Surface metallization processing device and preparation method of grid line of solar cell

Abstract

The invention discloses a surface metallization processing device and a preparation method of a grid line of a solar cell. The surface metallization treatment device comprises a shell, a template movably arranged in the shell and a supporting seat used for supporting a to-be-plated product, the template is provided with a first side face opposite to the to-be-plated product on the supporting seat, the template comprises a plurality of grooves formed in the first side face, and the grooves correspond to a graphical to-be-plated surface on the to-be-plated product; a cavity for accommodating a plating solution is formed in the template, and a solution outlet for communicating the cavity with the plurality of grooves is also formed in the template, so that the plating solution in the cavity is allowed to flow into the grooves; when the template is in the working position, the first side surface is in contact with a to-be-plated product on the supporting seat, and a plating cavity is formed between each groove and the to-be-plated surface of the to-be-plated product; and when the template is at the feeding and discharging position, the first side surface is separated from the to-be-plated product. According to the surface metallization treatment device, the using amount of the plating solution is small, and cost reduction is facilitated.

Description

Technical Field

[0001] The invention relates to a surface metallization processing device and a grid line preparation method for a solar cell sheet. Background Art

[0002] Surface metallization refers to the process of forming a metal layer on a non-metallic surface through surface treatment technology. Surface metallization technology has been widely used in the field of semiconductor manufacturing, especially in the preparation of solar cells. The front and / or back electrodes of solar cells include multiple grid lines that intersect each other. The photocurrent generated by the solar cell after photoelectric conversion is collected and transmitted by these grid lines. The traditional method of preparing grid lines is to screen print silver paste on the surface of the cell and form silver grid lines after sintering. This preparation method uses a large amount of silver paste, has a high cost, and the thickness of the silver grid lines is relatively large, generally 20 to 30 μm.

[0003] Subsequently, a method for preparing grid lines using electroplating technology instead of screen printing technology emerged. Specifically, a patterned slotted area is first prepared on the surface of the cell by laser etching equipment, and the passivation layer and / or anti-reflection layer therein are removed. Copper is electroplated in the slotted area to form a metallized contact with the substrate of the cell to produce copper grid lines. However, this method for preparing grid lines is relatively complicated, and requires a large number of types and types of equipment. Laser etching equipment is required. Although the cost of grid line materials is reduced, the equipment cost is high. At the same time, the traditional electroplating device uses a large amount of plating solution, and the overall cost is still high. Among them, some solutions also require the provision of a mask on the surface of the cell that does not require electroplating. The preparation of the mask and the steps of removing the mask after electroplating will lead to a complicated preparation process and increased manufacturing costs.

[0004] The above information disclosed in the Background section is only for enhancement of understanding of the background of the present application and therefore it may contain information that does not constitute the prior art that is already known to a person of ordinary skill in the art. Summary of the invention

[0005] In view of the above technical problems, the present invention provides a surface metallization treatment device, which uses less plating solution and is conducive to reducing costs. The present invention also provides a grid line preparation method for solar cells, which reduces the preparation cost and has a smaller grid line thickness.

[0006] The present invention adopts the following technical solution:

[0007] A surface metallization treatment device, comprising a housing, a template movably disposed in the housing, and a support seat for supporting a product to be plated, wherein the template has a first side surface opposite to the product to be plated on the support seat, and the template comprises a plurality of grooves formed on the first side surface, wherein the plurality of grooves correspond to a patterned surface to be plated on the product to be plated;

[0008] The template is provided with a chamber for containing a plating solution, and the template is also provided with a liquid outlet connecting the chamber and the plurality of grooves to allow the plating solution in the chamber to flow into the grooves;

[0009] The template has a working position and a loading and unloading position. In the working position, the first side surface is in contact with the product to be plated on the support seat, and a plating cavity is formed between each groove and the surface to be plated of the product to be plated; in the loading and unloading position, the first side surface is separated from the product to be plated.

[0010] In a preferred embodiment, part of the groove extends inward from the edge of the first side surface, thereby forming a flow opening for the plating solution to flow out.

[0011] In a more preferred embodiment, the support seat is disposed in the shell, and a drain port for discharging the waste plating liquid flowing into the shell is disposed at the bottom of the shell.

[0012] In a further preferred embodiment, the bottom of the housing has an inclined surface to facilitate the collection of waste plating liquid to the drain port.

