Bearing structure and integrated circuit packaging method

Abstract

The invention provides a bearing structure and an integrated circuit packaging method. Relates to the technical field of integrated circuit packaging, and aims to avoid damage to a bearing structure in temporary bonding and de-bonding processes and prolong the service life of the bearing structure. The bearing structure comprises a base, the base comprises a first surface, and the first surface is perpendicular to the thickness direction of the bearing structure; a groove is formed in the first surface and extends in the first direction; the first direction is perpendicular to the thickness direction of the bearing structure; the groove comprises a first side wall and a second side wall which are oppositely arranged in the first direction, the first side wall is provided with a first groove, the second side wall is provided with a second groove, and openings of the first groove and the second groove are located in the first surface and oppositely arranged in the second direction; the second direction is perpendicular to the thickness direction of the bearing structure and the first direction; the depth of the first groove and the depth of the second groove are both smaller than the depth of the groove.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and in particular to a bearing structure and an integrated circuit packaging method. Background Art

[0002] The temporary bonding and debonding process can form a single structural component into an array that matches the integrated circuit, and utilize wafer-level packaging technology to significantly improve packaging efficiency and reduce production costs.

[0003] Currently, traditional temporary bonding and debonding methods include mechanical stripping, wet chemical immersion, thermal sliding and laser debonding. When using the above traditional temporary bonding and debonding processes, there will be many problems in the process of separating the structural parts from the carrier plate used in the temporary bonding step, such as high cost and easy damage to the structural parts and the carrier plate. Summary of the invention

[0004] The embodiments of the present invention provide a bearing structure and an integrated circuit packaging method, which aim to avoid damage to the bearing structure during temporary bonding and debonding processes and increase the service life of the bearing structure.

[0005] To achieve the above object, the embodiments of the present invention adopt the following technical solutions: In the first aspect, the present application provides a bearing structure, which includes a base, the base includes a first surface, the first surface is perpendicular to the thickness direction of the bearing structure; the first surface is provided with a groove, the groove is extended along the first direction; the first direction is perpendicular to the thickness direction of the bearing structure; the groove includes a first side wall and a second side wall arranged opposite to each other in the first direction, the first side wall is provided with a first groove, the second side wall is provided with a second groove, the openings of the first groove and the second groove are located on the first surface, and are arranged opposite to each other in the second direction; the second direction is perpendicular to the thickness direction of the bearing structure and perpendicular to the first direction; the depths of the first groove and the second groove are both less than the depth of the groove.

[0006] In the bearing structure provided in the embodiment of the present application, a groove extending along the first direction is provided on the first surface of the base. Since the groove has a certain depth, the groove will form a first side wall and a second side wall opposite to each other on the first surface. The first side wall and the second side wall are respectively provided with a first groove and a second groove, and the openings of the first groove and the second groove are arranged relatively along the second direction for bearing the structural member. Since the depth of the first groove and the depth of the second groove are both less than the depth of the groove, the bottom of the first groove and the bottom of the second groove are higher than the bottom of the groove. The two ends of the bottom of the structural member are respectively placed on the bottom groove surfaces of the first groove and the second groove, and fixed to realize temporary bonding of the structural member and the bearing structure; a cutter is used to cut along the first side wall and the second side wall, and when the structural member is completely separated from the bearing structure, the cutter is located at the plane where the groove bottom of the first groove and the groove bottom of the second groove are located, that is, only the depth of the first groove and the second groove needs to be cut to realize complete separation of the structural member from the bearing structure. Since the depths of the first groove and the second groove are both smaller than the depth of the groove, no damage will be caused to the first surface of the supporting structure, nor will damage be caused to the first groove and the second groove. Therefore, damage to the supporting structure during the temporary bonding and debonding processes can be avoided, thereby increasing the service life of the supporting structure.

[0007] As a possible implementation manner, a plurality of grooves are disposed on the first surface of the base, and the plurality of grooves are spaced apart along the second direction.

[0008] As a possible implementation method, a plurality of first grooves are provided on the first side wall of the groove, a plurality of second grooves are provided on the second side wall of the groove, the plurality of first grooves are arranged at intervals along the first direction, the plurality of second grooves are arranged at intervals along the second direction, and the openings of a first groove and a second groove are arranged relatively in the second direction.

