A temperature value calculation method, an air conditioner control method, and an air conditioner

Abstract

The application provides a temperature value calculation method, an air conditioner control method and an air conditioner. The application establishes a temperature calculation method based on a heat transfer model by using a temperature output function built in an intelligent power module, combining the characteristics that the intelligent power module and a power factor correction module in an air conditioner drive board have the same or similar heat transfer structure. The accuracy of the heat transfer model is verified by obtaining an ambient temperature (a second temperature value) and a power value of the intelligent power module, calculating a temperature (a third temperature value) of the intelligent power module, and using the temperature (the third temperature value) as a verification. In the case that the model verification is passed, the temperature (a fourth temperature value) of the power factor correction module is calculated by further combining a power value and an ambient temperature of the power factor correction module and the heat transfer model of the power factor correction module. The method can accurately calculate the temperature of the power device of the power factor correction module in the air conditioner drive board without adding an additional temperature sensor.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of air conditioners, and in particular to a temperature value calculation method, an air conditioner control method and an air conditioner. BACKGROUND

[0002] A power factor correction module (PFC) is one of the functional modules in an air conditioner drive board. Its main function is to improve the power factor of the air conditioner during operation, reduce power grid harmonic interference and improve energy utilization efficiency. The PFC power circuit adjusts the waveform of the input current through the rectification and control circuit, so that it is more synchronized with the input voltage waveform, thereby reducing the loss of reactive power.

[0003] In the prior art, how to determine the temperature of the PFC power circuit in the air conditioner drive board without additionally increasing the temperature sensor is a technical problem to be solved. SUMMARY

[0004] The present application aims to overcome the above technical deficiencies and provide a temperature value calculation method, an air conditioner control method and an air conditioner to solve the problem of how to determine the temperature of the PFC power circuit in the air conditioner drive board without additionally increasing the temperature sensor in the related art.

[0005] To achieve the above technical purpose, the present application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a temperature value calculation method, which comprises:

[0007] During the operation of the air conditioner, a first temperature value, a second temperature value, a power value of an intelligent power module and a power value of a power factor correction module are obtained. The intelligent power module and the power factor correction module have the same or similar heat transfer structure. The first temperature value is the temperature value output by the intelligent power module, and the second temperature value is the ambient temperature value of the air conditioner drive board.

[0008] Based on the second temperature value, the power value of the intelligent power module and a preset heat transfer model of the intelligent power module, a third temperature value is calculated. The heat transfer model of the intelligent power module is constructed based on the heat transfer structure of the intelligent power module.

[0009] It is determined whether the difference between the first temperature value and the third temperature value is less than or equal to a first preset threshold value.

[0010] In a case that the second temperature value is less than or equal to a first preset threshold, a fourth temperature value is calculated based on the second temperature value, a power value of the power factor correction module and a preset heat transfer model of the power factor correction module, wherein the heat transfer model of the power factor correction module is constructed in advance based on a heat transfer structure of the power factor correction module.

[0011] In a second aspect, the application provides a control method of an air conditioner, comprising:

[0012] It is judged whether the fourth temperature value is in a first target temperature interval or a second target temperature interval, wherein the fourth temperature value is calculated by the above method; the first target temperature interval represents a temperature interval in which a protection operation control strategy needs to be taken; the second target temperature interval represents a temperature interval in which a shutdown protection needs to be taken, and a lower limit value of the second target temperature interval is greater than or equal to an upper limit value of the first target temperature interval.

[0013] In a case that the fourth temperature value is in the first target temperature interval, a preset protection operation control strategy is executed to perform a cooling process on the power factor correction module.

[0014] In a case that the fourth temperature value is in the second target temperature interval, the air conditioner is at least controlled to be shutdown.

[0015] In a third aspect, the application provides an air conditioner comprising a controller, which is used to execute the above temperature value calculation method or the above control method of the air conditioner.

[0016] Advantages:

[0017] The application establishes a temperature calculation method based on a heat transfer model by using a temperature output function built in an intelligent power module, combining the characteristics that the intelligent power module and the power factor correction module in the air conditioner drive board have the same or similar heat transfer structure. The temperature of the intelligent power module (third temperature value) is calculated by obtaining the ambient temperature (second temperature value) and the power value of the intelligent power module, and the accuracy of the heat transfer model is verified. In a case that the model verification is passed, the temperature of the power factor correction module (fourth temperature value) is calculated by the heat transfer model of the power factor correction module in combination with the power value and the ambient temperature of the power factor correction module. This method can accurately calculate the temperature of the power device of the power factor correction module in the air conditioner drive board without adding an additional temperature sensor, thereby effectively solving the technical problem of how to determine the temperature of the PFC power circuit in the air conditioner drive board without adding an additional temperature sensor in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1is a flowchart of a temperature value calculation method provided by an embodiment of the present application.

[0019] Figure 2 is a flowchart of a control method of an air conditioner provided by an embodiment of the present application.

[0020] Figure 3 is a flowchart of a control method of an air conditioner provided by an embodiment of the present application.

[0021] Figure 4 is a heat transfer structure of an intelligent power module and a power factor correction module provided by an embodiment of the present application.

[0022] Figure 5 is a block diagram of an air conditioner drive board provided by an embodiment of the present application. DETAILED DESCRIPTION

[0023] In order for those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should be within the scope of protection of the present application.

[0024] In the related art, the air conditioner drive board is the core circuit board in the air conditioner, used to drive and control various functional modules of the air conditioner. The air conditioner drive board usually contains multiple high-power devices, such as a power factor correction (PFC) module and an intelligent power module (IPM). The PFC module is a kind of power electronic module, used to improve the power factor of electrical equipment, so as to optimize the use efficiency of electric energy. The power factor is a key indicator to measure the efficiency of electric energy utilization, and a high power factor means that more electric energy is effectively used, instead of being wasted on reactive power. The IPM module is a highly integrated power electronic module, integrating power devices (such as IGBT or MOSFET), drive circuits and protection circuits. The IPM module is a core module for controlling and driving large-power devices such as motors and compressors.

[0025] The power devices in the PFC module and the IPM module will generate a large amount of heat during the operation of the air conditioner, and excessive temperature may cause damage or performance degradation of the power devices, thereby affecting the normal operation of the air conditioner. In order to ensure the reliability and safety of the air conditioner, it is crucial to monitor the temperature of these power devices in real time and take appropriate control measures.

[0026] In the prior art, the temperature of a power device is usually monitored by directly installing a temperature sensor on the power device. For example, a separate temperature sensor is added to an IGBT or a diode of a PFC module to monitor the temperature of the device in real time. However, this method has the following obvious defects:

[0027] Firstly, the addition of an extra temperature sensor significantly increases the hardware cost, especially when multiple sensors are needed to monitor multiple devices, and the cost accumulation effect is more significant.

[0028] Then, with each additional temperature sensor, a corresponding set of circuits and signal acquisition channels needs to be added, which not only complicates the hardware design of the drive board, but also may increase signal interference and errors.

[0029] Finally, the temperature sensor may age, drift or even be damaged over time, increasing the complexity and cost of equipment maintenance.

[0030] Therefore, how to determine the temperature of the PFC power circuit in the air conditioner drive board without adding additional temperature sensors is a technical problem to be solved.

