Connector
By designing the upper and lower parts on the housing of the connector, controlling their thermal expansion characteristics, the problem of lifting the terminal parts due to thermal expansion is solved, and the stability and reliability of the connector are achieved.
Patent Information
- Application Number
- CN202380065680.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-09-21
- Filing Date
- 2023-08-31
- Publication Date
- 2025-04-18
AI Technical Summary
When the substrate connection portion is connected to the surface of the circuit substrate by reflow soldering, thermal expansion may occur in the case, causing the through position of the terminal connection portion to be displaced upward, thereby lifting the substrate connection portion from the surface of the circuit substrate.
A connector is designed, and its case has an upper position and a lower position. The volume of the upper position is larger than that of the lower position. The thermal expansion of the upper position can be made smaller than that of the lower position in the upper direction, thereby suppressing thermal expansion of the upper position.
It effectively prevents the terminal parts from being lifted from the circuit board, ensuring the stability and reliability of the connector.
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Figure CN119856344A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to connectors. Background Art
[0002] The connector disclosed in Patent Document 1 includes a housing arranged on the surface of a circuit substrate and a terminal part assembled to the housing. The housing has a base wall in a shape that stands up from the surface of the circuit substrate and a cylindrical peripheral wall that protrudes forward from the outer edge of the base wall. A through hole is formed in the base wall. The terminal part is formed in a pin shape and has: a terminal connection part that passes through the through hole of the base wall and is connected to the other terminal part on the inner side of the peripheral wall; and a substrate connection part that is soldered to the circuit substrate at the lower end part farther back than the substrate for connection. The terminal connection part (swing support part) of the terminal part (contact terminal) is swingably supported on the base wall in a state where it passes through the through hole (assembly hole), and is tilted within the gap formed between it and the part of the base wall that protrudes backward (terminal support plate). In addition, connectors for substrates are also disclosed in Patent Documents 2-4. Prior art literature Patent Literature
[0003] Patent Document 1: Japanese Patent Application Publication No. 2011-187213 Patent Document 2: Japanese Patent Application Publication No. 2019-204744 Patent Document 3: Japanese Patent Application Publication No. 2005-190680 Patent Document 4: Japanese Patent Application Publication No. 2005-116230 Summary of the invention Problems to be solved by the invention
[0004] For example, when the substrate connection portion is connected to the surface of the circuit substrate by reflow soldering, there is a concern that the housing may thermally expand. If the housing thermally expands, there is a possibility that the through position of the terminal connection portion in the base wall will shift upward, causing the substrate connection portion to lift from the surface of the circuit substrate.
[0005] Therefore, an object of the present disclosure is to provide a connector capable of preventing terminal parts from being lifted off a circuit board. Solutions to Solve Problems
[0006] The connector disclosed in the present invention comprises a housing arranged on the surface of a circuit substrate and a terminal part assembled on the housing, the housing having a base wall in a shape standing up on the surface of the circuit substrate and a cylindrical peripheral wall protruding forward from the outer edge of the base wall, the terminal part having: a terminal connecting part, which passes through a through hole of the base wall and is connected to a counterpart terminal part on the inner side of the peripheral wall; and a substrate connecting part, which extends downward from the rear end of the terminal connecting part at a position rearward of the base wall, and the lower end is soldered to the surface of the circuit substrate for connection, the through hole having an inner lower surface parallel to the lower surface of the terminal connecting part and an inner upper surface parallel to the upper surface of the terminal connecting part, the base wall having: a lower portion, which divides the inner lower surface and is formed below the through hole within the height range of the rearward protruding portion of the base wall; and an upper portion, which divides the inner upper surface and is formed above the through hole within the height range of the rearward protruding portion of the base wall, the upper portion having a larger volume than the lower portion. Effects of the Invention
