Chip high-speed test connection assembly and chip test device

Abstract

The invention relates to the technical field of chip testing, in particular to a chip high-speed test connection assembly and a chip testing device, and the chip high-speed test connection assembly comprises a to-be-tested chip module and a backboard. The chip module to be tested comprises a PCB, a pinch plate and a test carrier used for bearing the PCB and the pinch plate. The plane where the back plate is located is perpendicular to the plane where the buckle plate is located, and a first high-speed connector is arranged on the side, close to the buckle plate, of the back plate. The buckle plate is provided with a second high-speed connector, and the to-be-tested chip module is driven to be close to or away from the back plate in the direction perpendicular to the back plate, so that the first high-speed connector and the second high-speed connector are connected in an inserted mode or separated from each other. According to the invention, plugging errors caused by manual wiring can be prevented, rapid connection can be realized, and the operation efficiency during chip replacement is improved.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip high-speed testing connection component and a chip testing device. Background Art

[0002] With the continuous development and evolution of AI technology, AI chips have become a key factor in the development of this technology. In the research and development of chips, chip testing devices are usually used to test the performance of chips. Since the chip is tested in its working state, the chip needs to be connected to the supporting module to ensure the normal operation of the chip. Every time a chip test is performed, a large number of cables need to be plugged in. Once the cables are plugged in incorrectly, there is a risk of burning the chip or causing the entire test equipment to fail. In addition, different chips need to be frequently replaced for testing, so it takes a lot of time to plug in the cables, which leads to low test efficiency. Summary of the invention

[0003] The purpose of the present application is to provide a chip high-speed test connection component and a chip testing device, which can not only prevent the plugging errors of manual wiring, but also enable rapid connection and improve the operational efficiency when replacing chips.

[0004] The embodiment of the present application is implemented as follows:

[0005] In the first aspect, an embodiment of the present application provides a chip high-speed test connection component, comprising a chip module to be tested and a backplane; the chip module to be tested comprises a PCB board, a buckle plate and a test carrier for carrying the PCB board and the buckle plate; the plane where the backplane is located is perpendicular to the plane where the buckle plate is located, and a first high-speed connector is provided on the side of the backplane close to the buckle plate; a second high-speed connector is provided on the buckle plate, and the chip module to be tested is driven to approach or move away from the backplane in a direction perpendicular to the backplane, so that the first high-speed connector and the second high-speed connector can be plugged in or separated.

[0006] As an optional embodiment, it also includes a jumper module; the surface of the PCB board close to the jumper module is arranged with a chip to be tested and a third high-speed connector, and the surface of the pinch plate close to the jumper module is arranged with a fourth high-speed connector; the jumper module includes a jumper board; the jumper board is driven close to the chip module to be tested, and the jumper board is inserted into the third high-speed connector and the fourth high-speed connector to enable the PCB board to be communicatively connected with the pinch plate; or, the jumper board is driven away from the chip module to be tested, and the jumper board is pulled out of the third high-speed connector and the fourth high-speed connector to disconnect the PCB board from the pinch plate.

[0007] As an optional embodiment, the jumper module includes two driving units; there are two groups of jumper boards and they are respectively connected to the two driving units; each of the driving units can drive a group of jumper boards to move in a direction perpendicular to the buckle plate; the buckle plate is parallel to the PCB board.

[0008] As an optional embodiment, the jumper module includes a locking block and a floating pin; the locking block is provided with a mounting hole, and the jumper board is installed on the locking block; one end of the floating pin is inserted into the mounting hole, and the other end is connected to the drive unit; the axis of the floating pin is consistent with the movement direction of the jumper board and a spring element is sleeved on the floating pin, and when the jumper board is plugged into the third high-speed connector and / or the fourth high-speed connector, the spring element is compressed to bring the drive unit and the locking block closer to each other.

[0009] As an optional embodiment, a guide pin is provided on the back plate near the buckle plate, and a guide hole is provided on the buckle plate to cooperate with the guide pin; and / or a guide hole is provided on the back plate near the buckle plate, and a guide pin is provided on the buckle plate to cooperate with the guide hole.

[0010] As an optional embodiment, a rotating pressing piece is provided on the test carrier; the surface of the PCB board facing away from the test carrier has an abutment portion; the pressing piece is driven to rotate and abut against the abutment portion, forming a force that prevents the PCB board from separating from the test carrier.

[0011] As an optional implementation, a copper busbar is provided at an edge of the PCB board; the abutting portions are located on the copper busbar and are arranged at intervals along an extension direction of the copper busbar.

[0012] A chip testing device comprises the above-mentioned chip high-speed test connection component and chip test heat dissipation component; the chip test heat dissipation component is located at one side of the chip module to be tested, and the chip test heat dissipation component is provided with a liquid cooling module that can abut against the chip to be tested.

