Electronic component hardness detection device and use method thereof

Abstract

The invention relates to the technical field of electronic component hardness detection, in particular to an electronic component hardness detection device and a using method thereof.The electronic component hardness detection device comprises a detection table, and a feeding mechanism is installed on the top face of the detection table; a detection structure is mounted on the top surface of the detection table, the detection structure comprises an air cylinder, the air cylinder is fixedly mounted on the top surface of the detection table, the extending end of the air cylinder is fixedly connected with a connecting block, a shade is slidably mounted on the outer side of the connecting block, and the outer side of the shade is fixedly connected with the air cylinder; and the top surface of the shade is fixedly connected with a first spring. According to the detection device disclosed by the invention, by arranging the rotatable placement table, the standard circuit board and the substandard circuit board can be separately discharged through left and right inclination, the process is smooth, residues of scraps on the placement table are avoided, the influence of external factors on a detection result is reduced, the advantages are outstanding, the functionality is stronger, and the wide popularization and use of the device are facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component hardness detection, and in particular to an electronic component hardness detection device and a use method thereof. Background Art

[0002] Electronic components are components of electronic components and small machines and instruments. Generally, it is necessary to perform hardness testing on circuit boards used in the production and processing of electronic components in order to detect whether the hardness of the circuit boards meets the standards. Usually, a hardness testing device is used to test the hardness of the circuit boards. Generally, a hardness testing device uses a hydraulic structure to impact the circuit boards to observe whether the circuit boards are damaged, so as to achieve the purpose of hardness testing.

[0003] In this regard, China's patent application number: CN202310314373.5 discloses an electronic component hardness testing device, including a frame, a workbench is provided on the frame, a working chamber for placing a circuit board is provided on the workbench, a hydraulic cylinder is provided on the frame, a test head abutting against the circuit board is provided at the end of the piston rod of the hydraulic cylinder, and a protective mechanism is provided on the frame, the protective mechanism includes a protective cover and a telescopic connector, the protective cover is provided outside the working chamber, the piston rod of the hydraulic cylinder passes through the protective cover and slides with the protective cover, and the two ends of the telescopic connector are respectively connected to the piston rod of the hydraulic cylinder and the protective cover. This application has the effect of improving the safety during the detection process.

[0004] The detection device can suck out the debris and fine slag by setting a pipeline to connect the suction mechanism. However, when sucking out the debris and fine slag, the debris and fine slag are easily blocked by the clamping part, and the ideal suction effect cannot be achieved. In addition, the debris and fine slag are left in the working chamber, which will also affect the subsequent circuit board inspection. At the same time, it is impossible to distinguish between qualified circuit boards and unqualified circuit boards. The functionality is poor and is not conducive to popularization and use.

[0005] Therefore, in order to solve the above problems, an electronic component hardness detection device and a method for using the same are proposed. Summary of the invention

[0006] The purpose of the present invention is to provide an electronic component hardness testing device and a method of using the same, so as to solve the problem that the testing device in the prior art proposed in the above background technology can suck out debris and fine slag by setting a pipeline to connect the suction mechanism, but when sucking out the debris and fine slag, the debris and fine slag are easily blocked by the clamping part, and the ideal suction effect cannot be achieved. In addition, the debris and fine slag are omitted in the working chamber, which will also affect the subsequent circuit board inspection. At the same time, it is impossible to distinguish between qualified circuit boards and unqualified circuit boards, and the functionality is poor, which is not conducive to promotion and use.

[0007] To achieve the above object, the present invention provides the following technical solution: an electronic component hardness testing device, comprising: a testing platform, a feeding mechanism is installed on the top surface of the testing platform; The top surface of the testing platform is provided with feeding troughs on both sides: The top surface of the detection platform is installed with a detection structure, and the detection structure includes a cylinder, the cylinder is fixedly installed on the top surface of the detection platform, the protruding end of the cylinder is fixedly connected with a connecting block, the outer side of the connecting block is slidably installed with a shield, the top surface of the shield is fixedly connected with a first spring, the bottom surface of the connecting block is fixedly connected with a second spring, one end of the second spring is fixedly connected with a detection head, and the front side of the shield is fixedly connected with a magnetic block; A distinguishing structure is installed on the lower side of the detection structure, and the distinguishing structure includes a guide table, which is fixedly installed on the middle part of the top surface of the detection table, and a placing table is movably installed on the upper end of the guide table through a bearing, a gear is fixedly connected to the front side of the guide table, an electric push rod is fixedly installed on the top surface of the placing table, a groove is provided on the top surface of the placing table, and a bottom plate is movably installed inside the groove, a first wedge block is fixedly connected to the center of the bottom surface of the bottom plate, and third springs are fixedly connected to both sides of the bottom surface of the bottom plate, a first wedge head rod is slidably installed on the inner side of the placing table, a first wedge groove is provided on the top surface of the first wedge head rod, and a fourth spring is fixedly connected to the rear end of the first wedge groove.

[0008] Preferably, a moving structure is installed on the front side of the distinguishing structure, and the moving structure includes two groups of guide rods, the two groups of guide rods are fixedly installed on the front side of the top surface of the detection platform, the upper ends of the guide rods are fixedly connected with a fifth spring, two groups of fixed frames are installed on the inner sides of the two groups of guide rods, the inner upper ends of the fixed frames are fixedly connected with a sixth spring, the outer side of the guide rods is slidably installed with a moving frame, the inner side of the moving frame is bonded with a damping pad, two groups of second wedge rods are fixedly connected to the inner wall of the moving frame, the front side of the moving frame is fixedly connected with a third wedge rod, a moving block is slidably installed on the inner side of the fixed frame, a rack plate is slidably installed on the inner side of the moving block, the outer wall of the rack plate is fixedly connected with a seventh spring, the bottom surface of the moving block is provided with a second wedge groove, and the inner wall of the second wedge groove is provided with an abutment groove.

