Insulated wire and insulated wire manufacturing method

By spiraling the laminated insulating tape in the insulated wire and ensuring that its overlapping length, width and adhesion meet certain conditions, the problem of the conductor exposed when bending is solved, and the complete coverage of the conductor is achieved when bending is achieved.

CN119856236APending Publication Date: 2025-04-18YAZAKI CORP
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202480003904.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-01-18
Filing Date
2024-01-09
Publication Date
2025-04-18

AI Technical Summary

Technical Problem

When existing insulated wires are bent, the conductors are exposed due to possible gaps between the insulating tapes.

Method used

By spirally wound on the conductor with the insulating tape laminated with the insulating layer and the adhesive layer in such a way that the adhesive layer is arranged to face the conductor, it is ensured that the overlap length, width and adhesion of the insulating tape meet certain conditions to prevent the conductor from being exposed.

Benefits of technology

It effectively reduces the possibility of conductor exposure during bending, ensuring that the insulated wire is completely covered when bending.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119856236A_ABST
    Figure CN119856236A_ABST
Patent Text Reader

Abstract

An insulated electric wire (1) is formed by helically winding an insulating tape (20) laminated with an insulating layer (21) and an adhesive layer (22) around a conductor (10) so that the adhesive layer (22) is disposed toward the conductor (10), where when the conductor diameter is x mm, the overlapping length y of the insulating tape (20) is y > = 1.5099 ln (x)-0.4959 mm, the width z is z < =-0.3774 x + 24.547 mm, and the thickness z of the insulating tape (20) is 0 < = x < = 0.3774 x + 24.547 mm. And the adhesive force c with respect to the back surface of the insulating tape (20) on the opposite side as the adhesive layer (22) is c > = 3.2 N / 19 mm.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to an insulated wire and a method for manufacturing the insulated wire. Background Art

[0002] In the related art, there has been proposed an insulated electric wire in which a covering portion is formed by directly spirally winding an insulating tape around a conductor (see Patent Documents 1 and 2).

[0003] Citation List

[0004] Patent Literature

[0005] Patent Document 1: JPH10-97815A

[0006] Patent Document 2: JPH06-73818U Summary of the invention

[0007] Technical issues

[0008] Here, in the insulated wires described in Patent Documents 1 and 2, since the insulating tape is spirally wound around the conductor, when the insulated wire is bent, a gap may exist between the insulating tapes wound outside the bent portion, thereby exposing the conductor.

[0009] The present invention is proposed to solve the above problems in the prior art, and an object of the present invention is to provide an insulated wire and a method for manufacturing the insulated wire which can reduce the possibility of conductor exposure during bending.

[0010] Solution to the problem

[0011] The insulated wire according to the present invention is formed by spirally winding an insulating tape laminated with an insulating layer and an adhesive layer on the conductor in a manner in which the adhesive layer is arranged toward the conductor, wherein, when the conductor diameter is x mm, the overlapping length y of the insulating tape is y≥1.5099ln(x)-0.4959mm, the width z is z≤-0.3774x+24.547mm, and the adhesive force c relative to the back side of the insulating tape as the opposite side of the adhesive layer is c≥3.2N / 19mm.

[0012] The method for manufacturing an insulated wire according to the present invention comprises: a first step of preparing a conductor having a conductor diameter of x mm; a second step of preparing an insulating tape laminated with an insulating layer and an adhesive layer, wherein a width z of the insulating tape is z≤-0.3774x+24.547 mm, and an adhesive force c relative to the back side of the insulating tape on the opposite side of the adhesive layer is c≥3.2 N / 19 mm; and a third step of spirally winding the insulating tape prepared in the second step in such a manner that the adhesive layer is arranged toward the conductor prepared in the first step and an overlapping length y is y≥1.5099ln(x)-0.4959 mm.

