Welding defect detection method, device, equipment, system and medium

Abstract

The invention relates to a welding defect detection method, device, equipment, system and medium, and relates to the technical field of welding detection. The technical problem that the accuracy of detecting whether a welding spot has a welding defect or not in the prior art is low is at least solved. Comprising the steps that deformation parameters of a circuit board are determined based on deformation parameters of a shell, and the shell is used for fixedly installing the circuit board; under the condition that the circuit board is controlled to deform based on the deformation parameter of the circuit board, detecting the function of the deformed circuit board to obtain a first detection result; and determining whether the circuit board has a welding defect according to the first detection result. The accuracy of detecting whether the welding spot has the welding defect can be improved.

Description

Technical Field

[0001] The present application relates to the field of welding detection technology, and in particular to a welding defect detection method, device, equipment, system and medium. Background Art

[0002] With the rapid development and popularization of new energy vehicles, the electric drive control system, as the brain of the new energy vehicle power system, plays the most critical role. Therefore, the stability of the electric drive control system determines the stability of the new energy vehicle power system. Among them, the Printed Circuit Assembly (PCA) board (also known as the electric control system control board) is the main component of the electric drive control system, and the PCA board is obtained by soldering electronic components on the circuit board. When soldering electronic components on the circuit board to obtain the PCA board, welding defects (such as cold soldering, lack of solder, insufficient tin, crooked pasting and bridging, etc.) are prone to occur.

[0003] In the related art, patent application CN 108008241 A electrically connects the solder joints and solder on the PCB board through two terminals provided by the resistor meter, and then drives the PCB board to vibrate through the vibration component. Therefore, in the scenario of simulating the vibration of the PCB board, the resistance value of the solder joint is detected by the resistor meter to determine whether there is a welding defect in the solder joint on the PCB board according to the resistance value. This technical solution causes the PCB board to vibrate by the vibration component, which only simulates the scenario of the PCB board shaking. In this case, for solder joints with minor welding defects, it is not possible to accurately detect them. Therefore, the accuracy of detecting whether there is a welding defect in the solder joint is low.

[0004] In another related technology, patent application CN 217224177 U fixes and connects fixed columns at the four corners of the upper end of the base, and slides and connects a telescopic rod in the fixed column, and the upper end of the telescopic rod passes through the fixed column and is fixedly connected to the mounting frame. In this way, by flexibly connecting the detection probe in the mounting frame and fixing the circuit board to the upper end of the base, the detection probe can be aligned with the solder joints on the circuit board, and the solder joints can be detected by the detection probe. This method discloses a scheme for detecting solder joints by detection probes, and does not simulate the use scenarios of circuit boards. The actual use scenarios of circuit boards are complex and changeable, and different scenarios have different effects on the circuit board. This method only detects the solder joints on the circuit board in an ideal environment, so the accuracy of detecting whether there are welding defects in the solder joints is low. Summary of the invention

[0005] The present application provides a welding defect detection method, device, equipment, system and medium. The purpose of the present application is to at least solve the technical problem of low accuracy in detecting whether a welding spot has a welding defect in the related art.

[0006] In order to achieve the above purpose, the technical solution adopted in this application is as follows:

[0007] According to the first aspect provided by the present application, a welding defect detection method is provided, the method comprising: determining deformation parameters of a circuit board based on deformation parameters of a shell, the shell being used to fix and install the circuit board; while controlling the deformation of the circuit board based on the deformation parameters of the circuit board, detecting the function of the deformed circuit board to obtain a first detection result; and determining whether there is a welding defect in the circuit board based on the first detection result.

[0008] According to the above technical means, the present application can determine the deformation parameters of the circuit board based on the deformation parameters of the shell on which the circuit board is fixedly installed. In this way, after the circuit board is installed on the shell, the deformation of the shell will cause the circuit board to deform, so the deformation parameters of the circuit board can be determined based on the deformation parameters of the shell. Therefore, when the circuit board is deformed based on the deformation parameters, the function of the deformed circuit board is detected to obtain the detection result, and it can be determined whether the function of the circuit board is normal after the circuit board is installed on the shell, so as to determine whether there are welding defects in the circuit board. In this way, by simulating the scene of the circuit board being installed on the shell, the accuracy of detecting whether there are welding defects in the solder joints on the circuit board can be improved.

[0009] In a possible embodiment, the above-mentioned determination of the deformation parameters of the circuit board based on the deformation parameters of the shell includes: obtaining preset parameters, the preset parameters including at least one of the following: a height parameter of the mounting column included in the shell, a deformation parameter corresponding to the temperature, the deformation parameter corresponding to the temperature being a deformation parameter of the shell caused by deformation of the temperature; determining the deformation parameters of the circuit board based on the deformation parameters of the shell and the preset parameters.

[0010] According to the above technical means, in the process of determining the deformation parameters of the circuit board based on the deformation parameters of the shell, the height of the mounting post will also affect the deformation of the circuit board, and the change in temperature will also cause the shell to deform. Therefore, the deformation parameters of the circuit board can be further determined by combining the height parameters of the mounting post included in the shell and the deformation parameters corresponding to the temperature. Thus, by combining multiple influencing parameters, the accuracy of determining the deformation parameters of the circuit board is further improved, so as to further improve the accuracy of detecting whether there are welding defects in the solder joints on the circuit board.

[0011] In a possible implementation, before determining the deformation parameters of the circuit board based on the deformation parameters of the shell, the method further includes: determining stress parameters of the shell; and determining the deformation parameters of the shell based on the stress parameters of the shell.

