Solid state disk packaging bonding pad control method and device

Abstract

The invention relates to the technical field of packaging process control, and discloses a solid state disk packaging bonding pad control method and device.According to the method, packaging design information and an execution scheme are obtained, machine vision is used for detecting the appearance of a hard disk in real time, visual detection features are extracted, and the current packaging step and execution information are determined in combination with the packaging design information; a detection scheme is analyzed based on performance information of a physical contact type detection device on scraper equipment, the detection device is driven to conduct physical contact detection on the hard disk, contact detection characteristics are obtained, state characteristics of the hard disk are fed back, analyzed and adjusted according to the contact detection characteristics, and soldering paste coating is accurately controlled. According to the method, through combination of visual detection and physical contact detection, the packaging process can be accurately monitored and adjusted, the uniformity and consistency of soldering paste coating are improved, and the problem that in the prior art, real-time and accurate feedback is difficult to conduct on soldering paste coating and other process steps is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging process control, and in particular to a solid state hard disk packaging pad control method and device. Background Art

[0002] With the continuous development of electronic devices and integrated circuit technology, solid-state drives (SSDs), as one of the core components of modern storage devices, are widely used in personal computers, data centers, servers, embedded systems, etc. due to their high-speed read and write performance, low power consumption, and longer service life. The packaging process of solid-state drives is a crucial link in their production, especially in pad control and welding technology. The welding quality directly affects the performance, stability and reliability of solid-state drives.

[0003] The packaging design and execution of SSDs usually include multiple steps, such as solder paste coating, pad alignment, heating and curing, etc. Each step needs to be precisely controlled to ensure the quality of the final product. In this process, solder paste coating is one of the key steps. It is necessary to ensure that the solder paste is evenly coated and can fully cover the pads to ensure the reliability of welding. However, since the packaging of SSDs involves multiple details and complex process steps, traditional manual monitoring and control methods have many problems, such as: Uneven solder paste coating: inconsistent solder paste thickness or excessive solder paste in some areas can easily lead to poor welding or short circuits; Visual monitoring error: Visual inspection based on manual inspection has large errors and it is difficult to ensure accuracy; Inconsistent packaging steps: There may be certain design differences between different batches of SSDs, and traditional control methods are difficult to quickly adapt and adjust.

[0004] In the prior art, machine vision technology is usually used to perform various steps of inspection on solid-state drives. However, machine vision technology lacks accurate feedback on the real-time status of solder paste coating and other process steps, and cannot detect and correct process problems in a timely manner. Summary of the invention

[0005] The purpose of the present invention is to provide a solid state drive package pad control method and device, aiming to solve the problem in the prior art that it is difficult to provide real-time and accurate feedback on solder paste coating and other process steps.

[0006] The present invention is implemented in this way. In a first aspect, the present invention provides a solid state hard disk package pad control method, comprising: Obtain the packaging design information and packaging implementation plan of the solid-state drive; Performing real-time inspection of the appearance of the solid-state hard disk by machine vision technology to obtain visual inspection features of the solid-state hard disk; Performing information analysis of the packaging execution steps on the visual inspection features according to the packaging design information and the packaging execution scheme of the solid state drive, so as to obtain the packaging execution steps of the solid state drive at the current moment and the step execution information of the packaging execution steps; Performing a detection scheme analysis on the packaging execution steps and step execution information of the solid state drive at the current moment according to the performance information of the physical contact detection device provided on the scraper device, so as to obtain a detection scheme of the physical contact detection device; According to the detection scheme, the physical contact detection device is driven to perform physical contact detection on the solid state hard disk to obtain a contact detection feature of the solid state hard disk corresponding to the detection scheme; The contact detection feature is subjected to state feedback analysis of the solid state hard disk to obtain a state feature of the solid state hard disk corresponding to the contact detection feature, and the scraper device is synchronously driven according to the state feature of the solid state hard disk to control the coating of the solder paste of the solid state hard disk.

[0007] In a second aspect, the present invention provides a solid state drive package pad control device, which is used to implement a solid state drive package pad control method according to any one of the first aspects, including: An information acquisition module, used to acquire the packaging design information and packaging execution plan of the solid state drive; A visual inspection module, used to perform real-time inspection of the appearance of the solid-state hard disk by machine vision technology to obtain visual inspection features of the solid-state hard disk; An information analysis module, configured to perform information analysis of a packaging execution step on the visual inspection feature according to the packaging design information and the packaging execution scheme of the solid state drive, so as to obtain the packaging execution step of the solid state drive at a current moment and step execution information of the packaging execution step; A scheme analysis module, used for performing a detection scheme analysis on the packaging execution steps and step execution information of the solid state hard disk at the current moment according to the performance information of the physical contact detection device arranged on the scraper device, so as to obtain a detection scheme of the physical contact detection device; A contact detection module, configured to drive the physical contact detection device to perform physical contact detection on the solid state drive according to the detection scheme, so as to obtain a contact detection feature of the solid state drive corresponding to the detection scheme; The coating control module is used to perform state feedback analysis of the solid-state hard disk on the contact detection feature to obtain the solid-state hard disk state feature corresponding to the contact detection feature, and synchronously drive the scraper device to control the coating of the solder paste of the solid-state hard disk according to the solid-state hard disk state feature.

[0008] The present invention provides a solid state hard disk package pad control method, which has the following beneficial effects: The present invention obtains packaging design information and an execution plan, uses machine vision to perform real-time detection of the hard disk appearance, extracts visual detection features, determines the current packaging step and execution information in combination with the packaging design information, analyzes the detection plan based on the performance information of the physical contact detection device on the scraper equipment, and drives the detection device to perform physical contact detection on the hard disk to obtain contact detection features, and adjusts the state features of the hard disk according to the feedback analysis of the contact detection features to accurately control solder paste coating. The method can accurately monitor and adjust the packaging process through the combination of vision and physical contact detection, improve the uniformity and consistency of solder paste coating, and solves the problem in the prior art that it is difficult to provide real-time and accurate feedback on solder paste coating and other process steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the steps of a solid state hard disk package pad control method provided by an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a solid state hard disk package pad control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0011] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0012] Reference Figure 1 , Figure 2 As shown, a preferred embodiment of the present invention is provided.

[0013] In a first aspect, the present invention provides a solid state drive package pad control method, comprising: S1: Obtaining the packaging design information and packaging implementation plan of the solid state drive; S2: Performing real-time inspection of the appearance of the solid state drive by machine vision technology to obtain visual inspection features of the solid state drive; S3: performing information analysis of the packaging execution steps of the visual inspection features according to the packaging design information and the packaging execution scheme of the solid state drive, so as to obtain the packaging execution steps of the solid state drive at the current moment and the step execution information of the packaging execution steps; S4: performing a detection scheme analysis on the packaging execution steps and step execution information of the solid state drive at the current moment according to the performance information of the physical contact detection device provided on the scraper device, so as to obtain a detection scheme of the physical contact detection device; S5: driving the physical contact detection device to perform physical contact detection on the solid state drive according to the detection scheme to obtain a contact detection feature of the solid state drive corresponding to the detection scheme; S6: Performing state feedback analysis of the solid state hard disk on the contact detection feature to obtain a state feature of the solid state hard disk corresponding to the contact detection feature, and synchronously driving the scraper device to control the coating of the solder paste of the solid state hard disk according to the state feature of the solid state hard disk.

[0014] Specifically, in step S1 of the embodiment provided by the present invention, it is first necessary to identify the specific model of the solid-state hard disk, and ensure that the system knows which type of hard disk it is by reading the serial number and label information of the hard disk or identifying its model through an automated system. Based on the identified hard disk model, the system will query the package design information corresponding to the model from the database. The package design information includes the size of the hard disk, pad layout, pad spacing, surface treatment requirements, pad coating thickness, etc. The design information is determined based on the specific purpose and manufacturing requirements of the hard disk.