[0007] According to the present disclosure, it is possible to provide a connector that can prevent terminal parts from being lifted off a circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1 It is a cross-sectional view of the connector fitted with the mating housing in the first embodiment of the present disclosure. Figure 2 This is a perspective view of the connector. Figure 3 This is a partial enlarged rear view of the connector. Figure 4 yes Figure 3 A-A line cross-sectional view. Figure 5 yes Figure 3 BB line cross-sectional view. Figure 6 yes Figure 5 A partial enlarged cross-sectional view of . DETAILED DESCRIPTION
[0009] [Description of Embodiments of the Present Disclosure] First, embodiments of the present disclosure will be described below. Connector of the present disclosure (1) A housing arranged on a surface of a circuit board and a terminal part mounted on the housing, the housing having a base wall in a shape standing up on the surface of the circuit board and a cylindrical peripheral wall protruding forward from the outer edge of the base wall, the terminal part having: a terminal connecting portion, which passes through a through hole of the base wall and is connected to a counterpart terminal part on the inner side of the peripheral wall; and a substrate connecting portion, which extends downward from a rear end portion of the terminal connecting portion at a position rearward of the base wall, and is connected to the surface of the circuit board by soldering at a lower end portion, the through hole having an inner lower surface which is parallel to and opposite to a lower surface of the terminal connecting portion and an inner upper surface which is parallel to and opposite to an upper surface of the terminal connecting portion, the base wall having: a lower portion which divides the inner lower surface and is formed below the through hole within a height range of a portion of the base wall protruding backward; and an upper portion which divides the inner upper surface and is formed above the through hole within a height range of a portion of the base wall protruding backward, the upper portion having a larger volume than the lower portion.
[0010] According to the above structure, since the upper portion has a larger volume than the lower portion, the thermal expansion of the upper portion in the vertical direction can be made smaller than that of the lower portion. As a result, the thermal expansion of the upper portion caused by heating during the installation of the connector can be suppressed. As a result, the through position of the terminal connection portion in the through hole of the base wall can be suppressed from shifting upward, and the substrate connection portion can be prevented from lifting from the circuit substrate.
[0011] (2) Preferably, the inner upper surface of the upper portion is formed to be longer than the inner lower surface of the lower portion in the front-rear direction, and the rear end of the inner upper surface of the upper portion is located rearward of the rear end of the inner lower surface of the lower portion. According to the above structure, the terminal connection part can be in contact with the inner upper surface of the upper part for a long time, and the rear end side of the terminal connection part can be prevented from being displaced in an upward tilted manner inside the through hole. As a result, the substrate connection part can be effectively prevented from being lifted from the circuit substrate.
[0012] (3) The upper portion may be formed thicker than the lower portion in the up-down direction. According to the above configuration, since the contact pressure of the upper portion side to the terminal connecting portion can be increased, the board connecting portion can be prevented from lifting from the circuit board even if the inner upper surface of the upper portion is not particularly long in the front-rear direction.
[0013] (4) It may also be that the upper portion has an upper introduction surface that is inclined upward from the rear end of the inner upper surface toward the rear, and the lower portion has a lower introduction surface that is inclined downward from the rear end of the inner lower surface toward the rear, and the front end of the lower introduction surface is located forward of the front end of the upper introduction surface. According to the above structure, the upper lead-in surface and the lower lead-in surface can play the function of introducing the terminal connection portion into the through hole. In particular, since the front end of the lower lead-in surface is connected to the rear end of the inner lower surface of the lower portion at a position forward of the front end of the upper lead-in surface, the inner lower surface of the lower portion can be efficiently formed in the front-to-back direction to be shorter than the inner upper surface of the upper portion.
[0014] [Details of the embodiments of the present disclosure] Hereinafter, specific examples of the present disclosure will be described with reference to the drawings. In addition, the present invention is not limited to these examples, but is indicated by the claims, and is intended to include all changes within the meaning and scope of the claims and their equivalents.
