Plasma processing apparatus, substrate processing system and fixture

By employing axially detachable fasteners in the plasma processing device, the problem of inconvenient disassembly and assembly of components is solved, enabling convenient maintenance and replacement and improving the system's maintenance efficiency.

CN119856260BActive Publication Date: 2025-12-30TOKYO ELECTRON LTD
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Patent Information

Application Number
CN202480003950.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2024-04-09
Filing Date
2024-06-13
Publication Date
2025-12-30
Estimated Expiration
2044-06-13

AI Technical Summary

Technical Problem

In the existing technology, the components of plasma processing devices and substrate processing systems are inconvenient to disassemble and assemble, which makes maintenance and replacement of components difficult.

Method used

The first and second components are fixed together by means of axial detachable fasteners with convex and concave parts. The components are detachable by means of the cooperation of shaft components, retaining components and ball-shaped components, and the components are moved and fixed by means of fluid or elastic components.

Benefits of technology

It enables convenient disassembly and assembly between the components of the plasma processing device and the substrate processing system, improving the efficiency of maintenance and component replacement.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a technology for making it easy to disassemble and assemble constituent parts of a plasma processing apparatus and a substrate processing system. The present invention provides a plasma processing apparatus including a chamber. The apparatus includes a first part, a second part, and a fixing member configured to fix the first part and the second part together in a manner that is disassemblable along an axial direction, the fixing member including a male member fixed to the first part and a female member fixed to the second part and configured to receive the male member. The male member includes a shaft member extending in the axial direction and expanding in diameter at a front end. The male member includes a receiving member fixed to the second part, a holding member disposed inside the receiving member, and a spherical member held by the holding member. The spherical member is configured to be guided by a tapered portion of an inner wall of the receiving member to move to an inner side in a radial direction when the holding member moves in a first direction that is the axial direction and a direction toward the opening.
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Description

Technical Field

[0001] The exemplary embodiments of the present invention relate to a plasma processing apparatus, a substrate processing system, and a fixture. Background Technology

[0002] Patent document 1 discloses that an electrostatic chuck is fastened to an electrostatic chuck mounting plate by means of a plurality of first fasteners, and a mounting stage for mounting a substrate is fastened to a support member by means of a plurality of second fasteners.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent document 1: Japanese Patent Application Publication No. 2019-197830. Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This invention provides a technique that facilitates the assembly and disassembly of components in a plasma processing apparatus and a substrate processing system.

[0008] Technical means for solving problems

[0009] In one exemplary embodiment of the present invention, a plasma processing apparatus having a chamber is provided, comprising: a first component; a second component; and a fastener configured to detachably fasten the first component and the second component together along an axial direction. The fastener includes: a convex component fixed to the first component; and a concave component fixed to the second component and configured to receive the convex component. The convex component includes a shaft component extending axially and expanding at its front end. The concave component includes: a receiving component fixed to the second component; a retaining component disposed within the receiving component; and a spherical component held by the retaining component. The receiving component includes: an opening for receiving the shaft component of the convex component; and a receiving space for receiving the retaining component and the spherical component. The inner wall of the receiving component defining the receiving space includes a tapered portion that narrows radially. The retaining component is configured to be movable axially within the receiving space while holding the spherical component. The spherical component is configured to be guided radially inward by the tapered portion of the inner wall when the retaining component moves axially in a first direction toward the opening.

[0010] Invention Effects

[0011] According to an exemplary embodiment of the present invention, a technique is provided that facilitates the assembly and disassembly of components of a plasma processing apparatus and a substrate processing system. Attached Figure Description

[0012] Figure 1This is a diagram illustrating a structural example of a plasma processing system.

[0013] Figure 2 This is a diagram illustrating a structural example of a capacitively coupled plasma processing device.

[0014] Figure 3 This is a diagram that schematically illustrates an example of a fixed structure FS.

[0015] Figure 4A This is a diagram illustrating an example of the movement of a spherical component.

[0016] Figure 4B This is a diagram illustrating an example of the movement of a spherical component.

[0017] Figure 5 This is a diagram illustrating an example of how fastener F is used.

[0018] Figure 6A This is another example of a drive mechanism for holding components.

[0019] Figure 6B This is another example of a drive mechanism for holding components.

[0020] Figure 7 This is a diagram used to illustrate another example of fastener F.

[0021] Figure 8 This is another example of a fastener F and its operation.

[0022] Figure 9 This is another example of a fastener F and its operation.

[0023] Figure 10 This is a diagram illustrating the structure of a substrate processing system (PS).

[0024] Figure 11 This is a diagram illustrating an application example of fastener F. Detailed Implementation

[0025] Hereinafter, various embodiments of the present invention will be described.

[0026] In one exemplary embodiment, a plasma processing apparatus having a chamber is provided, comprising: a first component; a second component; and a fastener configured to detachably fasten the first component and the second component together along an axial direction. The fastener includes: a convex component fastened to the first component; and a concave component fastened to the second component and configured to receive the convex component. The convex component includes a shaft component extending axially and widening at its front end. The concave component includes: a receiving component fastened to the second component; a retaining component disposed within the receiving component; and a spherical component held by the retaining component. The receiving component includes: an opening for receiving the shaft component of the convex component; and a receiving space for receiving the retaining component and the spherical component. The inner wall of the receiving component defining the receiving space includes a tapered portion that narrows radially. The retaining component is configured to be movable axially within the receiving space while holding the spherical component. The spherical component is configured to be guided radially inward by the tapered portion of the inner wall when the retaining component moves axially in a first direction toward the opening.

[0027] In one exemplary embodiment, the retaining member is movable in a first direction under the action of an elastic member disposed within the storage space.

[0028] In one exemplary embodiment, the retaining component is movable in a first direction under the action of a first fluid flowing into the receiving space.

[0029] In one exemplary embodiment, the retaining component is movable in a second direction opposite to the first direction under the action of a second fluid flowing into the receiving space.

[0030] In one exemplary embodiment, the receiving space includes a first space into which a first fluid can flow and a second space into which a second fluid can flow, the first space and the second space being sealed by a sealing member.

[0031] In one exemplary embodiment, the second space is located closer to the opening side than the first space, and the second space and the opening are sealed by a sealing member.

[0032] In one exemplary embodiment, the retaining component is configured to be subjected to a force in a first direction or a force in a second direction opposite to the first direction via a cylinder or an electric motor.

[0033] In one exemplary embodiment, the retaining member further includes a locking structure that restricts the spherical member from moving radially inward.

[0034] In one exemplary embodiment, at least one of the first component and the second component is a component disposed within the cavity.

[0035] In one exemplary embodiment, at least one of the first component and the second component is a component constituting a chamber or a component disposed outside the chamber.

[0036] In one exemplary embodiment, a sealing member is also included, which seals the space outside the chamber with the opening while the first and second components are fixed by the fastener.

[0037] In one exemplary embodiment, at least one of the first component and the second component constitutes an electrode of the plasma processing apparatus, and the fixing member is configured to provide a conductive path to the electrode by electrically connecting the convex component and the concave component to each other while the first component and the second component are fixed by the fixing member.

[0038] In one exemplary embodiment, a plasma processing apparatus having a chamber is provided, comprising: a first component; a second component; and a fixing member configured to detachably fix the first component and the second component together along an axial direction. The fixing member includes: a convex component fixed to the first component; and a concave component fixed to the second component and configured to receive the convex component. The concave component includes: a first movable body configured to move axially between a clamped position and a non-clamped position; and a second movable body held by the first movable body and configured to move in the clamped position to a position restricting axial movement of the convex component, and in the non-clamped position to a position that does not impede axial movement of the convex component.

