Disassembling device for electronic waste

Abstract

The embodiment of the invention provides an electronic waste disassembling device, and relates to the technical field of electronic waste disassembling. The electronic waste disassembling device comprises a top frame, the bottom of the top frame is fixedly connected with a bottom frame, and a base material plate discharging area is formed in one side of an inner cavity of the bottom frame; the other side of the inner cavity of the bottom frame is provided with an electronic element discharging area, and the side, close to the base material plate discharging area and the electronic element discharging area, of the bottom frame is provided with a base material plate receiving box and an electronic element receiving box correspondingly. Adjusting assemblies are arranged on the two sides of an inner cavity of the top frame, each adjusting assembly comprises a servo motor fixed to one side of the top frame, disassembling assemblies are arranged on the inner sides of the adjusting assemblies, and a smashing assembly is arranged in the position, close to the base material plate discharging area, of the inner cavity of the bottom frame. According to the principle of making the best use of materials, electronic elements on the waste circuit board are disassembled from the circuit board in a hot melting mode, and the disassembled circuit board base material board and the electronic elements are subjected to partition treatment.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic waste disassembly, and in particular relates to a device for disassembling electronic waste. Background Art

[0002] Electronic waste, commonly known as "e-waste", refers to electrical or electronic equipment that has been discarded and is no longer in use. It mainly includes obsolete electronic technology products such as refrigerators, air conditioners, washing machines, televisions, and communication electronic products such as computers. Electronic waste needs to be handled with caution, and the environmental pollution caused threatens the health of local residents.

[0003] In the prior art (the announcement number is CN207171143U, and the patent name is a patent application for a device for dismantling electronic waste), the electronic components on the waste circuit boards can be quickly and efficiently dismantled. During the dismantling process, the electronic components are less damaged, the dismantling cost is low, and the pollutant emissions are small. In the process of implementing this technical solution, it is found that there are at least the following problems in the prior art.

[0004] Circuit boards are present in many electronic products. For the sake of environmental protection and energy conservation, electronic waste such as circuit boards needs to be disassembled and processed. Most of them are disassembled and crushed directly or indirectly by humans. The electronic components on the waste circuit boards cannot be disassembled from the circuit boards by hot melting according to the principle of making the best use of things, and the disassembled circuit board substrates and electronic components cannot be partitioned for processing. Summary of the invention

[0005] The present application aims to solve at least one of the technical problems in the prior art that the electronic components on the discarded circuit boards cannot be hot-melted and disassembled from the circuit boards according to the principle of making the best use of materials, and the disassembled circuit board substrates and electronic components cannot be processed in different areas. To this end, the present application proposes a disassembly device for electronic waste.

[0006] To achieve the above purpose, the specific technical solutions of the present invention are as follows: An electronic waste disassembly device comprises a top frame, the bottom of which is fixedly connected to a bottom frame, and a substrate board unloading area is provided on one side of an inner cavity of the bottom frame; An electronic component unloading area is provided on the other side of the inner cavity of the base frame, and a base plate receiving box and an electronic component receiving box are respectively provided on one side of the base frame close to the base plate unloading area and the electronic component unloading area; Adjustment components are arranged on both sides of the inner cavity of the top frame, and the adjustment component includes a servo motor fixed on one side of the top frame. A disassembly component is arranged on the inner side of the adjustment component, and the disassembly component includes a heater fixed in the inner cavity of the top frame. A crushing component is arranged in the inner cavity of the bottom frame near the substrate plate unloading area.

[0007] Preferably: the adjustment assembly also includes a rotating rod fixed on the output shaft of the servo motor and rotatably matched with the top frame, and both sides of the rotating rod are fixedly connected to the main bevel gear, the top frame is rotatably connected to an electric push rod on one side close to the main bevel gear, and the piston rod of the electric push rod is fixedly connected to a slave bevel gear used in conjunction with the main bevel gear, and the other side of the electric push rod is fixedly connected to a screw rod rotatably matched with the top frame.

[0008] Preferably: the disassembly assembly also includes a screw sleeve threadedly connected to the screw, and the inner side of the screw sleeve is fixedly connected to a connecting seat, the inner side of the connecting seat is fixedly connected to a flip motor, and the output shaft of the flip motor is fixedly connected to a disassembly material rack, and the inner cavity of the disassembly material rack is provided with a leakage groove used in conjunction with a heater.