[0009] Preferably, the mask is located on the upper side of the placement table, one end of the first spring is fixedly connected to the outer wall of the connecting block, the bottom end of the detection head is exposed from the bottom surface of the connecting block, and the front end of the magnetic block is located on the upper side of the movable frame.

[0010] Preferably, the two side walls of the guide table are flush with the inner walls of the two groups of material discharge troughs, the placement table is horizontally arranged, the protruding end of the electric push rod is connected to a push plate, the top surface of the bottom plate is flush with the top surface of the placement table, the bottom end of the first wedge block is located on the inner side of the first wedge groove and is matched with the first wedge groove, one end of the third spring is fixedly connected to the inner wall of the groove, one end of the fourth spring is fixedly connected to the inner wall of the placement table, the front end of the first wedge head rod passes through the gear and is fitted with the bottom end of the third wedge head rod, and the first wedge head rod is matched with the third wedge head rod.

[0011] Preferably, the fixed frame is arranged on the left and right sides and is installed on the top surface of the detection platform, one end of the fifth spring is fixedly connected to the movable frame, the movable frame is located on the right side of the middle part of the two groups of guide rods, the damping pad is tightly fitted with the guide rod, the upper ends of the two groups of second wedge head rods are respectively inserted into the inside of the two groups of moving blocks, the two groups of second wedge head rods are arranged on the left and right sides, the upper end of the second wedge head rod of the left group is aligned with the abutment groove on the bottom surface of the left group of rack plates, and the upper end of the second wedge head rod of the right group is fitted with the inner wall of the second wedge groove on the bottom surface of the right group of rack plates.

[0012] Preferably, the two groups of rack plates are respectively located on the left and right sides of the gear, both groups of rack plates are meshed with the gear, one end of the seventh spring is fixedly connected to the inner wall of the moving block, and the second wedge groove is adapted to the second wedge head rod.

[0013] A method for using an electronic component hardness testing device: S1. Use the loading mechanism to place the circuit board on the top surface of the placement table, start the electric push rod, and drive the push plate to clamp the circuit board; S2. Start the cylinder to drive the connection block and the mask down, the mask fits the placement table, the magnetic block is magnetically connected to the top surface of the mobile frame, the detection head fits the circuit board downward, the detection head retracts upward into the connection block and squeezes the second spring; S3. If the circuit board is intact, the bottom plate remains fixed, the two sets of second wedge rods are respectively located on the right side inside the two sets of rack plates, the control cylinder contracts, the cylinder drives the detection head to rise, the magnetic block pulls the moving frame, the moving frame drives the left set of second wedge rods to move into the abutment groove, the right set of second wedge rods push the second wedge groove, the right set of rack plates are disengaged from the gear, the right set of second wedge rods moves into the abutment groove, the two sets of second wedge rods push the two sets of rack plates and the moving block, the left set of rack plates drives the gear to rotate clockwise, the placement table rotates clockwise, the placement table tilts to the right, and the qualified circuit boards on the placement table are moved out from the right side of the detection table via the placement table and the unloading chute; S4. If the circuit board is broken, the detection head loses the support of the circuit board and pushes the bottom plate. The bottom plate drives the first wedge block to push the first wedge groove downward. The first wedge rod extends forward in the placement table. The first wedge rod pushes the third wedge rod. The third wedge rod drives the movable frame to move to the left outside the guide rod. The two groups of second wedge rods move to the left in the two groups of moving blocks respectively. The upper end of the second wedge rod of the left group fits with the second wedge groove on the left, and the upper end of the second wedge rod of the right group separates from the second wedge groove on the right and is aligned with the abutment groove on the right side. The cylinder is controlled to contract. The cylinder drives the detection head to rise from the top surface of the placement table, and the detection head is pulled upward. The movable frame is moved, and the movable frame rises, driving the second wedge rod of the left group to push the second wedge groove, and the rack plate of the left group is released from the meshing with the gear. The second wedge rods of the left and right groups are moved into the abutting groove, and the rack plate on the right side will keep meshing with the gear. The magnetic block pulls the movable frame upward, and the two groups of second wedge rods push the two groups of rack plates and the movable block. The movable block rises in the fixed frame and squeezes the sixth spring. When the rack plate of the right group moves, it drives the gear to rotate counterclockwise, and the gear drives the placement table to rotate counterclockwise, so that the placement table tilts to the left on the guide table, and the circuit board fragments on the placement table are moved out from the left side of the detection table through the placement table and the unloading chute; S5. The first wedge rod and the base plate are reset under the elastic action of the fourth spring and the third spring, the cylinder drives the moving block to rise, the moving block moves to the upper end of the fixed frame and cannot move further, the magnetic attraction between the magnetic block and the moving frame is released, and the moving frame is reset downward under the elastic action of the sixth spring, and the moving frame and the two sets of second wedge rods are reset under the elastic action of the seventh spring, and keep the left set of second wedge rods aligned with the abutment grooves in the left set of rack plates, and the right set of second wedge rods are in a state of being in contact with the second wedge grooves of the right set of rack plates.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the detection device of the present invention, by providing a rotatable placement table, can distinguish and cut out qualified circuit boards and non-qualified circuit boards by tilting left and right. The process is smooth, and debris is avoided from remaining on the placement table, reducing the influence of external factors on the detection results. The advantages are outstanding, the functionality is stronger, and it is convenient for the widespread promotion and use of the device.

