , the third isolation column 23 and the fourth isolation column 24 in the first direction Y range from 3 μm to 4 μm; wherein the first direction Y is perpendicular to the substrate 101 .

[0148] Exemplarily, a dimension d8 of the first isolation column 21 in the first direction Y is 1.9 μm, 2.0 μm, or 2.1 μm, etc., which is not limited here.

[0149] Exemplarily, a dimension d9 of the second isolation column 22 in the first direction Y is 3 μm, 3.2 μm, 3.3 μm, 3.5 μm, 3.7 μm, 3.8 μm or 4 μm, etc., which is not limited here.

[0150] Exemplarily, a dimension d9 of the third isolation column 23 in the first direction Y is 3 μm, 3.1 μm, 3.4 μm, 3.5 μm, 3.7 μm, 3.9 μm or 4 μm, etc., which is not limited here.

[0151] Exemplarily, a dimension d9 of the fourth spacer column 24 in the first direction Y is 3 μm, 3.2 μm, 3.4 μm, 3.6 μm, 3.7 μm, 3.9 μm or 4 μm, etc., which is not limited here.

[0152] The dimension d9 of the second isolation column 22 in the first direction Y, the dimension d9 of the third isolation column 23 in the first direction Y, and the dimension d9 of the fourth isolation column 24 in the first direction Y may be equal or unequal, which is not limited here.

[0153] In other examples, the number of isolation columns 20 is 3, the dimension d8 of the first isolation column 21 in the first direction Y is 0.5 μm, the dimension d9 of the second isolation column 22 and the third isolation column 23 in the first direction Y is about 2 μm, and the number of isolation columns 20 is small and the height is small.

[0154] In the embodiment of the present disclosure, the dimension d8 of the first isolation column 21 in the first direction Y is in the range of 1.9μm to 2.1μm, and the dimension d9 of the second isolation column 22, the third isolation column 23 and the fourth isolation column 24 in the first direction Y are all in the range of 3μm to 4μm, thereby ensuring that the height of the isolation column 20 is large enough to increase the packaging effect of the isolation column 20 and improve the packaging effect of the display panel 100.

[0155] In some embodiments, Fig.13 As shown, between the third isolation column 23 and the fourth isolation column 24 , the first gate dielectric layer, the second gate dielectric layer and the interlayer dielectric layer 104 are all disconnected.

[0156] That is, between the third isolation column 23 and the fourth isolation column 24, the stacked first gate dielectric layer, the second gate dielectric layer and the interlayer dielectric layer 104 are disconnected into two parts, one part is close to the third isolation column 23, and the other part is close to the fourth isolation column 24, with a gap G between the two parts.

[0157] By breaking the stacked first gate dielectric layer, the second gate dielectric layer and the interlayer dielectric layer 104 into two parts, the corrosion of water and oxygen can be blocked, the packaging effect of the display panel 100 can be improved, and the life of the display panel 100 can be increased.

[0158] like Figure 2 As shown, an embodiment of the present disclosure further provides a display device 1000, which includes: a display panel 100 and an optical element 300 as described in any of the above embodiments; the optical element 300 is located in the sub-display area A2 of the display panel 100 and is located on the non-light-emitting side of the display panel 100.

[0159] The display device 1000 has the same structure and beneficial technical effects as the display panel 100 provided in some of the above embodiments, which will not be described in detail herein.

[0160] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display panel, characterized in that: The display panel has a display area; the display area includes: a main display area and a secondary display area located at least on one side of the main display area; The display panel comprises: a substrate and an encapsulation layer located on one side of the substrate, the encapsulation layer comprises: a first sub-portion located in the auxiliary display area and a second sub-portion located in the main display area; The material of the first sub-section includes at least one of epoxy resin and silicone resin; the material of the second sub-section includes inorganic material.