[0009] Preferably: the crushing assembly includes a main synchronous wheel fixed to the rotating rod near the outer side of the main bevel gear, and the other side of the main synchronous wheel is connected to a double-row wheel through a synchronous belt transmission, the inner cavity of the double-row wheel is embedded with a first electric telescopic rod that rotates with the base frame, and the piston rod of the first electric telescopic rod is fixedly connected to the first main circular gear, both sides of the inner cavity of the base frame are rotatably connected with the first slave circular gear used in conjunction with the first main circular gear, and the inner cavity of the first slave circular gear is fixedly connected to a crushing roller used for crushing substrate plates in the substrate plate unloading area.

[0010] Preferably: T-shaped slide rails are transversely opened on both sides of the inner cavity of the top frame, and the inner cavity of the T-shaped slide rail is slidably connected to a T-shaped slide fixedly matched with the screw sleeve.

[0011] Preferably, scraper plates used in conjunction with the disassembly rack are fixed in an array on both upper and lower sides of the center of the inner cavity of the top frame, and an arc chamfer is provided on one side of the scraper plate close to the disassembly rack.

[0012] Preferably, the disassembling material racks are distributed symmetrically in an array along the central axis of the top frame, and step grooves are provided at the edges of the disassembling material racks close to the material leakage grooves.

[0013] Preferably, both sides of the bottom frame close to the substrate unloading area are fixedly connected with crushing frames, and the inner array of the crushing frames is provided with crushing grooves used in conjunction with crushing rollers.

[0014] Preferably, a material guide frame cooperating with the material guide of the substrate plate receiving box and the electronic component receiving box is fixedly connected to the inner side of the bottom of the substrate plate unloading area and the electronic component unloading area.

[0015] Preferably, an inspection port with a blocking cover is provided on one side of the top of the top frame, and a loading port with a loading cover is provided on the other side of the top of the top frame.

[0016] The electronic waste disassembly device of the present invention has the following advantages: 1. The electronic waste disassembly device first provides a unified driving source by a servo motor, and the rotating rod drives two sets of main bevel gears to rotate synchronously. At the same time, two electric push rods adjust the meshing stroke between the two sets of slave bevel gears and the two sets of main bevel gears to the right position, and then the two sets of main bevel gears on the rotating rod successively drive the screws on the two sets of slave bevel gears to rotate, so as to provide displacement adjustment for the subsequent hot-melt disassembly of the waste circuit boards, and facilitate the partition disassembly of the circuit boards and electronic components on the waste circuit boards.

[0017] 2. The electronic waste dismantling device, then, is driven by two screws to rotate two sets of screw sleeves, and the two sets of screw sleeves drive the dismantling racks on the two sets of flip motors to move accordingly through the two sets of connecting seats, and the dismantling racks drive several sets of waste circuit boards to the heater area, and the heater performs heat melting to remove the soldering feet of the electronic components on the several sets of waste circuit boards. After the soldering feet are heat-melted off, the electronic components fall from the leakage trough into the electronic component unloading area. Similarly, the several sets of waste circuit board substrate boards left on the dismantling racks are transferred to the substrate board unloading area, and are driven by two sets of flip motors to flip and unload the several sets of waste circuit board substrate boards on the dismantling racks to the substrate board unloading area.

[0018] 3. The electronic waste dismantling device, then, the two sets of main synchronous wheels on the rotating rod drive the two sets of double-row wheels and the two first electric telescopic rods to rotate synchronously through the two synchronous belts, and the two first electric telescopic rods adjust the meshing stroke between the two sets of first main circular gears and the first slave circular gears to the right position, and then the two sets of main synchronous wheels and the double-row wheels on the rotating rod drive the two sets of first main circular gears and the first slave circular gears to rotate successively after being in place through the two first electric telescopic rods, and the two sets of first slave circular gears drive the two sets of crushing rollers to rotate in the substrate plate unloading area, and crush the substrate plates that fall into the substrate plate unloading area, which is conducive to the subsequent recycling of the substrate plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of the structure of an electronic waste disassembly device of the present invention; Figure 2 This is a rear view of the structure of an electronic waste disassembly device of the present invention; Figure 3 This is a cross-sectional view of the structure of an electronic waste disassembly device of the present invention; Figure 4 This is an internal view of the structure of an electronic waste disassembly device of the present invention; Figure 5 It is a top view of the initial state of the top frame, adjustment assembly and disassembly assembly structure of the present invention; Figure 6 It is a top view of the first-level working state of the adjustment component and disassembly component structure of the present invention; Figure 7 It is a top view of the adjustment component and disassembly component structure of the present invention in the secondary working state; Figure 8 It is a partial bottom-up cross-sectional view of the top frame, heater and scraper plate structure of the present invention; Fig. 9 It is a side cross-sectional view of the initial state of the base frame, adjustment assembly, crushing assembly and cleaning assembly structure of the present invention; Fig.10 It is a side view of the initial state of the adjustment component, crushing component and cleaning component structure of the present invention; Fig.11 It is a side view of the initial state of the adjustment component and the crushing component structure of the present invention; Fig.12 It is a side view of the working state of the adjustment component and the crushing component structure of the present invention; Fig.13 It is a partial side exploded view of the crushing assembly structure of the present invention; Fig.14 It is a side view of the initial state of the adjustment component and the cleaning component structure of the present invention; Fig.15 It is a side view of the working state of the adjustment component and the cleaning component structure of the present invention; Fig.16 It is a partial side exploded view of the cleaning assembly structure of the present invention; Fig.17 It is a partial side cross-sectional view of the chassis structure of the present invention.