[0015] A detection table, a detection structure, a distinguishing structure and a moving structure are provided. The cylinder is started to drive the connection block and the mask to descend. The mask will fit the top surface of the placement table and can cover the outside of the circuit board, and the magnetic block will be magnetically connected with the top surface of the moving frame. As the cylinder drives the connection block to continue to descend, the connection block will move downward on the mask, the connection block squeezes the first spring, and drives the detection head downward to fit the top surface of the circuit board. The detection head retracts upward into the connection block and squeezes the second spring. The second spring reacts on the detection head, so that the detection head is tightly pressed against the top surface of the circuit board to detect the hardness of the circuit board; If the circuit board remains intact, that is, meets the standards, the circuit board is mounted on the upper side of the bottom plate, and the detection head cannot press down the bottom plate, and the bottom plate remains fixed. Therefore, the first wedge rod cannot push the third wedge rod, and the movable frame is fixedly located on the right side of the top surface of the detection platform, and the two groups of second wedge rods will be respectively located on the right side of the inside of the two groups of rack plates. At the same time, the upper end of the second wedge rod of the left group is aligned with the abutment groove, and the upper end of the second wedge rod of the right group is in contact with the inner wall of the second wedge groove. At this time, the control cylinder contracts, and the cylinder drives the detection head to rise from the top surface of the placement table. The detection head will pull the movable frame upward through the magnetic block, and the movable frame will rise on the upper side of the guide rod, and drive the second wedge rod of the left group to move directly into the abutment groove through the second wedge groove, while the push rod of the second wedge rod of the right group The second wedge groove is moved, so that the right group of rack plates are released from meshing with the gear and retracted into the moving block of the right group, and the seventh spring on the right is squeezed. At the same time, the second wedge head rod of the right group will also move into the abutment groove. At this time, the left rack plate will remain meshed with the gear. As the magnetic block pulls the moving frame upward, the two groups of second wedge head rods will respectively push the two groups of rack plates and the moving block, so that the moving block rises in the fixed frame and squeezes the sixth spring. When the left group of rack plates moves, it will drive the gear to rotate clockwise, and the gear will drive the placement table to rotate clockwise, and the placement table will tilt to the right on the guide table. At the same time, the gear and the electric push rod release the clamping of the placement table, and the circuit board that meets the standards on the placement table is moved out from the right side of the inspection table via the placement table and the unloading chute; When the second spring is pressed against the second wedge, the first spring pushes the first wedge block downwardly and pushes the first wedge block downwardly to push the inner wall of the first wedge groove. When the second wedge block is pressed against the second wedge groove, the first wedge block pushes the first wedge block downwardly and pushes the first wedge block downwardly to push the inner wall of the first wedge groove. When the second wedge block is pressed against the second wedge groove, the first wedge block pushes the first wedge block downwardly and pushes the first wedge block downwardly to push the inner wall of the first wedge groove. The upper side rises and drives the left group of second wedge head rods to push the second wedge groove, so that the left group of rack plates are released from the meshing with the gear and retracted into the moving block of the left group and squeeze the seventh spring on the left side. At the same time, the right group of second wedge head rods directly moves into the abutment groove through the second wedge groove, and the left group of second wedge head rods will also move into the abutment groove. At this time, the rack plate on the right will keep meshing with the gear. As the magnetic block pulls the moving frame upward, the two groups of second wedge head rods will respectively push the two groups of rack plates and the moving block, so that the moving block rises in the fixed frame and squeezes the sixth spring. When the right group of rack plates moves, it will drive the gear to rotate counterclockwise, and the gear will drive the placement table to rotate counterclockwise, and the placement table will tilt to the left on the guide table. At the same time, the gear and the electric push rod release the clamping of the placement table, and the fragments of the substandard circuit board on the placement table are moved out from the left side of the inspection table through the placement table and the unloading chute to avoid the residue of fragments, so as to realize the rapid distinction between the qualified circuit board and the substandard circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic front view of the structure of the present invention; Figure 2 It is a schematic diagram of the structure explosion of the present invention; Figure 3 It is a front cross-sectional schematic diagram of the structure of the connecting block and the mask of the present invention; Figure 4 It is a schematic diagram of the structure explosion of the distinguishing structure and the moving structure of the present invention; Figure 5 It is a schematic side cross-sectional view of the structure of the placement table and the groove of the present invention; Figure 6 It is a schematic diagram of the structural explosion of the mobile structure of the present invention; Figure 7 It is a front cross-sectional schematic diagram of the structure of the moving block and the second wedge groove of the present invention; Figure 8 It is a schematic top view cross-sectional view of the structure of the guide rod, the movable frame and the damping pad of the present invention; Fig. 9 It is a front view cross-sectional schematic diagram of the structure of the second wedge head rod, the second wedge groove and the abutment groove of the present invention.