[0013] In a more preferred embodiment, the plurality of grooves include a plurality of first grooves extending along a first direction and a plurality of second grooves extending along a second direction, the first direction and the second direction are perpendicular to each other, and the plurality of first grooves and the plurality of second grooves intersect and communicate with each other.

[0014] In a further preferred embodiment, at least one of the first grooves extends from a first edge of the first side surface to a second edge thereof, and the first edge and the second edge are arranged opposite to each other; at least one of the second grooves extends from a third edge of the first side surface to a fourth edge thereof, and the third edge and the fourth edge are arranged opposite to each other.

[0015] In a specific embodiment, there are multiple liquid outlets, and each of the liquid outlets is opened on the bottom of at least one of the first grooves and / or at least one of the second grooves.

[0016] In a further preferred embodiment, the lengths of the first groove and the second groove correspond to the lengths of the grid lines on the product to be plated, and the widths of the first groove and the second groove correspond to the widths of the grid lines on the product to be plated.

[0017] In a preferred embodiment, the surface metallization treatment device further comprises an inlet pipe, which is connected to the second side of the template and communicates with the chamber so as to introduce plating solution into the chamber.

[0018] In a preferred embodiment, a guide column is provided in the housing, the template is movably mounted on the guide column, and the surface metallization treatment device further comprises a driving device for driving the template to move along the guide column.

[0019] In a more preferred embodiment, the driving device comprises a cylinder, which is mounted on the outside of the housing, and a piston rod of the cylinder passes through the housing and is connected to the second side of the template.

[0020] Furthermore, a sealing assembly for sealing the piston rod and the housing is provided on the piston rod of the cylinder. Specifically, the sealing assembly includes a sealing box and sealing oil filled in the sealing box, and the piston rod passes through the sealing box.

[0021] In a more preferred embodiment, a buffer pad is provided on the second side of the template. Further, the buffer pad is an acid- and alkali-resistant buffer pad. The buffer pad is sleeved on the piston rod and is located between the sealing box and the second side of the template.

[0022] In a preferred embodiment, the size of the groove is consistent with the size of the patterned surface to be plated on the product to be plated.

[0023] In a preferred embodiment, the chamber is configured to allow a chemical plating solution to flow therein, the surface metallization treatment device is a chemical plating device, the first side surface is a horizontal plane, and the template is located above the support seat.

[0024] The present invention also adopts the following technical solution:

[0025] A method for preparing grid lines of a solar cell sheet adopts the above-mentioned surface metallization processing device, and the grid line preparation method comprises the following steps:

[0026] S101, placing the solar cell to be plated on the support seat;

[0027] S102, moving the template to the first side surface to contact the surface to be plated of the solar cell, so that a plating cavity is formed between each of the grooves and the surface to be plated of the product to be plated;

[0028] S103, introducing a plating solution containing copper ions into the chamber, wherein the plating solution flows from the liquid outlet into each of the plating chambers to react on the imaged surface to be plated of the solar cell to form copper grid lines;

[0029] Wherein, the waste plating solution after the reaction flows into the shell from the groove.

[0030] In a preferred embodiment, in step S101, a patterned silver conductive layer with a thickness of less than 1 μm is pre-prepared on the solar cell; in step S103, a copper grid line with a thickness of 7 to 11.5 μm is stacked on the silver conductive layer. More preferably, the silver conductive layer is prepared by a screen printing process. Furthermore, the thickness of the silver conductive layer is 0.5 to 1.0 μm, and the total thickness of the silver conductive layer and the copper grid line is 8 to 12 μm.

[0031] The present invention adopts the above solution, which has the following advantages compared with the prior art:

[0032] The surface metallization treatment equipment of the present invention adopts a template with a graphic groove, the size, position, shape, etc. of the groove are designed according to the surface to be plated of the product to be plated, the product to be plated is fixed on the support seat, and when the template and the product to be plated are molded, each groove is closed by the surface to be plated of the product to be plated, so that multiple small plating cavities are formed between the multiple grooves and the product to be plated, and plating solution is introduced into these plating cavities, and a reaction is carried out in each plating cavity to form a plating layer, which greatly reduces the amount of plating solution. When the surface metallization treatment equipment is used to prepare the grid lines of solar cells, the manufacturing cost of solar cells can be significantly reduced.

