Wiring substrate, manufacturing method thereof and display screen

Abstract

The invention discloses a wiring substrate, a manufacturing method thereof and a display screen, and the wiring substrate comprises a substrate which comprises a first surface, a second surface and a plurality of third surfaces, the first surface and the second surface are oppositely arranged, and the third surfaces are used for connecting the first surface and the second surface; a plurality of signal lines on the first surface; a bridge over the second surface; the bridging piece comprises a climbing area and a flat area, and the climbing area is closer to the third surface relative to the flat area; the thickness of the flat area is uniform, and the thickness of the climbing area is gradually increased to be the same as the thickness of the flat area in the direction gradually approaching the flat area; the connecting lines are at least located on the third surface and the bridging pieces; the control chip is located on the side, away from the climbing area, of the flat area, and the control chip is electrically connected with the signal lines through the connecting lines. The bridging piece is provided with the climbing area, so that the thickness segment difference between the bridging piece and the second surface can be eliminated, and the problem of wiring breakage at the segment difference is avoided.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a wiring substrate, a manufacturing method thereof and a display screen. Background Art

[0002] Narrow-frame and borderless displays with a large display area have become the current development trend of displays with their beautiful and fashionable appearance. In order to meet the narrow-frame design requirements of displays, a flexible printed circuit (FPC) or chip on flex (COF) can be set on the back of the display. A control chip is bound to the FPC or COF, and the signal line on the front of the display is connected to the control chip on the back by routing on the side of the display.

[0003] The side wiring of the display screen can be formed by 3D printing. Due to the large thickness of FPC and COF, a bridge can usually be set between the FPC or COF and the side wiring. However, the thickness difference between the bridge and the substrate may still cause the 3D printing material to break during the production or testing of the display screen, affecting the product yield. Summary of the invention

[0004] The present invention provides a wiring substrate, a manufacturing method thereof and a display screen, which can avoid the problem of wiring breakage during the manufacturing and use of display products.

[0005] A first aspect of the present invention provides a wiring substrate, comprising: a base substrate, the base substrate comprising a first surface and a second surface arranged opposite to each other, and a plurality of third surfaces for connecting the first surface and the second surface;

[0006] A plurality of signal lines, located on the first surface;

[0007] a bridge member, located on the second surface; the bridge member comprises a climbing area and a flat area, the climbing area is closer to the third surface than the flat area; the flat area has a uniform thickness, and in a direction gradually approaching the flat area, the thickness of the climbing area gradually increases to be the same as the thickness of the flat area;

[0008] a plurality of connection lines, wherein the connection lines are at least located on the third surface and the bridge member;

[0009] A control chip is located on a side of the flat area away from the climbing area, and the control chip is electrically connected to the plurality of signal lines respectively through the plurality of connection lines.

[0010] In some embodiments of the present invention, the plurality of connecting lines include:

[0011] a plurality of first connection lines, wherein the first connection lines are located at least on the third surface and the climbing area, and the first connection lines are connected to at least one of the signal lines;

[0012] A plurality of second connection lines, wherein the second connection lines are at least located above the flat area, each of the second connection lines is connected to each of the first connection lines in a one-to-one correspondence, and an orthographic projection of the second connection line on the substrate overlaps with an orthographic projection of the corresponding first connection line on the substrate.

[0013] In some embodiments of the present invention, the first connecting line includes a first sub-segment, a second sub-segment, a third sub-segment and a fourth sub-segment; the first sub-segment is located on the first surface and is connected to the signal line; the second sub-segment is located on the third surface; the third sub-segment is located on the surface of the climbing area; the orthographic projection of the fourth sub-segment on the substrate falls within the orthographic projection range of the flat area on the substrate, and the fourth sub-segment is connected to the second connecting line.

[0014] In some embodiments of the present invention, the second connecting wire comprises a lap portion and a wire portion, the lap portion is connected to the first connecting wire, and an orthographic projection of the lap portion on the base substrate overlaps with an orthographic projection of the corresponding first connecting wire on the base substrate;

[0015] In the same second connecting line, the line width of the overlapping portion is greater than the line width of the conductive line portion.

[0016] In some embodiments of the present invention, the wiring substrate further comprises: a flexible connector, the flexible connector being used to bind the control chip;

[0017] The second connecting line also includes a binding portion, which is located on a side of the wire portion away from the overlapping portion, and the binding portion is electrically connected to the control chip by connecting to the flexible connector; the line width of the binding portion is greater than the line width of the wire portion.

