Full-automatic film sticking machine and defect identification method thereof

Abstract

The invention relates to the technical field of automatic production equipment, in particular to a full-automatic film sticking machine which comprises a machine body, the machine body is provided with a feeding module, a film sticking assembly, a recognition assembly, a material supplementing assembly, a material disc moving platform, a control system and a discharging module, the feeding module is arranged on one side of the machine body, the discharging module is arranged on the other side of the machine body, the film sticking assembly can stick a film to a product, and the recognition assembly can recognize the film sticking assembly. The full-automatic film pasting machine has the beneficial effects that by integrating product feeding, film tearing, film pasting, film supplementing and pasting and discharging, full automation is achieved, the full-automatic film pasting machine is high in pasting speed and precision, the product film pasting and taking and placing tasks can be efficiently and accurately completed, pre-inspection before pasting is conducted, the production efficiency is improved, and the production cost is reduced. Whether products exist or not is detected, foreign matter, dust, scratches and the like on the surfaces of the products are detected, re-inspection is conducted after the products are attached, the attaching precision, bubbles, foreign matter and the like are detected, and the product offline rate is 100% through pre-inspection and re-inspection.

Description

Technical Field

[0001] The present invention relates to the technical field of automated production equipment, and in particular to a fully automatic film laminating machine and a defect recognition method thereof. Background Art

[0002] Fully automatic film laminating machines are widely used in electronic manufacturing and semiconductor production, such as mobile phone screen film laminating and IC chip film laminating. The primary function of IC chip film laminating is to effectively prevent the chip from being scratched by hard objects during use, thereby significantly extending the service life of the chip. At the same time, it can also prevent oxidation on the chip surface, ensure the stability of chip performance, and achieve long-term and reliable operation. In addition, the chip protective film can also isolate the damage of environmental factors such as moisture, pollution, and ultraviolet rays, and keep the chip surface clean and safe. This protective film is usually made of high-quality materials such as polyester film, polyurethane film or polycarbonate film, and is tightly attached to the chip surface by adhesive backing, providing it with all-round protection. The workpiece film laminating generally uses the principle of electrostatic adsorption to stick the film on the workpiece. The efficiency of manual film laminating is low and the effect is poor. Therefore, semi-automatic film laminating machines have appeared on the market, but the degree of automation is low, and there are many places that require manual assistance, which increases labor costs. Therefore, a new technical solution should be provided to solve the above problems. Summary of the invention

[0003] In order to solve the deficiencies in the prior art, the present invention provides a fully automatic film laminating machine and a defect identification method thereof.

[0004] The technical solution of the present invention is: The product loading, film tearing, film sticking, film patching and material unloading are integrated together to achieve full automation.

[0005] The present invention provides a fully automatic film laminating machine, comprising a body, wherein the body is provided with a loading module, a film laminating component, an identification component, a material replenishing component, a material tray moving platform, a control system, and a material unloading module.

[0006] The material tray moving platform is connected to the loading module, the film pasting component, the material replenishing component and the unloading module.

[0007] The feeding module includes 5 sub-modules: feeding bin, feeding track, feeding gripper assembly, transfer feeding, and left lifting device. Each module can be controlled and operated separately.

[0008] The film pasting component includes a film transfer and pasting device, a right lifting device, and a feeder.

[0009] After the re-inspection of the products after film application, the refilling component will sort all defective products to the NG area and replenish the good products to ensure that all the products in the tray are good products. This includes two modules: material transfer and unloading, and refilling component.

[0010] Further feeder: the feeder automatically peels off the material film and waits for the suction nozzle to adsorb it. Multiple feeders can be set.

[0011] Furthermore, the loading gripper assembly is fixed on the machine body.

[0012] The identification component includes a pre-check component and a re-check component.

[0013] The further pre-inspection components include an industrial camera and a distance sensor, and the re-inspection component is an industrial camera.