[0013] Advantageous Effects of the Invention

[0014] According to the present invention, the possibility of the conductor being exposed during the bending process can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a perspective view showing an insulated wire according to an embodiment of the present invention;

[0016] Figure 2 yes Figure 1 An enlarged cross-sectional view of a portion of the structure shown in;

[0017] Figure 3 1 is a process diagram showing a method for manufacturing an insulated wire according to the present embodiment;

[0018] Figure 4 is a table showing Examples 1 to 12 and Comparative Examples 1 to 4;

[0019] Figure 5 is a table showing threshold values ​​of overlap length y based on experimental results in Examples 1 to 12 and Comparative Examples 1 to 4;

[0020] Figure 6 is a diagram showing the details of the experimental results and threshold values ​​in Examples 1 to 12 and Comparative Examples 1 to 4;

[0021] Figure 7 is a table showing Examples 13 to 21 and Comparative Examples 5 to 7;

[0022] Figure 8 is a table showing threshold values ​​of the width z of the insulating tape based on the experimental results in Examples 13 to 21 and Comparative Examples 5 to 7;

[0023] Fig. 9 is a diagram showing the details of the experimental results and threshold values ​​in Examples 13 to 21 and Comparative Examples 5 to 7;

[0024] Fig.10 is a table showing threshold values ​​of the width z of the insulating tape that is difficult to wind;

[0025] Fig.11 is a table showing Examples 22 to 27 and Comparative Examples 8 to 13;

[0026] Fig.12 is a table showing threshold values ​​of adhesive force c based on the experimental results in Examples 22 to 27 and Comparative Examples 8 to 13; and

[0027] Fig.13 It is a graph showing the details of the experimental results and threshold values ​​in Examples 22 to 27 and Comparative Examples 8 to 13. DETAILED DESCRIPTION

[0028] Hereinafter, the present invention will be described with reference to preferred embodiments. The present invention is not limited to the embodiments described below, and the embodiments may be appropriately changed without departing from the gist of the present invention. In the embodiments to be described below, there may be a portion in which the illustration and description of a part of the configuration are omitted, and needless to say, within the scope of not contradicting the contents to be described below, known or well-known techniques are appropriately applied to the details of the omitted techniques.

[0029] Figure 1 1 is a perspective view showing an insulated wire 1 according to an embodiment of the present invention. Figure 2 Yes Figure 1 An enlarged cross-sectional view of a portion of the structure shown. Figure 1 As shown, the insulated wire 1 according to the present embodiment includes a conductor 10 and an insulating tape 20 .

[0030] The conductor 10 is made of a conductive metal such as copper, aluminum, or an alloy thereof, and has a circular or substantially circular cross-sectional shape. Figure 2 As shown, the insulating tape 20 is formed by laminating an insulating layer 21 and an adhesive layer 22. The insulating tape 20 is directly spirally wound on the conductor 10 in a manner that the adhesive layer 22 is disposed toward the conductor 10. When wound on the conductor 10, the insulating tape 20 is wound in a manner having an overlapping length y in which the insulating tapes 20 overlap each other. Therefore, the insulated wire 1 is formed by directly winding the insulating tape 20 on the conductor 10 without exposing the metal constituting the conductor 10. In the present embodiment, the back side of the opposite side of the adhesive layer 22 is the insulating layer 21, but the present embodiment is not limited thereto, and another layer may be formed on the insulating layer 21, and the other layer may be located on the back side. In addition, another layer may be provided between the insulating layer 21 and the adhesive layer 22.

[0031] Here, even during bending (during bending from the radial direction), the conductor 10 in such an insulated wire 1 needs not to be exposed. Therefore, in the insulated wire 1 according to the present embodiment, the insulating tape 20 is provided with a back surface ( Figure 2The insulating layer 21 in the illustrated embodiment has an adhesive force c of 3.2 N / 19 mm or more. Therefore, the insulating tape 20 is less likely to move relatively during bending, and the conductor 10 is less likely to be exposed.

[0032] Furthermore, in the insulated wire 1 according to the present embodiment, when the diameter of the conductor 10 (conductor diameter) is x mm, the overlapping length y of the insulating tape 20 is 1.5099ln(x)-0.4959 mm or more. Thus, since the overlapping length y is 1.5099ln(x)-0.4959 mm or more, even if the insulating tape 20 is slightly displaced at the overlapping portion of the insulating tape 20 during bending, the overlapping length y can be ensured and the conductor can be prevented from being exposed.