[0015] More specifically, based on the packaging design information, the system will determine the packaging steps and operating procedures of the hard disk. The execution plan includes the specific execution order of each packaging step, coating method, selection of solder paste, operation mode of the scraper equipment, etc. The packaging execution plan also needs to take into account production efficiency and quality control, and how to ensure the accuracy and consistency of each step in a short time. By analyzing the hard disk design information, the system will also optimize the packaging process and select the most appropriate execution plan, which may include adjusting equipment parameters, optimizing work processes, reducing production cycles, etc., so as to achieve more efficient production goals.

[0016] Specifically, in step S2 of the embodiment provided by the present invention, it is first necessary to prepare machine vision equipment, which usually includes a high-resolution camera, a light source, an image acquisition card, an industrial camera, etc., and to properly set and calibrate the equipment to ensure that a clear image of the hard disk can be captured and that the image is not affected by factors such as lighting and angle. In order to obtain detailed information on the appearance of the hard disk, the light source needs to be reasonably set according to the surface material and shape of the hard disk to avoid reflections or shadows. The shooting angle and focal length of the camera also need to be adjusted according to the size of the hard disk and the detection requirements to ensure that the appearance of the hard disk can be detected in all directions.

[0017] More specifically, on the production line, the machine vision system uses a high-speed industrial camera to capture real-time images of the appearance of the solid-state drive. Each hard drive will have its image automatically captured as it passes through the visual inspection area. To improve the clarity and accuracy of the image, the image processing system will usually perform pre-processing such as denoising, contrast enhancement, and color correction on the captured image, which can help the system better identify defects on the surface of the hard drive.

[0018] More specifically, the machine vision system uses various algorithms (such as Canny edge detection, Hough transform, etc.) to analyze the image and extract the hard disk's contour, edge and shape information. This information is very important for judging the size and appearance consistency of the hard disk. The system will analyze the surface of the hard disk for defects and detect whether there are scratches, stains, cracks, shedding, deformation and other quality problems. The visual system identifies the size, location and shape of the hard disk surface defects through pixel-level analysis. The machine vision system can also measure the hard disk's dimensions (such as the length, width and height of the shell, the size of the pad, etc.) and compare them with the design standards or preset specifications. If the size error is found to be beyond the specified range, it will be marked as unqualified.

[0019] More specifically, by analyzing the features in the image, the system will match each defect on the hard disk surface with a pre-set defect type and classify it. For example, it may distinguish surface scratches from other types of defects, or evaluate defects of different sizes according to standards. During the analysis process, the system will mark the location of each defect and give the severity of the defect. For example, a minor scratch may not affect the use, while a large crack may cause the hard disk to not work properly. Based on the detected visual features and defect information, the system will make a qualified / unqualified judgment on each hard disk. If the appearance of the hard disk meets the predetermined standards, it will be judged as qualified; if the defects exceed the allowable range, it will be judged as unqualified. When a serious defect is found in the hard disk, the system will trigger an alarm to notify the operator or automatically remove the unqualified product from the production line. All inspection data will be recorded for easy traceability and quality analysis.

[0020] It is understandable that machine vision technology can automatically and in real time perform high-precision appearance inspection on hard disks, which not only improves inspection efficiency, but also significantly reduces errors in manual inspection. Through high-resolution image acquisition and intelligent algorithm analysis, the system can detect tiny defects that are difficult for the human eye to detect. The real-time nature of the machine vision system allows each hard disk to be inspected online during the production process without stopping or interrupting production. Once the hard disk passes the visual inspection area, the system will immediately give the inspection results and provide real-time feedback to the production line.

[0021] Specifically, in step S3 of the embodiment provided by the present invention, first, the packaging design information of the solid-state hard disk is extracted from the production system or database. This information generally includes specific packaging requirements, pad layout, welding method, material selection, size specifications, etc. According to the packaging design data, the corresponding packaging execution plan is selected. The packaging execution plan includes the packaging sequence, equipment parameters (such as temperature, pressure, speed), execution standards for each step, etc. The system selects the most appropriate execution plan according to the model and characteristics of the hard disk. The machine vision system collects image data of the solid-state hard disk in real time on the production line and performs appearance inspection, including size, surface defects, pad quality, etc. Visual features, including edges, shapes, defects, etc., are extracted from the collected images. Through the image processing algorithm, various appearance features of the hard disk are detected and compared with the preset standards to determine whether there are defects. The visual system will feedback the detection results, mark whether the hard disk is qualified, and give the type, location and severity of the defect. For example, if the pad is not in the right position or there are scratches on the surface, the system will immediately feedback this information.

[0022] More specifically, the system matches the package design information with the visual inspection features to analyze whether the appearance of the hard disk is consistent with the design. For example, the package execution plan may include pad size and welding quality requirements. The visual inspection features can provide real-time feedback on whether the pad meets the standards. Based on the feedback from the visual inspection features, the system may need to dynamically adjust the package execution plan. For example, if it is detected that the pad position is deviated or the size does not meet the requirements, the system can adjust the parameters of the welding equipment or select different packaging strategies to correct the deviation.

[0023] More specifically, based on the packaging execution plan, the packaging process is executed in real time on the production line. Each step of the operation is adjusted according to the design requirements and real-time detection results. For example, the bonding, welding, coating and other operations in the packaging process will be controlled by the system, and the process will be adjusted in real time according to visual feedback. The system records the execution of each packaging step, such as equipment status, operating parameters, execution time and other information. At the same time, the execution of each step is analyzed in real time to ensure that each step of the operation meets the design requirements and ensure the quality of the hard disk.

[0024] More specifically, if there are deviations in the visual inspection or packaging execution process during the packaging process, the system will monitor in real time and provide feedback to the operator. For example, if the soldering temperature is too high, the pressure is insufficient, or the visual inspection results show defects, the system will provide timely feedback to notify the operator or automatically adjust the equipment parameters. Based on the feedback information, the system may dynamically optimize the packaging steps. For example, if a large number of defects are detected in a certain link, the system will adjust the execution method of that step or switch to an alternative plan to avoid producing more unqualified products.

[0025] Specifically, in step S4 of the embodiment provided by the present invention, the performance parameters of the scraper equipment are obtained and analyzed, including the material, size, movement speed, contact pressure, etc. of the scraper. The performance of the physical contact detection device also needs to be evaluated, such as detection sensitivity, reaction time, measurement accuracy, etc., to understand the configuration and working conditions of the scraper equipment in different packaging steps. For example, whether the scraper is used to remove the surface coating or for uniform coating of the material, the contact detection function and accuracy requirements required for each operation are different.

[0026] More specifically, according to the SSD packaging process, each step is analyzed one by one. For example, some steps in the packaging process (such as coating, chip welding, surface cleaning, etc.) involve the use of scraper equipment. It is necessary to evaluate the role and demand of physical contact detection devices in these steps, and collect the execution information of the SSD packaging execution steps through the real-time monitoring system. This information includes time, speed, operating parameters (such as pressure, temperature), etc. Combined with these data, the execution status of the current packaging step is analyzed.

[0027] More specifically, based on the function of the scraper device, determine the specific features that need to be detected. For example, if the scraper is used to remove surface coatings or clean the surface of the hard disk, the physical contact detection device needs to check in real time whether the surface is uniform during the contact process, and whether there are scratches or coating residues. By selecting an appropriate physical contact detection method, the contact state and pressure changes between the scraper and the hard disk surface can be detected through tools such as contact force sensors, pressure sensors, and displacement sensors. For example, when the scraper contacts the hard disk, the sensor will record the contact pressure. If the pressure is too large or too small, it may indicate equipment failure or abnormal operation. According to the packaging requirements of the hard disk, set an appropriate tolerance range, such as the maximum allowable pressure when the scraper contacts, the allowable contact unevenness, the accuracy requirements of the scraper movement, etc. The detection plan should ensure that the operation is within these standard ranges.

[0028] More specifically, during the packaging process, the physical contact detection device will monitor the contact between the scraper and the hard disk surface in real time. For example, when the scraper contacts the hard disk, the sensor will feedback real-time contact pressure, displacement, scratches and other data. If a non-standard situation is detected (such as excessive pressure, scratches, uneven surface, etc.), the detection device will promptly feedback to the control system or operator, compare the real-time collected data with the preset tolerance range, and analyze whether there is a deviation. If the deviation exceeds the tolerance range, the system will automatically record this information and provide corresponding adjustment suggestions, or automatically stop the current step and make corrections.

