Package device, package method, and package control program

Abstract

A packaging apparatus includes a detection unit that detects an inclination of a stage surface or a work plane with respect to a reference plane using height information of each of a plurality of portions calculated on the basis of a first top view image and a second top view image, and detects the inclination of the stage surface or the work plane with respect to the reference plane. The first top view image and the second top view image enable the head of a packaging tool supporting the first shooting unit and the second shooting unit and performing packaging work to move relative to the carrying table. A first imaging unit and a second imaging unit, which are disposed such that optical systems and imaging elements of the first imaging unit and the second imaging unit satisfy the Sammer condition, are configured to image and output the plurality of portions of a work plane, which is an object to be subjected to a packaging process, respectively. The optical systems and imaging elements of the first imaging unit and the second imaging unit are configured to satisfy the Sammer condition. A plane parallel to the reference plane becomes a focal plane.

Description

Technical Field

[0001] The invention relates to a packaging device, a packaging method and a packaging control program. Background Art

[0002] In a packaging device that packages a semiconductor chip on a substrate, it is important to keep the substrate to be packaged parallel to the reference plane in order to package the semiconductor chip with good accuracy at the target position. For example, in the thermal compression bonding (TCB) process that is performed until the welding joint is joined during packaging, the horizontal maintenance of the bonding surface has a great influence on the control of the welding gap. Not limited to packaging devices for semiconductor chips, in a wide range of semiconductor processing devices, it is important to adjust the level of the stage. For example, a technology of irradiating laser light to the stage and adjusting the level is popularized (for example, refer to Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2000-114141 Summary of the invention

[0006] Problems to be solved by the invention

[0007] The laser light irradiation unit is specially provided for adjusting the level of the stage, which makes the device structure complicated. In addition, since the level adjustment of the stage using the laser light irradiation unit is performed separately from the packaging process of packaging the semiconductor chip on the substrate, it also becomes a reason for reducing the working efficiency.

[0008] The present invention is made to solve this problem and provides a packaging device, etc., which can detect the inclination of the carrier surface or the working plane as the object of the packaging operation without adding a dedicated detection unit, thereby improving the operating efficiency of the packaging process.

[0009] Technical means of solving problems

[0010] The packaging device of the first embodiment of the present invention includes: a carrier, on which a substrate encapsulated with a packaging body is placed; a packaging tool, which performs a packaging operation on the substrate placed on the carrier and at least any one of other packaging bodies that have been encapsulated on the substrate; a first shooting unit and a second shooting unit, which configure their respective optical systems and shooting elements to satisfy the Scheimpflug condition so that a plane parallel to a reference plane becomes a focal plane and is used for overhead shooting of an operating area where the packaging operation is performed; a head, which supports the packaging tool, the first shooting unit and the second shooting unit and is displaceable relative to the carrier; and a detection unit, which detects an inclination of the carrier surface or the operating plane relative to the reference plane using respective height information of a plurality of parts calculated based on a first overhead image and a second overhead image, wherein the first overhead image and the second overhead image are obtained by displacing the head so that the first shooting unit and the second shooting unit respectively shoot and output a plurality of parts of the carrier surface of the carrier or the operating plane including the operating area.

[0011] In addition, a packaging method according to a second embodiment of the present invention is a packaging method for a packaging body using a packaging device, wherein the packaging device includes: a carrier for carrying a substrate with a packaging body packaged thereon; a packaging tool for performing a packaging operation on the substrate carried on the carrier and at least any one of other packaging bodies that have been packaged on the substrate; a first shooting unit and a second shooting unit, wherein respective optical systems and shooting elements are configured to satisfy the Sham condition so that a plane parallel to a reference plane becomes a focal plane and is used for overhead shooting of an operating area where the packaging operation is performed; and a head, which supports the packaging tool, the first shooting unit and the second shooting unit and is displaceable relative to the carrier, wherein the packaging method includes: an acquisition step for acquiring respective height information of a plurality of parts calculated based on a first overhead image and a second overhead image, wherein the first overhead image and the second overhead image are obtained by displacing the head so that the first shooting unit and the second shooting unit respectively shoot and output a plurality of parts of a carrier surface of the carrier or an operating plane including the operating area; and a detection step for detecting the inclination of the carrier surface or the operating plane relative to the reference plane using the height information.

[0012] In addition, the packaging control program of the third embodiment of the present invention is a packaging control program for controlling a packaging device, wherein the packaging device includes: a carrier, on which a substrate encapsulated with a packaging body is mounted; a packaging tool, which performs a packaging operation on the substrate mounted on the carrier and at least any one of other packaging bodies that have been encapsulated on the substrate; a first shooting unit and a second shooting unit, which configure their respective optical systems and shooting elements to satisfy the Sham condition so that a plane parallel to a reference plane becomes a focal plane and is used for overhead shooting of an operating area where the packaging operation is performed; and a head, which supports the packaging tool, the first shooting unit and the second shooting unit and is displaceable relative to the carrier, wherein the packaging control program enables a computer to execute the following steps: an acquisition step, in which height information of respective portions calculated based on a first overhead image and a second overhead image is acquired by displacing the head so that the first shooting unit and the second shooting unit respectively shoot and output multiple portions of a carrier surface of the carrier or an operating plane including the operating area; and a detection step, in which the height information is used to detect the inclination of the carrier surface or the operating plane relative to the reference plane.

[0013] Effects of the Invention

[0014] The present invention can provide a packaging device or the like that can detect the inclination of a stage surface or a work plane that is the object of packaging operation without adding a dedicated detection unit, thereby improving the work efficiency of packaging processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] [ Figure 1 ] is an overall structural diagram of a flip chip bonding machine including the bonding device of this embodiment.

[0016] [ Figure 2 ] is a system structure diagram of the bonding device.

[0017] [ Figure 3 ] is an illustration for explaining the Sham optical system.

[0018] [ Figure 4 ] is a diagram showing a situation where three imaging units photograph a calibration mark.

[0019] [ Figure 5 ] is a diagram showing the situation where a bonding tool picks up a semiconductor chip.

[0020] [ Figure 6 ] is a diagram showing a situation where the third imaging unit photographs a semiconductor chip.

[0021] [ Figure 7 ] is a diagram schematically showing an overhead view image output by the third shooting unit.

[0022] [ Figure 8] is a diagram showing a situation where the first imaging unit and the second imaging unit photograph the lead frame.

[0023] [ Fig. 9 ]yes Figure 8 A partial stereogram of .

[0024] [ Fig.10 ] is a diagram showing the sequence of calculating the target coordinates for placing the semiconductor chip based on the first overhead image and the second overhead image.

[0025] [ Fig.11 ] is a diagram showing a situation in which a bonding tool places and bonds a semiconductor chip at a target position.

[0026] [ Fig.12 ] is a diagram showing the situation in which the joining tool retreats.

[0027] [ Fig.13 ] is a diagram illustrating the detection principle of the inclination of the detection frame surface relative to the reference plane.

[0028] [ Fig.14 ] is a diagram showing the situation of performing parallel adjustment of the frame surface.

[0029] [ Fig.15 ] is a flow chart illustrating the bonding sequence of semiconductor chips.

[0030] [ Fig.16 ] is a sub-flowchart illustrating the sequence of calibration control steps.

[0031] [ Fig.17 ] is a sub-flowchart illustrating the sequence of encapsulation control steps.

[0032] [ Fig.18 ] is a sub-flowchart illustrating the order of parallel adjustment steps.

[0033] [ Fig.19 ] is a partial stereoscopic view of a flip chip bonding machine for illustrating the first application example.

[0034] [ Fig. 20 ] is a partial stereoscopic view of a wire bonding machine for illustrating the second application example. DETAILED DESCRIPTION

[0035] The present invention is described below by the embodiments of the invention, but the invention of the claims is not limited to the following embodiments. In addition, all the structures described in the embodiments are not necessarily technical means for solving the problem. In addition, in each figure, when there are multiple structures with the same or similar structure, in order to avoid becoming complicated, sometimes a part of them is marked with a symbol, and the other parts are omitted from marking with the same symbol.

