Sun grain fin radiator
By designing sun-shaped fins in the radiator and using the cross-heat main frame to divide the heat dissipation surface into multiple areas, the problems of low heat dissipation efficiency and unevenness in the prior art are solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202411906081.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-04-22
AI Technical Summary
In the prior art, the heat dissipation efficiency of the radiator is low and the heat dissipation is uneven, resulting in high local temperature of the electronic device and affecting performance.
A sun-shaped fin radiator is designed to divide the heat dissipation surface into multiple areas through two crossed heat dissipation main frames, and each area forms sun-shaped fins to increase the heat dissipation area and improve heat dissipation efficiency.
The heat dissipation uniformity and heat dissipation efficiency are improved, and the temperature in the central area is reduced and the heat dissipation is promoted by increasing the heat dissipation area and improving the fin layout.
Smart Images

Figure CN119865997A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of radiators, and in particular to a sunburst fin radiator. Background Art
[0002] Electronic devices need a heat sink to speed up the heat dissipation, and the heat sink is usually made by cutting the heat dissipation profile according to actual needs. The heat dissipation profile has the characteristics of good thermal conductivity, light weight, and suitable for mass production. The heat dissipation effect of the heat dissipation profile fundamentally depends on the total surface area of the heat dissipation surface. Generally speaking, the larger the total surface area of heat dissipation, the better the heat dissipation effect. The size of the total surface area of heat dissipation is usually determined by the length of the heat dissipation fins and the number of heat dissipation fins. In the prior art, the heat dissipation fins for chips are usually linear, that is, the electronic devices are installed on the mounting surface of the heat sink, and the heat dissipation surfaces are all heat dissipation fins extending in the same direction. Such heat dissipation fins pass through the central area of the heat dissipation surface because the heat dissipation is not as timely as the heat dissipation of the edge area, resulting in a higher temperature in the central area, resulting in a situation where the local temperature of the electronic device is higher than the temperature of other areas, that is, uneven heat dissipation, affecting the performance of the electronic device. Moreover, the heat dissipation efficiency of all-linear heat dissipation fins still needs to be improved. Summary of the invention
[0003] Based on the above problems, the present invention provides a sun-patterned fin heat sink to solve the technical problems of the prior art heat sink that the heat dissipation efficiency needs to be improved and the heat dissipation is uneven.
[0004] A sun-patterned fin heat sink comprises a heat sink base plate, an electronic device is mounted on the mounting surface of the heat sink base plate, and the heat sink surface of the heat sink base plate is a non-planar surface with uneven surfaces;
[0005] The heat dissipation surface of the heat dissipation base plate includes a first heat dissipation area;
[0006] The first heat dissipation region has two intersecting heat dissipation main frames, which divide the first heat dissipation region into a first sub-region, a second sub-region, a third sub-region and a fourth sub-region, and the first sub-region is adjacent to the second sub-region and the fourth sub-region respectively, and is opposite to the third sub-region;
[0007] The first sub-region and the third sub-region are provided with heat dissipation fins connected to the side wall of the heat dissipation main frame, extending along the first direction and arranged in the second direction, and the first direction and the second direction do not overlap;
[0008] The second sub-region and the fourth sub-region are provided with heat dissipation fins connected to the side wall of the heat dissipation main frame, extending along the second direction and arranged in the first direction;
[0009] The heat dissipation fins and the convex areas of the heat dissipation surface of the heat dissipation base plate correspond to each other up and down.
[0010] Furthermore, the heat dissipation base plate further includes a second heat dissipation area and a third heat dissipation area, and the first heat dissipation area is located between the second heat dissipation area and the third heat dissipation area;
[0011] The second heat dissipation area and the third heat dissipation area are provided with heat dissipation fins extending along the first direction and arranged in the second direction.
[0012] Furthermore, the heat dissipation surface of the heat dissipation base plate and the area corresponding to the heat dissipation fins form bottom ribs, the lower edges of the heat dissipation fins are connected to the corresponding bottom ribs, and a recess is formed between two adjacent bottom ribs, so that the heat dissipation surface of the heat dissipation base plate becomes a non-planar surface with uneven surfaces.
[0013] Furthermore, the cross section of the bottom rib is semicircular or trapezoidal.
[0014] Furthermore, the heat dissipation fins on the first heat dissipation area, the second heat dissipation area and the third heat dissipation area are arranged at equal intervals.
[0015] Furthermore, at least one protrusion is provided on one surface of at least part of the heat dissipation fins.
[0016] Further, the heat dissipation base plate includes a first side edge and a second side edge that are opposite to each other;
[0017] The first side edge and the second side edge opposite to each other are respectively provided with a heat dissipation mounting plate;
[0018] The heat sink mounting plate is used to fix the heat sink to the external device;
[0019] The heat dissipation mounting plate is also provided with heat dissipation fins.