[0029] More specifically, if the physical contact detection device finds an unqualified situation, the system can automatically adjust the operating parameters of the scraper equipment, such as scraper pressure, movement speed, etc., to ensure that the contact process meets the standards. This automatic adjustment can reduce human intervention and improve production efficiency. In some cases, if the detection device finds an abnormality, the system can prompt the operator to intervene manually and conduct on-site inspection and correction. For example, it may be necessary to adjust the position of the scraper or replace a damaged scraper.

[0030] More specifically, all test data, step execution information, and equipment parameters will be recorded by the system to generate a detailed test report. This data can not only be used for subsequent traceability, but also provide a basis for production optimization. Through long-term analysis of test data, possible bottlenecks or common faults in the production process can be identified. For example, excessive or insufficient pressure in certain steps may cause equipment wear or deterioration in product quality. The system can continuously optimize the production process based on this information, adjust equipment settings, and improve packaging quality and production efficiency.

[0031] Specifically, in step S5 of the embodiment provided by the present invention, according to the set conditions in the aforementioned detection scheme (such as scraper pressure, contact area, contact speed, etc.), these parameters are loaded into the control system of the physical contact detection device. These parameters will serve as the basis for driving the physical contact detection device to ensure that the detection process meets the design requirements and that the sensor of the physical contact detection device has been pre-calibrated and can accurately detect parameters such as contact pressure, displacement, and surface changes. The calibration work at this stage includes zero point setting and sensitivity verification of the sensor. The solid-state hard disk to be detected is fixed on the detection platform to ensure that the contact position between the hard disk surface and the scraper device is correct. Through the settings in the detection scheme, the physical contact detection device is driven to perform the action of contacting the solid-state hard disk. For example, the scraper device contacts the hard disk surface at a preset pressure and speed, and the physical contact detection device starts to record the contact parameters.

[0032] More specifically, the physical contact detection device monitors the contact pressure, contact displacement, surface friction and other data between the scraper and the hard disk surface in real time. By collecting these data through sensors, the system can understand the status of the contact process in real time. The physical contact detection device can also detect surface irregularities, such as scratches, coating residues, uneven contact, etc., to further ensure the accuracy of the detection process. All detection data are transmitted to the main control system through the real-time data acquisition system. The main control system performs real-time processing and compares the collected data with the preset standards to determine whether they meet the quality requirements. The detection system will compare and analyze the collected contact parameters (such as pressure, displacement, friction, etc.) with the set tolerance range. If the data exceeds the tolerance range (for example, the pressure is too high or too low, resulting in scratches or uneven coating), the system will issue an alarm or automatically record the abnormality. If the test result shows an abnormality, the system can automatically adjust the working parameters of the scraper equipment (such as pressure, speed, etc.) to ensure that the contact process meets the requirements. If the problem is more serious, the system will suspend the current operation and prompt manual intervention.

[0033] Specifically, in step S6 of the embodiment provided by the present invention, the contact detection feature acquisition includes physical contact detection, and the surface of the solid state hard disk is detected by a physical contact detection device to obtain a series of characteristic data in the contact process, such as contact pressure, displacement, friction, etc. These data can reflect the details of the solder paste coating process, such as the contact uniformity between the scraper and the surface, the surface pressure distribution, etc. The collected contact detection characteristic data are analyzed by the system. The system compares these data with the preset standard value to determine whether the contact process is normal. For example, if the contact pressure is too large, it may cause excessive scraping; if the contact pressure is too small, it may cause uneven coating. Through the algorithm or machine learning model, the state characteristics of the current hard disk are analyzed to obtain its corresponding "state feedback", such as: contact unevenness: such as excessive or too small pressure in some areas, uneven coating: such as too thin solder paste layer thickness in some areas, abnormal contact: such as some areas cannot be normally contacted, and through the contact detection feature analysis, a state characteristic report of the solid state hard disk is generated. The report will include information such as the uniformity of the hard disk surface contact and the solder paste coating state, providing a basis for subsequent coating adjustments.

[0034] More specifically, based on the contact detection analysis results, the state characteristics of the solid-state drive are extracted. These characteristics usually include the uniformity of solder paste coating, areas of poor contact, possible contact anomalies, etc. Through state characteristic analysis, the system can accurately determine which areas need to be re-coated or the coating parameters need to be adjusted. According to different state feedback results, the solid-state drive is classified into different states. For example, some hard drives may need to reduce the coating pressure, while others may need to increase the coating force, or some areas may need more solder paste, while other areas need to reduce the amount of solder paste.

[0035] More specifically, based on the status characteristics of the solid-state drive, the system adjusts the coating parameters of the scraper equipment in real time through the control algorithm, which includes: adjusting the coating pressure: if it is detected that some areas are unevenly coated or the pressure is too high, the system will adjust the pressure of the scraper to reduce or increase the coating pressure; adjusting the coating speed: if some areas require more solder paste or a slower coating speed, the system will adjust the scraper speed according to the status feedback; finely control the coating area: based on the surface status of the hard disk, the system can accurately locate the area that needs correction and adjust the path of the scraper equipment to ensure that the solder paste coating in the area meets the predetermined requirements.

[0036] More specifically, the system can synchronize the hard disk status and the working status of the scraper device in real time to ensure that each coating meets the hard disk surface requirements. For example, in areas with abnormal contact, the system will automatically increase the coating force or change the coating method to prevent incomplete or uneven solder paste coating due to contact problems.

[0037] More specifically, after the coating process is completed, the system will perform another test to confirm whether the coating meets the predetermined standards. At this time, the scraper device stops working and the system checks the uniformity and integrity of the solder paste coating. The system will record the coating process of each hard disk and generate a coating quality report. If the hard disk does not meet the requirements, the system will issue an alarm, indicating that further manual inspection or adjustment is required.

[0038] More specifically, all inspection and control data will be stored in the database for subsequent quality traceability and analysis. The status, coating parameters, contact characteristics and other data of each hard disk will be linked together to ensure that problems can be traced back to the production link when they occur. By analyzing large amounts of production data, the system can continuously optimize contact feature analysis and coating control algorithms to improve coating quality and production efficiency.

[0039] The present invention provides a solid state hard disk package pad control method, which has the following beneficial effects: The present invention obtains packaging design information and an execution plan, uses machine vision to perform real-time detection of the hard disk appearance, extracts visual detection features, determines the current packaging step and execution information in combination with the packaging design information, analyzes the detection plan based on the performance information of the physical contact detection device on the scraper equipment, and drives the detection device to perform physical contact detection on the hard disk to obtain contact detection features, and adjusts the state features of the hard disk according to the feedback analysis of the contact detection features to accurately control solder paste coating. The method can accurately monitor and adjust the packaging process through the combination of vision and physical contact detection, improve the uniformity and consistency of solder paste coating, and solves the problem in the prior art that it is difficult to provide real-time and accurate feedback on solder paste coating and other process steps.

[0040] Preferably, the step of obtaining the packaging design information and packaging implementation scheme of the solid state drive includes: S11: collecting target models of the solid state hard disk to obtain model information of the solid state hard disk; S12: Acquire packaging design information of the solid state drive from a database according to the model information; wherein the packaging design information includes a plurality of component units of the solid state drive and structural information of each of the component units; S13: Acquire a packaging execution plan of the solid state drive from a database according to the model information; wherein the packaging execution plan includes a packaging execution order and a packaging execution method of each component unit of the solid state drive.

[0041] Specifically, the target model information of the solid-state drive is obtained through an automated detection system or manual input. This information usually includes the specifications, version number, production batch, etc. of the hard drive. The model information of the hard drive is the basis for subsequent packaging design and execution plan acquisition. The target solid-state drive model to be packaged is selected, for example, by scanning a barcode, RFID tag, or manually entering the model.

[0042] More specifically, based on the collected SSD model information, the system queries the package design information of the model from the product design database. The package design information usually includes the various components of the SSD and their structures. The components of the SSD may include PCB boards, NAND flash memory chips, controllers, power management chips, interface modules, heat sinks, etc. The design of each unit will describe its dimensions, functions, installation methods, material selection and other information in detail, including the connection method between the various components, hierarchical structure, package form (such as BGA, QFN, etc.), and the overall size and shape after assembly and other design parameters. This information provides necessary reference for subsequent packaging execution.