[0033] In a further preferred embodiment, a copper plating layer is prepared on a solar cell sheet that has been pre-prepared with a thinner silver conductive layer to form a silver-copper laminated grid line. While ensuring a cavity with good conductivity, the overall thickness of the grid line can be reduced (to as low as 8 to 12 μm), and the use of expensive laser etching equipment can be avoided. A mask need not be set, and the manufacturing cost of the solar cell sheet is further reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0035] Figure 1 It is a three-dimensional diagram of a surface metallization treatment device according to an embodiment of the present invention.

[0036] Figure 2 This is a three-dimensional view from another perspective of a surface metallization treatment device according to an embodiment of the present invention, wherein the housing is not shown.

[0037] Figure 3 for Figure 2 A partial enlarged view of point A in the middle.

[0038] Figure 4 It is a cross-sectional view of a surface metallization treatment device according to an embodiment of the present invention.

[0039] Figure 5 The figure is a schematic diagram of the chemical plating principle of a surface metallization treatment device according to an embodiment of the present invention.

[0040] Figure 6 for Figure 5 A partial enlarged view of point B in the middle.

[0041] Figure 7 A schematic diagram of a solar cell.

[0042] Figure 8 The figure is a flow chart of a gate line preparation method according to an embodiment of the present invention.

[0043] in:

[0044] 1. Shell; 11. Drain port; 12. Inclined surface; 13. Guide column; 14. Waterproof board; 15. Operation window;

[0045] 2. template; 21. first side; 22. groove; 22a. first groove; 22b. second groove; 221. groove bottom; 222. flow port; 23. chamber; 24. liquid outlet; 25. second side;

[0046] 3. Support seat;

[0047] 4. Inlet pipe;

[0048] 5. driving device; 51. cylinder; 511. piston rod; 52. sealing assembly; 521. sealing box; 522. oil seal; 53. buffer pad;

[0049] 6. Solar cell; 61. Grid line. DETAILED DESCRIPTION

[0050] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention.

[0051] In this document, the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", etc. are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.

[0052] This embodiment provides a surface metallization treatment device, specifically a chemical plating device, for preparing a metal coating on the surface of a semiconductor. Further, the chemical plating device is a selective chemical plating device, suitable for preparing a patterned coating, such as a grid line of a solar cell. Figures 1 to 6 As shown, the surface metallization treatment device includes a shell 1, a template 2 and a support base 3.

[0053] The shell 1 plays the role of supporting the internal components such as the template 2 and waterproofing. The template 2 is movably arranged in the shell 1, and the support seat 3 is also arranged in the shell 1 to fix and support the product to be plated. In this embodiment, the support seat 3 is fixed to the lower part of the shell 1 (lower shell), the template 2 is arranged in the upper part of the shell 1 (upper shell), and a drain port 11 is arranged at the bottom of the shell 1 for discharging the waste plating liquid flowing into the shell 1. Further, the bottom of the shell 1 has an inclined surface 12 to facilitate the collection of the waste plating liquid to the drain port 11. In this embodiment, the bottom of the shell 1 is a conical or pyramidal structure to facilitate the collection of waste plating liquid. In addition, a waterproof plate 14 is arranged on the upper part of the shell 1, and the waterproof plate 14 is arranged around the outer side of the template 2. There is an open operation window 15 above the waterproof plate 14 for the operator to put in or take out the product to be plated.

[0054] The template 2 has a first side surface 21 opposite to the product to be plated on the support seat 3, and the template 2 includes a plurality of grooves 22 opened on the first side surface 21, and the plurality of grooves 22 correspond to the patterned surface to be plated on the product to be plated. The template 2 is provided with a chamber 23 for accommodating a plating solution, and the template 2 is also provided with a liquid outlet 24 connecting the chamber 23 and the plurality of grooves 22, so as to allow the plating solution in the chamber 23 to flow into the grooves 22. The template 2 has a working position and a loading and unloading position. When in the working position, the first side surface 21 contacts the product to be plated on the support seat 3, and a plating cavity is formed between each groove 22 and the surface to be plated of the product to be plated; when in the loading and unloading position, the first side surface 21 is separated from the product to be plated, and the product to be plated can be placed in or taken out. The size, position and shape of the groove 22 should be consistent with the size, position and shape of the patterned surface to be plated on the product to be plated. When the template 2 is in the working position, each groove 22 covers the corresponding area to be plated, so that the metal coating is formed only in the area to be plated and the coating is avoided in other areas. The other areas where the coating is avoided are in close contact with the first side surface 21 of the unopened groove 22, and the plating solution rarely or cannot contact these surfaces, so that the use of a mask can be avoided and there is no need to protect other areas by a mask.