[0013] As an optional implementation, it further includes a chassis; the chassis has a chamber; the test carrier and the chip test heat dissipation assembly are inserted into the chamber.

[0014] As an optional implementation, the chip testing and heat dissipation assembly further includes a lifting mechanism; the jumper module and the liquid cooling module are both driven by the lifting mechanism to move in a vertical direction.

[0015] The beneficial effects of the embodiments of the present application include:

[0016] The embodiment of the present application provides a chip high-speed test connection assembly, including a chip module to be tested and a backplane. The chip module to be tested in the embodiment of the present application includes a PCB board, a gusset plate, and a test carrier for carrying the PCB board and the gusset plate; the plane where the backplane of the embodiment of the present application is located is perpendicular to the plane where the gusset plate is located, and a first high-speed connector is provided on the side of the backplane close to the gusset plate; a second high-speed connector is provided on the gusset plate, and the chip module to be tested is driven to approach or move away from the backplane in a direction perpendicular to the backplane, so that the first high-speed connector and the second high-speed connector can be plugged in or separated. Compared with the prior art, the embodiment of the present application can not only prevent the plug-in errors of manual wiring, but also can quickly connect, thereby improving the operating efficiency when replacing chips.

[0017] The embodiment of the present application provides a chip testing device, including the above-mentioned chip high-speed test connection component and the chip test heat dissipation component; the chip test heat dissipation component is located on one side of the chip module to be tested, and the chip test heat dissipation component is provided with a liquid cooling module that can abut against the chip to be tested. The embodiment of the present application adopts the above-mentioned chip high-speed test connection component, which can not only prevent the plug-in errors of manual wiring, but also can quickly connect and improve the operating efficiency when replacing the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is one of the structural schematic diagrams of the chip testing device according to the embodiment of the present application;

[0020] Figure 2 This is the second structural diagram of the chip testing device according to the embodiment of the present application;

[0021] Figure 3 This is the third structural diagram of the chip testing device according to the embodiment of the present application;

[0022] Figure 4 This is the fourth structural diagram of the chip testing device according to the embodiment of the present application;

[0023] Figure 5 This is the fifth structural diagram of the chip testing device according to the embodiment of the present application;

[0024] Figure 6 This is the sixth structural diagram of the chip testing device according to the embodiment of the present application;

[0025] Figure 7This is the seventh structural diagram of the chip testing device according to the embodiment of the present application;

[0026] Figure 8 This is the eighth structural diagram of the chip testing device according to the embodiment of the present application;

[0027] Fig. 9 This is one of the structural schematic diagrams of the chip test heat dissipation assembly according to the embodiment of the present application;

[0028] Fig.10 This is the second structural diagram of the chip test heat dissipation assembly according to the embodiment of the present application;

[0029] Fig.11 This is the third structural diagram of the chip test heat dissipation assembly according to the embodiment of the present application;

[0030] Fig.12 This is the fourth structural diagram of the chip test heat dissipation assembly according to the embodiment of the present application;

[0031] Fig.13 This is the fifth structural diagram of the chip test heat dissipation assembly according to the embodiment of the present application;

[0032] Fig.14 This is the sixth structural diagram of the chip test heat dissipation component of the embodiment of the present application.

[0033] icon:

[0034] 100-liquid cooling module; 101-first contact surface; 102-chip to be tested; 103-second contact surface; 104-driving module; 105-lifting mechanism; 106-lifting assembly plate; 107-pressure sensor; 108-connecting plate; 109-support plate; 110-adjusting member; 111-bottom support seat; 112-guide through hole; 113-first connecting rod; 114-second connecting rod; 115-linear driving module; 116-pushing member; 200- Jumper module; 201-PCB board; 202-buckle board; 203-test carrier; 204-third high-speed connector; 205-fourth high-speed connector; 206-jumper board; 207-drive unit; 208-positioning block; 209-floating pin; 210-back panel; 211-first high-speed connector; 212-second high-speed connector; 213-chassis; 214-guide pin; 215-rotating pressing piece; 216-abutment portion; 217-wiring copper busbar. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0037] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0038] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0039] With the continuous development and evolution of AI technology, AI chips have become a key factor in the development of this technology. In the research and development of chips, chip testing devices are usually used to test the performance of chips. Since the chip is tested in its working state, the chip needs to be connected to the supporting module to ensure the normal operation of the chip. Every time a chip test is performed, a large number of cables need to be plugged in. Once the cables are plugged in incorrectly, there is a risk of burning the chip or causing the entire test equipment to fail. In addition, different chips need to be frequently replaced for testing, so it takes a lot of time to plug in the cables, which leads to low test efficiency.

[0040] In order to solve the above technical problems, the embodiments of the present application provide a chip high-speed test connection component and a chip testing device.