[0043] More specifically, based on the hard disk model information, the system obtains the packaging execution plan of the solid-state hard disk of this model from the database. The packaging execution plan describes how to package the various components of the solid-state hard disk in a certain order and manner. The order of the packaging process is usually strictly required. For example, the NAND flash chip may be soldered first, then the controller is installed, and finally the PCB board is packaged. The packaging sequence is to ensure the coordination and installation accuracy between the various units. The packaging execution method includes the specific packaging methods, such as surface mount technology (SMT), manual welding, and automated assembly. Different execution methods correspond to different production processes and equipment requirements to ensure the reliability and accuracy of the final product.

[0044] More specifically, based on the packaging design information and the packaging execution plan, the system will automatically generate a packaging execution plan, which will list in detail the specific operations of each step, including the installation method, sequence, required equipment and tools, and quality control points of each component unit. According to the packaging execution plan, the time schedule and resource allocation plan for each step will be generated to ensure the efficient operation of the production line. The system will give detailed process requirements based on the packaging design and execution plan, such as welding temperature, pressure control, assembly sequence, inspection standards, etc.

[0045] More specifically, according to the generated packaging execution plan, the automated production equipment will start the packaging operation according to the plan. The equipment will automatically perform component assembly, welding, packaging and other processes in the set order to ensure that each unit is assembled correctly as required. During the production process, the system will monitor the execution of each step in real time and make necessary adjustments based on feedback. For example, data such as temperature, humidity, and equipment operating status will be collected in real time to ensure that every link in the packaging process meets the requirements.

[0046] More specifically, after packaging is completed, the system will automatically conduct a comprehensive quality inspection of the final product, including size, welding quality, appearance, function, etc. The inspection results will be used to determine whether the packaging standards are met. If problems are found, the system will automatically adjust the subsequent packaging execution plan, or perform manual intervention to correct them. Long-term data accumulation can also help improve packaging design and execution plans.

[0047] It is understandable that through the automated process, the system can accurately execute packaging design information and packaging execution plans, avoid errors caused by manual operations, and improve the efficiency and consistency of the packaging process. Automated execution also means that different models of hard disk packaging tasks can be quickly switched to improve production flexibility. From SSD model collection to packaging execution plan generation, the automation of the entire process greatly shortens production time. By optimizing the packaging execution sequence and method, invalid operations and waiting time can be further reduced, and overall production efficiency can be improved. Through strict control of the packaging execution sequence and method, the assembly accuracy and quality of each SSD can be ensured. The system's real-time monitoring and adjustment mechanism can provide immediate feedback when problems occur in any link, reducing the defect rate. Each packaging link can record detailed execution data to ensure the transparency of the entire packaging process. Quality inspection and problem feedback mechanisms ensure that the final product meets the standards and improves product reliability.

[0048] Preferably, the step of performing real-time detection of the appearance of the solid state hard disk by machine vision technology to obtain visual detection features of the solid state hard disk includes: S21: performing a preliminary inspection of the appearance of the solid state hard disk fixed on the package pad by using a plurality of pre-set camera units to obtain preliminary visual data of the solid state hard disk; S22: performing feature analysis on the preliminary visual data of the solid state drive to obtain setting status information of each component unit of the solid state drive fed back by the preliminary visual data; S23: Assemble the setting status information of each component unit of the solid state drive as a whole to obtain the visual detection feature of the solid state drive.

[0049] Specifically, the solid-state hard drive is monitored in real time through several pre-set camera units (such as industrial cameras, high-definition cameras, 3D vision sensors, etc.). The cameras are usually installed at different angles and positions to ensure that the hard drive surface is fully covered. The hard drive is usually fixed on a dedicated packaging pad to ensure that it does not move during the inspection process to ensure the accuracy of the visual data. Each camera unit synchronously takes a preliminary picture of the appearance of the solid-state hard drive to obtain preliminary visual data of the hard drive. The inspection at this stage can include basic information such as surface defects, welding quality, component location, and whether the label is clear.

[0050] More specifically, the preliminary visual data obtained needs to be processed and feature analyzed. Commonly used machine vision technologies include image preprocessing (denoising, contrast enhancement), edge detection, shape analysis, etc. The preliminary visual data is denoised and sharpened to improve the accuracy of subsequent feature extraction. Image processing algorithms (such as edge detection, template matching, morphological operations, etc.) are used to extract the characteristic information of each component unit of the hard disk from the preliminary visual data. For example, the welding position of the NAND flash memory chip, the controller position, the circuit board connection status, etc. are determined. By setting a threshold, it is detected whether there are any abnormalities in the appearance of the hard disk, such as missing components, solder joint defects, physical damage, surface scratches, etc. The algorithm is used to determine whether the actual position, installation status, and shape of each component unit (such as chip, connector, heat sink, etc.) meet the predetermined standard design.

[0051] More specifically, the setting status information of each component unit is combined to construct a complete visual inspection feature of the solid-state drive. This feature includes the installation status of all components, whether there is physical damage, welding quality, alignment between components, etc. The geometric relationship between each component is verified through machine vision technology. For example, it is checked whether the spacing between the NAND flash memory and the controller meets the design requirements, and whether the battery position and interface welding are accurate. The setting status information of each unit is integrated into an overall visual inspection feature and provided to the subsequent quality judgment system.

[0052] More specifically, the inspection results of all components are eventually integrated through algorithms and machine learning technology to generate a complete visual inspection feature, which is then fed back to the quality control system. This feature is used to judge the overall appearance quality of the SSD, and combined with preset quality standards (such as dimensional tolerances, welding quality requirements, etc.), it automatically determines whether the SSD meets the quality standards. Through real-time inspection, the system can immediately respond to abnormal situations. If defects or deviations are found, the system can directly trigger an alarm or require the operator to intervene manually to ensure that unqualified products do not continue to flow out of the production line.

[0053] It is understandable that the use of machine vision technology to automate the appearance inspection of solid-state drives reduces the reliance on manual inspection and ensures the efficiency and accuracy of inspection. The machine vision system can process a large amount of image data in a short period of time and conduct a comprehensive analysis of the hard drive appearance.

[0054] Preferably, the step of performing information analysis of the packaging execution step on the visual inspection feature according to the packaging design information and the packaging execution scheme of the solid state drive to obtain the packaging execution step of the solid state drive at the current moment and the step execution information of the packaging execution step comprises: S31: judging the completion status of the packaging design of the visual inspection feature according to the packaging design information of the solid state drive, so as to obtain the packaging completion status fed back by the visual inspection feature; S32: parsing the completion status of each component unit of the packaging completion status to obtain a set of component units to be packaged of the solid state drive; S33: arranging the set of component units to be packaged of the solid state drive in a packaging execution order according to the packaging execution scheme to obtain component units with a first-rank packaging execution order, and marking them as identification units; S34: According to the encapsulation execution scheme, the encapsulation execution mode and the encapsulation execution order of the identification unit are retrieved to obtain the encapsulation execution mode and the encapsulation execution order of the identification unit, the encapsulation execution order of the identification unit is format-converted to obtain the encapsulation execution steps of the solid-state hard disk at the current moment, the encapsulation execution steps of the identification unit are format-converted to obtain the step execution information of the solid-state hard disk at the current moment.

[0055] Specifically, the system will first parse the packaging design information of the SSD, which usually includes the specifications of each component unit of the package, the installation sequence, the connection method and any other design requirements that affect the packaging process. The visual feature data of the SSD is obtained through the previous machine vision inspection step, covering the appearance, position, installation status and other information of each component unit of the hard disk. According to the packaging design information, the system compares the visual inspection features to determine whether the various components of the hard disk meet the design requirements and determine whether the packaging has been completed or which units still need further processing. The output of this step is the "packaging completion status".

[0056] More specifically, based on the packaging completion status obtained in the previous step, the system will further analyze the completion status of each component unit. Specifically, it will check the installation and welding status of each component (such as memory chips, controllers, circuit boards, interfaces, etc.). For example, it will check whether the NAND flash memory chip has been correctly soldered, whether the connectors are in place, whether the packaging shell is correctly fixed, etc. After analysis, the system will generate a set of component units to be packaged, which includes all component units that currently need further packaging or adjustment.