[0039] In one exemplary embodiment, at least one of the first and second components constitutes an electrode of the plasma processing apparatus, and the fixing member is configured to provide a conductive path to the electrode by means of an convex component and a concave component electrically connected to each other in a clamping position.

[0040] In one exemplary embodiment, a substrate processing system having one or more chambers includes: a first component; a second component; and a fastener configured to detachably fasten the first component and the second component together along an axial direction. The fastener includes: a convex component fixed to the first component; and a concave component fixed to the second component and configured to receive the convex component. The convex component includes a shaft component extending axially and widening at its front end. The concave component includes: a receiving component fixed to the second component; a retaining component disposed within the receiving component; and a spherical component held by the retaining component. The receiving component includes: an opening for receiving the shaft component of the convex component; and a receiving space for receiving the retaining component and the spherical component. The inner wall of the receiving component defining the receiving space includes a tapered portion that narrows radially. The retaining component is configured to be movable axially within the receiving space while holding the spherical component. The spherical component is configured to be guided radially inward by the tapered portion of the inner wall when the retaining component moves axially in a first direction toward the opening.

[0041] In one exemplary embodiment, the substrate processing system includes: a transport chamber including a wall having an opening in communication with a cavity; and an opening / closing device including a closing portion configured to move within the transport chamber to close the opening, the wall of the transport chamber constituting one of a first component and a second component, and the closing portion of the opening / closing device constituting the other of the first component and the second component.

[0042] In one exemplary embodiment, a fixture for a substrate processing system is provided, comprising: a convex member including a shaft member; and a concave member that detachably secures the shaft member of the convex member, the concave member comprising: a first movable body configured to move axially between a clamped position and a non-clamped position; a second movable body held by the first movable body and configured to move in the clamped position to a position restricting axial movement of the shaft member of the convex member, and in the non-clamped position to a position that does not impede axial movement of the convex member; and a third movable body configured to push the shaft member of the convex member in the non-clamped position to move the shaft member axially.

[0043] In one exemplary embodiment, a fixture for a substrate processing system is provided, comprising a concave component and a convex component. The concave component includes: an inner wall defining a receiving space; and an engaging portion disposed on a portion of the inner wall. The convex component includes: a shaft component configured to be axially movable within the receiving space; and a movable body configured to move between a clamped position engaging with the engaging portion of the concave component and a non-clamped position not engaging with the engaging portion of the concave component, accompanying axial movement of the shaft component. The shaft component is configured to be axially movable to push against the inner wall of the concave component when the engaging portion is in the non-clamped position.

[0044] In one exemplary embodiment, a substrate processing system is provided, comprising: the aforementioned fixing member; a transport chamber including a wall having an opening communicating with a cavity; and an opening / closing device including a closing portion configured to move within the transport chamber to close the opening, one of a convex member and a concave member being disposed on the wall of the transport chamber, and the other of the convex member and the concave member facing the closing portion of the opening / closing device.

[0045] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in each drawing, the same or identical elements are labeled with the same reference numerals, and repeated descriptions are omitted. Unless otherwise specified, positional relationships such as up, down, left, and right are described based on the positional relationships shown in the drawings. The scale of the drawings does not represent actual scales, and actual scales are not limited to those shown in the drawings.

[0046] <Structural Example of a Plasma Processing System>

[0047] Figure 1 This is a diagram illustrating a structural example of a plasma processing system. In one embodiment, the plasma processing system includes a plasma processing apparatus 1 and a control unit 2. The plasma processing system is an example of a substrate processing system, and the plasma processing apparatus 1 is an example of a substrate processing apparatus. The plasma processing apparatus 1 includes a plasma processing chamber 10, a substrate support 11, and a plasma generation unit 12. The plasma processing chamber 10 has a plasma processing space. Furthermore, the plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space and at least one gas outlet for discharging gas from the plasma processing space. The gas supply port is connected to the gas supply unit 20 (described later), and the gas outlet is connected to the exhaust system 40 (described later). The substrate support 11 is disposed within the plasma processing space and has a substrate support surface for supporting a substrate.

[0048] The plasma generation unit 12 is configured to generate plasma from at least one process gas supplied to the plasma processing space. The plasma generated in the plasma processing space can be capacitively coupled plasma (CCP), inductively coupled plasma (ICP), electron-cyclotron-resonance plasma (ECR), helicon wave plasma (HWP), or surface wave plasma (SWP), etc. Alternatively, various types of plasma generation units, including AC (Alternating Current) plasma generation units and DC (Direct Current) plasma generation units, can be used. In one embodiment, the AC signal (AC power) used in the AC plasma generation unit has a frequency in the range of 100 kHz to 10 GHz. Therefore, the AC signal includes RF (Radio Frequency) signals and microwave signals. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.

[0049] The control unit 2 processes computer-executable commands that cause the plasma processing apparatus 1 to perform the various steps described herein. The control unit 2 is capable of controlling various elements of the plasma processing apparatus 1 to perform the various steps described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 is implemented, for example, by a computer 2a. The processing unit 2a1 may be configured to perform various control operations by reading a program from the storage unit 2a2 and executing the read program. The program may be pre-stored in the storage unit 2a2 or retrieved via a medium when needed. The retrieved program is stored in the storage unit 2a2 and read and executed by the processing unit 2a1 from the storage unit 2a2. The medium may be various storage media readable by the computer 2a, or a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 may also communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network).

[0050] Hereinafter, a structural example of a capacitively coupled plasma processing device, which is one example of plasma processing device 1, will be described. Figure 2 This is a diagram illustrating a structural example of a capacitively coupled plasma processing device.

[0051] The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. Additionally, the plasma processing apparatus 1 includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas inlet includes a spray head 13. The substrate support 11 is disposed within the plasma processing chamber 10. The spray head 13 is disposed above the substrate support 11. In one embodiment, the spray head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the spray head 13, the sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 is grounded. The spray head 13 and the substrate support 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0052] The substrate support portion 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region 111a for supporting a substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111 when viewed from above. The substrate W is disposed on the central region 111a of the main body portion 111, and the annular assembly 112 is disposed on the annular region 111b of the main body portion 111 in such a way that it surrounds the substrate W on the central region 111a of the main body portion 111. Therefore, the central region 111a is also referred to as a substrate support surface for supporting the substrate W, and the annular region 111b is also referred to as an annular support surface for supporting the ring assembly 112.

[0053] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive component. The conductive component of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic component 1111a and an electrostatic electrode 1111b disposed within the ceramic component 1111a. The ceramic component 1111a has a central region 111a. In one embodiment, the ceramic component 1111a also has an annular region 111b. Furthermore, other components surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating component, may also have an annular region 111b. In this case, the ring assembly 112 may be disposed on either the annular electrostatic chuck or the annular insulating component, or on both the electrostatic chuck 1111 and the annular insulating component. Additionally, at least one RF / DC electrode coupled to the RF power supply 31 and / or DC power supply 32 (described later) may also be disposed within the ceramic component 1111a. In this case, the at least one RF / DC electrode functions as a lower electrode. When the bias RF signal and / or DC signal (described later) are supplied to the at least one RF / DC electrode, the RF / DC electrode is also referred to as a bias electrode. Furthermore, the conductive components of the base 1110 and the at least one RF / DC electrode may also function as multiple lower electrodes. Additionally, the electrostatic electrode 1111b may also function as a lower electrode. Therefore, the substrate support portion 11 includes at least one lower electrode.

