Method for processing hyperplane of ultrathin optical component

Abstract

The invention discloses a method for processing a hyperplane of an ultrathin optical component, which relates to the technical field of optical component processing, and comprises the following processing steps of: S1, coating a protective layer on a graphic layer of a graphic substrate, and enabling the other side of the graphic substrate to be a surface to be processed; s2, a pattern layer of the pattern substrate faces the first base plate and is fixed to the first base plate, a plurality of auxiliary cushion blocks are placed on the first base plate, a second base plate is placed on the to-be-machined face of the pattern substrate, the pattern substrate is clamped between the first base plate and the second base plate, and the auxiliary cushion blocks are adjusted so that the parallelism of the first base plate and the second base plate can reach a set value; s3, disc feeding is conducted, specifically, the first base plate is placed on the disc face, it is ensured that the parallelism between the second base plate and the disc face reaches a set value, and the second base plate is taken down; and S4, grinding and polishing the to-be-processed surface of the pattern substrate. According to the processing method for the hyperplane of the ultra-thin optical component, the high-precision pattern substrate with the thickness being smaller than 1 mm can be obtained through processing.

Description

Technical Field

[0001] The present invention relates to the technical field of optical component processing, and in particular to a method for processing a super-plane of an ultra-thin optical component. Background Art

[0002] At present, the processing of optical components with a thickness of 1mm or less can only achieve a graphic CD (critical dimension) accuracy of 0.5μm or above. This is because the graphic substrate, that is, the glass sheet, is first processed to the designed thickness and surface shape, and then the graphic substrate is coated to achieve graphics. Due to the film stress of the coating, the original surface shape index of the graphic substrate will be deteriorated, and the position accuracy of the graphic layer will also be affected. That is, the graphic CD accuracy of the graphic substrate cannot be further improved, and the surface shape of the other side of the graphic substrate will also deteriorate. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for processing a super-plane of an ultra-thin optical component, which can process a high-precision pattern substrate with a thickness of less than 1 mm.

[0004] The method for processing a super-plane of an ultra-thin optical component according to an embodiment of the present invention is used to process a graphic substrate, wherein one side surface of the graphic substrate has a graphic layer, and comprises the following processing steps: Step S1, coating a protective layer on a surface of the pattern substrate having a pattern layer, wherein a surface of the pattern substrate opposite to the pattern layer is a surface to be processed; Step S2, facing one side of the graphic layer of the graphic substrate toward the first pad, and fixing the graphic substrate on the first pad, placing a plurality of auxiliary pads on the first pad, the plurality of auxiliary pads are distributed around the graphic substrate, placing a second pad on the surface to be processed of the graphic substrate, so that the graphic substrate is clamped between the first pad and the second pad, and adjusting the auxiliary pads so that the parallelism between the first pad and the second pad reaches a set value; Step S3, placing the first pad on the disk surface, ensuring that the parallelism between the second pad and the disk surface reaches a set value, and removing the second pad; Step S4, grinding and polishing the surface to be processed of the graphic substrate until the thickness of the graphic substrate, the surface shape of the processed surface, and the parallelism of the processed surface all reach set values.

[0005] The method for processing the ultra-plane of an ultra-thin optical component according to an embodiment of the present invention has at least the following beneficial effects: firstly, the graphic substrate is patterned, and then the graphic substrate is thinned to the designed thickness by removing material, so that an ultra-thin optical component with a thickness of 1 mm or less can be obtained, and the graphic CD accuracy can be better than 0.5 μm; the graphic substrate is patterned before thinning, and the film stress has less effect on the thicker image substrate during coating patterning, and the graphic CD accuracy can be better than 0.5 μm; when removing material from the surface to be processed of the graphic substrate, the first pad, the auxiliary pad and the second pad are used to clamp the graphic substrate and complete the upper plate operation, so that the graphic substrate can be accurately positioned before processing, and the parallelism of the processed graphic substrate can meet the design requirements.