[0012] According to the above technical means, the present application can determine the deformation parameters of the shell according to the stress parameters of the shell. Since the deformation of the shell is caused by the interaction of stresses generated inside the shell, the deformation parameters of the shell can be accurately determined according to the stress parameters of the shell.

[0013] In a possible implementation, the above-mentioned determination of the deformation parameters of the circuit board based on the deformation parameters of the shell and the preset parameters includes: adjusting the deformation parameters of the shell based on the preset parameters to obtain the adjusted deformation parameters of the shell; and determining the adjusted deformation parameters of the shell as the deformation parameters of the circuit board.

[0014] According to the above technical means, the present application can adjust the deformation parameters of the shell based on the height parameters of the mounting posts included in the shell and the deformation parameters corresponding to the temperature, obtain the adjusted deformation parameters of the shell, and determine the adjusted deformation parameters of the shell as the deformation parameters of the circuit board. That is, the present application can determine the deformation parameters of the circuit board based on the deformation parameters of the shell, the height parameters of the mounting posts included in the shell, and the deformation parameters corresponding to the temperature. Thus, by combining multiple influencing parameters, the accuracy of determining the deformation parameters of the circuit board is further improved, so as to further improve the accuracy of detecting whether there are welding defects in the solder joints on the circuit board.

[0015] In a possible implementation, the method further includes: adjusting the heights of a plurality of pressure heads included in the detection device based on deformation parameters of the circuit board; and controlling deformation of the circuit board by using the plurality of pressure heads with adjusted heights included in the detection device.

[0016] According to the above technical means, the present application can adjust the height of multiple pressure heads included in the detection device based on the deformation parameters of the circuit board, so as to control the deformation of the circuit board through the multiple pressure heads included in the detection device after the height adjustment. In this way, the height of the multiple pressure heads included in the detection device can be adjusted by determining the deformation parameters of the circuit board, so as to simulate the scene where the circuit board is installed on the shell and deformed. Therefore, in this scene, the function of the circuit board can be further detected to determine whether the circuit board has welding defects, which can improve the accuracy of detecting whether the solder joints on the circuit board have welding defects.

[0017] In a possible implementation, determining whether a circuit board has a welding defect based on the first test result includes: testing the function of the circuit board to obtain a second test result when the circuit board is not deformed; and determining that a welding defect exists in the circuit board when the first test result indicates that the function of the circuit board has failed the test and the second test result indicates that the function of the circuit board has passed the test.

[0018] According to the above technical means, the present application can further determine whether there is a welding defect in the circuit board based on the first test result, combined with the second test result obtained by testing the function of the circuit board when the circuit board is not deformed. In this way, when the first test result indicates that the function of the circuit board has not passed the test, and the second test result indicates that the function of the circuit board has passed the test, it can be determined that there is a welding defect in the circuit board. Thus, the accuracy of detecting whether there is a welding defect in the solder joint on the circuit board can be further improved through the test results in various situations.

[0019] According to the second aspect provided by the present application, a welding defect detection device is provided, and the welding defect detection device includes: a processing module and a detection module; the processing module is used to determine the deformation parameters of the circuit board based on the deformation parameters of the shell, and the shell is used to fix and install the circuit board; the detection module is used to detect the function of the deformed circuit board when the circuit board is controlled to deform based on the deformation parameters of the circuit board to obtain a first detection result; the processing module is also used to determine whether there is a welding defect on the circuit board based on the first detection result.

[0020] In a possible embodiment, the welding defect detection device also includes: an acquisition module; an acquisition module for acquiring preset parameters, the preset parameters including at least one of the following: a height parameter of the mounting column included in the shell, a deformation parameter corresponding to the temperature, the deformation parameter corresponding to the temperature being a deformation parameter of the shell caused by deformation of the shell due to the temperature; a processing module, specifically used to determine the deformation parameters of the circuit board based on the deformation parameters of the shell and the preset parameters.

[0021] In a possible implementation, the processing module is further used to determine stress parameters of the shell; the processing module is further used to determine deformation parameters of the shell based on the stress parameters of the shell.

[0022] In a possible implementation, the processing module is specifically used to adjust the deformation parameters of the shell based on preset parameters to obtain the adjusted deformation parameters of the shell; the processing module is specifically used to determine the adjusted deformation parameters of the shell as the deformation parameters of the circuit board.

[0023] In a possible implementation, the processing module is further used to adjust the heights of multiple pressure heads included in the detection device based on the deformation parameters of the circuit board; the processing module is also used to control the deformation of the circuit board through the multiple pressure heads after the heights are adjusted included in the detection device.

[0024] In a possible embodiment, the processing module is further used to detect the function of the circuit board when the circuit board is not deformed to obtain a second test result; the processing module is further used to determine that the circuit board has a welding defect when the first test result indicates that the function of the circuit board has not passed the test and the second test result indicates that the function of the circuit board has passed the test.

[0025] According to the third aspect provided by the present application, a detection device is provided, which includes multiple pressure heads, and the multiple pressure heads are used to control the deformation of the circuit board. The detection device is used to adjust the heights of the multiple pressure heads based on the deformation parameters of the circuit board to control the deformation of the circuit board.

[0026] In a possible implementation manner, the detection equipment further includes a welding defect detection device as described in the second aspect.

[0027] According to the fourth aspect provided by the present application, a welding defect detection system is provided, the welding defect detection system comprising: a detection device and a circuit board, the welding defect detection system is used to implement the method of the above-mentioned first aspect and any possible implementation method thereof.

[0028] According to the fifth aspect provided by the present application, an electronic device is provided, comprising: a processor; a memory for storing processor executable instructions; wherein the processor is configured to execute instructions to implement the method of the above-mentioned first aspect and any possible implementation manner thereof.

