Horizontal tablet uniformizing machine and tablet uniformizing method

Abstract

The invention relates to a horizontal uniformizing machine and a uniformizing method, which comprises the following steps of: carrying out wafer missing detection on flower baskets, simultaneously detecting a group of two same flower baskets each time, and simultaneously carrying the group of two flower baskets to a flower basket bearing platform of the uniformizing machine to uniformize wafers if any one flower basket prompts wafer missing abnormity according to the technological requirements of single-sided coating of silicon wafers. Meanwhile, the tablet uniformizing machine obtains tablet missing information of the abnormal flower basket, wherein the tablet missing information comprises the tablet missing number and tablet missing positions. The method has the advantages that the equipment structure and the method are reasonable in design, specifically, (1) the situation that the silicon wafers are placed in the ALD process boat in a single mode can be effectively avoided, manual intervention is not needed, and high efficiency and stability are achieved; (2) the basket of the horizontal wafer uniformizing machine is arranged at an inclined angle of 3 degrees, so that the silicon wafers in the basket are tidily and regularly arranged, the wafer uniformizing is accurate, and no scratch is caused; and (3) the uniformizing mechanism operates at independent stations, so that the rhythm of the whole machine is not influenced, the utilization rate of the whole machine can be effectively improved, and the productivity of equipment is improved.

Description

Technical Field

[0001] The present invention relates to a horizontal sheet leveler and a sheet leveling method, and in particular to a horizontal sheet leveler and a sheet leveling method for an ALD coating process for photovoltaic cells, and belongs to the technical field of the ALD coating process for photovoltaic cells. Background Art

[0002] The photovoltaic cell ALD coating process is a method of manufacturing photovoltaic cells through atomic layer deposition technology. The photovoltaic cell ALD coating process chemically reacts the surface of the silicon wafer used to form one or more dense passivation films, which is the core process of solar photovoltaic cell preparation.

[0003] In the preparation process of PERC cells (emitter and back passivation cells) and TOPCON cells (tunnel oxide passivation contact cells), the ALD process is required to prepare a passivation film on a single side of the silicon wafer, while the other side cannot be passivated. In order to achieve the requirement of preparing a passivation film on one side, in the ALD process, two silicon wafers are usually placed close together and placed in the same slot of the passivation container (process boat). The surface of the silicon wafer that needs to be coated is exposed, while the surface of the silicon wafer that does not need to be coated is bonded and covered with each other. Therefore, there are only two states in the slot of the passivation container (process boat): two bonded silicon wafers and a blank space.

[0004] After the previous process is completed, the silicon wafer enters the ALD equipment through the basket transmission line. Two silicon wafers or blanks need to be placed in the slot of the passivation container (process boat). Usually, two sets of vacuum suction cups are used to take the wafers from two identical baskets respectively, and then the two sets of suction cups are bonded. After other processing mechanisms, the silicon wafers are placed in the passivation container. Due to production and previous process reasons, the basket entering the ALD equipment may be missing, that is, one or more grids of silicon wafers are missing. If the missing wafers in the basket are not handled, both sides of the silicon wafers entering the passivation container will be covered with passivation film, resulting in poor process.

[0005] In the prior art, ALD equipment usually has a function of detecting missing wafers in a flower basket, such as a method for detecting abnormal silicon wafers in a flower basket disclosed in CN118448300A. However, if a missing wafer is detected in the flower basket, the flower basket is usually taken away manually to deal with the missing wafer separately, and no mechanism for automatically dealing with missing wafers in the flower basket is provided. The automation and intelligence are insufficient, the production efficiency is low, and the equipment utilization rate is low, which is extremely inconvenient and dangerous for the operators. Summary of the invention

[0006] The present invention provides a horizontal wafer leveling machine and a wafer leveling method, the purpose of which is to overcome the above-mentioned shortcomings of the prior art and avoid the situation where a single silicon wafer appears in the slots in the passivation container.

[0007] The technical solution of the present invention is a method for slicing, comprising the following steps: The flower baskets are tested for missing chips. Two identical flower baskets are tested simultaneously each time. According to the process requirements of single-sided coating of silicon wafers, if any of the flower baskets indicates missing chips, the two flower baskets are simultaneously transported to the flower basket carrying platform of the wafer leveler for chip leveling. At the same time, the wafer leveler obtains the missing chip information of the abnormal flower basket, including the number and location of missing chips.