[0031] The present application calculates the temperature value of the PFC module by using the temperature output function of the IPM module in the air conditioner drive board and combining a heat transfer model, thereby achieving real-time temperature monitoring of the PFC module without adding additional temperature sensors.

[0032] As shown in Figure 1 The present embodiment provides a temperature value calculation method, characterized in that the execution subject of the method can be a controller, and the method can include:

[0033] Step S12: During the operation of the air conditioner, a first temperature value, a second temperature value, a power value of an intelligent power module, and a power value of a power factor correction module are obtained; wherein the intelligent power module and the power factor correction module have the same or similar heat transfer structure; wherein the first temperature value is a temperature value output by the intelligent power module, and the second temperature value is an ambient temperature value of the air conditioner drive board.

[0034] In the present embodiment, the operation of the air conditioner can mean the normal operation of the air conditioner.

[0035] In the present embodiment, the step of obtaining the first temperature value can be:

[0036] Firstly, the controller obtains the real-time output voltage value of the intelligent power module through the temperature output pin of the intelligent power module.

[0037] Then, the controller calculates the first temperature value according to a preset temperature-voltage corresponding curve of the intelligent power module.

[0038] In the embodiment, the step of obtaining the second temperature value can be:

[0039] Firstly, the controller sends a request to a preset ambient temperature package to obtain the second temperature value. The ambient temperature package can be arranged near the driving board of the air conditioner, and can collect the ambient temperature value of the driving board of the air conditioner.

[0040] Specifically, during the operation of the air conditioner, the controller sends a request to the ambient temperature package according to a predetermined operation logic (for example, every fixed time period or at the time of event triggering) to require the ambient temperature package to provide the current ambient temperature value. The ambient temperature package can be connected to the controller through a physical or wireless communication interface. For example, the controller can send a temperature reading instruction to the temperature package through an I2C bus; the controller can send a communication request to the temperature package through an SPI bus; the controller can also send a data reading instruction through a serial port protocol; and the controller can also send a temperature reading instruction through a wireless protocol (for example, BLE or ZigBee).

[0041] It can be understood that the ambient temperature package can be integrated with a temperature sensor (for example, an NTC thermistor, a digital temperature sensor, etc.) inside. The temperature sensor can measure the current ambient temperature and convert the analog signal into a digital signal. The processing unit of the ambient temperature package can calibrate and process the temperature data and convert it into a standardized temperature value (such as Celsius). The ambient temperature package can store the processed temperature value in its internal register and wait for the controller to read.

[0042] Then, the controller receives the second temperature value returned by the ambient temperature package.

[0043] In the embodiment, the step of obtaining the power value of the intelligent power module can be:

[0044] Firstly, the controller obtains the real-time input current value of the intelligent power module by detecting the current signal at the input end of the intelligent power module. Specifically, the controller detects the current flowing through the intelligent power module through a current sampling circuit (current detection resistor or Hall sensor) connected to the input end of the intelligent power module. The current sampling circuit converts the detected current signal into a voltage signal and converts the analog signal into a digital signal through an analog-to-digital converter (ADC). The controller reads the digital signal output by the analog-to-digital converter and calculates the actual input current according to the calibration parameters (for example, resistance value) of the current sampling circuit.

[0045] Then, the controller obtains the real-time input voltage value of the intelligent power module by detecting the voltage signal at the input terminal of the intelligent power module. Specifically, the controller obtains the voltage at the input terminal of the intelligent power module through a voltage dividing circuit or a directly connected voltage sensor. The voltage signal is converted into a digital signal through an analog-to-digital converter (ADC). The controller reads the digital output of the analog-to-digital converter and calculates the actual input voltage according to the calibration parameters (for example, the voltage dividing ratio) of the voltage detection circuit.

[0046] Finally, the controller calculates the real-time power value of the intelligent power module using the obtained input current value and input voltage value. Specifically, if the intelligent power module works in a pulse modulation mode (PWM mode), the input current value and the input voltage value may be dynamically changing, and the controller can calculate the average power value.

[0047] In the present embodiment, the power value of the power factor correction module can be obtained in the same way, and details are not repeated here.

[0048] In the present embodiment, the air conditioner drive board can be a control circuit board for managing the operation of the air conditioner, which can integrate the controller, the power supply module, the power module (for example, the intelligent power module and the power factor correction module), and the temperature detection module.

[0049] Specifically, the air conditioner drive board can be a split-type air conditioner drive board, a central air conditioner drive board, a variable frequency air conditioner drive board, or a commercial air conditioner drive board.

[0050] In the present embodiment, the intelligent power module can be a highly integrated module integrating power switching devices (for example, IGBT or MOSFET), drive circuits, and protection circuits, which can be used to drive and control large power loads such as compressors, motors, or fans in air conditioners.

[0051] Specifically, the intelligent power module can be an IGBT-type intelligent power module, a MOSFET-type intelligent power module, or the like.

[0052] In the present embodiment, the power factor correction module can be a power electronic module for improving the efficiency of electrical energy utilization, which can adjust the input current waveform to be consistent with the grid voltage waveform, thereby optimizing the power factor.

[0053] Specifically, the power factor correction module can be a single-stage power factor correction module, a two-stage power factor correction module, a boost-type power factor correction module, a three-phase power factor correction module, or the like.

[0054] In the present embodiment, the smart power module and the power factor correction module are configured in the same air conditioner drive board, and have the same or similar heat transfer structure.

[0055] The heat transfer structure can represent how the heat generated inside the smart power module and the power factor correction module is conducted to the external heat sink through the heat transfer path, and finally diffused into the ambient environment of the drive board.

[0056] In a specific embodiment, the smart power module and the power factor correction module can have the same heat transfer structure. The smart power module and the power factor correction module have the same heat transfer structure, which means that their heat transfer paths and thermal resistance components are basically consistent.

[0057] Specifically, the heat transfer structure of the smart power module and the power factor correction module can be:

[0058] 1. The heat transfer path of the power device to the module housing (first thermal resistance):

[0059] The heat generated by the power device inside the smart power module (e.g., IGBT or MOSFET) and the power device inside the power factor correction module (e.g., diode, MOSFET or IGBT) is transferred to the module housing through the power device bottom heat conduction layer. It can be understood that due to the possible differences in chip packaging of the two modules (e.g., chip size, material, heat conduction interface, etc.), the specific thermal resistance value of the first thermal resistance can be different, but the transfer path is consistent.

[0060] 2. The heat transfer path of the module housing to the heat-conducting silicone grease layer (second thermal resistance):

[0061] The module housing is connected with the heat sink through the heat-conducting silicone grease layer, which serves as an intermediate medium for heat transfer and has consistent heat conduction performance. The smart power module and the power factor correction module can use the same type and thickness of heat-conducting silicone grease, so the thermal resistance value of the second thermal resistance can be the same. It can be understood that the smart power module and the power factor correction module can also not use the same type and thickness of heat-conducting silicone grease, so the thermal resistance value of the second thermal resistance can also be different.

[0062] 3. The heat transfer path of the heat-conducting silicone grease layer to the heat sink (third thermal resistance):

[0063] The smart power module and the power factor correction module are in direct contact with the heat sink, and the heat sink uniformly distributes and dissipates the heat to the surrounding environment through high-thermal-conductivity materials (e.g., aluminum profiles or copper profiles). Since the smart power module and the power factor correction module are both installed in parallel on the same heat sink, the thermal resistance value of the heat sink part can be the same.