[0029] According to the sixth aspect provided by the present application, a computer-readable storage medium is provided. When the instructions in the computer-readable storage medium are executed by a processor of an electronic device, the electronic device executes the method of the above-mentioned first aspect and any possible implementation method thereof.

[0030] According to the seventh aspect provided by the present application, a computer program product is provided, the computer program product comprising computer instructions, and when the computer instructions are executed on an electronic device, the electronic device executes the method of the above-mentioned first aspect and any possible implementation manner thereof.

[0031] Therefore, the above technical features of the present application have the following beneficial effects:

[0032] (1) The present application can determine the deformation parameters of the circuit board based on the deformation parameters of the shell on which the circuit board is fixedly mounted. In this way, after the circuit board is installed on the shell, the deformation of the shell will cause the circuit board to deform, so the deformation parameters of the circuit board can be determined based on the deformation parameters of the shell. Therefore, when the circuit board is deformed based on the deformation parameters, the function of the deformed circuit board is detected to obtain the detection result, and it can be determined whether the function of the circuit board is normal after the circuit board is installed on the shell, so as to determine whether there are welding defects on the circuit board. In this way, by simulating the scene of the circuit board being installed on the shell, the accuracy of detecting whether there are welding defects in the solder joints on the circuit board can be improved.

[0033] (2) In the process of determining the deformation parameters of the circuit board based on the deformation parameters of the shell, the height of the mounting post will also affect the deformation of the circuit board, and the change in temperature will also cause the shell to deform. Therefore, the deformation parameters of the circuit board can be further determined by combining the height parameters of the mounting post included in the shell and the deformation parameters corresponding to the temperature. Thus, by combining multiple influencing parameters, the accuracy of determining the deformation parameters of the circuit board is further improved, so as to further improve the accuracy of detecting whether there are welding defects in the solder joints on the circuit board.

[0034] (3) The present application can determine the deformation parameters of the shell according to the stress parameters of the shell. Since the deformation of the shell is caused by the interaction of stresses generated inside the shell, the deformation parameters of the shell can be accurately determined according to the stress parameters of the shell.

[0035] (4) The present application can adjust the deformation parameters of the shell based on the height parameters of the mounting posts included in the shell and the deformation parameters corresponding to the temperature, obtain the adjusted deformation parameters of the shell, and determine the adjusted deformation parameters of the shell as the deformation parameters of the circuit board. That is, the present application can determine the deformation parameters of the circuit board based on the deformation parameters of the shell, the height parameters of the mounting posts included in the shell, and the deformation parameters corresponding to the temperature. Thus, by combining multiple influencing parameters, the accuracy of determining the deformation parameters of the circuit board is further improved, so as to further improve the accuracy of detecting whether there are welding defects in the solder joints on the circuit board.

[0036] (5) The present application can adjust the height of multiple pressure heads included in the detection device based on the deformation parameters of the circuit board, thereby controlling the deformation of the circuit board through the multiple pressure heads included in the detection device after the height adjustment. In this way, the height of the multiple pressure heads included in the detection device can be adjusted by determining the deformation parameters of the circuit board, thereby simulating the scene where the circuit board is installed on the shell and deformed. Therefore, in this scene, the function of the circuit board can be further detected to determine whether the circuit board has welding defects, which can improve the accuracy of detecting whether the solder joints on the circuit board have welding defects.

[0037] (6) The present application can further determine whether the circuit board has a welding defect based on the first test result in combination with a second test result obtained by testing the function of the circuit board when the circuit board is not deformed. In this way, when the first test result indicates that the function of the circuit board has not passed the test, and the second test result indicates that the function of the circuit board has passed the test, it can be determined that the circuit board has a welding defect. Thus, the accuracy of detecting whether the solder joints on the circuit board have welding defects can be further improved through the test results in various situations.

[0038] It should be noted that the technical effects brought about by any implementation method in the second to seventh aspects can refer to the technical effects brought about by the corresponding implementation method in the first aspect, and will not be repeated here.

[0039] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application, and do not constitute an improper limitation on the present application.

[0041] Figure 1 is a structural schematic diagram of a welding defect detection system according to an exemplary embodiment;

[0042] Figure 2 is a flow chart of a welding defect detection method according to an exemplary embodiment;

[0043] Figure 3 is a flow chart of another welding defect detection method according to an exemplary embodiment;

[0044] Figure 4 is a schematic structural diagram of a detection device according to an exemplary embodiment;

[0045] Figure 5 is a structural schematic diagram of another detection device according to an exemplary embodiment;

[0046] Figure 6 is a block diagram of a welding defect detection device according to an exemplary embodiment;

[0047] Figure 7 It is a block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0048] In order to enable ordinary persons in the art to better understand the technical solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0049] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0050] Welding defects (cold solder joints) refer to defects formed at the welding joints during the welding process of the target components. Common circuit welding defects include cold solder joints, lack of solder joints, insufficient tin, skewed solder joints, and bridges. Currently, the methods for detecting cold solder joints are usually manual visual inspection and automated optical inspection (AOI).

[0051] The internal parts of the vehicle's electric drive control system usually work in a temperature range of 25℃ to 85℃, and are often in a vibrating environment. Therefore, the circuit boards of the electric drive control system (e.g., printed circuit assembly (PCA), printed circuit board (PCB), etc.) will generate internal stress due to temperature rise, vibration, and changes in the flatness of the installation fixed position. If there is a cold solder joint on the components on the circuit board, it will cause poor contact and thus functional failure. When there is a cold solder joint on the components on the circuit board, the circuit board may pass the normal function test, but it will malfunction after being installed in the control system. When the circuit board is disassembled and tested separately, the function returns to normal. After investigation, it will be found that it is caused by the cold solder joint of the electronic components of the circuit board, and the existing commonly used inspection methods for circuit boards, such as AOI inspection, cannot fully and effectively detect the cold solder joint problem.