[0054] The ring assembly 112 includes one or more annular components. In one embodiment, the one or more annular components include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0055] Additionally, the substrate support 11 may also include a temperature control module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 1110a, or a combination thereof. A heat transfer fluid such as brine or gas flows in the flow path 1110a. In one embodiment, the flow path 1110a is formed within the base 1110, and one or more heaters are disposed within the ceramic component 1111a of the electrostatic chuck 1111. Furthermore, the substrate support 11 may also include a heat transfer gas supply section configured to supply heat transfer gas to the gap between the back surface of the substrate W and the central region 111a.

[0056] The spray head 13 is configured to introduce at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The spray head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas inlets 13c. The process gas supplied to the gas supply port 13a is introduced into the plasma processing space 10s through the gas diffusion chamber 13b and the plurality of gas inlets 13c. Additionally, the spray head 13 includes at least one upper electrode. Furthermore, in addition to the spray head 13, the gas inlet may also include one or more side gas injectors (SGIs) mounted on one or more openings formed on the sidewall 10a.

[0057] The gas supply unit 20 may also include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one process gas from a corresponding gas source 21 to the spray head 13 via a corresponding flow controller 22. Each flow controller 22 may, for example, include a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may also include at least one flow modulation device for modulating or pulsed the flow rate of the at least one process gas.

[0058] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This causes at least one processing gas supplied to the plasma processing space 10s to form plasma. Therefore, the RF power supply 31 can function as at least a part of the plasma generation unit 12. Furthermore, by supplying a bias RF signal to at least one lower electrode, a bias potential can be generated on the substrate W, introducing ionic components from the formed plasma into the substrate W.

[0059] In one embodiment, the RF power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit, and is configured to generate a generation source RF signal (generation source RF power) for plasma generation. In one embodiment, the generation source RF signal has a frequency in the range of 10MHz to 150MHz. In one embodiment, the first RF generation unit 31a may also be configured to generate multiple generation source RF signals with different frequencies. The generated one or more generation source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0060] The second RF generation unit 31b is coupled to at least one lower electrode via at least one impedance matching circuit, and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than that of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generation unit 31b may also be configured to generate multiple bias RF signals with different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In addition, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0061] Alternatively, the power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generating unit 32a and a second DC generating unit 32b. In one embodiment, the first DC generating unit 32a is connected to at least one lower electrode and is configured to generate a first DC signal. The generated first DC signal is applied to at least one lower electrode. In one embodiment, the second DC generating unit 32b is connected to at least one upper electrode and is configured to generate a second DC signal. The generated second DC signal is applied to at least one upper electrode.

[0062] In various embodiments, the first and second DC signals can also be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses can have rectangular, trapezoidal, triangular, or combinations thereof pulse waveforms. In one embodiment, a waveform generation unit for generating a sequence of voltage pulses based on the DC signal is connected between the first DC generation unit 32a and at least one lower electrode. Therefore, the first DC generation unit 32a and the waveform generation unit constitute a voltage pulse generation unit. When the second DC generation unit 32b and the waveform generation unit constitute a voltage pulse generation unit, the voltage pulse generation unit is connected to at least one upper electrode. The voltage pulses can have positive or negative polarity. Additionally, the sequence of voltage pulses can also include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. Furthermore, the first and second DC generation units 32a and 32b can be further provided based on the RF power supply 31, and the first DC generation unit 32a can also be provided instead of the second RF generation unit 31b.

[0063] The exhaust system 40 can be connected, for example, to a gas outlet 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may also include a pressure regulating valve and a vacuum pump. The pressure regulating valve is used to regulate the pressure within the plasma processing space 10s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0064] <An example of fastener F>

[0065] Figure 3 This is a diagram schematically illustrating one example of a fixing device F in one embodiment. In one embodiment, the fixing device F can be used to... Figure 1 , Figure 2 The components of the plasma processing apparatus 1 shown are fixed together. The fixing member F is configured to secure the two components of the plasma processing apparatus 1 along the axial direction (…). Figure 3 The Z-axis direction is fixed by a disassembly and assembly method. The axial direction can vary depending on the configuration of the components fixed by the fastener F. The axial direction can be perpendicular to the horizontal plane of the plasma processing device 1 (the main surface of the substrate support 11). Figure 2 The direction (up and down) can also be a parallel direction ( Figure 2 It can be the left or right direction, or it can be the tilt direction.

[0066] like Figure 3 As shown, the fixing member F includes a convex member F1 and a concave member F2. The convex member F1 is fixed to a first member CP1 (not shown), which is a component of the plasma processing apparatus 1. The concave member F2 is fixed to a second member CP2 (not shown), which is a component of the plasma processing apparatus 1.

[0067] In one embodiment, at least one of the first component CP1 and the second component CP2 can be a component (e.g., electrostatic chuck 1111, base 1110, etc.) disposed within the plasma processing chamber 10 (hereinafter also referred to as "chamber 10"). For example, the first component CP1 can be the electrostatic chuck 1111, and the second component CP2 can be the base 1110. Alternatively, for example, the first component CP1 can also be the base 1110, and the second component CP2 can also be the electrostatic chuck 1111. In one embodiment, the first component CP1 and / or the second component CP2 can constitute the lower electrode of the plasma processing apparatus 1. In one embodiment, at least one of the first component CP1 and the second component CP2 can be a component constituting the chamber 10 (e.g., spray head 13, sidewall 10a, etc.). For example, the first component CP1 can be the spray head 13, and the second component CP2 can be the sidewall 10a. Alternatively, for example, the first component CP1 can also be the sidewall 10a, and the second component CP2 can also be the spray head 13. Alternatively, for example, if the spray head 13 is composed of multiple components, the first component CP1 may be one component of the spray head 13 (in one example, the top plate facing the plasma processing space 10s), and the second component CP2 may be another component of the spray head 13 (e.g., a support supporting the top plate). In one embodiment, the first component CP1 and / or the second component CP2 may constitute the upper electrode of the plasma processing apparatus 1. In one embodiment, at least one of the first component CP1 and the second component CP2 may be a component outside the chamber 10 (e.g., a gas supply unit 20, an exhaust system 40, etc.).

[0068] In one embodiment, the first component CP1 and the second component CP2 may be composed of one or more components. In one embodiment, at least one of the first component CP1 and the second component CP2 may be a component that is replaced due to consumption, modification, or the like.

[0069] like Figure 3 As shown, the convex component F1 includes a shaft component F10 extending axially (z-direction). The shaft component F10 includes a head F102 that is expanded at one end axially. The convex component F1 may include a support component F12 supporting the other end of the shaft component F10. In one embodiment, the convex component F1 can also be fixed to the first component CP1 (not shown) by fixing the support component F12 to the first component CP1. In one embodiment, a first sealing component SL1 may be provided on the surface of the support component F12.

[0070] In one embodiment, the convex component F1 may also exclude the support component F12. In this case, the other end of the shaft component F10 is fixed to the first component CP1, thereby fixing the convex component F1 to the first component CP1.

[0071] like Figure 3 As shown, the concave component F2 includes: a receiving component F20; a holding component F22 disposed within the receiving component F20; and a spherical component F24 held by the holding component F22.

[0072] The storage component F20 includes an outer wall W1 and an inner wall W2. In one embodiment, at least a portion of the outer wall W1 of the storage component F20 is fixed to a second component CP2 (not shown).

[0073] Alternatively, in one embodiment, a portion of the second component CP2 may also form part of the outer wall W1 and inner wall W2 of the receiving component F20. For example, Figure 3 The upper end F200 of the storage component F20 can also be part of the second component CP2, or integrated with the second component CP2. In this case, a second sealing component SL2 can be provided to seal the upper end F200 of the storage component F20 with the rest of the component.