[0064] It can be understood that the intelligent power module and the power factor correction module both transfer heat to the heat sink and dissipate to the environment through the same heat transfer path (first thermal resistance → second thermal resistance → third thermal resistance), ensuring the consistency of the heat transfer structure. Although the specific thermal resistance value of the first thermal resistance may be different due to the differences in internal structure and chip packaging of the modules, this does not affect the heat transfer model constructed based on the same heat transfer path. That is, in temperature calculation, the thermal resistance value is obtained through experimental and empirical data calibration. Even if the value of the first thermal resistance is different, as long as the thermal resistance parameters of the corresponding module are substituted into the calculation model, the temperature value can still be accurately calculated.

[0065] Specifically, in one specific scenario example, the intelligent power module and the power factor correction module are both installed on a long strip-shaped heat sink, one side of the heat sink is connected to the refrigerant pipe, and the other side is connected to the cooling air duct outside the drive board. The heat sink material is aluminum profile, the bottom thickness is uniform, the fin height is consistent, the air flow passage design is the same, and the fan provides the same cooling air field. The thickness of the thermal conductive silicone grease is controlled within 0.1 mm, and the thermal conductivity coefficient is 8.5 W / mK, ensuring efficient heat transfer. The heat transfer path is: power device → module housing → thermal conductive silicone grease → heat sink → air or refrigerant pipe.

[0066] In one specific embodiment, the intelligent power module and the power factor correction module can have the same heat transfer structure. Specifically, the heat transfer structure of the intelligent power module and the power factor correction module can be:

[0067] 1. The heat transfer path of the power device to the module substrate (first thermal resistance):

[0068] The heat generated inside the power device (e.g., IGBT, MOSFET, or diode) of the intelligent power module and the power factor correction module is transferred to the module substrate through the thermal conductive interface material (e.g., solder layer or thermal conductive adhesive layer) at the bottom of the chip. The module substrate can use high-thermal-conductivity ceramic substrate (e.g., aluminum nitride ceramic or aluminum oxide ceramic) or metal substrate (e.g., copper substrate or aluminum substrate). Due to the differences in power device packaging and substrate material of the two modules, the specific thermal resistance value of the first thermal resistance may be different, but the heat transfer path of both is power device → thermal conductive interface layer → module substrate.

[0069] 2. The heat transfer path of the module substrate to the heat sink (second thermal resistance):

[0070] The heat transfer between the module substrate and the heat sink is through a thermal pad (e.g. graphite pad or thermally conductive and electrically insulating pad). The thermal pad has both thermal conductivity and electrical insulation. The material and thickness of the thermal pad can be the same or different. If the same type of thermal pad (e.g. graphite pad with the same thickness) is used for both modules, the second thermal resistance can be the same. If different pad materials or thicknesses are selected based on the module's power requirement, the second thermal resistance can be different.

[0071] 3. Heat transfer path from the heat sink to the cooling channel (third thermal resistance):

[0072] The heat sink on the module substrate is in direct contact with the external cooling channel, which can be a forced air cooling channel or a liquid cooling channel. Both modules share the same cooling channel, and the material (e.g. aluminum alloy or copper) and geometry of the heat sink can be the same, so the third thermal resistance can have the same thermal resistance value.

[0073] In a specific embodiment, the intelligent power module and the power factor correction module can have similar heat transfer structures. Specifically:

[0074] The heat transfer structure of the intelligent power module can be a heat transfer structure with 3 layers of thermal resistance:

[0075] 1. Heat transfer path from the power device to the module housing (first thermal resistance):

[0076] The heat generated by the power device (e.g. IGBT or MOSFET) inside the intelligent power module is transferred to the module housing through the device bottom thermal layer. The thermal layer can be a solder layer or a thermally conductive adhesive material, with low thermal resistance.

[0077] 2. Heat transfer path from the module housing to the thermal silicone grease layer (second thermal resistance):

[0078] The module housing is connected to the heat sink through the thermal silicone grease, which serves as a medium for heat transfer.

[0079] 3. Heat transfer path from the thermal silicone grease layer to the heat sink (third thermal resistance):

[0080] The thermal silicone grease layer transfers heat to the heat sink, which dissipates heat to the environment through natural convection or forced convection.

[0081] The heat transfer structure of the power factor correction module can be a heat transfer structure with 4 layers of thermal resistance:

[0082] 1. Heat transfer path from the power device to the module substrate (first thermal resistance):

[0083] The heat generated by the power devices (e.g. diodes or MOSFETs) inside the PFC module is transferred through the thermal interface material to the module substrate. The substrate material can be a ceramic substrate (e.g. aluminum nitride or aluminum oxide) or a metal substrate (copper).

[0084] 2. Thermal transfer path from module substrate to module housing (second thermal resistance):

[0085] The heat transfer path from the module substrate to the module housing requires an additional interface layer (e.g. adhesive material or thermal interface material). This additional thermal resistance (second thermal resistance) exists in the PFC module, but its value is small and has limited impact on the overall thermal transfer performance.

[0086] 3. Thermal transfer path from module housing to thermal grease layer (third thermal resistance):

[0087] The module housing is connected to the heat sink through the thermal grease, which serves as the medium for heat transfer.

[0088] 4. Thermal transfer path from thermal grease layer to heat sink (fourth thermal resistance):

[0089] The thermal grease layer transfers heat to the heat sink, which dissipates heat to the environment through natural or forced convection.

[0090] It can be understood that the heat transfer paths of both modules include the process of transferring heat from the power devices to the module housing, then to the thermal grease layer and the heat sink, and finally to the environment. The heat transfer structures of the intelligent power module and the PFC module both belong to a series heat transfer path (parallel between the intelligent power module and the PFC module, which can be connected to the same heat sink), and the heat of both modules is finally transferred to the environment through the same heat sink. The heat transfer paths of the two modules have high similarity, both including the transfer process from the power devices to the module housing (or substrate), the module housing to the thermal grease, and the thermal grease to the heat sink.

[0091] The intelligent power module and the PFC module are both connected to the environment through the heat transfer path of the heat sink, so the heat transfer structures of the two modules belong to the same nature in essence. Once the heat transfer model of the intelligent power module is verified to be correct (the first temperature value and the third temperature value calculated by the heat transfer model match), it can be inferred that the heat transfer model of the PFC module is also correct. The reason is that the heat transfer paths of the two modules (although there are slight differences in the number of layers or details) belong to the same nature in essence, and the calculation logic of the heat transfer model is the same, and the difference in individual thermal resistance will not affect the accuracy of the overall heat transfer model.

[0092] Step S14: calculating a third temperature value based on the second temperature value, the power value of the intelligent power module, and a preset heat transfer model of the intelligent power module. The heat transfer model of the intelligent power module is constructed based on the heat transfer structure of the intelligent power module.

[0093] In the embodiment, the second temperature value and the power value of the intelligent power module can be input into the preset heat transfer model of the intelligent power module, so as to calculate the third temperature value.

