Heating body and preparation method thereof, atomizer and electronic atomization device

Abstract

The invention provides a heating body and a preparation method thereof, an atomizer and an electronic atomization device. The heating body comprises a porous base body, a heat dissipation layer and a heating layer. The heat dissipation layer is arranged on the porous substrate; the heat dissipation layer is of a porous structure; the heating layer is arranged on the surface of the heat dissipation layer away from the porous substrate. The heat dissipation layer is arranged to be of a porous structure, a liquid supply channel is provided for the heating layer, and sufficient liquid supply and continuous atomization of the heating layer are maintained; the heat dissipation layer is arranged between the porous substrate and the heating layer, so that the heat dissipation layer in contact with the porous substrate can quickly conduct heat to the area, not covered by the heat dissipation layer, of the porous substrate, and the aerosol generating substrate stored in the area, not covered by the heat dissipation layer, of the porous substrate can be quickly atomized; on the basis of achieving the same atomization amount, the atomization temperature of the heating body can be reduced, and the use experience feeling of a user is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization, and in particular to a heating element and a preparation method thereof, an atomizer, and an electronic atomization device. Background Art

[0002] The electronic atomization device is composed of a heating element, a battery, a control circuit and other parts. The heating element is the core component of the electronic atomization device, and its characteristics determine the atomization effect and user experience of the electronic atomization device.

[0003] The existing heating elements will have obvious scaling and fouling after being used a certain number of times, which affects the user experience. Summary of the invention

[0004] The present application provides a heating element and a preparation method thereof, an atomizer, and an electronic atomization device, which improve the scaling and fouling of the heating element and enhance the user experience.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a heating element, comprising: a porous substrate, a heat dissipation layer and a heat-generating layer. The heat dissipation layer is arranged on the porous substrate; the heat dissipation layer is a porous structure; and the heat-generating layer is arranged on the surface of the heat dissipation layer away from the porous substrate.

[0006] In one embodiment, the thickness of the heat dissipation layer is smaller than the thickness of the heating layer; and / or the porosity of the heat dissipation layer is greater than the porosity of the heating layer; and / or the heat dissipation layer and the heating layer are both in strip structures, and the line width of the heat dissipation layer is greater than the line width of the heating layer.

[0007] In one embodiment, the porosity of the heat dissipation layer is 30%-70%; and / or, the line width of the heat dissipation layer is 0.5mm-0.8mm; and / or, the resistance of the heat dissipation layer is 8Ω-20Ω; and / or, the thickness of the heating layer is 40μm-100μm; and / or, the porosity of the heating layer is 0-10%; and / or, the line width of the heating layer is 0.25mm-0.45mm; and / or, the resistance of the heating layer is 0.85Ω-1.60Ω.

[0008] In one embodiment, the orthographic projection of the heat dissipation layer on the heat generation layer completely covers the heat generation layer.

[0009] In one embodiment, the orthographic projection of the center line of the heat dissipation layer along the extension direction on the heat generation layer coincides with the center line of the heat generation layer along the extension direction.

[0010] In one embodiment, the porous matrix includes an atomized surface; the heat dissipation layer includes a main body and an infiltration portion, the main body is arranged on the atomized surface of the porous matrix, and the infiltration portion is arranged in the pores of the porous matrix.

[0011] In one embodiment, the thickness of the infiltration portion is 80 μm-150 μm; and / or the thickness of the main body portion is 5 μm-20 μm.

[0012] In one embodiment, the material of the heating layer includes at least one of a nickel-based alloy, an iron-based alloy, and a ruthenium-based alloy; and / or the material of the heat dissipation layer includes at least one of a nickel-based alloy, an iron-based alloy, and a ruthenium-based alloy.

[0013] In order to solve the above technical problems, the second technical solution provided in the present application is: to provide a nebulizer, comprising a liquid storage chamber and a heating element as described in any of the above items, wherein the liquid storage chamber is used to store an aerosol generating matrix, and the heating element is used to heat and atomize the aerosol generating matrix in the liquid storage chamber.

[0014] In order to solve the above technical problems, the third technical solution provided in the present application is: to provide an electronic atomization device, comprising a host and the atomizer described above, wherein the host is used to power the atomizer.

[0015] In order to solve the above technical problems, the fourth technical solution provided in the present application is: to provide a method for preparing a heating element, comprising: providing a porous substrate, wherein the porous substrate includes an atomized surface; coating a first slurry on the atomized surface of the porous substrate to form a heat dissipation layer; and coating a second slurry on the surface of the heat dissipation layer to form a heating layer.

[0016] In one embodiment, the viscosity of the first slurry is lower than the viscosity of the second slurry.

[0017] In one embodiment, the viscosity of the first slurry is 50,000 cp-150,000 cp; and / or the viscosity of the second slurry is 400,000 cp-800,000 cp.