[0015] <Implementation method 1> The connector 10 of the first embodiment of the present disclosure is a substrate connector, and includes a housing 20 disposed on the surface of a circuit substrate 90 and a terminal part 70 mounted on the housing 20. The housing 20 is mated with a counterpart housing 60. In the following description, in terms of the front-to-back direction, the side of the housing 20 mating with the counterpart housing 60 is referred to as the front side. Figure 3 The right side of each figure except for the figure is the front side (symbol X). In terms of the up-down direction, the side where the housing 20 is provided relative to the surface of the circuit board 90 is the upper side. Figure 4 The upper side of each figure other than the upper side is the upper side (symbol Z). The up-down direction is synonymous with the height direction. The left-right direction is based on the left-right direction when viewed from the front side, and the left-right direction is the rear view. Figure 3 The left side of is set as the right side (symbol Y). The left-right direction is synonymous with the width direction. These direction references are adopted for convenience and may not be consistent with the direction references in a state where the connector 10 is mounted on a vehicle not shown in the figure.
[0016] (Other shell) The other housing 60 is made of synthetic resin, such as Figure 1 As shown, the mating housing 60 is constructed as a square-shaped female housing. The mating housing 60 has a plurality of chambers 61. Each chamber 61 contains a mating terminal part 80 as a female terminal part connected to the terminal portion of the electric wire 100. The mating housing 60 has a locking arm 62 for keeping the housing 20 and the mating housing 60 in a mating state.
[0017] (Housing and terminal parts) The housing 20 is made of synthetic resin and is formed in a cover shape as a whole. Figure 2 and Figure 5As shown in FIG. 1 , the housing 20 has a base wall 21 that is vertically erected and has a rectangular shape when viewed from behind, and a peripheral wall 22 that is square and cylindrical and protrudes forward from the outer edge of the base wall 21. The side wall portions 23 on the left and right sides of the peripheral wall 22 have protective wall portions 24 that protrude backward from the base wall 21. Each protective wall portion 24 protects the later-described substrate connection portion 72 of the terminal part 70 from the side. Figure 2 The fixing member 50 is mounted as shown. The fixing member 50 is a metal plate, and is fixed to the surface of the circuit board 90 by soldering in a state where the fixing member 50 is mounted in the housing 20.
[0018] In the middle side of the upper wall portion 27 of the peripheral wall 22 in the left-right direction, Figure 1 The locking portion 26 is formed as shown. The locking portion 26 protrudes toward the inner side of the peripheral wall 22. The locking portion 26 is locked with the locking arm 62 of the counterpart housing 60. A through hole 28 is formed on the upper end side of the base wall 21 by drawing of a die (not shown) for forming the locking portion 26.
[0019] like Figure 1 and Figure 5 As shown in FIG. 2 , a plurality of through holes 29 are formed in the base wall 21. Each through hole 29 is formed in a rectangular opening shape that is long in the left-right direction. Figure 2 As shown, the through holes 29 are arranged in two layers and multiple rows in the width direction. The two rows of through holes 29 arranged in the center in the left-right direction are arranged below the through holes 28 and below the through holes 29 arranged on both sides in the left-right direction with a smaller opening diameter.
[0020] The terminal parts 70 are made of conductive metal, are formed in the shape of protrusions, and are held on the base wall 21 in a state of penetrating each through hole 29. Figure 2 As shown, the terminal part 70 of the present embodiment 1 is composed of four types, namely, a terminal part 70A, a terminal part 70B, a terminal part 70C, and a terminal part 70D. Among them, the terminal part 70A is a large and long part that penetrates the through-holes 29 of the upper layer arranged on both sides in the left-right direction, the terminal part 70B is a large and short part that penetrates the through-holes 29 of the lower layer arranged on both sides in the left-right direction, the terminal part 70C is a small and long part that penetrates the through-holes 29 of the upper layer arranged on the central side in the left-right direction, and the terminal part 70D is a small and short part that penetrates the through-holes 29 of the lower layer arranged on the central side in the left-right direction. In addition, in the following description, as long as there is no need to distinguish them specifically, the terminal parts 70A, 70B, 70C, and 70D are collectively referred to as the terminal parts 70.