[0094] In the embodiment, the heat transfer model of the intelligent power module can be:

[0095] The third temperature value is equal to the second temperature value plus the power value of the intelligent power module multiplied by the total thermal resistance. The total thermal resistance is the sum of the first thermal resistance, the second thermal resistance, and the third thermal resistance. The first thermal resistance represents the thermal resistance between the power device and the corresponding module housing. The second thermal resistance represents the thermal resistance between the corresponding module housing and the heat-conducting silicone layer. The third thermal resistance represents the thermal resistance of the heat sink.

[0096] In a specific embodiment, the expression of the heat transfer model of the intelligent power module can be:

[0097]

[0098] In the formula, represents the third temperature value, represents the first thermal resistance, represents the second thermal resistance, represents the third thermal resistance, represents the second temperature value, represents the power value of the intelligent power module. Wherein, represents the thermal resistance of the multiple heat transfer paths inside the intelligent power module. It can be understood that, , … may be the heat transfer path from the IGBT or MOSFET die inside the intelligent power module to the module housing; may be the heat transfer path from the diode and other power devices in the intelligent power module to the housing; may also be the coupled heat transfer path between different devices (such as IGBT and diode).

[0099] Step S16: determining whether the difference between the first temperature value and the third temperature value is less than or equal to a first preset threshold value.

[0100] In the embodiment, the first preset threshold value can be a tolerance value set based on the temperature sensor accuracy of the intelligent power module and the heat transfer model error range, for verifying the accuracy of the heat transfer model of the intelligent power module.

[0101] Specifically, first, the first temperature value of the intelligent power module is detected by its internal temperature output pin, and the detection value can have a certain measurement error. For example, if the temperature sensor accuracy of the intelligent power module is ±1°C, the preset threshold value can cover the measurement error. Then, the third temperature value calculated by the heat transfer model is based on the second temperature value (ambient temperature), the power value of the module and the thermal resistance data, wherein the power value of the module and the thermal resistance data can be deviated due to experimental calibration error and environmental fluctuation and other factors. Therefore, the first preset threshold value can be the comprehensive value of the temperature sensor error and the heat transfer model error, which ensures that the calculation result of the model can be determined to be accurate within the range. For example, if the temperature sensor error is ±1°C and the model error is ±1.5°C, the first preset threshold value can be set to ±2.5°C.

[0102] Step S18: In the case of less than or equal to the first preset threshold value, a fourth temperature value is calculated based on the second temperature value, the power value of the power factor correction module and the preset heat transfer model of the power factor correction module; wherein the heat transfer model of the power factor correction module is constructed in advance based on the heat transfer structure of the power factor correction module.

[0103] In the present embodiment, the second temperature value and the power value of the power factor correction module can be input into the preset heat transfer model of the power factor correction module for calculation, thereby obtaining the fourth temperature value.

[0104] The preset heat transfer model of the power factor correction module is:

[0105] The fourth temperature value is equal to the second temperature value plus the power value of the power factor correction module multiplied by the total thermal resistance.

[0106] In a specific embodiment, the preset heat transfer model of the power factor correction module is:

[0107]

[0108] In the formula, represents the fourth temperature value, represents the first thermal resistance, represents the second thermal resistance, represents the third thermal resistance, represents the second temperature value, represents the power value of the power factor correction module; wherein, represents the thermal resistance of the multiple heat transfer paths inside the power factor correction module. It can be understood that the The heat transfer path can be from the die of an IGBT switching device and other power devices (diodes) inside the power factor correction module to the module housing, or the heat transfer path of various devices (such as transistors, inductors, and filters) inside the module, or an independent heat path formed by the thermal coupling effect between the devices due to series or parallel connection.

[0109] It can be understood that the intelligent power module and the power factor correction module have the following common or similar physical properties in the heat transfer process:

[0110] Both contain power devices (for example, IGBT, MOSFET, diode), which are the main heat sources, and the heat generated by the power devices is dissipated through the heat transfer path.

[0111] The heat transfer path of both includes power devices, module housing, thermally conductive interface material (such as thermally conductive silicone grease), heat sink, and other parts, which have high similarity in thermal resistance structure.

[0112] Both are affected by the air conditioner drive board ambient temperature (the second temperature value).

[0113] Therefore, the same or similar heat transfer structure is the consistent physical basis for building the heat transfer model of both.

[0114] It can also be understood that the heat transfer model needs to be built based on the actual physical structure. If the heat transfer structures of both are different, the building foundation of the model cannot be unified, resulting in a large difference in the properties of the models of both. Since both have the same or similar heat transfer paths (such as the path from the power device to the housing, the path from the housing to the heat sink, etc.), the calculation method of the thermal resistance and the heat transfer formula have comparability, thereby laying the foundation for building models with the same properties.

[0115] The present application establishes a temperature calculation method based on a heat transfer model by utilizing the temperature output function built-in the intelligent power module, combining the characteristics that the intelligent power module and the power factor correction module in the air conditioner drive board have the same or similar heat transfer structure. By obtaining the ambient temperature (the second temperature value) and the power value of the intelligent power module, the temperature (the third temperature value) of the intelligent power module is calculated, and the accuracy of the heat transfer model is verified. In the case that the model verification is passed, further combining the power value and the ambient temperature of the power factor correction module, the temperature (the fourth temperature value) of the power factor correction module is calculated through the heat transfer model of the power factor correction module. This method can accurately calculate the temperature of the power devices of the power factor correction module in the air conditioner drive board without adding additional temperature sensors, thereby effectively solving the technical problem of how to determine the temperature of the PFC power circuit in the air conditioner drive board without adding additional temperature sensors in the prior art.

[0116] In some embodiments, the step of obtaining the first temperature value comprises:

[0117] Step S122: Obtain the real-time output voltage value of the intelligent power module through the temperature output pin of the intelligent power module.

[0118] In this embodiment, the controller reads the output voltage value of the temperature output pin connected to the intelligent power module in real time. The temperature output pin of the intelligent power module outputs a voltage signal related to the temperature according to the temperature change inside the module. The controller converts the analog voltage signal of the output pin into a digital signal using an internal ADC (analog-to-digital converter) module for subsequent calculation and processing.

[0119] Step S124: Calculate the first temperature value according to the preset temperature-output voltage corresponding curve of the intelligent power module.

[0120] In this embodiment, the controller has a pre-stored temperature-output voltage corresponding curve data table of the intelligent power module. This data table can be generated by the module manufacturer or laboratory tests to ensure its accuracy and reliability. The controller looks up the corresponding temperature value from the temperature-voltage corresponding table according to the collected real-time output voltage value. If the actual voltage value is not on the defined point in the table, the controller can calculate the accurate temperature value through an interpolation algorithm (such as linear interpolation). The controller stores the calculated first temperature value in the internal memory and provides it for subsequent temperature judgment or model calculation modules.

[0121] In this embodiment, the real-time output voltage value of the intelligent power module is directly obtained through the temperature output pin, and the first temperature value of the intelligent power module is calculated by combining the preset temperature-output voltage corresponding curve. This scheme has the following significant benefits: without the need for additional temperature sensors, it only relies on the existing hardware resources of the intelligent power module to achieve accurate monitoring of the module temperature. This not only simplifies the hardware design and reduces the cost, but also avoids errors that may be caused by improper installation or layout of external sensors. At the same time, by utilizing the temperature output characteristics of the module itself, the internal thermal state of the module can be reflected in real time, providing reliable basic data for subsequent heat transfer model verification and related temperature calculation.