[0018] Beneficial effects of the present application: Different from the prior art, the present application provides a heating element and a preparation method thereof, an atomizer, and an electronic atomization device. The heating element includes a porous substrate, a heat dissipation layer, and a heating layer. The heat dissipation layer is arranged on the porous substrate; the heat dissipation layer is a porous structure; the heating layer is arranged on the surface of the heat dissipation layer away from the porous substrate. By setting the heat dissipation layer as a porous structure, a liquid supply channel is provided to the heating layer to maintain sufficient liquid supply to the heating layer and continuous atomization; by setting a heat dissipation layer between the porous substrate and the heating layer, the heat dissipation layer in contact with the porous substrate can quickly transfer heat to the area of ​​the porous substrate not covered by the heat dissipation layer, and the aerosol generating matrix stored in the area of ​​the porous substrate not covered by the heat dissipation layer can be quickly atomized. On the basis of achieving the same atomization amount, the temperature field distribution of the atomization surface of the heating element can be improved, and the liquid supply can be more sufficient and efficient, and the scaling and fouling phenomenon can be improved, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a simplified structural diagram of the electronic atomization device provided in an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of the structure of the heating element provided in the embodiment of the present application;

[0021] Figure 3 yes Figure 2 The schematic diagram of the exploded structure of the heating element shown;

[0022] Figure 4 It is a partially enlarged schematic diagram of the heat dissipation layer and the porous matrix provided in the embodiment of the present application;

[0023] Figure 5 is a flow chart of a method for preparing a heating element provided in an embodiment of the present application;

[0024] Figure 6 It is the product schematic diagram of the first experimental piece;

[0025] Figure 7 It is the product schematic diagram of the second experimental piece;

[0026] Figure 8 This is the product schematic diagram of the third experimental piece;

[0027] Fig. 9 This is a comparison diagram of scaling of the first, second and third experimental pieces after 500 puffs respectively;

[0028] Fig.10 is a temperature field comparison diagram of the first experimental piece, the second experimental piece and the third experimental piece;

[0029] Fig.11 is the maximum temperature curve diagram of the first experimental piece, the second experimental piece and the third experimental piece;

[0030] Fig.12 is a penetration comparison diagram of the first experimental piece and the second experimental piece;

[0031] Fig.13 is a comparison diagram of suction scaling of the first experimental piece, the second experimental piece, and the third experimental piece;

[0032] Fig.14 is a comparison chart of the flatness of the first experimental piece, the second experimental piece, and the third experimental piece;

[0033] Fig.15 This is the product flow chart for preparing the second experimental piece.

[0034] Description of Figure Numbers:

[0035] 1-atomizer; 2-host; 10-heating element; 11-porous matrix; 111-atomizing surface; 112-liquid absorption surface; 12-heat dissipation layer; 121-main body; 122-penetration part; 13-heating layer. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0038] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0039] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0040] See also Figure 1 , Figure 1 It is a simplified structural diagram of the electronic atomization device provided in an embodiment of the present application.

[0041] In this embodiment, an electronic atomization device is provided. The electronic atomization device can be used for atomization of an aerosol-generating substrate. The electronic atomization device includes an atomizer 1 and a host 2 electrically connected to each other.

[0042] The atomizer 1 includes a liquid storage chamber and a heating element 10, wherein the liquid storage chamber is used to store an aerosol generating matrix, and the heating element 10 is used to heat the aerosol generating matrix in the atomized liquid storage chamber to form an aerosol that can be inhaled by the user. The atomizer 1 can be used in different fields, such as medical treatment, beauty, leisure inhalation, etc. In a specific embodiment, the atomizer 1 can be used in an electronic aerosolization device to atomize the aerosol generating matrix and generate an aerosol for inhalation by the smoker. The following embodiments all take this leisure inhalation as an example.

[0043] The structure and function of the atomizer 1 other than the heating element 10 can be found in the prior art and will not be described in detail here.

[0044] The host 2 includes a power supply (not shown) and a controller (not shown). The power supply is used to provide electrical energy for the operation of the atomizer 1, so that the atomizer 1 can atomize the aerosol-generating matrix to form an aerosol; the controller is used to control the operation of the atomizer 1. The host 2 also includes other components such as a battery holder and an airflow sensor.

[0045] The atomizer 1 and the host 2 can be integrally arranged or detachably connected, and can be designed according to specific needs.

[0046] See also Figure 2 and Figure 3 , Figure 2 is a schematic diagram of the structure of the heating element provided in the embodiment of the present application; Figure 3 yes Figure 2 Schematic diagram of the exploded structure of the heating element shown.

[0047] The heat generating element 10 includes a porous base 11 , a heat dissipation layer 12 , and a heat generating layer 13 .

[0048] The porous matrix 11 has an atomizing surface 111 and a liquid absorption surface 112 which are arranged opposite to each other. The porous matrix 11 is a porous structure, and the porous structure has a capillary force. The surface of the porous matrix 11 close to the liquid storage cavity is the liquid absorption surface 112, and the aerosol-generating matrix on the liquid absorption surface 112 is guided to the atomizing surface 111 by the capillary force of the porous matrix 11. In this embodiment, the porous matrix 11 is a porous ceramic, and the porous ceramic has interconnected disordered pores formed during the preparation process, and has a capillary force. In other embodiments, the porous matrix 11 is other porous structures, for example, a plurality of through holes are provided on a dense matrix to form a porous structure, and the dense matrix can be a dense ceramic, glass, etc.

[0049] The heat dissipation layer 12 is disposed on the porous substrate 11, and the heat dissipation layer 12 is a porous structure. The heat dissipation layer 12 is in contact with the porous substrate 11. In one embodiment, the heat dissipation layer 12 is formed by coating the first slurry on the surface of the atomized surface 111, and the formed heat dissipation layer 12 is a porous structure. This method of forming the heat dissipation layer 12 with a porous structure is simple and easy, and will not damage the structure of the porous substrate 11.