[0006] According to some embodiments of the present invention, in step S4, the step further includes: step S4.1.1, rough grinding the surface to be processed of the graphic substrate, the rough grinding adopts an oscillating grinding method, the grinding spindle speed is controlled at 40 to 60 rpm, and the air pressure is controlled at 4 to 5 kg / cm 2 , the swing speed is controlled at 7 to 10 times / minute; step S4.1.2, fine grinding the surface to be processed of the graphic substrate, the fine grinding adopts a swing grinding method, the grinding spindle speed is controlled at 30 to 40 rpm, and the air pressure is controlled at 1 to 2 kg / cm 2 The swing speed is controlled at 4 to 6 times per minute.

[0007] According to some embodiments of the present invention, in step S4, the graphic substrate is first ground to a thickness of less than 1 mm, and at this time the thickness of the graphic substrate is 0.2 mm away from the final design thickness, and then step S4.1.1 is performed.

[0008] According to some embodiments of the present invention, in step S4, it also includes step S4.2.1, after grinding the surface to be processed of the graphic substrate, continuing to rough polish, the rough polishing adopts a swing polishing method, the polishing spindle speed is controlled at 100 to 120 rpm, and the air pressure is controlled at 4 to 5 kg / cm 2 , the swing speed is controlled at 8 to 10 times / min; step S4.2.2, the surface to be processed of the graphic substrate is finely polished, and the fine polishing adopts a swing polishing method, the polishing spindle speed is controlled at 40 to 60 rpm, and the air pressure is controlled at 1 to 2 kg / cm 2 The swing speed is controlled at 3 to 5 times per minute.

[0009] According to some embodiments of the present invention, in step S1, the thickness of the applied protective layer is controlled to be 2-5 μm.

[0010] According to some embodiments of the present invention, the initial thickness of the graphic substrate to be processed is greater than or equal to 2 mm.

[0011] According to some embodiments of the present invention, the surface shapes of the first pad and the second pad both reach 1 / 4λ, and the parallelism of the first pad and the second pad both is less than or equal to 5 seconds.

[0012] According to some embodiments of the present invention, the parallelism of the auxiliary pad is less than or equal to 5 seconds.

[0013] According to some embodiments of the present invention, in step S2, the number of auxiliary pads placed on the first pad is at least 3.

[0014] According to some embodiments of the present invention, in step S3, the parallelism between the second pad and the disk surface is less than or equal to 5 seconds when placing the disk.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 It is a schematic diagram of the structure of the graphic substrate in accordance with an embodiment of the present invention in cooperation with the first pad, the second pad and the auxiliary pad.

[0017] Figure Number: The pattern substrate 100 , the first pad 200 , the second pad 300 , and the auxiliary pad 400 . DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0019] In the description of the present invention, it should be understood that descriptions involving orientation, such as orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] In the description of the present invention, "a plurality" means more than two. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0022] Ultra-plane machining refers to the ultra-precision machining of a plane to obtain a high-precision graphic substrate with a thickness of less than 1mm. The high precision of the graphic substrate means that the graphic CD precision is better than 0.5μm, that is, the graphic CD precision is less than or equal to 0.5μm. At the same time, the surface shape of the opposite side surface of the graphic layer of the graphic substrate can be better than 1 / 4λ.

[0023] The surface shape of the machined surface is better than 1 / 4λ. The surface shape can be regarded as the smoothness of the surface. The deviation of the surface shape is measured by the ripple value λ, which is generally tested using light with a wavelength of 632.8nm. A surface shape of 1λ indicates a general quality level. A surface shape of the machined surface better than 1 / 4λ indicates a better than precise quality level.

[0024] The upper plate refers to the plate surface on the workbench where the product to be processed is fixed during the processing of optical components.

[0025] Parallelism is an indicator that measures the amount of change in the parallel direction of an actual element relative to a reference. Among them, a parallelism of 1 second means that the error is 1mm at a distance of 100mm.