[0017] In the figure: 1. detection table; 11. unloading trough; 12. feeding mechanism; 2. detection structure; 21. cylinder; 22. connecting block; 23. shield; 24. first spring; 25. second spring; 26. detection head; 27. magnetic block; 3. distinguishing structure; 31. guide table; 32. placing table; 33. gear; 34. electric push rod; 35. groove; 36. bottom plate; 37. first wedge block; 38. third spring; 39. first wedge head rod; 310. first wedge groove; 311. fourth spring; 4. moving structure; 41. guide rod; 42. fifth spring; 43. fixed frame; 44. sixth spring; 45. moving frame; 46. damping pad; 47. second wedge head rod; 48. third wedge head rod; 49. moving block; 410. rack plate; 411. seventh spring; 412. second wedge groove; 413. abutment groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1-Figure 9 , an embodiment provided by the present invention: The testing table 1, feeding mechanism 12, cylinder 21, testing head 26 and electric push rod 34 used in the present application are products that can be directly purchased on the market. Their principles and connection methods are existing technologies well known to those skilled in the art, so they will not be repeated here.

[0020] An electronic component hardness testing device comprises: a testing platform 1, a feeding mechanism 12 is installed on the top surface of the testing platform 1; The top surface of the testing platform 1 is provided with feed troughs 11 on both sides: A detection structure 2 is installed on the top surface of the detection platform 1. The detection structure 2 includes a cylinder 21. The cylinder 21 is fixedly installed on the top surface of the detection platform 1. A connecting block 22 is fixedly connected to the protruding end of the cylinder 21. A shield 23 is slidably installed on the outer side of the connecting block 22. A first spring 24 is fixedly connected to the top surface of the shield 23. A second spring 25 is fixedly connected to the bottom surface of the connecting block 22. A detection head 26 is fixedly connected to one end of the second spring 25. A magnetic block 27 is fixedly connected to the front of the shield 23. A distinguishing structure 3 is installed at the lower side of the detection structure 2, and the distinguishing structure 3 includes a guide table 31, which is fixedly installed in the middle of the top surface of the detection table 1, and a placement table 32 is movably installed on the upper end of the guide table 31 through a bearing, and a gear 33 is fixedly connected to the front of the guide table 31, and an electric push rod 34 is fixedly installed on the top surface of the placement table 32. A groove 35 is opened on the top surface of the placement table 32, and a bottom plate 36 is movably installed inside the groove 35. The center of the bottom surface of the bottom plate 36 is fixedly connected to a first wedge block 37, and the bottom surface of the bottom plate 36 is fixed on both sides. A third spring 38 is connected, and a first wedge rod 39 is slidably installed on the inner side of the placement table 32. A first wedge groove 310 is provided on the top surface of the first wedge rod 39, and a fourth spring 311 is fixedly connected to the rear end of the first wedge groove 310. By setting a rotatable placement table 32, qualified circuit boards and unqualified circuit boards can be distinguished and unloaded by tilting left and right. The process is smooth, and debris residue on the placement table 32 is avoided, reducing the influence of external factors on the detection results. The advantages are outstanding, the functionality is stronger, and it is convenient for the widespread promotion and use of the device.

[0021] Further, a moving structure 4 is installed on the front side of the distinguishing structure 3, and the moving structure 4 includes two groups of guide rods 41, the two groups of guide rods 41 are fixedly installed on the front side of the top of the detection platform 1, the upper ends of the guide rods 41 are fixedly connected with the fifth spring 42, the inner sides of the two groups of guide rods 41 are installed with two groups of fixed frames 43, the inner upper ends of the fixed frames 43 are fixedly connected with the sixth spring 44, the outer sides of the guide rods 41 are slidably installed with a moving frame 45, the inner side of the moving frame 45 is bonded with a damping pad 46, the inner wall of the moving frame 45 is fixedly connected with two groups of second wedge rods 47, the front side of the moving frame 45 is fixedly connected with the third wedge rod 48, and the fixed A moving block 49 is slidably installed on the inner side of the fixed frame 43, and a rack plate 410 is slidably installed on the inner side of the moving block 49. A seventh spring 411 is fixedly connected to the outer wall of the rack plate 410. A second wedge groove 412 is provided on the bottom surface of the moving block 49, and an abutment groove 413 is provided on the inner wall of the second wedge groove 412. The moving structure 4 can drive the placement table 32 to tilt in a certain direction according to the cooperation between the detection head 26 and the base plate 36, so as to distinguish and unload qualified circuit boards and unqualified circuit boards. The process is smooth, and debris is avoided from remaining on the placement table 32, reducing the influence of external factors on the detection results.

[0022] Furthermore, the mask 23 is located on the upper side of the placement table 32, one end of the first spring 24 is fixedly connected to the outer wall of the connecting block 22, the bottom end of the detection head 26 is exposed from the bottom surface of the connecting block 22, and the front end of the magnetic block 27 is located on the upper side of the moving frame 45. The mask 23 can cover the upper side of the placement table 32, and the magnetic block 27 can be magnetically connected to the moving frame 45.

[0023] Furthermore, the two side walls of the guide platform 31 are flush with the inner walls of the two groups of feed troughs 11, the placement platform 32 is arranged horizontally, the extended end of the electric push rod 34 is connected with a push plate, the top surface of the bottom plate 36 is flush with the top surface of the placement platform 32, the bottom end of the first wedge block 37 is located on the inner side of the first wedge groove 310 and is adapted to the first wedge groove 310, one end of the third spring 38 is fixedly connected to the inner wall of the groove 35, one end of the fourth spring 311 is fixedly connected to the inner wall of the placement platform 32, and the front end of the first wedge head rod 39 is fixedly connected to the inner wall of the groove 35. It passes through the gear 33 and fits with the bottom end of the third wedge rod 48. The first wedge rod 39 is adapted to the third wedge rod 48. The electric push rod 34 cooperates with the push plate to fix the circuit board. The first wedge block 37 can be inserted in the first wedge groove 310 to push the first wedge rod 39 to move on the inner side of the placement table 32. The first wedge rod 39 can abut against the third wedge rod 48 to make the movable frame 45 move horizontally. The third spring 38 and the fourth spring 311 provide power for the reset of the bottom plate 36 and the first wedge rod 39.