[0050] The heating layer 13 is arranged on the surface of the heat dissipation layer 12 away from the porous substrate 11. By setting the heat dissipation layer 12 as a porous structure, a liquid supply channel is provided to the heat dissipation layer 13 arranged on the surface of the heat dissipation layer 12, so as to maintain sufficient liquid supply to the heat dissipation layer 13 and continuous atomization. The heat dissipation layer 12 is arranged between the porous substrate 11 and the heat dissipation layer 13, and the heat dissipation layer 12 can fill the defects on the surface of the porous substrate 11. The heat dissipation layer 12 provides a flatter surface than the porous substrate 11, and the heat dissipation layer 13 is formed on the flatter surface, which reduces the influence of the defects on the surface of the porous substrate 11 on the resistance value of the heat dissipation layer 13, and improves the consistency of the resistance value of the heat dissipation layer 13.

[0051] In this embodiment, the heat dissipation layer 12 has good thermal conductivity, and the heat transfer rate of the heat dissipation layer 12 is greater than the heat transfer rate of the porous matrix 11, so that the heat dissipation layer 12 in contact with the porous matrix 11 can quickly transfer heat to the area of ​​the porous matrix 11 not covered by the heat dissipation layer 12, and the aerosol generating matrix stored in the area of ​​the porous matrix 11 not covered by the heat dissipation layer 12 can be quickly atomized. On the basis of achieving the same atomization amount, the atomization temperature of the heating element 10 can be reduced, meeting the national standard requirements and improving the user experience. The inventors analyzed that the above effects are achieved mainly through the following improvements: First, the heat dissipation layer 12 adopts a material with higher thermal conductivity, and is partially filled in the pores or defects of the porous matrix 11 corresponding to the atomized surface area, thereby improving the thermal conductivity of this part, that is, the thermal conductivity of this area is further improved; Second, the setting of the heat dissipation layer 12 increases the bonding depth between the heating layer 13 and the porous matrix 11, so that heat can be quickly conducted over a larger range, while reducing thermal resistance; Third, the heat dissipation layer 12 has a larger porosity, and the aerosol generating matrix also has better fluidity in this area, which can avoid high-temperature dry burning due to lack of liquid.

[0052] During the atomization process, the heat dissipation layer 12 mainly plays a role of rapid heat conduction, and the heating layer 13 mainly plays a role of a matrix for generating atomized aerosol.

[0053] See also Figure 4 , Figure 4 It is a partially enlarged schematic diagram of the heat dissipation layer and the porous matrix provided in the embodiment of the present application.

[0054] The heat dissipation layer 12 includes a main body 121 and an infiltration part 122, wherein the main body 121 is disposed on the atomized surface 111 of the porous substrate 11, and the infiltration part 122 is disposed in the pores of the porous substrate 11. In one embodiment, in the process of coating the first slurry on the surface of the porous substrate 11 to form the heat dissipation layer 12, part of the first slurry is formed on the atomized surface 111 of the porous substrate 11 to form the main body 121, and part of the first slurry infiltrates into the pores of the porous substrate 11 to form the infiltration part 122. At this time, the thickness of the infiltration part 122 is related to the viscosity of the first slurry (the viscosity of the first slurry affects the fluidity of the first slurry, thereby affecting the depth of the first slurry infiltrating into the pores, and affecting the thickness of the infiltration part 122 formed by the first slurry in the pores). The infiltration portion 122 of the heat dissipation layer 12 is arranged in the pores of the porous matrix 11 , which improves the bonding force between the heat dissipation layer 12 and the porous matrix 11 , greatly reduces the risk of detachment and warping of the heat dissipation layer 12 , and improves the service life of the heating element 10 .

[0055] The thickness D of the penetration portion 122 is 80 μm-150 μm, so that the heat dissipation layer 12 has a strong bonding force with the porous matrix 11. The thickness D of the penetration portion 122 can be 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, etc., or a range consisting of any two of these values. The thickness D of the penetration portion 122 refers to the distance from the connection point between the penetration portion 122 and the main body 121 to the end point of the penetration portion 122 farthest from the main body 121.

[0056] It should be noted that Figure 4 Only part of the pore structure of the porous substrate 11 is shown. The thickness of the infiltration portion 122 in different pores of the porous substrate 11 may be the same or different. For example, the porous substrate 11 is a porous ceramic, which has a plurality of disordered pores formed during the preparation process. The disordered pores are irregular. When the first slurry is applied, the first slurry penetrates into different disordered pores to different depths, so that the thicknesses of different infiltration portions 122 are sometimes the same and sometimes different.

[0057] In one embodiment, the thickness of the heat dissipation layer 12 disposed on the surface of the porous substrate 11 (i.e., the thickness of the main body 121 of the heat dissipation layer 12) is less than the thickness of the heating layer 13. Since the thickness of the heat dissipation layer 12 disposed on the surface of the porous substrate 11 is thinner than the thickness of the heating layer 13, the heat generated by the heat dissipation layer 12 and the heat transferred to the heat dissipation layer 12 by the heating layer 13 are more easily transmitted to the outside, thereby achieving the main function of the heat dissipation layer 12 to conduct heat quickly.

[0058] Optionally, the thickness of the main body 121 of the heat dissipation layer 12 is 5 μm-20 μm; the thickness of the main body 121 of the heat dissipation layer 12 can be 5 μm, 10 μm, 15 μm, 20 μm, etc., or can be a range consisting of any two of these values. If the thickness of the main body 121 of the heat dissipation layer 12 is less than 5 μm, the effect of covering the surface defects of the porous substrate 11 is not very good, and a relatively flat surface cannot be provided for the heating layer 13; if the thickness of the main body 121 of the heat dissipation layer 12 is greater than 20 μm, the heat dissipation and thermal conductivity effect is poor.