[0041] Reference Figure 1 , Figure 2As shown, an embodiment of the present application provides a chip high-speed test connection component, including a chip module to be tested and a jumper module 200; the chip module to be tested includes a PCB board 201, a buckle board 202 and a test carrier 203 for carrying the PCB board 201 and the buckle board 202.

[0042] Reference Figure 3 , Figure 5 as well as Figure 6 As shown, the embodiment of the present application includes a backplane 210; the plane where the backplane 210 is located is perpendicular to the plane where the buckle plate 202 is located, and a first high-speed connector 211 is arranged on the side of the backplane 210 close to the buckle plate 202; a second high-speed connector 212 is arranged on the buckle plate 202, and the chip module to be tested is driven to approach or move away from the backplane 210 in a direction perpendicular to the backplane 210, so that the first high-speed connector 211 and the second high-speed connector 212 can be plugged in or separated.

[0043] It should be noted that the backplane 210 of the embodiment of the present application can be fixed in a chassis 213 for accommodating a chip high-speed test connection assembly, and the backplane 210 is connected to a test mainboard via a cable. The test mainboard can test the chip 102 to be tested.

[0044] The first high-speed connector 211 of the embodiment of the present application matches the second high-speed connector 212 to ensure that the two can be accurately aligned and achieve reliable communication connection. The main function of the backplane 210 and the pinch plate 202 of the embodiment of the present application is to serve as a bridge between the PCB board 201 and the test mainboard to ensure that the chip 102 to be tested can communicate with the test mainboard through the backplane 210 and the pinch plate 202.

[0045] The test carrier 203 can be manually pushed into or pulled out of the chassis 213 by the staff, and the first high-speed connector 211 and the second high-speed connector 212 can be automatically connected and disconnected by setting a guide structure in the chassis 213. The embodiment of the present application can greatly shorten the preparation time required for each test, reduce the manual plugging of cables, and is particularly suitable for large-scale production and automated testing environments. In particular, when different chips need to be frequently replaced, the embodiment of the present application can significantly improve the test efficiency.

[0046] In addition, since the connection between the backplane 210 and the test mainboard is fixed, each time the chip to be tested 102 is replaced, the plugging or detaching operation can be completed by simply moving the test carrier 203. This design simplifies the replacement process of the chip to be tested 102, saves a lot of manpower time, and further improves the test efficiency.

[0047] Furthermore, in the embodiment of the present application, the surface of the PCB board 201 close to the jumper module 200 is arranged with the chip to be tested 102 and the third high-speed connector 204, and the surface of the pinch plate 202 close to the jumper module 200 is arranged with the fourth high-speed connector 205; the jumper module 200 includes a jumper board 206; the jumper board 206 is driven close to the chip module to be tested, and the jumper board 206 is inserted into the third high-speed connector 204 and the fourth high-speed connector 205 to enable the PCB board 201 to communicate with the pinch plate 202; or, the jumper board 206 is driven away from the chip module to be tested, and the jumper board 206 can unplug the third high-speed connector 204 and the fourth high-speed connector 205 to disconnect the PCB board 201 from the pinch plate 202.

[0048] It should be noted that the PCB board 201 of the embodiment of the present application is provided with the chip under test 102 and the third high-speed connector 204 for communication connection with the jumper module 200. The PCB board 201 is the carrier of the chip under test 102 and is responsible for providing the power supply, signal input and output and other interfaces required by the chip under test 102.

[0049] It should be noted that the test carrier 203 is a support plate for supporting the PCB board 201 and the pinch plate 202 to ensure that the PCB board 201 and the pinch plate 202 remain stable during the test.

[0050] The jumper board 206 of the embodiment of the present application can be inserted into or removed from the third high-speed connector 204 and the fourth high-speed connector 205, thereby realizing the communication connection or disconnection between the PCB board 201 and the pinch board 202. The jumper board 206 is controlled by the driving unit 207 and can move in a direction perpendicular to the test carrier 203, approaching or moving away from the chip module to be tested.

[0051] When chip testing is required, the driving unit 207 pushes the jumper board 206 to move closer to the test carrier 203, so that it can be inserted into the third high-speed connector 204 on the PCB board 201 and the fourth high-speed connector 205 on the pinch board 202. At this time, the jumper board 206 acts as a bridge to achieve electrical connection between the PCB board 201 and the pinch board 202, ensuring that the chip 102 to be tested can work normally and communicate with the test equipment.

[0052] When the test is finished or the chip needs to be replaced, the driving unit 207 drives the jumper board 206 to move away from the test carrier 203, so that it unplugs the third high-speed connector 204 and the fourth high-speed connector 205. At this time, the electrical connection between the PCB board 201 and the pinch board 202 is disconnected, and the communication between the chip to be tested 102 and the test equipment is also interrupted accordingly. This design makes it easier to replace the chip and reduces the need for frequent plugging of cables.

