Electronic atomization device, atomizer, atomization core and heating body of atomization core

Abstract

The invention provides an electronic atomization device, an atomizer, an atomization core and a heating body of the atomization core. The first heating layer comprises a first surface and a second surface which are opposite to each other; the second heating layer is arranged on the first heating layer and at least partially covers the first surface and / or the second surface; wherein the resistance temperature coefficient of the first heating layer is greater than that of the second heating layer. According to the application, the second heating layer with high high temperature resistance is arranged on the first heating layer with large resistance temperature coefficient and limited high temperature resistance, and the second heating layer covers the first surface and the second surface which are opposite to each other of the first heating layer to form the heating body, so that accurate temperature control can be realized while the heating efficiency is improved, and dry burning is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomizers, and in particular to an electronic atomization device, an atomizer, an atomization core and a heating element thereof. Background Art

[0002] Existing electronic atomization devices usually use resistance heating to atomize the atomizing medium. Currently, the commonly used resistance heating structures are mainly divided into thick film, thin film and metal sheet / mesh. Among them, metal sheets or metal meshes are bulk materials, which have better density than membrane systems. Therefore, from the perspective of materials, metal sheets / meshes have better consistency and reliability. Currently, the commonly used mesh materials are mainly electrothermal alloys (such as nickel-based alloys such as FeCrAl and NiCr, which have good high temperature resistance, but the resistance temperature coefficient is usually low, less than 300ppm / ℃, and are mainly used in foreign electronic atomization devices without temperature control requirements) and steel (mainly stainless steel systems, with a higher resistance temperature coefficient greater than 500ppm / ℃, but limited high temperature resistance, mainly used in electronic atomization devices requiring temperature control).

[0003] At present, during the normal operation of the electronic atomization device, the temperature of the resistive heating component is usually between 300℃ and 400℃. However, if there is insufficient liquid supply during the heating and atomization process, the heating film may dry-burn and the temperature may even reach over 1000℃, which has a serious impact on non-electric heating alloy materials with limited high temperature resistance. Summary of the invention

[0004] The main technical problem solved by the present invention is to provide an electronic atomization device, an atomizer, an atomization core and a heating element thereof, so as to solve the problem of poor high temperature resistance of the heating element in the prior art.

[0005] In order to solve the above technical problems, the first technical solution adopted by the present invention is: to provide a heating body, the heating body is used to heat the aerosol-forming matrix, the heating body includes a first heating layer, including a first surface and a second surface relative to each other; the second heating layer is arranged on the first heating layer and at least partially covers the first surface and / or the second surface; wherein the resistance temperature coefficient of the first heating layer is greater than the resistance temperature coefficient of the second heating layer.

[0006] The heating element further includes a third heating layer, and the third heating layer at least partially covers the surface of the first heating layer that is not covered by the second heating layer.

[0007] The second heating layer completely covers the first surface, and the third heating layer completely covers the second surface.

[0008] Among them, the second heating layer is arranged on the entire outer surface of the first heating layer; the thickness of the second heating layer and / or the third heating layer is 1 micron to 50 microns; preferably, the thickness of the second heating layer and / or the third heating layer is 3 microns to 10 microns.

[0009] Wherein, the thickness of the heating element is 50 micrometers to 150 micrometers; preferably, the thickness of the heating element is 70 micrometers to 100 micrometers.

[0010] The thickness of the first heating layer accounts for 10% to 80% of the thickness of the heating element.

[0011] Among them, the second heating layer and / or the third heating layer is a material containing aluminum element; preferably, the material of the second heating layer and / or the third heating layer is an alloy containing aluminum element.

[0012] Among them, the material containing aluminum elements includes at least one of Al2O3, NiAl, NiCrAl, NiCrAlY, and FeCrAl.

[0013] Among them, the resistance temperature coefficient of the first heating layer is not less than 800ppm / ℃; the resistance temperature coefficient of the heating body ranges from 300ppm / ℃ to 1450ppm / ℃, and the resistivity of the heating body ranges from 0.76Ω·cm to 1.27Ω·cm.