[0018] In some embodiments of the present invention, the orthographic projection of each of the second connecting lines on the base substrate falls within the orthographic projection range of the flat area on the base substrate.

[0019] In some embodiments of the present invention, the climbing area is at a set distance from the third surface.

[0020] In some embodiments of the present invention, a side edge of the climbing area facing away from the flat area is located in the plane where the second surface is located;

[0021] Alternatively, a side edge of the climbing area facing away from the flat area is spaced a set distance from the second surface in a thickness direction of the bridge member.

[0022] In some embodiments of the present invention, the material used for the first connecting wire includes silver paste doped with glue; the material used for the second connecting wire includes molybdenum or copper; and the material used for the bridge component includes polyimide.

[0023] In some embodiments of the present invention, the wiring substrate further includes:

[0024] An insulating layer is located between the bridge element and each of the second connecting lines, and the orthographic projection of the insulating layer on the substrate falls within the orthographic projection range of the flat area on the substrate.

[0025] A second aspect of the present invention provides a display screen, comprising any one of the above-mentioned wiring substrates.

[0026] A third aspect of the present invention provides a method for manufacturing a wiring substrate, comprising:

[0027] A plurality of signal lines are formed on a base substrate; the base substrate comprises a first surface and a second surface arranged opposite to each other, and a plurality of third surfaces for connecting the first surface and the second surface, and the plurality of signal lines are located on the first surface;

[0028] A base is attached to the second surface of the substrate; the base comprises a to-be-processed area and a flat area, and the to-be-processed area is closer to the third surface than the flat area;

[0029] forming an insulating layer on the flat area of ​​the substrate;

[0030] forming a wire layer on the insulating layer; the wire layer comprises a plurality of second connecting wires;

[0031] Laser processing the area to be processed forms a climbing area; in a direction gradually approaching the flat area, the thickness of the climbing area gradually increases to be the same as the thickness of the flat area; the climbing area and the flat area constitute a bridge;

[0032] A plurality of first connection lines are formed on the first surface, the third surface and the bridge member; each of the first connection lines is connected to at least one of the signal lines, and each of the first connection lines is connected to each of the second connection lines in a one-to-one correspondence;

[0033] A flexible connector and a control chip are bound on the second surface of the substrate; the control chip is bound on the flexible connector, and the flexible connector is connected to each of the second connection lines.

[0034] The beneficial effects of the present invention are as follows:

[0035] The present invention provides a wiring substrate, a manufacturing method thereof and a display screen, wherein the wiring substrate comprises: a substrate substrate, the substrate substrate comprises a first surface and a second surface arranged opposite to each other, and a plurality of third surfaces for connecting the first surface and the second surface; a plurality of signal lines, located on the first surface; a bridge, located on the second surface; the bridge comprises a climbing area and a flat area, the climbing area is closer to the third surface than the flat area; the thickness of the flat area is uniform, and in the direction gradually approaching the flat area, the thickness of the climbing area gradually increases to the same as the thickness of the flat area; a plurality of connecting lines, the connecting lines are at least located on the third surface and the bridge; a control chip, located on the side of the flat area away from the climbing area, and the control chip is electrically connected to the plurality of signal lines respectively through the plurality of connecting lines. The climbing area of ​​the bridge can eliminate the thickness step difference between the bridge and the second surface, and avoid the problem of wiring breakage at the step difference. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings introduced below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0037] Figure 1 A cross-sectional view of a wiring substrate provided by an embodiment of the present invention;

[0038] Figure 2 A side view of a wiring substrate provided by an embodiment of the present invention;

[0039] Figure 3 A schematic diagram of the structure of a first connecting line provided by an embodiment of the present invention;

[0040] Figure 4 A schematic diagram of the structure of a second connecting line provided by an embodiment of the present invention;

[0041] Figure 5 A top view of a wiring substrate provided by an embodiment of the present invention;

[0042] Figure 6 A schematic flow chart of a method for manufacturing a wiring substrate provided by an embodiment of the present invention;

[0043] Figure 7 is a schematic diagram of the structure after the substrate is attached to the second surface;

[0044] Figure 8 is a schematic diagram of a structure after an insulating layer is formed on the flat area;

[0045] Fig. 9is a schematic diagram of a structure after a conductor layer is formed on an insulating layer;

[0046] Fig.10 This is a schematic diagram of the laser processing process;

[0047] Fig.11 This is a schematic diagram of the structure after the climbing area is formed. DETAILED DESCRIPTION

[0048] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described below with reference to the accompanying drawings and examples. However, the exemplary embodiments can be implemented in various forms and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concepts of the exemplary embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the present invention are all explained using the accompanying drawings as examples, but changes can be made as needed, and the changes made are all included in the scope of protection of the present invention. The drawings of the present invention are only used to illustrate the relative position relationship and do not represent the true proportions.