[0055] Furthermore, part or all of the groove 22 extends inward from the edge of the first side surface 21, thereby forming a flow opening 222 for the plating solution to flow out. Figure 5 and Figure 7As shown, the plating liquid enters the groove 22 from the liquid outlet 24, and then flows out from the flow port 222. The waste plating liquid collected at the bottom of the shell 1 is discharged from the drain port 11, and then can be further passed into a filtering device. After filtering treatment, it can be recycled and provided to the chamber 23 of the template 2.

[0056] like Figure 7 As shown, in this embodiment, the product to be plated is a solar cell 6. The surface metallization treatment device is used to prepare a patterned grid line 61 on the surface of the solar cell 6. Among them, a number of grid lines 61 extend horizontally, and a number of grid lines 61 extend longitudinally, and the grid lines 61 extending horizontally and the grid lines 61 extending longitudinally intersect with each other. Correspondingly, the plurality of grooves 22 include a plurality of first grooves 22a extending along a first direction and a plurality of second grooves 22b extending along a second direction, the first direction and the second direction are perpendicular to each other, and the plurality of first grooves 22a and the plurality of second grooves 22b intersect with each other and are connected. Among them, the first groove 22a corresponds to the grid line extending horizontally, and the second groove 22b corresponds to the grid line extending longitudinally. The length of the first groove 22a and the second groove 22b corresponds to the length of the grid line on the product to be plated, and the width of the first groove 22a and the second groove 22b corresponds to the width of the grid line on the product to be plated. The area corresponding to the grid line 61 is the above-mentioned patterned area to be plated.

[0057] Further, at least one first groove 22a extends from the first edge of the first side surface 21 to the second edge thereof, and the first edge and the second edge are arranged oppositely. The first edge and the second edge correspond to a pair of short sides of the solar cell 6. At least one second groove 22b extends from the third edge of the first side surface 21 to the fourth edge thereof, and the third edge and the fourth edge are arranged oppositely. The third edge and the fourth edge correspond to a pair of long sides of the solar cell 6.

[0058] There are multiple liquid outlets 24, and the liquid outlets 24 are opened on the groove bottom 221 of at least one first groove 22a and / or at least one second groove 22b. Specifically in this embodiment, the multiple liquid outlets 24 are respectively opened on the groove bottom 221 of different second grooves 22b. Preferably, the multiple liquid outlets 24 are evenly arranged.

[0059] The surface metallization treatment device further includes an inlet pipe 4, which is connected to the second side 25 of the template 2 and communicates with the chamber 23 to pass the plating solution into the chamber 23. The second side 25 and the first side 21 are two opposite surfaces of the template 2, for example, the first side 21 is the lower surface of the template 2, and the second side 25 is the upper surface of the template 2.

[0060] A guide post 13 is provided in the housing 1, and the template 2 is movably sleeved on the guide post 13. The surface metallization treatment device also includes a driving device 5 for driving the template 2 to move along the guide post 13. The driving device 5 includes a cylinder 51, which is installed on the outer side of the housing 1. The piston rod 511 of the cylinder 51 passes through the housing 1 and is connected to the second side 25 of the template 2. A sealing assembly 52 for sealing the piston rod 511 and the housing 1 is provided on the piston rod 511 of the cylinder 51. Specifically, the sealing assembly 52 includes a sealing box 521 and an oil seal 522, the piston rod 511 passes through the sealing box 521, and the oil seal 522 is provided between the sealing box 521 and the piston rod 511. A buffer pad 53 is provided on the second side 25 of the template 2. Furthermore, the buffer pad 53 is an acid and alkali resistant buffer pad. The buffer pad 53 is sleeved on the piston rod 511 and can be fixed on the second side surface 25 of the template 2 . The buffer pad 53 is located between the sealing box 521 and the second side surface 25 of the template 2 .