[0052] This application combines the characteristics of manual visual inspection and AOI inspection, provides complementary services based on manual visual inspection and AOI inspection, and can maximize the detection rate of cold solder joints. By simulating the maximum deformation of the circuit board and generating internal stress through pre-deformation, it can detect whether the circuit board has malfunctions due to cold solder joints.

[0053] It should be noted that the welding defect detection method provided in the embodiment of the present application is not limited to the circuit board of the electric drive control system for the circuit board to be detected, and can be applied to the welding defect detection of circuit boards of any form, any function, and applied to any field. This application only takes the circuit board of the electric drive control system as an example for exemplary description.

[0054] The welding defect detection method provided in the embodiment of the present application can be applicable to a welding defect detection system. Figure 1 FIG. 1 shows a schematic diagram of the structure of a welding defect detection system. Figure 1 As shown, the welding defect detection system 10 includes: an electronic device 11, a detection device 12 and a circuit board 13.

[0055] The electronic device 11 can determine the deformation parameters of the circuit board 13 based on the deformation parameters of the housing, and the housing is used to fix and install the circuit board 13.

[0056] The electronic device 11 may also detect the function of the deformed circuit board 13 to obtain a first detection result when the detection device 12 controls the circuit board 13 to deform based on the deformation parameters of the circuit board 13 .

[0057] The electronic device 11 can also determine whether the circuit board 13 has a welding defect according to the first detection result.

[0058] In some embodiments, the electronic device 11 can also obtain preset parameters, which include at least one of the following: a height parameter of the mounting column included in the shell, a deformation parameter corresponding to the temperature, the deformation parameter corresponding to the temperature is a deformation parameter of the shell caused by deformation of the temperature; and based on the deformation parameter of the shell and the preset parameter, the deformation parameter of the circuit board 13 is determined.

[0059] The electronic device 11 can also determine stress parameters of the shell; and based on the stress parameters of the shell, determine deformation parameters of the shell.

[0060] The electronic device 11 can also adjust the deformation parameters of the shell based on the preset parameters to obtain the adjusted deformation parameters of the shell; and determine the adjusted deformation parameters of the shell as the deformation parameters of the circuit board 13.

[0061] The electronic device 11 can also adjust the heights of the multiple pressure heads included in the detection device 12 based on the deformation parameters of the circuit board 13, so as to control the deformation of the circuit board 13 through the multiple pressure heads with adjusted heights included in the detection device 12.

[0062] The electronic device 11 can also detect the function of the circuit board 13 when the circuit board 13 is not deformed to obtain a second detection result; thereby, when the first detection result indicates that the function of the circuit board 13 has failed the test and the second detection result indicates that the function of the circuit board 13 has passed the test, it is determined that there is a welding defect in the circuit board 13.

[0063] The welding defect detection method provided in the embodiment of the present application uses the principle of mechanical mechanics to generate internal stress by bending and deforming the circuit board, so that the electronic components with poor solder joints can be deformed and separated from the solder joints, thereby being detected. The method tests the circuit board under bending and stress, and then powers on to detect whether there is a functional fault caused by poor solder joints.

[0064] For ease of understanding, the welding defect detection method provided by the present application is specifically introduced below with reference to the accompanying drawings.

[0065] Figure 2 is a flow chart of a welding defect detection method according to an exemplary embodiment. Figure 2 As shown, the method includes the following S201-S203:

[0066] S201. Determine deformation parameters of the circuit board based on deformation parameters of the housing.

[0067] The housing is used to fix and install the circuit board.

[0068] Optionally, the deformation parameters of the housing and / or the deformation parameters of the circuit board include a deformation position and a corresponding deformation amount (also referred to as a deformation degree).

[0069] Optionally, since the shell for mounting the circuit board has stress during the processing or forming process, the shell has a certain deformation (ie, deformation parameter). The certain deformation of the shell can be simulated by Computer Aided Engineering (CAE) to obtain the maximum deformation degree and deformation position.

[0070] It can be understood that the deformation parameters of the housing can be determined by CAE simulation according to the assembly conditions of the circuit board (ie, the installed housing), thereby determining the deformation parameters of the circuit board.

[0071] It should be noted that the deformation parameters of the circuit board include the deformation position and the corresponding deformation amount, which can be understood as the maximum deformation amount corresponding to the deformation position of the circuit board.

[0072] In some embodiments, in a welding defect detection method provided by an embodiment of the present application, the above S201 may also include: determining stress parameters of the shell; and determining deformation parameters of the shell based on the stress parameters of the shell.

[0073] Optionally, the stress parameters of the shell may be determined through CAE simulation, and thus the deformation parameters of the shell may be determined based on the stress parameters of the shell.

[0074] In the embodiment of the present application, the present application can determine the deformation parameters of the shell according to the stress parameters of the shell. Since the deformation of the shell is caused by the interaction of stresses generated inside the shell, the deformation parameters of the shell can be accurately determined according to the stress parameters of the shell.

[0075] In some embodiments, Figure 3 As shown, in a welding defect detection method provided in an embodiment of the present application, S201 may specifically include S301-S302:

[0076] S301, obtaining preset parameters.

[0077] The preset parameters include at least one of the following: a height parameter of a mounting column included in the shell, and a deformation parameter corresponding to temperature, wherein the deformation parameter corresponding to temperature is a deformation parameter of the shell caused by deformation due to temperature.