[0036] Figure 1 1 is an overall structural diagram of a flip chip bonding machine including the bonding device 100 of the present embodiment. The flip chip bonding machine mainly includes the bonding device 100 as an example of a packaging device and a chip supply device 500. The chip supply device 500 is a device that places the cut semiconductor chip 310 as a package on its upper surface and supplies it to the bonding device 100. Specifically, the chip supply device 500 includes a pickup mechanism 510 and a flip mechanism 520. The pickup mechanism 510 is a device that pushes any placed semiconductor chip 310 toward the flip mechanism 520. The flip mechanism 520 is a device that adsorbs and flips the semiconductor chip 310 pushed by the pickup mechanism 510, thereby exchanging its vertical direction. The bonding device 100 is a device that picks up the semiconductor chip 310 adsorbed in a state flipped by the flip mechanism 520 by the bonding tool 120 described later and places it on the target position of the lead frame 330 for bonding. The lead frame 330 is an example of a substrate mounted on the stage 190 .

[0037] The bonding device 100 mainly includes a head 110, a bonding tool 120, a first imaging unit 130, a second imaging unit 140, a third imaging unit 150, a calibration unit 170, and a stage 190. The head 110 supports the bonding tool 120, the first imaging unit 130, and the second imaging unit 140, and can be moved in a planar direction and a vertical direction by a head drive motor 111. That is, the head 110 can be displaced relative to the stage 190. In this embodiment, as shown in the figure, the planar direction is a horizontal direction defined by the X-axis direction and the Y-axis direction, and the vertical direction (height direction) is a Z-axis direction orthogonal to the X-axis direction and the Y-axis direction.

[0038] The bonding tool 120 can be moved in the height direction relative to the head 110 by a tool driving motor 121. The bonding tool 120 is an example of a packaging tool, and has a chuck 122 that adsorbs the semiconductor chip 310 at the front end and a heater 124 that heats the semiconductor chip 310 adsorbed by the chuck 122. The bonding tool 120 places the semiconductor chip 310 adsorbed by the chuck 122 at a predetermined position set on the frame surface 330a of the lead frame 330 placed on the stage 190, and heats and bonds the semiconductor chip 310 while applying pressure with the front end of the chuck 122.

[0039] The first photographing unit 130 and the second photographing unit 140 are photographing units for photographing the lead frame 330 from above. The first photographing unit 130 includes a first optical system 131 and a first photographing element 132, and is tiltedly arranged on the head 110 with its optical axis facing the bottom of the bonding tool 120. The first optical system 131 and the first photographing element 132 are arranged to satisfy the Sham condition so that a plane parallel to the reference plane becomes the focal plane 110a. In this embodiment, the reference plane is a horizontal plane. Which plane is used as the reference plane is determined according to the nature of the packaging device or its utilization status.

[0040] The second imaging unit 140 includes a second optical system 141 and a second imaging element 142, and is tiltedly arranged on the head 110 on the side opposite to the first imaging unit 130 relative to the bonding tool 120, with its optical axis facing the bottom of the bonding tool 120. The second optical system 141 and the second imaging element 142 are arranged to satisfy the Sham condition so that a plane parallel to the reference plane becomes the focal plane 110a. In addition, in the following description, the first imaging unit 130 and the second imaging unit 140 are sometimes collectively referred to as a "top-view imaging unit".

[0041] The third imaging unit 150 is an imaging unit for imaging the semiconductor chip held in the chuck 122 of the bonding tool 120 from above. As shown in the figure, if the stage surface 190a of the stage 190 is used as a dividing surface, the third imaging unit 150 is arranged in a space on the opposite side of the space where the imaging unit for top view is arranged.

[0042] The third imaging unit 150 includes a third optical system 151 and a third imaging element 152, and is arranged so that its optical axis is directed upward. The third imaging unit 150 is a general imaging unit configured so that the third optical system 151 and the third imaging element 152 are orthogonal to the optical axis, and its focal plane 150a is parallel to the light receiving surface of the third imaging element 152. In addition, the focal plane 150a is set to coincide with the frame surface 330a of the lead frame 330. In addition, the third optical system 151 uses a certain depth range across the focal plane 150a as the depth of field. Therefore, the setting adjustment to make the focal plane 150a coincide with the frame surface 330a only needs to be the depth of field D P In the following description, the third imaging unit 150 is sometimes referred to as an "upward-looking imaging unit".

[0043] The calibration unit 170 mainly includes a mark driving motor 171, a mark plate 172, and a calibration mark 173. The calibration mark 173 is, for example, a reference mark that specifies a reference position such as an intersection of a cross mark. The mark plate 172 is, for example, a thin plate of glass or transparent resin, and the calibration mark 173 is printed on one side thereof. That is, the calibration mark 173 can also be observed from any side of the mark plate 172. In the present embodiment, the calibration mark 173 is printed on the surface of the mark plate 172 on the opposite side of the surface facing the third shooting unit 150. In the present embodiment, the surface on which the calibration mark 173 is printed is referred to as a mark surface 173a. In addition, the calibration mark 173 is not limited to printing, and can also be set by attaching a seal or drawing a line on the surface of the mark plate 172.

[0044] The mark driving motor 171 rotates the mark plate 172 about the Z axis, thereby moving the calibration mark 173 toward or away from the center of the field of view of the third imaging unit 150. When the calibration mark 173 moves toward the center of the field of view of the third imaging unit 150, the mark surface 173a becomes the same surface as the frame surface 330a of the lead frame 330 and the focal plane 150a of the third imaging unit 150.

[0045] The stage 190 is disposed on the frame 180, and the height and inclination relative to the frame 180 can be adjusted within a specified range by driving the stage drive motor 191. The height adjustment is an adjustment in which the stage surface 190a of the stage 190 moves in the Z-axis direction, and the inclination adjustment is an adjustment in which the stage surface 190a of the stage 190 rotates around the X-axis and the Y-axis.

[0046] Figure 2 1 is a system structure diagram of the bonding apparatus 100. The control system of the bonding apparatus 100 mainly includes a processing unit 210, a storage unit 220, an input / output device 230, a first imaging unit 130, a second imaging unit 140, a third imaging unit 150, a head driving motor 111, a tool driving motor 121, a mark driving motor 171, and a stage driving motor 191.

[0047] The operation processing unit 210 is a processor (central processing unit (CPU)) that controls the bonding device 100 and executes the program. The processor may also be a structure combined with an operation processing chip such as an application specific integrated circuit (ASIC) or a graphics processing unit (GPU). The operation processing unit 210 reads the bonding control program stored in the storage unit 220 and executes various processes related to the bonding control.

[0048] The storage unit 220 is a non-volatile storage medium, such as a hard disk drive (HDD). In addition to storing the bonding control program, the storage unit 220 can also store various parameter values, functions, comparison tables, etc. used for control or calculation. The storage unit 220 particularly stores calibration data 221. The calibration data 221 will be specifically described later and is data related to the following calibration value, which is the difference between the coordinate value calculated based on the overhead image and the coordinate value calculated based on the bottom view image for the same observation object.

[0049] The input / output device 230 includes, for example, a keyboard, a mouse, and a display monitor, and is a device for accepting menu operations performed by the user or presenting information to the user. For example, the processing unit 210 may also display the acquired top-view image or bottom-view image on the display monitor which is one of the input / output devices 230.

[0050] The first imaging unit 130 receives the imaging request signal from the operation processing unit 210 and performs imaging, and sends the first overhead image output by the first imaging element 132 as an image signal to the operation processing unit 210. The second imaging unit 140 receives the imaging request signal from the operation processing unit 210 and performs imaging, and sends the second overhead image output by the second imaging element 142 as an image signal to the operation processing unit 210. The third imaging unit 150 receives the imaging request signal from the operation processing unit 210 and performs imaging, and sends the bottom image output by the third imaging element 152 as an image signal to the operation processing unit 210.