[0014] In order to solve the above technical problems, the second technical solution adopted by the present invention is: to provide an atomization core, the atomization core includes a porous matrix, including a liquid absorption surface and an atomization surface; a heating element is arranged on the atomization surface of the porous matrix, wherein the heating element is the above-mentioned heating element.

[0015] In order to solve the above technical problems, the third technical solution adopted by the present invention is: to provide an atomizer, the atomizer includes a shell, having a accommodating cavity, the accommodating cavity is used to accommodate an aerosol-forming matrix; an atomizer core is arranged in the accommodating cavity, and the heating element is used to heat the aerosol-forming matrix; wherein the atomizer core is the above-mentioned atomizer core.

[0016] In order to solve the above technical problems, the fourth technical solution adopted by the present invention is: to provide an electronic atomization device, the electronic atomization device includes a power supply component and the above atomizer, and the power supply component is used to supply power to the atomizer.

[0017] The beneficial effects of the present invention are as follows: Different from the prior art, an electronic atomization device, an atomizer, an atomization core and a heating element thereof are provided, wherein the heating element comprises a first heating layer, comprising a first surface and a second surface opposite to each other; a second heating layer, which is arranged on the first heating layer and at least partially covers the first surface and / or the second surface; wherein the resistance temperature coefficient of the first heating layer is greater than the resistance temperature coefficient of the second heating layer. The present application forms a composite heating element by arranging a high-temperature resistant second heating layer on the first heating layer having a large resistance temperature coefficient and limited high-temperature resistance, and improves the high-temperature resistance of the heating element by the second heating layer, so that the heating element has both good high-temperature resistance and high temperature controllable performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a schematic diagram of the structure of the electronic atomization device provided by the present invention;

[0020] Figure 2 It is a schematic diagram of the longitudinal section structure of the atomizer provided by the present invention;

[0021] Figure 3 It is a schematic diagram of the structure of the atomizer core in the electronic atomizer device provided by the present invention;

[0022] Figure 4 It is a structural schematic diagram of a specific embodiment of the heating element provided by the present invention;

[0023] Figure 5 is a structural schematic diagram of another specific embodiment of the heating element provided by the present invention;

[0024] FIG6( a ) is a SEM image of the first heat generating layer without the NiCrAlY coating after high temperature heating;

[0025] FIG6( b ) is a SEM image of a heating element made of a first heating layer having a NiCrAlY coating after high temperature heating;

[0026] FIG7( a ) is a SEM image of the first heat generating layer alone after high temperature heating;

[0027] FIG. 7( b ) is a SEM image of the heating element formed by laminating and pressing the second heating layer, the first heating layer and the third heating layer after high-temperature heating.

[0028] In the figure: electronic atomization device 100; atomizer 1; shell 11; accommodating chamber 110; atomization core 12; porous matrix 121; heating element 122; first heating layer 21; first surface 21a; second surface 21b; second heating layer 22; third heating layer 23; atomization surface 24; liquid absorption surface 25; power supply component 2. DETAILED DESCRIPTION

[0029] The following describes the embodiments of the present invention in detail with reference to the accompanying drawings.

[0030] In the following description, for the purpose of explanation rather than limitation, specific details such as particular system structures, interfaces, and technologies are provided to provide a thorough understanding of the present invention.

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] The terms "first", "second" and "third" in the present invention are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0033] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] See also Figures 1 to 3 , Figure 1 It is a schematic diagram of the structure of the electronic atomization device provided by the present invention; Figure 2 It is a schematic diagram of the longitudinal section structure of the atomizer provided by the present invention; Figure 3 It is a schematic diagram of the structure of the atomization core in the electronic atomization device provided by the present invention.

[0035] The electronic atomization device 100 provided in this embodiment includes a power supply assembly 2 and an atomizer 1 connected to each other. The power supply assembly 2 is used to power the atomizer 1. The atomizer 1 is used to store an aerosol-forming matrix and heat the aerosol-forming matrix to form an aerosol that can be inhaled by the user. The aerosol-forming matrix can be a liquid matrix such as a liquid medicine, a plant leaf liquid, etc.; the atomizer 1 can be used in different fields, such as medical treatment, beauty, electronic aerosolization, etc. The atomizer 1 and the power supply assembly 2 can be set as an integral unit or can be detachably connected, and can be designed according to specific needs.