[0059] Optionally, the thickness of the heating layer 13 is 40 μm-80 μm; the thickness of the heating layer 13 can be 40 μm, 60 μm, 80 μm, 100 μm, etc., or a range consisting of any two of these values. Setting the thickness of the heating layer 13 to 40 μm-80 μm allows the heating layer 13 to have a higher atomization efficiency at a lower energy consumption.

[0060] In one embodiment, the porosity of the heat dissipation layer 12 is greater than the porosity of the heating layer 13. Since the porosity of the heat dissipation layer 12 is greater than the porosity of the heating layer 13, the heat generated by the heat dissipation layer 12 and the heat transferred to the heat dissipation layer 12 by the heating layer 13 are more easily transmitted outward, thereby realizing that the heat dissipation layer 12 mainly plays a role of rapid heat conduction. In addition, the porosity of the heating layer 13 is less than the porosity of the heat dissipation layer 12. During the atomization process, there is less liquid stored in the heating layer 13. Under the same heating power, the stored liquid can be quickly heated and atomized to avoid forming a thick liquid film on its surface, thereby avoiding the phenomenon of liquid explosion caused by the rupture of the thick liquid film during the atomization process.

[0061] Optionally, the porosity of the heat dissipation layer 12 is 30%-70%; the porosity of the heat dissipation layer 12 can be 30%, 50%, 70%, etc., or can be a range consisting of any two of these values. The porosity of the heat dissipation layer 12 is set to 30%-70%, and the liquid supply of the heat dissipation layer 12 matches the atomization capacity of the heating layer 13 to maintain sufficient liquid supply to the heating layer 13. If the porosity of the heat dissipation layer 12 is less than 30%, the problem of small liquid supply of the heat dissipation layer 12 is prone to occur, resulting in low atomization efficiency of the heating layer 13, or even dry burning; if the porosity of the heat dissipation layer 12 is greater than 70%, the liquid supply of the heat dissipation layer 12 is prone to be large, and the heating layer 13 cannot be atomized in time, which leads to leakage.

[0062] Optionally, the porosity of the heating layer 13 is 0-10%; the porosity of the heating layer 13 can be 0, 3%, 6%, 9%, 10%, etc., or can be a range consisting of any two of these values. When the porosity of the heating layer 13 is 0, the heating layer 13 has a dense structure. When the porosity of the heating layer 13 is greater than 0, the heating layer 13 has a porous structure. When the heating layer 13 has a porous structure, the wettability of the aerosol generating matrix to the heating layer 13 as a whole can be improved, which is beneficial to the rapid atomization of the aerosol generating matrix and improves the atomization efficiency of the heating body 10. The porosity of the heating layer 13 is greater than 10%, and the consistency of its resistance value is difficult to control, and the consistency of the heating body is poor.

[0063] In one embodiment, the heat dissipation layer 12 and the heating layer 13 are both in strip-shaped structures, and the line width of the heat dissipation layer 12 is greater than the line width of the heating layer 13. Since the line width of the heat dissipation layer 12 is wider than the line width of the heating layer 13, the heat dissipation layer 12 has a larger contact area with the porous substrate 11, and the heat generated by the heat dissipation layer 12 and the heat transferred to the heat dissipation layer 12 by the heating layer 13 are more easily transmitted to the outside, thereby realizing that the heat dissipation layer 12 mainly plays a role of rapid heat conduction.

[0064] Optionally, the line width of the heat dissipation layer 12 is 0.5mm-0.8mm; the line width of the heat dissipation layer 12 can be 0.5mm, 0.6mm, 0.7mm, 0.8mm, etc., or it can be a range consisting of any two of these values. By setting the line width of the heat dissipation layer 12 to 0.5mm-0.8mm, a better thermal conductivity effect is achieved. The heat dissipation layer 12 takes into account both the thermal field distribution and the liquid supply capacity, minimizes the scaling on the surface of the heating layer 13, thereby reducing the interference of scaling on the heating function of the heating layer 13 and improving the consistency of the atomization amount. The heat dissipation layer 12 has a good thermal conductivity, so that the areas around the heat dissipation layer 12 and the heating layer 13 also have a faster aerosol generation substrate consumption rate, reducing the aerosol generation substrate around the heating layer 13 to flow toward the heating layer 13, thereby reducing the scaling generated by the flowing aerosol generation substrate carrying the heating layer 13 and depositing on the heating layer 13, thereby reducing the scaling of the heating layer 13.

[0065] Optionally, the line width of the heating layer 13 is 0.25mm-0.45mm; the line width of the heating layer 13 can be 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, etc., or a range consisting of any two of these values. By setting the line width of the heating layer 13 to 0.25mm-0.45mm, a larger heating area is provided, and a better atomization effect is achieved.

[0066] In one embodiment, the resistance of the heat dissipation layer 12 is 8Ω-20Ω; the resistance of the heat dissipation layer 12 may be 8Ω, 10Ω, 12Ω, 14Ω, 16Ω, 18Ω, 20Ω, etc., or may be a range consisting of any two of these values. It should be noted that the resistance of the heat dissipation layer 12 may be 8Ω-20Ω by using the parameters described above for the thickness and / or porosity and / or line width of the heat dissipation layer 12.

[0067] In one embodiment, the resistance of the heating layer 13 is 0.85Ω-1.60Ω; the resistance of the heating layer 13 can be 0.85Ω, 1.05Ω, 1.25Ω, 1.45Ω, 1.60Ω, etc., or a range consisting of any two of these values. It should be noted that the resistance of the heating layer 13 can be 0.85Ω-1.60Ω by using the parameters described above for the thickness and / or porosity and / or line width of the heating layer 13.