[0024] Furthermore, the fixed frame 43 is arranged on the left and right sides and is installed on the top surface of the detection platform 1. One end of the fifth spring 42 is fixedly connected to the movable frame 45. The movable frame 45 is located on the right side of the middle part of the two groups of guide rods 41. The damping pad 46 is tightly fitted with the guide rod 41. The upper ends of the two groups of second wedge rods 47 are respectively inserted into the inside of the two groups of moving blocks 49. The two groups of second wedge rods 47 are arranged on the left and right sides. The upper end of the left group of second wedge rods 47 is aligned with the abutment groove 413 on the bottom surface of the left group of rack plates 410, and the upper end of the right group of second wedge rods 47 is fitted with the inner wall of the second wedge groove 412 on the bottom surface of the right group of rack plates 410. The rack plates 410 in the two groups of fixed frames 43 can be moved horizontally one by one with the cooperation of the two groups of second wedge rods 47 on the movable frame 45 to realize the unidirectional rotation of the gear 33 and provide power for the tilting of the placement table 32.

[0025] Furthermore, the two sets of rack plates 410 are respectively located on the left and right sides of the gear 33, and the two sets of rack plates 410 are both meshed with the gear 33. One end of the seventh spring 411 is fixedly connected to the inner wall of the moving block 49, and the second wedge groove 412 is adapted to the second wedge head rod 47. The seventh spring 411 provides power for the moving block 49 to reset in the rack plate 410. The second wedge head rod 47 can push the second wedge groove 412, so that the rack plate 410 moves in the moving block 49.

