A mold grinding device with multi-angle precision grinding function

By introducing a detection mechanism into the mold grinding equipment, the depth position of the grinding mechanism is automatically adjusted, and the problem of low grinding efficiency of mold cavity in the prior art is solved, and efficient multi-angle mold cavity grinding is achieved.

CN119871156BActive Publication Date: 2025-07-04SUZHOU HAOJUN AUTOMATION EQUIP TECH CO LTD
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Patent Information

Application Number
CN202510314719.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-03-18
Publication Date
2025-07-04
Estimated Expiration
2045-03-18

AI Technical Summary

Technical Problem

When existing mold grinding equipment grinding the inside of the mold cavity with step surfaces, it is necessary to first check the cavity depth and then adjust the position of the grinding head. The process is complicated and the grinding efficiency is low.

Method used

The mold grinding equipment including a frame, clamping mechanism, moving mechanism, grinding mechanism and testing mechanism is adopted to judge the depth of the mold cavity through the testing mechanism, and automatically adjust the depth position of the grinding mechanism to achieve all-round grinding.

Benefits of technology

It improves the efficiency of mold cavity polishing, realizes multi-angle polishing, and simplifies the operation process.

✦ Generated by Eureka AI based on patent content.

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    Figure CN119871156B_ABST
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Abstract

The present invention discloses a mold grinding device with multi-angle precision grinding function, which relates to the technical field of grinding. The mold grinding device includes a frame, a clamping mechanism, a moving mechanism, a grinding mechanism and a detection mechanism. The clamping mechanism is fixedly connected to the frame and is used for clamping the mold. The moving mechanism is slidably connected to the frame and is used for driving the grinding mechanism to move. The grinding mechanism is fixedly connected to the moving mechanism. The detection mechanism is fixedly connected to the grinding mechanism and is used for detecting the cavity depth of the mold. The moving mechanism can drive the grinding mechanism to sweep across the position of the mold to be ground along a certain trajectory, so as to grind the mold. However, the cavity depth of the mold is inconsistent, and there are stepped surfaces with different depths. By judging the depth of different positions of the mold cavity through the detection mechanism, the depth position of the grinding mechanism is adjusted to perform all-round grinding on the cavity of the mold.
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Description

Technical Field

[0001] The invention relates to the technical field of grinding, in particular to a mold grinding device with a multi-angle fine grinding function. Background Art

[0002] Grinding and polishing is a very important step in the mold making process. The surface roughness of the mold cavity is directly related to the surface finish of the injection molded product. It can also improve the corrosion resistance and wear resistance of the material surface, and facilitate subsequent injection molding processing, such as making plastic products easy to demold and reducing the production injection molding cycle. Therefore, with the increase in the requirements for the smoothness of the appearance of injection molded products, the requirements for mold grinding and polishing are also higher.

[0003] However, when existing mold grinding and polishing equipment is grinding the inside of a mold cavity with a stepped surface, it is necessary to first detect the depth of the cavity and then adjust the position of the grinding head. The process is complicated and the grinding efficiency is low. Summary of the invention

[0004] The purpose of the present invention is to provide a mold grinding device with a multi-angle fine grinding function to solve the problems raised in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: the mold grinding equipment includes a frame, a clamping mechanism, a moving mechanism, a grinding mechanism and a detection mechanism, the clamping mechanism is tightly connected to the frame, the clamping mechanism is used to clamp the mold, the moving mechanism is slidably connected to the frame, the moving mechanism is used to drive the grinding mechanism to move, the grinding mechanism is tightly connected to the moving mechanism, the detection mechanism is tightly connected to the grinding mechanism, and the detection mechanism is used to detect the cavity depth of the mold.

[0006] The present invention is used for grinding the cavity of a mold, and the frame is used for providing a stable working environment for each mechanism. First, the mold to be ground is fixed on the frame by a clamping mechanism to prevent the mold body from shaking during the grinding process, and then the moving mechanism is started to drive the grinding mechanism to the position on the mold that needs to be ground. The moving mechanism can drive the grinding mechanism to sweep along a certain trajectory to the position of the mold that needs to be ground, thereby grinding the mold. However, the depth of the mold cavity is inconsistent, and there are step surfaces of different depths. The depth of different positions of the mold cavity is judged by a detection mechanism to adjust the depth position of the grinding mechanism, and the mold cavity is ground in all directions.