[0009] As a possible implementation method, the first groove includes a first groove surface facing the second groove, and the second groove includes a second groove surface facing the first groove; the first groove and the second groove are configured to be a load-bearing structural member, and the distance between the first groove surface and the second groove surface along the second direction is greater than or equal to the size of the structural member along the second direction.

[0010] As a possible implementation manner, the first groove surface is perpendicular to the first surface, and / or the second groove surface is perpendicular to the first surface.

[0011] As a possible implementation method, the structural member includes a functional area, and a first cutting reserved area and a second cutting reserved area respectively arranged on opposite sides of the functional area; the size of the first groove along the second direction is less than or equal to the size of the first cutting reserved area along the second direction, and the size of the second groove along the second direction is less than or equal to the size of the second cutting reserved area along the second direction.

[0012] As a possible implementation manner, the depth of the first groove and the second groove are both less than or equal to the thickness of the structural member.

[0013] As a possible implementation manner, a size of the first groove along the second direction is equal to a size of the second groove along the second direction.

[0014] As a possible implementation manner, the depth of the first groove is equal to the depth of the second groove.

[0015] In a second aspect, the present application also provides an integrated circuit packaging method, which includes: fixing a structural member to be packaged on a supporting structure as described above; wherein two ends of the structural member are respectively fixed in a first groove and a second groove of the supporting structure; bonding a wafer to the structural member to form a bonding structure; cutting the bonding structure along a first side wall and a second side wall of a groove of the supporting structure, respectively, to obtain a bonding structure unit separated from the supporting structure; wherein the bonding structure unit includes a structural member and a plurality of integrated circuits bonded to the structural member.

[0016] As a possible implementation manner, both ends and / or side walls of the structural member are bonded to the first groove and the second groove of the bearing structure through a room temperature curing adhesive layer.

[0017] As a possible implementation manner, when cutting along the first side wall of the groove, there is a gap between the cutting blade and the first side wall; when cutting along the second side wall of the groove, there is a gap between the cutting blade and the second side wall.

[0018] As a possible implementation manner, the interval between the cutter and the first side wall, and the interval between the cutter and the second side wall, are greater than or equal to the width of the cutting mark of the cutter.

[0019] As a possible implementation manner, the bonding structure unit includes a plurality of structural members arranged at intervals along the length extension direction of the bonding structure unit; the integrated circuit packaging method also includes: cutting the bonding structure unit along a direction perpendicular to the length extension direction of the bonding structure unit to obtain a plurality of integrated circuit packaging structures; wherein the integrated circuit packaging structure includes a structural member and a wafer portion bonded to the structural member.

[0020] Among them, the beneficial effects of the second aspect and its specific implementation methods can refer to the beneficial effects of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a bearing structure from a viewing angle provided in an embodiment of the present application; Figure 2 A schematic diagram of a bearing structure from another perspective provided in an embodiment of the present application; Figure 3An enlarged schematic diagram of the internal components of a bearing structure provided in an embodiment of the present application; Figure 4 A schematic diagram of a structural member from a viewing angle provided in an embodiment of the present application; Figure 5 A schematic diagram of a structural member from another perspective provided in an embodiment of the present application; Figure 6 A flowchart of an integrated circuit packaging method provided in an embodiment of the present application; Figure 7 A schematic diagram of temporary bonding and debonding provided in an embodiment of the present application; Figure 8 Another schematic diagram of temporary bonding and debonding provided in an embodiment of the present application; Fig. 9 Another schematic diagram of temporary bonding and debonding provided in an embodiment of the present application; Fig.10 Another schematic diagram of temporary bonding and debonding provided in an embodiment of the present application; Fig.11 Another schematic diagram of temporary bonding and debonding provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, when describing the pipeline, the "connected" and "connection" used in the present invention have the meaning of conduction. The specific meaning needs to be understood in conjunction with the context.

[0025] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0026] Wafer Level Packaging (WLP) for MEMS integrated circuits is a packaging technology completed at the wafer level, which allows the entire wafer to be packaged before the wafer is cut into individual integrated circuits. This packaging method has many advantages, including smaller package size, higher performance, lower cost and better reliability.

[0027] In order to realize wafer-level packaging of MEMS integrated circuits, temporary bonding and debonding processes are introduced. Temporary bonding refers to the use of a reversible adhesive or bonding technology to temporarily combine two wafers or structural parts with a carrier structure, and then perform necessary processing steps such as etching and filling after temporary bonding. Debonding refers to the separation of two wafers or structural parts from the carrier structure by heating, mechanical force or other methods after the processing is completed.