[0049] The display screen includes a wiring substrate for setting the wiring structure. The control elements, light-emitting elements and other electronic components need to be connected to the wiring structure to realize the display function. Since the wiring structure is distributed in various areas of the wiring substrate to connect the light-emitting elements, it is usually necessary to gather the wiring at different positions to a specific position and then connect it to the control element. Therefore, a certain space needs to be reserved around the display area for the wiring, resulting in a larger frame of the wiring substrate, which affects the appearance of the display product.

[0050] In order to meet the narrow frame design requirements of display products, the related technology binds the control chip on the back of the display screen, and connects the control chip to the front wiring by routing on the side of the display screen, thereby saving the wiring space at the frame. The control chip needs to be bound to the FPC or COF and then connected to the side wiring. Since the thickness of the FPC and COF is relatively large, a bridge can be set between the FPC or COF and the side wiring. However, the thickness difference between the bridge and the substrate may still cause the wiring material to break during the production or testing of the display screen, affecting the product yield. In view of this, an embodiment of the present invention provides a wiring substrate and a display screen, which can avoid the above problems by improving the wiring method on the wiring substrate in the display screen.

[0051] Figure 1 A cross-sectional view of a wiring substrate provided in an embodiment of the present invention.

[0052] like Figure 1As shown, the wiring substrate provided by the embodiment of the present invention includes: a base substrate 10, a plurality of signal lines, a bridge 20, a plurality of connection lines 30 and a control chip 40. Among them, the light-emitting element 50 and each signal line are located on the same side surface of the base substrate 10, and each signal line can have a variety of routing patterns, which need to be adaptively designed according to the arrangement of the light-emitting element 50. The embodiment of the present invention does not limit the arrangement of the light-emitting element 50 and the routing of the signal line. In order to make the diagram clear and easy to describe, Figure 1 The schematic diagram shows the structure after the light emitting element 50 is soldered on the wiring substrate, but the routing pattern of each signal line is not shown.

[0053] The base substrate 10 includes a first surface 11 and a second surface 12 arranged opposite to each other, and a plurality of third surfaces 13 for connecting the first surface 11 and the second surface 12. Each signal line is located on the first surface 11 of the base substrate 10, the bridge 20 and the control chip 40 are located on the second surface 12 of the base substrate 10, and the connecting wire 30 is at least located on the third surface 13 of the base substrate 10 and the bridge 20. The control chip 40 is electrically connected to the plurality of signal lines through the plurality of connecting wires 30, so that the control chip 40 can transmit the driving signal to the corresponding signal line through each connecting wire 30 to drive each light-emitting element 50 to emit light, thereby realizing the display function. In the embodiment of the present invention, the control chip 40 and each signal line are arranged on the surface of different sides of the base substrate 10 and are connected to each other through the connecting wires 30 on the side surface of the base substrate 10. The frame area of ​​the wiring substrate does not need to reserve a routing space for collecting the signal lines, which is conducive to realizing the narrow frame design of the display product.

[0054] In the embodiment of the present invention, the bridge 20 can use polyimide (PI for short) as a substrate, and is disposed at a set position on the second surface 12 by means of attachment. The embodiment of the present invention takes the case where the connecting wire 30 is disposed on one of the third surfaces 13 of the base substrate 10 and the bridge 20 is disposed in a region of the second surface 12 close to the third surface 13 as an example for explanation. In specific implementation, the number and arrangement of the bridge 20 on the second surface 12 and the connecting wire 30 thereon can also be adjusted according to the wiring method of the signal line on the first surface 11, and the embodiment of the present invention does not limit this.