[0061] In this embodiment, the chamber 23 is configured to allow the chemical plating solution to pass through, the first side 21 is a horizontal plane, and the template 2 is located above the support seat 3. The support seat 3 is provided with a mounting groove that is compatible with the product to be plated, and the product to be plated can be firmly placed in the mounting groove. The guide column 13 extends up and down, the cylinder 51 is provided on the top of the shell 1, the inlet pipe 4 extends up and down, and the lower end of the inlet pipe 4 is connected to the chamber 23 of the template 2. The cylinder 51 can drive the template 2 to move downward, thereby pressing on the solar cell 6 on the support seat 3; refer to Figure 5 and Figure 6 As shown by the middle arrow, the plating solution is continuously introduced into the chamber 23 through the inlet pipe 4, distributed to each groove 22 through a plurality of evenly distributed liquid outlets 24 in the chamber 23, and enters a plurality of tiny plating cavities formed between the grooves 22 and the upper surface of the solar cell 6. The plating solution undergoes an oxidation-reduction reaction in the process of flowing over the upper surface of the solar cell 6, and forms a metal coating on other deposits. The waste plating solution flowing through the plating cavity enters the outer shell 1 from the connecting port respectively, gathers at the bottom of the outer shell 1, and is discharged from the drain port 11.

[0062] In this embodiment, the template 2 is formed by stacking a plurality of plates, the chamber 23 can be provided on one of the plates, the groove 22 is provided on another plate, and the inlet pipe 4 is connected to the uppermost plate. In some other embodiments, the template 2 can also be an integrated structure.

[0063] This embodiment also provides a method for preparing grid lines of a solar cell, which uses the above-mentioned surface metallization processing device. Figure 8 As shown, the gate line preparation method includes the following steps:

[0064] S101, placing the solar cell 6 to be plated on the support 3;

[0065] S102, moving the template 2 until the first side surface 21 contacts the surface to be plated of the solar cell 6, so that a plating cavity is formed between each groove 22 and the surface to be plated of the product to be plated;

[0066] S103, introducing a plating solution containing copper ions into the chamber 23, and the plating solution flows into each plating cavity from the liquid outlet 24 to react on the imaged surface to be plated of the solar cell to form copper grid lines;

[0067] The waste plating solution after the reaction flows into the housing 1 from the groove 22 .

[0068] The preparation method further includes a step S100 before step S101: pre-preparing a patterned silver conductive layer on the solar cell. The thickness of the silver conductive layer is less than 1 μm and is prepared by a screen printing process. That is, firstly screen-printing silver paste on the cell, and then sintering to form the silver conductive layer.

[0069] In step S103, a copper grid line with a thickness of 7 to 11.5 μm is stacked on the silver conductive layer. More preferably, the silver conductive layer is prepared by a screen printing process. Further, the thickness of the silver conductive layer is 0.5 to 1.0 μm, and the total thickness of the silver conductive layer and the copper grid line is 8 to 12 μm. The depth of the above-mentioned groove 22 is greater than 12 μm and less than 30 μm.

[0070] The above-mentioned surface metallization treatment equipment uses a template 2 with a graphic groove 22. The size, position, shape, etc. of the groove 22 are designed according to the surface to be plated of the product to be plated. The product to be plated is fixed on the support seat 3. When the template 2 and the product to be plated are molded together, each groove 22 is closed by the surface to be plated of the product to be plated, so that multiple small plating cavities are formed between the multiple grooves 22 and the product to be plated. Plating solution is introduced into these plating cavities, and a reaction is carried out in each plating cavity to form a plating layer, which greatly reduces the amount of plating solution. When the surface metallization treatment equipment is used to prepare the grid lines of solar cells, the manufacturing cost of solar cells can be significantly reduced.

[0071] A copper plating layer is prepared on a solar cell sheet that has been pre-prepared with a thinner silver conductive layer to form a silver-copper laminated grid line. While ensuring a cavity with good conductivity, the overall thickness of the grid line can be reduced (to as low as 8 to 12 μm), and the use of expensive laser etching equipment can be avoided. A mask does not need to be set, and the manufacturing cost of the solar cell sheet is further reduced.

[0072] As shown in this specification and claims, the terms "comprises" and "include" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the relevant listed items.

[0073] It is further understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar thereto.

[0074] It should be noted that, unless otherwise specified, when a feature is referred to as being “fixed” or “connected” to another feature, it may be directly fixed or connected to the other feature, or it may be indirectly fixed or connected to the other feature.