[0026] A method for processing a super-plane of an ultra-thin optical component according to an embodiment of the present invention is used to process a pattern substrate, wherein one side surface of the pattern substrate has a pattern layer, and comprises the following processing steps: Step S1, coating a protective layer on a surface of a pattern substrate having a pattern layer, and a surface of the pattern substrate opposite to the pattern layer is a surface to be processed; Step S2, facing one side of the graphic layer of the graphic substrate toward the first pad, and fixing the graphic substrate on the first pad, placing a plurality of auxiliary pads on the first pad, the plurality of auxiliary pads are distributed around the graphic substrate, placing a second pad on the surface to be processed of the graphic substrate, so that the graphic substrate is clamped between the first pad and the second pad, and adjusting the auxiliary pads so that the parallelism between the first pad and the second pad reaches a set value; Step S3, placing the first pad on the disk surface, ensuring that the parallelism between the second pad and the disk surface reaches a set value, and removing the second pad; Step S4, grinding and polishing the surface to be processed of the graphic substrate until the thickness of the graphic substrate, the surface shape of the processed surface, and the parallelism of the processed surface all reach the set values.

[0027] The graphic substrate is first patterned and then thinned to the designed thickness by removing material, so that ultra-thin optical components with a thickness of 1 mm or less can be obtained, and the graphic CD accuracy can be better than 0.5μm. The graphic substrate is patterned before thinning, and the film stress has less effect on the thicker image substrate during coating patterning, and the graphic CD accuracy can be better than 0.5μm.

[0028] The patterned substrate 100 has a pattern layer. In the subsequent material removal process, in order to protect the pattern layer, a protective layer needs to be coated on the pattern layer. Preferably, the coating thickness of the protective layer is controlled to be 2-5 μm.

[0029] Reference Figure 1 As shown, the graphic substrate 100 is placed on the first pad 200 and fixed, ensuring that the side of the graphic substrate coated with the protective layer faces the first pad. The fixing method between the graphic substrate and the first pad can be optical glue method or bonding method. Then a plurality of auxiliary pads 400 are placed on the first pad, and a plurality of auxiliary pads are placed around the graphic substrate. Next, the second pad 300 is placed on the surface to be processed of the graphic substrate, and the second pad is adjusted by the auxiliary pads to ensure that the parallelism between the second pad and the first pad reaches the set value. Preferably, the parallelism between the second pad and the first pad is controlled within 5 seconds.

[0030] Then, the disk operation is performed, and the first pad is placed on the disk surface to ensure that the parallelism between the second pad and the disk surface also reaches the set value. Preferably, the parallelism between the second pad and the disk surface is also controlled within 5 seconds. It should be understood that the side of the graphic substrate with the graphic layer has been graphic processed, and the surface shape of the graphic layer surface has met the set value, while the surface shape of the surface to be processed of the graphic substrate is poor. If the graphic substrate is directly placed on the disk, it is difficult to ensure that the parallelism between the graphic layer and the disk surface reaches the set value, resulting in deviations in subsequent processing, and the parallelism of the processed graphic substrate may be poor.

[0031] It should be understood that the parallelism and surface shape of the first pad and the second pad also need to meet the set values. Preferably, the parallelism of the first pad is within 5 seconds, and the surface shape reaches 1 / 4λ, and the parallelism of the second pad is also within 5 seconds, and the surface shape also reaches 1 / 4λ. The parallelism of the auxiliary pad is also preferably controlled within 5 seconds. It should be understood that the better the parallelism of the auxiliary pad, the better the parallelism of the upper plate of the graphic substrate can be controlled. The number of auxiliary pads is preferably 3, of course, more than 3 auxiliary pads can also be placed.

[0032] The graphic substrate has a graphic layer on one side that has been processed graphically, and the surface shape of the graphic layer has met the set value. Therefore, after the graphic substrate is fixed to the first pad, the first pad can be used as a reference surface, and then the auxiliary pad and the second pad can be placed. By adjusting the auxiliary pad, the parallelism of the second pad and the first pad can be controlled within the set value. When operating the upper disk, the second pad can be used as a reference to adjust the parallelism between the second pad and the disk surface to reach the set value, preferably within 5 seconds. Next, after removing the second pad, the surface to be processed of the graphic substrate can be processed, which can ensure that the parallelism of the processed graphic substrate reaches the set value, that is, the parallelism of the processed graphic substrate can be controlled within 5 seconds.