[0008] Preferably, when slicing, one of the flower baskets is defined as H1, and the number of missing wafers is n1, n1≥0; the other flower basket is defined as H2, and the number of missing wafers is n2, n2≥0, and n1 and n2 are not equal to 0 at the same time; it is defined that the flower baskets H1 and H2 have N grids, N≤120; the number of grids with the same slot position of missing wafers in the flower baskets H1 and H2 is defined as S; the number of silicon wafers temporarily stored in the silicon wafer temporary storage platform is defined as n3, n3≤5; and slicing is performed according to the value of ln1-n2l and S.

[0009] Preferably, when ln1-n2l=0, that is, the number of missing pieces in the flower basket H1 and the flower basket H2 is the same, If n1=n2=S, that is, the missing slots in baskets H1 and H2 correspond one to one, no slicing is done; If n1=n2>S, that is, the missing chip positions in the baskets H1 and H2 are not all the same, the slice leveler only levels the slots with different missing chip positions.

[0010] Preferably, when S=0, suppose H1 lacks a silicon wafers, and the missing wafers are located in H1-a1, H1-a2, ..., H1-an, respectively, and the corresponding H2 flower basket slots of H1-a1, H1-a2, ..., H1-an all have silicon wafers; flower basket H2 lacks b silicon wafers, and the missing wafers are located in H2-b1, H2-b2, ..., H2-bn, respectively, and the corresponding H1 flower basket slots of H2-b1, H2-b2, ..., H2-bn all have silicon wafers, that is, the missing wafer positions of the two flower baskets are completely different; The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of the flower basket H1 and the flower basket H2, it randomly selects one of the flower baskets, such as H1, to level the wafers and start working; the wafer leveling sucker is driven by the XYZ three-axis motion mechanism to move to the top of the H2-a1 grid corresponding to the H1-a1 grid, and the wafer leveling sucker is inserted into the flower basket to absorb the silicon wafer of the H2-a1 grid, and the silicon wafer of the H2-a1 grid is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafer is inserted into the slot H2 -b1, the first wafer leveling is completed; and so on, the wafer leveling suction cup that completes the n-1th wafer leveling action moves to the top of H2-an corresponding to the missing wafer slot H1-an, the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of H2-an, and the silicon wafer of H2-an is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-bn, and then the silicon wafer is inserted into the slot H2-bn to complete the nth wafer leveling. After n wafer leveling, the missing wafer positions of the flower basket H1 and the flower basket H2 are consistent.

[0011] Preferably, when S≠0, that is, the flower basket H1 and the flower basket H2 have the same missing piece slot position, the same missing piece slot position is not subjected to slicing, and the slicing method for different missing piece slot positions is the same as that when S=0. That is, when n1=n2=S or n1=n2>S, the slicing mechanism can achieve the consistency of the missing piece positions of the flower basket H1 and the flower basket H2 as long as the slicing is performed in a single flower basket.

[0012] Preferably, when ln1-n21>0, that is, the number of missing pieces of the flower baskets H1 and H2 on the flower basket carrying platform differs by at least 1 piece, the pieces are evened according to whether ln1-n21 is an odd number or an even number and whether S is equal to 0.

[0013] Preferably, when ln1-n2l is an odd number and S=0, it is assumed that the basket H1 lacks a silicon wafers, and the missing wafers are located in the H1-a1 grid, H1-a2 grid, ..., H1-an grid respectively, and the H2 basket slots corresponding to the H1-a1 grid, H1-a2 grid, ..., H1-an grid all have silicon wafers; the basket H2 lacks b (b≠a) silicon wafers, and the missing wafers are located in the H2-b1 grid, H2-b2 grid, ..., H2-bm grid respectively, and the H1 basket slots corresponding to the H2-b1 grid, H2-b2 grid, ..., H2-bm grid all have silicon wafers; The wafer leveling method is as follows: after the wafer leveling machine obtains the wafer shortage information of the flower baskets H1 and H2, it randomly selects one of the flower baskets, such as the flower basket H2, for wafer leveling; the wafer leveling suction cup is driven by the XYZ three-axis motion mechanism and moves to the top of the H2-a1 grid corresponding to the H1-a1 grid, the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of the H2-a1 grid, and the silicon wafer of the H2-a1 grid is taken out of the flower basket and transferred to the top of the nearest wafer shortage slot H2-b1, and then the silicon wafer is inserted into the slot H2-b1 to complete the first wafer leveling; and so on, when the wafer leveling times of the flower basket with fewer wafer shortages reach the number of missing wafers, the number of silicon wafers temporarily stored on the flower basket temporary storage platform is judged according to the signal of the sensor for wafer leveling.