[0053] Traditional chip testing methods require manual plugging of a large number of cables, which can easily lead to plugging errors, which in turn cause chip damage or test equipment failure. The chip high-speed test connection assembly of the present application realizes the automatic connection and disconnection between the PCB board 201 and the buckle board 202 through the combination of the jumper board 206 and the drive mechanism. The embodiment of the present application eliminates the step of manually plugging cables, avoids the risks caused by plugging errors, and significantly improves the safety of the test.

[0054] The chip high-speed test connection assembly of the present application makes it easier to replace the chip through an automated design. The tester only needs to install a new chip 102 to be tested on the PCB board 201, and the drive mechanism will automatically complete the insertion and removal of the jumper board 206 without the need to manually plug in cables. This greatly shortens the time for chip replacement and improves test efficiency.

[0055] The insertion and removal process of the jumper board 206 in the embodiment of the present application is precisely controlled by the driving unit 207, ensuring that the electrical connection between the PCB board 201 and the pinch board 202 is always in a stable state. Such a stable electrical connection helps to improve the accuracy of the test and ensure the reliability and consistency of the test results.

[0056] Reference Figure 1 , Figure 4 as well as Fig.14 As shown, as an optional embodiment, the jumper module 200 includes two driving units 207; there are two groups of jumper boards 206 and they are respectively connected to the two driving units 207; each driving unit 207 can drive a group of jumper boards 206 to move in a direction perpendicular to the buckle plate 202; wherein, the plane where the test carrier 203 is located, the buckle plate 202 and the PCB board 201 are parallel.

[0057] It should be noted that the jumper module 200 of the embodiment of the present application includes two driving units 207 , and each driving unit 207 can drive a group of jumper boards 206 to move in a direction perpendicular to the pinch plate 202 .

[0058] In the embodiment of the present application, the first group of jumper boards 206 are connected to the third high-speed connector 204, and the second group of jumper boards 206 are connected to the fourth high-speed connector 205. The number and location of the high-speed connectors in the third high-speed connector 204 and the fourth high-speed connector 205 can be set by those skilled in the art as needed, and are not particularly limited.

[0059] The number of jumper boards 206 included in the first group of jumper boards 206 is consistent with the number of third high-speed connectors 204, and the positions correspond one to one. The number of jumper boards 206 included in the second group of jumper boards 206 is consistent with the number of fourth high-speed connectors 205, and the positions correspond one to one.

[0060] in, Fig. 9 is a schematic diagram of the structure of the first group of jumper boards 206; Fig.14 2 is a schematic diagram of the structure of the second set of jumper boards 206.

[0061] Reference Figure 4 As shown, as an optional embodiment, the jumper module 200 includes a locking block 208 and a floating pin 209; the locking block 208 has a mounting hole, and the jumper board 206 is installed on the locking block 208; one end of the floating pin 209 is inserted into the mounting hole, and the other end is connected to the drive unit 207; the axis of the floating pin 209 is consistent with the movement direction of the jumper board 206 and a spring element is sleeved on the floating pin 209. When the jumper board 206 is plugged into the third high-speed connector 204 and / or the fourth high-speed connector 205, the spring element is compressed to bring the drive unit 207 and the locking block 208 close to each other.

[0062] It should be noted that the jumper module 200 of the embodiment of the present application further includes a positioning block 208 and a floating pin 209. The floating pin 209 is not only a connector between the jumper board 206 and the drive unit 207, but also plays a supporting and guiding role. Through the design of the floating pin 209, the jumper board 206 can float freely within a certain range, adapting to the third high-speed connector 204 and the fourth high-speed connector 205 at different positions, ensuring the smoothness of the plug-in process.

[0063] The main function of the spring element of the embodiment of the present application is to provide a floating gap for the jumper board 206, allowing the jumper board 206 to have a certain displacement margin during the plug-in process. The floating gap of the embodiment of the present application can effectively avoid the rigid collision between the jumper board 206 and the high-speed connector, reduce the impact force during plug-in, and protect the jumper board 206 and the high-speed connector from damage. When the jumper board 206 is plugged into the high-speed connector, the spring element will be compressed and play a buffering role. The buffering mechanism can effectively absorb the impact energy generated during the plug-in process, prevent excessive force from being directly transmitted to the high-speed connector or the jumper board 206, and further reduce the risk of damage.

[0064] The floating design of the spring element in the embodiment of the present application enables the jumper module 200 to adapt to different high-speed connector positions and insertion depths, reducing the requirements for assembly accuracy. Even if the high-speed connector position is slightly deviated, the jumper module 200 can automatically adjust to ensure smooth insertion. This not only improves the fault tolerance of assembly, but also simplifies maintenance work and reduces the troubleshooting time caused by poor insertion.

[0065] The specific size of the floating gap can be set by those skilled in the art as required and is not particularly limited thereto.