[0122] In some embodiments, the power factor correction module and the intelligent power module have the same heat transfer structure in the air conditioner drive board, and the power factor correction module and the intelligent power module are arranged in the same heat sink, and the heat sink is used for dissipating heat of the power factor correction module and the intelligent power module.

[0123] The preset heat transfer model of the intelligent power module is:

[0124] the third temperature value is equal to the second temperature value plus the power value of the intelligent power module multiplied by the thermal resistance sum; wherein the thermal resistance sum is the sum of the first thermal resistance, the second thermal resistance and the third thermal resistance; wherein the first thermal resistance is the thermal resistance between the power device and the corresponding module housing; the second thermal resistance is the thermal resistance between the corresponding module housing and the thermal conductive silicone grease layer; and the third thermal resistance is the thermal resistance of the heat sink;

[0125] the preset thermal transfer model of the power factor correction module is:

[0126] the fourth temperature value is equal to the second temperature value plus the power value of the power factor correction module multiplied by the thermal resistance sum.

[0127] In the embodiment, by configuring the power factor correction module and the intelligent power module on the same heat sink in the air conditioner drive board and ensuring that the two modules have the same thermal transfer structure, the uniformity of the thermal transfer model and the simplification of the calculation logic can be ensured. Since the thermal transfer paths (including the first thermal resistance, the second thermal resistance and the third thermal resistance) of the two modules are consistent, and the thermal transfer model thereof is preset before the air conditioner is running, it is not necessary to configure or adjust the thermal transfer model in real time during the running process. By verifying whether the thermal transfer model of the intelligent power module is accurate (i.e. by comparing the third temperature value with the first temperature value), it can be ensured that the thermal transfer model of the power factor correction module is also reliable under the same logic. Subsequently, the fourth temperature value is calculated based on the preset thermal transfer model of the power factor correction module, so as to realize accurate estimation of the temperature of the power device inside the module. This method not only improves the reliability of model construction and verification, but also avoids hardware modification and real-time adjustment during the running process, reduces the system complexity, and improves the running safety and temperature control effect of the air conditioner.

[0128] In some embodiments, the preset thermal transfer model of the power factor correction module is:

[0129]

[0130] In the formula, represents the fourth temperature value, represents the first thermal resistance, represents the second thermal resistance, represents the third thermal resistance, represents the second temperature value, represents the power value of the power factor correction module; wherein, represents the thermal resistance of the plurality of thermal transfer paths inside the power factor correction module.

[0131] It can be understood that the first thermal resistance adopts a parallel thermal resistance calculation method, which can more accurately reflect the actual heat flow distribution of multiple heat transfer paths inside the power factor correction module. Since there may be multiple heat transfer paths in the multiple power devices or different regions of the power devices inside the module, the thermal resistance values of these paths are different, but they jointly affect the overall heat transfer efficiency. By using the parallel thermal resistance calculation method, the thermal resistances of these different paths can be equivalent to a comprehensive thermal resistance, thereby simplifying the calculation model and ensuring that the calculation result is closer to the actual situation. In addition, the parallel thermal resistance calculation method can effectively consider the differences in the contribution of each heat transfer path to the overall heat flow, improving the accuracy and universality of the model calculation, so that the heat transfer model can accurately reflect the complex thermal resistance characteristics and is convenient for rapid operation and verification in actual application.

[0132] In the embodiment, by the preset power factor correction module heat transfer model, the thermal resistances of multiple heat transfer paths inside the module are calculated in parallel to obtain the comprehensive thermal resistance of the module, and combined with the external thermal resistance (Rth) and ) and the ambient temperature, the fourth temperature value of the power device inside the power factor correction module is finally calculated. The beneficial effect of this method is that by determining the multiple heat transfer paths inside the power factor correction module and their thermal resistance parameters, and combining the power value of the module and the ambient temperature value, the heat transfer model of the power factor correction module can be accurately constructed, thereby realizing accurate calculation of the internal temperature of the power factor correction module without adding additional sensors. This model calculation method can avoid complex real-time measurement hardware requirements and improve system operation efficiency and reliability.

[0133] As shown in Figure 2 , the control method of the air conditioner provided in the embodiment can also be executed by the controller, and the method can include:

[0134] Step S22: determining whether the fourth temperature value is in a first target temperature interval or a second target temperature interval; wherein the fourth temperature value is calculated by the temperature value calculation method provided in the above embodiment; wherein the first target temperature interval is a temperature interval indicating that a protection operation control strategy needs to be taken; and the second target temperature interval is a temperature interval indicating that a shutdown protection needs to be taken, and the lower limit value of the second target temperature interval is greater than or equal to the upper limit value of the first target temperature interval.

[0135] In the embodiment, the controller receives the fourth temperature value calculated according to the calculation method of the temperature value, and compares the fourth temperature value with the first target temperature interval and the second target temperature interval set in advance. Specifically, the controller first determines whether the fourth temperature value falls within the first target temperature interval, which represents a temperature range in which the protection operation control strategy needs to be taken. If the fourth temperature value is not within the first target temperature interval, it is further determined whether the fourth temperature value falls within the second target temperature interval, which represents a temperature range in which the shutdown protection needs to be taken. Through such determination, the controller can distinguish the temperature range in which the current fourth temperature value is located, and take corresponding control strategy according to the determination result. It can be understood that if the fourth temperature value is neither in the first target temperature interval nor in the second target temperature interval, it means that it is in a normal operation state, and the following control operation can not be performed.

[0136] Step S24: In the case that the fourth temperature value is in the first target temperature interval, a preset protection operation control strategy is executed to perform cooling processing on the power factor correction module.

[0137] In the embodiment, when the controller determines that the fourth temperature value is in the first target temperature interval, a preset protection operation control strategy is started to reduce the temperature of the power factor correction module to prevent it from continuing to rise and exceeding the safety range. Specifically, the controller executing the preset protection operation control strategy can be:

[0138] Increasing the operating frequency of the fan to enhance air convection and heat dissipation efficiency;

[0139] Reducing the temperature of the refrigerant pipe to improve the heat dissipation performance of the power factor correction module through the refrigerant heat dissipation system;

[0140] Adjusting the operating mode of the air conditioner, for example, limiting the power output of the power factor correction module to reduce the heat generated by its power consumption;

[0141] Dynamically adjusting the fan operating mode, for example, by controlling the start / stop mode of the fan, dynamically adjusting its operating time and wind field distribution, so as to reduce power consumption while ensuring heat dissipation efficiency;

[0142] Increasing the flow rate of the refrigerant or increasing the circulation speed of the refrigerant to improve the heat absorption capacity of the refrigerant and reduce the temperature of the power factor correction module.

[0143] Through the above control strategies, the controller can effectively reduce the temperature of the power factor correction module within the first target temperature interval, thereby avoiding potential damage to the module and system caused by further temperature rise.

[0144] Step S26: In the case that the fourth temperature value is in the second target temperature interval, at least the air conditioner is controlled to be shut down.

[0145] In the embodiment, when the controller determines that the fourth temperature value is in the second target temperature interval, it indicates that the temperature of the power factor correction module has exceeded the threshold for safe operation, and there is a potential risk of over-temperature. In order to avoid irreversible damage to the power factor correction module caused by high temperature, the controller immediately controls the air conditioner to stop running and stops all running tasks related to the power factor correction module. At the same time, the controller can trigger a preset alarm mechanism, for example, send an alarm message to the user interface to prompt the user that the power factor correction module has an over-temperature risk. Through this shutdown protection measure, the controller can terminate the operation of the module in time to avoid further damage, and at the same time improve the safety and reliability of the air conditioner.