[0020] Further, the heat dissipation fins on the heat dissipation mounting plate extend along the second direction and are arranged along the first direction;
[0021] The heat dissipation base plate also includes a third side edge and a fourth side edge that are opposite to each other;
[0022] The heat dissipation fins of the second heat dissipation area extend to the third side;
[0023] The heat dissipation fins of the third heat dissipation area extend to the fourth side.
[0024] Furthermore, the heat dissipation mounting plate is an L-shaped plate formed by connecting a horizontal plate and a vertical plate;
[0025] The vertical plates are connected to the heat dissipation base plate, and the vertical plates at the first side and the second side form retaining edges on the heat dissipation surface and the mounting surface of the heat dissipation base plate;
[0026] The bottom of the heat dissipation fin of the heat dissipation mounting plate is connected to the horizontal plate, and one side of the heat dissipation fin of the heat dissipation mounting plate is connected to the vertical plate.
[0027] The beneficial technical effect of the present invention is that the heat dissipation area of the heat dissipation surface is divided into four areas by two crossed heat dissipation main frames, and each area forms a heat dissipation fin, which increases the heat dissipation area while allowing the central area to dissipate heat to the outside through more channels. Because the heat dissipation fins are divided into areas, they are shorter than the heat dissipation fins that go all the way to the bottom of the prior art, which is more conducive to timely dissipating the heat from the central area, improving the heat dissipation uniformity and heat dissipation efficiency. The uneven heat dissipation surface further increases the heat dissipation area and improves the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1-2 It is a structural schematic diagram of a sun pattern fin heat sink of the present invention.
[0029] Among them, 1-heat dissipation base plate; 2-first heat dissipation area; 3-second heat dissipation area; 7-third heat dissipation area; 4-heat dissipation fins; 21-first sub-area; 22-second sub-area; 23-third sub-area; 24-fourth sub-area; 25-heat dissipation main frame; 5-heat dissipation mounting plate; 51-horizontal plate; 52-vertical plate; 53-reinforcement ribs; 6-bottom ribs. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0031] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.
[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.
[0033] See also Figure 1-2 The present invention provides a sun-patterned fin heat sink, comprising a heat sink base plate (1), an electronic device being mounted on a mounting surface of the heat sink base plate (1), and a heat sink surface of the heat sink base plate (1) being a non-planar surface with uneven surfaces;
[0034] The heat dissipation surface of the heat dissipation base plate (1) comprises a first heat dissipation area (2);
[0035] The first heat dissipation region (2) has two intersecting heat dissipation main frames (25), the two intersecting heat dissipation main frames (25) dividing the first heat dissipation region (2) into a first sub-region (21), a second sub-region (22), a third sub-region (23) and a fourth sub-region (24), the first sub-region (21) being adjacent to the second sub-region (22) and the fourth sub-region (24), respectively, and being opposite to the third sub-region (23);
[0036] The first sub-region (21) and the third sub-region (23) are provided with heat dissipation fins (4) connected to the side walls of the heat dissipation main frame (25), extending along a first direction and arranged in a second direction, and the first direction and the second direction do not overlap;
[0037] The second sub-region (22) and the fourth sub-region (24) are provided with heat dissipation fins (4) connected to the side wall of the heat dissipation main frame (25), extending along the second direction and arranged in the first direction;
[0038] The convex areas of the heat dissipation surface of the heat dissipation fins (4) and the heat dissipation base plate (1) correspond to each other vertically.
[0039] The heat dissipation area of the heat dissipation surface is divided into four areas by two cross heat dissipation main frames, and each area forms a sun pattern heat dissipation fin. In this way, the heat dissipation area is increased, and the central area can be dissipated to the outside through more ways. Because it is divided into areas, the heat dissipation fins are shorter than the heat dissipation fins that go all the way to the bottom of the prior art, which is more conducive to timely dissipation of the central area. Moreover, the sun pattern fins usually radiate from the center to the outside. Such a layout can make the heat transfer from the heat source to the end of the fin faster. This can reduce the internal thermal resistance and enable the entire radiator to dissipate heat more quickly. In addition, the sun pattern design helps to guide the airflow, making it easier for air to pass through the gaps between the fins. This design reduces airflow resistance and promotes more effective natural convection or forced convection cooling. Compared with the linear design, the sun pattern structure may be more conducive to the formation of turbulence, which can further enhance heat exchange. The present invention improves heat dissipation uniformity and heat dissipation efficiency. The uneven heat dissipation surface further increases the heat dissipation area and improves the heat dissipation efficiency.
[0040] Specifically, the first direction is perpendicular to the second direction.