[0075] The above embodiment is only for illustrating the technical concept and features of the present invention, and is a preferred embodiment. Its purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. Any equivalent transformation or modification made according to the principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A surface metallization treatment device, characterized in that: The invention comprises a housing, a template movably disposed in the housing, and a support seat for supporting a product to be plated, wherein the template has a first side surface opposite to the product to be plated on the support seat, and the template comprises a plurality of grooves formed on the first side surface, wherein the plurality of grooves correspond to a patterned surface to be plated on the product to be plated; The template is provided with a chamber for containing a plating solution, and the template is also provided with a liquid outlet connecting the chamber and the plurality of grooves to allow the plating solution in the chamber to flow into the grooves; The template has a working position and a loading and unloading position. In the working position, the first side surface is in contact with the product to be plated on the support seat, and a plating cavity is formed between each groove and the surface to be plated of the product to be plated; in the loading and unloading position, the first side surface is separated from the product to be plated.

2. The surface metallization treatment device according to claim 1, characterized in that: Part of the groove extends inward from the edge of the first side surface, thereby forming a flow opening for the plating solution to flow out.

3. The surface metallization treatment device according to claim 2, characterized in that: The support seat is arranged in the shell, and the bottom of the shell is provided with a drain port for discharging the waste plating liquid flowing into the shell.

4. The surface metallization treatment device according to claim 3, characterized in that: The bottom of the shell has an inclined surface to facilitate the collection of waste plating liquid to the drain port.

5. The surface metallization treatment device according to claim 2, characterized in that: The plurality of grooves include a plurality of first grooves extending along a first direction and a plurality of second grooves extending along a second direction. The first direction and the second direction are perpendicular to each other. The plurality of first grooves and the plurality of second grooves intersect and communicate with each other.

6. The surface metallization treatment device according to claim 5, characterized in that: At least one of the first grooves extends from the first edge of the first side to its second edge, and the first edge and the second edge are arranged opposite to each other; at least one of the second grooves extends from the third edge of the first side to its fourth edge, and the third edge and the fourth edge are arranged opposite to each other.

7. The surface metallization treatment device according to claim 6, characterized in that: There are multiple liquid outlets, and each of the liquid outlets is opened on the bottom of at least one of the first grooves and / or at least one of the second grooves.

8. The surface metallization treatment device according to claim 5, characterized in that: The lengths of the first groove and the second groove correspond to the lengths of the grid lines on the product to be plated, and the widths of the first groove and the second groove correspond to the widths of the grid lines on the product to be plated.

9. The surface metallization treatment device according to any one of claims 1 to 7, characterized in that: The surface metallization treatment device also includes an inlet pipe, which is connected to the second side of the template and communicates with the chamber so as to introduce plating solution into the chamber.

10. The surface metallization treatment device according to claim 1, characterized in that: A guide column is arranged in the shell, and the template is movably sleeved on the guide column. The surface metallization treatment device also includes a driving device for driving the template to move along the guide column.

11. The surface metallization treatment device according to claim 10, characterized in that: The driving device includes a cylinder, which is installed on the outside of the shell. The piston rod of the cylinder passes through the shell and is connected to the second side of the template. A sealing assembly for sealing the piston rod and the shell is provided on the piston rod of the cylinder; a buffer pad is provided on the second side of the template.

12. The surface metallization treatment device according to claim 1, characterized in that: The size of the groove is consistent with the size of the patterned surface to be plated on the product to be plated.

13. The surface metallization treatment device according to claim 1, characterized in that: The chamber is configured to allow a chemical plating solution to flow into it, the surface metallization treatment device is a chemical plating device, the first side surface is a horizontal plane, and the template is located above the support seat.

14. A method for preparing grid lines of a solar cell, characterized in that: Using the surface metallization treatment device according to any one of claims 1 to 13, the gate line preparation method comprises the following steps: S101, placing the solar cell to be plated on the support seat; S102, moving the template to the first side surface to contact the surface to be plated of the solar cell, so that a plating cavity is formed between each of the grooves and the surface to be plated of the product to be plated; S103, introducing a plating solution containing copper ions into the chamber, wherein the plating solution flows from the liquid outlet into each of the plating chambers to react on the imaged surface to be plated of the solar cell to form copper grid lines; Wherein, the waste plating solution after the reaction flows into the shell from the groove.

15. The gate line preparation method according to claim 14, characterized in that: In step S101, a patterned silver conductive layer with a thickness of less than 1 μm is pre-prepared on the solar cell; in step S103, a copper grid line with a thickness of 7 to 11.5 μm is stacked on the silver conductive layer.

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