[0036] The atomizer 1 includes a shell 11 and an atomizer core 12. The shell 11 has a accommodating cavity 110, and the accommodating cavity 110 is used to accommodate an aerosol-forming matrix. The atomizer core 12 is arranged in the accommodating cavity 110, and the atomizer core 12 is used to heat the aerosol-forming matrix. Among them, the atomizer core 12 heats the aerosol-forming matrix, and volatilizes any component in the aerosol-forming matrix to form an aerosol for the user to inhale. The atomizer core 12 is electrically connected to the power supply component 2 to heat the aerosol-forming matrix. The atomizer core 12 includes a porous matrix 121 and a heating element 122. The porous matrix 121 includes a liquid absorption surface 25 and an atomization surface 24. The surface of the porous matrix 121 that contacts the aerosol-forming matrix in the accommodating cavity 110 is the liquid absorption surface 25. The surface of the porous matrix 121 used to heat the aerosol-forming matrix is ​​the atomization surface 24. The heating element 122 is arranged on the atomization surface 24 of the porous matrix 121. Among them, the porous matrix 121 is used to guide the aerosol-forming matrix in the accommodating cavity 110 to the surface of the porous matrix 121 provided with a heating element 122. The heating element 122 is used to heat the aerosol-forming matrix to generate an aerosol. Among them, the heating element 122 can be a metal sheet, a metal mesh or a metal strip, etc. In one embodiment, the porous matrix 121 can be a ceramic porous body, and the heating element 122 can be an S-shaped metal strip, or a mesh-shaped metal mesh, and pins are respectively provided at both ends, and the two ends of the heating element 122 are connected to the positive and negative electrodes of the power supply component 2 through the pins. Part of the heating element 122 is embedded in the interior of the porous matrix 121.

[0037] The heating body 122 includes a first heating layer 21 and a second heating layer 22. The first heating layer 21 includes a first surface 21a and a second surface 21b opposite to each other. In the present embodiment, the first heating layer 21 is a sheet structure, for example, the first heating layer 21 is a metal sheet. Among them, the material of the first heating layer 21 is stainless steel. Among them, the temperature coefficient of resistance of stainless steel is not less than 500ppm / ℃. In the present embodiment, the temperature coefficient of resistance of the first heating layer 21 is not less than 800ppm / ℃. Specifically, the stainless steel includes at least one of stainless steel 403, stainless steel 304, stainless steel 316, and stainless steel 904. The stainless steel system has a higher temperature coefficient of resistance, but its high temperature resistance is limited.

[0038] The second heating layer 22 is disposed on the first heating layer 21 and at least partially covers the first surface 21a and / or the second surface 21b. The high temperature resistance of the second heating layer 22 is better than that of the first heating layer 21, and the resistance temperature coefficient of the first heating layer 21 is greater than the resistance temperature coefficient of the second heating layer 22. The heating element 122 is formed by disposing the second heating layer 22 with high high temperature resistance on the first heating layer 21 with large resistance temperature coefficient and limited high temperature resistance, so that the obtained heating element 122 has both good high temperature resistance and high temperature controllability.

[0039] See also Figure 4 , Figure 4 It is a structural schematic diagram of a specific embodiment of the heating element provided by the present invention.

[0040] In one embodiment, the second heating layer 22 is a film layer covering the outer surface of the first heating layer 21. The second heating layer 22 is formed on the outer surface of the first heating layer 21 by one or more methods selected from spin coating, hot pressing, electrostatic spraying, plasma spraying, slit coating, screen coating, gravure printing, micro-concave coating, comma blade coating, screen printing, vapor deposition, vacuum coating, and thermal spraying. In this embodiment, the second heating layer 22 is disposed on the outer surface of the first heating layer 21 by vapor deposition or spraying.

[0041] Specifically, the second heating layer 22 is deposited on the first surface 21a and / or the second surface 21b of the first heating layer 21 by physical vapor deposition coating, that is, a film layer is formed on the surface of the first heating layer 21. In another embodiment, the second heating layer 22 is deposited on a portion of the first surface 21a and / or the second surface 21b of the first heating layer 21 by physical vapor deposition coating, so that the second heating layer 22 at least partially covers the first surface 21a and / or the second surface 21b, that is, a film layer is formed on at least a portion of the surface of the first heating layer 21.