[0026] A method for using an electronic component hardness testing device: S1. Use the loading mechanism 12 to place the circuit board on the top surface of the placement table 32, start the electric push rod 34, and drive the push plate to clamp the circuit board; S2. Start the cylinder 21, drive the connection block 22 and the mask 23 down, the mask 23 fits the placement table 32, the magnetic block 27 is magnetically connected to the top surface of the movable frame 45, the detection head 26 fits the circuit board downward, the detection head 26 retracts upward into the connection block 22 and squeezes the second spring 25; S3. If the circuit board is intact, the bottom plate 36 remains fixed, the two groups of second wedge rods 47 are respectively located on the right side inside the two groups of rack plates 410, the control cylinder 21 contracts, the cylinder 21 drives the detection head 26 to rise, the magnetic block 27 pulls the moving frame 45, and the moving frame 45 drives the left group of second wedge rods 47 to move into the abutment groove 413, the right group of second wedge rods 47 push the second wedge groove 412, the right group of rack plates 410 are released from the meshing with the gear 33, the right group of second wedge rods 47 move into the abutment groove 413, the two groups of second wedge rods 47 push the two groups of rack plates 410 and the moving block 49, the left group of rack plates 410 drives the gear 33 to rotate clockwise, the placement table 32 rotates clockwise, the placement table 32 tilts to the right, and the qualified circuit board on the placement table 32 is moved out from the right side of the detection table 1 via the placement table 32 and the unloading chute 11; S4. If the circuit board is broken, the detection head 26 loses the support of the circuit board and pushes the bottom plate 36. The bottom plate 36 drives the first wedge block 37 to push the first wedge groove 310 downward. The first wedge rod 39 extends forward in the placement table 32. The first wedge rod 39 pushes the third wedge rod 48. The third wedge rod 48 drives the movable frame 45 to move to the left outside the guide rod 41. The two groups of second wedge rods 47 move to the left in the two groups of moving blocks 49 respectively. The upper end of the left group of second wedge rods 47 is fitted with the second wedge groove 412 on the left, and the upper end of the right group of second wedge rods 47 is separated from the second wedge groove 412 on the right, and aligned with the abutment groove 413 on the right. The control cylinder 21 contracts, and the cylinder 21 drives the detection head 26 to rise from the top surface of the placement table 32. The detection head 26 pulls the movable frame 45 upward. 5. The movable frame 45 rises, driving the second wedge rod 47 of the left side to push the second wedge groove 412, and the rack plate 410 of the left side is released from the meshing with the gear 33. The second wedge rods 47 of the left and right sides are moved into the abutting groove 413, and the rack plate 410 of the right side will keep meshing with the gear 33. The magnetic block 27 pulls the movable frame 45 upward, and the two sets of second wedge rods 47 push the two sets of rack plates 410 and the movable block 49. The movable block 49 rises in the fixed frame 43, squeezing the sixth spring 44. When the rack plate 410 of the right side moves, it drives the gear 33 to rotate counterclockwise, and the gear 33 drives the placement table 32 to rotate counterclockwise, so that the placement table 32 tilts to the left on the guide table 31, and the circuit board fragments on the placement table 32 are moved out from the left side of the detection table 1 through the placement table 32 and the unloading chute 11. S5. The first wedge rod 39 and the bottom plate 36 are reset under the elastic action of the fourth spring 311 and the third spring 38, and the cylinder 21 drives the moving block 49 to rise. The moving block 49 moves to the upper end of the fixed frame 43 and cannot move further. The magnetic attraction between the magnetic block 27 and the moving frame 45 is released, and the moving frame 45 is reset downward under the elastic action of the sixth spring 44. The moving frame 45 and the two sets of second wedge rods 47 are reset under the elastic action of the seventh spring 411, and keep the left set of second wedge rods 47 aligned with the abutment groove 413 in the left set of rack plates 410, and the right set of second wedge rods 47 are in a state of being in contact with the second wedge groove 412 of the right set of rack plates 410. Working principle: During the inspection, the circuit board is placed on the top surface of the placement table 32 through the feeding mechanism 12, and the electric push rod 34 is started to drive the push plate to clamp the circuit board, so as to fix the circuit board on the top surface of the placement table 32; Start the cylinder 21 to drive the connection block 22 and the mask 23 to descend. The mask 23 will fit the top surface of the placement table 32 and can cover the outside of the circuit board. The magnetic block 27 will be magnetically connected to the top surface of the moving frame 45. As the cylinder 21 drives the connection block 22 to continue to descend, the connection block 22 will move downward on the mask 23. The connection block 22 squeezes the first spring 24 and drives the detection head 26 downward to fit the top surface of the circuit board. The detection head 26 retracts upward into the connection block 22 and squeezes the second spring 25. The second spring 25 reacts on the detection head 26, so that the detection head 26 is tightly pressed against the top surface of the circuit board to detect the hardness of the circuit board. If the circuit board remains intact, that is, meets the standard, the circuit board is mounted on the upper side of the bottom plate 36, and the detection head 26 cannot press down the bottom plate 36, and the bottom plate 36 remains fixed. Therefore, the first wedge rod 39 cannot push the third wedge rod 48, and the movable frame 45 is fixedly located on the right side of the top surface of the detection platform 1, and the two groups of second wedge rods 47 will be respectively located on the inner right side of the two groups of rack plates 410. At the same time, the upper end of the left group of second wedge rods 47 is aligned with the abutment groove 413, and the upper end of the right group of second wedge rods 47 is in contact with the inner wall of the second wedge groove 412. At this time, the control cylinder 21 contracts, and the cylinder 21 drives the detection head 26 to rise from the top surface of the placement table 32. The detection head 26 will pull the movable frame 45 upwards through the magnetic block 27, and the movable frame 45 will rise on the upper side of the guide rod 41, and drive the left group of second wedge rods 47 to move directly into the abutment groove 413 through the second wedge groove 412. The slot 412 causes the right group of rack plates 410 to release the meshing with the gear 33 and retract into the right group of moving blocks 49, and squeeze the seventh spring 411 on the right side. At the same time, the right group of second wedge rods 47 will also move into the abutment slot 413. At this time, the left rack plate 410 will remain meshed with the gear 33. As the magnetic block 27 pulls the moving frame 45 upward, the two groups of second wedge rods 47 will respectively push the two groups of rack plates 410 and the moving block 49, so that the moving block 49 rises in the fixed frame 43 and squeezes the sixth spring 44. When the left group of rack plates 410 moves, it will drive the gear 33 to rotate clockwise, and the gear 33 will drive the placement table 32 to rotate clockwise, and the placement table 32 will tilt to the right on the guide table 31. At the same time, the gear 33 and the electric push rod 34 release the clamping of the placement table 32, and the qualified circuit board on the placement table 32 will be moved out from the right side of the detection table 1 through the placement table 32 and the unloading chute 11. If the circuit board is broken, that is, it does not meet the standard, and the outer wall of the push plate fits with the inner wall of the mask 23, the fragments are located between the two sets of push plates, which is convenient for sliding out from the left side. The detection head 26 loses the support of the circuit board, that is, the bottom plate 36 is pushed downward under the elastic action of the second spring 25, so that the bottom plate 36 presses the third spring 38 downward, and drives the first wedge block 37 to push the inner wall of the first wedge groove 310 downward, and the first wedge head rod 39 extends forward in the placement table 32 under the cooperation of the first wedge block 37 and the first wedge groove 310, and the first wedge head rod 39 pushes the third wedge head rod 48, and the third wedge head rod 48 drives the moving frame 45 moves to the left outside the guide rod 41, and the guide rod 41 rubs against the damping pad 46. At this time, the two groups of second wedge rods 47 move to the left inside the two groups of moving blocks 49 respectively, and the upper end of the second wedge rod 47 of the left group fits with the second wedge groove 412 on the left side, and the upper end of the second wedge rod 47 of the right group separates from the second wedge groove 412 on the right side, and is aligned with the abutment groove 413 on the right side, and the cylinder 21 is controlled to contract, and the cylinder 21 drives the detection head 26 to rise from the top surface of the placement table 32. The detection head 26 will pull the moving frame 45 upward through the magnetic block 27, and the moving frame 45 is on the guide rod 41. The upper side rises up and drives the second wedge rod 47 of the left side to push the second wedge groove 412, so that the rack plate 410 of the left side is released from the meshing with the gear 33 and retracts into the moving block 49 of the left side, and squeezes the seventh spring 411 on the left side. At the same time, the second wedge rod 47 of the right side moves directly into the abutment groove 413 through the second wedge groove 412, and the second wedge rod 47 of the left side will also move into the abutment groove 413. At this time, the rack plate 410 on the right side will keep meshing with the gear 33. As the magnetic block 27 pulls the moving frame 45 upward, the two sets of second wedge rods 47 will respectively push the two sets of gears The strip plate 410 and the moving block 49 make the moving block 49 rise in the fixing frame 43 and squeeze the sixth spring 44. When the right set of rack plates 410 moves, it will drive the gear 33 to rotate counterclockwise, and the gear 33 will drive the placement table 32 to rotate counterclockwise, and the placement table 32 will tilt to the left on the guide table 31. At the same time, the gear 33 and the electric push rod 34 release the clamping of the placement table 32, and the fragments of the substandard circuit board on the placement table 32 will be removed from the left side of the inspection table 1 through the placement table 32 and the unloading chute 11, so as to avoid the residue of the fragments and realize the rapid distinction between the qualified circuit boards and the substandard circuit boards; The first wedge rod 39 and the base plate 36 are reset under the elastic action of the fourth spring 311 and the third spring 38 respectively. As the cylinder 21 drives the mask 23, the magnetic block 27, the movable frame 45 and the movable block 49 to continue to rise, the movable block 49 moves to the upper end of the fixed frame 43 and cannot move further. Therefore, the magnetic block 27 will release the magnetic attraction with the movable frame 45, and the movable frame 45 loses traction, that is, it resets downward under the elastic action of the sixth spring 44, and the movable frame 45 and the two groups of second wedge rods 47 will reset under the elastic action of the seventh spring 411, and keep the left group of second wedge rods 47 and the abutment groove 413 in the left group of rack plates 410 aligned up and down, and the right group of second wedge rods 47 and the second wedge groove 412 of the right group of rack plates 410 in a state of being in contact with each other, so as to prepare for the next detection.