[0021] Explanation of the markings in the figure: 1. Top frame; 2. Bottom frame; 3. Unloading area for substrate board; 4. Unloading area for electronic components; 5. Receiving box for substrate board; 6. Receiving box for electronic components; 71. Servo motor; 72. Rotating rod; 73. Main bevel gear; 74. Electric push rod; 75. Slave bevel gear; 76. Screw; 81. Screw sleeve; 82. Connecting seat; 83. Flipping motor; 84. Disassembling rack; 85. Leakage trough; 86. Heater; 91. Main synchronous wheel; 92, double-row wheels; 93, first electric telescopic rod; 94, first main circular gear; 95, first slave circular gear; 96, crushing roller; 101, slave synchronous wheel; 102, second electric telescopic rod; 103, second main circular gear; 104, second slave circular gear; 105, cleaning roller; 106, cleaning frame; 11, T-type slide rail; 12, T-type slide frame; 13, scraper plate; 14, crushing frame; 15, guide frame. DETAILED DESCRIPTION

[0022] The present invention is specifically described below in conjunction with the accompanying drawings and specific embodiments: like Figure 1-Figure 17 As shown, an electronic waste disassembly device of the present invention comprises a top frame 1, a bottom frame 2 is fixedly connected to the bottom of the top frame 1, and a substrate board unloading area 3 is opened on one side of the inner cavity of the bottom frame 2, an inspection port with a blocking cover is opened on one side of the top of the top frame 1, which is convenient for inspecting the internal components of the top frame 1, and a loading port with a loading cover is opened on the other side of the top of the top frame 1, which is convenient for loading the waste circuit boards; An electronic component unloading area 4 is provided on the other side of the inner cavity of the base frame 2, and a substrate board receiving box 5 and an electronic component receiving box 6 are respectively provided on one side of the base frame 2 close to the substrate board unloading area 3 and the electronic component unloading area 4. A material guide rack 15 cooperating with the substrate board receiving box 5 and the electronic component receiving box 6 is fixedly connected to the inner side of the base frame 2 close to the bottom of the substrate board unloading area 3 and the electronic component unloading area 4, so as to facilitate the partitioning of the substrate board and the electronic components for temporary storage; Adjustment components are provided on both sides of the inner cavity of the top frame 1, and the adjustment component includes a servo motor 71 fixed on one side of the top frame 1. A disassembly component is provided on the inner side of the adjustment component, and the disassembly component includes a heater 86 fixed in the inner cavity of the top frame 1. Several groups of discarded circuit boards and electronic components are disassembled and removed in sections. A crushing component is provided in the inner cavity of the bottom frame 2 near the substrate board unloading area 3 to crush the substrate boards that fall into the substrate board unloading area 3, which is beneficial for the subsequent recycling of the substrate boards.