[0051] The head drive motor 111 receives a drive signal from the operation processing unit 210 to move the head 110 in the horizontal direction and the height direction. The tool drive motor 121 receives a drive signal from the operation processing unit 210 to move the bonding tool 120 in the height direction and rotate around the Z axis. The mark drive motor 171 receives a drive signal from the operation processing unit 210 to rotate the mark plate 172. The stage drive motor 191 receives a drive signal from the operation processing unit 210 to move the stage 190 in the Z axis direction and rotate around the X axis and the Y axis.

[0052] The operation processing unit 210 also plays the role of a functional operation unit, which performs various operations according to the processing instructed by the bonding control program. The operation processing unit 210 can function as an image acquisition unit 211, a drive control unit 212, a calibration control unit 213, a packaging control unit 214, and a detection unit 215. The image acquisition unit 211 sends a shooting request signal to the first shooting unit 130, the second shooting unit 140, and the third shooting unit 150 to acquire image signals of the first top view image, the second top view image, and the bottom view image. The drive control unit 212 sends a drive signal corresponding to the control amount to the head drive motor 111, the tool drive motor 121, the mark drive motor 171, and the stage drive motor 191, thereby causing the head 110, the bonding tool 120, the mark plate 172, and the stage 190 to move to the target state. In addition, a drive signal is sent to the pickup mechanism 510 or the flipping mechanism 520, thereby pushing up the semiconductor chip 310 to be the target, or adsorbing and flipping the semiconductor chip 310.

[0053] The calibration control unit 213 calculates the calibration value by controlling the image acquisition unit 211 or the drive control unit 212, etc., based on causing the downward-viewing imaging unit to capture and output the downward-viewing image of the calibration mark 173 and causing the upward-viewing imaging unit to capture and output the downward-viewing image of the calibration mark 173. The packaging control unit 214 recognizes the reference position of the semiconductor chip 310 by controlling the image acquisition unit 211 or the drive control unit 212, etc., based on causing the downward-viewing imaging unit to capture and output the downward-viewing image of the semiconductor chip 310 held by the bonding tool 120. Then, the bonding tool 120 places and bonds the semiconductor chip 310 on the predetermined placement area in such a manner that the reference position matches the target position determined based on causing the downward-viewing imaging unit to capture and output the downward-viewing image of the predetermined placement area where the semiconductor chip 310 is to be placed and the calibration value.

[0054] The detection unit 215 detects the inclination of the stage surface or the working plane relative to the reference plane using the respective height information of the plurality of parts calculated based on the first top view image and the second top view image, which are obtained by displacing the head 110 and causing the first imaging unit 130 and the second imaging unit 140 to respectively photograph and output the plurality of parts of the working plane such as the stage surface 190a or the frame surface 330a. The specific control or processing of the calibration control unit 213, the packaging control unit 214, and the detection unit 215 will be described in detail later.

[0055] Figure 3 1 is an explanatory diagram for explaining the Sham optical system adopted in the first imaging unit 130. The second imaging unit 140 also adopts the same Sham optical system, but the Sham optical system of the first imaging unit 130 will be representatively described here.

[0056] exist Figure 3 In the plane S 1 It is the focal plane 110a parallel to the reference plane. 2 The plane S is a plane including the principal plane of the first optical system 131 including the object side lens group 131a and the image side lens group 131b as a structural group. 3 is a plane including the light receiving surface of the first imaging element 132. In this embodiment, the Sham optical system includes the first optical system 131 and the first imaging element 132 arranged to satisfy the Sham condition. The arrangement satisfying the Sham condition is the plane S 1 、Imaginary surface S 2 、Imaginary surface S 3 The arrangement is such that they intersect each other on a common straight line P.

[0057] The aperture 133 is disposed between the object side lens group 131a and the image side lens group 131b to limit the light beam passing through. The depth of field D can be adjusted by the diameter of the aperture 133. P Therefore, if the target work area where the encapsulation work is performed is located within the depth of field, the work area can be photographed in a focused state.

[0058] The second imaging unit 140 includes the same structure as the first imaging unit 130, and is symmetrically arranged on the head 110 with respect to the YZ plane including the central axis of the bonding tool 120. Therefore, the second imaging unit 140 can also photograph the object working area in a focused state, similarly to the first imaging unit 130. The focal plane of the first imaging unit 130 and the focal plane of the second imaging unit 140 are preferably consistent with the focal plane 110a, but even if there is a deviation, as long as a part of the depth of field of each other overlaps, the object working area can be photographed in a focused state.

[0059] Furthermore, if such a photographing unit using a Sham optical system is used, the lower part of the bonding tool 120 can be observed from an oblique direction. Therefore, even when the semiconductor chip 310 is held on the bonding tool 120 and the bonding tool 120 is moved to the state directly above the die pad as the predetermined loading area, the die pad can be observed using the overhead photographing unit. That is, the bonding tool 120 can be moved to the state directly above the die pad as the predetermined loading area, and then the target position for placing the semiconductor chip 310 can be determined based on the overhead image output by the overhead photographing unit. In this way, it is sufficient to move the semiconductor chip 310 from the state to the target position, so the movement of the head 110 or the bonding tool 120 can be greatly suppressed, thereby achieving a reduction in positional deviation or a shortening of the lead time associated with the movement.

[0060] However, it is known that the shooting unit using the Sham optical system has the structural characteristics of the optical system, and as long as the optical system or the shooting element is displaced as the temperature of the surrounding environment changes, the output image is easily displaced in the plane direction. That is, it is known that the image will be displaced due to the temperature change of the surrounding environment. This phenomenon may cause an error in the target position when the target position for mounting the semiconductor chip 310 is determined based on the overhead image. Therefore, in the case where the semiconductor chip is to be bonded to the target position with higher accuracy, a compensation process for absorbing such an error may be performed. Specifically, for example, a calibration process for calculating a calibration value is performed at a specified time when the temperature change of the surrounding environment is assumed. The calibration value is the difference between the coordinate value calculated based on the overhead image and the coordinate value calculated based on the upward image for the same observation object. Then, in the packaging process of bonding the semiconductor chip 310 to the target position of the lead frame 330, the calculated calibration value is used to determine the precise target position. The calibration process and the packaging process are described in sequence below.

[0061] The calibration process is executed by the calibration control unit 213. The calibration control unit 213 first causes the first imaging unit 130, the second imaging unit 140, and the third imaging unit 150 to image the calibration mark 173. Figure 4 This is a diagram showing a situation where three imaging units capture an image of the calibration mark 173 .

[0062] As shown in the figure, when the calibration control unit 213 starts the calibration process, the mark driving motor 171 is driven via the drive control unit 212, thereby moving the mark plate 172 into the field of view of the third imaging unit 150. When the mark plate 172 moves into the field of view of the third imaging unit 150, the calibration mark 173 provided on the mark plate 172 is located approximately in the center relative to the field of view of the fixed third imaging unit 150.

[0063] Next, the calibration control unit 213 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 so that the focal plane 110a of the overhead imaging unit coincides with the mark surface 173a and the calibration mark 173 is located directly below the bonding tool 120. In addition, the bonding tool 120 retreats to a position that does not enter the field of view of the overhead imaging unit.

[0064] In the state where the calibration control unit 213 is arranged as described above, the calibration control unit 213 acquires the first top view image from the first imaging unit 130, the second top view image from the second imaging unit 140, and the bottom view image from the third imaging unit 150 via the image acquisition unit 211. Then, the three-dimensional coordinates (X and Y) of the calibration mark 173 are calculated based on the image coordinates of the images of the calibration mark 173 captured in the first top view image and the second top view image. hr , Y hr, Z hr In addition, the three-dimensional coordinates (X and Y) of the calibration mark 173 are calculated based on the image coordinates of the image of the calibration mark 173 captured in the bottom-up image. sr , Y sr , Z sr ). If it is assumed that the overhead imaging unit is not affected by the temperature change of the surrounding environment and the coordinates between the imaging units are accurately adjusted in the initial state of the bonding apparatus 100, then at least X hr =X sr , Y hr =Y sr .