[0027] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. An electronic component hardness detection device, comprising: A testing platform (1), wherein a feeding mechanism (12) is installed on the top surface of the testing platform (1); Features: The top surface of the detection platform (1) is provided with material discharge troughs (11) on both sides: A detection structure (2) is installed on the top surface of the detection platform (1), and the detection structure (2) comprises a cylinder (21), the cylinder (21) is fixedly installed on the top surface of the detection platform (1), the protruding end of the cylinder (21) is fixedly connected to a connecting block (22), a shield (23) is slidably installed on the outer side of the connecting block (22), a first spring (24) is fixedly connected to the top surface of the shield (23), a second spring (25) is fixedly connected to the inside of the bottom surface of the connecting block (22), one end of the second spring (25) is fixedly connected to a detection head (26), and a magnetic block (27) is fixedly connected to the front side of the shield (23); A distinguishing structure (3) is installed at the lower side of the detection structure (2), and the distinguishing structure (3) comprises a guide table (31), the guide table (31) is fixedly installed in the middle of the top surface of the detection table (1), a placement table (32) is movably installed on the upper end of the guide table (31) via a bearing, a gear (33) is fixedly connected to the front side of the guide table (31), an electric push rod (34) is fixedly installed on the top surface of the placement table (32), and a groove is provided on the top surface of the placement table (32). (35), a bottom plate (36) is movably installed inside the groove (35), a first wedge block (37) is fixedly connected to the center of the bottom surface of the bottom plate (36), and third springs (38) are fixedly connected to both sides of the bottom surface of the bottom plate (36), a first wedge head rod (39) is slidably installed on the inner side of the placement platform (32), a first wedge groove (310) is formed on the top surface of the first wedge head rod (39), and a fourth spring (311) is fixedly connected to the rear end of the first wedge groove (310).

2. The electronic component hardness detection device according to claim 1, characterized in that: A moving structure (4) is installed on the front side of the distinguishing structure (3), and the moving structure (4) includes two groups of guide rods (41), the two groups of guide rods (41) are fixedly installed on the front side of the top surface of the detection platform (1), the upper ends of the guide rods (41) are fixedly connected to fifth springs (42), the inner sides of the two groups of guide rods (41) are installed with two groups of fixed frames (43), the inner upper ends of the fixed frames (43) are fixedly connected to sixth springs (44), the outer sides of the guide rods (41) are slidably installed with moving frames (45), and the inner sides of the moving frames (45) are bonded with damping pads (42). 6), two groups of second wedge rods (47) are fixedly connected to the inner wall of the movable frame (45), a third wedge rod (48) is fixedly connected to the front of the movable frame (45), a movable block (49) is slidably mounted on the inner side of the fixed frame (43), a rack plate (410) is slidably mounted on the inner side of the movable block (49), a seventh spring (411) is fixedly connected to the outer wall of the rack plate (410), a second wedge groove (412) is formed on the bottom surface of the movable block (49), and an abutment groove (413) is formed on the inner wall of the second wedge groove (412).

3. The electronic component hardness detection device according to claim 1, characterized in that: The shield (23) is located on the upper side of the placement table (32), one end of the first spring (24) is fixedly connected to the outer wall of the connection block (22), the bottom end of the detection head (26) is exposed from the bottom surface of the connection block (22), and the front end of the magnetic block (27) is located on the upper side of the moving frame (45).

4. The electronic component hardness detection device according to claim 1, characterized in that: The side walls of the guide platform (31) are flush with the inner walls of the two groups of material discharge troughs (11); the placement platform (32) is arranged horizontally; the protruding end of the electric push rod (34) is connected to a push plate; the top surface of the bottom plate (36) is flush with the top surface of the placement platform (32); the bottom end of the first wedge block (37) is located on the inner side of the first wedge groove (310) and is matched with the first wedge groove (310); one end of the third spring (38) is fixedly connected to the inner wall of the groove (35); one end of the fourth spring (311) is fixedly connected to the inner wall of the placement platform (32); the front end of the first wedge head rod (39) passes through the gear (33) and is in contact with the bottom end of the third wedge head rod (48); the first wedge head rod (39) is matched with the third wedge head rod (48).