[0068] By designing the resistance of the heat dissipation layer 12 and the heating layer 13, that is, the resistance of the heat dissipation layer 12 is much greater than the resistance of the heating layer 13, the heat dissipation layer 12 is mainly used for rapid heat conduction, and the heating layer 13 is mainly used for heat generation. The heat of the heating layer 13 is transferred to the heat dissipation layer 12, and the rapid heat dissipation effect of the heat dissipation layer 12 is utilized to make the temperature field stable and consistent, and below 300°C, which fully meets the national standard.

[0069] In one embodiment, the material of the heating layer 13 includes at least one of a nickel-based alloy, an iron-based alloy, and a ruthenium-based alloy, and / or the material of the heat dissipation layer 12 includes at least one of a nickel-based alloy, an iron-based alloy, and a ruthenium-based alloy. It is understood that the materials of the heat dissipation layer 12 and the heating layer 13 can be the same or different. Optionally, a small amount of ceramic powder is doped in the material of the heat dissipation layer 12 to improve the bonding force between the heat dissipation layer 12 and the porous substrate 11 (in this case, the porous substrate 11 is a porous ceramic) and to improve the heat transfer effect of the heat dissipation layer 12 to the porous substrate 11.

[0070] In one embodiment, the orthographic projection of the heat dissipation layer 12 on the heating layer 13 completely covers the heating layer 13. The heat dissipation layer 12 can quickly conduct the heat generated by the heating layer 13, and the temperature field is stable and the temperature is low by utilizing the rapid heat dissipation effect of the heat dissipation layer 12.

[0071] Optional, such as Figure 2 As shown, the orthographic projection of the center line of the heat dissipation layer 12 along the extension direction on the heating layer 13 coincides with the center line of the heating layer 13 along the extension direction, the liquid supply amount of the heat dissipation layer 12 to various parts of the heating layer 13 is basically the same, and the heating layer 13 has a higher atomization efficiency.

[0072] Optionally, the heating layer 13 is offset on the heat dissipation layer 12; in other words, the orthographic projection of the center line of the heat dissipation layer 12 along the extension direction on the heating layer 13 is offset from the center line of the heat dissipation layer 12 along the extension direction, and the orthographic projection of the heat dissipation layer 12 on the heating layer 13 completely covers the heat dissipation layer 13.

[0073] The center line of the heat dissipation layer 12 is a line extending from the middle point of one end of the heat dissipation layer 12 to the middle point of the other end of the heat dissipation layer 12 along the extension direction. Any point on the center line of the heat dissipation layer 12 is at the same vertical distance from the edges of the heat dissipation layer 12 on both sides. The center line of the heating layer 13 is similarly defined to the center line of the heat dissipation layer 12.

[0074] In one embodiment, the shape of the heating layer 13 is the same as that of the heat dissipation layer 12 , and both the heating layer 13 and the heat dissipation layer 12 extend in a curve, increasing the contact area between the heat dissipation layer 12 and the porous matrix 11 within the effective atomization surface 111 area.

[0075] Optionally, the heat dissipation layer 12 extends in an "S"-shaped curve. Specifically, the heat dissipation layer 12 includes a first straight line segment, a second straight line segment, a third straight line segment and a first curved line segment and a second curved line segment. The first straight line segment, the second straight line segment and the third straight line segment are parallel to each other, and the second straight line segment is located between the first straight line segment and the third straight line segment. The first curved line segment connects the first straight line segment and the second straight line segment, and the first curved line segment and the second straight line segment are connected end to end in sequence. The second curved line segment connects the second straight line segment and the third straight line segment, and the second straight line segment, the second curved line segment and the third straight line segment are connected end to end in sequence. The heat dissipation layer 13 also extends in an "S"-shaped curve, and the specific arrangement is similar to the structure of the heat dissipation layer 12.

[0076] In one embodiment, the line length of the heat dissipation layer 12 is the same as the line length of the heat generating layer 13 .

[0077] It should be noted that by sequentially arranging the heat dissipation layer 12 and the heating layer 13 on the surface of the porous matrix 11, the possibility of the adaptability of the heating element 10 to different aerosol generating matrices (hereinafter referred to as: matrix) is expanded. Through research, it is found that in the process of atomizing aerosol generating matrices such as matrix 1 (for example, Crane Dances in the Blue Sky) and matrix 2 (for example, aloe grapes) using the heating element 10 provided in the embodiment of the present application, the greater the heating power, the better the heat conduction and heat dissipation effect, which is manifested in that under the test conditions of 8W to 12W, the highest temperature field is basically stable at about 280°C; compared with the existing highest temperature field at 300°C-350°C, the atomization temperature of the heating element 10 is reduced, which can meet the national standard requirements, and has a better atomization effect at a lower temperature, and the heating element 10 has a longer life and a richer taste.

[0078] The heating element 10 provided in this embodiment has a longer lifespan, and the performance of the heat dissipation layer 12 and the heating layer 13 is improved. The heat dissipation layer 12 and the heating layer 13 with different resistance values ​​are used to make the temperature field stable and below 300°C, reducing the risk of high temperature and meeting national standards; the double-layer design increases the product design space, can adjust different tastes, and increases the application space of the heating element 10. The embodiment of the present application is simple to implement and has a high degree of effect: it significantly improves product performance and can quickly realize product application.

[0079] See also Figure 5 , Figure 5 It is a flow chart of the method for preparing a heating element provided in an embodiment of the present application.

[0080] The embodiment of the present application further provides a method for preparing a heating element, and the method for preparing a heating element can be used to prepare the heating element 10 provided in the above embodiment.