[0028] Currently, traditional temporary bonding and debonding methods include mechanical stripping, wet chemical immersion, thermal sliding and laser debonding. When using the above traditional temporary bonding and debonding processes, there will be many problems in the process of separating the structural parts from the carrier plate used in the temporary bonding step, such as high cost and easy damage to the structural parts and the carrier plate.

[0029] In view of this, the present application embodiment provides a bearing structure, exemplarily, as Figure 1 As shown. The bearing structure 100 includes a base 1, and the base 1 includes a first surface 11. The first surface 11 is perpendicular to the thickness direction of the bearing structure 100, that is, perpendicular to the Z direction. The first surface 11 is provided with a groove 12, and the groove 12 is extended along the first direction, that is, the Y direction. The first direction is perpendicular to the thickness direction of the bearing structure 100. The groove 12 includes a first side wall 121 and a second side wall 122 that are relatively arranged in the first direction, the first side wall 121 is provided with a first groove 13, and the second side wall 122 is provided with a second groove 14. The openings of the first groove 13 and the second groove 14 are located on the first surface 11, and are relatively arranged in the second direction, that is, the X direction. The second direction is perpendicular to the thickness direction of the bearing structure 100 and perpendicular to the first direction. The depths h1 of the first groove 13 and the second groove 14 are both less than the depth h2 of the groove 12.

[0030] In the load-bearing structure 100 provided in the embodiment of the present application, a groove 12 extending along a first direction is provided on the first surface 11 of the base 1. Since the groove 12 has a certain depth, the groove 12 forms a first side wall 121 and a second side wall 122 opposite to each other on the first surface 11. The first side wall 121 and the second side wall 122 are respectively provided with a first groove 13 and a second groove 14, and the openings of the first groove 13 and the second groove 14 are arranged opposite to each other along the second direction for bearing the structural member.

[0031] The first surface 11 is partially connected to the first side wall 121 and is recessed downward, and the first side wall 121 is partially connected to the first surface 11 and is recessed in a direction away from the second side wall 122, forming the first groove 13. The first surface 11 is partially connected to the second side wall 122 and is recessed downward, and the second side wall 122 is partially connected to the first surface 11 and is recessed in a direction away from the first side wall 121, forming the second groove 14.

[0032] Since the depth of the first groove 13 and the depth of the second groove 14 are both less than the depth of the groove 12, the bottom of the first groove 13 and the bottom of the second groove 14 are higher than the bottom of the groove 12. The two ends of the bottom of the structural member are respectively placed on the bottom groove surfaces of the first groove 13 and the second groove 14, and fixed to achieve temporary bonding of the structural member and the bearing structure 100; a cutter is used to cut along the first side wall 121 and the second side wall 122, and when the structural member is completely separated from the bearing structure 100, the cutter is located at the plane where the groove bottom of the first groove 13 and the groove bottom of the second groove 13 are located, that is, only the depth of the first groove 13 and the second groove 14 needs to be cut to achieve complete separation of the structural member and the bearing structure 100. Since the depth of the first groove 13 and the second groove 14 are both less than the depth of the groove 12, the first surface 11 of the bearing structure 100 will not be damaged, nor will the first groove 13 and the second groove 14 be damaged, so it is possible to avoid damage to the bearing structure 100 during the temporary bonding and debonding process, thereby increasing the service life of the bearing structure 100.

[0033] As a possible implementation, for example, Figure 1 and Figure 2 As shown, the first surface 11 of the base is provided with a plurality of grooves 12, and the plurality of grooves 12 are arranged at intervals along the second direction. Figure 2 The first surface 11 of the base shown in FIG. 1 is provided with six grooves 12 .

[0034] In some embodiments, a plurality of grooves 12 are arranged at equal intervals along the second direction. The arrangement of the grooves 12 at equal intervals simplifies the process of manufacturing the bearing structure, saving manufacturing cost and manufacturing time.

[0035] As a possible implementation, for example, Figure 1 and Figure 2 A plurality of first grooves 13 are disposed on the first side wall 121 of the groove 12, and a plurality of second grooves 14 are disposed on the second side wall 122 of the groove 12. The plurality of first grooves 13 are arranged at intervals along the first direction, and the plurality of second grooves 14 are arranged at intervals along the second direction. The openings of a first groove 13 and a second groove 14 are arranged opposite to each other in the second direction.