[0042] In this embodiment, in order to prevent the aerosol-forming matrix from contacting the first heating layer 21 and corroding the first heating layer 21, the second heating layer 22 is covered on the entire first surface 21a and the entire second surface 21b and all side surfaces of the first heating layer 21 by physical vapor deposition coating.

[0043] In another embodiment, the second heating layer 22 is a sheet structure, and the second heating layer 22 and the first heating layer 21 are welded or mechanically pressed to form the heating body 122 .

[0044] See also Figure 5 , Figure 5 It is a structural schematic diagram of another specific embodiment of the heating element provided by the present invention.

[0045] The heating element 122 further includes a third heating layer 23 , which at least partially covers the surface of the first heating layer 21 that is not covered by the second heating layer 22 .

[0046] In one embodiment, the second heating layer 22 is deposited on the first surface 21a or the second surface 21b of the first heating layer 21 by physical vapor deposition coating, and the third heating layer 23 is stacked on the surface of the first heating layer 21 where the second heating layer 22 is not deposited, and then welded or mechanically pressed and patterned to obtain the heating element 122. The second heating layer 22 is a film layer structure, and the third heating layer 23 is a sheet layer structure.

[0047] In another embodiment, the second heating layer 22 is stacked on the first surface 21a or the second surface 21b of the first heating layer 21 and processed by welding or mechanical pressing and patterning; the third heating layer 23 is deposited on the surface of the first heating layer 21 stacked with the second heating layer 22 by physical vapor deposition coating to obtain the heating body 122. The second heating layer 22 is a sheet layer structure, and the third heating layer 23 is a film layer structure.

[0048] In another embodiment, the second heating layer 22, the first heating layer 21 and the third heating layer 23 are stacked in sequence and processed by welding or mechanical pressing and patterning to obtain the heating body 122. The second heating layer 22 and the third heating layer 23 are both sheet-layer structures.

[0049] The material of the second heating layer 22 and the material of the third heating layer 23 may be different or the same. The second heating layer 22 and / or the third heating layer 23 are high temperature resistant materials containing aluminum elements. In the present embodiment, the second heating layer 22 and / or the third heating layer 23 are high temperature resistant alloys containing aluminum elements, and the alloys containing aluminum elements include at least one of Al2O3, NiAl, NiCrAl, NiCrAlY, and FeCrAl. The thickness of the second heating layer 22 may be the same as or different from the thickness of the third heating layer 23. In the present embodiment, in order to ensure the manufacturing yield of the heating element 122, the material of the second heating layer 22 is the same as that of the third heating layer 23; the thickness of the second heating layer 22 is the same as that of the third heating layer 23.

[0050] The thickness of the second heating layer 22 and / or the third heating layer 23 is 1 micron to 50 microns. In the present embodiment, the thickness of the second heating layer 22 and / or the third heating layer 23 is 3 microns to 10 microns. Specifically, the thickness of the second heating layer 22 is 3 microns to 10 microns; and / or the thickness of the third heating layer 23 is 3 microns to 10 microns, or the thickness of the second heating layer 22 and the third heating layer 23 can be 3 microns to 10 microns. For example, the thickness of the second heating layer 22 and / or the third heating layer 23 can be 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, etc., or other values ​​within the above range, which are not limited here.

[0051] In one embodiment, the thickness of the heating element 122 ranges from 50 microns to 150 microns. In this embodiment, the thickness of the heating element 122 ranges from 70 microns to 100 microns. For example, the thickness of the heating element 122 can be 70 microns, 80 microns, 90 microns, 100 microns, etc. In this embodiment, the thickness of the first heating layer 21 accounts for 10% to 80% of the thickness of the heating element 122, that is, the ratio of the thickness of the first heating layer 21 to the thickness of the heating element 122 satisfies (0.1 to 0.8):1. Specifically, the ratio of the thickness of the first heating layer 21 to the thickness of the heating element 122 can be 0.1:1, 0.2:1, 0.3:1, 0.4:1, 0.5:1, 0.6:1, 0.7:1, 0.8:1, etc., and can also be other values ​​within the above range, which are not limited here. The present application can adjust the high temperature resistance and the temperature coefficient of resistance of the heating element 122 by controlling the thickness ratio of the first heating layer 21 and the second heating layer 22 to the heating element 122, thereby meeting the diverse needs of users.