[0081] A method for preparing a heating element, comprising:

[0082] Step S01: providing a porous substrate, wherein the porous substrate comprises an atomized surface.

[0083] Specifically, the porous matrix 11 has an atomization surface 111 and a liquid absorption surface 112 that are relatively arranged. The porous matrix 11 is a porous structure, and the porous structure has a capillary force. The surface of the porous matrix 11 close to the liquid storage cavity is the liquid absorption surface 112, and the aerosol-generating matrix on the liquid absorption surface 112 is guided to the atomization surface 111 by the capillary force of the porous matrix 11. In this embodiment, the porous matrix 11 is a porous ceramic, and the interconnected disordered pores formed in the preparation process of the porous ceramic have a capillary force. In other embodiments, the porous matrix 11 is other porous structures, for example, a plurality of through holes are provided on a dense matrix to form a porous structure, and the dense matrix can be a dense ceramic, glass, etc.

[0084] Step S02: coating a first slurry on the atomized surface of the porous substrate to form a heat dissipation layer.

[0085] In one embodiment, the viscosity of the first slurry is 50000cp-150000cp; the viscosity of the first slurry can be 50000cp, 100000cp, 150000cp, etc., or a range consisting of any two of these values. The first slurry includes at least one of a nickel-based alloy slurry, an iron-based alloy slurry, and a ruthenium-based alloy slurry; optionally, a small amount of ceramic powder is doped in the first slurry.

[0086] By setting the viscosity of the first slurry to 50000cp-150000cp, it has low viscosity and high fluidity, so that part of the first slurry can penetrate into the pores of the porous matrix 11. The heat dissipation layer 12 is formed by coating the first slurry. During the formation process, part of the first slurry penetrates into the pores of the porous matrix 11, and the part that penetrates into the porous matrix 11 forms the penetration part 122, and the part that does not penetrate into the porous matrix 11 and is formed on the surface of the porous matrix 11 is the main body 121, so that the heat dissipation layer 12 has a strong bonding force with the porous matrix 11, which greatly reduces the risk of the heat dissipation layer 12 detaching and warping, and improves the service life of the heating element 10. In one embodiment, the thickness D of the penetration portion 122 is 80 μm-150 μm, so that the heat dissipation layer 12 has a strong bonding force with the porous matrix 11. The height D of the penetration portion 122 can be 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, etc., or it can be a range consisting of any two of these values.

[0087] In one embodiment, the depth of penetration of the first slurry into the pores of the porous matrix 11 can be increased by extending the leveling time of the first slurry or increasing the pressing process, that is, increasing the thickness D of the penetration portion 122 , so that the heat dissipation layer 12 and the porous matrix 11 have a stronger bonding force.

[0088] Step S03: coating the second slurry on the surface of the heat dissipation layer to form a heat generation layer.

[0089] In one embodiment, the viscosity of the second slurry is greater than that of the first slurry. In other words, the viscosity of the first slurry is less than that of the second slurry, so that the first slurry has better fluidity. The heat dissipation layer 12 formed by the first slurry can fill the defects on the surface of the porous substrate 11. The formed heat dissipation layer 12 has a higher surface flatness, providing a smoother surface for the heating layer 13. The heating layer 13 is formed on a surface with higher flatness, thereby improving the product resistance yield of the heating layer 13 and improving the consistency of the resistance of the heating layer 13.

[0090] In one embodiment, the viscosity of the second slurry is 400000cp-800000cp. The second slurry includes at least one of a nickel-based alloy slurry, an iron-based alloy slurry, and a ruthenium-based alloy slurry.

[0091] The heating element 10 prepared by the preparation method of the heating element 10 provided in the above embodiment has a simple preparation method, improves the bonding strength between the heat dissipation layer 12 and the porous matrix 11, improves the product resistance yield and resistance consistency of the heating layer 13, and expands the possibility of the adaptability of the heating element 10 to different aerosol generating matrices.

[0092] The present application also conducts an experimental comparison between the heating element in the prior art and the heating element 10 provided in the embodiment of the present application. The heating element in the prior art includes only a heating layer without a heat dissipation layer, and the heating layer has a line width of 0.4 mm and a line length of 8.6 cm, which is recorded as the first experimental piece (such as Figure 6 As shown, Figure 6 ) is a product schematic diagram of the first experimental piece. The structure of the heating element 10 introduced in the above embodiment is used for the experiment. The line width of the heat dissipation layer 12 is 0.7 mm, the line width of the heating layer 13 is 0.4 mm, and the line length of the heating layer 13 is 8.6 cm. The line length of the heat dissipation layer 12 is the same as that of the heating layer 13. This is recorded as the second experimental piece (such as Figure 7 As shown, Figure 7 ) is a product schematic diagram of the second experimental piece. The structure of the heating element 10 introduced in the above embodiment is used for the experiment. The line width of the heat dissipation layer 12 is 0.7 mm, the line width of the heating layer 13 is 0.4 mm, and the line length of the heating layer 13 is 7.8 cm. The line length of the heat dissipation layer 12 is the same as that of the heating layer 13. This is recorded as the third experimental piece (such as Figure 8 As shown, Figure 8 ) The performance of the porous substrate 11 and the heat generating layer 13 of the second and third experimental pieces is substantially consistent with that of the substrate and the heat generating layer of the first experimental piece.

[0093] Experiment 1: Performance comparison.

[0094] Test conditions: draw for 3 seconds and rest for 8 seconds per puff, and test the equipment according to laboratory standards.

[0095] 1. Dry burning life under 6.5W: The first experimental piece can be puffed for 10-15 puffs, the second experimental piece can be puffed for 25-30 puffs, and the third experimental piece can be puffed for 25-35 puffs.