[0057] More specifically, according to the packaging execution scheme, which is usually a pre-set sequence of packaging steps, the system sorts the set of component units to be packaged according to the scheme. According to the packaging scheme, the system assigns an execution order to each component unit to ensure that the packaging process is efficient and meets the design requirements. The order is based on the physical limitations of the package, the operation logic (for example, install the main control chip first, then install the memory module), and other factors (such as thermal management, welding sequence, etc.). According to the execution order, the system determines the identification unit in the packaging execution order (that is, the unit that is executed first). This unit is usually the most important or basic component (such as the main controller, memory chip, etc.).

[0058] More specifically, according to the packaging execution plan, the system will determine the packaging execution method of the first-order unit. This may involve specific welding methods, hot pressing processes, mechanical assembly steps, etc. For example, the installation of the controller may require precise spot welding, and the packaging of the memory chip may need to be heated to a specific temperature for packaging. At the same time, the system will also call the execution order and related parameters of the unit and perform format conversion. The purpose of format conversion is to convert the execution order into a standard format that the machine can understand and execute, such as an instruction set, command line or data flow.

[0059] More specifically, the system converts the packaging execution sequence of the identification unit into specific step execution information including: the number of the execution step, the operation type of each step (such as "welding", "installation", "inspection"), the operation time of each step, and the relevant physical location or equipment requirements. The step execution information is converted into a standardized format to facilitate subsequent operations and records. For example, a packaging execution log or step report can be generated for real-time monitoring of the packaging process. This part of the information provides detailed execution steps, including the specific execution content of each step, the order of operations, the required equipment and tools, etc., to ensure that each packaging link is completed in sequence and with high quality.

[0060] It is understandable that through the analysis of packaging design information and visual inspection features, the system can automatically optimize the packaging execution sequence, ensure that the packaging steps are executed in a predetermined efficient and reasonable order, and avoid confusion or errors caused by human factors. Automated sorting and management enable each step in the production process to be precisely controlled and work more closely with hardware, tools and equipment. The reasonable arrangement of the packaging execution sequence can greatly improve packaging efficiency and avoid repeated operations or unnecessary waiting. For example, by installing the controller and main memory chip first, and then installing the auxiliary components, interference with other units can be reduced and assembly accuracy can be improved. Through precise packaging method retrieval and format conversion, the system can execute each packaging step in a standardized manner to ensure that each unit can be executed according to precise technical requirements.

[0061] Preferably, the steps of performing a detection scheme analysis on the packaging execution steps and step execution information of the solid state hard disk at the current moment according to the performance information of the physical contact detection device provided on the scraper device to obtain the detection scheme of the physical contact detection device include: S41: Acquire performance information of a physical contact detection device provided on the scraper device; wherein the physical contact detection device includes an elastic airbag and a pressure sensor; S42: analyzing the packaging execution steps and step execution information of the solid state drive at the current moment for detection targets, so as to obtain detection requirement information of the solid state drive at the current moment; S43: analyzing the detection mode of the detection requirement information according to the performance information to obtain a device application mode of the physical contact detection device corresponding to the detection requirement information; S44: driving the scraper device to move in several specified directions relative to the target object to be detected on the solid state hard disk, and synchronously recording image data of the scraper device when it moves in each specified direction through a camera unit preset on the scraper device, and obtaining relative position information of the scraper device relative to the target object to be detected on the solid state hard disk by analyzing the image data; S45: Analyze specific application parameters of the device application mode according to the relative position information of the scraper device with respect to the target object to be detected on the solid-state hard disk, so as to obtain device driving parameters of the physical contact detection device set on the scraper device for the target object to be detected on the solid-state hard disk, and use the device driving parameters as the detection scheme of the physical contact detection device.

[0062] Specifically, the performance parameters of the physical contact detection device installed on the scraper equipment are collected and analyzed, including the pressure adjustment range of the elastic airbag, the sensitivity of the pressure sensor, the response time, etc. This information is crucial to the subsequent detection plan because they determine the detection device's response ability to different targets. The elastic airbag is responsible for providing a stable physical contact force, and the pressure sensor monitors the changes in the contact force in real time to ensure that the detection process does not cause damage to the solid-state drive. The accuracy and reliability of the device are evaluated to determine whether it can meet the various requirements in the packaging process.

[0063] More specifically, the system obtains the current SSD packaging execution steps and execution information. These steps include the installation, welding, and fixing of each hard disk component. Based on the information of these execution steps, it analyzes which links require physical contact detection. For example, the target objects that may need to be detected include the stability of the welding point, whether the component position is correct, or whether the packaging of the shell is complete, and generates detection requirement information, such as the physical properties of the detection target (such as position, thickness, surface smoothness, etc.).

[0064] More specifically, an appropriate detection mode is determined based on the performance information of the physical contact detection device and the current detection demand information. The detection mode selects the appropriate contact method and applied force based on the working principle of the elastic airbag and the pressure sensor. For example, for some more sensitive components, the detection mode may require a lower contact pressure; while for key parts such as welding points, stronger pressure may be required to detect whether the connection is firm. According to the needs, the contact method (such as steady pressure or vibration detection) and force are selected to ensure that the components will not be damaged while providing effective quality judgment.

[0065] More specifically, the scraper device is driven to move in several specified directions relative to the target object on the solid-state drive. The movement can be linear, rotational or other multi-directional movement, depending on the layout and complexity of the object to be detected. The preset camera unit on the scraper device records the image data of the device moving in each specified direction in real time. The data can be used for subsequent analysis to obtain the position information of the target object in different directions. For example, through image processing technology, the contour, position deviation and potential installation errors of the target object can be accurately obtained.

[0066] More specifically, image recognition technology is used to analyze the collected image data to determine the relative position information of the scraper device relative to the target object to be inspected on the solid-state drive. This includes determining whether the hard disk component is in the correct position, whether the surface is flat, whether the edges of the component are aligned, etc. Image analysis can also identify any potential packaging problems, such as missing or offset parts.

[0067] More specifically, based on the relative position information, the specific application mode of the physical contact detection device is further analyzed, for example, whether it is necessary to adjust the force application mode of the elastic airbag, the sensitivity setting of the pressure sensor, or the moving speed of the scraper device, etc., and the required device drive parameters are generated based on the analysis results. These parameters determine the working mode of the physical contact detection device, including: the intensity and change rate of the applied pressure; the speed and moving path of the scraper device; the inflation volume of the airbag and its adjustment method. These drive parameters are used as the detection scheme and as the basis for the execution of subsequent tests. These parameters ensure that the physical contact detection device can complete accurate detection as required in actual production.

[0068] It can be understood that by analyzing the performance information of the device and flexibly adjusting the device application mode, the system can adapt to various types of packaging objects according to different packaging steps and detection target requirements. The elastic airbag and pressure sensor provide highly adjustable pressure application capabilities, allowing the detection device to accurately apply force according to the requirements of different components of the hard disk, avoiding damage to the hard disk components due to excessive pressure.

[0069] Preferably, the step of driving the physical contact detection device to perform physical contact detection on the solid state hard disk according to the detection scheme to obtain the contact detection feature of the solid state hard disk corresponding to the detection scheme includes: S51: driving the physical contact detection device to move to an initial detection position relative to a target object to be detected on the solid state drive according to the detection scheme; S52: according to the detection scheme, driving the elastic airbag at the initial detection position to perform a specified form of physical contact test relative to the solid state drive, so as to obtain pressure distribution data when the elastic airbag and the solid state drive perform the specified form of physical contact through a pressure sensor; wherein the specified form includes pressure degree and pressure direction; S53: resetting the physical contact detection device to the initial detection position, and driving the elastic airbag at the initial detection position to perform other specified forms of physical contact tests relative to the solid state drive according to the detection scheme, and obtaining pressure distribution data when the elastic airbag and the solid state drive perform the specified form of physical contact through a pressure sensor; S54: Combining the pressure distribution data in various specified forms to obtain the contact detection characteristics of the solid state drive corresponding to the detection scheme.