[0146] The embodiment divides the fourth temperature value of the power factor correction module into a first target temperature interval and a second target temperature interval, thereby achieving accurate hierarchical management of the temperature of the power factor correction module. When the fourth temperature value is in the first target temperature interval, the air conditioner can automatically execute a protection operation control strategy, for example, increase the heat dissipation measures or adjust the running state, to effectively reduce the temperature of the power factor correction module, ensure that the power factor correction module runs within a safe range, and prolong its service life. When the fourth temperature value is in the second target temperature interval, the air conditioner can stop running in time to avoid more serious equipment failure caused by damage to the power factor correction module due to high temperature, thereby improving the safety and reliability of the air conditioner. Through the hierarchical temperature control management strategy, the embodiment can achieve a dynamic balance between temperature protection and stability, and significantly improve the efficiency and safety of the overall operation of the air conditioner.

[0147] In some embodiments, the step of executing a preset protection operation control strategy to perform cooling processing on the power factor correction module includes:

[0148] Increasing the running frequency of a preset fan to increase the wind field; wherein the fan is a fan that performs cooling on the power factor correction module.

[0149] In the embodiment, the controller monitors the temperature of the power factor correction module in real time, and determines whether the fourth temperature value obtained by the foregoing calculation is in the first target temperature range. When the controller detects that the fourth temperature value is in the first target temperature range, the controller sends a control instruction to the preset cooling fan to increase the operating frequency of the fan. The control instruction can specifically include a parameter value for increasing the rotating speed of the fan to ensure the enhancement of the wind field. After the rotating speed of the fan is increased, the air flow rate around the radiator is significantly increased, so that the heat on the surface of the power factor correction module is quickly taken away, and the temperature of the module is reduced. After the frequency of the fan is increased, the controller can continue to monitor the fourth temperature value. If the fourth temperature value is still not reduced to the safe range, the controller can further optimize the frequency of the fan until the fourth temperature value reaches the ideal range or triggers other protection measures.

[0150] Alternatively, the temperature of the refrigerant heat dissipation pipe is reduced to improve the refrigerant heat dissipation effect; wherein the refrigerant heat dissipation pipe is a refrigerant heat dissipation pipe for cooling the power factor correction module.

[0151] In the embodiment, the controller detects the current working state of the refrigerant system according to the real-time temperature of the power factor correction module, including the current temperature of the refrigerant pipe. When the controller detects that the fourth temperature value is in the first target temperature range, the controller sends an instruction to reduce the temperature of the refrigerant heat dissipation pipe of the refrigerant system. The specific operation can include: adjusting the operating power of the refrigerant compressor to enhance the refrigeration capacity of the refrigerant; adjusting the opening degree of the expansion valve to optimize the flow and temperature of the refrigerant; enhancing the heat dissipation effect of the condenser, and improving the refrigerant circulation efficiency by controlling the fan or other condensing devices. After the temperature of the refrigerant is reduced, the temperature difference of the refrigerant heat dissipation pipe is increased, and the heat of the radiator is more quickly transferred to the refrigerant pipe, so as to improve the overall heat dissipation performance and effectively reduce the temperature of the power factor correction module.

[0152] In the embodiment, the efficient cooling of the power factor correction module can be realized by increasing the operating frequency of the preset fan to increase the wind field and / or reducing the temperature of the refrigerant heat dissipation pipe to improve the refrigerant heat dissipation effect. The beneficial effects of this control strategy are as follows: first, by increasing the operating frequency of the fan, the air flow around the radiator is enhanced, and the heat dissipation of the module surface is accelerated, so that the temperature of the module is reduced; second, by optimizing the temperature setting of the refrigerant heat dissipation pipe, the heat absorption capacity of the refrigerant is further improved, and the overall heat dissipation effect is enhanced.

[0153] In some embodiments, the at least controlling the air conditioner to stop includes:

[0154] The air conditioner is controlled to stop and a preset first alarm measure is performed; wherein the first alarm measure is an alarm measure for prompting that the power factor correction module has a fault.

[0155] In the embodiment, the first alarm measure can be an audible and visual alarm. Specifically, a prompt sound is emitted through a built-in buzzer of the air conditioner, and an alarm indicator light is lit on the display panel to remind the user that the power factor correction module has a fault.

[0156] In the embodiment, the first alarm measure can be a display screen prompt. Specifically, prompt information such as “power factor correction module overheating, please check the equipment” is displayed on the display screen of the control panel of the air conditioner or the remote control terminal to provide specific fault information.

[0157] In the embodiment, the first alarm measure can be remote notification. For example, an alarm notification can be sent to the user's mobile phone APP, SMS or email through Wi-Fi or mobile network to inform the user of the overheating condition of the power factor correction module.

[0158] In the embodiment, by controlling the air conditioner to stop and executing the preset first alarm measure, when the temperature of the power factor correction module exceeds the second target temperature range (i.e. the temperature range that requires shutdown protection), the operation of the air conditioner can be interrupted in time to avoid damage to the power factor correction module or other critical components due to overheating, thereby improving the safety and reliability of the system. At the same time, the first alarm measure clearly prompts the possible fault information of the power factor correction module, providing a quick and accurate guide for subsequent equipment maintenance and troubleshooting, reducing system downtime and operation and maintenance costs, and further improving the user experience and use efficiency of the air conditioner.

[0159] In some embodiments, before the step of judging whether the fourth temperature value is in the first target temperature range or the second target temperature range, the method further comprises:

[0160] Step S201: When the air conditioner is started for the first time or restarted after a preset time of shutdown, the current first temperature value and the second temperature value are obtained.

[0161] In the embodiment, the controller monitors the state of the air conditioner, and triggers the temperature acquisition process when it is detected that the air conditioner is in the first power-on starting state, or the air conditioner is started from the shutdown state and the shutdown time has reached a preset time. The preset time can be set according to the environmental temperature stabilization time or the internal heat dissipation characteristics of the intelligent power module, for example, 10 minutes or more. The controller reads the real-time output voltage value through the temperature output pin of the intelligent power module. The controller converts the voltage value into the current first temperature value (i.e., the temperature of the intelligent power module) according to the preset temperature and output voltage corresponding curve. The controller sends a request to the ambient temperature sensing bag arranged near the drive board of the air conditioner. The ambient temperature sensing bag responds to the request, acquires the current ambient temperature value of the drive board of the air conditioner, and returns the value to the controller as the second temperature value.

[0162] Step S202: determining whether the difference between the first temperature value and the second temperature value is less than or equal to a second preset threshold value.

[0163] In the embodiment, the controller calculates the difference between the acquired first temperature value (the temperature of the intelligent power module) and the second temperature value (the ambient temperature) to obtain the difference.