[0033] When removing material from the surface to be processed of the graphic substrate, the first pad, auxiliary pad and second pad are used to clamp the graphic substrate and complete the mounting operation. The graphic substrate can be accurately positioned before processing, and the parallelism of the processed graphic substrate can meet the design requirements. The surface shape control of the surface to be processed of the graphic substrate needs to be obtained through grinding and polishing.

[0034] It is understood that step S4 also includes step S4.1.1, rough grinding the surface to be processed of the graphic substrate, the rough grinding adopts an oscillating grinding method, the grinding spindle speed is controlled at 40 to 60 rpm, and the air pressure is controlled at 4 to 5 kg / cm 2 , the swing speed is controlled at 7 to 10 times / min; step S4.1.2, fine grinding the surface to be processed of the graphic substrate, the fine grinding adopts the swing grinding method, the grinding spindle speed is controlled at 30 to 40 rpm, and the air pressure is controlled at 1 to 2 kg / cm 2 The swing speed is controlled at 4 to 6 times per minute.

[0035] During the rough grinding process, the grinding time is preferably 20 minutes. During the fine grinding process, the grinding time is preferably 30 minutes. After grinding, the surface to be processed of the graphic substrate can reach a surface shape within 1λ, and the parallelism can be within 10 seconds. Preferably, after grinding, the thickness of the graphic substrate differs from the thickness of the set value by 0.01mm, and then polishing is performed until the set thickness is reached. Of course, the thickness of the graphic substrate can also differ from the thickness of the set value by 0.01mm with a tolerance of ±0.005mm. That is, the maximum can reach 0.015mm and the minimum can reach 0.005mm.

[0036] It is understandable that in step S4, the graphic substrate is first ground to a thickness of less than 1 mm, and at this time the thickness of the graphic substrate is 0.2 mm away from the final design thickness, and then step S4.1.1 is performed.

[0037] In order to reduce the influence of coating stress when processing the graphic surface on the surface of the graphic substrate, the graphic substrate preferably uses a glass sheet with a thickness of 2mm or more. Then the thickness is reduced to the set thickness through the processing method of the ultra-thin optical component super plane. It should be understood that the processing of ultra-thin optical components is aimed at the processing of ultra-thin optical components. The thickness of ultra-thin optical components is generally 1mm or less. Therefore, before rough grinding, the thickness of the graphic substrate is quickly processed to 1mm or less by grinding. However, before rough grinding, the thickness of the graphic substrate must be 0.2mm away from the final design thickness. Of course, at this time, the thickness of the graphic substrate can be 0.2mm different from the set value and can have a tolerance of ±0.05mm.

[0038] It is understood that in step S4, it also includes step S4.2.1, after grinding the surface to be processed of the graphic substrate, continuing to rough polishing, the rough polishing adopts a swing polishing method, the polishing spindle speed is controlled at 100 to 120 rpm, and the air pressure is controlled at 4 to 5 kg / cm 2 , the swing speed is controlled at 8 to 10 times / min; step S4.2.2, fine polishing is performed on the surface to be processed of the graphic substrate, and the fine polishing adopts a swing polishing method, the polishing spindle speed is controlled at 40 to 60 rpm, and the air pressure is controlled at 1 to 2 kg / cm 2 The swing speed is controlled at 3 to 5 times per minute.

[0039] During the rough polishing process, the polishing time is preferably 40 minutes. During the fine polishing process, the polishing time is preferably 60 minutes. After polishing, the processed surface of the graphic substrate can reach a surface shape within 1 / 4λ, a parallelism within 5 seconds, and a smoothness of 20 to 10. It should be understood that after the final polishing of the surface to be processed of the graphic substrate, the surface to be processed is transformed into a processed surface.

[0040] It should be understood that after fine polishing, the surface to be processed of the graphic substrate can also be subjected to final low-polishing and shaping. After the processing is completed, the surface shape of the processed surface can be within 1 / 4λ, the parallelism can be within 5 seconds, and the smoothness can reach the index of 20-10.