[0052] In one embodiment, the temperature coefficient of resistance of the heating element 122 ranges from 300ppm / °C to 1450ppm / °C, and the resistivity of the heating element 122 ranges from 0.76Ω·cm to 1.27Ω·cm. For example, the temperature coefficient of resistance of the heating element 122 may be 800ppm / °C, 900ppm / °C, 1000ppm / °C, 1100ppm / °C, 1200ppm / °C, 1300ppm / °C, 1400ppm / °C, etc., or other values ​​within the above range, which are not limited here. The resistivity of the heating element 122 may be 0.8Ω·cm, 0.9Ω·cm, 1.0Ω·cm, 1.1Ω·cm, 1.2Ω·cm, etc., or other values ​​within the above range, which are not limited here.

[0053] In this embodiment, the first heating layer 21 is prone to a large amount of brittle iron-containing and chromium-containing oxides precipitating into the aerosol-generating matrix under high temperature conditions. The heating element 122 is formed by stacking, pressing and patterning the second heating layer 22, the first heating layer 21 and the third heating layer 23 in sequence. The heating element 122 is a "sandwich" laminated structure. Specifically, the second heating layer 22 completely covers the first surface 21a of the first heating layer 21, and the third heating layer 23 completely covers the second surface 21b of the first heating layer 21. Under high temperature conditions, the surfaces of the second heating layer 22 and the third heating layer 23 away from the first heating layer 21 will form a dense oxygen-blocking oxide film. The oxide film can prevent the heating element 122 from being oxidized by contact with the outside world, and thus will not form iron-containing oxides and chromium-containing oxides, thereby maintaining the high temperature resistance reliability of the heating element 122.

[0054] The heating element 122 has good high temperature performance. When preparing the atomizer core 12, the heating element 122 can be first installed on the atomization surface 24 of the porous substrate 121, and then co-fired under high temperature conditions to improve the structural stability of the atomizer core 12. In this embodiment, due to the excellent high temperature resistance of the heating element 122, the co-firing temperature of the porous substrate 121 and the heating element 122 can be adapted to a higher temperature, and the adjustable range of the sintering temperature is increased. Specifically, during the sintering process, the co-firing temperature of the porous substrate 121 and the heating element 122 can exceed 1000°C.

[0055] In one embodiment, the first heating layer 21 is a metal mesh of stainless steel 316, with a resistivity of approximately 0.8Ω·cm, a resistance value of approximately 0.9Ω, a resistance temperature coefficient of approximately 1300ppm / °C, and a thickness of 50 microns. A NiCrAlY coating with a thickness of 3μm is deposited on the surface of the first heating layer 21 by physical vapor deposition. The first heating layer 21 and the second heating layer 22 form a heating element 122, and the resistance value of the heating element 122 is 0.86Ω, and the resistance temperature coefficient is 1250ppm / °C.

[0056] Please refer to Figures 6(a) and 6(b). Figure 6(a) is a SEM image of the first heating layer without NiCrAlY coating after high-temperature heating; Figure 6(b) is a SEM image of the heating element made of the first heating layer with NiCrAlY coating after high-temperature heating.

[0057] The metal mesh made of the first heating layer 21 without NiCrAlY coating and the heating element 122 made of the first heating layer 21 with NiCrAlY coating were placed in 1000°C air for heat treatment for one hour. Under high temperature conditions, a large amount of brittle flaky iron and chromium oxides are formed on the surface of the first heating layer 21 without NiCrAlY coating, as shown in Figure 6(a), and the surface of the first heating layer 21 turns green; while the surface of the first heating layer 21 with NiCrAlY coating does not turn green, and the NiCrAlY coating on the surface of the first heating layer 21 forms a granular and dense aluminum oxide film layer under high temperature conditions, as shown in Figure 6(b), which can effectively prevent the first heating layer 21 from being oxidized.