[0021] Each terminal part 70 is formed into a tab shape, such as Figure 5As shown, the circuit board 90 has a terminal connection portion 71 extending in the front-to-back direction through the through hole 29, and a substrate connection portion 72 extending downward from the rear end of the terminal connection portion 71 at a position further back than the base wall 21. The substrate connection portion 72 has a solder connection portion 73 extending backward from the lower end side. The solder connection portion 73 is soldered to a conductive portion (not shown) formed on the surface of the circuit board 90 for electrical connection (see FIG. Figure 1 ).
[0022] like Figure 4 As shown, the terminal connection portion 71 includes: a connection body portion 74 disposed inside the through hole 29 and inside the peripheral wall 22; and a connecting portion 75 extending from the through hole 29 with a smaller plate width (dimension in the left-right direction) than the connection body portion 74. When the housing 20 is mated with the counterpart housing 60, as shown in FIG. Figure 1 As shown, the connection body portion 74 is electrically connected to a counterpart terminal fitting 80 mounted on the counterpart housing 60 inside the peripheral wall 22 .
[0023] like Figure 3 As shown, the long terminal parts 70A and 70C ( Figure 3 Only 70A is shown in the figure) so that the connecting portion 75 is connected to one side of the rear end surface of the connecting body portion 74 in the left-right direction ( Figure 3 The short terminal parts 70B and 70D ( Figure 3 Only 70B is shown in the figure) so that the connecting portion 75 is connected to the other side ( Figure 3 Thus, the upper and lower layers of the terminal parts 70 avoid mutual interference.
[0024] like Figure 4 As shown, the rear end portion of the connecting body portion 74 has a step surface 76 facing forward at a position on the side opposite to the above-mentioned rear end surface connected to the connecting portion 75. When the connecting body portion 74 is inserted into the through hole 29 from the rear, the step surface 76 contacts the opening end surfaces 34 on the left and right sides of the through hole 29 in the rear surface of the base wall body portion 31 described later, and the insertion action of the terminal part 70 is stopped. In addition, the rear end portion of the connecting body portion 74 has a locking protrusion 77 extending to the left and right sides at a position forward of the step surface 76. The step surface 76 contacts the opening end surfaces 34 on the left and right sides of the through hole 29 and each locking protrusion 77 is locked in the left and right surfaces 33 on the inner side of the through hole 29 in a sunken manner, thereby the terminal part 70 is inserted into the through hole 29 and retained on the base wall 21.
[0025] like Figure 1 and Figure 5As shown in FIG. 1 , the base wall 21 includes: a base wall main body 31 arranged over the entire height in the vertical direction of the housing 20; and a protrusion 32 (a portion of the base wall 21 protruding backward) protruding backward from the rear surface of the base wall main body 31. The base wall main body 31 is formed in a rectangular plate shape when viewed from the rear, and has an outer edge connected to the peripheral wall 22. The base wall 21 is formed thickly in the front-rear direction within the height range having the protrusion 32.
[0026] like Figure 4 As shown, the left and right sides 33 of the inner side of the through hole 29 are formed only in the base wall main body 31, and intersect with the opening end surface 34 at the rear end. Figure 6 As shown, the inner upper surface 35 (surface facing downward) and the inner lower surface 36 (surface facing upward) of the through hole 29 are horizontally arranged so as to extend from the base wall main body 31 toward the protrusion 32 along the front-rear direction. The upper surface of the connecting body 74 of the terminal connecting part 71 is arranged so as to be parallel to and in contact with the inner upper surface 35 of the through hole 29. The lower surface of the connecting body 74 of the terminal connecting part 71 is arranged so as to be parallel to and in contact with the inner lower surface 36 of the through hole 29.