[0096] 2. The life of the bare chip wet burning is that the first experimental piece can draw 400-600 puffs, the second experimental piece can draw more than 1500 puffs, and the third experimental piece can draw more than 1500 puffs.

[0097] 3. Installed performance (7.5W, matrix 1); that is, the heating element is assembled into an atomizer for testing.

[0098] (1) Lifespan: The first experimental piece can draw 400-600 puffs, the second experimental piece can draw more than 1000 puffs, and the third experimental piece can draw more than 1000 puffs.

[0099] (2) Atomization amount: The atomization amount of the first experimental piece was 7.0 mg, the atomization amount of the second experimental piece was 7.5 mg, and the atomization amount of the third experimental piece was 7.8 mg.

[0100] (3) Scaling after 500 suctions. The scaling after 500 suctions of the first test piece is as follows: Fig. 9 As shown, Fig. 9 The following is a comparison of the scaling of the first, second and third experimental pieces after 500 puffs. Fig. 9 (a) is the first experimental piece, (b) is the second experimental piece, and (c) is the third experimental piece.

[0101] Through the above experiments, it can be seen that the dry burning life, bare chip wet burning life and smoke loading performance of the second and third experimental pieces are significantly better than those of the first experimental piece. By comparing the second and third experimental pieces, it can be seen that the atomization amount can be further increased by shortening the line length.

[0102] Experiment 2: Comparison of temperature field performance.

[0103] See also Fig.10 , Fig.10 This is a temperature field comparison diagram of the first, second and third experimental pieces. It should be noted that: Fig.10 (a1) is the temperature field of the first experimental piece under infrared, (a2) is the temperature distribution diagram of the first experimental piece, and different colors represent different temperatures. (b1) is the temperature field of the second experimental piece under infrared, (b2) is the temperature distribution diagram of the second experimental piece, (c1) is the temperature field of the third experimental piece under infrared, and (c2) is the temperature distribution diagram of the third experimental piece.

[0104] See also Fig.11, Fig.11 is the highest temperature curve of the first, second and third experimental pieces. It should be noted that Fig.11 (a) is the first experimental piece, (b) is the second experimental piece, and (c) is the third experimental piece.

[0105] Through the above experiments, we can know that the high temperature area of ​​the first experimental piece is concentrated on the heating layer; the temperature field of the second and third experimental pieces is concentrated in the quadrilateral area formed by the edge of the heating layer, and the highest temperature area is concentrated in the blank area defined by the S-shaped film, with a larger and more uniform high temperature area; avoiding high temperature concentration in the heating layer and reducing fouling on the heating layer. In this way, the second and third experimental pieces perform better, and the temperature field stability and consistency of the second and third experimental pieces are both high; and they are stably controlled below 300°C, which meets the national standard temperature; taste consistency; and improved life.

[0106] Experiment 3: Comparison of binding strength.

[0107] 1. Penetration depth performance.

[0108] The penetration depth surface test was performed on the first experimental piece and the second experimental piece respectively, and multiple parts of the first experimental piece and the second experimental piece were compared. The test results are as follows: Fig.12 As shown, Fig.12 is a comparison chart of the penetration of the first experimental piece and the second experimental piece. It should be noted that Fig.12 Among them, (a1) is the penetration depth expression diagram of part A of the first experimental piece, (a2) is the penetration depth expression diagram of part B of the first experimental piece, (a3) ​​is the penetration depth expression diagram of part C of the first experimental piece, (b1) is the penetration depth expression diagram of part D of the second experimental piece, (b2) is the penetration depth expression diagram of part E of the second experimental piece, and (b3) is the penetration depth expression diagram of part F of the second experimental piece. Part A of the first experimental piece corresponds to part D of the second experimental piece, part B of the first experimental piece corresponds to part E of the second experimental piece, and part C of the first experimental piece corresponds to part F of the second experimental piece.

[0109] The penetration depth of the first experimental piece was 50 μm to 80 μm, and the penetration depth of the second experimental piece was 100 μm to 140 μm.

[0110] 2. Bonding force test: The force value of the first test piece is 75MPa±25MPa, the force value of the second test piece is 135MPa±15MPa, and the force value of the third test piece is 125MPa±15MPa.

[0111] Through the comparison of bonding strength, it is found that setting the heat dissipation layer 12 between the porous matrix 11 and the heating layer 13 can greatly improve the bonding strength between the heating layer 13 and the porous matrix 11, and greatly reduce the risk of detachment and warping of the heating layer 13, thereby increasing the life of the heating element 10.

[0112] Experiment 4: Scaling test. The test conditions refer to the "Installation Performance" section in Experiment 1.

[0113] See also Fig.13 , Fig.13 This is a comparison chart of suction scaling of the first, second and third experimental pieces. It should be noted that: Fig.13 Among them, (a1) is the product picture of the first experimental piece before puffing, (a2) is the product picture of the first experimental piece after puffing matrix two, (a3) ​​is the product picture of the first experimental piece after puffing matrix three, (b1) is the product picture of the second experimental piece before puffing, (b2) is the product picture of the second experimental piece after puffing matrix two, (b3) is the product picture of the second experimental piece after puffing matrix three, (c1) is the product picture of the third experimental piece before puffing, (c2) is the product picture of the third experimental piece after puffing matrix two, and (c3) is the product picture of the third experimental piece after puffing matrix three; for example, matrix three is a sweet aerosol generating matrix.