[0078] Optionally, due to errors in the processing or molding of the housing, the heights of the multiple mounting posts are different (not in the same plane), and there is a processing tolerance between the heights of the multiple mounting posts. Therefore, the height parameters of the mounting posts can be determined based on the processing tolerance between the heights of the multiple mounting posts.

[0079] Optionally, the machining tolerance between the heights of the plurality of mounting posts includes an upper tolerance value and a lower tolerance value, and thus the difference between the upper tolerance value and the lower tolerance value may be determined as the height parameter of the mounting post.

[0080] For example, assuming that the height of the mounting post should be 20.0 mm, and the processing tolerances of the mounting posts included in the housing include an upper tolerance value of 0.5 mm and a lower tolerance value of -0.5 mm, it can be determined that the height parameter of the mounting post is 1 mm. As long as the height of the mounting posts is between 19.5 mm and 20.5 mm, the housing is a qualified product.

[0081] Optionally, due to thermal expansion and contraction, the shell may expand and contract under different temperature conditions, thereby causing further deformation of the shell. Therefore, the effect of temperature on the deformation of the shell also needs to be considered.

[0082] Optionally, the effect of temperature on the deformation of the shell, that is, the shrinkage deformation of the shell caused by the temperature difference, can be simulated by CAE to obtain the corresponding deformation at the highest and lowest operating temperatures of the shell (that is, the deformation parameters corresponding to the temperature).

[0083] It should be noted that the deformation of the circuit board unit is very small and can be ignored. Its main deformation comes from the deformation after being installed in the shell. Therefore, the main factors of circuit board deformation are: shell deformation (i.e., shell deformation parameters), processing tolerance of the mounting column (i.e., height parameters of the mounting column included in the shell), and thermal expansion and contraction deformation of the shell caused by temperature difference (i.e., deformation parameters corresponding to temperature).

[0084] S302: Determine deformation parameters of the circuit board based on deformation parameters of the housing and preset parameters.

[0085] Optionally, the deformation parameters of the circuit board may be determined based on the deformation parameters of the shell and preset parameters by using a Worse Case (WC) method or a Root Sum Squares (RSS) method.

[0086] Optionally, when determining the deformation parameters of the circuit board by the extreme value method, the height parameter of the mounting post included in the shell, the deformation parameter corresponding to the temperature, and the deformation parameter of the shell can be accumulated to obtain the deformation parameters of the circuit board. For example, if the deformation parameter of the shell is ±0.3mm, the height parameter of the mounting post included in the shell is ±0.1mm, and the deformation parameter corresponding to the temperature is ±0.2mm, then the deformation parameter of the circuit board calculated by the extreme value method is ±(0.3+0.1+0.2)=±0.6mm.

[0087] Optionally, when determining the deformation parameters of the circuit board through RSS, the deformation parameters of the circuit board can be determined by the formula: deformation parameters of the circuit board = Square (A2 + B2 + C2). For example, the deformation parameter of the shell is ± 0.3mm, the height parameter of the mounting column included in the shell is ± 0.1mm, and the deformation parameter corresponding to the temperature is ± 0.2mm. Then the deformation parameter of the circuit board calculated by RSS is: deformation parameter of the circuit board = Square (0.3 2 +0.12+0.22)=±0.37mm.

[0088] In some embodiments, in a welding defect detection method provided by an embodiment of the present application, the above S302 may specifically include: adjusting the deformation parameters of the shell based on preset parameters to obtain the adjusted deformation parameters of the shell; and determining the adjusted deformation parameters of the shell as the deformation parameters of the circuit board.

[0089] It can be understood that the deformation parameters of the circuit board are determined based on the deformation parameters of the shell and the preset parameters, which is essentially to adjust the deformation parameters of the shell through the preset parameters (i.e., the height parameters of the mounting posts included in the shell and the deformation parameters corresponding to the temperature). This is because the different heights of the mounting posts included in the shell and the thermal expansion and contraction caused by the temperature will cause the deformation degree of the shell to be further deepened. Therefore, the deformation parameters of the shell can be adjusted (for example, the deformation parameters of the shell are increased) through the height parameters of the mounting posts included in the shell and the deformation parameters corresponding to the temperature. Thereby, the deformation parameters of the circuit board are determined based on the adjusted deformation parameters of the shell (for example, the adjusted deformation parameters of the shell are determined as the deformation parameters of the circuit board).

[0090] In an embodiment of the present application, the present application can adjust the deformation parameters of the shell based on the height parameters of the mounting posts included in the shell and the deformation parameters corresponding to the temperature, obtain the adjusted deformation parameters of the shell, and determine the adjusted deformation parameters of the shell as the deformation parameters of the circuit board. That is, the present application can determine the deformation parameters of the circuit board based on the deformation parameters of the shell, the height parameters of the mounting posts included in the shell, and the deformation parameters corresponding to the temperature. Thus, by combining multiple influencing parameters, the accuracy of determining the deformation parameters of the circuit board is further improved, so as to further improve the accuracy of detecting whether there are welding defects in the solder joints on the circuit board.

[0091] In the embodiment of the present application, in the process of determining the deformation parameters of the circuit board based on the deformation parameters of the shell, the height of the mounting post will also affect the deformation of the circuit board, and the change in temperature will also cause the shell to deform. Therefore, the deformation parameters of the circuit board can be further determined by combining the height parameters of the mounting post included in the shell and the deformation parameters corresponding to the temperature. Thus, by combining multiple influencing parameters, the accuracy of determining the deformation parameters of the circuit board is further improved, so as to further improve the accuracy of detecting whether there are welding defects in the solder joints on the circuit board.