[0055] like Figure 1As shown, the bridge 20 includes a climbing area 21 and a flat area 22, wherein the climbing area 21 is closer to the third surface 13 than the flat area 22, the control chip 40 is located on the side of the flat area 22 away from the climbing area 21, and the connecting wire 30 extends from the first surface 11 of the substrate 10 to the third surface 13 and then to the surface of the bridge 20 and then connects with the control chip 40. In the embodiment of the present invention, the thickness of the flat area 22 of the bridge 20 is uniform, and in the direction gradually approaching the flat area 22, the thickness of the climbing area 21 gradually increases to the same as the thickness of the flat area 22, and correspondingly, the connecting wire 30 on the climbing area 21 can rise uniformly along the surface of the climbing area 21.

[0056] The embodiment of the present invention forms a climbing area 21 in the bridge member 20, thereby eliminating the thickness step difference between the surface of the bridge member 20 and the second surface 12 of the base substrate 10 in the area, avoiding the phenomenon of wiring breakage at the step difference position due to uneven thickness of the wiring material or different expansion and contraction degrees of the wiring material compared with other parts during temperature changes, which is beneficial to improving the stability of the product.

[0057] Specifically, the climbing area 21 of the bridge member 20 can be formed by laser processing, and the side of the climbing area 21 away from the flat area 22 can be located in the plane where the second surface 12 is located, or the side of the climbing area 21 away from the flat area 22 can be at a set distance from the second surface 12 in the thickness direction of the bridge member 20, which is determined by the depth accuracy of the laser processing.

[0058] Figure 2 A side view of a wiring substrate provided in an embodiment of the present invention.

[0059] like Figure 1 and Figure 2 As shown, the multiple connection lines 30 in the wiring substrate may include multiple first connection lines 31 and multiple second connection lines 32, wherein the first connection lines 31 are at least located on the third surface 13 and the climbing area 21 of the bridge 20, and the first connection lines 31 are connected to at least one signal line; the second connection lines 32 are at least located on the flat area 22 of the bridge 20, and each second connection line 32 is connected to each first connection line 31 one by one, and the orthographic projection of the second connection line 32 on the base substrate 10 has an overlapping part with the orthographic projection of the corresponding first connection line 31 on the base substrate 10, so that the first connection line 31 and the second connection line 32 can overlap with each other and be electrically connected.

[0060] Figure 3 A schematic structural diagram of a first connecting line provided in an embodiment of the present invention.

[0061] like Figure 3As shown, in the embodiment of the present invention, the first connecting line 31 may include a first sub-segment 311, a second sub-segment 312, a third sub-segment 313 and a fourth sub-segment 314. The first sub-segment 311 is located on the first surface 11, and the first sub-segment 311 is used to connect with the signal line on the first surface 11, the second sub-segment 312 is located on the third surface 13, the third sub-segment 313 is located on the surface of the climbing area 21, the orthographic projection of the fourth sub-segment 314 on the base substrate 10 falls within the orthographic projection range of the flat area 22 on the base substrate 10, and the fourth sub-segment 314 is overlapped at one end of the second connecting line 32 and is electrically connected to the second connecting line 32 on the surface of the flat area 22.

[0062] In some embodiments, the first subsection 311 of the first connecting line 31 may not be arranged on the first surface 11, but the signal line on the first surface 11 may be extended to the side of the first surface 11 and connected to the second subsection 312. In some embodiments, the climbing area 21 and the third surface 13 closest to it may be separated by a set distance, and the first connecting line 31 may also include a fifth subsection 315, which is located on the second surface 12 of the base substrate 10 and connects the second subsection 312 and the third subsection 313. In specific implementation, the structure of each first connecting line 31 can be adjusted according to specific design requirements, and the embodiment of the present invention is not limited here, and only the above exemplary description is given.

[0063] The material used for the first connecting line 31 may include silver paste doped with glue, etc., and may be made by 3D printing or sputtering. The embodiment of the present invention takes the case of using 3D printing technology to make each first connecting line 31 as an example. Since the bridge component 20 has a climbing area 21, when printing the first connecting line 31, the 3D printed material on each surface can have a relatively uniform thickness, which is beneficial to avoid the problem of wiring breakage.

[0064] Figure 4 A schematic diagram of the structure of a second connecting line provided by an embodiment of the present invention; Figure 5 A top view of a wiring substrate provided in an embodiment of the present invention.