[0074] The inner wall W2 of the storage component F20 defines the storage space SP and the opening OP. The storage space SP houses the retaining component F22, the spherical component F24, etc. In one embodiment, the storage space SP can be divided into multiple mutually sealed spaces. For example, in... Figure 3 In the example shown, the receiving space SP is divided into a first space SP1, a second space SP2, and a third space SP3 from the distal side to the proximal side of the opening OP. The first space SP1 and the second space SP2 can be configured to receive the first fluid FL1 and the second fluid FL2, described later, respectively. In this case, the first space SP1 communicates with the opening through which the first fluid FL1 flows in and / or flows out. Additionally, the second space SP2 communicates with the opening through which the second fluid FL2 flows in and / or flows out. The third space SP3 is the space where the spherical member F24 is disposed. In one embodiment, a third sealing member SL3 may be provided between the first space SP1 and the second space SP2. In one embodiment, a fourth sealing member SL4 may be provided between the second space SP2 and the third space SP3.

[0075] The opening OP communicates with the third space SP3. The opening OP has a diameter larger than the head F102 of the shaft member F10. Therefore, the shaft member F10 can be inserted into and removed relative to the receiving space SP through the opening OP. Furthermore, a tapered portion TP is provided on the inner wall W2 of the defined third space SP3. Figure 3 As shown, the tapered portion TP is along the axial direction and is in the first direction toward the opening OP. Figure 3 (Z1 indicates the direction of the taper). The tapered portion TP, as described later, acts along the radial direction ( Figure 3The guide component of the ball-shaped component F24 (in the Y-axis direction) functions as a guide component.

[0076] The retaining member F22 is configured to be able to retain the spherical member F24 while moving axially within the storage space SP. Specifically, the retaining member F22 is capable of moving axially within the storage space SP in a first direction toward the opening OP and in a second direction opposite to the first direction. Figure 3 (The direction shown by Z2) moves in both directions. That is, the retaining member F22 can reciprocate along the axial direction within the storage space SP. The retaining member F22 is an example of the first moving body.

[0077] In one embodiment, a second fluid FL2 may flow into the second space SP2. Furthermore, the movement of the retaining member F22 in the second direction can be achieved by using the second fluid FL2 flowing into the second space SP2 to push against the first surface F220 (the surface facing the first direction) of the retaining member F22.

[0078] In one embodiment, an elastic member F26 (e.g., a compression spring) may be disposed within the first space SP1. Furthermore, movement of the retaining member F22 in the first direction can be achieved by using the elastic member F26 to push against the second surface F222 (the surface facing the second direction) of the retaining member F22. In one embodiment, a first fluid FL1 may flow into the first space SP1. Furthermore, movement of the retaining member F22 in the first direction can be achieved by using the first fluid FL1 flowing into the first space SP1 to push against the second surface F222 of the retaining member F22. In one embodiment, movement of the retaining member F22 in the first direction can be achieved by using the elastic member F26 and a second fluid FL2 to push against the second surface F222 of the retaining member F22.

[0079] In one embodiment, the retaining member F22 may include a constraint on the spherical member F24 moving radially ( Figure 3 A locking structure that allows movement within the Y-axis. The locking structure could be, for example, a... Figure 3 The protrusion F224 shown.

[0080] The spherical component F24 is held by the retaining component F22. The spherical component F24 is held axially by the movement of the retaining component F22. Figure 3 When moving along the Z-axis, it is simultaneously guided by the tapered portion TP of the inner wall W2, and also moves radially ( Figure 3 The spherical component F24 is an example of a second moving body. In one embodiment, there are two or more spherical components F24.

[0081] As described above, the first component CP1 and the second component CP2 can constitute part of the electrode (upper electrode or lower electrode) of the plasma processing apparatus 1. In one embodiment, the convex component F1 and the concave component F2 of the fixing member F can be configured to be electrically connected to each other. For example, the support component F12 and shaft component F10 of the convex component F1, the spherical component F24 of the concave component F2, the holding component F22, the elastic component F26, and the upper end F200 of the receiving component F20 can be made of conductive components. (As described later...) Figure 5 As shown in (c), when the convex member F1 is fixed and cannot move axially relative to the concave member F2, the shaft member F10 contacts the spherical member F24. Furthermore, a conductive path for current is formed through the support member F12 of the convex member F1, the shaft member F10, the spherical member F24 of the concave member F2, the retaining member F22, the elastic member F26, and the upper end F200 of the receiving member F20. Thus, the convex member F1 and the concave member F2 are electrically connected. That is, when the first member CP1 and the second member CP2 are fixed, the fixing member F can function as a conductive path between the first member CP1 and the second member CP2. For example, when the first member CP1 and the second member CP2 are fixed, the current supplied to the first member CP1 can be supplied to the second member CP2 via the fixing member F. Additionally, for example, when the first member CP1 and the second member CP2 are fixed, the current supplied to the second member CP2 can be supplied to the first member CP1 via the fixing member F.

[0082] Figure 4A and Figure 4B This is a diagram illustrating an example of the movement of a spherical component. Figure 4A This is an example of a state in which the component F22 is moved to its maximum extent in the second direction (the direction away from the opening OP) (this position will also be referred to as the "non-clamping position" below). Figure 4B This is an example of a state in which part F22 is moved to its maximum extent in the first direction (the direction close to the opening OP) (hereinafter referred to as the "clamping position").

[0083] like Figure 4A As shown, in the non-clamped position, the spherical component F24 abuts against the upper side (far side relative to the opening OP) of the tapered portion TP. At this time, the radial distance between the spherical components F24 is D1. D1 is larger than the maximum width of the head F102 of the shaft component F10. (As shown...) Figure 4B As shown, in the clamped position, the spherical component F24 abuts against the lower side (proximal side relative to the opening OP) of the tapered portion TP. At this time, the radial distance between the spherical components F24 is D2. D2 is smaller than the maximum width of the head F102 of the shaft component F10.

[0084] <Example of the use of fastener F>

[0085] Figure 5 This is a diagram illustrating an example of how fastener F is used. Figure 5 This is an example of a method for fixing the convex part F1 (and the first part CP1 fixed to the convex part F1) of the fastener F to the concave part F2 (and the second part CP2 fixed to the concave part F2).

[0086] First, the convex component F1 of the fastener F faces the concave component F2 in the second direction ( Figure 5 The concave member F2 can move in the direction shown by Z2. Furthermore, the concave member F2 can also move toward the convex member F1 in the first direction. Then, the shaft member F10 of the convex member F1 is inserted into the third space SP3 via the opening OP of the receiving member F20 (see reference). Figure 5 (a)). At this time, the retaining member F22 of the concave member F2 is in the non-clamped position.

[0087] When the supporting member F12 of the convex member F1 abuts against the outer wall W1 of the receiving member F20 of the concave member F2, the shaft member F10 of the convex member F1 is disposed within the third space SP3 of the receiving member F20 (see reference). Figure 5 (b)). Next, the second fluid FL2 flows out from the second space SP2. Then, through the elastic member F26, the retaining member F22 of the concave member F2 is moved in the first direction ( Figure 5 The fluid moves in the direction indicated by Z1. At this time, in order to facilitate movement in the first direction, the first fluid FL1 can also flow into the first space SP1.