[0014] The method of using the invention is to put a material tray with products into the feed bin, and then transport it to the transfer and loading position through the feed track and the clamping claws, and determine whether the products in the material tray can be pasted with film through the pre-inspection component. The inspected material tray is transported to the film pasting transfer platform through the left lifting device for film pasting, and the film pasting nozzle sucks the film material from the feeder, and attaches it to the product after being guided by the positioning camera. After waiting for the film pasting to be completed, the material tray is transported to the unloading transfer platform through the right lifting device and moved to the replenishing position. The re-inspection component goes to the top of the platform to take pictures for re-inspection to determine whether the film is defective. The defective products are sucked by the replenishing nozzle and placed in the NG area, and then the good products are sucked from the good product area and placed in the vacant position of the material tray. After the material tray is filled, the material tray moving platform moves the material tray to the unloading position, and the material tray is transported to the unloading bin through the unloading clamping claws and the unloading track. After the unloading bin is stacked to the specified number, the equipment reports an error prompting manual removal of the full material tray.

[0015] Bad identification method Step 1: Pre-screening Through distance sensors and industrial cameras for detection, if there is any defect, an alarm will be issued for manual processing.

[0016] Step 2: Re-inspect after application Call the big model through API to automatically determine defects.

[0017] The beneficial effects achieved by the present invention are: The present invention integrates product loading, film tearing, film sticking, film patching and material unloading together to achieve full automation. The present invention has fast sticking speed and high precision, and can efficiently and accurately complete the product sticking and picking and placing tasks. There is a pre-sticking pre-inspection to detect the presence of product, surface foreign matter, dust, scratches, etc., and a post-sticking re-inspection to detect the sticking accuracy, bubbles, foreign matter, etc. The product offline rate is 100% through the pre-inspection and re-inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the internal structure of the present invention; Figure 3 It is a schematic diagram of the feeding gripper assembly and the pre-inspection assembly of the present invention; Figure 4 It is a schematic diagram of the film sticking assembly of the present invention; Figure 5 It is a schematic diagram of the feeding module and the film sticking assembly of the present invention; Figure 6 It is a schematic diagram of the lifting device of the present invention; Figure 7 This is a schematic diagram of the feeding assembly of the present invention; Figure 8 This is a schematic diagram of the blanking module of the present invention; Fig. 9 This is an operating parameter diagram of the device of the present invention.

[0019] In the figure: 1. Body; 2. Loading module; 3. Film sticking assembly; 4. Identification assembly; 5. Replenishing assembly; 6. Tray moving platform; 7. Control system; 8. Unloading module; 201, feeding track; 202, feeding gripper assembly; 2021, tray gripper; 2022, gripper moving device; 203, transfer and feeding; 204, left lifting device; 2041, lifting plate; 205, silo; 301, film transfer and laminating device; 3011, film transfer and laminating device; 3012, film laminating device; 30121, suction nozzle; 30122, rotating shaft; 30123, vacuum generator; 302, right lifting device; 303, feeder; 401, pre-inspection component; 4011, pre-inspection upper camera; 4012, pre-inspection distance sensor; 402, positioning camera; 403, re-inspection component; 501, material suction assembly; 5011, material suction nozzle; 502, NG area; 503, good area; 504, lower camera; 801, unloading track; 802, unloading gripper assembly; 803, unloading bin. DETAILED DESCRIPTION

[0020] To facilitate those skilled in the art to understand the present invention, specific implementations of the present invention are described below with reference to the accompanying drawings.

[0021] The product in this embodiment is an IC chip. The device for placing the IC chip is called a material tray or a tray. The film is divided into film sheets.

[0022] Structure introduction: like Figures 1 to 9 As shown, the present invention provides a fully automatic film laminating machine, including a body 1, the body 1 is provided with a loading module 2, a film laminating component 3, an identification component 4, a feeding component 5, a material tray moving platform 6, a control system 7, and a unloading module 8.

[0023] The loading module 2 is on one side of the fuselage 1 , and the unloading module 8 is on the other side of the fuselage 1 . The film sticking assembly 3 can stick the film onto the product. The material tray moving platform 6 connects the loading module 2 , the film sticking assembly 3 , the material replenishment assembly 5 , and the unloading module 8 .