[0066] Reference Figure 6 As shown, as an optional embodiment, a guide pin 214 is provided on the back panel 210 near the buckle plate 202, and a guide hole that cooperates with the guide pin 214 is provided on the buckle plate 202; the difference is that a guide hole is provided on the back panel 210 near the buckle plate 202 in the embodiment of the present application, and a guide pin 214 that cooperates with the guide hole is provided on the buckle plate 202.

[0067] In the embodiment of the present application, a guide structure is formed by the guide hole and the guide pin 214 when the first high-speed connector 211 and the second high-speed connector 212 are plugged in, which is conducive to achieving accurate plugging.

[0068] It should be noted that the specific models of the third high-speed connector 204, the fourth high-speed connector 205, the first high-speed connector 211 and the second high-speed connector 212 in the embodiment of the present application can be set by those skilled in the art as needed.

[0069] Reference Figure 2 as well as Figure 7 As shown, as an optional embodiment, a rotating pressing member 215 is provided on the test carrier 203; the surface of the PCB board 201 facing away from the test carrier 203 has an abutment portion 216; the rotating pressing member 215 is driven to rotate and abut against the abutment portion 216, forming a force to prevent the PCB board 201 from separating from the test carrier 203.

[0070] It should be noted that after the rotating pressing member 215 rotates and presses the abutting portion 216, the rotating pressing member 215 can be locked by locking members such as bolts to prevent it from being separated from the abutting portion 216 due to vibration during testing, which is beneficial to improving the reliability of pressing.

[0071] In the embodiment of the present application, a flexible gasket is arranged on the rotating pressing member 215, and the rotating pressing member 215 abuts against the abutting portion 216 through the flexible gasket to achieve flexible pressing. The above arrangement can achieve flexible protection for the PCB board 201 and prevent damage to the PCB board 201.

[0072] A copper busbar 217 is disposed at the edge of the PCB board 201 ; the contact portions 216 are located on the copper busbar 217 and are arranged at intervals along the extending direction of the copper busbar 217 .

[0073] It should be noted that the embodiment of the present application can realize the rapid fixation and removal of the PCB board 201 by rotating the pressing member 215, so as to facilitate the rapid replacement of different PCB boards 201 during the detection process.

[0074] A chip testing device provided in an embodiment of the present application includes the above-mentioned chip high-speed test connection component and chip test heat dissipation component; the chip test heat dissipation component is located on one side of the chip module to be tested, and a liquid cooling module 100 that can abut against the chip 102 to be tested is provided on the chip test heat dissipation component.

[0075] It should be noted that, refer to Figure 8 As shown, the embodiment of the present application further includes a chassis 213; the chassis 213 has a chamber; the test carrier 203 and the chip test heat dissipation component are inserted into the chamber.

[0076] Reference Fig. 9 , Fig.10 as well as Fig.11 As shown, the chip test heat dissipation component of the embodiment of the present application includes a liquid cooling module 100 arranged on one side of the chip to be tested 102; the liquid cooling module 100 has a first contact surface 101, and the chip to be tested 102 has a second contact surface 103 parallel to the first contact surface 101; and also includes a driving module 104, the driving module 104 drives the liquid cooling module 100 to move in a direction perpendicular to the first contact surface 101, so that the first contact surface 101 is in contact with or separated from the second contact surface 103.

[0077] It should be noted that the liquid cooling module 100 is responsible for conducting heat away from the chip under test 102. A first contact surface 101 is provided on the liquid cooling module 100, and the first contact surface 101 is parallel to a second contact surface 103 of the chip under test 102, and the first contact surface 101 and the second contact surface 103 can be in close contact. The liquid cooling module 100 contains a cooling liquid channel inside, and the cooling liquid in the cooling liquid channel circulates through a pump to take away the heat generated by the chip under test 102.

[0078] It should be noted that the driving module 104 can control the liquid cooling module 100 to contact or separate from the chip to be tested 102. The driving module 104 can drive the liquid cooling module 100 to move in a direction perpendicular to the first contact surface 101, so that the first contact surface 101 of the liquid cooling module 100 contacts or separates from the second contact surface 103 of the chip to be tested 102. The design of the driving module 104 ensures that the contact force between the liquid cooling module 100 and the chip is controllable, avoiding damage to the chip caused by excessive pressure.

[0079] In the embodiment of the present application, a thermally conductive gasket is provided on the first contact surface 101 of the liquid cooling module 100. When the liquid cooling module 100 abuts against the chip to be tested 102, the thermally conductive gasket can eliminate the gap between the liquid cooling module 100 and the chip to be tested 102, so as to form a better thermal conductivity effect between the chip to be tested 102 and the liquid cooling module 100.

[0080] Different from the traditional pressing mechanism, the driving module 104 in the present application can accurately control the contact force between the liquid cooling module 100 and the chip under test 102. By adjusting the thrust of the driving module 104, it can be ensured that the contact force between the liquid cooling module 100 and the chip under test 102 is kept within a safe range, which not only ensures a good heat conduction effect, but also avoids applying excessive pressure to the chip under test 102 to prevent damage to the chip.