[0023] like Figure 5-Figure 13The servo motor 71 is provided with a unified driving source, and the two sets of main bevel gears 73 are driven by the rotating rod 72 to rotate synchronously. The side of the top frame 1 close to the main bevel gear 73 is rotatably connected to an electric push rod 74, and the piston rod of the electric push rod 74 is fixedly connected to a slave bevel gear 75 used in conjunction with the main bevel gear 73. The meshing stroke between the two sets of slave bevel gears 75 and the two sets of main bevel gears 73 is adjusted to the right by the two electric push rods 74. The other side of the electric push rod 74 is fixedly connected to a screw rod 76 that is rotatably matched with the top frame 1. The two sets of main bevel gears 73 on the rotating rod 72 successively drive the screw rods 76 on the two sets of slave bevel gears 75 to rotate accordingly, thereby providing displacement adjustment for the subsequent hot melt disassembly of the discarded circuit boards, and facilitating the partition disassembly of the circuit boards and electronic components on the discarded circuit boards. The disassembly assembly also includes a screw sleeve 81 threadedly connected to the screw 76, and the two screws 76 drive the two sets of screw sleeves 81 to rotate, and the inner side of the screw sleeve 81 is fixedly connected to a connection seat 82, and the inner side of the connection seat 82 is fixedly connected to a flip motor 83, and the output shaft of the flip motor 83 is fixedly connected to a disassembly rack 84. The two sets of screw sleeves 81 drive the disassembly racks 84 on the two sets of flip motors 83 to move accordingly through the two sets of connection seats 82, and the inner cavity of the disassembly rack 84 is provided with a leakage groove 85 used in conjunction with the heater 86 , the disassembling rack 84 drives several groups of waste circuit boards to the heater 86 area, and the heater 86 heats up and melts off the solder pins of the electronic components on the several groups of waste circuit boards, and then the electronic components after the solder pins are heat-melted fall from the leakage trough 85 into the electronic component unloading area 4. Similarly, several groups of waste circuit board substrates left on the disassembling rack 84 are transferred to the substrate unloading area 3 area, and two groups of flipping motors 83 drive several groups of waste circuit board substrates on the disassembling rack 84 to flip and unload to the substrate unloading area 3 area; T-shaped slide rails 11 are horizontally provided on both sides of the inner cavity of the top frame 1, and the inner cavity of the T-shaped slide rails 11 is slidably connected with a T-shaped slide rail 12 fixedly matched with the screw sleeve 81, which plays a role of sliding limit for the screw sleeve 81, thereby improving the displacement stability of the screw sleeve 81 to prevent the screw sleeve 81 and the components on the connecting seat 82 from shaking. Scraper plates 13 used in conjunction with the disassembly rack 84 are fixed in an array on the upper and lower sides of the center of the inner cavity of the top frame 1, and an arc chamfer is provided on the side of the scraper plate 13 close to the disassembly rack 84 to scrape off the residual electronic components on the discarded circuit board after passing through the scraper plate 13 and heat-melting treatment by the heater 86. The disassembly rack 84 is distributed in an array-like symmetrical state along the central axis of the top frame 1, and a step groove is provided on the edge of the disassembly rack 84 close to the leakage groove 85 to temporarily place the substrate board of the discarded circuit board.

[0024] The crushing assembly includes a main synchronous wheel 91 fixed to the rotating rod 72 near the outer side of the main bevel gear 73, and the other side of the main synchronous wheel 91 is connected to a double-row wheel 92 through a synchronous belt transmission, and the inner cavity of the double-row wheel 92 is embedded with a first electric telescopic rod 93 that rotates with the bottom frame 2. The two sets of main synchronous wheels 91 on the rotating rod 72 drive the two sets of double-row wheels 92 and the two first electric telescopic rods 93 to rotate synchronously through two synchronous belts, and the piston rod of the first electric telescopic rod 93 is fixedly connected to the first main circular gear 94, and the two sides of the inner cavity of the bottom frame 2 are rotatably connected to the first slave circular gear 95 used in conjunction with the first main circular gear 94. The two first electric telescopic rods The meshing stroke between the two sets of first main circular gears 94 and the first slave circular gears 95 is adjusted to the right position, and the inner cavity of the first slave circular gear 95 is fixedly connected with a crushing roller 96 for crushing the substrate plate in the substrate plate unloading area 3. Then, the two sets of main synchronous wheels 91 and the double-row wheels 92 on the rotating rod 72 drive the two sets of first main circular gears 94 and the first slave circular gears 95 to rotate successively after being in place through the two first electric telescopic rods 93. The two sets of first slave circular gears 95 drive the two sets of crushing rollers 96 to rotate in the substrate plate unloading area 3, and crush the substrate plate that falls into the substrate plate unloading area 3, which is conducive to the subsequent recycling of the substrate plate. The bottom frame 2 is fixedly connected to a crushing frame 14 on both sides close to the substrate plate unloading area 3, and the inner array of the crushing frame 14 is provided with a crushing groove used in conjunction with a crushing roller 96 to perform auxiliary crushing processing on the substrate plate that falls into the substrate plate unloading area 3, thereby improving the comprehensiveness of the crushing of the substrate plate in the substrate plate unloading area 3 to avoid missing corners in the crushing.