[0024] The feeding module 2 includes a feeding bin 205, a feeding track 201, a feeding gripper assembly 202, a transfer and feeding 203, and a left lifting device 2045 submodules, each of which can be controlled and operated separately.

[0025] The feed bin 205 is used to place multiple feed trays.

[0026] The loading track 201 automatically separates the trays with loaded products and sends the trays to the position to be clamped to wait for the loading gripper assembly 202 to grab them.

[0027] The left lifting device 204 can be raised and lowered to lift or lower the material tray to the material tray moving platform 6 , and the left lifting device 204 is provided with a lifting plate 2041 .

[0028] The loading gripper assembly 202 module grabs the tray that has been in place on the loading track 201 and moves it to the transfer loading position 203. The loading gripper assembly 202 includes a tray gripper 2021 and a gripper moving device 2022. The gripper moving device 2022 is fixed to the machine body 1 through a fixing block. The gripper moving device 2022 drives the tray gripper 2021 to move forward and backward. The tray gripper 2021 is equipped with a cylinder or a motor, which can move up and down.

[0029] The loading and unloading device 203 is located above the tray moving platform 6. The product is pre-inspected and positioned at this position. The upper camera and distance sensor are moved above the tray under the control of the control system 7 to take pictures, automatically identify and detect the presence of products, surface foreign matter, dust, scratches, etc., and locate the position of each IC chip.

[0030] After the pre-inspection of the left lifting device 204 is completed, the tray moving platform 6 moves the tray to the left lifting device 204, and the left lifting device 204 lifts the tray to a certain height to prepare for film lamination.

[0031] The film sticking assembly 3 includes a film sticking transfer device 301 , a right lifting device 302 , and a feeder 303 .

[0032] The left lifting device 204 and the right lifting device 302 have the same structure, see Figure 6 , different locations.

[0033] The film-sticking device 301 is transferred to apply film to the pre-inspected products in the tray. After the film sticking is completed, the left lifting device 204 descends and the tray is placed on the tray moving platform 6. The tray moving platform 6 moves the tray to the transfer and unloading position. At the same time, the left lifting device 204 lifts up a new tray of IC chips that need to be film-sticked.

[0034] The film transfer and laminating device 301 includes a film transfer device 3011 and a film laminating device 3012 . The film laminating device 3012 includes a suction nozzle 30121 , a rotating shaft 30122 , and a vacuum generator 30123 .

[0035] The vacuum generator 30123 can be in a vacuum state to absorb or put down the membrane. The suction nozzle 30121 is set on the rotating shaft 30122. The rotating shaft 30122 can slightly adjust the angle. The suction nozzle 30121 is adjusted at the same time to align with the IC chip to ensure the accuracy of each attachment.

[0036] The right lifting device 302 rises to lift the material tray on the film-transferring and laminating device 301 and separate it from the film-transferring and laminating device 301, waiting for the material to be unloaded and transferred into place.

[0037] Feeder 303: The feeder automatically peels off the material film and waits for the suction nozzle 30121 to adsorb. In this embodiment, the feeder 303 is two groups.

[0038] The function of the material replenishment component 5 is to re-inspect the products after film pasting, sort all defective products to the NG area 502, replenish the good products, ensure that all the materials in the tray are good products, transfer and unload the materials, and re-inspect them at this station to detect the adhesion accuracy, bubbles, foreign matter, etc.

[0039] The right lifting device 302 descends, and the material tray with IC chips is replaced on the transfer and unloading station. The transfer and unloading tray is moved to the unloading tray position, waiting to be grabbed by the unloading gripper.

[0040] The material replenishing component 5 includes a material suction component 501 , an NG area 502 , a good area 503 , and a lower camera 504 .

[0041] The material suction component 501 re-inspects the products after film application, sorts all defective products to the NG area 502, and after the material trays are fully replenished from the good product area 503, moves to the unloading position to wait for the unloading gripper to grab them.

[0042] The structure and implementation principle of the material suction component 501 are similar to those of the transfer and film laminating device 301 , and is used to suck and place down IC chips. The material suction component 501 is provided with a material suction nozzle 5011 .