[0164] In the embodiment, the second preset threshold value can be an error range determined according to the temperature output characteristics of the intelligent power module and the accuracy of the ambient temperature sensor. The first temperature value of the intelligent power module is calculated through the temperature output pin and the corresponding voltage-temperature curve, and there is often a certain sampling accuracy error. For example, the temperature sampling accuracy can be ±1°C. The second temperature value (ambient temperature) is acquired by the ambient temperature bag, and the ambient temperature bag itself also has a certain temperature measurement error, for example, ±0.5°C. Therefore, the second preset threshold value can be ±1.5°C.

[0165] Step S203: in the case of being greater than the second preset threshold value, performing a preset second alarm measure; wherein the second alarm measure is an alarm measure for prompting the temperature sampling abnormality of the intelligent power module.

[0166] In the embodiment, when the controller determines that the difference is greater than the second preset threshold value, the second alarm measure is triggered immediately to prompt that the temperature sampling of the intelligent power module can be abnormal. For example, the controller can display fault information on the display panel of the air conditioner, such as “temperature sampling abnormality of the intelligent power module”, and turn on the related alarm indicator light. The controller can send a fault alarm notification to the mobile terminal of the user through Wi-Fi or mobile network to prompt the user to check the equipment. The controller can record the alarm event in the internal storage of the air conditioner, including the time of the alarm occurrence, the first temperature value, the second temperature value, and the difference, etc., to facilitate subsequent fault diagnosis and maintenance.

[0167] In this embodiment, when the air conditioner is first started or restarted after a preset downtime, the current first temperature value (the temperature value output by the intelligent power module) and the second temperature value (the ambient temperature value) are first acquired, and the difference between the two is judged. This effectively verifies whether there is an abnormality in the temperature sampling of the intelligent power module. If the difference is greater than a second preset threshold, a preset second alarm measure is triggered, indicating that the temperature sampling of the intelligent power module may be abnormal. The beneficial effect of this method is that by comparing and checking the temperature at startup, the temperature sampling deviation or fault of the intelligent power module can be detected in time before the air conditioner starts running, avoiding the failure of subsequent temperature calculation and protection strategies due to sampling errors. Furthermore, this mechanism improves the reliability of air conditioner operation, provides a more accurate data basis for the temperature monitoring and protection of the power factor correction module, and effectively prevents potential faults or safety hazards caused by abnormal temperature sampling.

[0168] like Figure 3 As shown, in some embodiments, before the step of determining whether the fourth temperature value is within the first target temperature range or the second target temperature range, the method further includes:

[0169] Step S204: When the temperature is less than or equal to the second preset threshold, control the intelligent power module and the power factor correction module to run for a preset fixed time with a preset fixed duty cycle, and after running for the preset fixed time, update the current first temperature value.

[0170] In this embodiment, the controller first determines whether the difference between the first and second temperature values ​​from the previous steps is less than or equal to a second preset threshold. If the condition is met, this step is initiated. The controller can control the intelligent power module and the power factor correction module to run for a fixed period of time according to preset fixed duty cycle parameters. For example, the fixed duty cycle can be set to 50%, and the running time can be 60 seconds. After the fixed operation ends, the controller obtains the new real-time output voltage value through the temperature output pin of the intelligent power module, calculates the first temperature value after operation according to the preset temperature-voltage correspondence curve, and stores it as the updated first temperature value.

[0171] Step S205: Determine the reference temperature value of the intelligent power module from a preset data table based on the second temperature value; wherein, the data table is pre-configured with the reference temperature value of the intelligent power module after the intelligent power module and the power factor correction module have been running for a preset fixed time with a preset fixed duty cycle under different ambient temperatures.

[0172] In the present embodiment, the controller looks up the reference temperature value corresponding to the current second temperature value in a preconfigured data table. The data table preconfigures the reference temperature value of the smart power module after running the smart power module and the power factor correction module at a preconfigured fixed duty ratio for a fixed time under different ambient temperatures. It can be understood that if the second temperature value does not completely match the entries in the data table, the controller can use an interpolation algorithm (for example, linear interpolation) to calculate the closest reference temperature value.

[0173] Step S206: determining whether the difference between the reference temperature value of the smart power module and the updated first temperature value is less than or equal to a third preset threshold value;

[0174] In the present embodiment, the controller can calculate the difference between the updated first temperature value (obtained in step S204) and the reference temperature value (obtained in step S205). The controller compares the calculated difference with the third preset threshold value. The third preset threshold value can be ±2℃, ±3℃ or ±3.5℃, etc.

[0175] If it is less than or equal to the third preset threshold value, it means that the temperature sampling of the smart power module is normal and meets the expectation, and the subsequent process can be entered.

[0176] If it is greater than the third preset threshold value, the next alarm processing is entered.

[0177] Step S207: in the case of being greater than the third preset threshold value, a preconfigured second alarm measure is executed.

[0178] In the present embodiment, when the controller determines that the difference is greater than the third preset threshold value, it is considered that the temperature sampling of the smart power module is abnormal, and the second alarm measure is triggered. For example, the controller displays alarm information on the display panel of the air conditioner, such as "smart power module temperature sampling abnormal, please check the equipment", and turns on the alarm indicator.

[0179] In the embodiment, by further controlling the intelligent power module and the power factor correction module to run for a fixed time at a preset fixed duty ratio when the second preset threshold meets the condition, and combining the ambient temperature value, the reference temperature value of the intelligent power module is obtained from the preset data table and compared with the updated actual first temperature value. The beneficial effect of this method is that through temperature sampling and comparison verification under fixed running conditions, the heat transfer model and the accuracy of temperature sampling of the intelligent power module can be effectively checked, so as to further confirm whether the temperature monitoring function of the module is normal. Through the pre-configuration of the data table, it can be ensured that the reference temperature value matches the actual running condition, and the accuracy of comparison is improved. If the comparison result shows that the difference exceeds the third preset threshold, the second alarm measure is executed in time, which can find potential temperature sampling abnormalities or heat model deviations before the air conditioner runs, avoid the failure of subsequent temperature control and protection strategies, and thus enhance the safety, reliability and temperature control ability of the system.

[0180] As shown in Figure 4 In one specific and possible embodiment, a heat transfer structure of an intelligent power module and the power factor correction module is provided:

[0181] The heat generated by the IGBT in the PFC circuit is sequentially transmitted through the heat-conducting silicone grease, the heat sink, and finally dissipated to the refrigerant pipe and the air through the heat convection. Among them, is the temperature of the IGBT in the PFC circuit; is the temperature of the heat-dissipating silicone grease; is the temperature of the heat sink; T is the temperature of the appliance box environment at this time (the temperature can be obtained by the appliance box environment temperature bag); is the thermal resistance of the multiple heat transfer paths between the body of the IGBT and the chip shell; is the thermal resistance of the heat-dissipating silicone grease; is the thermal resistance of the heat sink body.

[0182]

[0183] P is the total power of the power device; is the temperature difference; is the total thermal resistance, because the power device and the heat sink are in series mode, so:

[0184]

[0185] In the formula, represents the fourth temperature value, represents the first thermal resistance, represents the second thermal resistance, represents the third thermal resistance, represents a second temperature value, represents a power value of the power factor correction module; wherein, , … represents a thermal resistance of a plurality of heat transfer paths inside the power factor correction module.

[0186] The calculation formula of the thermal resistance can be calculated as follows:

[0187]

[0188] In the formula, σ is the thickness of the material along the heat flow direction; λ is the thermal conductivity; and S is the area of the material perpendicular to the heat flow direction.