[0058] The shape and size of the first heating layer 21 of the stainless steel 316 metal mesh are shown in Table 1.

[0059] Table 1

[0060]

[0061]

[0062] In another embodiment, the first heating layer 21 is a metal mesh of stainless steel 430, with a resistivity of about 0.6Ω·cm, a resistance temperature coefficient of about 1800ppm / ℃, and a thickness of 70 microns. The heating element 122 is obtained by stacking and mechanically pressing the second heating layer 22 made of FeCrAl, the first heating layer 21 made of stainless steel 430, and the third heating layer 23 made of FeCrAl, and the thickness of the heating element 122 is about 80 microns. Among them, the second heating layer 22 and the third heating layer 23 are 20 microns each, and the first heating layer 21 is 40 microns. The resistivity of the heating element 122 is 1Ω·cm, and the resistance temperature coefficient is about 1300ppm / ℃.

[0063] Please refer to Figure 7(a) and Figure 7(b). Figure 7(a) is a SEM image of the first heating layer alone after high-temperature heating; Figure 7(b) is a SEM image of the heating body made by stacking and pressing the second heating layer, the first heating layer and the third heating layer after high-temperature heating.

[0064] The metal mesh made of the single first heating layer 21 and the heating element 122 obtained by stacking and pressing the second heating layer 22, the first heating layer 21 and the third heating layer 23 are placed in the air at 1000°C for heat treatment for one hour. Under high temperature conditions, a large amount of brittle flaky iron and chromium oxides are formed on the surface of the single first heating layer 21, as shown in Figure 7(a), and the surface of the single first heating layer 21 appears green; while the surface of the heating element 122 obtained by stacking and pressing the second heating layer 22, the first heating layer 21 and the third heating layer 23 has no greening phenomenon, and a granular and dense aluminum oxide film layer is formed on the surface of the second heating layer 22 and the third heating layer 23, as shown in Figure 7(b), which can effectively prevent the heating element 122 from being oxidized and ensure the high temperature resistance and temperature controllable performance of the heating element 122.

[0065] The metal mesh formed by stainless steel 430 is used as the first heating layer 21 , and the shape and size of the first heating layer 21 are shown in Table 2.

[0066] Table 2

[0067]

[0068]

[0069] The technical solution of the present application is described in detail below based on specific embodiments.

[0070] Example 1

[0071] A first heating layer 21, a second heating layer 22 and a third heating layer 23 are provided. The first heating layer 21 is stainless steel 430, and the materials of the second heating layer 22 and the third heating layer 23 are both FeCrAl. The second heating layer 22, the first heating layer 21 and the third heating layer 23 are stacked and mechanically pressed to obtain a precursor.

[0072] The precursor is chemically etched to obtain a grid-shaped heating element 122 .

[0073] In this embodiment, the thickness of the heating element 122 is 70 micrometers, the resistivity of the heating element 122 is 1Ω·cm, and the resistance temperature coefficient is 1300 ppm / ° C. The thickness of the first heating layer 21 accounts for 50% of the thickness of the heating element 122 .

[0074] Example 2

[0075] The grid-shaped heating element 122 is obtained by using the same materials and steps as in Example 1.

[0076] In this embodiment, the thickness of the heating element 122 is 100 micrometers, the resistivity of the heating element 122 is 0.76Ω·cm, and the resistance temperature coefficient is 1450 ppm / ° C. The thickness of the first heating layer 21 accounts for 80% of the thickness of the heating element 122 .

[0077] Example 3

[0078] The grid-shaped heating element 122 is obtained by using the same materials and steps as in Example 1.

[0079] In this embodiment, the thickness of the heating element 122 is 80 micrometers, the resistivity of the heating element 122 is 1.2Ω·cm, and the resistance temperature coefficient is 750 ppm / ° C. The thickness of the first heating layer 21 accounts for 25% of the thickness of the heating element 122 .

[0080] Example 4

[0081] A first heating layer 21, a second heating layer 22 and a third heating layer 23 are provided. The material of the first heating layer 21 is 316 stainless steel, and the materials of the second heating layer 22 and the third heating layer 23 are both FeCrAl. The second heating layer 22, the first heating layer 21 and the third heating layer 23 are stacked and mechanically pressed to obtain a precursor.