[0025] like Figure 14-16As shown, after the substrate boards and electronic components on the discarded circuit boards are thermally stripped and disassembled, not only the substrate boards of the discarded circuit boards need to be crushed and recycled, but also the electronic components after thermal stripping need to be cleaned and processed, and the disassembled electronic components need to be manually cleaned, which is not conducive to the rapid recycling of the thermally stripped and disassembled electronic components, and is relatively troublesome and labor-intensive. A cleaning component is provided in the inner cavity of the chassis 2 near the electronic component unloading area 4, and the cleaning component includes a slave synchronous wheel 101 driven by two synchronous belts on the other side of the two sets of double-row wheels 92, and the inner cavity of the slave synchronous wheel 101 is embedded with a second electric telescopic rod 102 that rotates with the chassis 2, and the piston rod of the second electric telescopic rod 102 is fixedly connected to a second main circular gear 103, and both sides of the inner cavity of the chassis 2 are rotatably connected to a second slave circular gear 104 used in conjunction with the second main circular gear 103, and the two sets of double-row wheels 92 are driven by two synchronous belts. While the belt drives the two groups of slave synchronous wheels 101 and the second electric telescopic rod 102 to rotate successively, the two second electric telescopic rods 102 adjust the meshing stroke between the two groups of second main circular gears 103 and the second slave circular gears 104 to the right position; and the inner cavity of the second slave circular gear 104 is fixedly connected with a cleaning roller 105 for cleaning the electronic components in the electronic component unloading area 4, and both sides of the bottom frame 2 close to the electronic component unloading area 4 are fixedly connected with a cleaning frame 106 used in conjunction with the cleaning roller 105. The two second electric telescopic rods 102 drive the two groups of second main circular gears 103 and the second slave circular gears 104 that are meshed in place to rotate successively, and the two groups of second slave circular gears 104 drive the two cleaning rollers 105 to clean the electronic components that have fallen off due to heat in the electronic component unloading area 4, thereby improving the cleanliness of the electronic components, replacing the manual cleaning operation, and facilitating the subsequent rapid recycling of the electronic components.