[0189] As Figure 5 shown, according to an embodiment of the present application, an air conditioner comprises a controller configured to perform the above-mentioned temperature value calculation method or the above-mentioned air conditioner control method.

[0190] Specifically, in the embodiment, the controller can be configured in the same air conditioner drive board as the intelligent power module and the power factor correction module. The intelligent power module and the power factor correction module have the same or similar heat transfer structure.

[0191] In the embodiment, the controller can also be separately arranged and not configured in the same air conditioner drive board as the intelligent power module and the power factor correction module.

[0192] In the embodiment, the intelligent power module and the power factor correction module can also not be configured in the same air conditioner drive board. For example, the intelligent power module is configured in one air conditioner drive board, and the power factor correction module is configured in another air conditioner drive board, but in this case, the intelligent power module and the power factor correction module still have the same or similar heat transfer structure.

[0193] According to an embodiment of the present application, a computer readable storage medium is provided, which stores a computer program. When the computer program is executed by a computer, the computer performs the method described in any of the above embodiments.

[0194] According to an embodiment of the present application, a computer program product comprising instructions which, when executed by a computer, cause the computer to perform a method according to any of the above embodiments.

[0195] It should be noted that the terms "first", "second" and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the use of these terms is interchangeable under appropriate circumstances such that the descriptive

[0196] Optionally, the specific examples in the embodiments can refer to the examples described in the above embodiments, and the embodiments will not be described here again.

[0197] The serial numbers of the above embodiments of the present application are only for description, not representing the advantages and disadvantages of the embodiments.

[0198] In the above embodiments of the present application, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0199] The above only describes the preferred embodiments of the present application, and it should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which should be considered as the protection scope of the present application.

Claims

1. A method of calculating a temperature value, characterized by, The method comprises: During the operation of the air conditioner, a first temperature value, a second temperature value, a power value of an intelligent power module and a power value of a power factor correction module are acquired; wherein the intelligent power module and the power factor correction module have the same or similar heat transfer structure; wherein the first temperature value is a temperature value output by the intelligent power module, and the second temperature value is an ambient temperature value of an air conditioner driving board; Based on the second temperature value, the power value of the intelligent power module and a preset heat transfer model of the intelligent power module, a third temperature value is calculated; wherein the heat transfer model of the intelligent power module is constructed in advance based on the heat transfer structure of the intelligent power module; It is judged whether the difference between the first temperature value and the third temperature value is less than or equal to a first preset threshold value; In the case of being less than or equal to the first preset threshold value, based on the second temperature value, the power value of the power factor correction module and a preset heat transfer model of the power factor correction module, a fourth temperature value is calculated; wherein the heat transfer model of the power factor correction module is constructed in advance based on the heat transfer structure of the power factor correction module; The power factor correction module and the intelligent power module have the same heat transfer structure in the air conditioner driving board, and the power factor correction module and the intelligent power module are arranged in the same heat sink, and the heat sink is used for dissipating heat of the power factor correction module and the intelligent power module; The preset heat transfer model of the intelligent power module is: The third temperature value is equal to the second temperature value plus the power value of the intelligent power module multiplied by the total thermal resistance; The preset heat transfer model of the power factor correction module is: The fourth temperature value is equal to the second temperature value plus the power value of the power factor correction module multiplied by the total thermal resistance.

2. The method of claim 1, wherein, The step of acquiring the first temperature value comprises: The real-time output voltage value of the intelligent power module is acquired through the temperature output pin of the intelligent power module; According to the preset temperature and output voltage corresponding curve of the intelligent power module, the first temperature value is calculated.

3. The method of claim 1, wherein, The total thermal resistance is the sum of a first thermal resistance, a second thermal resistance and a third thermal resistance; wherein the first thermal resistance is the thermal resistance between the power device and the corresponding module shell; the second thermal resistance is the thermal resistance between the corresponding module shell and the heat-conducting silicone layer; and the third thermal resistance is the thermal resistance of the heat sink.

4. The method of claim 3, wherein, The preset heat transfer model of the power factor correction module is: In the formula, is represented as a fourth temperature value, is represented as a first thermal resistance, is represented as a second thermal resistance, is represented as a third thermal resistance, is represented as a second temperature value, is represented as a power value of the power factor correction module; wherein, is represented as a thermal resistance of a plurality of heat transfer paths inside the power factor correction module.

5. A control method of an air conditioner, characterized by, It comprises: It is judged whether the fourth temperature value is in a first target temperature interval or a second target temperature interval; wherein the fourth temperature value is calculated by the method of any one of claims 1-4; wherein the first target temperature interval is a temperature interval in which a protection operation control strategy needs to be taken; and the second target temperature interval is a temperature interval in which a shutdown protection needs to be taken, and the lower limit value of the second target temperature interval is greater than or equal to the upper limit value of the first target temperature interval; In a case that the fourth temperature value is in a first target temperature interval, a preset protection operation control strategy is executed to perform cooling treatment on the power factor correction module; In a case that the fourth temperature value is in a second target temperature interval, the air conditioner is at least controlled to stop.

6. The method of claim 5, wherein, The step of executing the preset protection operation control strategy to perform cooling treatment on the power factor correction module comprises: increasing a preset operation frequency of a fan to increase a wind field, wherein the fan is a fan for performing cooling treatment on the power factor correction module; or reducing a temperature of a refrigerant heat dissipation pipe to improve a refrigerant heat dissipation effect, wherein the refrigerant heat dissipation pipe is a refrigerant heat dissipation pipe for performing cooling treatment on the power factor correction module.

7. The method of claim 5, wherein, The step of at least controlling the air conditioner to stop comprises: controlling the air conditioner to stop and executing a preset first alarm measure, wherein the first alarm measure is an alarm measure for prompting that the power factor correction module has a fault.

8. The method of claim 5, wherein, Before the step of judging whether the fourth temperature value is in the first target temperature interval or the second target temperature interval, the method further comprises: acquiring a current first temperature value and a second temperature value when the air conditioner is started for the first time or restarted after experiencing a preset time of stop; judging whether a difference between the first temperature value and the second temperature value is less than or equal to a second preset threshold value; in a case that the difference is greater than the second preset threshold value, executing a preset second alarm measure, wherein the second alarm measure is an alarm measure for prompting that temperature sampling of the intelligent power module is abnormal.

9. The method of claim 8, wherein, Before the step of judging whether the fourth temperature value is in the first target temperature interval or the second target temperature interval, the method further comprises: in a case that the difference is less than or equal to the second preset threshold value, controlling the intelligent power module and the power factor correction module to operate for a preset fixed time at a preset fixed duty ratio and updating the current first temperature value after operating for the preset fixed time; determining a reference temperature value of the intelligent power module from a preset data table according to the second temperature value, wherein the data table is preconfigured with reference temperature values of the intelligent power module under different ambient temperatures when the intelligent power module and the power factor correction module operate for the preset fixed time at the preset fixed duty ratio; judging whether a difference between the reference temperature value of the intelligent power module and the updated first temperature value is less than or equal to a third preset threshold value; in a case that the difference is greater than the third preset threshold value, executing the preset second alarm measure.

10. An air conditioner characterized by comprising: The controller is configured to execute the temperature value calculation method of any one of claims 1-4 or execute the air conditioner control method of any one of claims 5-9.

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