[0041] Specifically, the first sub-region (21), the second sub-region (22) and the third sub-region (23) are triangular, and the fourth sub-region (24) is non-triangular.
[0042] Furthermore, the heat dissipation base plate (1) further comprises a second heat dissipation area (3) and a third heat dissipation area (7), and the first heat dissipation area (2) is located between the second heat dissipation area (3) and the third heat dissipation area (7);
[0043] The second heat dissipation area (2) and the third heat dissipation area (3) are provided with heat dissipation fins extending along the first direction and arranged in the second direction.
[0044] By arranging the sun-patterned heat dissipation fins in the middle area, the problem of uneven heat dissipation in the central area can be further solved.
[0045] Furthermore, the heat dissipation surface of the heat dissipation base plate (1) and the area corresponding to the heat dissipation fins form bottom ribs (6), the lower edge of the heat dissipation fins (4) is connected to the corresponding bottom ribs (6), and a recess is formed between two adjacent bottom ribs (6), so that the heat dissipation surface of the heat dissipation base plate (1) becomes a non-planar surface with uneven surfaces.
[0046] The bottom rib (6) will further guide the heat dissipation to the heat dissipation fins (4), thereby improving the heat dissipation efficiency.
[0047] Specifically, the heat dissipation fins (4) and the metal base plate (1) are made of copper and aluminum.
[0048] Furthermore, the cross section of the bottom rib (6) is semicircular or trapezoidal.
[0049] Furthermore, the heat dissipation fins (4) on the first heat dissipation region (2), the second heat dissipation region (3) and the third heat dissipation region (7) are all arranged at equal intervals.
[0050] Furthermore, at least one protrusion is provided on one surface of at least part of the heat dissipation fins (4).
[0051] Small bumps are arranged on the sides of the heat dissipation fins (4) to further increase the heat dissipation area and improve the heat dissipation efficiency.
[0052] Furthermore, the heat dissipation base plate (1) comprises a first side edge and a second side edge which are opposite to each other;
[0053] The first side edge and the second side edge which are opposite to each other are respectively provided with a heat dissipation mounting plate (5);
[0054] The heat dissipation mounting plate (5) is used to fix the heat sink on an external device;
[0055] The heat dissipation mounting plate (5) is also provided with heat dissipation fins (4).
[0056] A mounting plate is provided on the side to make the radiator look more regular, and cooling fins are also provided on the mounting plate to further improve the heat dissipation efficiency.
[0057] Furthermore, the heat dissipation fins (4) on the heat dissipation mounting plate (5) extend along the second direction and are arranged along the first direction;
[0058] The heat dissipation base plate (1) further comprises a third side edge and a fourth side edge which are opposite to each other;
[0059] The heat dissipation fins (4) of the second heat dissipation area (3) extend to the third side;
[0060] The heat dissipation fins (4) of the third heat dissipation area (7) extend to the fourth side.
[0061] Furthermore, the heat dissipation mounting plate (5) is an L-shaped plate formed by connecting a horizontal plate (51) and a vertical plate (52);
[0062] The vertical plate (52) is connected to the heat dissipation base plate (1), and the vertical plates (52) on the first side and the second side form retaining edges on the heat dissipation surface and the installation surface of the heat dissipation base plate (1);
[0063] The bottom of the heat dissipation fin (4) of the heat dissipation mounting plate (5) is connected to the horizontal plate (51), and one side of the heat dissipation fin (4) of the heat dissipation mounting plate (5) is connected to the vertical plate (52).
[0064] Specifically, the height of the heat dissipation fins (4) of the heat dissipation mounting plate (5) is the same as the height of the heat dissipation fins (4) on the heat dissipation surface of the heat dissipation base plate (1).
[0065] Specifically, the heat dissipation fins (4) on the heat dissipation mounting plate (5) are arranged at equal intervals.
[0066] The vertical plates on the first side and the second side form ribs on the heat dissipation surface and the mounting surface of the heat dissipation base plate, that is, the vertical plates on each side are higher than the heat dissipation surface, so that the heat dissipation fins of the mounting plate and the heat dissipation fins of the heat dissipation surface of the heat dissipation base plate are close to each other, which is convenient for heat dissipation. The vertical plates block the mounting surface of the heat dissipation base plate, so that the electronic components are installed in the groove, which is beneficial to protecting the electronic components.
[0067] Specifically, the first heat dissipation region (2), the second heat dissipation region (3) and the third heat dissipation region (7) are all rectangular.
[0068] Specifically, installation areas are reserved at both ends of the heat dissipation fins (4) and the horizontal plate (51) of the heat dissipation installation plate (5) to facilitate fixation to external equipment.