[0088] When the retaining member F22 of the convex member moves to the clamping position, the radial distance between the spherical members F24 narrows, resulting in the head F102 of the shaft member F10 being clamped between the spherical members F24 (see reference). Figure 5 (c) The radially outward movement of the spherical member F24 is restricted by the tapered portion TP of the inner wall W2. Therefore, the axial movement of the shaft member F10 is restricted. As a result, the convex member F1 is fixed relative to the concave member F2 in a manner that prevents axial movement. Consequently, the first member CP1 is fixed relative to the second member CP2. Furthermore, when removing the convex member F1 of the fastener F from the concave member F2 (removing the first member CP1 from the second member CP2), the process can be performed in the reverse order described above.

[0089] By using the fastener F, the components of the plasma processing apparatus 1 can be assembled and disassembled mechanically by moving the fastener F without the use of fasteners (screws). This allows for easy assembly and disassembly of the constituent parts of the plasma processing apparatus 1. Compared to using fasteners, using the fastener F reduces the labor time and operation hours required for maintenance such as assembly, replacement of consumables, and modifications of the plasma processing apparatus.

[0090] <Another example of a drive mechanism for retaining components>

[0091] Figure 6A and Figure 6B This is a diagram illustrating another example of a drive mechanism for retaining components. In one embodiment, as... Figure 6A As shown, the upper end of the retaining member F22 of the concave member F2 can be connected to the cylinder member F28. The cylinder member F28 can be configured to reciprocate axially, thereby applying forces in a first direction and a second direction to the retaining member F22. In one embodiment, as... Figure 6B As shown, the upper end of the retaining member F22 of the concave member F2 can be connected to the rack of the rack and pinion system F29. The rack and pinion system F29 transmits the rotational motion of the electric motor to the rack via gears. The rack reciprocates axially in accordance with the rotational direction of the electric motor, thereby enabling it to apply forces in a first direction and a second direction to the retaining member F22.

[0092] <Another example of fastener F>

[0093] Figure 7 This is another diagram used to illustrate fastener F. In Figure 7 In the example shown, the other end of the shaft component F10 of the convex component F1 is fixed by embedding it into the first component CP1. Additionally, the concave component F2 is fixed by embedding it entirely into the second component CP2. In one embodiment, a first sealing component SL1 may be disposed on the opposing surfaces of the first component CP1 and the second component CP2. The first sealing component SL1 seals the space SPout (e.g., the space outside the chamber 10) between the external space SPout and the opening OP of the receiving component F20.

[0094] In one embodiment, the structures of the fastener F can be composed of multiple components. For example, such as Figure 7 As shown, the storage component F20 of the concave component F2 can be composed of multiple components (F20A to F20C).

[0095] Figure 8 This is another diagram illustrating the fastener F and its operation. Figure 8In the example shown, the concave component F2 includes a pressing component F25 that presses against the shaft component F10 of the convex component F1. The pressing component F25 is disposed within the storage space SP of the storage component F20 and is configured to be axially movable. The pressing component F25 includes a head F250 and a shaft portion F252 extending axially from the center of the head F250. The storage space SP includes a fourth space SP4 and a first space SP1 divided by the head F250. The front end of the shaft portion F252 is configured to pass through the central portion of the retaining component F22. The pressing component F25 is an example of a third moving body.

[0096] When holding component F22 is in the clamped position (refer to...) Figure 8 (a) to the non-clamped position (refer to) Figure 8 When (b) moves, the engagement between the spherical component F24 and the head F102 of the shaft component F10 is released. In this state, the fourth fluid FL4 flows into the fourth space SP4. Then, the pushing component F25 moves in the first direction ( Figure 8 (b) Move in the direction shown by Z1. At this time, the first fluid FL1 can be allowed to flow out of the first space SP1, or the first space SP1 can be sealed to prevent the first fluid FL1 from flowing out.

[0097] As the pushing component F25 moves in the first direction, the shaft portion F252 abuts against the head F102 of the shaft component F10, pushing the shaft component F10 out along the first direction (see reference). Figure 8 (c) Thus, the concave component F2 (and the second component CP2) separates from the convex component F1 (and the first component CP1) (hereinafter referred to as the "pull-out position").

[0098] However, while keeping component F22 in the unclamped position ( Figure 8 In state (b), there exists a situation where the convex component F1 and the concave component F2 are fixed to each other, for example, at their boundary surface TH1. In such a case, the two cannot be separated as long as the fixation is not released. Furthermore, it is difficult to detect whether such fixation has actually occurred in a non-contact manner.

[0099] Regarding this point, Figure 8 The structure shown includes a non-clamping position ( Figure 8 (b) The pushing member F25 of the shaft member F10 that pushes the convex member F1. Therefore, even in the case of a fixed connection, it is possible to separate the convex member F1 and the concave member F2. Figure 8 (c)).

[0100] In one implementation, it can be from the non-clamping position ( Figure 8 (b)) towards the push position ( Figure 8During the transfer process (c), the first space SP1 is sealed, and the pressure within the first space SP1 is detected. This allows detection of whether the pushing member F25 has actually reached the ejection position. For example, if the pressure in the first space SP1 rises to a given pressure after a certain period of time, it is determined that the pushing member F25 has moved to the ejection position. Conversely, if the pressure in the first space SP1 does not reach the given pressure after a certain period of time, it is determined that the pushing member F25 has not moved to the ejection position (the convex member F1 and the concave member F2 are firmly fixed together). This allows detection of whether the convex member F1 and the concave member F2 have actually separated.

[0101] Figure 9 This is another diagram illustrating the fastener F and its operation. Figure 9 In the example shown, the fastener F includes a concave component F3 and a convex component F4. The concave component F3 includes an inner wall W3 that defines the receiving space SP5. A portion of the inner wall W3 includes a radially widened, tapered engaging portion EG.

[0102] The convex component F4 includes a support platform F40, a shaft component F42, a spherical component F44, a retaining component F46, and a storage component F48.

[0103] A support platform F40 is disposed within the receiving space of the receiving component F48, defining a sixth space SP6 and a seventh space SP7. The support platform F40 moves along a first direction (z1 direction) and a second direction (z2 direction) opposite to the first direction, as fluid flows into or out of the sixth space SP6 and the seventh space SP7, respectively. A shaft component F42 is fixed to the support platform F40 and moves within the receiving space SP5 in the first and second directions as the support platform F40 moves. The shaft component F42 includes a neck F420 with a reduced diameter along the axial direction.

[0104] The spherical component F44 moves between the clamped position and the unclamped position while the concave component F3 and the convex component F4 are in contact with each other.

[0105] Specifically, when fluid flows into the sixth space SP6 and the support platform F40 and shaft component F42 move in the first direction (z1 direction), the spherical component F44 moves radially outward (at this time, the axial movement of the spherical component F44 is restricted by the retaining component F46). Thus, the spherical component F44 engages with the engaging portion EG of the concave component F3 (see reference). Figure 9 (a)). This position is the clamping position, where the concave part F3 and the convex part F4 are fixed in a manner in which they cannot move relative to each other axially.

[0106] Furthermore, when fluid flows into the seventh space SP7 and the support platform F40 and shaft component F42 move in the second direction (z2 direction), the spherical component F44 moves radially inward along the neck F420 of the shaft component F42 (at this time, the axial movement of the spherical component F44 is restricted by the retaining component F46). As a result, the engagement between the spherical component F44 and the engaging portion EG of the concave component F3 is released (see reference). Figure 9 (b)). This position is a non-clamped position, and the concave part F3 and the convex part F4 are movable relative to each other axially.