[0065] like Figure 1 , Figure 4 and Figure 5As shown, the second connection line 32 may include a lap portion 321 and a wire portion 322, wherein the lap portion 321 is connected to the first connection line 31, and the orthographic projection of the lap portion 321 on the base substrate 10 overlaps with the orthographic projection of the corresponding first connection line 31 on the base substrate 10, and in the same second connection line 32, the line width of the lap portion 321 is greater than the line width of the wire portion 322. Considering the accuracy of 3D printing, in the embodiment of the present invention, the line width of the lap portion 321 of each second connection line 21 can be set to be greater than the line width of the corresponding first connection line 31, so that the 3D printed first connection line 31 can fall within the range of the lap portion 321, ensuring a stable electrical connection between the two, and setting the line width of the lap portion 321 to be larger is also conducive to reducing the contact resistance at the lap portion 321.

[0066] like Figure 1 , Figure 4 and Figure 5 As shown, in the embodiment of the present invention, the wiring substrate may further include a flexible connector 60, which is located on the second surface 12 and may be an FPC or a COF, and is used to bind the control chip 40. The second connecting line 32 may further include a binding portion 323, which is located on the side of the wire portion 322 away from the lap portion 321 and has a line width greater than the line width of the wire portion 322. In order to match the line inside the flexible connector 60, the line width of the binding portion 323 may be the same as the line width of the routing in the flexible connector 60, and the binding portion 323 is electrically connected to the control chip 40 by connecting the flexible connector 60.

[0067] The material used for the second connecting wire 32 may include metal materials such as molybdenum or copper, and its routing pattern may be formed by etching or sputtering. Each second connecting wire 32 may be formed by a single patterning process, in which case the wiring substrate further includes an insulating layer, which is located between the bridge 20 and each second connecting wire 32. In order to meet the surface flatness requirements during patterning, the orthographic projection of each second connecting wire 32 on the substrate substrate 10 falls within the orthographic projection range of the flat area 22 on the substrate substrate 10, and the orthographic projection of the insulating layer on the substrate substrate 10 also falls within the orthographic projection range of the flat area 22 on the substrate substrate 10. It can be understood that Figure 4 The wire portions 322 of each second connecting line 32 shown in the figure all extend in the same direction. In a specific implementation, the pattern of the wire portion 322 can also be designed according to specific needs, and the relative positions of the overlapping portions 321 and the binding portions 323 at both ends thereof are also adjusted accordingly. The embodiment of the present invention does not limit the routing pattern of the wire portion 322 in each second connecting line 32.

[0068] Based on the same inventive concept, an embodiment of the present invention also includes a method for manufacturing a wiring substrate.

[0069] Figure 6 A schematic flow chart of a method for manufacturing a wiring substrate provided in an embodiment of the present invention.

[0070] like Figure 6 As shown, the method for manufacturing a wiring substrate may include the following steps:

[0071] S1, forming a plurality of signal lines on a substrate;

[0072] S2, attaching a base to the second surface of the base substrate;

[0073] S3, forming an insulating layer on the flat area of ​​the substrate;

[0074] S4, forming a conductor layer on the insulating layer;

[0075] S5, laser processing the area to be processed forms a climbing area;

[0076] S6, forming a plurality of first connection lines on the first surface, the third surface and the bridge member;

[0077] S7. Bind the flexible connector and the control chip on the second surface of the substrate.

[0078] In step S1, the base substrate 10 may be a glass substrate, and the thickness of the glass substrate may be 0.5 mm. Figure 1 The base substrate 10 includes a first surface 11 and a second surface 12 that are arranged opposite to each other, and a plurality of third surfaces 13 for connecting the first surface 11 and the second surface 12. A plurality of signal lines are located on the first surface 11 of the base substrate 10. A conductive material can be deposited on the first surface 11 and then a patterning process is used to form each signal line.

[0079] Figure 7 It is a schematic diagram of the structure after the substrate is attached to the second surface.

[0080] After completing step S2, the following can be formed: Figure 7 In the structure shown in FIG. 1 , in step S2 , the material of the substrate 700 may be polyimide (PI for short). In a possible implementation, the thickness of the substrate 700 may be 88 μm. Figure 7, the substrate 200 includes a processing area 210 and a flat area 22, and the processing area 210 is closer to the third surface 13 than the flat area 22. When the thickness of the substrate 200 is constant, the wider the processing width, the smaller the angle of the subsequently formed climbing area 21, and the less likely the 3D printed circuit will crack. However, since the increase in the length of the 3D printed circuit will increase its resistance, the size of the processing area 210 can be adjusted according to the resistance of the 3D printing material and the capacity of the laser equipment, and the width of the processing area 210 can be 6mm to 50cm. In a possible embodiment, the processing angle of the processing area 210 can be 20° or 21°, and the processing width can be 230μm.