[0036] In some embodiments, a plurality of first grooves 13 are arranged at equal intervals along the first direction, and a plurality of second grooves 14 are arranged at equal intervals along the second direction. The first grooves 13 and the second grooves 14 arranged at equal intervals simplify the process of manufacturing the bearing structure, saving manufacturing cost and manufacturing time. The bearing structure 100 has a plurality of grooves 12, and each groove 12 includes a plurality of first grooves 13 and corresponding second grooves 14, which means that for each additional first groove 13 and corresponding second groove 14, one more structural member can be bonded to the bearing structure 100, which helps to improve production efficiency.

[0037] As a possible implementation, Figure 3 As shown, the first groove 13 includes a first groove surface 131 facing the second groove 14, and the second groove 14 includes a second groove surface 141 facing the first groove 13. The first groove 13 and the second groove 14 are configured to carry a structural member, and a distance L1 between the first groove surface 131 and the second groove surface 141 along the second direction is greater than or equal to a size of the structural member along the second direction.

[0038] For example, the schematic diagram of the structural member 2 is as follows: Figure 4 and Figure 5 As shown, Figure 4 and Figure 5 They are schematic diagrams of the structural member 2 at different viewing angles. Figure 3~Figure 5 , the distance L1 between the first groove surface 131 and the second groove surface 141 along the second direction is greater than the size of the structural member along the second direction, or the distance L1 between the first groove surface 131 and the second groove surface 141 along the second direction is equal to the size of the structural member along the second direction, which means that sufficient accommodating space can be formed between the first groove surface 131 and the second groove surface 141 to support the structural member 2.

[0039] In some embodiments, in combination Figure 1 and Figure 3, the first groove surface 131 is perpendicular to the first surface 11, the second groove surface 141 is perpendicular to the first surface 11, and the distance L1 between the first groove surface 131 and the second groove surface 141 along the second direction is equal to the size of the structural member along the second direction. In other embodiments, the first groove surface 131 is perpendicular to the first surface 11, and the distance L1 between the first groove surface 131 and the second groove surface 141 along the second direction is greater than the size of the structural member along the second direction. In still other embodiments, the second groove surface 141 is perpendicular to the first surface 11, and the distance L1 between the first groove surface 131 and the second groove surface 141 along the second direction is greater than the size of the structural member along the second direction.

[0040] For example, refer to Figure 3 and Figure 4 The structural member 2 includes a functional area 21, and a first cutting reserved area 22 and a second cutting reserved area 23 respectively arranged on opposite sides of the functional area 21. The size of the first groove 13 along the second direction is less than or equal to the size of the first cutting reserved area 22 along the second direction, and the size of the second groove 14 along the second direction is less than or equal to the size of the second cutting reserved area 23 along the second direction.

[0041] The space formed between the first groove surface of the first groove 13 and the second groove surface of the second groove 14 is used to support the structural member 2, specifically, the first cutting reserved area 22 of the structural member 2 is overlapped in the groove inside of the first groove 13 opposite to the second groove 14 along the second direction. The second cutting reserved area 23 of the structural member 2 is overlapped in the groove inside of the second groove 14 opposite to the first groove 13 along the second direction.

[0042] Exemplarily, the functional area 21 of the structural member 2 refers to a circuit portion that performs a specific function in an integrated circuit device or an integrated circuit (IC). The functional area 21 is a basic unit when designing an integrated circuit. Each functional area 21 has its own unique electrical characteristics, and they work together to realize the function of the entire integrated circuit. The first cutting reserved area 22 and the second cutting reserved area 23 do not have a similar structure to the functional area 21, that is, in the process of debonding the structural member 2 from the bearing structure, cutting off the area where the first cutting reserved area 22 and the second cutting reserved area 23 are located does not affect the function or characteristics of the structural member 2 itself.

[0043] The size of the first groove 13 along the second direction is smaller than or equal to the size of the first cutting reserved area 22 along the second direction, including that the size of the first groove 13 along the second direction is smaller than the size of the first cutting reserved area 22 along the second direction, and the size of the first groove 13 along the second direction is equal to the size of the first cutting reserved area 22 along the second direction. Such a design ensures that the cutter will not damage the functional area 21 on one side of the first cutting reserved area 22 during the process of cutting along the first side wall to separate the structural member 2 from the bearing structure, thereby ensuring the integrity of the structural member 2 during peeling.