[0043] If the re-inspection component 403 finds that the product after film application has a defective IC chip, the right lifting device 302 rises to lift the material tray to the specified position, the suction component 501 sucks the defective IC chip and places it in the defective area, then takes the IC chip from the good area 503, and adjusts the angle at the lower camera 504 position, and puts it in the position of the original defective product to ensure that the entire material tray is a good product. Then the right lifting device 302 descends and places the material tray on the material tray moving platform 6, and the material tray moving platform 6 moves the material tray to the transplanting and unloading position.

[0044] If the suction component 501 fails to suck up the IC chip, the re-inspection component 403 will take photos of the defective area and the good area 503 and transmit them to the control system 7. The control system 7 automatically determines whether there is a shortage of material. If there is a shortage of material, an alarm will be issued for manual processing, otherwise the IC chip will be sucked up again.

[0045] The identification component 4 includes a pre-check component 401, a positioning camera 402 and a re-check component 403. The positioning camera 402 is located at one side of the film pasting device 3012, and can realize the positioning of another IC chip while pasting a film on one IC chip.

[0046] Furthermore, the pre-inspection component 401 includes an industrial camera and a distance sensor, and the re-inspection component 403 is provided with an AI smart camera.

[0047] The unloading module 8 includes a unloading track 801, an unloading gripper assembly 802, and a unloading bin 8033 submodules, each of which can be controlled and operated separately.

[0048] The unloading track 801 cooperates with the unloading bin 803 to automatically stack multiple trays together.

[0049] The method of using the present invention is to put a material tray with products into the feed bin 205, and then transport it to the transfer and loading position 203 through the feed track and the clamping claws, and determine whether the product in the material tray can be film-coated by the pre-inspection component 401. After the inspection, the material tray is transported to the film-coating transfer platform 3011 through the left lifting device 204 for film-coating. The film-coating suction nozzle 30121 sucks the film material from the feeder 303, and adheres it to the product after being guided by the positioning camera 402. After waiting for the film-coating to be completed, the material tray is passed through the right lifting device 302 The tray is transported to the material unloading transfer platform and moved to the refilling position. The re-inspection component 403 goes to the top of the platform to take photos for re-inspection to determine whether the film is defective. The defective products are sucked up by the refilling nozzle 30121 and placed in the NG area 502. Then the good products are sucked from the good area 503 and placed in the empty position of the tray. After the tray is filled, the tray moving platform 6 moves the tray to the unloading position, and the tray is transported to the unloading bin 803 through the unloading clamp and the unloading track 801. After the unloading bin 803 is stacked to the specified number, the equipment reports an error prompting manual removal of the full tray.

[0050] Because the equipment cycle is short, defect identification is the key. The bad identification method is divided into two steps Step 1: Pre-screening The pre-painting distance sensor 4012 and the pre-painting camera 4011 detect whether there are products, foreign matter, dust, scratches, etc. on the surface.

[0051] The distance sensor obtains the distance data of the IC chips in the entire tray and detects defects such as dust, scratches, and distance differences through various algorithms.

[0052] Reference Publication Number: CN 118067024A Technical document on a product warpage detection device and its detection algorithm.

[0053] The pre-inspection camera 4011 takes a picture and transmits it to the control system 7. The control system 7 automatically matches whether the IC chip is good or not according to the parameters set such as foreign matter, dust, scratches, etc.

[0054] Step 2: Re-inspect after application The camera of the re-inspection component 403 is equipped with an AI smart camera, which can call the large model through the API, and the control system 7 automatically determines the defect.

[0055] In this embodiment, the SC6000 series AI smart camera is used. It is developed based on a high-performance embedded platform, has powerful AI capabilities, built-in VM algorithm software, and can freely use 140+ algorithm functions. It has powerful processing capabilities while taking into account high ease of use and strong flexibility. It can be widely used in complex application scenarios such as positioning, measurement, identification, and detection in various industries. It is the choice of single-camera vision system. It is necessary to train countless good product pictures and defective product pictures in advance for the large model. The trained large model uses artificial intelligence technology to automatically identify defects.