[0007] Furthermore, the moving mechanism includes a gantry, an electric slide, a rotating table and an adjusting electric cylinder. The frame is provided with a guide rail, the gantry is slidably connected to the guide rail, the gantry is provided with a guide section, the electric slide is slidably connected to the guide section, the rotating table is tightly connected to the electric slide, the output end of the rotating table is transmission connected to the adjusting electric cylinder, and the output end of the adjusting electric cylinder is transmission connected to the grinding mechanism.

[0008] The electric slide tables on the gantry and the guiding section form a two-axis moving platform, which drives the grinding mechanism to sweep along a certain trajectory over the positions of the mold that need to be ground, so as to grind the mold. The rotating table is used to adjust the grinding angle of the grinding mechanism to achieve multi-angle grinding. The adjusting cylinder is used to adjust the height of the grinding mechanism. Before grinding, the grinding mechanism is first moved to the upper surface of the mold by the adjusting cylinder, and the upper surface of the mold is used as the grinding reference surface. Then, the detection mechanism is used to control the depth of the grinding mechanism extending into the mold cavity to grind the inside of the mold cavity.

[0009] Further, the grinding mechanism includes a connecting piece, an adjusting component, a grinding motor and a grinding head. The connecting piece is fixedly connected to the output end of the adjusting cylinder. One end of the adjusting component is fixedly connected to the connecting piece, and the other end of the adjusting component is fixedly connected to the grinding motor. The adjusting component is used to adjust the position of the grinding motor. The output end of the grinding motor is drivingly connected to the grinding head.

[0010] The connecting piece is used to connect the adjusting cylinder and the adjusting component. The adjusting component is used to adjust the height position of the grinding motor and the mold. The grinding motor is used to output torque to drive the grinding head to rotate, and the rotating grinding head is used to grind the surface of the mold cavity.

[0011] Further, the detection mechanism includes a laser source, a movable component, a rotating rod, a telescopic rod and a linkage component. The laser source is fixedly connected to the connecting piece. The output end of the laser source faces the mold. The movable component is fixedly connected to the connecting piece. The movable component is located at one end of the connecting piece away from the laser source. The movable component is used to receive the light reflected from the laser source irradiating the surface of the mold. A number of groups of movable components are arranged on the connecting piece. The number of movable components abuts against the rotating rod. The rotating rod is hinged to the connecting piece. One end of the telescopic rod is fixedly connected to the rotating rod, and the other end of the telescopic rod is hinged to the linkage component. The linkage component is used to judge the depth of the mold cavity.

[0012] When the grinding head and the upper surface of the mold are in the same plane, that is, when the grinding mechanism is at the grinding reference surface, the detection mechanism is started to detect the depth of the mold cavity. The laser source is arranged obliquely, so that the light emitted from the laser source will be reflected to the surface of the movable component when it irradiates the surface of the mold cavity; and according to the principle of refraction of light, the deeper the depth of the cavity, the farther the position of the movable component irradiated by the reflected light is from the laser source. The irradiated movable component can drive the rotating rod to deflect upward along the hinge point, thereby driving the telescopic rod to deflect downward, and further driving the linkage component to act. By detecting the action of the linkage component, the depth of the mold cavity can be judged.

[0013] Further, the movable component includes a photoresistor, a first electromagnet, a first repulsive magnet, and a movable rod. The photoresistor is fixedly connected to the connecting member, and the detection end of the photoresistor faces the mold. The connecting member is provided with a movable groove, the first electromagnet is fixedly connected to the movable groove, the first electromagnet is electrically connected to the photoresistor, the first repulsive magnet is slidably connected to the movable groove, the opposite ends of the first repulsive magnet and the first electromagnet are like poles, one end of the movable rod is fixedly connected to the first repulsive magnet, and the other end of the movable rod passes through the connecting member and abuts against the rotating rod.