[0027] like Figure 3 As shown, the protrusion 32 has an upper portion 37 , a lower portion 38 , and a side portion 39 at the opening edge of the through hole 29 in the rear surface of the base wall body portion 31 . The upper portion 37 is formed in a block shape that is long in the left-right direction. Figure 6 As shown, the inner upper surface 35 is divided above the through hole 29. The inner upper surface 35 is equivalent to the lower surface of the upper portion 37. The upper surface of the upper portion 37 is the upper surface of the protrusion 32, and is horizontally arranged along the front-to-back direction. The rear surface of the upper portion 37 is arranged in a steep manner along the up-down direction. The upper portion 37 has an upper side introduction surface 41 that is inclined upward from the rear end of the inner upper surface 35 toward the rear surface of the upper portion 37.
[0028] The lower portion 38 is formed in a square shape that is long in the left-right direction. Figure 6 As shown, the inner lower surface 36 is divided below the through hole 29. The inner lower surface 36 is equivalent to the upper surface of the lower portion 38. The upper and lower thickness (dimension in the upper and lower directions) of the lower portion 38 is thinner than the upper and lower thickness of the upper portion 37. The front-to-back length (dimension in the front-to-back direction) of the lower portion 38 is shorter than the front-to-back length of the upper portion 37. In addition, the front-to-back length of the inner lower surface 36 is shorter than the front-to-back length of the inner upper surface 35. The volume (resin amount) of the lower portion 38 is smaller than the volume of the upper portion 37 as a whole.
[0029] The lower surface of the lower portion 38 is the lower surface of the protrusion 32, and is horizontally arranged along the front-rear direction at a position opposite to the upper surface of the upper portion 37. The rear surface of the lower portion 38 is located at a position further in front of the rear surface of the upper portion 37 (see Figure 3 and Figure 6 ) is arranged in a steep manner along the vertical direction. The lower portion 38 has a lower side introduction surface 42 that slopes downward from the rear end of the inner lower surface 36 of the through hole 29 toward the rear surface of the lower portion 38. Figure 6 As shown, the front-to-back length of the lower lead-in surface 42 is set to be the same as the front-to-back length of the upper lead-in surface 41. Since the rear end of the inner lower surface 36 is located forward of the rear end of the inner upper surface 35, the lower lead-in surface 42 is offset (displaced) forward of the upper lead-in surface 41 as a whole.
[0030] like Figure 3 As shown, the side portions 39 are formed into a block shape that is long in the vertical direction and are arranged in pairs on the left and right sides of the through hole 29. Each side portion 39 has an opposing surface 43 extending in the front-back direction and having a front end that crosses and connects to the left and right opening end surfaces 34 of the through hole 29 (see Figure 4 The rear surface of each side portion 39 is arranged in a manner that it stands steeply in the vertical direction. The rear surface of each side portion 39 is connected to the rear surface of the upper portion 37 at a position behind the rear surface of the lower portion 38 without any height difference ( Figure 3 The dotted line indicates the boundary between the side portion 39 and the upper portion 37). Each side portion 39 has a side lead-in surface 45 that expands to the left and right sides from the rear end of the opposing surface toward the rear surface of each side portion 39. The side lead-in surface 45 is formed with a front-to-rear length shorter than that of the upper lead-in surface 41 and the lower lead-in surface 42. Figure 1 - Figure 3 As shown, on the rear surface of the base wall 21 , a recess 44 is defined and formed between the upper lower portion 38 , the lower upper portion 37 , and the rear surface of the base wall main body 31 .
[0031] (Function of connector) During assembly, each terminal fitting 70 is inserted from the rear into each through hole 29 of the base wall 21. The terminal connection portion 71 of each terminal fitting 70 is introduced into the through hole 29 via the side introduction surface 45, the upper introduction surface 41, and the lower introduction surface 42.
[0032] Here, if Figure 6As shown, the front-to-back length of the upper surface of the connecting body part 74 in contact with the inner upper surface 35 is longer than the front-to-back length of the lower surface of the connecting body part 74 in contact with the inner lower surface 36. An upper portion 37 thick and large in the vertical direction is arranged above the rear end side of the connecting body part 74, and a lower portion 38 thinner and smaller in the vertical direction than the upper portion 37 is arranged below the rear end side of the connecting body part 74.