[0082] The precursor is chemically etched to obtain a grid-shaped heating element 122 .

[0083] In this embodiment, the thickness of the heating element 122 is 70 micrometers, the resistivity of the heating element 122 is 1.1Ω·cm, and the resistance temperature coefficient is 1000 ppm / ° C. The thickness of the first heating layer 21 accounts for 50% of the thickness of the heating element 122 .

[0084] Example 5

[0085] A first heating layer 21, a second heating layer 22 and a third heating layer 23 are provided. The material of the first heating layer 21 is stainless steel 904, and the materials of the second heating layer 22 and the third heating layer 23 are both FeCrAl. The second heating layer 22, the first heating layer 21 and the third heating layer 23 are stacked and mechanically pressed to obtain a precursor.

[0086] The precursor is chemically etched to obtain a grid-shaped heating element 122 .

[0087] In this embodiment, the thickness of the heating element 122 is 100 micrometers, the resistivity of the heating element 122 is 1.27Ω·cm, and the resistance temperature coefficient is 300 ppm / ° C. The thickness of the first heating layer 21 accounts for 10% of the thickness of the heating element 122 .

[0088] Comparative Example 1

[0089] The heating element 122 is a single-layer structure. The material of the heating element 122 is stainless steel 430. The thickness of the heating element 122 is 70 microns. The resistivity of the heating element 122 is 0.6Ω·cm, and the resistance temperature coefficient is 1800ppm / °C.

[0090] Comparative Example 2

[0091] The heating element 122 is a single-layer structure. The material of the heating element 122 is stainless steel 316. The thickness of the heating element 122 is 70 microns. The resistivity of the heating element 122 is 0.8Ω·cm, and the resistance temperature coefficient is 1340ppm / °C.

[0092] Comparative Example 3

[0093] The heating element 122 is a single-layer structure. The material of the heating element 122 is stainless steel 904. The thickness of the heating element 122 is 70 microns. The resistivity of the heating element 122 is 0.95Ω·cm, and the resistance temperature coefficient is 800ppm / °C.

[0094] Comparative Example 4

[0095] The heating element 122 is a single-layer structure. The material of the heating element 122 is FeCrAl. The thickness of the heating element 122 is 70 micrometers. The resistivity of the heating element 122 is 1.4Ω·cm, and the temperature coefficient of resistance is less than 100ppm / °C.

[0096] The above implementation and the performance test of the heating element 122 are carried out. Specifically, the thickness of the heating element 122 and the thickness of the first heating layer 21, the second heating layer 22 and / or the third heating layer 23 in the heating element 122 are measured; and the resistivity of the heating element 122 is tested by a resistivity tester.

[0097] Specifically, the resistivity and resistance temperature coefficient of the heating element 122 in the above-mentioned embodiment and comparative example are shown in Table 3.

[0098] Table 3

[0099]

[0100] The heating element 122 prepared in Examples 1 to 5 of the present application can enhance the heat resistance of the heating element 122 by adopting three metal sheets stacked in layers, so that the heating element 122 has excellent high temperature resistance and a high temperature coefficient of resistance. The excellent resistivity can make the heating element 122 generate more heat during the heating process, thereby improving the heating efficiency; the high temperature coefficient of resistance makes the temperature of the heating element 122 controllable. The first heating layer 21 is covered by the second heating layer 22 and the third heating layer 23, so that a dense aluminum oxide film layer is formed on the surface of the heating element 122 under high temperature conditions, which can effectively prevent the continuous oxidation of the heating element 122, improve the problem that the heating element 122 is easy to form a large amount of brittle flaky iron and chromium oxides, and prevent the first heating layer 21 from being corroded by the aerosol-forming matrix.

[0101] In Example 1, the heating element 122 obtained by adopting the composite mode of FeCrAl+stainless steel 430+FeCrAl can obtain a higher resistivity and a higher temperature coefficient of resistance, and has a temperature control function while improving the heating efficiency, and its comprehensive performance is excellent.

[0102] In Example 2, the heating element 122 obtained by adopting the composite mode of FeCrAl+stainless steel 430+FeCrAl can obtain suitable resistivity and high resistance temperature coefficient, which can ensure the heating efficiency of the heating element 122 while achieving precise temperature control to prevent dry burning.