[0044] Similarly, the size of the second groove 14 along the second direction is less than or equal to the size of the second cutting reserved area 23 along the second direction, including the size of the second groove 14 along the second direction is less than the size of the second cutting reserved area 23 along the second direction, and the size of the second groove 14 along the second direction is equal to the size of the second cutting reserved area 23 along the second direction. Such a design ensures that the cutter will not damage the functional area 21 on one side of the second cutting reserved area 23 during the process of cutting along the second side wall to separate the structural member 2 from the bearing structure, thereby ensuring the integrity of the structural member 2 during peeling.

[0045] As a possible implementation, refer to Figure 3 , the depth of the first groove 13 and the second groove 14, that is, the dimension in the third direction, is less than or equal to the thickness of the structural member. The depth of the first groove 13 and the second groove 14 is less than or equal to the thickness of the structural member, so that the upper surface of the structural member supported on the supporting structure is flush with or protrudes from the upper surface of the first groove 13 and the second groove 14. Since the wafer needs to contact the upper surface of the structural member when transferring the structural member temporarily bonded on the supporting structure to the wafer, the depth setting of the first groove 13 and the second groove 14 makes it more convenient to transfer the structural member temporarily bonded on the supporting structure to the wafer.

[0046] In some embodiments, Figure 3 As shown, the size of the first groove 13 along the second direction is equal to the size of the second groove 14 along the second direction. This setting of the same size allows the bearing structure to be repeatedly built using the same mold during the manufacturing process, which simplifies the steps in the process manufacturing and saves manufacturing costs and time. In addition, the size of the first groove 13 along the second direction is equal to the size of the second groove 14 along the second direction, so that when the bearing structure is loaded, the force on the structure is more uniform, which helps to better disperse the pressure when the structure is transferred to the wafer for bonding, thereby protecting the structure.

[0047] In some embodiments, Figure 3 As shown, the depth of the first groove 13, that is, the dimension along the third direction, is equal to the depth of the second groove 14. The equal depth of the first groove 13 and the second groove 14 ensures that the structural member is supported while keeping the structural member in a horizontal state, and the force is more uniform. Similarly, when transferring the structural member and bonding the structural member to the wafer, the pressure can be better dispersed, thereby protecting the structural member.

[0048] As a possible implementation manner, the material of the bearing structure includes at least one of silicon, glass, metal, and ceramic materials.

[0049] As a possible implementation, the material of the structural member includes at least one of silicon, glass, metal, and ceramic material. The present application does not limit the shape of the structural member.

[0050] The present application also provides an integrated circuit packaging method, exemplarily, as Figure 6 As shown, the integrated circuit packaging method includes: S1: Fix the structural member to be packaged on the supporting structure as described above.

[0051] Reference Figure 3 and Figure 5 , wherein fixing the structure 2 to be packaged on the supporting structure as mentioned above means fixing the two ends of the structure in the first groove 13 and the second groove 14 of the supporting structure respectively.

[0052] As a possible implementation, the two ends of the structural member 2 are bonded to the first groove 13 and the second groove 14 of the load-bearing structure through a room temperature curing adhesive layer; or the side wall of the structural member 2 is bonded to the first groove 13 and the second groove 14 of the load-bearing structure through a room temperature curing adhesive layer; or the two ends and the side wall of the structural member 2 are bonded to the first groove 13 and the second groove 14 of the load-bearing structure through a room temperature curing adhesive layer. Exemplarily, glue is applied (temporary spacer glue is applied) at the corner position of the bottom of the first groove 13 away from the first groove surface, such as Figure 3 As shown by the black dots in the figure. Glue is dispensed at the corners of the bottom of the second groove 14 away from the second groove surface. Glue is dispensed at the four corners of the first cutting reserved area 22 and the second cutting reserved area 23 of the structural member 2, as shown in FIG. Figure 4 As shown by the black dots in .

[0053] The structural member 2 is placed in the space formed between the first groove 13 and the second groove 14 , so that the first cutting reserved area 22 of the structural member 2 is connected to the groove bottom of the first groove 13 , and the second cutting reserved area 23 of the structural member 2 is connected to the groove bottom of the second groove 14 .

[0054] This application does not limit the method, shape, position and number of glue dispensing. According to the actual processing conditions, the method of glue dispensing can be automatic machine dispensing or manual dispensing. The shape of the glue dispensing can be round, square or other shapes. The number of glue dispensing can be more or less. However, it must be ensured that the amount of glue at each glue dispensing point is consistent while ensuring that the bonding force is met, so that the structural parts are always in a horizontal state on the load-bearing structure, so that the surface parallelism of the structural parts after temporary bonding with the load-bearing structure meets the subsequent process, for example, the parallelism requirement is less than 0.01mm.