[0081] Figure 8 It is a schematic diagram of the structure after an insulating layer is formed on the flat area.

[0082] After completing step S3, the following can be formed: Figure 8 In the structure shown in step S3, the material of the insulating layer 70 can be silicon oxide (SiO x ) etc. Figure 8 As shown, an insulating material is deposited on the surface of the flat region 22 of the substrate 200 to form an insulating layer 70. In a possible implementation manner, the thickness of the insulating layer 70 may be 600 nm.

[0083] Fig. 9 It is a schematic diagram of the structure after forming a conductor layer on the insulating layer.

[0084] After completing step S4, the following can be formed: Fig. 9 In the structure shown in step S4, the material used for the wire layer 320 may include metal materials such as molybdenum or copper, and the wiring pattern of the wire layer 320 may be formed by depositing a conductive material on the insulating layer 70, coating a photoresist on the conductive material, and exposing, developing, etching, and other processes. The wire layer 320 includes a plurality of second connecting wires 32. Fig. 9 As shown, the orthographic projection of the wire layer 320 on the base substrate 10 falls within the orthographic projection range of the flat area 22 on the base substrate 10. In a possible implementation, the thickness of the wire layer 320 may be 1.2 μm.

[0085] Fig.10 Schematic diagram of the laser processing process.

[0086] In step S5, the laser may be used to irradiate the processing area 210 to melt the base material (PI) at the irradiated position to a set thickness, and the melted base material may be removed in time by blowing with an air knife. Fig.10As shown, the laser stepper processes the to-be-processed area 210 of the PI substrate, and the wind knife blows air in the direction of the edge of the substrate to remove the melted substrate material. In a possible implementation, a CO2 laser can be used to emit laser light, and its depth control accuracy is ±10μm and position control accuracy is ±30μm.

[0087] Fig.11 This is a schematic diagram of the structure after the climbing area is formed.

[0088] After completing step S5, the following can be formed: Fig.11 The structure shown, such as Fig.11 As shown, in the direction gradually approaching the flat area 22, the thickness of the climbing area 21 gradually increases to the same thickness as the flat area 22, and the climbing area 21 and the flat area 22 constitute a bridge. Due to the limitation of the depth control accuracy of the laser, the side of the climbing area 21 away from the flat area 22 can be located in the plane where the second surface 12 is located, or the side of the climbing area 21 away from the flat area 22 can be a set distance away from the second surface 12 in the thickness direction of the bridge 20. Due to the limitation of the position control accuracy of the laser, the distance between the edge of the climbing area 21 and the third surface 13 of the substrate 10 needs to be greater than the position control accuracy of the laser. In a possible embodiment, the distance between the edge of the climbing area 21 and the third surface 13 of the substrate 10 can be 30μm.

[0089] In step S6, the first connection line 31 can be formed by using a conductive silver paste doped with glue and a 3D printing process. In the subsequent manufacturing process or testing process of the display product, there will also be a temperature change process such as high-temperature curing of conductive materials, reflow soldering of light-emitting components, or high and low temperature reliability testing of the display product. In the embodiment of the present invention, the bridge 20 is provided with a climbing area 21, so that the 3D printing material on each surface can have a relatively uniform thickness, avoiding the problem of wiring breakage caused by uneven thickness of the 3D printing material or uneven expansion and contraction of the 3D printing material in different areas during temperature changes, which is conducive to improving product yield.

[0090] The position of the first connecting line 31 printed in step S6 is determined according to the position of the signal line on the first surface 11 of the base substrate 10 and the position of the second connecting line 32 on the bridge 20. After completing step S6, each first connecting line 31 is connected to at least one signal line, and each first connecting line 31 is connected to each second connecting line 32 one by one.

[0091] In step S7, the control chip 40 can be bound to the flexible connector 60, and the flexible connector 60 is connected to each second connection line 32. The flexible connector 60 can be made of FPC or COF. After completing step S7 and welding the light emitting element 50, the following can be formed: Figure 1 The structure shown.