[0014] Preferably, when n3=0, the wafer leveling suction cup moves to the top of the grid of another flower basket corresponding to the grid of the flower basket with more missing wafers, takes out the silicon wafers in the grid and puts them into the silicon wafer temporary storage platform to complete the wafer leveling.

[0015] Preferably, when n3≠0, the wafer leveling suction cup moves to the top of the silicon wafer temporary storage platform, inserts into the nearest silicon wafer temporary storage platform, takes out a silicon wafer, inserts it into the missing wafer grid of the flower basket with more missing wafers, and then determines whether n3 is equal to 0, until the wafer leveling is completed.

[0016] Preferably, when ln1-n21 is an odd number and S≠0, that is, flower basket H1 and flower basket H2 have the same missing piece slots, because the same missing piece slots are not evenly sliced, the number of slots is considered to cancel each other out, and the slicing method is the same as when ln1-n21 is an odd number and S=0.

[0017] Preferably, when ln1-n2l is an even number and S=0, it is assumed that the flower basket H1 lacks a silicon wafers, and the missing wafers are respectively located in the H1-a1 grid, H1-a2 grid, ..., H1-an grid, and the H2 flower basket slot grids corresponding to the H1-a1 grid, H1-a2 grid, ..., H1-an grid all have silicon wafers; the flower basket H2 lacks b silicon wafers, b≠a, and the missing wafers are respectively located in the H2-b1 grid, H2-b2 grid, ..., H2-bm grid, and the H1 flower basket slot grids corresponding to the H2-b1 grid, H2-b2 grid, ..., H2-bm grid all have silicon wafers; The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of the flower baskets H1 and H2, it randomly selects one of the flower baskets, such as the flower basket H2, for wafer leveling; the wafer leveling suction cup is driven by the XYZ three-axis motion mechanism to move to the top of the H2-a1 grid corresponding to the H1-a1 grid, and the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of the H2-a1 grid, and the silicon wafer of the H2-a1 grid is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafer is inserted into the slot H2-b1 to complete the first step. The wafers are evened once; by analogy, when the number of times the flower basket with fewer missing wafers has been evened reaches the number of missing wafers, and the flower basket with more missing wafers still has an even number of missing wafer slots, the wafer-evening suction cup is moved to the nearest slot of the missing wafer flower basket above the slot corresponding to the other flower basket under the drive of the XYZ three-axis manipulator, and then the wafer-evening suction cup is inserted into the slot, the silicon wafer in the slot is taken out, and the wafer is transferred to the other slot of the missing wafer flower basket above the missing wafer, and the silicon wafer is inserted into the slot until ln1-n2l=0, and the wafer-evening is completed.

[0018] Preferably, when ln1-n2l is an even number and S≠0, that is, flower basket H1 and flower basket H2 have the same missing piece slots, because the same missing piece slots are not evenly sliced, the number of slots is considered to cancel each other out, and the slicing method is the same as when ln1-n2l is an even number and S=0.

[0019] Preferably, a horizontal slice leveling machine is used, whose structure includes two groups of flower basket positioning mechanisms arranged on the bearing platform plate and a slice leveling suction cup mechanism arranged above the bearing platform plate, a flower basket is positioned in each group of flower basket positioning mechanisms, silicon wafers are regularly arranged in the flower basket to form a flower basket bearing platform, a silicon wafer temporary storage platform is also provided at one end of the bearing platform plate, the bearing platform plate is installed on the mounting frame through an A fixing seat, the bearing platform plate forms an angle of 3° with the horizontal plane of the mounting frame, and an angle adjustment mechanism is provided on the A fixing seat.