[0056] The above-described embodiments of the present invention do not constitute a limitation on the protection scope of the present invention. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A fully automatic film laminating machine, comprising a machine body (1), characterized in that: The machine body (1) is provided with a loading module (2), a film pasting component (3), an identification component (4), a feeding component (5), a material tray moving platform (6), a control system (7), and a material unloading module (8). The loading module (2) is on one side of the machine body (1), and the unloading module (8) is on the other side of the machine body (1). The film pasting component (3) can paste the film onto the product, and the material tray moving platform (6) is connected to the loading module (2), the film pasting component (3), the feeding component (5), and the unloading module (8).

2. The fully automatic film laminating machine according to claim 1, characterized in that: The loading module (2) comprises five submodules, namely, a feeding bin (205), a loading track (201), a loading gripper assembly (202), a loading transfer device (203), and a left lifting device (204), and each submodule can be controlled and operated independently.

3. The fully automatic film laminating machine according to claim 2, characterized in that: The loading gripper assembly (202) comprises a tray gripper (2021) and a gripper moving device (222). The gripper moving device (222) is fixed to the machine body (1) via a fixing block, and the gripper moving device (222) drives the tray gripper (2021) to move forward and backward.

4. The fully automatic film laminating machine according to claim 2, characterized in that: The loading track (201) automatically separates the trays of loaded products and delivers the trays to the waiting position to be grasped by the loading gripper assembly (202). The left lifting device (204) can be raised and lowered to lift or lower the trays to the tray moving platform (6). The left lifting device (204) is provided with a lifting plate (2041).

5. The fully automatic film laminating machine according to claim 1, characterized in that: The film pasting assembly (3) comprises a film pasting transfer device (301), a right lifting device (302), and a feeder (303); the film pasting transfer device (301) comprises a film pasting transfer device (3011) and a film pasting device (3012); the film pasting device (3012) comprises a suction nozzle (30121), a rotating shaft (30122), and a vacuum generator (30123).

6. The fully automatic film laminating machine according to claim 5, characterized in that: The feeder (303) automatically peels off the material film and waits for the suction nozzle (30121) to adsorb it, and the right lifting device (302) can be raised and lowered.

7. The fully automatic film laminating machine according to claim 4, characterized in that: The identification component (4), the pre-inspection component (401), the positioning camera (402) and the re-inspection component (403), the positioning camera (402) is located on one side of the film pasting device (3012), the pre-inspection component (401) includes an industrial camera and a distance sensor, and the re-inspection component (403) is provided with an AI smart camera.

8. The fully automatic film laminating machine according to claim 5, characterized in that: The material replenishment component (5) comprises a material suction component (501), an NG area (502), a good product area (503), and a lower camera (504). The structure and implementation principle of the material suction component (501) are similar to those of the transfer and film laminating device (301), and is used to suck and place products. The material suction component (501) is provided with a material suction nozzle (5011).

9. The fully automatic film laminating machine according to claim 1, characterized in that: The material unloading module (8) comprises three submodules, namely a material unloading track (801), a material unloading gripper assembly (802), and a material unloading bin (803), and each submodule can be controlled and operated independently.

10. A bad identification method, characterized in that: Using a fully automatic film laminating machine according to any one of claims 1 to 9, a defective identification method is divided into two steps: Step 1: Pre-screening Pre-sticking pre-inspection distance sensor (4012) and pre-inspection camera (4011) detect the presence of products, foreign matter, dust, scratches, etc. on the surface; The distance sensor obtains the distance data of the IC chips in the entire tray and detects defects such as dust, scratches, and distance differences through various algorithms; The pre-inspection camera (4011) takes a picture and transmits it to the control system (7). The control system (7) automatically checks whether the IC chip is good or not according to the parameters set such as foreign matter, dust, scratches, etc.; Step 2: Re-inspect after application The camera of the re-inspection component (403) is equipped with an AI smart camera, which can call the large model through the API, and the control system (7) automatically determines the defect.

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