[0033] In addition, in the insulated wire 1 according to the present embodiment, the width z of the insulating tape 20 is -0.3774x+24.547 mm or less. Here, when the width z is large, a large force is applied to one point on the overlap length y during bending, and the insulating tape 20 may be deflected. However, since the width z of the insulating tape 20 is -0.3774x+24.547 mm or less, this can be prevented.

[0034] In the insulated wire 1 according to the present embodiment, the width z of the insulating tape 20 is preferably less than 3.2978x+2.282 mm. When the width z is 3.2978x+2.282 or more and is too large relative to the conductor diameter x, the insulating tape 20 may wrinkle when it is spirally wound or the overlapping length y may gradually increase, making it difficult to spirally wind the insulating tape 20.

[0035] Next, a method of manufacturing the insulated wire 1 according to the present embodiment will be described. Figure 3 1 is a process diagram showing a method for manufacturing an insulated wire 1 according to the present embodiment. Figure 3 As shown, a conductor preparation step (first step) is performed. In this step, a conductor 10 having a conductor diameter of x mm is prepared.

[0036] Next, an insulating tape preparation process (second process) is performed. In this process, the prepared insulating tape 20 includes an insulating layer 21 and an adhesive layer 22 laminated thereon, and has a width z of -0.3774x+24.547 mm or less. In addition, in this process, the insulating tape 20 is prepared to have an adhesive force c of 3.2 N / 19 mm or more relative to the back surface of the insulating tape 20.

[0037] Next, an electron beam cross-linking process (fourth process) is performed. In this process, the insulating tape 20 prepared in the insulating tape preparation process is cross-linked by electron beams to increase the heat resistance temperature.

[0038] Thereafter, a winding process (third process) is performed. In this process, the insulating tape 20 prepared in the insulating tape preparation process and electron beam cross-linked in the electron beam cross-linking process is spirally wound on the conductor 10 prepared in the conductor preparation process in such a manner that the overlap length y ≥ 1.5099ln(x) - 0.4959 mm. At this time, the wound insulating tape 20 is wound in such a manner that the adhesive layer 22 of the insulating tape 20 is disposed toward the conductor 10.

[0039] By the above, the insulated wire 1 according to the present embodiment is obtained. As described above, the electron beam cross-linking process is performed before the winding process. When the electron beam cross-linking is performed after winding, one side of the insulating tape 20 is irradiated with the electron beam, and it is difficult to irradiate the other side with the conductor 10, thereby making it difficult to increase the heat resistance temperature of the other side. However, when the insulating tape 20 is irradiated before winding, the electron beam irradiation is not hindered by the conductor 10, and it is easier to irradiate the entire insulating tape 20 with the electron beam.

[0040] Next, Examples and Comparative Examples will be described. Figure 4 is a table showing Examples 1 to 12 and Comparative Examples 1 to 4. Figure 4 In Examples 1 to 12 and Comparative Examples 1 to 4 shown, an insulating tape (vinyl chloride tape) having an adhesive force c of 3.2 N / 19 mm and a width z of 19 mm was wound around a conductor at various overlapping lengths y to form an insulated wire.

[0041] More specifically, in Examples 1 to 4, an insulating tape was wound around a conductor having a conductor diameter x of 5.4 mm (10 sq) to form an insulated wire. The overlap length y was 2 mm in Example 1, 4 mm in Example 2, 4.8 mm in Example 3, and 6.3 mm in Example 4.

[0042] In addition, in Comparative Examples 1 and 2 and Examples 5 to 9, an insulating tape was wound around a conductor having a conductor diameter x of 9.4 mm (40 sq) to form an insulated wire. The overlap length y was 1.5 mm in Comparative Example 1, 2 mm in Comparative Example 2, 3 mm in Example 5, and 4 mm in Example 6. In addition, the overlap length y was 4.3 mm in Example 7, 4.8 mm in Example 8, and 5 mm in Example 9.

[0043] In addition, in Comparative Examples 3 and 4 and Examples 10 to 12, an insulating tape was wound around a conductor having a conductor diameter x of 14.7 mm (95 sq) to form an insulated wire. The overlap length y was 2 mm in Comparative Example 3, 3 mm in Comparative Example 4, 3.5 mm in Example 10, 4 mm in Example 11, and 4.5 mm in Example 12.