[0020] Preferably, the silicon wafer temporary storage platform is provided with upper and lower gap slot blocks arranged oppositely on both sides, and the silicon wafers are temporarily stored in the gap slots surrounded by the gap slot blocks on both sides, and the gap slot blocks are connected to an X-direction fine-tuning mechanism. Pneumatic regularization mechanisms are also provided on both sides of the silicon wafer temporary storage platform, and a sensor is configured under the gap slot block on the upper layer on one side, corresponding to each gap slot.

[0021] Preferably, the film-leveling suction cup mechanism includes a film-leveling suction cup made of ceramic material, and the end of the film-leveling suction cup is respectively connected to the vacuum generator and the negative pressure feedback element through an air path interface, the film-leveling suction cup mechanism is installed on the Z-direction driving mechanism, the Z-direction driving mechanism is installed on the Y-direction driving mechanism, the Y-direction driving mechanism is installed on the X-direction driving mechanism, the X-direction driving mechanism is connected to the mounting frame through a B fixing seat, the X-direction driving mechanism, the Y-direction driving mechanism and the Z-direction driving mechanism constitute an XYZ three-axis motion mechanism, and the XYZ three-axis motion mechanism forms an angle of 3° with the horizontal plane of the mounting frame.

[0022] The advantages of the present invention are: the equipment structure and method are reasonably designed, specifically, (1) It can effectively avoid the situation of placing silicon wafers in the ALD process boat, without manual intervention, and is efficient and stable; (2) The basket of the horizontal wafer leveling machine is tilted at a 3° angle, so that the silicon wafers in the basket are arranged neatly and regularly, and the wafers are leveled accurately without scratches; (3) The sheet leveling mechanism operates independently without affecting the overall machine cycle, which can effectively improve the overall machine utilization rate and increase equipment production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the horizontal slicing machine of the present invention.

[0024] Figure 2 It is a schematic diagram of the main structure of the horizontal slicer of the present invention.

[0025] Figure 3 Schematic diagram of the position and status of missing pieces in the flower basket of Example 1.

[0026] Figure 4 It is a schematic diagram of the position and status of missing pieces in the flower basket after slicing in Example 1.

[0027] Figure 5 It is a schematic diagram of the position and status of missing pieces in the flower basket of Example 2.

[0028] Figure 6 It is a schematic diagram of the position and status of the missing pieces of the flower basket in Example 3.

[0029] Figure 7 It is a schematic diagram of the position and status of missing pieces in the flower basket after slicing in Example 3.

[0030] In the figure, 0 is the carrying platform plate, 1 is the flower basket positioning mechanism, 2 is the X-direction driving mechanism, 3 is the film leveling suction cup mechanism, 31 is the film leveling suction cup, 4 is the Z-direction driving mechanism, 5 is the Y-direction driving mechanism, 6 is the silicon wafer temporary storage platform, 61 is the gap slot block, 62 is the pneumatic regularization mechanism, 63 is the sensor, 7 is the angle adjustment mechanism, 8 is the A fixing seat, and 9 is the B fixing seat. DETAILED DESCRIPTION

[0031] The present invention is further described in detail below with reference to examples and specific implementation modes.

[0032] like Figure 1 , 2As shown, a horizontal slice leveling machine has a structure including two groups of flower basket positioning mechanisms 11 arranged on a bearing platform plate 0 and a slice leveling suction cup mechanism 3 arranged above the bearing platform plate, a flower basket is positioned in each group of flower basket positioning mechanisms 11, silicon wafers are regularly arranged in the flower basket to form a flower basket bearing platform, a silicon wafer temporary storage platform 6 is also provided at one end of the bearing platform plate 0, the bearing platform plate 0 is installed on the mounting frame through an A fixing seat 8, so that the flower basket bearing platform and the silicon wafer temporary storage platform form an integral module, the bearing platform plate 0 forms an angle of 3° with the horizontal plane of the mounting frame, and an angle adjustment mechanism 7 is provided on the A fixing seat 8.

[0033] The two sides of the silicon wafer temporary storage platform 6 are equipped with upper and lower gap slot blocks 61 arranged opposite to each other, and the silicon wafers 5 (the structure shown in the figure can accommodate five wafers) are temporarily stored in the gap slots surrounded by the gap slot blocks 61 on both sides. The gap slot blocks 61 are connected to the X-direction fine-tuning mechanism. The two sides of the silicon wafer temporary storage platform 6 are also equipped with pneumatic regularization mechanisms 62, which are used to center the silicon wafers in the gap slots in the Y direction. A sensor 63 can be configured below the gap slot block 61 on the upper layer of one side, which is set corresponding to each gap slot to detect whether there is a silicon wafer temporarily stored in the gap slot.