[0026] The working principle of a dismantling device for electronic waste is as follows: first, several groups of waste circuit boards to be disassembled are placed on a dismantling material rack 84 from a loading port, with the soldering feet of the electronic components of the several groups of waste circuit boards facing upwards, and then the loading cover is closed, and two electric push rods 74 are controlled to open and drive two groups of slave bevel gears 75 to reach the meshing parts of two groups of main bevel gears 73, and then the servo motor 71 is controlled to open and drive the two groups of main bevel gears 73 on the rotating rod 72 to rotate, and the two groups of main bevel gears 73 drive the screw rods 76 on the two electric push rods 74 to rotate accordingly through the two groups of slave bevel gears 75 meshed in place, and under the sliding limit cooperation of the two groups of T-type slide rails 11 and the T-type slide 12 on the two groups of screw rod sleeves 81, the two screw rods 76 drive the two groups of screw rod sleeves 8 1 moves toward the heater 86, and the two sets of screw rod sleeves 81 drive the disassembly rack 84 on the two sets of flip motors 83 to move toward the heater 86 through the two sets of connecting seats 82, until the several sets of discarded circuit boards on the disassembly rack 84 arrive directly below the heater 86, and then the servo motor 71 is paused, and the heater 86 is controlled to start in advance and the solder legs of the several sets of discarded circuit boards in place are subjected to heat melting treatment. Under the action of the self-weight of the electronic components, the electronic components on the several sets of discarded circuit boards after thermal stripping and disassembly fall from the leakage groove 85 on the disassembly rack 84 to the electronic component unloading area 4, and the substrate boards on the several sets of discarded circuit boards after thermal stripping and disassembly of the electronic components are still temporarily placed on the step groove along the edge of the disassembly rack 84; After the electronic components on several groups of discarded circuit boards are thermally stripped from the disassembly rack 84 and fall into the electronic component unloading area 4, the servo motor 71 is continuously controlled to be turned on. Similarly, the two groups of screw sleeves 81 drive the disassembly rack 84 on the two groups of flip motors 83 to move away from the heater 86 through the two groups of connecting seats 82. When the solder legs of the residual electronic components on several groups of discarded circuit boards on the disassembly rack 84 pass through the scraper plate 13, and are scraped by the scraper plate 13, the residual electronic components on several groups of discarded circuit boards are forced to fall into the electronic component unloading area 4. After the electronic components are completely thermally stripped and the substrate boards of several groups of discarded circuit boards temporarily placed on the disassembly rack 84 are continuously transferred to the top of the substrate board unloading area 3, the servo motor 71 is first controlled to pause. , and control the two groups of flip motors 83 to drive the substrate boards of several groups of discarded circuit boards on the disassembly rack 84 to flip and fall into the substrate board unloading area 3, and then control the servo motor 71 to start again, otherwise, the two groups of flip motors 83 drive the disassembly rack 84 to flip and reset, and re-transfer the empty disassembly rack 84 to the loading port to wait for the next batch of discarded circuit boards to be loaded, and so on, until the substrate boards and electronic components on the large batch of discarded circuit boards are partitioned and disassembled, first control the servo motor 71 to pause, and then control the two electric push rods 74 to close and drive the two groups of slave bevel gears 75 to disengage the meshing parts of the two groups of main bevel gears 73 to the initial position, waiting for the subsequent processing of the substrate boards and electronic components after thermal stripping and disassembly; When the number of substrate plates in the substrate plate unloading area 3 and the number of electronic components in the electronic component unloading area 4 meet the processing requirements, the two first electric telescopic rods 93 are first controlled to open and drive the first main circular gear 94 to synchronously move inward to reach the meshing portion of the two groups of first slave circular gears 95, and then the servo motor 71 is controlled to continue to open and drive the two groups of double-row wheels 92 to rotate synchronously through the two groups of main synchronous wheels 91 on the rotating rod 72, and the two groups of double-row wheels 92 drive the first main circular gears 94 on the two first electric telescopic rods 93 to rotate accordingly, and the two groups of first main circular gears 94 drive the crushing rollers 96 on the two groups of first slave circular gears 95 to rotate in the substrate plate unloading area 3, and under the auxiliary crushing cooperation of the two groups of crushing racks 14, the two groups of crushing rollers 96 in the rotating state crush the substrate plates that fall into the substrate plate unloading area 3, and then under the cooperation of the guide rack 15, the crushed substrate plate particles are guided to the substrate plate receiving box 5 for temporary storage; At the same time, the two second electric telescopic rods 102 are controlled to open and drive the two sets of second main circular gears 103 to move inward synchronously to the meshing portion of the two sets of second slave circular gears 104. Similarly, the two sets of main synchronous wheels 91 on the rotating rod 72 drive the two sets of double-row wheels 92 to rotate synchronously, and the two sets of double-row wheels 92 also drive the two sets of slave synchronous wheels 101 to rotate accordingly. The two sets of slave synchronous wheels 101 drive the two sets of second main circular gears 103 to rotate through the two second electric telescopic rods 102, and the two sets of second main circular gears 103 drive the two sets of second slave circular gears 104 that are meshed in place to rotate accordingly. With the rotation of the two sets of second circular gears 104, the two sets of cleaning rollers 105 rotate in the electronic component unloading area 4, and with the auxiliary cleaning cooperation of the two sets of cleaning racks 106, the two sets of cleaning rollers 105 in a rotating state clean the electronic components that fall into the electronic component unloading area 4, and with the cooperation of the guiding of the guiding rack 15, the electronic components after cleaning in the electronic component unloading area 4 are guided to the electronic component receiving box 6 for temporary storage. After the materials are full, the substrate board particles temporarily stored in the substrate board receiving box 5 and the electronic components temporarily stored in the electronic component receiving box 6 are taken out respectively.

[0027] It should be noted that the specific models and specifications of the servo motor 71, the electric push rod 74, the heater 86 and the electric telescopic rod need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be repeated in detail.

[0028] The power supply circuits of the servo motor 71, the electric push rod 74, the heater 86 and the electric telescopic rod are clear to those skilled in the art and will not be described in detail herein.