[0044] The insulated wires of Examples 1 to 12 and Comparative Examples 1 to 4 formed as described above were held in a radially bent state for several seconds, and the conductor was tested for exposure. As a result, no exposure occurred in Examples 1 to 12, but exposure occurred in Comparative Examples 1 to 4.

[0045] Figure 5 TABLE 1 is a table showing the threshold values ​​of the overlap length y based on the experimental results in Examples 1 to 12 and Comparative Examples 1 to 4. Figure 4 and Figure 5 As shown, when the conductor diameter x is 5.4 mm, when the overlap length y is 2 mm or more, that is, equal to or greater than Example 1, the conductor is prevented from being exposed. In addition, when the conductor diameter x is 9.4 mm, when the overlap length y is 3 mm or more, that is, equal to or greater than Example 5, the conductor is prevented from being exposed. In addition, when the conductor diameter x is 14.7 mm, when the overlap length y is 3.5 mm or more, that is, equal to or greater than Example 10, the conductor is prevented from being exposed.

[0046] Figure 6 : is a graph showing the details of the experimental results and threshold values ​​in Examples 1 to 12 and Comparative Examples 1 to 4. Figure 6 As shown in FIG. 1 , when the conductor diameter x is 5.4 mm, the overlap length y needs to be 2 mm or more, when the conductor diameter x is 9.4 mm, the overlap length y needs to be 3 mm or more, and when the conductor diameter x is 14.7 mm, the overlap length y needs to be 3.5 mm or more. Therefore, from the results of the approximate formulas obtained based on these logarithmic approximations, it can be seen that in the case of winding an insulating tape having an adhesive force c of 3.2 N / 19 mm and a width z of 19 mm, when the overlap length y is 1.5099ln(x)-0.4959 mm or more, the conductor is prevented from being exposed during radial bending.

[0047] Obviously, the greater the adhesion c, the more the conductor can be prevented from being exposed. Therefore, when the overlap length y is 1.5099ln(x)-0.4959mm or more, even in an insulating tape with an adhesion c greater than 3.2N / 19mm, the conductor can be prevented from being exposed during the radial bending process. As described above, the width z of the insulating tape is preferably smaller. Therefore, when the overlap length y is 1.5099ln(x)-0.4959mm or more, even in an insulating tape with a width z less than 19mm, the conductor can be prevented from being exposed during the radial bending process.

[0048] Figure 7 is a table showing Examples 13 to 21 and Comparative Examples 5 to 7. Figure 7In Examples 13 to 21 and Comparative Examples 5 to 7 shown in the drawings, insulating tapes (vinyl chloride tapes) having an adhesive force c of 3.2 N / 19 mm and having various widths z were used. Figure 5 The threshold overlap length y shown is wound around the conductor to form an insulated wire.

[0049] More specifically, in Examples 13 and 14, the insulating tape was wound around a conductor having a conductor diameter x of 5.4 mm with an overlap length y of 2 mm to form an insulated wire. The width z of the insulating tape was 13 mm in Example 13 and 19 mm in Example 14.

[0050] In addition, in Examples 15 to 17 and Comparative Example 5, the insulating tape was wound around a conductor having a conductor diameter x of 9.4 mm with an overlap length y of 3 mm to form an insulated wire. The width z of the insulating tape was 13 mm in Example 15, 19 mm in Example 16, 21 mm in Example 17, and 25 mm in Comparative Example 5.

[0051] In addition, in Examples 18 to 21 and Comparative Examples 6 and 7, the insulating tape was wound around a conductor having a conductor diameter x of 14.7 mm with an overlap length y of 3.5 mm to form an insulated wire. The width z of the insulating tape was 13 mm in Example 18, 15 mm in Example 19, 17 mm in Example 20, 19 mm in Example 21, 21 mm in Comparative Example 6, and 25 mm in Comparative Example 7.

[0052] The insulated wires in Examples 13 to 21 and Comparative Examples 5 to 7 formed as described above were held in a radially bent state for several seconds, and the conductor was tested for exposure. As a result, no exposure occurred in Examples 13 to 21, but exposure occurred in Comparative Examples 5 to 7.