[0033] After the above-mentioned terminal parts 70 are assembled, the connector 10 is placed on the surface of the circuit substrate 90 and enters the reflow process. The solder connection part 73 of each terminal part 70 is soldered to the conductive part (not shown) of the circuit substrate 90 through the reflow process to be connected. When the connector 10 is heated in a reflow furnace (not shown), there is a concern that the housing 20 may thermally expand on the surface of the circuit substrate 90. If the housing 20 is assumed to thermally expand, there is a possibility that the solder connection part 73 of each terminal part 70 is lifted from the surface of the circuit substrate 90, resulting in poor installation.
[0034] However, in the case of the present embodiment 1, the above-mentioned large upper portion 37 is configured in a manner that covers the rear end side of the connecting body portion 74 of the terminal part 70 from above. Therefore, the thermal expansion of the upper portion 37 in the up-down direction is suppressed to be small, and the upper portion 37 is less likely to thermally expand. As a result, the inner upper surface 35 of the through hole 29 is suppressed from being displaced upward, and the connecting body portion 74 of the terminal part 70 can be maintained in a state where it is horizontally arranged along the inner upper surface 35. In addition, by maintaining the horizontal state of the connecting body portion 74, it is possible to prevent the solder connection portion 73 from being lifted from the surface of the circuit substrate 90. In addition, by preventing the solder connection portion 73 of each terminal part 70 from being lifted from the surface of the circuit substrate 90, the height position of each solder connection portion 73 can be aligned at a certain position, and the coplanarity can be stabilized.
[0035] As described above, according to the first embodiment, since displacement of the bulky upper portion 37 upward of the connection body portion 74 can be suppressed, the solder connection portion 73 can be prevented from lifting from the circuit board 90 .
[0036] In addition, since the front-to-back length of the inner upper surface 35 of the upper portion 37 is formed to be longer than the front-to-back length of the inner lower surface 36 of the lower portion 38, and the rear end of the inner upper surface 35 is located at a position further back than the rear end of the inner lower surface 36, the terminal connection portion 71 can be in contact along the inner upper surface 35 of the upper portion 37 for a long time, and the rear end side of the terminal connection portion 71 can be suppressed from being displaced upward inside the through hole 29. As a result, the substrate connection portion 72 can be prevented from being lifted from the circuit substrate 90.
[0037] In addition, since the upper portion 37 is formed thicker than the lower portion 38, the contact pressure of the upper portion 37 on the terminal connection portion 71 can be increased. As a result, even if the inner upper surface 35 of the upper portion 37 is not particularly long in the front-rear direction, the substrate connection portion 72 can be prevented from lifting from the circuit substrate 90.
[0038] Furthermore, according to the first embodiment, the upper portion 37 has an upper lead-in surface 41 that is inclined upward from the rear end of the inner upper surface 35 toward the rear, and the lower portion 38 has a lower lead-in surface 42 that is inclined downward from the rear end of the inner lower surface 36 toward the rear, and the front end of the lower lead-in surface 42 is located forward of the front end of the upper lead-in surface 41. Therefore, in addition to being able to properly exert the lead-in function of the terminal connection portion 71, it is also possible to efficiently form a shape in which the front-to-rear length of the inner lower surface 36 of the lower portion 38 is shorter than the front-to-rear length of the inner upper surface 35 of the upper portion 37 without waste.