[0070] Specifically, first, according to the detection scheme, the physical contact detection device (such as a device with an elastic airbag and a pressure sensor) is driven to move to an initial detection position relative to the target object to be detected on the solid-state hard disk. This position is usually a specific area of ​​the solid-state hard disk, which may be an edge, surface or interface position. Depending on the target to be detected, the detection device is aligned with the target object through a visual positioning system or a preset mechanical limit to ensure the accuracy of the subsequent physical contact test. According to the requirements of the detection scheme, the elastic airbag is driven to perform a specified form of physical contact test relative to the solid-state hard disk. The specified form includes: Pressure degree: The pressure applied by the airbag can be set by air pressure regulation or other control methods. Different target areas (such as surfaces, interfaces, etc.) require different pressure levels to avoid damaging the hard disk components while ensuring sufficient detection capabilities. Pressure direction: The direction in which the elastic airbag applies pressure can be vertical, oblique or other directions to simulate different contact conditions in actual use. The pressure distribution data is obtained through the pressure sensor. When the airbag contacts the solid-state hard disk, the pressure sensor will record the pressure distribution data of the contact point. The data usually includes: the pressure intensity of each contact point, the change of pressure in the contact area (such as pressure peak, uniformity, etc.).

[0071] More specifically, after the test is completed, the physical contact detection device will be reset to the initial detection position. This process ensures that the device can return to its original position between multiple test cycles, thereby ensuring data consistency. According to the requirements of the detection plan, the device will drive the elastic airbag to perform other forms of physical contact tests. Each form may include different pressure directions and different pressure levels. Under each test form, the pressure sensor will record new pressure distribution data again. Through multiple tests, different usage and contact scenarios (such as equipment installation, external force, friction, etc.) can be simulated.

[0072] More specifically, after collecting the pressure distribution data under all test forms, they are combined into a comprehensive contact detection feature. These data may include: the strength and distribution of each pressure point; the uniformity and change of pressure; the pressure direction and pressure fluctuation on the contact surface, generating contact detection features. By combining data under different forms, the contact detection features of the corresponding detection scheme of the solid-state hard disk are finally obtained. These features can describe the response characteristics of the hard disk under physical contact, including: the uniformity and strength of contact; the pressure distribution in the contact area; and the interaction between the elastic airbag and the hard disk target.

[0073] It is understandable that by accurately collecting pressure distribution data under different pressure levels and directions through pressure sensors, a comprehensive analysis can be made on the pressure that the hard disk may be subjected to during the packaging process or use. Through the analysis of pressure distribution, it is possible to identify which areas have more uniform contact and which areas may affect the quality of the hard disk due to excessive or insufficient pressure. This helps to optimize the contact quality during the packaging process and avoid the risk of potential damage to the hard disk or unstable performance due to excessive pressure. By testing according to different pressure directions and pressure levels, the detection scheme can simulate a variety of actual situations to ensure the stability of the equipment under different conditions. For example, the hard disk may face different contact forces during transportation, installation, vibration, etc. This scheme comprehensively evaluates the compressive performance of the hard disk through multi-angle testing. By simulating different contact situations, it can fully cover all contact risks that the hard disk may encounter during the packaging process, including edge collisions, surface contact, side pressure, etc.

[0074] Preferably, the step of performing state feedback analysis of the solid state hard disk on the contact detection feature to obtain a state feature of the solid state hard disk corresponding to the contact detection feature comprises: S61: performing data analysis corresponding to the specified form on each item of pressure distribution data in the contact detection feature, so as to obtain a morphological feedback feature of the solder paste part to be detected on the solid state drive corresponding to each item of pressure distribution data; S62: performing digital twin simulation on the solder paste portion to be detected on the solid state drive according to the morphological feedback characteristics of each item of the pressure distribution data, so as to obtain a digital solder paste model of the solder paste portion corresponding to each item of the pressure distribution data; S63: sorting the digital solder paste models according to the test acquisition order of each item of the pressure distribution data to obtain a solder paste simulation sequence obtained by sorting the digital solder paste models, and extracting defect features of each digital solder paste model in the solder paste simulation sequence to obtain solder paste defect features of each digital solder paste model in the solder paste simulation sequence; S64: Based on the arrangement order of each digital solder paste model in the solder paste simulation sequence, performing a solder paste morphology change tendency analysis of each digital solder paste model in a physical contact test, and performing a theoretical state analysis of the digital solder paste model of a subsequent arrangement order on each digital solder paste model in the solder paste simulation sequence according to the analysis result, to obtain a theoretical simulation sequence composed of a plurality of theoretical solder paste models; S65: Match and verify the theoretical simulation sequence with the solder paste simulation sequence to obtain the confidence and preservation degree of the solder paste defect characteristics of each digital solder paste model in the solder paste simulation sequence, and obtain the solid-state hard disk state characteristics of the solder paste part to be detected on the solid-state hard disk by performing time-series weight superposition and threshold judgment on the confidence and preservation degree of the solder paste defect characteristics of each digital solder paste simulation in the solder paste simulation sequence.

[0075] Specifically, the pressure distribution data obtained from physical contact detection is transmitted to the data analysis module. According to the detection plan, the data analysis will perform a detailed analysis of each pressure data in a specified form (such as the degree and direction of pressure). The pressure data obtained through analysis is used to generate the morphological feedback features of the solder paste part to be detected on the solid-state drive. These morphological feedback features represent the physical changes in the solder paste area, such as deformation, uniformity, possible indentations, etc. Based on the morphological feedback features obtained through analysis, the corresponding digital solder paste model is established using digital twin technology. This simulation model can accurately reflect the morphological changes of the solder paste under different pressure distributions. Each pressure distribution data corresponds to the generation of a digital twin model of the solder paste part. These models can highly simulate the actual state of the solder paste, including its thickness, surface flatness and stress distribution.

[0076] More specifically, the models are arranged according to the test order of the pressure data, and all the generated digital solder paste models are sorted in time series according to the order in which the pressure distribution data is obtained. This step ensures that the arrangement of each model can reflect the actual contact process of the solder paste area during the test. A complete solder paste simulation sequence is formed from the sorted digital solder paste models. This sequence will be arranged according to the response order of the solder paste area under different contact conditions. Defect features are extracted for the digital solder paste models in each solder paste simulation sequence, including: morphological defects: such as uneven solder paste, cracks, pores, etc., indentations and deformations: changes in solder paste morphology caused by excessive or insufficient pressure, functional defects: such as poor electrical connection caused by insufficient solder paste, etc. Through feature extraction, the severity of the defect can be quantified, such as depth, area or range of impact on the contact area.

[0077] More specifically, based on the arrangement order of each digital solder paste model, a trend analysis of the morphological change of the solder paste after the physical contact test is performed. This analysis focuses on the changing trend of the solder paste under pressure, including the possible flow, extrusion, and dispersion of the solder paste. According to the trend of pressure and morphological changes, the theoretical state that each digital solder paste model may reach after the contact test is inferred. This analysis helps predict the behavior mode and change characteristics of the solder paste under different pressure conditions. Based on the analysis of the tendency of solder paste morphology changes, the subsequent state of each digital solder paste model is predicted. These prediction results generate a series of theoretical solder paste models, which present the possible development trajectory of the solder paste under different physical contact conditions. These theoretical solder paste models are arranged in a predetermined order to form a theoretical simulation sequence, which represents the possible changes of solder paste in the actual production process. The solder paste simulation sequence obtained by actual testing is matched and verified with the theoretical simulation sequence. By comparing the differences between the two, the accuracy and reliability of the digital solder paste model are checked to ensure that the simulation results are consistent with the actual situation. Through comparative testing, the confidence and preservation of the defect characteristics of each digital solder paste model are evaluated: Confidence: Evaluate the authenticity of the defect characteristics, that is, whether the defects really exist and are consistent with the test results; Preservation: Evaluate the stability of the defect characteristics over time, and whether they can maintain consistency in the entire solder paste simulation sequence.