[0014] When not detected, the movable rod supports the rotating rod, and the rotating rod is in a horizontal state; when the reflected light irradiates a certain group of several movable components, the photoresistor in this group of movable components irradiates the light, the resistance value decreases, and the current transmitted to the first electromagnet increases. Under the action of the magnetic force, it will push the first repulsive magnet to move upward along the movable groove, thereby driving the movable rod to move upward, and then driving the rotating rod in contact with the movable rod to deflect upward. Since the upward movement distance of the movable rod is certain, the greater the distance from the laser source, the greater the upward deflection angle of the rotating rod driven by the movable component, and the greater the deflection angle of the telescopic rod, that is, the deeper the cavity depth of the mold, the greater the deflection angle of the telescopic rod.

[0015] Further, the linkage component includes a guide block, an iron core, a second repulsive magnet, and a piezoresistor. The connecting member is provided with a guide groove and a detection groove. The guide block is slidably connected to the guide groove, the telescopic rod is hinged to the guide block, the iron core is fixedly connected to the guide block, the piezoresistor is fixedly connected to the inner wall of the detection groove, the second repulsive magnet abuts against the detection end of the piezoresistor, a coil is wound around the detection groove, and the iron core is inserted into the coil to form a second electromagnet. The opposite ends of the second electromagnet and the second repulsive magnet are like poles, and the piezoresistor is electrically connected to the adjustment component.

[0016] The greater the pressure received by the piezoresistor, the smaller the resistance value; and the deeper the cavity depth of the mold, the greater the deflection angle of the telescopic rod, the longer the sliding distance of the guide block along the guide groove, the longer the distance that the iron core is inserted into the coil, the stronger the magnetic force of the second electromagnet composed of the coil and the iron core, the greater the repulsive force on the second repulsive magnet, the greater the pressure transmitted to the piezoresistor, and the smaller the resistance value of the piezoresistor; that is, the deeper the cavity depth of the mold, the smaller the resistance value of the piezoresistor.

[0017] Further, the adjustment component includes a fixed member, an adjustment electromagnet, a movable electromagnet, a slider, a connecting rod, and a support spring. The fixed member is fixedly connected to the connecting member, the adjustment electromagnet is fixedly connected to the inner cavity of the fixed member, the movable electromagnet is fixedly connected to the slider, the opposite ends of the adjustment electromagnet and the movable electromagnet are like poles, the adjustment electromagnet and the movable electromagnet are electrically connected to the piezoresistor, the slider is slidably connected to the inner cavity of the fixed member, one end of the connecting rod is fixedly connected to the slider, the other end of the connecting rod is fixedly connected to the grinding motor, and the support spring is sleeved on the connecting rod.

[0018] The fixing member is fixed on the connecting member, providing an installation basis for the adjusting assembly. The adjusting electromagnet, the movable electromagnet and the varistor form a circuit. Since the deeper the cavity depth of the mold, the smaller the resistance value of the varistor, the deeper the cavity depth of the mold, the greater the current transmitted to the adjusting electromagnet and the movable electromagnet, the greater the repulsive force received by the movable electromagnet, driving the slider to slide downward, the supporting spring is compressed under force, and the length of the connecting rod extending out of the fixing member becomes longer, and the depth of the grinding motor extending into the mold cavity is deeper; that is, it realizes automatically adjusting the distance that the grinding motor extends into the mold according to the cavity depth of the mold, thereby improving the grinding efficiency.

[0019] Furthermore, a vertical groove is provided in the inner cavity of the fixing member, and the slider is slidably connected to the vertical groove.

[0020] In order to prevent the slider from rotating relative to the inner cavity of the fixing member, the moving direction of the slider is restricted by the vertical groove, and the slider can only move up and down along the vertical groove.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. The gantry and the electric slide table on the guiding section form a two-axis moving platform, thereby driving the grinding mechanism to sweep across the position of the mold to be ground along a certain trajectory to grind the mold. The rotating table is used to adjust the grinding angle of the grinding mechanism, realizing multi-angle grinding.