[0029] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. An electronic waste disassembly device, comprising a top frame (1), characterized in that: The bottom of the top frame (1) is fixedly connected to the bottom frame (2), and a substrate sheet unloading area (3) is provided on one side of the inner cavity of the bottom frame (2); An electronic component unloading area (4) is provided on the other side of the inner cavity of the base frame (2), and a base plate receiving box (5) and an electronic component receiving box (6) are respectively provided on one side of the base frame (2) close to the base plate unloading area (3) and the electronic component unloading area (4); Adjustment components are provided on both sides of the inner cavity of the top frame (1), and the adjustment component includes a servo motor (71) fixed to one side of the top frame (1); a disassembly component is provided on the inner side of the adjustment component, and the disassembly component includes a heater (86) fixed to the inner cavity of the top frame (1); and a crushing component is provided in the inner cavity of the bottom frame (2) close to the substrate plate unloading area (3).

2. The electronic waste dismantling device according to claim 1, characterized in that: The adjustment assembly further comprises a rotating rod (72) fixed on the output shaft of the servo motor (71) and rotatably matched with the top frame (1), and both sides of the rotating rod (72) are fixedly connected to main bevel gears (73), and a side of the top frame (1) close to the main bevel gear (73) is rotatably connected to an electric push rod (74), and a piston rod of the electric push rod (74) is fixedly connected to a slave bevel gear (75) used in conjunction with the main bevel gear (73), and the other side of the electric push rod (74) is fixedly connected to a screw rod (76) rotatably matched with the top frame (1).

3. The electronic waste dismantling device according to claim 2, characterized in that: The disassembly assembly further comprises a screw sleeve (81) threadedly connected to the screw (76), and a connecting seat (82) is fixedly connected to the inner side of the screw sleeve (81), a flip motor (83) is fixedly connected to the inner side of the connecting seat (82), and an output shaft of the flip motor (83) is fixedly connected to a disassembly rack (84), and an inner cavity of the disassembly rack (84) is provided with a material leakage groove (85) used in conjunction with the heater (86).

4. The electronic waste dismantling device according to claim 3, characterized in that: The crushing assembly comprises a main synchronous wheel (91) fixed to the rotating rod (72) near the outer side of the main bevel gear (73), and the other side of the main synchronous wheel (91) is connected to a double-row wheel (92) through a synchronous belt transmission, the inner cavity of the double-row wheel (92) is embedded with a first electric telescopic rod (93) that is rotatably matched with the base frame (2), and the piston rod of the first electric telescopic rod (93) is fixedly connected to a first main circular gear (94), both sides of the inner cavity of the base frame (2) are rotatably connected to a first slave circular gear (95) used in conjunction with the first main circular gear (94), and the inner cavity of the first slave circular gear (95) is fixedly connected to a crushing roller (96) used for crushing the substrate plate in the substrate plate unloading area (3).

5. The electronic waste dismantling device according to claim 4, characterized in that: T-shaped slide rails (11) are transversely provided on both sides of the inner cavity of the top frame (1), and the inner cavity of the T-shaped slide rail (11) is slidably connected to a T-shaped slide bracket (12) fixedly matched with the screw sleeve (81).

6. The electronic waste dismantling device according to claim 5, characterized in that: Scraper plates (13) used in conjunction with the disassembling material rack (84) are fixed in an array on both upper and lower sides of the center of the inner cavity of the top frame (1), and an arc chamfer is provided on one side of the scraper plate (13) close to the disassembling material rack (84).

7. The electronic waste dismantling device according to claim 6, characterized in that: The disassembling material racks (84) are distributed symmetrically in an array along the central axis of the top frame (1), and a step groove is provided at the edge of the disassembling material rack (84) close to the material leakage groove (85).

8. The electronic waste dismantling device according to claim 7, characterized in that: The bottom frame (2) is fixedly connected to a crushing frame (14) on both sides close to the substrate plate unloading area (3), and a crushing groove for use with a crushing roller (96) is provided in an array on the inner side of the crushing frame (14).

9. The electronic waste dismantling device according to claim 8, characterized in that: A material guide frame (15) is fixedly connected to the inner side of the bottom frame (2) near the bottom of the substrate board unloading area (3) and the electronic component unloading area (4) and cooperates with the substrate board receiving box (5) and the electronic component receiving box (6) to guide materials.

10. The electronic waste dismantling device according to claim 9, characterized in that: A maintenance opening with a blocking cover is provided on one side of the top of the top frame (1), and a loading opening with a loading cover is provided on the other side of the top of the top frame (1).

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