[0092] S202: When the circuit board is controlled to deform based on the deformation parameters of the circuit board, a function of the deformed circuit board is detected to obtain a first detection result.

[0093] Optionally, after the deformation parameters of the circuit board are determined, the circuit board may be controlled to deform based on the deformation parameters of the circuit board through a detection device, thereby simulating a scenario in which the circuit board is deformed when installed on a housing.

[0094] In some embodiments, a welding defect detection method provided in an embodiment of the present application may also include: adjusting the heights of multiple pressure heads included in the detection device based on the deformation parameters of the circuit board; and controlling the deformation of the circuit board through the multiple pressure heads with adjusted heights included in the detection device.

[0095] Optionally, the detection device is a circuit board fixing carrier with multiple pressure heads, which can simulate the bending deformation scenario of the circuit board when assembled on the housing. Therefore, after the circuit board is controlled to deform by the detection device, the deformed circuit board on the detection device can be powered on to perform a working condition test to detect the function of the deformed circuit board and obtain a first detection result.

[0096] For example, Figure 4 As shown, the detection device can be designed as a box structure including an upper cover plate 401 (or an upper pressure plate) and a lower cover plate 402 (or a lower pressure plate). The circuit board can be supported by referring to the screw fixing position of the circuit board inside the detection device, and the multiple pressure heads 403 included in the detection device are height-adjustable structures. The pressure head 403 can be a threaded structure or a hydraulic structure. The threaded structure can adjust the height of the pressure head 403 by a knob, and the hydraulic structure can adjust the height of the pressure head 403 by hydraulic pressure, thereby realizing the deformation adjustment of the circuit board 404.

[0097] It should be noted that the upper cover plate and the lower cover plate included in the detection device both include pressure heads, and the circuit board can be deformed by the pressure heads of the upper cover plate and the lower cover plate pressing the circuit board.

[0098] Further, such as Figure 5 As shown, it is a top view of the detection device. It can be seen from the figure that the multiple pressure heads 403 included in the detection device are evenly arranged. When the circuit board 404 is placed between the upper cover plate and the lower cover plate, by adjusting the height of the multiple pressure heads 403, the circuit board 404 can be deformed, simulating the scene of the circuit board 404 being installed on the shell and deformed. It should be noted that when the circuit board 404 is placed between the upper cover plate and the lower cover plate, it is necessary to first fix the circuit board 404 in a plane by screws, and then adjust the pressure head 403 on the upper cover plate of the detection device and the pressure head 403 on the lower cover plate respectively, so that the circuit board 404 can be stably clamped on the detection device without moving up and down. Then, according to the determined deformation parameters of the circuit board 404, the height of the pressure head 403 corresponding to the maximum deformation position of the circuit board 404 is adjusted, so that the pressure head 403 is pressed against the circuit board 404 to cause the circuit board 404 to deform.

[0099] Optionally, there are many ways for the circuit board to deform, such as unidirectional deformation (ie, forming an arc-shaped board) or multi-position deformation to form an S-shaped circuit board. In short, the way the circuit board deforms is determined according to the deformation parameters of the circuit board.

[0100] Finally, based on the deformation parameters of the circuit board, after the circuit board is deformed by the multiple pressure heads included in the detection equipment, the test line is connected to the functional test interface of the circuit board, and the upper and lower covers of the detection equipment are closed and locked, so that the circuit board is in a deformed state. Then, the circuit board is powered on to perform a conventional functional test to obtain the test results.

[0101] In an embodiment of the present application, the present application can adjust the height of multiple pressure heads included in the detection device based on the deformation parameters of the circuit board, so as to control the deformation of the circuit board through the multiple pressure heads included in the detection device after the height adjustment. In this way, the height of the multiple pressure heads included in the detection device can be adjusted by determining the deformation parameters of the circuit board, so as to simulate the scene where the circuit board is installed on the shell and deformed. Therefore, in this scene, the function of the circuit board can be further detected to determine whether the circuit board has welding defects, which can improve the accuracy of detecting whether there are welding defects in the solder joints on the circuit board.

[0102] S203: Determine whether there is a welding defect on the circuit board according to the first detection result.

[0103] Optionally, when the circuit board is powered on and a routine functional test is performed, if the first test result indicates that the function of the circuit board has failed the test, it can be determined that the circuit board has a welding defect; if the first test result indicates that the function of the circuit board has passed the test, it can be determined that the circuit board does not have a welding defect.

[0104] In some embodiments, in a welding defect detection method provided in an embodiment of the present application, the above-mentioned S203 may specifically include: when the circuit board is not deformed, detecting the function of the circuit board to obtain a second detection result; when the first detection result indicates that the function of the circuit board has not passed the test, and the second detection result indicates that the function of the circuit board has passed the test, determining that the circuit board has a welding defect.

[0105] Optionally, the presence of welding defects in the circuit board may be determined by further combining a second test result of testing the function of the circuit board when the circuit board is not deformed.

[0106] It is understandable that when the circuit board is not deformed, the function of the circuit board is tested. If the test result indicates that the function of the circuit board has passed the test, it cannot be completely determined that there are no welding defects in the circuit board. This is because when the circuit board is installed on the housing, it will be deformed. When the circuit board is deformed, the solder joints of the electronic components will be deformed or desoldered. Therefore, when the circuit board is not deformed, the result of the function test of the circuit board is inaccurate.

[0107] Therefore, when the first test result indicates that the function of the circuit board has not passed the test, the second test result of testing the function of the circuit board when the circuit board has not been deformed can be combined to determine whether the circuit board has a welding defect. If the second test result indicates that the function of the circuit board has passed the test, it can be determined that the circuit board has a cold solder joint. When the circuit board is deformed, the cold solder joint will become unsoldered.