[0023] 2. When detecting the depth of the mold cavity, the light emitted from the laser source is reflected onto the surface of the movable component when it irradiates the surface of the mold cavity; the deeper the depth of the cavity, the farther the position of the movable component irradiated by the reflected light is from the laser source. When the reflected light irradiates a certain group among several movable components, the photoresistor in this group of movable components is irradiated by the light, its resistance value decreases, and the current transmitted to the first electromagnet increases. Under the action of the magnetic force, it will push the first repelling magnet to move upward along the movable slot, thereby driving the movable rod to move upward, and further driving the rotating rod in contact with the movable rod to deflect upward. Since the upward movement distance of the movable rod is fixed, the farther the movable component is from the laser source, the larger the angle by which the rotating rod is pushed to deflect upward, and the larger the deflection angle of the telescopic rod. The longer the sliding distance of the guiding block along the guiding slot, the longer the distance that the iron core is inserted into the coil, the stronger the magnetic force of the second electromagnet composed of the coil and the iron core, the greater the repulsive force on the second repelling magnet, the greater the pressure transmitted to the varistor, the smaller the resistance value of the varistor, the greater the current transmitted to the adjusting electromagnet and the movable electromagnet, the greater the repulsive force received by the movable electromagnet, driving the slider to slide downward, the supporting spring is compressed under force, and the length of the connecting rod extending out of the fixing member becomes longer, and the depth of the grinding motor extending into the mold cavity is deeper; that is, it realizes automatically adjusting the distance that the grinding motor extends into the mold according to the depth of the mold cavity, thereby automatically adjusting the position of the grinding head during grinding and improving the grinding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 is a schematic diagram of the moving mechanism of the present invention;

[0026] Figure 3 is a schematic diagram of the grinding mechanism of the present invention;

[0027] Figure 4 is Figure 3 a partial enlarged view of A in

[0028] Figure 5 is a schematic diagram of the detection mechanism of the present invention;

[0029] Figure 6 is a partial cross-sectional view of the detection mechanism;

[0030] Figure 7 is Figure 6 a partial enlarged view of B in

[0031] Figure 8 is Figure 6 a partial enlarged view of C in

[0032] Figure 9 is a schematic diagram of the operation of the detection mechanism;

[0033] Figure 10 Circuit diagram of the adjustment component and the movable component.

[0034] In the figure: 1 - frame, 11 - guide rail, 2 - clamping mechanism, 3 - moving mechanism, 31 - gantry, 311 - guiding section, 32 - electric slide, 33 - rotating table, 34 - adjusting electric cylinder, 4 - grinding mechanism, 41 - connecting piece, 411 - movable slot, 412 - guiding slot, 413 - detecting slot, 42 - adjustment component, 421 - fixing piece, 4211 - vertical slot, 422 - adjusting electromagnet, 423 - movable electromagnet, 424 - slider, 425 - connecting rod, 426 - supporting spring, 43 - grinding motor, 44 - grinding head, 5 - detecting mechanism, 51 - laser source, 52 - movable component, 521 - photoresistor, 522 - first electromagnet, 523 - first repelling magnet, 524 - movable rod, 53 - rotating rod, 54 - telescopic rod, 55 - linkage component, 551 - guiding block, 552 - iron core, 553 - second repelling magnet, 554 - piezoresistor, 555 - coil. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Embodiment: As Figures 1 - 10 shown, the present invention provides a technical solution for a mold grinding device with multi-angle precision grinding function. The mold grinding device includes a frame 1, a clamping mechanism 2, a moving mechanism 3, a grinding mechanism 4 and a detecting mechanism 5. The clamping mechanism 2 is fixedly connected to the frame 1 and is used for clamping the mold. The moving mechanism 3 is slidably connected to the frame 1 and is used for driving the grinding mechanism 4 to move. The grinding mechanism 4 is fixedly connected to the moving mechanism 3. The detecting mechanism 5 is fixedly connected to the grinding mechanism 4 and is used for detecting the cavity depth of the mold.

[0037] The present invention is used for polishing the cavity of a mold. The frame 1 provides a stable working environment for each mechanism. First, the mold to be polished is fixed on the frame 1 through the clamping mechanism 2 to prevent the mold body from shaking during the polishing process. Then, the moving mechanism 3 is started to drive the polishing mechanism 4 to the position on the mold that needs to be polished. The moving mechanism 3 can drive the polishing mechanism 4 to sweep across the position on the mold that needs to be polished along a certain trajectory, so as to polish the mold. However, the depths of the cavities of the mold are inconsistent, with stepped surfaces of different depths. The detection mechanism 5 is used to judge the depths of different positions of the mold cavity, and then the depth position of the polishing mechanism 4 is adjusted to perform all-round polishing on the cavity of the mold.