[0081] When the test is finished or the chip 102 to be tested needs to be replaced, the driving module 104 will drive the liquid cooling module 100 to move downward, so that the first contact surface 101 of the liquid cooling module 100 is separated from the second contact surface 103 of the chip 102 to be tested. This separation mechanism not only facilitates the loading and unloading of the chip, but also avoids the secondary damage to the chip that may be caused by the traditional pressing mechanism during the separation process.

[0082] It should be noted that the chip under test 102 in the embodiment of the present application can be arranged horizontally, and the chip test heat dissipation component is arranged below the chip under test 102. The driving module 104 can push the liquid cooling module 100 to move upward, so that the liquid cooling module 100 contacts the second contact surface 103 of the chip under test 102, thereby achieving heat dissipation of the chip under test 102.

[0083] The layout of the chip under test 102 and the chip test heat dissipation assembly may also be adjusted as needed.

[0084] Exemplarily, the heat dissipation component is disposed above the chip under test 102 , and the driving module 104 controls the liquid cooling module 100 to move downward to contact the chip under test 102 .

[0085] Exemplarily, the chip under test 102 is vertically arranged, the heat dissipation component is arranged on one side of the chip under test 102 , and the driving module 104 controls the liquid cooling module 100 to move horizontally close to the chip under test 102 so that the liquid cooling module 100 contacts the chip under test 102 .

[0086] Different from the prior art, the embodiment of the present application controls the movement of the liquid cooling module 100 through the driving module 104, accurately controls the contact force between the liquid cooling module 100 and the chip, ensures that the chip will not be subjected to excessive pressure during the test, avoids damage to the chip, and is conducive to improving the safety of chip testing. The driving module 104 realizes the automatic operation of contact and separation between the liquid cooling module 100 and the chip, simplifies the operation process, and improves the test efficiency.

[0087] Reference Fig.11As shown, as an optional embodiment, the driving module 104 includes a lifting mechanism 105 and a lifting combination plate 106 arranged horizontally and located below the chip to be tested 102; the liquid cooling module 100 is arranged on the lifting combination plate 106, and the lifting mechanism 105 drives the liquid cooling module 100 to move in the vertical direction through the lifting combination plate 106.

[0088] It should be noted that the lifting mechanism 105 of the embodiment of the present application can be driven by a motor or a telescopic cylinder. When chip testing is required, the lifting mechanism 105 will push the lifting assembly plate 106 to move upward, so that the first contact surface 101 of the liquid cooling module 100 is in close contact with the second contact surface 103 of the chip to be tested 102; when the test is completed or the chip needs to be replaced, the lifting mechanism 105 will drive the lifting assembly plate 106 to move downward, so that the liquid cooling module 100 is separated from the chip.

[0089] The lifting assembly plate 106 is provided with a pressure sensor 107 on the plane in contact with the liquid cooling module 100 . When the first contact surface 101 contacts the second contact surface 103 , the pressure sensor 107 is used to detect the abutting force between the liquid cooling module 100 and the chip to be tested 102 .

[0090] It should be noted that the pressure sensor 107 is used to monitor the contact force between the liquid cooling module 100 and the chip to be tested 102 to ensure that the contact force is always kept within a safe range. If the detected contact force is too large, the pressure sensor 107 will immediately feed back to the control system of the embodiment of the present application, and the control system can issue a warning after receiving the signal. The lifting mechanism 105 will automatically adjust the lifting speed of the liquid cooling module 100 or stop lifting to prevent excessive pressure from being applied to the chip and avoid damage to the chip.

[0091] It should be noted that the embodiment of the present application can set a safety threshold through the pressure sensor 107. When the pressure sensor 107 detects that the contact force exceeds the preset safety threshold, the control system will automatically adjust the movement of the lifting mechanism 105, slow down the lifting speed of the liquid cooling module 100 or stop lifting until the contact force returns to a safe range. The embodiment of the present application can achieve automatic adjustment, which not only protects the chip, but also improves the reliability and consistency of the test.

[0092] In addition, the embodiment of the present application avoids local overpressure between the liquid cooling module 100 and the chip by precisely controlling the contact force, thereby preventing local overheating, which helps to improve the stability and reliability of the chip and extend its service life.

[0093] Reference Fig.12As shown, as an optional embodiment, the lifting combination plate 106 includes a connecting plate 108 and a supporting plate 109; the liquid cooling module 100 is arranged on the surface of the supporting plate 109 facing away from the connecting plate 108; the connecting plate 108 is connected to the lifting mechanism 105; a spring element is arranged on the connecting plate 108, one end of which abuts against the supporting plate 109, and the compression of the spring element generates a force that pushes the liquid cooling module 100 to abut against the chip to be tested 102.