[0092] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0093] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A wiring substrate, characterized in that: include: A substrate substrate, the substrate substrate comprising a first surface and a second surface arranged opposite to each other, and a plurality of third surfaces for connecting the first surface and the second surface; A plurality of signal lines, located on the first surface; a bridge member, located on the second surface; the bridge member comprises a climbing area and a flat area, the climbing area is closer to the third surface than the flat area; the flat area has a uniform thickness, and in a direction gradually approaching the flat area, the thickness of the climbing area gradually increases to be the same as the thickness of the flat area; a plurality of connection lines, wherein the connection lines are at least located on the third surface and the bridge member; A control chip is located on a side of the flat area away from the climbing area, and the control chip is electrically connected to the plurality of signal lines respectively through the plurality of connection lines.

2. The wiring substrate according to claim 1, wherein: The plurality of connecting lines include: a plurality of first connection lines, wherein the first connection lines are located at least on the third surface and the climbing area, and the first connection lines are connected to at least one of the signal lines; A plurality of second connection lines, wherein the second connection lines are at least located above the flat area, each of the second connection lines is connected to each of the first connection lines in a one-to-one correspondence, and an orthographic projection of the second connection line on the substrate overlaps with an orthographic projection of the corresponding first connection line on the substrate.

3. The wiring substrate according to claim 2, wherein: The first connecting line includes a first sub-segment, a second sub-segment, a third sub-segment and a fourth sub-segment; the first sub-segment is located on the first surface and is connected to the signal line; the second sub-segment is located on the third surface; the third sub-segment is located on the surface of the climbing area; the orthographic projection of the fourth sub-segment on the substrate falls within the orthographic projection range of the flat area on the substrate, and the fourth sub-segment is connected to the second connecting line.

4. The wiring substrate according to claim 2, wherein: The second connecting line comprises a lap portion and a conductor portion, the lap portion is connected to the first connecting line, and an orthographic projection of the lap portion on the base substrate overlaps with an orthographic projection of the corresponding first connecting line on the base substrate; In the same second connecting line, the line width of the overlapping portion is greater than the line width of the conductive line portion.

5. The wiring substrate according to claim 4, wherein: Also includes: A flexible connector, the flexible connector is used to bind the control chip; The second connecting line also includes a binding portion, which is located on a side of the wire portion away from the overlapping portion, and the binding portion is electrically connected to the control chip by connecting to the flexible connector; the line width of the binding portion is greater than the line width of the wire portion.

6. The wiring substrate according to claim 2, wherein: The orthographic projection of each of the second connecting lines on the base substrate falls within the orthographic projection range of the flat area on the base substrate.

7. The wiring substrate according to claim 1, wherein: The climbing area is at a set distance from the third surface.

8. The wiring substrate according to claim 1, wherein: The side edge of the climbing area facing away from the flat area is located in the plane where the second surface is located; Alternatively, a side edge of the climbing area facing away from the flat area is spaced apart from the second surface by a set distance in the thickness direction of the bridge member.

9. The wiring substrate according to any one of claims 2 to 8, wherein: The material used for the first connecting wire includes silver paste doped with glue; the material used for the second connecting wire includes molybdenum or copper; and the material used for the bridge component includes polyimide.

10. The wiring substrate according to any one of claims 2 to 8, wherein: Also includes: An insulating layer is located between the bridge element and each of the second connecting lines, and the orthographic projection of the insulating layer on the substrate falls within the orthographic projection range of the flat area on the substrate.

11. A display screen, characterized in that: It comprises the wiring substrate as claimed in any one of claims 1 to 10.

12. A method for manufacturing a wiring substrate, characterized in that: include: A plurality of signal lines are formed on a base substrate; the base substrate comprises a first surface and a second surface arranged opposite to each other, and a plurality of third surfaces for connecting the first surface and the second surface, and the plurality of signal lines are located on the first surface; attaching a base to the second surface of the base substrate; The substrate comprises a to-be-processed area and a flat area, wherein the to-be-processed area is closer to the third surface than the flat area; forming an insulating layer on the flat area of ​​the substrate; forming a wire layer on the insulating layer; the wire layer comprises a plurality of second connecting wires; Laser processing the area to be processed forms a climbing area; in a direction gradually approaching the flat area, the thickness of the climbing area gradually increases to be the same as the thickness of the flat area; the climbing area and the flat area constitute a bridge; A plurality of first connection lines are formed on the first surface, the third surface and the bridge member; each of the first connection lines is connected to at least one of the signal lines, and each of the first connection lines is connected to each of the second connection lines in a one-to-one correspondence; A flexible connector and a control chip are bound on the second surface of the substrate; the control chip is bound on the flexible connector, and the flexible connector is connected to each of the second connection lines.

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