[0034] The film-leveling suction cup mechanism 3 includes a film-leveling suction cup 31 made of ceramic material, and the end of the film-leveling suction cup 31 is respectively connected to the vacuum generator and the negative pressure feedback element through the air path interface. The film-leveling suction cup mechanism 3 is installed on the Z-direction driving mechanism 4, the Z-direction driving mechanism 4 is installed on the Y-direction driving mechanism 5, the Y-direction driving mechanism 5 is installed on the X-direction driving mechanism 2, the X-direction driving mechanism 2 is connected to the mounting frame through the B fixing seat 9, the X-direction driving mechanism 2, the Y-direction driving mechanism 5 and the Z-direction driving mechanism 4 form an XYZ three-axis motion mechanism, and the XYZ three-axis motion mechanism is at an angle of 3° with the horizontal plane of the mounting frame. The Z-direction driving mechanism 4 is a screw-type drive module, which is connected to the Y-direction driving mechanism 5 through a connecting plate, and the Y-direction driving mechanism 5 is a belt-type transmission module.

[0035] Based on the above-mentioned horizontal slicing machine, a slicing method comprises the following steps: The flower basket missing chip detection method of the prior art is used to detect the missing chips of the flower basket. Each time, two identical flower baskets are tested simultaneously. Due to the process requirements of single-sided coating of silicon wafers, as long as any one of the flower baskets indicates that the missing chips are abnormal, the two flower baskets in the group will be transported to the flower basket carrying platform for chip leveling at the same time. At the same time, the chip leveling machine will obtain the missing chip information of the abnormal flower basket, including the number of missing chips and the missing chip position; Define one basket as H1, and the number of missing wafers is n1 (n1 ≥ 0), and the other basket as H2, and the number of missing wafers is n2 (n2 ≥ 0), where n1 and n2 are not equal to 0 at the same time. Define baskets H1 and H2 to have N slots (01~N), usually N≤120. The number of slots with the same missing wafer positions in baskets H1 and H2 is defined as S. Define the number of wafers temporarily stored in the wafer temporary storage platform as n3 (n3≤5).

[0036] (1) When ln1-n2l=0, it means that the number of missing pieces in basket H1 and basket H2 is the same. Further: If n1=n2=S, it means that the missing slots in basket H1 and basket H2 correspond one to one, and there is no need to level the slices.

[0037] If n1=n2>S, it means that the missing chip positions in the baskets H1 and H2 are not all the same, and the slicer only slices the slots with different missing chip positions.

[0038] When S=0, specifically, H1 is missing a silicon wafers, and the missing wafers are located in H1-a1, H1-a2, ..., H1-an, and the corresponding H2 flower basket slots have silicon wafers. Flower basket H2 is missing b silicon wafers, and the missing wafers are located in H2-b1, H2-b2, ..., H2-bn, and the corresponding H1 flower basket slots have silicon wafers. The missing wafer positions of the two flower baskets are completely different, S=0.

[0039] The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of baskets H1 and H2, it randomly selects one of the baskets, such as H1, to level the wafers and start working. Driven by the XYZ three-axis motion mechanism, the wafer leveling sucker moves to the top of the H2-a1 grid corresponding to the H1-a1 grid, and the wafer leveling sucker is inserted into the basket to absorb the silicon wafers of H2-a1 grid, and the silicon wafers of H2-a1 grid are taken out of the basket and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafer is inserted into the slot H2-b1 to complete the first wafer leveling. By analogy, the wafer leveling suction cup that completes the n-1th wafer leveling action moves to the top of H2-an corresponding to the missing wafer slot H1-an, and the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of H2-an, and the silicon wafer of H2-an is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-bn, and then the silicon wafer is inserted into the slot H2-bn to complete the nth wafer leveling. After n wafer leveling actions, the missing wafer positions of the flower basket H1 and the flower basket H2 are consistent.