[0114] Through the above comparison of suction scaling, the second and third experimental pieces under the same conditions have almost no scaling after suction, reflecting their higher application value. By providing the heat dissipation layer 12 between the porous substrate 11 and the heating layer 13, scaling on the heating layer 13 can be reduced.

[0115] Experiment 5: Flatness comparison.

[0116] See also Fig.14 , Fig.14 This is a comparison chart of the flatness of the first, second, and third experimental pieces. It should be noted that: Fig.14 (a) is the first experimental piece, (b) is the second experimental piece, and (c) is the third experimental piece.

[0117] The edge of the heating layer of the first experimental piece has burrs, while the edges of the heating layer 13 of the second and third experimental pieces are relatively smooth with a high degree of flatness, which improves the consistency of the resistance of the heating layer 13 along the extension direction of the heating layer 13, and the overall resistance consistency of the heating element 10 product is high.

[0118] See also Fig.15 , Fig.15 This is the product flow chart for the preparation of the second experimental piece. It should be noted that: Fig.15(a) is a product picture of the second experimental piece with the heat dissipation layer 12 formed by silk screen printing, (b) is a product picture of the second experimental piece with the heat dissipation layer 12 and the heating layer 13 formed by silk screen printing, and (c) is a product picture of the second experimental piece after the heat dissipation layer and the heating layer are co-fired. The edge of the heating layer 13 of the second experimental piece is relatively flat and has a high flatness.

[0119] A heating element 10 provided in an embodiment of the present application comprises: a porous substrate 11, a heat dissipation layer 12 and a heating layer 13. The heat dissipation layer 12 is arranged on the porous substrate 11; the heat dissipation layer 12 is a porous structure; the heating layer 13 is arranged on the surface of the heat dissipation layer 12 away from the porous substrate 11. By setting the heat dissipation layer 12 as a porous structure, a liquid supply channel is provided to the heating layer 13, and sufficient liquid supply and continuous atomization of the heating layer 13 are maintained; by setting the heat dissipation layer 12 between the porous substrate 11 and the heating layer 13, the heat dissipation layer 12 in contact with the porous substrate 11 can quickly conduct heat to the area of ​​the porous substrate 11 not covered by the heat dissipation layer 12, and the aerosol generation matrix stored in the area of ​​the porous substrate 11 not covered by the heat dissipation layer 12 can be quickly atomized, and the atomization temperature of the heating element 10 can be reduced on the basis of achieving the same atomization amount, thereby improving the user experience.

[0120] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heating element, characterized in that: include: Porous matrix; A heat dissipation layer is provided on the porous substrate; the heat dissipation layer is a porous structure; A heat generating layer is provided on the surface of the heat dissipating layer away from the porous substrate. 。 2. The heating element according to claim 1, characterized in that: The thickness of the heat dissipation layer is smaller than the thickness of the heat generation layer; and / or, The porosity of the heat dissipation layer is greater than the porosity of the heat generation layer; and / or, The heat dissipation layer and the heating layer are both in a strip structure, and the line width of the heat dissipation layer is greater than the line width of the heating layer.

3. The heating element according to claim 2, characterized in that: The porosity of the heat dissipation layer is 30%-70%; and / or, The line width of the heat dissipation layer is 0.5 mm to 0.8 mm; and / or, The resistance of the heat dissipation layer is 8Ω-20Ω; and / or, The thickness of the heating layer is 40 μm-100 μm; and / or, The porosity of the heating layer is 0-10%; and / or, The line width of the heating layer is 0.25 mm to 0.45 mm; and / or, The resistance of the heating layer is 0.85Ω-1.60Ω.

4. The heating element according to claim 1, characterized in that The orthographic projection of the heat dissipation layer on the heat generation layer completely covers the heat generation layer.

5. The heating element according to claim 4, characterized in that: The orthographic projection of the center line of the heat dissipation layer along the extension direction on the heat generation layer coincides with the center line of the heat generation layer along the extension direction.

6. The heating element according to claim 1, characterized in that: The porous matrix includes an atomized surface; the heat dissipation layer includes a main body and an infiltration portion, the main body is arranged on the atomized surface of the porous matrix, and the infiltration portion is arranged in the pores of the porous matrix; Preferably, the thickness of the infiltration portion is 80 μm-150 μm; and / or the thickness of the main body portion is 5 μm-20 μm.

7. The heating element according to claim 1, characterized in that: The material of the heating layer includes at least one of a nickel-based alloy, an iron-based alloy, and a ruthenium-based alloy; and / or, The material of the heat dissipation layer includes at least one of a nickel-based alloy, an iron-based alloy, and a ruthenium-based alloy.

8. An atomizer, characterized in that: It comprises a liquid storage chamber and a heating element as described in any one of claims 1 to 7, wherein the liquid storage chamber is used to store an aerosol generating substrate, and the heating element is used to heat and atomize the aerosol generating substrate in the liquid storage chamber.

9. An electronic atomization device, characterized in that: It comprises a host and the atomizer according to claim 8, wherein the host is used to power the atomizer.

10. A method for preparing a heating element, characterized in that: include: Providing a porous substrate, the porous substrate comprising an atomized surface; Coating a first slurry on the atomized surface of the porous substrate to form a heat dissipation layer; A second slurry is coated on the surface of the heat dissipation layer to form a heat generation layer.

11. The preparation method according to claim 10, characterized in that: The viscosity of the first slurry is lower than the viscosity of the second slurry.

12. The preparation method according to claim 11, characterized in that: The viscosity of the first slurry is 50,000 cp-150,000 cp; and / or the viscosity of the second slurry is 400,000 cp-800,000 cp.

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