[0055] As a possible implementation method, the bonding adhesive is a room temperature curing adhesive that can be cured by ultraviolet irradiation without heating, thereby preventing the structural parts and load-bearing structural parts from being affected by thermal stress during the curing process of the bonding adhesive.

[0056] As a possible implementation method, a groove can be opened inward on the first groove surface of the first groove, and a groove can be opened inward on the second groove surface of the second groove. Glue is dispensed inside the two grooves and at the same time on the two sides of the structural component.

[0057] Reference Figure 7 , by means of manual or automatic equipment, such as an automatic placement machine, the structural component 2 is placed on the bearing structure 100 after the dispensing, and pressure is applied to the structural component 2 to ensure that the structural component 2 is always parallel to the surface of the bearing structure 100. The transfer of the structural component 2 can be carried out by vacuum suction or clamping. After the structural component 2 is placed in the cavity formed by each first groove and the second groove of the bearing structure 100, a structure is formed as shown in FIG. Figure 7 The structure shown.

[0058] S2: Bonding the wafer to the structural component to form a bonding structure.

[0059] For example, Figure 8 With the help of an alignment device, the supporting structure 100 carrying the structural component is aligned with the matching wafer 3, the structural component is aligned with the pre-planned position on the wafer 3, and the wafer 3 and the structural component are bonded by a bonding device to form a bonding structure.

[0060] S3: Cutting the bonding structure along the first side wall and the second side wall of the groove of the supporting structure respectively to obtain a bonding structure unit separated from the supporting structure.

[0061] For example, Fig. 9 As shown. The cutter 4 cuts the bonding structure along the first side wall 121 and the second side wall 122 of the groove, and cuts off at least a portion of the first cutting reserved area and the second cutting reserved area of ​​the structural member temporarily bonded to the supporting structure, thereby separating the structural member and the bonded wafer from the supporting structure. The number of the obtained bonding structure units 300 is the same as the number of the grooves of the supporting structure. Among them, the bonding structure unit 300 includes a structural member and a plurality of integrated circuits bonded to the structural member.

[0062] As a possible implementation, for example, Fig.10 shown. Fig.10The last two figures in the figure are enlarged schematic diagrams of the first figure before and after cutting in the dotted frame. When cutting along the first side wall 121 of the groove, there is a gap between the cutter 4 and the first side wall 121; when cutting along the second side wall 122 of the groove, there is a gap between the cutter 4 and the second side wall 122. Since the cutter 4 itself has a thickness, such as Fig.10 As shown, the whole structure is wedge-shaped from the blade upward, so when cutting, the cutter 4 is horizontally moved slightly along the first side wall 121 toward the second groove surface, so that some space is retained between the cutter 4 and the first side wall 121. When cutting, the cutter 4 is horizontally moved slightly along the second side wall 122 toward the first groove surface, so that some space is retained between the cutter 4 and the second side wall 122. It is avoided that the lower part of the opening of the first groove and the second groove is damaged during cutting, thereby improving the service life of the bearing structure 100.

[0063] As a possible implementation, the interval between the cutter 4 and the first side wall 121, and the interval between the cutter 4 and the second side wall 122, are greater than or equal to the width of the cutting mark of the cutter. The width of the cutting mark is the widest dimension of the cross section of the cutter along the second direction when the cutter 4 completes the separation of the wafer 3, the structural member 2 and the bearing structure.

[0064] As a possible implementation, for example, Fig. 9 and Fig.11 The bonding structure unit 300 includes a longitudinal extension direction of the bonding structure unit 300, that is, Fig.11 The integrated circuit packaging method further comprises: cutting the bonding structure unit 300 in a direction perpendicular to the length extension direction of the bonding structure unit, that is, in the X direction, to obtain a plurality of integrated circuit packaging structures 400. The integrated circuit packaging structure 400 comprises a structural member and an integrated circuit bonded to the structural member.

[0065] The dicing process is a key step in integrated circuit manufacturing, which involves cutting a complete wafer into individual integrated circuits (dies). Wafers are the basis for the production of integrated circuit devices, and hundreds or thousands of tiny circuits are formed on the wafer through a series of complex process steps. After all these process steps are completed, each integrated circuit on the wafer needs to be separated for packaging and final testing. In the integrated circuit packaging method provided in the present application, the dicing process and the debonding process are combined into one, which simplifies the overall process flow and improves efficiency.