[0065] However, as described above, after a period of time has passed since the bonding device 100 was first used, the three-dimensional coordinates calculated based on the overhead image will be affected by the temperature change of the surrounding environment and contain errors. Therefore, (ΔX, ΔY) as the error is used as the calibration value. Specifically, the error is expressed in the form of a difference, which can be set as ΔX = X sr -X hr , ΔY=Y sr -Y hr As long as the calibration value is calculated in advance as described above, the three-dimensional coordinates of a certain observation object are calculated based on the overhead image by the overhead image capturing unit (X ht , Y ht , Z ht ), then the calibration value can be added to correct it to (X ht +ΔX,Y ht +ΔY,Z ht ). It can be said that the corrected coordinate values ​​have no error with respect to the coordinate values ​​calculated from the bottom-up image obtained even if the same observation object is photographed by the bottom-up imaging unit.

[0066] The calibration control unit 213 stores the calibration value calculated as described above in the storage unit 220 as calibration data 221. Before it is evaluated that the temperature of the surrounding environment may further change and another calibration process is required, the calibration data 221 is referred to in the packaging process described later. In other words, if it is evaluated that another calibration process is required, the calibration control unit 213 repeats the above process and updates the calibration value.

[0067] As an example of evaluating the need for another calibration process, consider the timing when the packaging control unit 214 completes the bonding of a preset batch of semiconductor chips 310. Specifically, the calibration control unit 213 may also perform the calibration process corresponding to the timing of supplying a new batch of semiconductor chips 310 to the chip supply device 500. In addition, the operation time of the bonding operation performed by the packaging control unit 214 may also be used as a standard. For example, it may be stipulated that the calibration process is performed when the bonding operation is continuously performed for 60 minutes. Furthermore, a temperature detection unit for detecting the temperature of the overhead shooting unit is provided in the head 110, and the timing when the temperature detection unit detects a preset temperature may also be used. Specifically, multiple temperatures are pre-set, and the calibration process is performed when it is detected that the ambient temperature has crossed the temperature change. As long as the calibration value is updated as described above, the error of the coordinate value calculated based on the overhead image can be controlled within a certain range throughout the period of continuous packaging processing.

[0068] The packaging process is executed by the packaging control unit 214. The packaging control unit 214 first picks up the semiconductor chip 310 to be targeted. Figure 5 This is a diagram showing a state where the bonding tool 120 picks up the semiconductor chip 310 .

[0069] The packaging control unit 214 drives the head drive motor 111 via the drive control unit 212, thereby moving the head 110 to the upper part of the chip supply device 500, and drives the tool drive motor 121, thereby lowering the bonding tool 120. At the same time, the pickup mechanism 510 pushes the semiconductor chip 310 as the packaging target among the semiconductor chips 310 placed on the chip supply device 500 toward the flip mechanism 520, and the flip mechanism 520 absorbs and flips the semiconductor chip 310. Then, the lowered bonding tool 120 absorbs and picks up the semiconductor chip 310 through the chuck 122, so that the bonding tool 120 rises.

[0070] When the mark plate 172 is located in the field of view of the third imaging unit 150, the packaging control unit 214 moves the mark plate 172 away from the field of view of the third imaging unit 150 before and after the bonding tool 120 picks up the semiconductor chip 310. Specifically, the packaging control unit 214 drives the mark drive motor 171 via the drive control unit 212 to move the mark plate 172.

[0071] Next, the packaging control unit 214 causes the third imaging unit 150 to image the semiconductor chip 310 sucked by the bonding tool 120 . Figure 6 This is a diagram showing a state where the third imaging unit 150 captures an image of the semiconductor chip 310 adsorbed onto the bonding tool 120 .

[0072] The packaging control unit 214 drives the head driving motor 111 via the driving control unit 212, thereby moving the head 110 so that the focal plane 110a of the overhead imaging unit coincides with the marking surface 173a, and the third imaging unit 150 is located directly below the bonding tool 120. Then, the tool driving motor 121 is driven to lower the bonding tool 120 so that the contacting surface of the held semiconductor chip 310 that contacts the lead frame 330 coincides with the marking surface 173a. After completing the adjustment of this configuration, the packaging control unit 214 causes the third imaging unit 150 to capture the semiconductor chip 310 held by the bonding tool 120 via the image acquisition unit 211.

[0073] Figure 7 The figure schematically shows that the third imaging unit 150 captures and outputs a bottom view image of the semiconductor chip 310 held by the bonding tool 120. In addition, each subject image in the figure is directly labeled with the corresponding subject number for description.

[0074] As described above, the bonding tool 120 picks up and holds the semiconductor chip 310 prepared by the chip supply device 500 by adsorbing it with the chuck 122. At this time, the bonding tool 120 intends to adsorb the center of the semiconductor chip 310 in a predetermined direction, but in fact, there is a case where the semiconductor chip is adsorbed with a deviation. Therefore, the packaging control unit 214 confirms in what direction and position the semiconductor chip 310 is actually held, and identifies the reference position for placing the semiconductor chip 310 on the lead frame 330.

[0075] Figure 7 The bottom view image shown is an image obtained by the third imaging unit 150 looking up at the semiconductor chip 310, so the chuck 122 holding the semiconductor chip 310 is also captured. Therefore, the packaging control unit 214 calculates the image coordinates of the chuck center 123 by detecting a circle as the outline of the chuck 122.

[0076] In addition, the semiconductor chip 310 in this embodiment is provided with a chip reference mark 311 on the contacting predetermined surface with the lead frame 330, and the packaging control unit 214 calculates the image coordinates of the chip reference mark 311 captured in the bottom-up image. The packaging control unit 214 can recognize in what direction and at what position the semiconductor chip 310 is actually held relative to the chuck 122, based on the image coordinates of the chuck center 123 and the image coordinates of the chip reference mark 311 calculated as described above. For example, if the position where the chip reference mark 311 is set is used as the reference position for placing the semiconductor chip 310 on the lead frame 330, the packaging control unit 214 can calculate the three-dimensional coordinates of the reference position of the semiconductor chip 310 at the time of capturing the bottom-up image. Therefore, even if the bonding tool 120 or the head 110 is moved later, as long as the chuck 122 continues to hold the semiconductor chip 310, the three-dimensional coordinates of the reference position can be tracked.

[0077] After the packaging control unit 214 recognizes the three-dimensional coordinates of the reference position, the tool driving motor 121 is driven to raise the bonding tool 120 to a position where the held semiconductor chip 310 is retracted from the field of view of the overhead imaging unit. Then, the head driving motor 111 is driven to move the head 110 so that the bonding tool 120 is directly above the chip pad on which the semiconductor chip 310 is to be placed next, and the focal plane 110a of the overhead imaging unit is aligned with the frame surface 330a, which is the intended placement surface of the lead frame 330. In addition, the raising of the bonding tool 120 and the movement of the head 110 may be performed in parallel.

[0078] Figure 8 1 is a diagram showing a state where the first imaging unit 130 and the second imaging unit 140 capture images of the working area of ​​the lead frame 330 when the head 110 and the bonding tool 120 are arranged as described above. Fig. 9 yes Figure 8 A partial stereoscopic view of the lead frame 330 in this embodiment has a chip pad 320 in each unit area 322 that will be cut out and housed in a package in the future. In this embodiment, the unit area 322 is an operation area for performing a bonding operation, including a predetermined loading area for loading a semiconductor chip 310. In addition, the frame surface 330a is an operation plane including the operation area. A pad reference mark 321 indicating the reference position is provided in each unit area 322. In this embodiment, the pad reference mark 321 can be identified as a specific portion of the operation plane.

[0079] In such Figure 8 and Fig. 9In such a configuration, the first imaging unit 130 and the second imaging unit 140 can capture the die pad 320 and the pad reference mark 321 included in the same unit area 322 in the field of view and capture them in a focused state. The packaging control unit 214 uses the first top view image output by the first imaging unit 130 and the second top view image output by the second imaging unit 140 to calculate the coordinates of the target position where the reference position should be matched when the semiconductor chip 310 is placed on the die pad 320.