[0039] [Other embodiments of the present disclosure] The embodiments disclosed this time should be considered in all respects as illustrative and non-restrictive. In the case of the above-mentioned embodiment 1, the front-to-back length of the inner upper surface of the upper portion is formed to be longer than the front-to-back length of the inner lower surface of the lower portion, and the upper and lower thicknesses of the upper portion are formed to be thicker than the upper and lower thicknesses of the lower portion. In contrast, according to other embodiments, although the front-to-back length of the inner upper surface of the upper portion is formed to be longer than the front-to-back length of the inner lower surface of the lower portion, the upper and lower thicknesses of the upper portion are formed to be the same as the upper and lower thicknesses of the lower portion or thinner than the upper and lower thicknesses of the lower portion. In addition, according to other embodiments, although the upper and lower thicknesses of the upper portion are formed to be thicker than the upper and lower thicknesses of the lower portion, the front-to-back length of the inner upper surface of the upper portion is formed to be the same as the front-to-back length of the inner lower surface of the lower portion or shorter than the front-to-back length of the inner lower surface of the lower portion. In the case of the first embodiment, the upper portions of the upper and lower layers are formed to have the same volume. In contrast, according to other embodiments, the volume of the upper portion of the upper layer may be formed to be larger than the volume of the upper portion of the lower layer and may be strictly set according to the thermal expansion coefficient of the housing. Description of Reference Numerals
[0040] 10…Connector 20…Housing 21…base wall 22…Surrounding wall 23…Side wall 24…Protect the wall 26…Locking part 27…Upper wall 28…Through hole 29…Through hole 31...Base wall main part 32 ... protrusion (a portion of the base wall protruding rearward) 33…left and right 34…Open end face 35…Inner upper surface 36…Inner lower surface 37…upper part 38…lower part 39…lateral part 41…Upper side lead-in surface 42…lower side lead-in surface 43…Opposite side 44…Concave 45…Side entry surface 50…Fixed components 60…Other shell 61…Chamber 62…Locking arm 70…Terminal parts 70A…Large and long terminal parts 70B…Large and short terminal parts 70C…Small and long terminal parts 70D…Small and short terminal parts 71…Terminal connection part 72…Substrate connection part 73…Solder connection 74…Connect the main body 75…connection 76…Step surface 77…Lock protrusion 80…Other terminal parts 90…Circuit board 100…Wire
Claims
1. A connector, wherein: The connector includes a housing disposed on a surface of a circuit board and terminal parts mounted on the housing. The housing has a base wall that stands upright on the surface of the circuit board and a cylindrical peripheral wall that protrudes forward from the outer edge of the base wall. The terminal part has: a terminal connection portion which passes through the through hole of the base wall and is connected to a counterpart terminal part on the inner side of the peripheral wall; and a substrate connection portion extending downward from a rear end portion of the terminal connection portion at a position rearward of the base wall, the lower end portion of which is soldered to the surface of the circuit substrate for connection, The through hole has an inner lower surface that is parallel to and opposite to the lower surface of the terminal connecting portion, and an inner upper surface that is parallel to and opposite to the upper surface of the terminal connecting portion. The base wall comprises: a lower portion which divides the inner lower surface and is formed below the through hole within the height range of the portion of the base wall protruding rearward; and an upper portion which divides the inner upper surface and is formed above the through hole within the height range of the portion of the base wall protruding rearward. The upper portion has a larger volume than the lower portion.
2. The connector according to claim 1, wherein: The inner upper surface of the upper portion is formed to be longer than the inner lower surface of the lower portion in the front-rear direction, and a rear end of the inner upper surface of the upper portion is located rearward of a rear end of the inner lower surface of the lower portion.
3. The connector according to claim 2, wherein: The upper portion is formed thicker than the lower portion in the up-down direction.
4. The connector according to claim 2, wherein: The upper portion has an upper introduction surface that is inclined upward from the rear end of the inner upper surface toward the rear, The lower portion has a lower introduction surface that slopes downward from the rear end of the inner lower surface toward the rear. The front end of the lower introduction surface is located forward of the front end of the upper introduction surface.
Citation Information
Patent Citations
Connector for substrate
JP2005116230A
Substrate layout structure of connector for substrate
JP2005190680A
Connector for substrate mounting
JP2011187213A
PCB connector
JP2019204744A