[0107] In this state, fluid can further flow into the seventh space SP7. Then, the support platform F40 and shaft component F42 move further in the second direction. At this time, fluid can flow out of the sixth space SP6, or the sixth space SP6 can be sealed to prevent fluid from flowing out. As the support platform F40 and shaft component F42 move in the second direction, the shaft component F42 pushes out the inner wall W3 of the concave component F3 along the second direction (see reference). Figure 9 (c)). Thus, the concave component F3 and the convex component F4 separate from each other (hereinafter referred to as the "separation position").

[0108] However, even when the spherical part F44 is in the non-clamped position ( Figure 9 In case (b), there are also situations where the concave component F3 and the convex component F4 are fixed to each other, for example, at their boundary surface TH2. In such cases, the two cannot be separated as long as the fixation is not released. Furthermore, it is difficult to detect whether such a fixation has actually occurred in a non-contact manner.

[0109] Regarding this point, Figure 9 In the structure shown, by moving the support platform F40 and the shaft component F42 from the unclamped position ( Figure 9 The state of (b) moves in the second direction, enabling it to push against the inner wall W3 of the concave component F3 in the second direction. Figure 9 (c)). Therefore, even when the concave member F3 and the convex member F4 are fixedly connected, they can be separated. Furthermore, from the non-clamped position ( Figure 9 (b)) towards the separation position ( Figure 9During the transfer process of (c)), the sixth space SP6 can be sealed, and the pressure of the sixth space SP6 can be detected. Furthermore, if the pressure of the sixth space SP6 rises to a given pressure after a certain period of time, it is determined that the support platform F40 and the shaft component F42 have moved to the separation position. Conversely, if the pressure of the sixth space SP6 does not reach the given pressure after a certain period of time, it is determined that the support platform F40 and the shaft component F42 have failed to move to the separation position (the concave component F3 and the convex component F4 are firmly fixed together). Thus, it is possible to detect whether the concave component F3 and the convex component F4 are actually separated.

[0110] <Application Examples of Substrate Processing Systems>

[0111] In one embodiment, the aforementioned fastener F can be used to secure components of a substrate processing system (hereinafter also referred to as "substrate processing system PS") that includes one or more chambers.

[0112] Figure 10 This diagram illustrates the structure of a substrate processing system (PS). The PS includes substrate processing chambers PM1 to PM6 (hereinafter collectively referred to as "substrate processing modules PM"), a transport module TM, loading interlock modules LLM1 and LLM2 (hereinafter collectively referred to as "loading interlock modules LLM"), a loading module LM, and loading ports LP1 to LP3 (hereinafter collectively referred to as "loading ports LP"). The control unit CT controls each structure of the PS to perform given processing on the substrate W.

[0113] The substrate processing module PM has chambers within which the substrate W undergoes etching, trimming, film deposition, annealing, doping, photolithography, cleaning, and ashing processes. At least one of the substrate processing chambers PM1 to PM6 can be... Figure 1 or Figure 2 The plasma processing apparatus 1 shown includes a chamber 10. Additionally, at least one of the substrate processing chambers PM1 to PM6 can be part of a plasma processing apparatus using any plasma source such as inductively coupled plasma or microwave plasma. At least one of the substrate processing chambers PM1 to PM6 can be a measurement module, for example, capable of measuring, using optical methods, the film thickness formed on the substrate W, the dimensions of the pattern formed on the substrate W, etc.

[0114] The transport module TM has a transport device for transporting substrate W between substrate processing modules PM or between substrate processing module PM and loading interlock module LLM. The substrate processing module PM and loading interlock module LLM are configured adjacent to the transport module TM. The transport module TM is spatially isolated from or connected to the substrate processing module PM and loading interlock module LLM via openable and closable gate valves.

[0115] In one embodiment, a transport device included in the transport module TM transports a substrate W from the transport module TM to the plasma processing space 10s of a plasma processing apparatus 1, which is an example of a substrate processing module PM. The transport device places the substrate W in the central region 111a of the substrate support portion 11. The plasma processing apparatus 1 may have a lift, which the transport device can place the substrate W in. The lift mechanism is capable of rising and falling within a plurality of through holes provided in the substrate support portion 11. When the lift rises, the front end of the lift protrudes from the central region 111a of the substrate support portion 11, holding the substrate W in that position. When the lift falls, the front end of the lift is retracted into the substrate support portion 11, and the substrate W is placed in the central region 111a of the substrate support portion 11. As an example, the transport device may be a transport device for transporting substrates such as silicon wafers.

[0116] Loading interlock modules LLM1 and LLM2 are located between the transport module TM and the loading module LM. The loading interlock module LLM can switch its internal pressure to atmospheric pressure or vacuum. "Atmospheric pressure" can be the external pressure of the various modules included in the substrate processing system PS. "Vacuum" is a pressure lower than atmospheric pressure, for example, a medium vacuum of 0.1 Pa to 100 Pa. The loading interlock module LLM transports substrate W from the atmospheric pressure loading module LM to the vacuum transport module TM, and conversely, transports substrate W from the vacuum transport module TM to the atmospheric pressure loading module LM.

[0117] The loading module LM has a transport device for transporting substrates W between the loading interlock module LLM and the loading port LP. The loading port LP can hold, for example, a FOUP (Front Opening Unified Pod) capable of holding 25 substrates W, or an empty FOUP. The loading module LM removes substrates W from the FOUP in the loading port LP and transports them to the loading interlock module LLM. Conversely, the loading module LM removes substrates W from the loading interlock module LLM and transports them to the FOUP in the loading port LP.

[0118] The control unit CT controls each structure of the substrate processing system PS to perform given processing on the substrate W. The control unit CT stores a processing scheme that sets the processing order, processing conditions, transport conditions, etc., and controls each structure of the substrate processing system PS according to this processing scheme to perform the given processing on the substrate W. The control unit CT can also function as... Figure 1 Some or all of the functions of the control unit 2 shown.

[0119] Figure 11 This diagram illustrates an application example of the fixture F in the aforementioned substrate processing system PS. For example... Figure 11 As shown, the transport module TM has an opening TM100 on a portion of the wall TM10 that constitutes the vacuum chamber. In one example, the opening TM100 communicates with the substrate processing module PM. In another example, the opening TM100 communicates with the loading interlock module LLM.

[0120] An opening / closing device M1 for opening and closing the opening TM100 is provided inside the conveying module TM. The opening / closing device M1 includes a closing part M10 and a base M12. The opening / closing device M1 moves on the floor surface TM12 of the conveying module TM. By moving the opening / closing device M1 toward the front of the opening TM100, the closing part M10 is pushed toward the opening TM100, and the opening TM100 is closed. When the opening / closing device M1 moves to another position, the closure of the opening TM100 by the closing part M10 is released.

[0121] In one embodiment, multiple coils can be arranged on the floor surface TM12 of the conveying module TM, and a permanent magnet can be provided on the floor surface M12 of the opening / closing device M1. In this case, when current is supplied to each coil of the floor surface TM12, a magnetic field is generated on the floor surface TM12, and the opening / closing device M1 moves magnetically levitated on the floor surface TM12. The position, orientation, and levitation amount of the opening / closing device M1 are controlled by controlling the current value of each coil.

[0122] In one embodiment, the fastener F can be used to fix the wall TM10 of the conveying module TM and the opening / closing device M1. For example, the concave component F2 (F3) of the fastener F can be provided in the region TM102 surrounding the opening TM100 of the wall TM10, and the convex component F1 (F4) can be provided at the corresponding position of the closing portion M10. Alternatively, for example, the convex component F1 (F4) of the fastener F can be provided in the region TM102, and the concave component F2 (F3) can be provided at the corresponding position of the closing portion M10. In addition, more than one fastener F can be provided.