[0080] Fig.10 1 is a diagram showing a sequence of calculating the target coordinates for placing the semiconductor chip 310 from the first top view image and the second top view image. The first imaging unit 130 images the chip pads 320 from the pad reference mark 321 side, so the unit area 322 is captured in the first top view image as the output image of the chip pad 320 in a trapezoidal shape that expands toward the pad reference mark 321 side. On the other hand, the second imaging unit 140 images the chip pads 320 from the side opposite to the pad reference mark 321, so the unit area 322 is captured in the second top view image as the output image of the chip pad 320 in a trapezoidal shape that narrows toward the pad reference mark 321 side.

[0081] The packaging control unit 214 determines the image coordinates (x 1k ,y 1k ), and in addition, the image coordinates (x 2k ,y 2k Then, by referring to a conversion table for converting image coordinates into three-dimensional coordinates, for example, the marker coordinates (X k , Y k , Z k ). The coordinate value of the marker coordinate is a temporary target position used to calculate the precise target position, and as described above, it may be affected by the temperature change of the surrounding environment and contain errors. Therefore, the calibration value (ΔX, ΔY) is read from the calibration data 221 and then corrected. It is expected that the corrected marker coordinate (X k +ΔX,Y k +ΔY,Z k ) has no error with respect to the spatial coordinates calculated based on the upward-looking image.

[0082] Since the relative position between the preset target position of the chip pad 320 and the pad reference mark 321 is known, the packaging control unit 214 can calculate the target position of the chip pad 320 according to the corrected mark coordinates (X k +ΔX,Yk +ΔY,Z k ) accurately calculate the coordinates of the target position (X T , Y T , Z T ).

[0083] After the coordinates of the target position are determined, the semiconductor chip 310 is placed and bonded to the target position. Fig.11 This is a diagram showing a state in which the bonding tool 120 places and bonds the semiconductor chip 310 at a target position.

[0084] As described above, the packaging control unit 214 tracks and grasps the three-dimensional coordinates of the reference position of the semiconductor chip 310 relative to the movement of the bonding tool 120 or the head 110, and moves the semiconductor chip 310 so that the reference position matches the target position of the die pad 320. Specifically, the head drive motor 111 is driven by the drive control unit 212 to finely adjust the position of the head 110 in the XY direction, and the tool drive motor 121 is driven to finely adjust the rotation amount of the bonding tool 120 around the Z axis. Then, the bonding tool 120 is lowered in a state where the X coordinate and Y coordinate of the reference position are respectively consistent with the X coordinate and Y coordinate of the target position, and the semiconductor chip 310 is placed on the die pad 320. Then, the semiconductor chip 310 is pressed by the front end of the chuck 122 and heated by the heater 124, so that the semiconductor chip 310 is bonded to the die pad 320.

[0085] In this embodiment, the focus plane 110a of the overhead imaging unit and the mark plane 173a of the calibration mark 173 are aligned with the frame surface 330a of the lead frame 330 to calculate the calibration value. That is, the position of the head 110 in the Z direction when calculating the calibration value is the same as the position of the head 110 in the Z direction when the overhead imaging unit captures the chip reference mark 311. In addition, when using Figure 6 and Figure 7 As described above, the contacting surface of the semiconductor chip 310 held by the chuck 122 is aligned with the frame surface 330a of the lead frame 330, and the three-dimensional coordinates of the chip reference mark 311 are calculated. That is, the position in the Z direction of the bonding tool 120 when the three-dimensional coordinates of the chip reference mark 311 are calculated is the same as the position in the Z direction of the bonding tool 120 when the semiconductor chip 310 is placed on the die pad 320.

[0086] Therefore, there is no need to consider the error between the actual three-dimensional coordinates and the recognized three-dimensional coordinates relative to the XY direction that may occur when the head 110 or the bonding tool 120 is moved in the Z direction. Figure 8In the state in which the bonding tool 120 holds the semiconductor chip 310 and withdraws from the field of view of the overhead imaging unit, the X-coordinate and Y-coordinate of the actual reference position in the above state may not be consistent with the X-coordinate and Y-coordinate recognized by the packaging control unit 214 due to the influence of the clearance between the components of the moving mechanism that moves the bonding tool 120 up and down. Fig.11 In this way, the height of the bonding tool 120 when the semiconductor chip 310 is placed on the frame surface 330a becomes the same as the height of the bonding tool 120 when the three-dimensional coordinates of the chip reference mark 311 are calculated, and the error factor caused by the moving mechanism is eliminated. That is, the X coordinate and Y coordinate of the actual reference position when the semiconductor chip 310 is placed on the frame surface 330a become consistent with the X coordinate and Y coordinate recognized by the packaging control unit 214. From this point of view, when calculating the calibration value, it is effective to make the focal plane 110a and the mark surface 173a of the calibration mark 173 consistent with respect to the frame surface 330a, or when calculating the three-dimensional coordinates of the chip reference mark 311, it is effective to make the contact planned surface of the semiconductor chip 310 consistent with respect to the frame surface 330a.

[0087] In addition, when the frame surface 330a is made to coincide with the mark surface 173a, the height of the mark surface 173a may be adjusted to coincide with the frame surface 330a, or the height of the frame surface 330a may be adjusted to coincide with the mark surface 173a. When the height of the mark surface 173a is adjusted, for example, the mark surface 173a may be displaced in the Z-axis direction together with the third imaging unit 150 by driving the mark driving motor 171 so that the mark surface 173a and the focal plane 150a are kept consistent. When the height of the frame surface 330a is adjusted, for example, the frame surface 330a may be displaced in the Z-axis direction by driving the stage driving motor 191.

[0088] Fig.12 1 is a diagram showing the situation where the bonding tool 120 retreats. As shown in the figure, after the bonding of the semiconductor chip 310 is completed, the packaging control unit 214 drives the tool drive motor 121 via the drive control unit 212, thereby raising the bonding tool 120. Then, in the case of bonding a new semiconductor chip 310, the bonding tool 120 returns to the position of the bonding tool 120. Figure 5 status and repeat the process.

[0089] In the above calibration process and packaging process, the following case is described: the focus plane 150a of the overhead imaging unit, the mark surface 173a of the calibration mark 173, and the frame surface 330a of the lead frame 330 are respectively adjusted to be parallel to the horizontal plane as an example of the reference plane, and the mark surface 173a and the frame surface 330a are adjusted to be the same plane. However, in the case where the stage 190 includes a mechanism that can adjust the height or inclination of the stage surface 190a, or the front and back surfaces of the lead frame 330 are not parallel to each other due to manufacturing deviation, the frame surface 330a, which is the working plane of the packaging operation, may be inclined from the reference plane.

[0090] In the packaging process of semiconductor chips, the tilt of the working plane may cause various undesirable situations. For example, in the present embodiment, if the frame surface 330a is tilted relative to the reference plane, even if the overhead shooting unit can be focused relative to a certain working area, other working areas on the same frame surface 330a may not be focused unless the height of the head 110 is readjusted. In this way, every time a working area that cannot be focused appears, a step for readjusting the height of the head 110 is required, which violates the requirement of shortening the lead time. In particular, when a calibration value is used for high precision as in the present embodiment, it is sometimes necessary to perform the calibration process again to calculate the correction value relative to the height of the working area.

[0091] In this embodiment, if using Fig.10 As described above, the packaging control unit 214 calculates the plane coordinates (X k , Y k ), the height coordinate Z of the pad reference mark 321 is also calculated. k In addition, in order to confirm the direction and position of the lead frame 330 on the stage surface 190a, there is also a case where the plane coordinates of the marks provided on the stage surface 190a or the marks provided on the peripheral portion of the lead frame 330 are observed and calculated. In this case, the packaging control unit 214 also calculates the height coordinates. If more than three marks as objects for calculating the three-dimensional coordinates are not arranged on a straight line, the tilt of the plane on which these multiple marks are provided can be detected by using the three-dimensional coordinates calculated based on these marks.