2. The display panel according to claim 1, characterized in that: The display panel further includes: an organic layer, an inorganic layer and a metal layer located between the substrate and the encapsulation layer; The auxiliary display area includes: a light-transmitting area, a pixel area, and a connection area between the light-transmitting area and the pixel area; the pixel area is provided with sub-pixels; In the secondary display area, the organic layer includes: a portion located in the light-transmitting area, a portion located in the pixel area, and a portion located in the connection area; the inorganic layer includes: a portion located in the pixel area and a portion located in the connection area; and the metal layer includes: a portion located in the pixel area and a portion located in the connection area.

3. The display panel according to claim 2, characterized in that: The organic layer includes at least one of a first planarization layer, a second planarization layer, and a pixel definition layer.

4. The display panel according to claim 3, characterized in that: The thickness of the portion of the first planarization layer located in the light-transmitting area is greater than the thickness of the portion of the first planarization layer located in the connecting area; The thickness of the portion of the second planarization layer located in the light-transmitting area is less than or equal to the thickness of the portion of the second planarization layer located in the connecting area; The thickness of the portion of the pixel defining layer located in the light-transmitting area is greater than the thickness of the portion of the pixel defining layer located in the connecting area.

5. The display panel according to claim 2, characterized in that: In the light-transmitting area, The substrate includes: a first flexible layer, a first barrier layer, a second flexible layer and a second barrier layer arranged in sequence in a direction close to the first sub-section; or, the substrate includes: a first flexible layer, a first barrier layer and a second flexible layer arranged in sequence in a direction close to the first sub-section.

6. The display panel according to claim 5, characterized in that: The thickness of the second barrier layer located in the light-transmitting area is less than or equal to the thickness of the second barrier layer located in the connecting area.

7. The display panel according to claim 1, characterized in that: The auxiliary display area includes: a light-transmitting area, a pixel area, and a connection area between the light-transmitting area and the pixel area; the pixel area is provided with sub-pixels; The first sub-portion only covers the pixel area; or, the first sub-portion covers the auxiliary display area.

8. The display panel according to any one of claims 1 to 7, characterized in that: The thickness of the first sub-portion ranges from 50 μm to 200 μm.

9. The display panel according to claim 1, characterized in that: It also includes: a transition area between the main display area and the auxiliary display area; The transition area is provided with a plurality of isolation columns, and the isolation columns surround the auxiliary display area; the first sub-portion abuts against the isolation columns closest to the auxiliary display area.

10. The display panel according to claim 9, characterized in that: The distance between the isolation column closest to the main display area and the main display area is greater than or equal to 600 μm.

11. The display panel according to claim 9, characterized in that: The second sub-section includes a first inorganic encapsulation film, an organic encapsulation film, and a second inorganic encapsulation film sequentially arranged in a direction away from the substrate; a distance between a boundary of the organic encapsulation film and an isolation column closest to the main display area is greater than or equal to 60 μm.

12. The display panel according to claim 9, characterized in that: The number of the isolation columns is 4.

13. The display panel according to claim 9, characterized in that: In the direction from the main display area to the auxiliary display area, the four isolation columns are respectively: a first isolation column, a second isolation column, a third isolation column and a fourth isolation column; The first isolation column has a size range of 1.9 μm to 2.1 μm in the first direction, and the second isolation column, the third isolation column and the fourth isolation column have a size range of 3 μm to 4 μm in the first direction; wherein the first direction is perpendicular to the substrate.

14. The display panel according to claim 13, characterized in that: The display panel further includes: a first gate dielectric layer, a second gate dielectric layer and an interlayer dielectric layer located between the substrate and the encapsulation layer; Between the third isolation column and the fourth isolation column, the first gate dielectric layer, the second gate dielectric layer and the interlayer dielectric layer are all disconnected.

15. A display device, characterized in that: include: The display panel and the optical element according to any one of claims 1 to 14; The optical element is located in the auxiliary display area of ​​the display panel and on the non-light emitting side of the display panel.

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