[0041] It can be understood that in step S1, the thickness of the applied protective layer is controlled to be 2-5 μm.

[0042] The thickness of the protective layer is controlled at 2-5 μm, which can protect the graphic layer without affecting the parallelism between the graphic substrate and the first pad, and will not affect the parallelism of the graphic substrate when mounting.

[0043] It is understandable that the initial thickness of the graphic substrate to be processed is greater than or equal to 2 mm.

[0044] In order to reduce the influence of coating stress when processing the pattern surface on the surface of the pattern substrate, the pattern substrate preferably uses a glass sheet with a thickness of 2 mm or more.

[0045] It can be understood that the surface shapes of the first pad and the second pad both reach 1 / 4λ, and the parallelism of the first pad and the second pad both are less than or equal to 5 seconds.

[0046] It is understood that the parallelism of the auxiliary pad is less than or equal to 5 seconds.

[0047] The better the parallelism of the auxiliary pads, the better the parallelism of the graphic substrate after the upper plate is placed, and the better the parallelism of the processed surface after processing.

[0048] It can be understood that in step S2, the number of auxiliary pads placed on the first pad is at least 3.

[0049] Preferably, the number of auxiliary pads is 3. The three auxiliary pads can better determine a plane, which is beneficial to the adjustment of the second pad until the parallelism between the second pad and the first pad reaches a set value.

[0050] It can be understood that in step S3, the parallelism between the second pad and the disk surface is less than or equal to 5 seconds when placing the disk.

[0051] In some embodiments, a 2mm graphic substrate is selected, and the graphic layer has been processed on the surface of the graphic substrate. A protective layer is coated on the surface of the graphic substrate with a graphic layer, and the coating thickness of the protective layer is 3μm; one side of the graphic layer of the graphic substrate faces the first pad, and the graphic substrate is fixed on the first pad, and three auxiliary pads are placed on the first pad. The three auxiliary pads are distributed around the graphic substrate, and the second pad is placed on the surface to be processed of the graphic substrate, so that the graphic substrate is clamped between the first pad and the second pad, and the auxiliary pads are adjusted so that the parallelism of the first pad and the second pad reaches 5 seconds. Among them, the parallelism of the first pad is 5 seconds, and the surface shape reaches 1 / 4λ, and the parallelism of the second pad is also 5 seconds, and the surface shape also reaches 1 / 4λ. The parallelism of the auxiliary pads is also controlled at 5 seconds.

[0052] Place the first pad on the disk surface, and ensure that the parallelism between the second pad and the disk surface reaches 5 seconds, then remove the second pad; perform rough grinding on the surface to be processed of the graphic substrate, and use the swing grinding method for rough grinding. The grinding spindle speed is controlled at 50 rpm, and the air pressure is controlled at 4kg / cm 2 The swing speed is controlled at 8 times / min, and the grinding time is 20 minutes; the surface to be processed of the graphic substrate is finely ground, and the fine grinding adopts the swing grinding method. The grinding spindle speed is controlled at 40 rpm, and the air pressure is controlled at 1.5kg / cm 2, the swing speed is controlled at 5 times / minute, and the grinding time is 30 minutes. After grinding, the thickness of the graphic substrate is 0.01mm different from the set value, and then polishing is performed.

[0053] After grinding the surface of the graphic substrate to be processed, continue with rough polishing. The rough polishing adopts the swing polishing method. The polishing spindle speed is controlled at 120 rpm and the air pressure is controlled at 5kg / cm 2 The swing speed is controlled at 10 times / min, and the polishing time is 40 minutes; the surface to be processed of the graphic substrate is finely polished, and the fine polishing adopts the swing polishing method. The polishing spindle speed is controlled at 60 rpm, and the air pressure is controlled at 2kg / cm 2 , the swing speed is controlled at 5 times / minute, the polishing time is 60 minutes; finally, low polishing and shaping are performed. The surface shape of the processed surface of the processed graphic substrate can reach within 1 / 4λ, the parallelism can be within 5 seconds, and the smoothness can reach the index of 20-10.