[0040] When S≠0, specifically, This indicates that the flower baskets H1 and H2 have the same missing chip slot positions. Since the same missing chip slot positions do not require slicing, different missing chip slot positions can be sliced ​​using the slicing method when S=0.

[0041] In summary, when n1=n2=S or n1=n2>S, the slicing mechanism can achieve the consistency of missing slice positions of baskets H1 and H2 by slicing in a single basket ( Figure 3 ).

[0042] (2) When ln1-n2l>0, it means that the number of missing pieces of flower baskets H1 and H2 on the flower basket carrying platform differs by at least one piece. Further: (a) If ln1-n2l is an odd number, S=0, specifically, Flower basket H1 lacks a silicon wafers, and the missing wafers are located in H1-a1, H1-a2, ..., H1-an, and the corresponding H2 flower basket slots have silicon wafers. Flower basket H2 lacks b (b≠a) silicon wafers, and the missing wafers are located in H2-b1, H2-b2, ..., H2-bm, and the corresponding H1 flower basket slots have silicon wafers, S=0.

[0043] The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of baskets H1 and H2, it randomly selects one of the baskets, such as basket H2, for wafer leveling. Driven by the XYZ three-axis motion mechanism, the wafer leveling suction cup moves to the top of the H2-a1 grid corresponding to the H1-a1 grid, and the wafer leveling suction cup is inserted into the basket to absorb the silicon wafers of H2-a1, and the silicon wafers of the H2-a1 grid are taken out of the basket and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafers are inserted into the slot H2-b1 to complete the first wafer leveling. Similarly, when the number of wafer leveling of the basket with fewer missing wafers reaches the number of missing wafers, the number of silicon wafers temporarily stored on the basket temporary storage platform can be determined based on the signal of the sensor, and further: If n3=0, the wafer leveling sucker moves to the top of the grid of another basket corresponding to the grid of the basket with more missing wafers, takes out the silicon wafers in the grid and puts them into the silicon wafer temporary storage platform to complete the wafer leveling.

[0044] If n3≠0, the wafer leveling suction cup moves to the top of the silicon wafer temporary storage platform, inserts a silicon wafer into the nearest silicon wafer temporary storage platform, takes out a silicon wafer, inserts it into the missing wafer grid of the flower basket with more missing wafers, and then determines whether n3 is equal to 0 until the wafer leveling is completed.

[0045] (b) If ln1-n2l is an odd number and S≠0, specifically, It means that basket H1 and basket H2 have the same missing slots. Since the same missing slots are not evenly sliced, the number of slots can be considered to cancel each other out. Therefore, the slicing method when ln1-n2l is an odd number and S≠0 is the same as the slicing method when ln1-n2l is an odd number and S=0.

[0046] (c) If ln1-n2l is an even number, S = 0, specifically, Flower basket H1 lacks a silicon wafers, and the missing wafers are located in H1-a1, H1-a2, ..., H1-an, and the corresponding H2 flower basket slots have silicon wafers. Flower basket H2 lacks b (b≠a) silicon wafers, and the missing wafers are located in H2-b1, H2-b2, ..., H2-bm, and the corresponding H1 flower basket slots have silicon wafers, S=0.

[0047] The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of baskets H1 and H2, it randomly selects one of the baskets, such as basket H2, for wafer leveling. Driven by the XYZ three-axis motion mechanism, the wafer leveling sucker moves to the top of the H2-a1 grid corresponding to the H1-a1 grid, and the wafer leveling sucker is inserted into the basket to absorb the silicon wafer of H2-a1, and the silicon wafer of H2-a1 grid is taken out of the basket and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafer is inserted into the slot H2-b1 to complete the first wafer leveling. By analogy, when the number of times the flower basket with fewer missing chips has been leveled reaches the number of missing chips, and the flower basket with more missing chips still has an even number of missing chip slots, the leveling suction cup is moved to the nearest slot of the missing chip flower basket above the slot corresponding to the other flower basket under the drive of the XYZ three-axis manipulator, and then the leveling suction cup is inserted into the slot, the silicon wafer in the slot is taken out, and transferred to the other slot of the missing chip flower basket above, and the silicon wafer is inserted into the slot until ln1-n2l=0, and the leveling is completed.