[0038] The moving mechanism 3 includes a gantry 31, an electric slide 32, a rotary table 33 and an adjusting electric cylinder 34. A guide rail 11 is provided on the frame 1. The gantry 31 is slidably connected to the guide rail 11. A guiding section 311 is provided on the gantry 31. The electric slide 32 is slidably connected to the guiding section 311. The rotary table 33 is fixedly connected to the electric slide 32. The output end of the rotary table 33 is drivingly connected to the adjusting electric cylinder 34. The output end of the adjusting electric cylinder 34 is drivingly connected to the polishing mechanism 4.

[0039] The electric slide 32 on the gantry 31 and the guiding section 311 form a two-axis moving platform, which drives the polishing mechanism 4 to sweep across the position on the mold that needs to be polished along a certain trajectory to polish the mold. The rotary table 33 is used to adjust the polishing angle of the polishing mechanism 4 to achieve multi-angle polishing. The adjusting electric cylinder 34 is used to adjust the height of the polishing mechanism 4. Before polishing, the polishing mechanism 4 is first moved to the upper surface of the mold through the adjusting electric cylinder 34, and the upper surface of the mold is used as the polishing reference surface. Then, the detection mechanism 5 is used to control the depth of the polishing mechanism 4 extending into the mold cavity to polish the inside of the mold cavity.

[0040] The polishing mechanism 4 includes a connecting piece 41, an adjusting component 42, a polishing motor 43 and a polishing head 44. The connecting piece 41 is fixedly connected to the output end of the adjusting electric cylinder 34. One end of the adjusting component 42 is fixedly connected to the connecting piece 41. The other end of the adjusting component 42 is fixedly connected to the polishing motor 43. The adjusting component 42 is used to adjust the position of the polishing motor 43. The output end of the polishing motor 43 is drivingly connected to the polishing head 44.

[0041] The connecting piece 41 is used to connect the adjusting electric cylinder 34 and the adjusting component 42. The adjusting component 42 is used to adjust the height position of the polishing motor 43 and the mold. The polishing motor 43 is used to output torque to drive the polishing head 44 to rotate, and the surface of the mold cavity is polished by the rotating polishing head 44.

[0042] The detection mechanism 5 includes a laser source 51, a movable component 52, a rotating rod 53, a telescopic rod 54, and a linkage component 55. The laser source 51 is fixedly connected to the connecting component 41, and the output end of the laser source 51 faces the mold. The movable component 52 is fixedly connected to the connecting component 41, and the movable component 52 is located at one end of the connecting component 41 away from the laser source 51. The movable component 52 is used to receive the light reflected from the surface of the mold irradiated by the laser source 51. A plurality of groups of the movable components 52 are arranged on the connecting component 41. A plurality of movable components 52 are in contact with the rotating rod 53. The rotating rod 53 is hinged to the connecting component 41. One end of the telescopic rod 54 is fixedly connected to the rotating rod 53, and the other end of the telescopic rod 54 is hinged to the linkage component 55. The linkage component 55 is used to judge the cavity depth of the mold.

[0043] When the grinding head 44 is on the same plane as the upper surface of the mold, that is, when the grinding mechanism 4 is at the grinding reference plane, the detection mechanism 5 is started to detect the cavity depth of the mold. The laser source 51 is inclinedly arranged, so that the light emitted from the laser source 51 will be reflected onto the surface of the movable component 52 when it irradiates the cavity surface of the mold; and according to the principle of light refraction, the deeper the cavity depth, the farther the position of the movable component 52 irradiated by the reflected light is from the laser source 51. The irradiated movable component 52 can drive the rotating rod 53 to deflect upward along the hinge point, thereby driving the telescopic rod 54 to deflect downward, and further driving the linkage component 55 to act. By detecting the action of the linkage component 55, the cavity depth of the mold can be judged.