[0054] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A method for processing an ultra-thin optical component super-plane, used for processing a pattern substrate, wherein one side surface of the pattern substrate has a pattern layer, characterized in that: The processing steps include: Step S1, coating a protective layer on a surface of the pattern substrate having a pattern layer, wherein a surface of the pattern substrate opposite to the pattern layer is a surface to be processed; Step S2, facing one side of the graphic layer of the graphic substrate toward the first pad, and fixing the graphic substrate on the first pad, placing a plurality of auxiliary pads on the first pad, the plurality of auxiliary pads are distributed around the graphic substrate, placing a second pad on the surface to be processed of the graphic substrate, so that the graphic substrate is clamped between the first pad and the second pad, and adjusting the auxiliary pads so that the parallelism between the first pad and the second pad reaches a set value; Step S3, placing the first pad on the disk surface, ensuring that the parallelism between the second pad and the disk surface reaches a set value, and removing the second pad; Step S4, grinding and polishing the surface to be processed of the graphic substrate until the thickness of the graphic substrate, the surface shape of the processed surface, and the parallelism of the processed surface all reach set values.

2. The method for processing a super-plane of an ultra-thin optical component according to claim 1, characterized in that: In step S4, it also includes: Step S4.1.1, rough grinding the surface to be processed of the graphic substrate, the rough grinding adopts an oscillating grinding method, the grinding spindle speed is controlled at 40 to 60 rpm, and the air pressure is controlled at 4 to 5 kg / cm 2 , the swing speed is controlled at 7 to 10 times per minute; Step S4.1.2, fine grinding the surface to be processed of the graphic substrate, the fine grinding adopts an oscillating grinding method, the grinding spindle speed is controlled at 30-40 rpm, and the air pressure is controlled at 1-2 kg / cm 2 The swing speed is controlled at 4 to 6 times per minute.

3. The method for processing a super-plane of an ultra-thin optical component according to claim 2, characterized in that: In step S4, the graphic substrate is first ground to a thickness of less than 1 mm, and at this time the thickness of the graphic substrate is 0.2 mm away from the final design thickness, and then step S4.1.1 is performed.

4. The method for processing a super-plane of an ultra-thin optical component according to claim 1, characterized in that: In step S4, it also includes: Step S4.2.1, after grinding the surface to be processed of the graphic substrate, continue to perform rough polishing, the rough polishing adopts a swing polishing method, the polishing spindle speed is controlled at 100-120 rpm, and the air pressure is controlled at 4-5 kg / cm 2 , the swing speed is controlled at 8 to 10 times per minute; Step S4.2.2, fine polishing the surface to be processed of the graphic substrate, the fine polishing adopts an oscillating polishing method, the polishing spindle speed is controlled at 40 to 60 rpm, and the air pressure is controlled at 1 to 2 kg / cm 2 The swing speed is controlled at 3 to 5 times per minute.

5. The method for processing a super-plane of an ultra-thin optical component according to claim 1, characterized in that: In step S1, the thickness of the applied protective layer is controlled to be 2-5 μm.

6. The method for processing a super-plane of an ultra-thin optical component according to claim 1, characterized in that: The initial thickness of the graphic substrate to be processed is greater than or equal to 2 mm.

7. The method for processing a super-plane of an ultra-thin optical component according to claim 1, characterized in that: The surface shapes of the first pad and the second pad both reach 1 / 4λ, and the parallelism of the first pad and the second pad both is less than or equal to 5 seconds.

8. The method for processing a super-plane of an ultra-thin optical component according to claim 7, characterized in that: The parallelism of the auxiliary pad is less than or equal to 5 seconds.

9. The method for processing a super-plane of an ultra-thin optical component according to claim 1, characterized in that: In step S2, at least three auxiliary pads are placed on the first pad.

10. The method for processing a super-plane of an ultra-thin optical component according to claim 1, characterized in that: In step S3, the parallelism between the second pad and the disk surface is less than or equal to 5 seconds when placing the disk.

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