[0078] More specifically, the defect feature confidence and preservation degree of each digital solder paste model are weighted and superimposed according to the time series to form a dynamic defect assessment model. By setting a threshold, the severity of the solder paste defect is judged to ensure the impact of the defect on the hard disk performance. If the confidence and preservation degree of the defect exceed the threshold, it means that the defect may have a significant impact on the hard disk performance and needs further processing or repair. Through the above steps, the state characteristics of the solder paste part to be tested on the solid-state drive are finally obtained. This feature reflects the overall health status of the solder paste area, including whether there are defects, the type and severity of the defects and their potential impact on the hard disk performance.

[0079] It is understandable that by combining the contact pressure data with the solder paste morphology feedback characteristics, the defects of the solder paste under different pressures, such as unevenness, bubbles, cracks, etc., can be accurately predicted. These defects are crucial to the performance of the solid-state drive, and timely detection can avoid large-scale quality problems. The digital twin simulation can highly restore the state of the solder paste in the actual contact environment, providing a strong basis for defect diagnosis. Through the timing analysis and weight superposition of the solder paste simulation sequence, the real-time monitoring of the solder paste state can be achieved, and the changing trend of solder paste defects can be dynamically evaluated. The production process and equipment settings can be adjusted in time to prevent the accumulation of potential problems. This dynamic evaluation process helps to improve the quality control capabilities of the production line, ensure that each solder paste area meets the standard requirements, and avoid product rework or damage due to poor welding.

[0080] Preferably, the step of synchronously driving the scraper device to control the coating of the solder paste of the solid state hard disk according to the state characteristics of the solid state hard disk includes: S66: Acquire performance information of the scraper device, and analyze the application mode of the state characteristics of the solid state hard disk according to the performance information of the scraper device to obtain the application mode of the scraper device corresponding to the state characteristics of the solid state hard disk; S67: performing parameter analysis of a specific execution process of the performance information according to the application mode to obtain working parameters of the scraper device, and driving the scraper device according to the working parameters to achieve coating control of the solder paste of the solid state drive.

[0081] Specifically, the performance information of the scraper equipment is obtained through sensors or system interfaces, including its working range, working speed, pressure control accuracy, motion path, vibration characteristics, etc. These data are important bases for driving the scraper equipment control to ensure its stability and accuracy during the working process. According to the previously obtained solid-state hard disk state characteristics (such as solder paste morphology, defect type, etc.), combined with the actual production needs of the hard disk, an application mode analysis is performed. The purpose of this step is to determine the working mode of the scraper equipment according to different solder paste states (such as uneven thickness, bubbles, cracks, etc.) and the production process requirements of the hard disk. By analyzing the obtained solid-state hard disk state characteristics, the application modes of the scraper equipment under different hard disk states are generated. These modes will guide the scraper equipment on how to adjust its working mode to adapt to different solder paste coating requirements.

[0082] More specifically, according to the determined application mode, the performance information of the scraper device is analyzed for specific parameters, including how to adjust the scraper speed, pressure, path, coating thickness, etc. to adapt to the current state characteristics of the solid-state drive, and extract the specific working parameters of the scraper device from the application mode. For example, if the solder paste layer is too thick, higher pressure and slower coating speed may be required; if there is a bubble problem, the scraper path frequency and coating uniformity requirements need to be adjusted. Working parameters may include: scraper speed: control the scraper movement speed to ensure uniform coating of the solder paste; applied pressure: adjust the pressure strength of the scraper according to the thickness and uniformity requirements of the solder paste; coating path: design a suitable scraper path according to the morphology of the solder paste area on the solid-state drive; coating frequency: adjust the scraper operation frequency to optimize the continuity of the coating.

[0083] More specifically, according to the working parameters obtained by the above analysis, the corresponding control signal is generated through the system control unit (such as PLC controller, digital signal processor, etc.), and the control signal is transmitted to the scraper device to drive it to perform corresponding work, such as adjusting the speed, pressure and path of the scraper to accurately coat the solder paste. This process needs to ensure that the scraper device can match the real-time state changes of the solid-state hard disk to achieve the best coating effect. According to the feedback signal of the scraper device (such as pressure sensor, speed monitoring, etc.), the equipment parameters are adjusted in real time to ensure the stability and consistency of the coating process. By monitoring various real-time data in the coating process (such as coating thickness, uniformity, etc.), it is judged whether the production standards are met and the coating strategy is adjusted when necessary.

[0084] It can be understood that through the real-time driving of the scraper equipment and the synchronous analysis of the state characteristics of the solid-state hard disk, the coating parameters can be adjusted according to different solder paste defects (such as uneven thickness, bubbles, etc.) to ensure that the solder paste coating of each solid-state hard disk is uniform and meets the quality standards. By precisely controlling the speed, pressure and path of the scraper, common coating defects such as bubbles, solder paste accumulation or uneven distribution can be effectively avoided to ensure the reliability of the welding area. The system can automatically adjust the working parameters of the scraper equipment according to the actual state characteristics of the solid-state hard disk, reducing manual intervention and operation errors. Automated coating control not only improves production efficiency, but also reduces coating defects caused by human errors. The optimized coating control can accurately grasp the optimal time and quantity of solder paste coating, avoid unnecessary material waste, and improve resource utilization efficiency.

[0085] Reference Figure 2 As shown, in a second aspect, the present invention provides a solid state hard disk package pad control device, which is used to implement a solid state hard disk package pad control method according to any one of the first aspects, including: An information acquisition module, used to acquire the packaging design information and packaging execution plan of the solid state drive; A visual inspection module, used to perform real-time inspection of the appearance of the solid-state hard disk by machine vision technology to obtain visual inspection features of the solid-state hard disk; An information analysis module, configured to perform information analysis of a packaging execution step on the visual inspection feature according to the packaging design information and the packaging execution scheme of the solid state drive, so as to obtain the packaging execution step of the solid state drive at a current moment and step execution information of the packaging execution step; A scheme analysis module, used for performing a detection scheme analysis on the packaging execution steps and step execution information of the solid state hard disk at the current moment according to the performance information of the physical contact detection device arranged on the scraper device, so as to obtain a detection scheme of the physical contact detection device; A contact detection module, configured to drive the physical contact detection device to perform physical contact detection on the solid state drive according to the detection scheme, so as to obtain a contact detection feature of the solid state drive corresponding to the detection scheme; The coating control module is used to perform state feedback analysis of the solid-state hard disk on the contact detection feature to obtain the solid-state hard disk state feature corresponding to the contact detection feature, and synchronously drive the scraper device to control the coating of the solder paste of the solid-state hard disk according to the solid-state hard disk state feature.

[0086] In this embodiment, for the specific implementation of each module in the above-mentioned device embodiment, please refer to the above-mentioned method embodiment, which will not be described in detail here.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A solid state hard disk package pad control method, characterized in that: include: Obtain the packaging design information and packaging implementation plan of the solid-state drive; Performing real-time inspection of the appearance of the solid-state hard disk by machine vision technology to obtain visual inspection features of the solid-state hard disk; Performing information analysis of the packaging execution steps on the visual inspection features according to the packaging design information and the packaging execution scheme of the solid state drive, so as to obtain the packaging execution steps of the solid state drive at the current moment and the step execution information of the packaging execution steps; Performing a detection scheme analysis on the packaging execution steps and step execution information of the solid state drive at the current moment according to the performance information of the physical contact detection device provided on the scraper device, so as to obtain a detection scheme of the physical contact detection device; According to the detection scheme, the physical contact detection device is driven to perform physical contact detection on the solid state hard disk to obtain a contact detection feature of the solid state hard disk corresponding to the detection scheme; The contact detection feature is subjected to state feedback analysis of the solid state hard disk to obtain a state feature of the solid state hard disk corresponding to the contact detection feature, and the scraper device is synchronously driven according to the state feature of the solid state hard disk to control the coating of the solder paste of the solid state hard disk.

2. The solid state drive package pad control method according to claim 1, characterized in that: The steps of obtaining the package design information and package implementation plan of the solid state drive include: Collecting a target model of the solid state drive to obtain model information of the solid state drive; Acquire the package design information of the solid state drive from the database according to the model information; wherein the package design information includes several component units of the solid state drive and the structure information of each of the component units; The packaging execution scheme of the solid state drive is obtained from a database according to the model information; wherein the packaging execution scheme includes a packaging execution sequence and a packaging execution method of each component unit of the solid state drive.