[0069] Specifically, two ends of the heat dissipation mounting plate (5) are provided with reinforcing ribs (53), and the reinforcing ribs (53) are connected to the horizontal plate (51) and the vertical plate (52) at the same time, so that the horizontal plate (51) and the vertical plate (52) are more stable.
[0070] Specifically, a mounting area is reserved between the heat dissipation fins (4) of the heat dissipation mounting plate (5) and the reinforcing ribs (53) on both sides.
[0071] Specifically, the heat dissipation fins (4) of the first sub-region (2) and part of the heat dissipation fins of the second heat dissipation region (3) overlap in the first direction. In this way, the gaps between the two heat dissipation fins of the first sub-region and the second heat dissipation region are the same and unobstructed, which facilitates air circulation and heat dissipation.
[0072] Specifically, the heat dissipation fins of the third sub-region (7) and the heat dissipation fins of part of the third heat dissipation region (7) overlap in the first direction. In this way, the gaps between the two heat dissipation fins of the third sub-region and the third heat dissipation region are the same and unobstructed, which facilitates air circulation and heat dissipation.
[0073] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.
Claims
1. A sun pattern fin heat sink, characterized in that: It comprises a heat dissipation base plate, the mounting surface of which is used to mount electronic devices, and the heat dissipation surface of which is a non-planar surface with uneven surfaces; The heat dissipation surface of the heat dissipation base plate includes a first heat dissipation area; The first heat dissipation region has two intersecting heat dissipation main frames, and the two intersecting heat dissipation main frames divide the first heat dissipation region into a first sub-region, a second sub-region, a third sub-region and a fourth sub-region, and the first sub-region is adjacent to the second sub-region and the fourth sub-region respectively, and is opposite to the third sub-region; The first sub-region and the third sub-region are provided with heat dissipation fins connected to the side wall of the heat dissipation main frame, extending along a first direction and arranged in a second direction, and the first direction and the second direction do not overlap; The second sub-region and the fourth sub-region are provided with heat dissipation fins connected to the side wall of the heat dissipation main frame, extending along the second direction and arranged in the first direction; The heat dissipation fins correspond to the convex areas of the heat dissipation surface of the heat dissipation base plate in the upper and lower parts.
2. A sunburst fin heat sink as claimed in claim 1, characterized in that: The heat dissipation base plate further includes a second heat dissipation area and a third heat dissipation area, and the first heat dissipation area is between the second heat dissipation area and the third heat dissipation area; The second heat dissipation area and the third heat dissipation area are provided with heat dissipation fins extending along the first direction and arranged in the second direction.
3. A sunburst fin heat sink as claimed in claim 2, characterized in that: The heat dissipation surface of the heat dissipation base plate and the area corresponding to the heat dissipation fins form bottom ribs, the lower edges of the heat dissipation fins are connected to the corresponding bottom ribs, and a recess is formed between two adjacent bottom ribs, so that the heat dissipation surface of the heat dissipation base plate becomes a non-planar surface with uneven surfaces.
4. A sunburst fin heat sink as claimed in claim 3, characterized in that: The cross section of the bottom rib is semicircular or trapezoidal.
5. The sunray fin heat sink according to claim 2, characterized in that: The heat dissipation fins on the first heat dissipation area, the second heat dissipation area and the third heat dissipation area are arranged at equal intervals.
6. The sunray fin heat sink according to claim 2, characterized in that: At least one protrusion is disposed on one surface of at least part of the heat dissipation fins.
7. The sunburst fin heat sink according to claim 2, characterized in that: The heat dissipation base plate includes a first side edge and a second side edge that are opposite to each other; The first side edge and the second side edge which are opposite to each other are respectively provided with a heat dissipation mounting plate; The heat dissipation mounting plate is used to fix the heat sink to an external device; The heat dissipation mounting plate is also provided with heat dissipation fins.
8. The sunburst fin heat sink according to claim 7, characterized in that: The heat dissipation fins on the heat dissipation mounting plate extend along the second direction and are arranged along the first direction; The heat dissipation base plate further includes a third side and a fourth side that are opposite to each other; The heat dissipation fins of the second heat dissipation area extend to the third side; The heat dissipation fins of the third heat dissipation region extend to the fourth side.
9. The sunburst fin heat sink according to claim 7, characterized in that: The heat dissipation mounting plate is an L-shaped plate formed by connecting a horizontal plate and a vertical plate; The vertical plates are connected to the heat dissipation base plate, and the vertical plates at the first side and the second side form ribs on both the heat dissipation surface and the mounting surface of the heat dissipation base plate; The bottom of the heat dissipation fin of the heat dissipation mounting plate is connected to the horizontal plate, and one side of the heat dissipation fin of the heat dissipation mounting plate is connected to the vertical plate.