[0053] Figure 8 TABLE 1 is a table showing the threshold values ​​of the width z of the insulating tape based on the experimental results in Examples 13 to 21 and Comparative Examples 5 to 7. Figure 7 and Figure 8 As shown, when the conductor diameter x is 5.4 mm, as shown in Examples 13 and 14, the conductor is not exposed, but the threshold value cannot be obtained. On the other hand, in the case where the conductor diameter x is 9.4 mm, when the width z is 21 mm or less, that is, equal to or less than Example 17, the conductor is prevented from being exposed. In addition, in the case where the conductor diameter x is 14.7 mm, when the width z is 19 mm or less, that is, equal to or less than Example 21, the conductor is prevented from being exposed.

[0054] Fig. 9 : is a graph showing the details of the experimental results and threshold values ​​in Examples 13 to 21 and Comparative Examples 5 to 7. Fig. 9 As shown in FIG. 1 , when the conductor diameter x is 9.4 mm, the width z of the insulating tape needs to be less than 21 mm, and when the conductor diameter x is 14.7 mm, the width z of the insulating tape needs to be less than 19 mm. Therefore, from the results of the approximate formula obtained based on these linear approximations, it can be seen that Figure 5 When the insulating tape having an adhesive force c of 3.2 N / 19 mm is wound with the overlap length y shown, when the width z of the insulating tape is less than -0.3774x+24.547, the conductor is prevented from being exposed during radial bending.

[0055] like Figure 6 As shown in the figure, it is obvious that the larger the overlap length y is, the better it can prevent the conductor from being exposed. Therefore, when the width z of the insulating tape is less than -0.3774x+24.547mm, even if the overlap length y is greater than Figure 5 When the thickness of the insulating tape is less than the threshold value shown in FIG. 1 , the conductor can be prevented from being exposed during the radial bending process. In addition, it is obvious that the greater the adhesive force c, the more the conductor can be prevented from being exposed. Therefore, when the width z of the insulating tape is less than -0.3774x+24.547 mm, even in the insulating tape with an adhesive force c greater than 3.2 N / 19 mm, the conductor can be prevented from being exposed during the radial bending process.

[0056] Fig.10 : is a table showing the threshold value of the width z of the insulating tape that is difficult to wind. Here, when the width z of the insulating tape is too large, the insulating tape may wrinkle when it is wound spirally or the overlap length y may gradually increase, making it difficult to wind the insulating tape into a spiral. The width z at which it is extremely difficult to wind spirally can be calculated according to (circumference of the conductor) + (threshold value of the overlap length y) + 1. Therefore, the width z of the insulating tape is preferably less than 3.2978x + 2.282, as shown in FIG. Fig.10 As shown in FIG. 1 , when the conductor diameter x is 5.4 mm, it is 20 mm; when the conductor radius x is 9.4 mm, it is 34 mm; and when the conductor width x is 14.7 mm, it is 51 mm. Therefore, the width z of the insulating tape that does not wrinkle, can easily maintain the overlap length y, and can prevent the conductor from being exposed during radial bending is less than -0.3774x+24.547 mm and less than 3.2977x+2.282 mm. That is, Fig. 9 The shaded area in .

[0057] Fig.11 is a table showing Examples 22 to 27 and Comparative Examples 8 to 13. Fig.11 In Examples 22 to 27 and Comparative Examples 8 to 13 shown in the drawings, insulating tapes (vinyl chloride tapes) having a width z of 19 mm and having various adhesive strengths c were placed on the Figure 5 The threshold overlap length y shown is wound around the conductor to form an insulated wire.

[0058] More specifically, in Comparative Examples 8 and 9 and Examples 22 and 23, the insulating tape was wound around a conductor having a conductor diameter x of 5.4 mm with an overlap length y of 2 mm to form an insulated wire. The adhesive force c was 2.36 N / 19 mm in Comparative Example 8, 2.74 N / 19 mm in Comparative Example 9, 3.2 N / 19 mm in Example 22, and 5 N / 19 mm in Example 23.

[0059] In addition, in Comparative Examples 10 and 11 and Examples 24 and 25, the insulating tape was wound around a conductor having a conductor diameter x of 9.4 mm with an overlap length y of 3 mm to form an insulated wire. The adhesive force c was 2.36 N / 19 mm in Comparative Example 10, 2.74 N / 19 mm in Comparative Example 11, 3.2 N / 19 mm in Example 24, and 5 N / 19 mm in Example 25.