[0123] By using the fastener F, the closing portion M10 of the opening / closing device M1 and the wall surface TM10 can be more securely fixed. Therefore, even when there is a large pressure difference between the destination of the opening portion TM100 and the delivery module TM, fluid leakage through the opening portion TM100 can be suppressed. Furthermore, by using the fastener F, the closing portion M10 and the wall surface TM10 are mechanically fixed together. Therefore, for example, when the opening / closing device M1 is magnetically driven, the electrical power required to fix the position of the opening / closing device M1 can be reduced.

[0124] The embodiments of the present invention also include the following methods.

[0125] (Postscript 1)

[0126] A plasma processing apparatus having a chamber, comprising:

[0127] First component;

[0128] Second component; and

[0129] A fastener, configured to detachably fasten the first component and the second component together along an axial direction, includes: a convex component fixed to the first component; and a concave component fixed to the second component and configured to receive the convex component.

[0130] The convex component includes a shaft component that extends in the axial direction and expands at the front end.

[0131] The concave component includes: a receiving component fixed to the second component; a retaining component disposed within the receiving component; and a spherical component held by the retaining component.

[0132] The receiving component includes: an opening for receiving the shaft component of the convex component; and a receiving space for receiving the retaining component and the spherical component, wherein the inner wall of the receiving component of the receiving space includes a radially tapered portion.

[0133] The retaining member is configured to hold the spherical member while moving it along the axial direction within the storage space.

[0134] The spherical component is configured such that when the retaining component moves in the first direction, which is the axial direction and the direction toward the opening, it can be guided by the tapered portion of the inner wall to move radially inward.

[0135] (Postscript 2)

[0136] According to the plasma processing apparatus described in Appendix 1, the holding member is movable in the first direction under the action of an elastic member disposed within the storage space.

[0137] (Note 3)

[0138] According to Appendix 1 or Appendix 2, the plasma processing apparatus wherein the holding member is movable in the first direction under the action of a first fluid flowing into the receiving space.

[0139] (Postscript 4)

[0140] According to any one of Annexes 1 to 3, in the plasma processing apparatus, the holding member is movable in a second direction opposite to the first direction under the action of a second fluid flowing into the receiving space.

[0141] (Note 5)

[0142] According to any one of Annexes 1 to 4, the plasma processing apparatus includes a first space capable of receiving the first fluid and a second space capable of receiving the second fluid, wherein the first space and the second space are sealed by a sealing member.

[0143] (Note 6)

[0144] According to the plasma processing apparatus described in Appendix 5, the second space is located closer to the opening side than the first space, and the second space and the opening are sealed by a sealing member.

[0145] (Note 7)

[0146] According to any one of Appendices 1 to 6, in the plasma processing apparatus, the holding member is configured to be subjected to a force in the first direction or a force in a second direction opposite to the first direction via a cylinder or an electric motor.

[0147] (Postscript 8)

[0148] According to any one of Appendices 1 to 7, the plasma processing apparatus further includes a locking structure that restricts the movement of the spherical member toward the radially inward side.

[0149] (Note 9)

[0150] According to any one of Appendices 1 to 8, in a plasma processing apparatus, at least one of the first component and the second component is a component disposed within the chamber.

[0151] (Postscript 10)

[0152] According to any one of Appendices 1 to 9, in the plasma processing apparatus, at least one of the first component and the second component is a component constituting the chamber or a component disposed outside the chamber.

[0153] (Postscript 11)

[0154] The plasma processing apparatus according to any one of Appendices 1 to 10 further includes a sealing member that seals the space outside the chamber from the opening while the first member and the second member are fixed by the fixing member.

[0155] (Postscript 12)

[0156] According to any one of Appendices 1 to 11, in a plasma processing apparatus, at least one of the first component and the second component constitutes an electrode of the plasma processing apparatus, and the fixing member is configured to provide a conductive path to the electrode by electrically connecting the convex component and the concave component to each other while the first component and the second component are fixed by the fixing member.

[0157] (Postscript 13)

[0158] A plasma processing apparatus having a chamber, comprising:

[0159] First component;

[0160] Second component; and

[0161] A fastener, configured to detachably fasten the first component and the second component together along an axial direction, includes: a convex component fixed to the first component; and a concave component fixed to the second component and configured to receive the convex component.

[0162] The concave component includes:

[0163] A first movable body, configured to move along the axial direction between a clamped position and a non-clamped position; and

[0164] The second movable body, held by the first movable body, is configured to move from the clamping position to a position that restricts the axial movement of the convex member, and from the non-clamping position to a position that does not impede the axial movement of the convex member.

[0165] (Postscript 14)

[0166] According to the plasma processing apparatus described in Appendix 13, at least one of the first component and the second component constitutes an electrode of the plasma processing apparatus, and the fixing member is configured to provide a conductive path to the electrode by means of the convex component and the concave component being electrically connected to each other at the clamping position.

[0167] (Postscript 15)

[0168] A substrate processing system having one or more chambers, characterized in that it comprises:

[0169] First component;

[0170] Second component;

[0171] A fastener configured to detachably fasten the first component and the second component together along an axial direction, the fastener comprising: a convex component fixed to the first component; and a concave component fixed to the second component and configured to receive the convex component.

[0172] The convex component includes a shaft component that extends in the axial direction and expands at the front end.

[0173] The concave component includes: a receiving component fixed to the second component; a retaining component disposed within the receiving component; and a spherical component held by the retaining component.

[0174] The receiving component includes: an opening for receiving the shaft component of the convex component; and a receiving space for receiving the retaining component and the spherical component, wherein the inner wall of the receiving component of the receiving space includes a radially tapered portion.

[0175] The retaining member is configured to hold the spherical member while moving it along the axial direction within the storage space.

[0176] The spherical component is configured such that when the retaining component moves in the first direction, which is the axial direction and the direction toward the opening, it can be guided by the tapered portion of the inner wall to move radially inward.

[0177] (Postscript 16)

[0178] According to the substrate processing system described in Appendix 15, wherein,

[0179] The substrate processing system includes:

[0180] A transport chamber, comprising a wall having an opening communicating with a cavity; and

[0181] An opening and closing device includes a closing part configured to move within the conveying chamber to close the opening.

[0182] The wall of the conveying chamber constitutes one of the first component and the second component, and the closing part of the opening and closing device constitutes the other of the first component and the second component.

[0183] (Postscript 17)

[0184] A fixture for a substrate processing system, comprising:

[0185] Convex components, including shaft components; and

[0186] A concave component that detachably secures the shaft component of the convex component.

[0187] The concave component includes:

[0188] The first movable body is configured to be able to move along the axial direction between a clamped position and a non-clamped position;

[0189] A second movable body, held by the first movable body, is configured to move from the clamping position to a position restricting the axial movement of the shaft member of the convex member, and from the non-clamping position to a position that does not impede the axial movement of the convex member; and

[0190] The third moving body is configured to push the shaft component of the convex component in the non-clamping position to move the shaft component along the axial direction.

[0191] (Postscript 18)

[0192] A fixture for a substrate processing system includes a concave component and a convex component.

[0193] The concave component includes:

[0194] The inner walls of the specified storage space; and

[0195] An engaging portion disposed on a portion of the inner wall

[0196] The convex component includes:

[0197] A shaft component configured to move axially within the storage space; and

[0198] A movable body is configured to move along with the axial movement of the shaft component, between a clamped position where it engages with the engaging portion of the concave component and a non-clamped position where it does not engage with the engaging portion of the concave component.

[0199] The shaft component is configured to move axially in the state where the engaging portion is in the non-clamped position to push against the inner wall of the concave component.