[0092] The bonding device 100 of this embodiment includes a detection unit 215, which detects the inclination of the carrier surface 190a or the frame surface 330a relative to the reference plane by using the height coordinates calculated when calculating the in-plane coordinates (i.e., plane coordinates) of more than three specific parts of the carrier surface 190a or the frame surface 330a in a series of operations in which the packaging control unit 214 packages the semiconductor chip 310 as described above.

[0093] Fig.13 This is a diagram for explaining the detection principle of the inclination of the detection frame surface 330a relative to the reference plane. Specifically, Fig.13 3 is a diagram showing a schematically illustrated lead frame 330 as viewed from above. The lead frame 330 has a first unit region 322a at the lower left end, a second unit region 322b at the upper left end, and a third unit region 322c at the upper right end. Here, the semiconductor chip 310 is packaged continuously in the order of the first unit region 322a → the second unit region 322b → the third unit region 322c, and then packaged in other unit regions in sequence.

[0094] The packaging control unit 214 acquires the three-dimensional coordinates (X) of the first pad reference mark 321a provided in the first unit region 322a. Ta , Y Ta , Z Ta ), and after packaging the semiconductor chip 310 based on the three-dimensional coordinates, the detection unit 215 receives the three-dimensional coordinates from the packaging control unit 214. Similarly, the three-dimensional coordinates (X ) of the second pad reference mark 321b set in the second unit area 322b are also received from the packaging control unit 214. Tb , Y Tb , Z Tb ) and the three-dimensional coordinates (X Tc , Y Tc , Z Tc ). Then, the tilt of the frame surface 330a is calculated using the three 3D coordinates. Here, the tilt can be calculated as a normal vector of the frame surface 330a, or as a tilt angle around the X axis and a tilt angle around the Y axis.

[0095] In addition, when the inclination is calculated using three-dimensional coordinates of four or more points, it is sufficient to calculate the inclination of the regression plane after obtaining the regression plane applicable to these three-dimensional coordinates. Tx , Y Tx) to calculate the tilt, but since the position of each pad reference mark 311 on the lead frame 330 in the frame surface 330a is known, the known information and the calculated height coordinate Z can also be combined. k In the above, in order to improve the accuracy of the calculated tilt, three pad reference marks 321 respectively provided on the peripheral edge of the lead frame 330 are selected, but the reference marks 321 measured for calculating the tilt are not limited to these.

[0096] Fig.14 3 is a diagram showing the situation of parallel adjustment of the frame surface 330a. After the detection unit 215 calculates the inclination of the frame surface 330a, the packaging control unit 214 drives the stage drive motor 191 via the drive control unit 212 before executing the next packaging process for packaging the semiconductor chip 310, thereby performing parallel adjustment so that the frame surface 330a is parallel to the reference plane. At this time, as shown in the figure, the packaging control unit 214 can also simultaneously execute the operation of the bonding tool 120 picking up the semiconductor chip 310 to be packaged next time from the chip supply device 500. As described above, if the inclination of the frame surface 330a can be eliminated in a series of packaging processes for packaging multiple semiconductor chips 310, the lead time required for the packaging process can be shortened, and more accurate packaging processing can be achieved.

[0097] In addition, depending on the degree of inclination of the frame surface 330a, the pad reference mark may not be within the depth of field D of the top-view imaging unit in any unit area. P In this case, the packaging control unit 214 moves the head 110 up and down to converge the unit area to the depth of field D. P , and then calculate the three-dimensional coordinates of the pad reference mark set in the unit area. At this time, the packaging of the semiconductor chip 310 in the unit area is retained. Then, the detection unit 215 calculates the inclination of the frame surface 330a based on these three-dimensional coordinates. Based on the result, the packaging control unit 214 drives the stage driving motor 191 to eliminate the inclination and adjust the frame surface 330a to become the same surface as the mark surface 173a. Then, the head 110 is moved up and down again to calculate the three-dimensional coordinates of the pad reference mark, and the semiconductor chip 310 is packaged in the unit area based on the three-dimensional coordinates.

[0098] Next, the overall bonding procedure including the calibration process, the packaging process, and the parallel adjustment process described above will be summarized along the flowchart. Fig.15 3 is a flowchart illustrating a procedure for bonding the semiconductor chip 310 .

[0099] In step S11, the calibration control unit 213 starts a calibration control step for performing calibration processing. The details will be described later as a subroutine. In addition, when the packaging process is started from the initial state where the coordinates between the imaging units are accurately adjusted, the initial calibration control step can also be skipped.

[0100] After the calibration control unit 213 completes the execution of the calibration control step, the process proceeds to step S12, and the packaging control unit 214 starts the packaging control step for packaging processing. The details will be described later as a subroutine.

[0101] After the packaging control unit 214 finishes the execution of the packaging control step, the process proceeds to step S13, where the calibration control unit 213 determines whether the state of the bonding device 100 at the time point satisfies the pre-set calibration timing condition. As the pre-set calibration timing condition, a condition that may be considered to require another calibration process is set. For example, as described above, the number of batches that have been processed, the operation time of the bonding operation, the temperature detected by the temperature detection unit, etc. become candidates for setting the condition.

[0102] In step S13, when the calibration control unit 213 determines that the condition is satisfied, the process returns to step S11. When it is determined that the condition is not satisfied, the process proceeds to step S14. When the process proceeds to step S14, the packaging control unit 214 determines whether the state of the bonding device 100 at this time satisfies the pre-set condition of the timing of parallel adjustment. The pre-set condition of the timing of parallel adjustment can be considered as a condition that requires parallel adjustment processing. For example, as described above, the time point when the semiconductor chips 310 are packaged on the three unit areas 322 set in the peripheral portion, or the time point when a specified number or a specified batch number of semiconductor chips 310 are packaged becomes a candidate for setting the condition. In addition, as described above, the time point when the lead frame 330 is placed on the carrier 190 can also be used as a setting condition.

[0103] If the packaging control unit 214 determines that the condition is satisfied in step S14, the process proceeds to step S15, and the detection unit 215 starts the parallel adjustment step. After the parallel adjustment step is completed, the process returns to step S12. If the condition is not satisfied in step S14, the process proceeds to step S16.

[0104] When entering step S16, the packaging control unit 214 determines whether all the scheduled packaging processes are completed. If it is determined that the semiconductor chip 310 to be packaged remains, the process returns to step S12. If it is determined that all the packaging processes are completed, the series of processes ends.

[0105] Fig.16 is a sub-flow chart illustrating the sequence of the calibration control steps. In the calibration control step, the main execution is to use Figure 4In step S1101, the calibration control unit 213 moves the mark plate 172 to place the calibration mark 173 at the center of the field of view of the third imaging unit 150. Next, in step S1102, the calibration control unit 213 moves the head 110 so that the calibration mark 173 becomes the focal plane 110a of the first imaging unit 130 and the second imaging unit 140, and the calibration mark 173 is located directly below the bonding tool 120.

[0106] The calibration control unit 213 proceeds to step S1103, and causes each imaging unit to perform imaging via the image acquisition unit 211, and acquires a first overhead image from the first imaging unit 130, a second overhead image from the second imaging unit 140, and a bottom image from the third imaging unit 150. Then, in the subsequent step S1104, the three-dimensional coordinates of the calibration mark 173 are calculated based on the image coordinates of the images of the calibration mark 173 captured in the first overhead image and the second overhead image, respectively, and the three-dimensional coordinates of the calibration mark 173 are calculated based on the image of the calibration mark 173 captured in the bottom image. The calibration control unit 213 calculates the difference in the XY plane direction of each three-dimensional coordinate calculated as described above as a calibration value. The calculated calibration value is stored in the storage unit 220 as calibration data 221.

[0107] Then, in step S1105, the calibration control unit 213 moves the mark plate 172 to retract the calibration mark 173 from the field of view of the third imaging unit 150. After the calibration mark 173 is retracted, the process returns to the main flow. In addition, the calibration mark 173 may also be retracted during the subsequent packaging process.