[0108] In an embodiment of the present application, the present application can further determine whether the circuit board has a welding defect based on the first detection result in combination with the second detection result obtained by detecting the function of the circuit board when the circuit board is not deformed. In this way, when the first detection result indicates that the function of the circuit board has not passed the test, and the second detection result indicates that the function of the circuit board has passed the test, it can be determined that the circuit board has a welding defect. Thus, the accuracy of detecting whether the solder joints on the circuit board have welding defects can be further improved through the detection results in various situations.

[0109] In an embodiment of the present application, the present application can determine the deformation parameters of the circuit board based on the deformation parameters of the shell on which the circuit board is fixedly mounted. In this way, after the circuit board is installed on the shell, the deformation of the shell will cause the circuit board to deform, so the deformation parameters of the circuit board can be determined based on the deformation parameters of the shell. Therefore, when the circuit board is deformed based on the deformation parameters, the function of the deformed circuit board is detected to obtain the detection result, and it can be determined whether the function of the circuit board is normal after the circuit board is installed on the shell, so as to determine whether there are welding defects in the circuit board. In this way, by simulating the scene of the circuit board being installed on the shell, the accuracy of detecting whether there are welding defects in the solder joints on the circuit board can be improved.

[0110] Combination Figure 4 and Figure 5 As shown, it is a structural schematic diagram of a detection device according to an exemplary embodiment, the detection device includes a plurality of pressure heads 403, and the plurality of pressure heads 403 are used to control the deformation of a circuit board 404. The detection device includes a welding defect detection device, and the detection device is used to implement the welding defect detection method in the above embodiment.

[0111] It can be understood that the detection equipment provided by the embodiment of the present application is simple in structure, easy to implement, and highly reliable. Through the circuit deformation test, it is possible to check in advance whether the welding of the circuit board is reliable, expose welding quality problems in advance, and facilitate product design and process optimization. Thereby improving the detection capability of cold solder joints, reducing the outflow of defective cold solder joints, and improving product quality.

[0112] The above mainly introduces the solution provided by the embodiment of the present application from the perspective of the method. In order to achieve the above functions, the welding defect detection device or electronic device includes a hardware structure and / or software module corresponding to the execution of each function. It should be easy for those skilled in the art to realize that, in combination with the units and algorithm steps of each example described in the embodiments disclosed in this document, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0113] The embodiment of the present application can divide the functional modules of the welding defect detection device or electronic device according to the above method. For example, the welding defect detection device or electronic device can include various functional modules corresponding to the various functional divisions, or two or more functions can be integrated into one processing module. The above integrated modules can be implemented in the form of hardware or in the form of software functional modules. It should be noted that the division of modules in the embodiment of the present application is schematic and is only a logical functional division. There may be other division methods in actual implementation.

[0114] Figure 6 is a block diagram of a welding defect detection device according to an exemplary embodiment. Figure 6 The welding defect detection device 600 includes: a processing module 601, a detection module 602 and an acquisition module 603.

[0115] The processing module 601 is used to determine the deformation parameters of the circuit board based on the deformation parameters of the shell, and the shell is used to fix the circuit board; the detection module 602 is used to detect the function of the deformed circuit board when the circuit board is controlled to deform based on the deformation parameters of the circuit board to obtain a first detection result; the processing module 601 is also used to determine whether there is a welding defect in the circuit board based on the first detection result.

[0116] In one possible embodiment, the acquisition module 603 is used to obtain preset parameters, which include at least one of the following: a height parameter of the mounting column included in the shell, a deformation parameter corresponding to the temperature, and the deformation parameter corresponding to the temperature is a deformation parameter of the shell caused by deformation of the temperature; the processing module 601 is specifically used to determine the deformation parameters of the circuit board based on the deformation parameters of the shell and the preset parameters.

[0117] In a possible implementation, the processing module 601 is further used to determine stress parameters of the shell; the processing module 601 is further used to determine deformation parameters of the shell based on the stress parameters of the shell.

[0118] In a possible implementation, the processing module 601 is specifically used to adjust the deformation parameters of the shell based on preset parameters to obtain the adjusted deformation parameters of the shell; the processing module 601 is specifically used to determine the adjusted deformation parameters of the shell as the deformation parameters of the circuit board.

[0119] In a possible implementation, the processing module 601 is further used to adjust the heights of multiple pressure heads included in the detection device based on the deformation parameters of the circuit board; the processing module 601 is further used to control the deformation of the circuit board through the multiple pressure heads after the heights are adjusted included in the detection device.

[0120] In a possible implementation, the processing module 601 is further used to detect the function of the circuit board when the circuit board is not deformed to obtain a second detection result; the processing module 601 is further used to determine whether the circuit board has a welding defect when the first detection result indicates that the function of the circuit board has not passed the detection and the second detection result indicates that the function of the circuit board has passed the detection.

[0121] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0122] Figure 7 FIG. 1 is a block diagram of an electronic device according to an exemplary embodiment. Figure 7 As shown, the electronic device 700 includes but is not limited to: a processor 701 and a memory 702 .

[0123] The memory 702 is used to store executable instructions of the processor 701. It can be understood that the processor 701 is configured to execute instructions to implement the welding defect detection method in the above embodiment.

[0124] It should be noted that those skilled in the art can understand that Figure 7 The electronic device structure shown in the figure does not constitute a limitation on the electronic device, and the electronic device may include Figure 7 More or fewer components may be shown, or certain components may be combined, or the components may be arranged differently.