[0044] The movable component 52 includes a photosensitive resistor 521, a first electromagnet 522, a first repelling magnet 523, and a movable rod 524. The photosensitive resistor 521 is fixedly connected to the connecting component 41, and the detection end of the photosensitive resistor 521 faces the mold. An activity groove 411 is provided on the connecting component 41. The first electromagnet 522 is fixedly connected to the activity groove 411. The first electromagnet 522 is electrically connected to the photosensitive resistor 521. The first repelling magnet 523 is slidably connected to the activity groove 411. The opposite ends of the first repelling magnet 523 and the first electromagnet 522 are like magnetic poles. One end of the movable rod 524 is fixedly connected to the first repelling magnet 523, and the other end of the movable rod 524 passes through the connecting component 41 and is in contact with the rotating rod 53.

[0045] When not detected, the movable rod 524 supports the rotating rod 53, and the rotating rod 53 is in a horizontal state; when the reflected light irradiates a certain group of the plurality of movable components 52, the photoresistor 521 in this group of movable components 52 irradiates the light, the resistance value decreases, and the current transmitted to the first electromagnet 522 increases. Under the action of the magnetic force, it will push the first repulsive magnet 523 to move upward along the movable groove 411, thereby driving the movable rod 524 to move upward, and further driving the rotating rod 53 in contact with the movable rod 524 to deflect upward. Since the upward movement distance of the movable rod 524 is certain, the farther the movable component 52 is from the laser source 51, the greater the upward deflection angle of the rotating rod 53 is, and the greater the deflection angle of the telescopic rod 54 is, that is, the deeper the cavity depth of the mold is, the greater the deflection angle of the telescopic rod 54 is.

[0046] The linkage component 55 includes a guide block 551, an iron core 552, a second repulsive magnet 553 and a varistor 554. The connecting member 41 is provided with a guide groove 412 and a detection groove 413. The guide block 551 is slidably connected to the guide groove 412. The telescopic rod 54 is hinged to the guide block 551. The iron core 552 is fixedly connected to the guide block 551. The varistor 554 is fixedly connected to the inner wall of the detection groove 413. The second repulsive magnet 553 abuts against the detection end of the varistor 554. A coil 555 is wound around the detection groove 413. The iron core 552 is inserted into the coil 555 to form a second electromagnet. The opposite ends of the second electromagnet and the second repulsive magnet 553 are the same-named magnetic poles. The varistor 554 is electrically connected to the adjusting component 42.

[0047] The greater the pressure received by the varistor 554, the smaller the resistance value; and the deeper the cavity depth of the mold is, the greater the deflection angle of the telescopic rod 54 is, the longer the sliding distance of the guide block 551 along the guide groove 412 is, the longer the insertion distance of the iron core 552 into the coil 555 is, the stronger the magnetic force of the second electromagnet formed by the coil 555 and the iron core 552 is, the greater the repulsive force on the second repulsive magnet 553 is, the greater the pressure transmitted to the varistor 554 is, and the smaller the resistance value of the varistor 554 is; that is, the deeper the cavity depth of the mold is, the smaller the resistance value of the varistor 554 is.

[0048] The adjusting assembly 42 includes a fixing member 421, an adjusting electromagnet 422, a movable electromagnet 423, a slider 424, a connecting rod 425, and a support spring 426. The fixing member 421 is fixedly connected to the connecting member 41. The adjusting electromagnet 422 is fixedly connected to the inner cavity of the fixing member 421. The movable electromagnet 423 is fixedly connected to the slider 424. The facing ends of the movable electromagnet 423 and the adjusting electromagnet 422 are like magnetic poles. The adjusting electromagnet 422 and the movable electromagnet 423 are electrically connected to the varistor 554. The slider 424 is slidably connected to the inner cavity of the fixing member 421. One end of the connecting rod 425 is fixedly connected to the slider 424, and the other end of the connecting rod 425 is fixedly connected to the grinding motor 43. The support spring 426 is sleeved on the connecting rod 425.

[0049] The fixing member 421 is fixed on the connecting member 41, providing an installation basis for the adjusting assembly 42. The adjusting electromagnet 422, the movable electromagnet 423, and the varistor 554 form a circuit. Since the deeper the cavity depth of the mold, the smaller the resistance value of the varistor 554, the deeper the cavity depth of the mold, the greater the current transmitted to the adjusting electromagnet 422 and the movable electromagnet 423, the greater the repulsive force received by the movable electromagnet 423, driving the slider 424 to slide downward, the support spring 426 is compressed under force, and the length of the connecting rod 425 extending out of the fixing member 421 becomes longer, and the depth of the grinding motor 43 extending into the mold cavity is deeper; that is, it realizes automatically adjusting the distance that the grinding motor 43 extends into the mold according to the cavity depth of the mold, thereby improving the grinding efficiency.