5. The electronic component hardness testing device according to claim 2, characterized in that: The fixed frame (43) is arranged on the left and right sides and is installed on the top surface of the detection platform (1). One end of the fifth spring (42) is fixedly connected to the movable frame (45). The movable frame (45) is located on the right side of the middle part of the two groups of guide rods (41). The damping pad (46) is tightly fitted with the guide rod (41). The upper ends of the two groups of second wedge rods (47) are respectively inserted into the inside of the two groups of moving blocks (49). The two groups of second wedge rods (47) are arranged on the left and right sides. The upper end of the second wedge rod (47) of the left group is vertically aligned with the abutment groove (413) on the bottom surface of the rack plate (410) of the left group, and the upper end of the second wedge rod (47) of the right group is fitted with the inner wall of the second wedge groove (412) on the bottom surface of the rack plate (410) of the right group.

6. The electronic component hardness testing device according to claim 2, characterized in that: The two sets of rack plates (410) are respectively located on the left and right sides of the gear (33), and the two sets of rack plates (410) are both meshed with the gear (33). One end of the seventh spring (411) is fixedly connected to the inner wall of the moving block (49), and the second wedge groove (412) is adapted to the second wedge head rod (47).

7. A method for using an electronic component hardness testing device according to any one of claims 1 to 6, characterized in that: S1. Use the loading mechanism (12) to place the circuit board on the top surface of the placement table (32), start the electric push rod (34), and drive the push plate to clamp the circuit board; S2. Start the cylinder (21), drive the connection block (22) and the mask (23) to descend, the mask (23) is attached to the placement table (32), the magnetic block (27) is magnetically connected to the top surface of the movable frame (45), the detection head (26) is attached to the circuit board downward, and the detection head (26) is retracted upward into the connection block (22) and squeezes the second spring (25); S3. If the circuit board is intact, the bottom plate (36) remains fixed, the two sets of second wedge rods (47) are respectively located on the right sides of the two sets of rack plates (410), the control cylinder (21) is retracted, the cylinder (21) drives the detection head (26) to rise, the magnetic block (27) pulls the moving frame (45), the moving frame (45) drives the left set of second wedge rods (47) to move into the abutment groove (413), the right set of second wedge rods (47) push the second wedge groove (412), and the right set of rack plates (41 0) disengages from the gear (33), a right-side set of second wedge rods (47) moves into the abutment groove (413), the two sets of second wedge rods (47) push the two sets of rack plates (410) and the moving block (49), the left-side set of rack plates (410) drives the gear (33) to rotate clockwise, the placement table (32) rotates clockwise, the placement table (32) tilts to the right, and the qualified circuit board on the placement table (32) is moved out from the right side of the inspection table (1) via the placement table (32) and the unloading chute (11); S4. If the circuit board is broken, the detection head (26) loses the support of the circuit board and pushes the bottom plate (36). The bottom plate (36) drives the first wedge block (37) to push the first wedge groove (310) downward. The first wedge rod (39) extends forward in the placement table (32). The first wedge rod (39) drives the third wedge rod (48). The third wedge rod (48) drives the movable frame (45) to move to the left outside the guide rod (41). The two sets of second wedge rods (47) are separated. The two groups of moving blocks (49) move to the left, the upper end of the second wedge rod (47) of the left group fits with the second wedge groove (412) on the left, the upper end of the second wedge rod (47) of the right group separates from the second wedge groove (412) on the right, and aligns with the abutment groove (413) on the right side, the cylinder (21) is controlled to shrink, the cylinder (21) drives the detection head (26) to rise from the top surface of the placement table (32), and the detection head (26) pulls the moving frame (45) upward, The movable frame (45) rises, driving the second wedge rod (47) on the left side to push the second wedge groove (412), and the rack plate (410) on the left side is released from the meshing with the gear (33). The left and right second wedge rods (47) are both moved into the abutment groove (413), and the rack plate (410) on the right side is kept meshing with the gear (33). The magnetic block (27) pulls the movable frame (45) upward, and the two sets of second wedge rods (47) push the two sets of rack plates (410) and The moving block (49) is raised in the fixed frame (43) to compress the sixth spring (44), and the right set of rack plates (410) drives the gear (33) to rotate counterclockwise when moving, and the gear (33) drives the placement table (32) to rotate counterclockwise, so that the placement table (32) tilts to the left on the guide table (31), and the circuit board fragments on the placement table (32) are moved out from the left side of the inspection table (1) through the placement table (32) and the discharge chute (11); S5. The first wedge rod (39) and the bottom plate (36) are reset under the elastic action of the fourth spring (311) and the third spring (38), the cylinder (21) drives the moving block (49) to rise, the moving block (49) moves to the upper end of the fixed frame (43), and cannot move further, the magnetic attraction between the magnetic block (27) and the moving frame (45) is released, and the moving frame (45) is reset downward under the elastic action of the sixth spring (44), and the moving frame (45) and the two sets of second wedge rods (47) are reset under the elastic action of the seventh spring (411), and the left set of second wedge rods (47) are kept aligned with the abutment groove (413) in the left set of rack plates (410), and the right set of second wedge rods (47) are kept in a state of being in contact with the second wedge groove (412) of the right set of rack plates (410).

Images