[0108] Fig.17 is a sub-flowchart that illustrates the sequence of the encapsulation control steps. In the encapsulation control step, the main execution uses Figures 5 to 12 The processing described.

[0109] In step S1201, the packaging control unit 214 moves the head 110 to the upper part of the chip supply device 500 to lower the bonding tool 120. Then, the semiconductor chip 310 to be packaged among the semiconductor chips 310 placed in the chip supply device 500 is reversed by the pickup mechanism 510 and the flip mechanism 520, and the chuck 122 sucks and picks it up, so that the bonding tool 120 rises.

[0110] In step S1202, the packaging control unit 214 moves the head 110 so that the focal plane 110a of the overhead imaging unit coincides with the index surface 173a, and the third imaging unit 150 is located directly below the bonding tool 120. Furthermore, in step S1203, the bonding tool 120 is lowered so that the contacting surface of the held semiconductor chip 310 that contacts the lead frame 330 coincides with the index surface 173a.

[0111] After completing the adjustment of such configuration, the packaging control unit 214 causes the third imaging unit 150 to capture the contacting surface of the semiconductor chip 310 held by the bonding tool 120 in step S1204. Then, in step S1205, the bottom view image output by the third imaging unit 150 is acquired, and the three-dimensional coordinates of the reference position of the semiconductor chip 310 are recognized based on the image coordinates of the captured chip reference mark 311 and the like.

[0112] In step S1206, the packaging control unit 214 raises the bonding tool 120 to a position where the held semiconductor chip 310 is out of the field of view of the overhead imaging unit, and moves the head 110 so that the bonding tool 120 is directly above the die pad 320 on which the semiconductor chip 310 is next placed. In the subsequent step S1207, the height of the head 110 is adjusted so that the focal plane 110a of the overhead imaging unit coincides with the frame surface 330a of the lead frame 330.

[0113] After completing the adjustment of such arrangement, the packaging control unit 214 causes the first imaging unit 130 and the second imaging unit 140 to capture the unit area 322 including the target chip pad 320 and the pad fiducial mark 321 on the placement plan surface in step S1208. Then, in step S1209, the first top view image output by the first imaging unit 130 and the second top view image output by the second imaging unit 140 are acquired, and the three-dimensional coordinates of the target position are calculated based on the image coordinates of the captured pad fiducial mark 321 and the calibration value.

[0114] After the target position is determined, the process proceeds to step S1210, where the head 110 and the bonding tool 120 are moved so that the reference position of the semiconductor chip 310 coincides with the target position, and the semiconductor chip 310 is placed on the die pad 320. Then, the semiconductor chip 310 is pressurized / heated to complete the bonding. After the bonding is completed, the bonding tool 120 is raised and the process returns to the main process.

[0115] Fig.18 is a sub-flow chart illustrating the sequence of parallel adjustment steps. In the parallel adjustment step, the main execution is to use Fig.13 and Fig.14 The processing described.

[0116] In step S1501, the detection unit 215 obtains the three-dimensional coordinates of the pad reference marks of more than three points calculated in the packaging control step. In the subsequent step S1502, the inclination of the frame surface 330a relative to the reference plane is detected based on the obtained three-dimensional coordinates. In step S1503, the drive control unit 212 drives the stage drive motor 191 to set the inclination detected by the detection unit 215 to 0. In the present embodiment, in particular, the frame surface 330a is made horizontal. At this time, in the case where the height of the frame surface 330a deviates from the height of the mark surface 173a, the height can be adjusted at the same time to make them the same height. After completing the adjustment of the frame surface 330a, return to the main process.

[0117] In the above description, although an embodiment in which the semiconductor chip 310 is bonded to the frame surface 330a of the lead frame 330 is described, the parallel adjustment can also be implemented in an embodiment in which the semiconductor chip is stacked and packaged on other semiconductor chips already packaged on the substrate surface. Fig.19 1 is a partial perspective view of a bonding apparatus 100 for explaining a first application example of the embodiment. The bonding apparatus 100 of the first application example has the same hardware structure as the bonding apparatus 100 described above, but is different in that it performs packaging control of stacked package semiconductor chips. Fig.19 is with Fig. 9 Components identical to those already described are denoted by the same reference numerals and their description is omitted unless otherwise specified.

[0118] Before the first semiconductor chip 310 a as the first layer is packaged in each unit region 322 of the lead frame 330 , the process is the same as that before the semiconductor chip 310 is packaged in each unit region 322 in the above description. Fig.19 The figure shows the state where the second semiconductor chip 310b as the second layer is packaged on top of the first semiconductor chip 310a. Specifically, the second semiconductor chip 310b to be packaged next is sucked by the clamp 122, and the upper surface of the packaged first semiconductor chip 310a, which is the mounting surface for mounting the second semiconductor chip 310b, is photographed by the top-view imaging unit.

[0119] A stacking reference mark 323 indicating a reference position is provided on the upper surface of the first semiconductor chip 310a, and the stacking reference mark 323 is captured in both the first top view image and the second top view image. The packaging control unit 214 calculates the three-dimensional coordinates (X-axis, Y-axis, and Y-axis) of the stacking reference mark 323 based on these images. j , Y j , Z j). Here, if the three-dimensional coordinates of two or more stacking reference marks 323 have been calculated, the detection unit 215 can calculate the inclination of the working plane including the upper surface of each first semiconductor chip 310a relative to the reference plane. If it is assumed that the working plane is tilted above the allowable range relative to the reference plane, the drive control unit 212 drives the stage drive motor 191 to eliminate the inclination. If the inclination is eliminated, or if the inclination above the allowable range is not detected, the packaging control unit 214 lowers the bonding tool 120 to bond the second semiconductor chip 310b to the upper surface of the first semiconductor chip 310a.

[0120] The parallel adjustment can also be performed in a wire bonding machine. Fig. 20 1 is a partial perspective view of a bonding apparatus 100 ′ as a wire bonding machine for explaining a second application example of the embodiment. Fig. 20 is with Fig. 9 Components identical to those already described are denoted by the same reference numerals and their description is omitted unless otherwise specified.

[0121] The bonding apparatus 100' connects the pad electrode 341 of the semiconductor chip 340 and the lead electrode 342 of the lead frame 330' using the wire 350 as the bonding wire. The pad electrode 341 and the lead electrode 342 are targets for which the three-dimensional coordinates are measured and the wire 350 is supplied.

[0122] The head 110' supports the bonding tool 120', the first imaging unit 130, and the second imaging unit 140. The bonding tool 120', for example, has the function of supplying the wire 350 as a metal wire, and includes a wire clamp, a transducer, and a capillary. When the first bonding is performed to the pad electrode 341, as shown in the figure, the wire 350 extends from the front end, and a free air ball (FAB) is formed at the front end of the wire 350 through a welding gun electrode (not shown).

[0123] The packaging control unit 214 uses a top-view shooting unit to shoot the pad electrode 341 and the lead electrode 342 connected by the wire 350 and calculate their respective three-dimensional coordinates. Here, if the three-dimensional coordinates of two or more lead electrodes 342 have been calculated, the detection unit 215 can calculate the inclination of the frame surface of the lead frame 330' relative to the reference plane. If it is assumed that the frame surface is tilted above the allowable range relative to the reference plane, the drive control unit 212 drives the stage drive motor 191 to eliminate the inclination. If the inclination is eliminated, or if the inclination above the allowable range is not detected, the packaging control unit 214 lowers the bonding tool 120' and performs the wiring process.

[0124] The present embodiment is described above together with two modified examples, but is not limited to these bonding devices. A packaging tool that performs packaging operations on at least one of a substrate placed on a stage and other packages already packaged on the substrate is supported by a head together with a top-view imaging unit. If the semiconductor device is packaged by displacing the head relative to the stage, the inclination of the stage surface or the working plane relative to the reference plane can be detected using the height information of each of the plurality of parts calculated based on the first top view image and the second top view image. In the present embodiment, a case where the stage is driven to eliminate the detected inclination and the packaging process is continued is described, but the processing based on the detected inclination is not limited to the processing of driving the stage. For example, the packaging process may be terminated at the time when the inclination exceeding the allowable range is detected.