3. The solid state drive package pad control method according to claim 1, characterized in that: The step of performing real-time inspection of the appearance of the solid state hard disk by machine vision technology to obtain visual inspection features of the solid state hard disk includes: Performing a preliminary inspection of the appearance of a solid-state hard disk fixed on a package pad by using a plurality of pre-set camera units to obtain preliminary visual data of the solid-state hard disk; Performing feature analysis on the preliminary visual data of the solid state drive to obtain setting status information of each component unit of the solid state drive fed back by the preliminary visual data; The setting status information of each component unit of the solid state hard disk is integrated to obtain the visual detection characteristics of the solid state hard disk.

4. The solid state hard disk package pad control method according to claim 2, characterized in that: The step of performing information analysis of the packaging execution step on the visual inspection feature according to the packaging design information and the packaging execution scheme of the solid state drive to obtain the packaging execution step of the solid state drive at the current moment and the step execution information of the packaging execution step comprises: Judging the completion status of the packaging design of the visual inspection feature according to the packaging design information of the solid state drive, so as to obtain the packaging completion status fed back by the visual inspection feature; Parsing the completion status of each component unit of the packaging completion status to obtain a set of component units to be packaged of the solid state drive; Arranging the set of component units to be packaged of the solid state drive in a packaging execution order according to the packaging execution scheme to obtain component units with a first-rank packaging execution order and marking them as identification units; According to the encapsulation execution scheme, the encapsulation execution mode and the encapsulation execution order of the identification unit are retrieved to obtain the encapsulation execution mode and the encapsulation execution order of the identification unit, the encapsulation execution order of the identification unit is format-converted to obtain the encapsulation execution steps of the solid-state hard disk at the current moment, the encapsulation execution steps of the identification unit are format-converted to obtain the step execution information of the solid-state hard disk at the current moment.

5. The solid state drive package pad control method according to claim 1, characterized in that: The steps of analyzing the packaging execution steps and step execution information of the solid state hard disk at the current moment according to the performance information of the physical contact detection device provided on the scraper device to obtain the detection scheme of the physical contact detection device include: Acquiring performance information of a physical contact detection device provided on the scraper device; wherein the physical contact detection device comprises an elastic airbag and a pressure sensor; Analyzing the detection target of the packaging execution steps and step execution information of the solid state drive at the current moment to obtain the detection requirement information of the solid state drive at the current moment; Analyzing the detection mode of the detection requirement information according to the performance information to obtain a device application mode of the physical contact detection device corresponding to the detection requirement information; The scraper device is driven to move in several specified directions relative to the target object to be detected on the solid-state hard disk, and image data of the scraper device when the scraper device moves in each specified direction is synchronously recorded by a camera unit preset on the scraper device, and relative position information of the scraper device relative to the target object to be detected on the solid-state hard disk is obtained by analyzing the image data; The specific application parameters of the device application mode are analyzed based on the relative position information of the scraper device with respect to the target object to be detected on the solid-state hard disk, so as to obtain the device driving parameters of the physical contact detection device set on the scraper device for the target object to be detected on the solid-state hard disk, and the device driving parameters are used as the detection scheme of the physical contact detection device.

6. The solid state drive package pad control method according to claim 5, characterized in that: The step of driving the physical contact detection device to perform physical contact detection on the solid state hard disk according to the detection scheme to obtain the contact detection feature of the solid state hard disk corresponding to the detection scheme includes: According to the detection scheme, the physical contact detection device is driven to move to an initial detection position relative to the target object to be detected on the solid state drive; According to the detection scheme, the elastic airbag at the initial detection position is driven to perform a specified form of physical contact test relative to the solid state drive, so as to obtain pressure distribution data when the elastic airbag and the solid state drive perform a specified form of physical contact through a pressure sensor; wherein the specified form includes pressure degree and pressure direction; Resetting the physical contact detection device to the initial detection position, and driving the elastic airbag at the initial detection position to perform other specified forms of physical contact tests relative to the solid state drive according to the detection scheme, and obtaining pressure distribution data when the elastic airbag and the solid state drive perform the specified form of physical contact through a pressure sensor; The pressure distribution data in various specified forms are combined to obtain the contact detection characteristics of the solid state drive corresponding to the detection scheme.

7. The solid state drive package pad control method according to claim 6, characterized in that: The step of performing state feedback analysis of the solid state hard disk on the contact detection feature to obtain the state feature of the solid state hard disk corresponding to the contact detection feature comprises: Performing data analysis corresponding to the specified form on each item of pressure distribution data in the contact detection feature to obtain a morphological feedback feature of the solder paste portion to be detected on the solid state drive corresponding to each item of pressure distribution data; Performing digital twin simulation on the solder paste portion to be detected on the solid-state hard disk according to the morphological feedback characteristics of each item of the pressure distribution data, so as to obtain a digital solder paste model of the solder paste portion corresponding to each item of the pressure distribution data; Sorting each of the digital solder paste models according to the test acquisition order of each of the pressure distribution data to obtain a solder paste simulation sequence obtained by sorting each of the digital solder paste models, and extracting defect features of each of the digital solder paste models in the solder paste simulation sequence to obtain solder paste defect features of each of the digital solder paste models in the solder paste simulation sequence; Based on the arrangement order of each digital solder paste model in the solder paste simulation sequence, performing a solder paste morphology change tendency analysis of each digital solder paste model in a physical contact test, and performing a theoretical state analysis of the digital solder paste model of a subsequent arrangement order on each digital solder paste model in the solder paste simulation sequence according to the analysis result, to obtain a theoretical simulation sequence composed of a plurality of theoretical solder paste models; The theoretical simulation sequence and the solder paste simulation sequence are matched and verified to obtain the confidence and preservation degree of the solder paste defect characteristics of each digital solder paste model in the solder paste simulation sequence, and the solid-state hard disk state characteristics of the solder paste part to be detected on the solid-state hard disk are obtained by performing time-series weight superposition and threshold judgment on the confidence and preservation degree of the solder paste defect characteristics of each digital solder paste model in the solder paste simulation sequence.

8. The solid state drive package pad control method according to claim 1, characterized in that: The step of synchronously driving the scraper device to control the coating of the solder paste of the solid state hard disk according to the state characteristics of the solid state hard disk includes: Acquiring performance information of the scraper device, and analyzing the application mode of the state characteristics of the solid state hard disk according to the performance information of the scraper device, so as to obtain the application mode of the scraper device corresponding to the state characteristics of the solid state hard disk; The performance information is specifically executed through parameter analysis according to the application mode to obtain the working parameters of the scraper device, and the scraper device is driven according to the working parameters to achieve control over the coating of the solder paste of the solid state drive.

9. A solid state hard disk package pad control device, characterized in that: A solid state hard disk package pad control method for implementing any one of claims 1 to 8, comprising: An information acquisition module, used to acquire the packaging design information and packaging execution plan of the solid state drive; A visual inspection module, used to perform real-time inspection of the appearance of the solid-state hard disk by machine vision technology to obtain visual inspection features of the solid-state hard disk; An information analysis module, configured to perform information analysis of a packaging execution step on the visual inspection feature according to the packaging design information and the packaging execution scheme of the solid state drive, so as to obtain the packaging execution step of the solid state drive at a current moment and step execution information of the packaging execution step; A scheme analysis module, used for performing a detection scheme analysis on the packaging execution steps and step execution information of the solid state hard disk at the current moment according to the performance information of the physical contact detection device arranged on the scraper device, so as to obtain a detection scheme of the physical contact detection device; A contact detection module, configured to drive the physical contact detection device to perform physical contact detection on the solid state drive according to the detection scheme, so as to obtain a contact detection feature of the solid state drive corresponding to the detection scheme; The coating control module is used to perform state feedback analysis of the solid-state hard disk on the contact detection feature to obtain the solid-state hard disk state feature corresponding to the contact detection feature, and synchronously drive the scraper device to control the coating of the solder paste of the solid-state hard disk according to the solid-state hard disk state feature.

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