[0125] The processor 701 is the control center of the electronic device. It uses various interfaces and lines to connect various parts of the entire electronic device. By running or executing software programs and / or modules stored in the memory 702, and calling data stored in the memory 702, it performs various functions of the electronic device and processes data, thereby monitoring the electronic device as a whole. The processor 701 may include one or more processing units. Optionally, the processor 701 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 701.

[0126] The memory 702 may be used to store software programs and various data. The memory 702 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required by at least one functional module (such as a processing module, etc.), etc. In addition, the memory 702 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0127] In an exemplary embodiment, a computer-readable storage medium including instructions is also provided, such as a memory 702 including instructions, and the above instructions can be executed by a processor 701 of an electronic device 700 to implement the welding defect detection method in the above embodiment.

[0128] In actual implementation, Figure 6 The functions of the processing module 601, the detection module 602 and the acquisition module 603 in Figure 7 The processor 701 in the embodiment calls the computer program stored in the memory 702. The specific execution process can refer to the description of the welding defect detection method in the above embodiment, which will not be repeated here.

[0129] Optionally, the computer-readable storage medium may be a non-temporary computer-readable storage medium, for example, the non-temporary computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0130] In an exemplary embodiment, the present application also provides a computer program product including one or more instructions, which can be executed by the processor 701 of the electronic device 700 to complete the welding defect detection method in the above embodiment.

[0131] It should be noted that when the instructions in the above-mentioned computer-readable storage medium or one or more instructions in the computer program product are executed by the processor of the electronic device, the various processes of the above-mentioned welding defect detection method embodiment are implemented, and the same technical effect as the above-mentioned welding defect detection method can be achieved. To avoid repetition, they will not be repeated here.

[0132] Through the description of the above implementation methods, technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0133] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0134] The units described as separate components may or may not be physically separated, and the components shown as units may be one physical unit or multiple physical units, that is, they may be located in one place or distributed in multiple different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0135] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0136] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art or the full classification part or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium, including a number of instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor (processor) to execute the full classification part or part of the steps of each embodiment method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, ROM, RAM, disk or CD and other media that can store program code.

[0137] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A welding defect detection method, characterized in that: The method comprises: Determining deformation parameters of a circuit board based on deformation parameters of a housing, wherein the housing is used to fix and install the circuit board; In a case where the circuit board is controlled to deform based on the deformation parameter of the circuit board, detecting the function of the deformed circuit board to obtain a first detection result; According to the first detection result, it is determined whether the circuit board has a welding defect.

2. The method according to claim 1, characterized in that The step of determining the deformation parameters of the circuit board based on the deformation parameters of the housing includes: Acquire preset parameters, where the preset parameters include at least one of the following: a height parameter of a mounting column included in the shell, and a deformation parameter corresponding to temperature, where the deformation parameter corresponding to temperature is a deformation parameter of the shell caused by temperature; Based on the deformation parameter of the housing and the preset parameter, a deformation parameter of the circuit board is determined.

3. The method according to claim 1, characterized in that Before determining the deformation parameters of the circuit board based on the deformation parameters of the housing, the method further includes: determining stress parameters of the shell; Based on the stress parameter of the shell, a deformation parameter of the shell is determined.

4. The method according to claim 2, characterized in that: The step of determining the deformation parameter of the circuit board based on the deformation parameter of the housing and the preset parameter includes: adjusting the deformation parameters of the shell based on the preset parameters to obtain adjusted deformation parameters of the shell; The adjusted deformation parameters of the shell are determined as the deformation parameters of the circuit board.

5. The method according to any one of claims 1 to 4, characterized in that The method further comprises: Based on the deformation parameters of the circuit board, adjusting the heights of a plurality of pressure heads included in the detection device; The circuit board is controlled to deform by using the plurality of pressure heads with adjusted heights included in the detection device.

6. The method according to any one of claims 1 to 4, characterized in that Determining whether the circuit board has a welding defect according to the first detection result includes: When the circuit board is not deformed, detecting the function of the circuit board to obtain a second detection result; When the first test result indicates that the function of the circuit board has not passed the test, and the second test result indicates that the function of the circuit board has passed the test, it is determined that there is a welding defect in the circuit board.

7. A welding defect detection device, characterized in that: The welding defect detection device comprises: a processing module and a detection module; The processing module is used to determine the deformation parameters of the circuit board based on the deformation parameters of the housing, and the housing is used to fix and install the circuit board; The detection module is used to detect the function of the deformed circuit board when the circuit board is controlled to deform based on the deformation parameter of the circuit board, so as to obtain a first detection result; The processing module is further used to determine whether there is a welding defect on the circuit board according to the first detection result.

8. A detection device, characterized in that: The detection device includes a plurality of pressure heads, and the plurality of pressure heads are used to control the deformation of the circuit board. The detection device is used to adjust the heights of the plurality of pressure heads based on the deformation parameters of the circuit board to control the deformation of the circuit board.

9. The detection device according to claim 8, characterized in that: The detection equipment also includes a welding defect detection device as described in claim 7.

10. A welding defect detection system, characterized in that: The welding defect detection system comprises: a detection device and a circuit board, and the welding defect detection system is used to implement the method according to any one of claims 1 to 6.

11. An electronic device, characterized in that: include: processor; a memory for storing instructions executable by the processor; The processor is configured to execute the instructions to implement the method according to any one of claims 1 to 6.

12. A computer-readable storage medium, characterized in that: When the computer-executable instructions stored in the computer-readable storage medium are executed by a processor of an electronic device, the electronic device executes the method as claimed in any one of claims 1 to 6.

Images