[0050] The inner cavity of the fixing member 421 is provided with a vertical groove 4211, and the slider 424 is slidably connected to the vertical groove 4211.

[0051] In order to prevent the slider 424 from rotating relative to the inner cavity of the fixing member 421, the moving direction of the slider 424 is restricted by the vertical groove 4211, and the slider 424 can only move up and down along the vertical groove 4211.

[0052] Working principle of the present invention: When detecting the depth of the mold cavity, the light emitted from the laser source 51 is reflected onto the surface of the movable assembly 52 when it irradiates the surface of the mold cavity; and according to the principle of light refraction, the deeper the depth of the cavity, the farther the position of the movable assembly 52 irradiated by the reflected light is from the laser source 51. When the reflected light irradiates a certain group of the plurality of movable assemblies 52, the photoresistor 521 in this group of movable assemblies 52 is irradiated by light, its resistance value decreases, and the current transmitted to the first electromagnet 522 increases. Under the action of the magnetic force, it will push the first repulsive magnet 523 to move upward along the movable groove 411, thereby driving the movable rod 524 to move upward, and further driving the rotating rod 53 in contact with the movable rod 524 to deflect upward. Since the upward movement distance of the movable rod 524 is certain, the farther the movable assembly 52 is from the laser source 51, the greater the upward deflection angle of the rotating rod 53, and the greater the deflection angle of the telescopic rod 54. That is, the deeper the depth of the mold cavity, the greater the deflection angle of the telescopic rod 54, the longer the distance that the guide block 551 slides downward along the guide groove 412, and the longer the distance that the iron core 552 is inserted into the coil 555. The stronger the magnetic force of the second electromagnet composed of the coil 555 and the iron core 552, the greater the repulsive force on the second repulsive magnet 553, the greater the pressure transmitted to the varistor 554, the smaller the resistance value of the varistor 554, and the greater the current transmitted to the adjusting electromagnet 422 and the movable electromagnet 423. The greater the repulsive force on the movable electromagnet 423, driving the slider 424 to slide downward, the support spring 426 is compressed by force, and the length of the connecting rod 425 extending out of the fixing member 421 becomes longer, and the depth of the grinding motor 43 extending into the mold cavity is deeper; that is, it realizes automatically adjusting the distance that the grinding motor 43 extends into the mold according to the depth of the mold cavity.

[0053] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A mold grinding device with multi-angle precision grinding function, characterized in that: The mold grinding equipment includes a frame (1), a clamping mechanism (2), a moving mechanism (3), a grinding mechanism (4), and a detection mechanism (5). The clamping mechanism (2) is fixedly connected to the frame (1) and is used for clamping the mold. The moving mechanism (3) is slidably connected to the frame (1) and is used to drive the grinding mechanism (4) to move. The grinding mechanism (4) is fixedly connected to the moving mechanism (3), and the detection mechanism (5) is fixedly connected to the grinding mechanism (4). The detection mechanism (5) is used to detect the cavity depth of the mold; The moving mechanism (3) includes an adjusting electric cylinder (34), and the adjusting electric cylinder (34) is used to adjust the height of the grinding mechanism (4); The grinding mechanism (4) includes a connecting member (41); The detection mechanism (5) includes a telescopic rod (54) and a linkage assembly (55), and the linkage assembly (55) is used to judge the cavity depth of the mold; The linkage assembly (55) includes a guide block (551), an iron core (552), a second repulsive magnet (553), and a varistor (554). A guide groove (412) and a detection groove (413) are provided on the connecting member (41). The guide block (551) is slidably connected to the guide groove (412). The telescopic rod (54) is hinged to the guide block (551). The iron core (552) is fixedly connected to the guide block (551). The varistor (554) is fixedly connected to the inner wall of the detection groove (413). The second repulsive magnet (553) abuts against the detection end of the varistor (554). A coil (555) is wound around the detection groove (413). The iron core (552) is inserted into the coil (555) to form a second electromagnet. The opposite ends of the second electromagnet and the second repulsive magnet (553) are like-named magnetic poles. The varistor (554) is electrically connected to the adjusting assembly (42); The detection mechanism (5) further includes a laser source (51), a movable assembly (52), and a rotating rod (53). The laser source (51) is fixedly connected to the connecting member (41), and the output end of the laser source (51) faces the mold. The movable assembly (52) is fixedly connected to the connecting member (41). The movable assembly (52) is located at one end of the connecting member (41) away from the laser source (51) and is used to receive the light reflected from the surface of the mold irradiated by the laser source (51). Several groups of the movable assemblies (52) are arranged on the connecting member (41). Several of the movable assemblies (52) abut against the rotating rod (53). The rotating rod (53) is hinged to the connecting member (41). One end of the telescopic rod (54) is fixedly connected to the rotating rod (53), and the other end of the telescopic rod (54) is hinged to the linkage assembly (55).