[0125] Description of Figure Numbers

[0126] 100, 100': Jointing device

[0127] 110, 110': Head

[0128] 110a: focal plane

[0129] 111: Head drive motor

[0130] 120, 120': Joining tool

[0131] 121: Tool drive motor

[0132] 122: Chuck

[0133] 123: Chuck center

[0134] 124: Heater

[0135] 130: First shooting unit

[0136] 131: First optical system

[0137] 131a: Object side lens group

[0138] 131b: Image side lens group

[0139] 132: First camera element

[0140] 133: Aperture

[0141] 140: Second shooting unit

[0142] 141: Second optical system

[0143] 142: Second camera element

[0144] 150: Third shooting unit

[0145] 150a: focal plane

[0146] 151: The third optical system

[0147] 152: Third camera element

[0148] 170: Calibration unit

[0149] 171: Logo drive motor

[0150] 172: Sign board

[0151] 173: Calibration mark

[0152] 173a: Logo surface

[0153] 180: Stand

[0154] 190: Carrier

[0155] 190a: Carrier surface

[0156] 191: Stage drive motor

[0157] 210: Operation processing unit

[0158] 211: Image acquisition unit

[0159] 212: Drive control unit

[0160] 213: Calibration Control Department

[0161] 214: Packaging Control Department

[0162] 215: Inspection Department

[0163] 220: Storage

[0164] 221: Calibration Data

[0165] 230: Input and output devices

[0166] 310: Semiconductor chips

[0167] 310a: first semiconductor chip

[0168] 310b: second semiconductor chip

[0169] 311: Chip fiducial marking

[0170] 320: Chip pad

[0171] 321: Pad fiducial mark

[0172] 321a: First pad reference mark

[0173] 321b: Second pad reference mark

[0174] 321c: Third pad reference mark

[0175] 322: Unit area

[0176] 322a: First unit area

[0177] 322b: Second unit area

[0178] 322c: Third unit area

[0179] 323: Stacked fiducial markers

[0180] 330, 330': Lead frame

[0181] 330a: Frame surface

[0182] 340: Semiconductor chips

[0183] 341: Pad electrode

[0184] 342: Lead electrode

[0185] 350: Line

[0186] 500: Chip supply device

[0187] 510: Pick-up mechanism

[0188] 520: Flip mechanism

Claims

1. A packaging device, comprising: A carrier for mounting a substrate encapsulated with a package body; A packaging tool for performing a packaging operation on at least one of the substrate placed on the carrier and other packaging bodies already packaged on the substrate; The first photographing unit and the second photographing unit are configured so that their respective optical systems and photographing elements satisfy the Sham condition, so that a plane parallel to the reference plane becomes a focal plane, and are used to photograph the working area where the packaging operation is performed from a bird's-eye view; A head, supporting the packaging tool, the first photographing unit and the second photographing unit, and capable of displacement relative to the stage; as well as The detection unit detects the inclination of the carrier surface or the working plane relative to the reference plane using respective height information of a plurality of parts calculated based on a first overhead view image and a second overhead view image, wherein the first overhead view image and the second overhead view image are obtained by displacing the head so that the first imaging unit and the second imaging unit respectively photograph and output the plurality of parts of the carrier surface of the carrier or the working plane including the working area. 2 . The packaging device according to claim 1 , further comprising a drive control unit configured to drive the stage based on the tilt detected by the detection unit so that the stage surface or the working plane is parallel to the reference plane.

3. The packaging device according to claim 2, comprising a packaging control unit, wherein the packaging control unit packages the package body in the working area by controlling a control object including the packaging tool. In a series of operations of the packaging control unit to package the package body, the detection unit calculates the in-plane coordinates of a specific portion of the carrier surface or the working plane based on the first overhead image and the second overhead image, and uses the height coordinates of the specific portion calculated together as the height information.

4. The packaging device according to claim 3, wherein: The detection unit detects the tilt by using the height coordinate calculated in the operation of the packaging control unit to confirm the placement position of the substrate with respect to the stage. The drive control unit drives the stage so that the working plane is parallel to the reference plane before the packaging control unit places the package on the working area.

5. The packaging device according to claim 3, wherein: The detection unit detects the inclination by using the height coordinates of the respective working planes calculated during the sealing of three or more packages by the sealing control unit, When the package is further packaged, the drive control unit drives the stage so that the working plane is parallel to the reference plane before the package is placed in the working area.

6. The packaging device according to any one of claims 3 to 5, comprising: a third photographing unit, configured to photograph the package body held in the packaging tool from a side opposite to the first photographing unit and the second photographing unit, looking up at the stage surface; as well as a calibration control unit that calculates calibration values ​​based on causing the first and second overhead images of a preset calibration mark to be captured and output by the first and second imaging units, respectively, and causing the third imaging unit to capture and output a bottom-up image of the calibration mark, the calibration values ​​calibrating a difference between coordinate values ​​calculated based on the first and second overhead images outputted by the first and second imaging units, respectively, and coordinate values ​​calculated based on the bottom-up image outputted by the third imaging unit, The packaging control unit identifies the reference position of the packaging body based on the bottom view image, and identifies the target position of the working area based on the first top view image, the second top view image and the calibration value, so as to place and package the packaging body in the working area in a manner that the reference position matches the target position. The bottom view image is formed by adjusting the position of the packaging tool so that the working plane becomes the same height as the marking surface of the calibration mark, so that the third imaging unit photographs and outputs the packaging surface of the packaging body. The first top view image and the second top view image are formed by adjusting the positions of the first imaging unit and the second imaging unit so that the focal plane becomes the same height relative to the working plane having the same height as the marking surface, so that the first imaging unit and the second imaging unit respectively photograph the working area.

7. A packaging method, which is a packaging method using a packaging body of a packaging device, wherein the packaging device comprises: A carrier, for mounting a substrate encapsulating the package body; A packaging tool for performing packaging operations on at least one of the substrate placed on the stage and other packaging bodies already packaged on the substrate; a first photographing unit and a second photographing unit, each of which has an optical system and a photographing element configured to satisfy the Sham condition, so that a plane parallel to the reference plane becomes a focal plane, and is used to photograph a working area where the packaging operation is performed from a bird's-eye view; and a head, which supports the packaging tool, the first shooting unit and the second shooting unit and can be displaced relative to the stage, the packaging method comprising: An acquisition step of acquiring height information of a plurality of parts calculated based on a first overhead image and a second overhead image, wherein the first overhead image and the second overhead image are obtained by displacing the head and causing the first photographing unit and the second photographing unit to respectively photograph and output the plurality of parts of the stage surface of the stage or the working plane including the working area; as well as A detection step is performed to detect the inclination of the stage surface or the working plane relative to the reference plane using the height information.

8. A packaging control program is a packaging control program for controlling a packaging device, wherein the packaging device comprises: A carrier for mounting a substrate encapsulated with a package body; A packaging tool for performing packaging operations on at least one of the substrate placed on the stage and other packaging bodies already packaged on the substrate; a first photographing unit and a second photographing unit, each of which has an optical system and a photographing element configured to satisfy the Sham condition, so that a plane parallel to the reference plane becomes a focal plane, and is used to photograph a working area where the packaging operation is performed from a bird's-eye view; and a head, which supports the packaging tool, the first shooting unit and the second shooting unit and can be displaced relative to the stage, and the packaging control program enables the computer to execute the following steps: An acquisition step of acquiring height information of a plurality of parts calculated based on a first overhead image and a second overhead image, wherein the first overhead image and the second overhead image are obtained by displacing the head and causing the first photographing unit and the second photographing unit to respectively photograph and output the plurality of parts of the stage surface of the stage or the working plane including the working area; as well as A detection step is performed to detect the inclination of the stage surface or the working plane relative to the reference plane using the height information.

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