[0103] In Example 5, the heating element 122 obtained by the composite mode of FeCrAl+stainless steel 904+FeCrAl can obtain excellent resistivity and low resistance temperature coefficient, so that the heating element 122 can only ensure the heating efficiency of the heating element 122 but cannot take into account the temperature control function of the heating element 122.

[0104] In summary, the present application can design and set values ​​according to user needs by selecting the material of the heating layer and the thickness of each layer of the heating layer, and can obtain a series of heating elements 122 with excellent performance.

[0105] In an electronic atomization device 100 provided in this embodiment, a heating element 122 includes a first heating layer 21, including a first surface 21a and a second surface 21b opposite to each other; a second heating layer 22, which is arranged on the first heating layer 21 and at least partially covers the first surface 21a and / or the second surface 21b; wherein the resistance temperature coefficient of the first heating layer 21 is greater than the resistance temperature coefficient of the second heating layer 22. In this application, a second heating layer 22 with high temperature resistance is arranged on the first heating layer 21 with a large resistance temperature coefficient and limited high temperature resistance, and the second heating layer 22 covers the first surface 21a and the second surface 21b opposite to the first heating layer 21 to form a composite heating element 122, so that the heating element 122 has both good high temperature resistance and high temperature controllability.

[0106] The above are only implementation modes of the present invention, and are not intended to limit the patent protection scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A heating element for heating an aerosol-forming substrate, characterized in that: The heating element comprises: A first heat-generating layer including a first surface and a second surface opposite to each other; a second heating layer, disposed on the first heating layer and at least partially covering the first surface and / or the second surface; Wherein, the resistance temperature coefficient of the first heating layer is greater than the resistance temperature coefficient of the second heating layer.

2. The heating element according to claim 1, characterized in that: The heating element further comprises: A third heat-generating layer at least partially covers a surface of the first heat-generating layer that is not covered by the second heat-generating layer.

3. The heating element according to claim 2, characterized in that: The second heat generating layer completely covers the first surface, and the third heat generating layer completely covers the second surface.

4. The heating element according to any one of claims 1 to 3, characterized in that: The thickness of the second heating layer and / or the third heating layer is 1 micrometer to 50 micrometers; Preferably, the thickness of the second heating layer and / or the third heating layer is 3 micrometers to 10 micrometers.

5. The heating element according to any one of claims 1 to 3, characterized in that: The thickness of the heating element is 50 microns to 150 microns; Preferably, the thickness of the heating element is 70 microns to 100 microns.

6. The heating element according to claim 5, characterized in that: The thickness of the first heating layer accounts for 10% to 80% of the thickness of the heating element.

7. The heating element according to any one of claims 1 to 3, characterized in that: The second heating layer and / or the third heating layer are made of a material containing aluminum; Preferably, the material of the second heating layer and / or the third heating layer is an alloy containing aluminum element.

8. The heating element according to claim 7, characterized in that: The material containing aluminum element includes at least one of Al2O3, NiAl, NiCrAl, NiCrAlY, and FeCrAl.

9. The heating element according to any one of claims 1 to 3, characterized in that: Also includes at least one of the following: The resistance temperature coefficient of the first heating layer is not less than 800ppm / ℃; The temperature coefficient of resistance of the heating element is in the range of 300ppm / ℃~1450ppm / ℃; The resistivity of the heating element is in the range of 0.76 Ω·cm to 1.27 Ω·cm.

10. An atomizer core, characterized in that: include: A porous substrate including a liquid absorption surface and an atomization surface; A heating element is arranged on the atomized surface of the porous substrate, wherein the heating element is the heating element according to any one of claims 1 to 9.

11. An atomizer, characterized in that: include: A housing having a receiving cavity for receiving an aerosol-forming substrate; An atomizer core is disposed in the accommodating cavity, and the atomizer core is used to heat the aerosol-forming substrate; wherein the atomizer core is the atomizer core described in claim 10 above.

12. An electronic atomization device, characterized in that: It comprises a power supply assembly and the atomizer according to claim 11, wherein the power supply assembly is used to supply power to the atomizer.

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