[0094] It should be noted that a plurality of groups of spring elements may be provided on the connecting plate 108 in the embodiment of the present application, wherein the specific number and arrangement positions of the spring elements may be set by technicians in the field as required, and are not particularly limited thereto.

[0095] Exemplarily, four groups of spring elements are disposed on the connecting plate 108 , and the four groups of spring elements are distributed at intervals on the connecting plate 108 .

[0096] The spring element of the embodiment of the present application is arranged between the connecting plate 108 and the supporting plate 109, with one end abutting against the supporting plate 109 and the other end abutting against the adjusting member 110 on the connecting plate 108. The function of the spring element is to provide an elastic thrust when the liquid cooling module 100 contacts the chip under test 102, so that an elastic abutment is formed between the liquid cooling module 100 and the chip to be tested, thereby playing a buffering role.

[0097] It should be noted that, since the spring element has elastic properties, the embodiment of the present application can automatically adjust the contact force according to the contact condition between the liquid cooling module 100 and the chip to be tested 102, ensuring that the contact force is always kept within a safe range. The elastic contact method of the embodiment of the present application not only avoids damage to the chip to be tested 102 due to excessive pressure, but also ensures a good heat conduction effect.

[0098] Further, see Fig.12 As shown, an adjusting member 110 is provided on the connecting plate 108 and abuts against the other end of the spring element; when the liquid cooling module 100 abuts against the chip to be tested 102, the adjusting member 110 moves closer to or away from the supporting plate 109 to adjust the force of the spring element.

[0099] The adjusting member 110 of the embodiment of the present application can adjust the compression of the spring element by moving closer to or farther away from the support plate 109, thereby adjusting the force of the spring element on the liquid cooling module 100. Among them, the embodiment of the present application can accurately control the compression degree of the spring element by adjusting the adjusting member 110, thereby adjusting the contact force between the liquid cooling module 100 and the chip to be tested 102. This adjustable design enables the system to flexibly adjust the contact force according to different chip types, sizes and heat dissipation requirements, ensuring that the best heat dissipation effect can be achieved in each test.

[0100] Reference Fig. 9, Fig.13 As shown, as an optional embodiment, the lifting mechanism 105 includes a bottom support seat 111 and a guide shaft; a guide through hole 112 is provided on the lifting plate; one end of the guide shaft is provided on the bottom support seat 111, and the other end is passed through the guide through hole 112 along a direction vertical to the lifting plate.

[0101] The embodiment of the present application can ensure the axial movement of the lifting plate along the guide shaft through the setting of the guide shaft. The coordinated setting of the guide shaft and the guide through hole 112 can enable the lifting plate to drive the liquid cooling module 100 to move accurately in the vertical direction, thereby improving the stability of the lifting movement.

[0102] Specifically, refer to Fig.13 As shown, the lifting mechanism 105 of the embodiment of the present application includes a first connecting rod 113, a second connecting rod 114 and a linear drive module 115; the first end of the first connecting rod 113 is connected to the bottom support seat 111, and the first end of the second connecting rod 114 is connected to the lifting combination plate 106; the second end of the first connecting rod 113 and the second end of the second connecting rod 114 are hinged to form a double connecting rod; a pushing member 116 is provided on the linear drive module 115, and the pushing member 116 has a guide groove extending in the vertical direction; a guide member cooperating with the guide groove is provided on the double connecting rod; the pushing member 116 is driven to move the guide groove in the horizontal direction, and under the action of the guide groove, the guide block drives the lifting combination plate 106 to move through the double connecting rod.

[0103] When the first connecting rod 113 and the second connecting rod 114 both move to the vertical direction, the first connecting rod 113 and / or the second connecting rod 114 abut against the bottom support seat 111 .

[0104] It should be noted that the linear drive module 115 in the embodiment of the present application may be a ball screw.

[0105] In the embodiment of the present application, the servo motor can drive the ball screw so that the first connecting rod 113 and the second connecting rod 114 move to a vertical state. At this time, the double connecting rod abuts against the bottom support seat 111 and reaches the dead point. At this time, the gravity generated by the liquid cooling module 100 and the lifting assembly plate 106 is offset by the support force of the first connecting rod 113 and the second connecting rod 114. Therefore, the ball screw and the servo motor have no reaction force at this time. The force of the spring element on the liquid cooling module 100 can be adjusted by the adjusting member 110.

[0106] It should be noted that the lifting mechanism 105 of the embodiment of the present application may also be a telescopic component or other driving structure. The telescopic component may be a telescopic motor or a telescopic cylinder. Those skilled in the art may configure it as required, and no special limitation is made to this.

[0107] It should be noted that the chip testing heat dissipation assembly provided in the embodiment of the present application also includes a controller and an operation panel.

[0108] The workflow of the embodiment of the present application is:

[0109] The staff can turn on the machine by pressing the buttons or touch keys on the operation panel.