[0048] (d) If ln1-n2l is an even number and S≠0, the specific It means that basket H1 and basket H2 have the same missing slots. Since the same missing slots are not evenly sliced, the number of slots can be considered to cancel each other out. Therefore, the slicing method when ln1-n2l is an even number and S≠0 is the same as the slicing method when ln1-n2l is an even number and S=0. Example 1

[0049] When n1=n2>S, and S=0, specifically, like Figure 3As shown, H1 is missing three silicon wafers, which are located in H1-03, H1-10 and H1-14 respectively. The corresponding H2 slots of H1-03, H1-10 and H1-14 all have silicon wafers. Flower basket H2 is missing three silicon wafers, which are located in H2-06, H2-17 and H2-21 respectively. The corresponding H1 slots of H2-06, H2-17 and H2-21 all have silicon wafers. The missing wafer positions of the two flower baskets are completely different, S=0.

[0050] Slice methods include: After the wafer leveler obtains the missing wafer information of baskets H1 and H2, it randomly selects one of the baskets (such as basket H2) for wafer leveling and starts working. Driven by the XYZ three-axis motion mechanism, the wafer leveling sucker moves to the top of the H2-03 grid corresponding to the H1-03 grid, and the wafer leveling sucker is inserted into the basket to absorb the silicon wafer of H2-03 grid, and the silicon wafer of H2-03 grid is taken out of the basket and transferred to the top of the nearest missing wafer slot H2-06, and then the silicon wafer is inserted into the slot H2-06 to complete the first wafer leveling. Similarly, the wafer leveling suction cup that has completed the first wafer leveling action moves to the top of the slot H2-10 corresponding to the missing wafer slot H1-10, and the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of H2-10, and the silicon wafer of H2-10 is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-17, and then the silicon wafer is inserted into the slot H2-17 to complete the second wafer leveling. Similarly, the wafer leveling suction cup that has completed the second wafer leveling action moves to the top of H2-14 corresponding to the missing wafer slot H1-14, and the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of H2-14, and the silicon wafer of H2-14 is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-21, and then the silicon wafer is inserted into the slot H2-21 to complete the third wafer leveling. After three wafer levelings, the missing wafer positions of the flower basket H1 and the flower basket H2 are consistent, as shown in FIG. Figure 4 shown. Example 2

[0051] When ln1-n2l is an odd number and S=0, specifically, like Figure 5 As shown, H1 is missing three silicon wafers, which are located in H1-03, H1-10 and H1-14 respectively. The corresponding H2 flower basket slots of H1-03, H1-10 and H1-14 all have silicon wafers. Flower basket H2 is missing two silicon wafers, which are located in H2-06 and H2-17 respectively. The corresponding H1 flower basket slots of H2-06 and H2-17 all have silicon wafers, S=0.

[0052] The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of baskets H1 and H2, it randomly selects one of the baskets (such as basket H2) for wafer leveling. Driven by the XYZ three-axis motion mechanism, the wafer leveling sucker moves to the top of the H2-03 grid corresponding to the H1-03 grid, and the wafer leveling sucker is inserted into the basket to absorb the silicon wafer of H2-03, and the silicon wafer of H2-03 grid is taken out of the basket and transferred to the top of the nearest missing wafer slot H2-06, and then the silicon wafer is inserted into the slot H2-06 to complete the first wafer leveling. Similarly, the wafer leveling suction cup that has completed the first wafer leveling action moves to the top of the slot H2-10 corresponding to the missing wafer slot H1-10, and the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of H2-10, and the silicon wafer of H2-10 is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-17, and then the silicon wafer is inserted into the slot H2-17 to complete the second wafer leveling. Flower basket H1 lacks one more piece (H1-14) than flower basket H2. According to the signal of sensor (6-03), the number of silicon wafers temporarily stored on the flower basket temporary storage platform can be determined, and further: If n3=0, the wafer leveling suction cup moves to the top of the flower basket H2-14 grid corresponding to the flower basket H1-14 grid, takes out the silicon wafer in the H2-14 grid and puts it into the silicon wafer temporary storage platform to complete the wafer leveling.