[0060] In addition, in Comparative Examples 12 and 13 and Examples 26 and 27, the insulating tape was wound around a conductor having a conductor diameter x of 14.7 mm with an overlap length y of 3.5 mm to form an insulated wire. The adhesive force c was 2.36 N / 19 mm in Comparative Example 12, 2.74 N / 19 mm in Comparative Example 13, 3.2 N / 19 mm in Example 26, and 5 N / 19 mm in Example 27.

[0061] The insulated wires of Examples 22 to 27 and Comparative Examples 8 to 13 formed as described above were held in a radially bent state for several seconds, and the conductor was tested for exposure. As a result, no exposure occurred in Examples 22 to 27, but exposure occurred in Comparative Examples 8 to 13.

[0062] Fig.12 : is a table showing the threshold values ​​of the adhesive force c based on the experimental results in Examples 22 to 27 and Comparative Examples 8 to 13. Fig.11 and Fig.12 As shown, when the conductor diameter x is 5.4 mm, when the adhesive force c is 3.2 N / 19 mm or more, that is, equal to or greater than Example 22, the conductor is prevented from being exposed. In addition, when the conductor diameter x is 9.4 mm, when the adhesive force c is 3.2 N / 19 mm or more, that is, equal to or greater than Example 24, the conductor is prevented from being exposed. In addition, when the conductor diameter x is 14.7 mm, it is 3.2 N / 19 mm or more, that is, equal to or greater than Example 26, and the conductor is prevented from being exposed.

[0063] Fig.13 : is a graph showing the details of the experimental results and threshold values ​​in Examples 22 to 27 and Comparative Examples 8 to 13. Fig.13As shown in FIG. 1 , for all cases where the conductor diameter x is 5.4 mm, 9.4 mm, and 14.7 mm, the adhesive force c of the insulating tape needs to be 3.2 N / 19 mm or more. Figure 5 In the case of the insulating tape having an overlap length y and a winding width z of 19 mm, when the adhesive force c of the insulating tape is 3.2 N / 19 mm or more, the conductor is prevented from being exposed during radial bending.

[0064] like Figure 6 As shown in the figure, it is obvious that the larger the overlap length y is, the more the conductor can be prevented from being exposed. Therefore, when the adhesive force c of the insulating tape is ensured to be 3.2N / 19mm, even when the overlap length y is greater than Figure 5 The insulating tape with the threshold value shown can also prevent the conductor from being exposed during radial bending. Figure 7 As shown, the smaller the width z of the insulating tape is, the more the conductor can be prevented from being exposed. Therefore, when the adhesive force c of the insulating tape is ensured to be 3.2N / 19mm, even in the insulating tape with a width z of 19mm or less, the conductor can be prevented from being exposed during radial bending.

[0065] Based on the above-mentioned embodiments 1 to 27 and comparative examples 1 to 13, when the overlapping length y of the insulating tape is greater than 1.5099ln(x)-0.4959mm, the width z is less than -0.3774x+24.547mm, and the adhesion c relative to the back side of the insulating tape is greater than 3.2N / 19mm, the conductor is prevented from being exposed during radial bending.

[0066] Thus, for the insulated wire 1 according to the present embodiment, since the adhesive force c of the insulating tape 20 relative to the back surface of the insulating tape 20 is 3.2N / 19mm or more, the insulating tape 20 is less likely to move relatively during the bending process. In addition, since the overlapping length y is 1.5099ln(x)-0.4959mm or more, the overlapping length y can be ensured even if there is a slight deviation, and the conductor exposure can be prevented. When the width z of the insulating tape 20 is large, a large force is applied to a point on the overlapping length y during the bending process, and the insulating tape 20 is likely to be deflected, but since the width z of the insulating tape is -0.3774x+24.547mm or less, this can be prevented. Therefore, the possibility of the conductor 10 being exposed during the bending process can be reduced.