[0066] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application.

[0067] Finally, it should be noted that the above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A bearing structure, characterized in that: The base comprises a first surface, wherein the first surface is perpendicular to the thickness direction of the bearing structure; The first surface is provided with a groove, and the groove is extended along a first direction; the first direction is perpendicular to the thickness direction of the bearing structure; The groove comprises a first side wall and a second side wall arranged opposite to each other in the first direction, the first side wall is provided with a first groove, the second side wall is provided with a second groove, the openings of the first groove and the second groove are located on the first surface and are arranged opposite to each other in the second direction; the second direction is perpendicular to the thickness direction of the bearing structure and perpendicular to the first direction; The depths of the first groove and the second groove are both smaller than the depth of the groove.

2. The bearing structure according to claim 1, characterized in that: The first surface of the base is provided with a plurality of the grooves, and the plurality of the grooves are arranged at intervals along the second direction.

3. The bearing structure according to claim 1, characterized in that: A plurality of first grooves are provided on the first side wall of the groove, a plurality of second grooves are provided on the second side wall of the groove, the plurality of first grooves are arranged at intervals along the first direction, the plurality of second grooves are arranged at intervals along the second direction, and the openings of a first groove and a second groove are arranged opposite to each other in the second direction.

4. The bearing structure according to claim 1, characterized in that: The first groove includes a first groove surface facing the second groove, and the second groove includes a second groove surface facing the first groove; The first groove and the second groove are configured as a load-bearing structural member, and a distance between the first groove surface and the second groove surface along the second direction is greater than or equal to a size of the structural member along the second direction.

5. The bearing structure according to claim 4, characterized in that: The first groove surface is perpendicular to the first surface, and / or the second groove surface is perpendicular to the first surface.

6. The bearing structure according to claim 4, characterized in that: The structural member comprises a functional area, and a first cutting reserved area and a second cutting reserved area respectively arranged on opposite sides of the functional area; A size of the first groove along the second direction is smaller than or equal to a size of the first reserved cutting area along the second direction, and a size of the second groove along the second direction is smaller than or equal to a size of the second reserved cutting area along the second direction.

7. The bearing structure according to claim 4, characterized in that: The depths of the first groove and the second groove are both less than or equal to the thickness of the structural member.

8. The bearing structure according to any one of claims 1 to 7, characterized in that: A size of the first groove along the second direction is equal to a size of the second groove along the second direction.

9. The bearing structure according to any one of claims 1 to 7, characterized in that: The depth of the first groove is equal to the depth of the second groove.

10. An integrated circuit packaging method, characterized in that: include: Fixing the structural member to be packaged on the supporting structure according to any one of claims 1 to 9; wherein two ends of the structural member are respectively fixed in the first groove and the second groove of the supporting structure; Bonding the wafer to the structural member to form a bonding structure; The bonding structure is cut along the first side wall and the second side wall of the groove of the supporting structure respectively to obtain a bonding structure unit separated from the supporting structure; wherein the bonding structure unit includes the structural member and a plurality of integrated circuits bonded to the structural member.

11. The integrated circuit packaging method according to claim 10, characterized in that: The two ends and / or side walls of the structural member are bonded to the first groove and the second groove of the bearing structure through a room temperature curing adhesive layer.

12. The integrated circuit packaging method according to claim 10, characterized in that: When cutting along the first side wall of the groove, there is a gap between the cutting knife and the first side wall; When cutting along the second side wall of the groove, a space is provided between the cutting blade and the second side wall.

13. The integrated circuit packaging method according to claim 12, characterized in that: The interval between the cutting knife and the first side wall, and the interval between the cutting knife and the second side wall, are greater than or equal to the width of the cutting mark of the cutting knife.

14. The integrated circuit packaging method according to any one of claims 10 to 13, characterized in that: The bonding structure unit comprises a plurality of the structural members arranged at intervals along a length extension direction of the bonding structure unit; The integrated circuit packaging method further comprises: The bonding structure unit is cut along a direction perpendicular to the length extension direction of the bonding structure unit to obtain a plurality of integrated circuit packaging structures; wherein the integrated circuit packaging structure includes one of the structural members and an integrated circuit bonded to the structural member.

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