[0200] (Postscript 19)

[0201] A substrate processing system, comprising:

[0202] The fasteners described in Note 17 or Note 18;

[0203] A transport chamber, comprising a wall having an opening communicating with a cavity; and

[0204] An opening and closing device includes a closing part configured to move within the conveying chamber to close the opening.

[0205] One of the convex component and the concave component is disposed on the wall surface of the conveying chamber, and the other of the convex component and the concave component faces the closing portion of the opening and closing device.

[0206] The above embodiments are described for illustrative purposes only and are not intended to limit the scope of the present invention. Various modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. For example, some components of one embodiment can be added to other embodiments. Furthermore, some components of one embodiment can be replaced with corresponding components of other embodiments.

[0207] Explanation of reference numerals in the attached figures

[0208] 1……Plasma processing device, 10……Plasma processing chamber, CP1……First component, CP2……Second component, F……Fixed component, F1, F4……Convex component, F10……Shaft component, F2, F3……Concave component, F20……Receiving component, F22……Holding component, F24……Spherical component, OP……Opening, SP……Receiving space, TP……Conical part, W2, W3……Inner wall.

Claims

1. A plasma processing apparatus having a chamber, characterized by, Comprise: a first member; a second member; and a fixing member configured to fix the first member and the second member together in a manner detachable in an axial direction, the fixing member including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member including a shaft member extending in the axial direction and expanding in diameter at a front end, the female member including a housing member fixed to the second member, a holding member disposed in the housing member, and a spherical member held by the holding member, the housing member including an opening for receiving the shaft member of the male member and a housing space for housing the holding member and the spherical member, an inner wall of the housing member defining the housing space including a tapered portion that is tapered in a radial direction in a first direction that is the axial direction and a direction toward the opening, the holding member configured to move in the axial direction within the housing space while holding the spherical member, the spherical member configured to be guided by the tapered portion of the inner wall to move toward an inner side in the radial direction when the holding member moves in the first direction.

2. The plasma processing apparatus according to claim 1, wherein: the holding member is movable in the first direction by an elastic member disposed in the housing space.

3. The plasma processing apparatus according to claim 2, wherein: the holding member is movable in the first direction by a first fluid flowing into the housing space.

4. The plasma processing apparatus according to claim 3, wherein: the holding member is movable in a second direction opposite to the first direction by a second fluid flowing into the housing space.

5. The plasma processing apparatus according to claim 4, wherein: the housing space includes a first space into which the first fluid is able to flow and a second space into which the second fluid is able to flow, the first space and the second space being sealed by a sealing member.

6. The plasma processing apparatus according to claim 5, wherein: the second space is disposed at a position closer to the opening than the first space, the second space and the opening being sealed by a sealing member.

7. The plasma processing apparatus according to claim 1, wherein: the holding member is configured to be subjected to a force in the first direction or a force in a second direction opposite to the first direction via a pneumatic cylinder or an electric motor.

8. The plasma processing apparatus according to any one of claims 1 to 7, wherein: the holding member further includes a stop structure that limits movement of the spherical member toward the inner side in the radial direction.

9. The plasma processing apparatus according to any one of claims 1 to 7, wherein: at least one of the first member and the second member is a member disposed in the chamber.

10. The plasma processing apparatus according to any one of claims 1 to 7, wherein: ​ At least one of the first member and the second member is a member constituting the chamber or a member disposed outside the chamber.

11. The plasma processing apparatus of claim 10, wherein: Further comprising a sealing member that seals a space outside the chamber from the opening in a state where the first member and the second member are fixed by the fixing member.

12. The plasma processing apparatus of any one of claims 1 to 7, wherein: At least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixing member is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other in a state where the first member and the second member are fixed by the fixing member.

13. A plasma processing apparatus having a chamber, characterized by, Comprising: a first member; a second member; and a fixing member configured to fix the first member and the second member together in a detachable manner along an axial direction, the fixing member including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the female member including: an inner wall that defines a receiving space of the female member, including a tapered portion that is tapered in a radial direction along a first direction, the first direction being the axial direction and being a direction to an opening for receiving the male member; a first movable body configured to move within the receiving space along the axial direction between a clamping position and a non-clamping position; and a second movable body held by the first movable body and configured to be guided by the tapered portion to move to a position that restricts movement of the male member in the axial direction when the first movable body moves to the clamping position, and to move to a position that does not interfere with the movement of the male member in the axial direction when the first movable body moves to the non-clamping position.

14. The plasma processing apparatus of claim 13, wherein: At least one of the first member and the second member constitutes an electrode of the plasma processing apparatus, and the fixing member is configured to provide a conductive path to the electrode by electrically connecting the male member and the female member to each other in the clamping position.

15. A substrate processing system having one or more chambers, wherein: Comprising: a first member; a second member; a fixing member configured to fix the first member and the second member together in a detachable manner along an axial direction, the fixing member including a male member fixed to the first member and a female member fixed to the second member and configured to receive the male member, the male member including a shaft member that extends in the axial direction and is expanded in diameter at a front end, the female member including: a receiving member fixed to the second member; a holding member disposed within the receiving member; and a spherical member held by the holding member, The housing member includes an opening for receiving the shaft member of the male member, and a housing space for housing the holding member and the spherical member, an inner wall of the housing member defining the housing space including a tapered portion that is tapered in a radial direction along a first direction that is an axial direction and a direction toward the opening, The holding member is configured to be able to move along the axial direction within the housing space while holding the spherical member, The spherical member is configured to be guided by the tapered portion of the inner wall to move to an inner side in the radial direction when the holding member moves in the first direction.

16. The substrate processing system of claim 15, wherein: The substrate processing system includes: a transfer chamber including a wall surface provided with an opening portion that communicates with the chamber; and an opening and closing device including a closing portion configured to be able to move inside the transfer chamber to close the opening portion, the wall surface of the transfer chamber constitutes one of the first member and the second member, and the closing portion of the opening and closing device constitutes the other of the first member and the second member.

17. A fixture for a substrate processing system, characterized by, includes: a male member including a shaft member; and a female member that detachably fixes the shaft member of the male member, the female member includes: an inner wall that defines a housing space of the female member, including a tapered portion that is tapered in a radial direction along a first direction that is an axial direction and a direction toward an opening for receiving the male member; a first movable body configured to be able to move along the axial direction within the housing space between a clamping position and a non-clamping position; a second movable body held by the first movable body and configured to be able to move to a position that restricts movement of the axial direction of the shaft member of the male member to an inner side in the radial direction guided by the tapered portion when the first movable body moves to the clamping position, and to a position that does not interfere with the movement of the axial direction of the male member to an outer side in the radial direction guided by the tapered portion when the first movable body moves to the non-clamping position; and a third movable body configured to be able to press the shaft member of the male member in the axial direction at the non-clamping position to move the shaft member along the axial direction.

18. A substrate processing system, comprising: includes: the fixing member of claim 17; a transfer chamber including a wall surface provided with an opening portion that communicates with the chamber; and an opening and closing device including a closing portion configured to be able to move inside the transfer chamber to close the opening portion, one of the male member and the female member is provided to the wall surface of the transfer chamber, and the other of the male member and the female member faces the closing portion of the opening and closing device. ​

Citation Information

Patent Citations

  • Mounting table and plasma processing apparatus

    JP2019197830A

  • Substrate processing apparatus

    CN113838773A

  • Tightening apparatus

    JP2001157937A

  • Substrate processing device and maintenance method for the same

    JP2023038169A

  • Fastening member for electrode plate of plasma chamber

    KR102168313B1