[0067] In addition, since the width z of the insulating tape 20 is less than 3.2978x+2.282 mm, it is possible to prevent the width z of the insulating tape 20 from being too large relative to the conductor diameter x, the insulating tape 20 from wrinkling when being spirally wound, or the overlapping length y from gradually increasing, making it difficult to wind the insulating tape 20 into a spiral shape.

[0068] Furthermore, by the method for manufacturing the insulated wire 1 according to the present embodiment, it is possible to provide an insulated wire in which the possibility of the conductor 10 being exposed during bending is reduced.

[0069] Furthermore, since electron beam cross-linking is performed before the insulating tape 20 is wound, the entire insulating tape 20 can be easily irradiated with an electron beam. That is, when the insulating tape 20 is irradiated with an electron beam after winding, one side of the insulating tape 20 is irradiated with an electron beam, and it is difficult to irradiate the other side (i.e., the opposite side) with an electron beam across the conductor 10, thereby making it difficult to increase the heat-resistant temperature of the other side. However, when the insulating tape 20 is irradiated before winding, the electron beam is not hindered by the conductor 10, and it is easier to irradiate the entire insulating tape 20 with an electron beam. Therefore, it is easy to appropriately increase the heat-resistant temperature.

[0070] Although the present invention has been described above based on the embodiments, the present invention is not limited to the above embodiments, and may be modified without departing from the gist of the present invention, and known or publicly known technologies may be combined.

[0071] For example, in the above description, it is assumed that the conductor 10 is a single wire, but the conductor 10 is not limited thereto, and may be a twisted wire in which a plurality of wires are twisted together.

[0072] In the above-mentioned embodiments and comparative examples, the experiments were conducted when the conductor diameter x was 5.4 mm or more. This is because extrusion coating is more effective when the conductor diameter x is less than 5.4 mm. One of the reasons for forming the insulated wire 1 by winding the insulating tape 20 on the conductor 10 is to reduce the diameter of the insulated wire 1 itself. When the conductor diameter x is less than 5.4 mm, the insulated wire 1 can be made thin enough even by extrusion coating. In addition, in the above-mentioned embodiments and comparative examples, the experiments were conducted below 14.7 mm. This is because when the conductor diameter x is greater than 14.7 mm, it is difficult to perform self-radial bending when the insulating tape 20 is wound on the conductor.

[0073] This application is based on Japanese patent application (No. 2023-005646) filed on January 18, 2023, the contents of which are incorporated herein by reference.

[0074] Reference Mark List

[0075] 1: Insulated wire

[0076] 10: Wire

[0077] 20: Insulation tape

[0078] 21: Insulation layer

[0079] 22: Adhesive layer

[0080] c: Adhesion

[0081] x: conductor diameter

[0082] y: overlap length

[0083] z: width

Claims

1. An insulated wire formed by spirally winding an insulating tape having an insulating layer and an adhesive layer laminated thereon on a conductor in such a manner that the adhesive layer is disposed toward the conductor, wherein: When the conductor diameter is x mm, the overlapping length y of the insulating tape is y≥1.5099ln(x)-0.4959mm, the width z is z≤-0.3774x+24.547mm, and the adhesive force c relative to the back side of the insulating tape opposite to the adhesive layer is c≥3.2N / 19mm.

2. The insulated wire according to claim 1, wherein The width z is set to z<3.2978x+2.282 mm.

3. A method for manufacturing an insulated wire, comprising: In the first step, a conductor with a conductor diameter of x mm is prepared; A second step is to prepare an insulating tape laminated with an insulating layer and an adhesive layer, wherein a width z of the insulating tape is z≤-0.3774x+24.547 mm, and an adhesive force c of c≥3.2 N / 19 mm relative to the back side of the insulating tape opposite to the adhesive layer; and The third step is to spirally wind the insulating tape prepared in the second step so that the adhesive layer is disposed toward the conductor prepared in the first step and the overlapping length y satisfies y≥1.5099ln(x)-0.4959 mm.

4. The method for manufacturing an insulated wire according to claim 3, further comprising: The fourth step is to electron beam cross-link the insulating tape prepared in the second step to increase the heat resistance temperature, wherein: The third step includes spirally winding the insulating tape cross-linked by the electron beam in the fourth step.

Citation Information

Patent Citations

  • Thermal processing torch and thermal processing system

    JP2023005646A