2. The mold grinding equipment with multi-angle fine grinding function according to claim 1, characterized in that: The moving mechanism (3) further includes a gantry (31), an electric slide table (32) and a rotary table (33). A guide rail (11) is provided on the frame (1). The gantry (31) is slidably connected to the guide rail (11). A guiding section (311) is provided on the gantry (31). The electric slide table (32) is slidably connected to the guiding section (311). The rotary table (33) is fixedly connected to the electric slide table (32). The output end of the rotary table (33) is drivingly connected to an adjusting electric cylinder (34). The output end of the adjusting electric cylinder (34) is drivingly connected to a grinding mechanism (4).

3. The mold grinding equipment with multi-angle precision grinding function according to claim 2, characterized in that: The grinding mechanism (4) further includes an adjusting assembly (42), a grinding motor (43) and a grinding head (44). The connecting member (41) is fixedly connected to the output end of the adjusting electric cylinder (34). One end of the adjusting assembly (42) is fixedly connected to the connecting member (41). The other end of the adjusting assembly (42) is fixedly connected to the grinding motor (43). The adjusting assembly (42) is used to adjust the position of the grinding motor (43). The output end of the grinding motor (43) is drivingly connected to the grinding head (44).

4. A mold grinding device with multi-angle fine grinding function according to claim 1, characterized in that: The movable assembly (52) includes a photoresistor (521), a first electromagnet (522), a first repelling magnet (523) and a movable rod (524). The photoresistor (521) is fixedly connected to the connecting member (41). The detection end of the photoresistor (521) faces the mold. An activity groove (411) is provided on the connecting member (41). The first electromagnet (522) is fixedly connected to the activity groove (411). The first electromagnet (522) is electrically connected to the photoresistor (521). The first repelling magnet (523) is slidably connected to the activity groove (411). The facing ends of the first repelling magnet (523) and the first electromagnet (522) are like magnetic poles. One end of the movable rod (524) is fixedly connected to the first repelling magnet (523). The other end of the movable rod (524) passes through the connecting member (41) and abuts against the rotating rod (53).

5. A mold grinding device with multi-angle fine grinding function according to claim 1, characterized in that: The adjusting assembly (42) includes a fixing member (421), an adjusting electromagnet (422), a movable electromagnet (423), a slider (424), a connecting rod (425) and a supporting spring (426). The fixing member (421) is fixedly connected to the connecting member (41). The adjusting electromagnet (422) is fixedly connected to the inner cavity of the fixing member (421). The movable electromagnet (423) is fixedly connected to the slider (424). The facing ends of the movable electromagnet (423) and the adjusting electromagnet (422) are like magnetic poles. The adjusting electromagnet (422) and the movable electromagnet (423) are electrically connected to a piezoresistor (554). The slider (424) is slidably connected to the inner cavity of the fixing member (421). One end of the connecting rod (425) is fixedly connected to the slider (424). The other end of the connecting rod (425) is fixedly connected to the grinding motor (43). The supporting spring (426) is sleeved on the connecting rod (425).

6. The mold grinding equipment with multi-angle fine grinding function according to claim 5, characterized in that: The inner cavity of the fixing member (421) is provided with a vertical groove (4211), and the slider (424) is slidably connected to the vertical groove (4211).

Citation Information

Patent Citations

  • Hardware fitting polishing device

    CN218312665U