[0110] The controller controls the driving module 104 to move, and the liquid cooling module 100 is automatically lifted up so that the first contact surface 101 fits with the chip to be tested 102 to achieve targeted heat dissipation.

[0111] The safety threshold is set by the pressure sensor 107. When the pressure sensor 107 detects that the contact force exceeds the preset safety threshold, the controller automatically adjusts the movement of the lifting mechanism 105 to slow down the lifting speed of the liquid cooling module 100 or stops lifting until the contact force returns to a safe range.

[0112] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip high-speed test connection component, characterized in that: The invention comprises a chip module to be tested and a backplane (210); the chip module to be tested comprises a PCB board (201), a gusset board (202) and a test carrier (203) for carrying the PCB board (201) and the gusset board (202); the plane where the backplane (210) is located is perpendicular to the plane where the gusset board (202) is located, and a first high-speed connector (211) is arranged on the side of the backplane (210) close to the gusset board (202); a second high-speed connector (212) is arranged on the gusset board (202), and the chip module to be tested is driven to approach or move away from the backplane (210) in a direction perpendicular to the backplane (210), so that the first high-speed connector (211) and the second high-speed connector (212) can be plugged in or separated.

2. The chip high-speed test connection assembly according to claim 1, characterized in that: The invention also comprises a jumper module (200); a chip to be tested (102) and a third high-speed connector (204) are arranged on a surface of the PCB board (201) close to the jumper module (200); a fourth high-speed connector (205) is arranged on a surface of the pinch plate (202) close to the jumper module (200); the jumper module (200) comprises a jumper board (206); the jumper board (206) is driven close to the chip module to be tested, and the jumper board (206) is inserted into the third high-speed connector (204) and the fourth high-speed connector (205) so that the PCB board (201) and the pinch plate (202) are connected in communication; or the jumper board (206) is driven away from the chip module to be tested, and the jumper board (206) is pulled out of the third high-speed connector (204) and the fourth high-speed connector (205) so that the PCB board (201) and the pinch plate (202) are disconnected.

3. The chip high-speed test connection assembly according to claim 2, characterized in that: The jumper module (200) comprises two drive units (207); there are two groups of jumper boards (206) which are respectively connected to the two drive units (207); each of the drive units (207) is capable of driving a group of jumper boards (206) to move in a direction perpendicular to the pinch plate (202); the pinch plate (202) is parallel to the PCB board (201).

4. The chip high-speed test connection assembly according to claim 3, characterized in that: The jumper module (200) comprises a positioning block (208) and a floating pin (209); the positioning block (208) is provided with a mounting hole, and the jumper board (206) is mounted on the positioning block (208); one end of the floating pin (209) is inserted into the mounting hole, and the other end is connected to the drive unit (207); the axis of the floating pin (209) is consistent with the movement direction of the jumper board (206) and a spring element is sleeved on the floating pin (209); when the jumper board (206) is plugged into the third high-speed connector (204) and / or the fourth high-speed connector (205), the spring element is compressed to bring the drive unit (207) and the positioning block (208) closer to each other.

5. The chip high-speed test connection assembly according to claim 2, characterized in that: A guide pin (214) is provided on one side of the back plate (210) close to the buckle plate (202), and a guide hole is provided on the buckle plate (202) to cooperate with the guide pin (214); and / or a guide hole is provided on one side of the back plate (210) close to the buckle plate (202), and a guide pin (214) is provided on the buckle plate (202) to cooperate with the guide hole.

6. The chip high-speed test connection assembly according to any one of claims 2 to 4, characterized in that: A rotating pressing piece (215) is provided on the test carrier (203); a surface of the PCB board (201) facing away from the test carrier (203) has an abutment portion (216); the pressing piece is driven to rotate and can abut against the abutment portion (216), thereby forming a force that blocks the PCB board (201) from separating from the test carrier (203).

7. The chip high-speed test connection assembly according to claim 6, characterized in that: A copper wiring bar (217) is provided at the edge of the PCB board (201); the abutment portions (216) are located on the copper wiring bar (217) and are arranged at intervals along the extension direction of the copper wiring bar (217).

8. A chip testing device, characterized in that: It comprises a chip high-speed test connection component and a chip test heat dissipation component as described in any one of claims 2 to 7; the chip test heat dissipation component is located on one side of the chip module to be tested, and the chip test heat dissipation component is provided with a liquid cooling module (100) that can abut against the chip (102) to be tested.

9. The chip testing device according to claim 8, characterized in that: It also includes a chassis (213); the chassis (213) has a chamber; the test carrier (203) and the chip test heat dissipation component are inserted into the chamber.

10. The chip testing device according to claim 9, characterized in that: The chip testing heat dissipation assembly further comprises a lifting mechanism (105); the jumper module (200) and the liquid cooling module (100) are both driven by the lifting mechanism (105) to move in a vertical direction.

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