[0053] If n3≠0, the wafer leveling sucker moves to the top of the silicon wafer temporary storage platform, inserts it into the nearest silicon wafer temporary storage platform, takes out a silicon wafer, and inserts it into the H1-14 grid of the H1 flower basket to complete the wafer leveling. Example 3

[0054] When ln1-n2l is an even number and S=0, specifically, H1 is missing three silicon wafers, which are located in H1-03, H1-10 and H1-14 respectively. The corresponding H2 slots have silicon wafers. H2 is missing one silicon wafer, which is located in H2-06 respectively. The corresponding H1 slots have silicon wafers, S=0.

[0055] The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of baskets H1 and H2, it randomly selects one of the baskets (such as basket H2) for wafer leveling. Driven by the XYZ three-axis motion mechanism, the wafer leveling sucker moves to the top of the H2-03 grid corresponding to the H1-03 grid, and the wafer leveling sucker is inserted into the basket to absorb the silicon wafer of H2-03, and the silicon wafer of H2-03 grid is taken out of the basket and transferred to the top of the nearest missing wafer slot H2-06, and then the silicon wafer is inserted into the slot H2-06 to complete the first wafer leveling. At this time, there are still two missing wafers in the flower basket H1. Driven by the XYZ three-axis manipulator, the wafer leveling suction cup moves to the top of the H2-10 slot corresponding to the flower basket H1-10. Then the wafer leveling suction cup is inserted into the flower basket H2-10, and the silicon wafer in the H2-10 slot is taken out and transferred to the top of the flower basket H1-14 slot. The silicon wafer is inserted into the H1-14 slot to complete the wafer leveling. Figure 7 shown.

[0056] All the components mentioned above are prior art, and those skilled in the art can use any model and existing design that can achieve their corresponding functions.

[0057] The above is only a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, which all fall within the protection scope of the present invention.

Claims

1. A method for slicing, characterized in that: The following steps are involved: The flower baskets are tested for missing chips. Two identical flower baskets are tested simultaneously each time. According to the process requirements of single-sided coating of silicon wafers, if any of the flower baskets indicates missing chips, the two flower baskets are simultaneously transported to the flower basket carrying platform of the wafer leveler for chip leveling. At the same time, the wafer leveler obtains the missing chip information of the abnormal flower basket, including the number and location of missing chips.

2. A method for slicing as claimed in claim 1, characterized in that: When slicing, define one of the baskets as H1, and the number of missing wafers is n1, n1≥0; define the other basket as H2, and the number of missing wafers is n2, n2≥0, and n1 and n2 are not equal to 0 at the same time; define baskets H1 and H2 to have N grids, N≤120; define the number of grids with the same missing wafer positions in baskets H1 and H2 to be S; define the number of silicon wafers temporarily stored in the silicon wafer temporary storage platform to be n3, n3≤5; and perform slicing according to the value of ln1-n2l and S.

3. A method for slicing as claimed in claim 2, characterized in that: When ln1-n2l=0, that is, the number of missing pieces in basket H1 and basket H2 is the same, If n1=n2=S, that is, the missing slots in baskets H1 and H2 correspond one to one, no slicing is done; If n1=n2>S, that is, the missing chip positions in baskets H1 and H2 are not all the same, the slicer only slices the slots with different missing chip positions; When S=0, suppose H1 lacks a silicon wafers, and the missing wafers are located in H1-a1, H1-a2, ..., H1-an, respectively. The corresponding H1-a1, H1-a2, ..., H1-an slots of H2 all have silicon wafers; flower basket H2 lacks b silicon wafers, and the missing wafers are located in H2-b1, H2-b2, ..., H2-bn, respectively. The corresponding H2-b1, H2-b2, ..., H2-bn slots of H1 all have silicon wafers, that is, the missing wafer positions of the two flower baskets are completely different; The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of the flower basket H1 and the flower basket H2, it randomly selects one of the flower baskets, such as H1, to level the wafers and start working; the wafer leveling sucker is driven by the XYZ three-axis motion mechanism to move to the top of the H2-a1 grid corresponding to the H1-a1 grid, and the wafer leveling sucker is inserted into the flower basket to absorb the silicon wafer of the H2-a1 grid, and the silicon wafer of the H2-a1 grid is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafer is inserted into the slot H2 -b1, the first wafer leveling is completed; and so on, the wafer leveling sucker that has completed the n-1th wafer leveling action moves to the top of H2-an corresponding to the missing wafer slot H1-an, and the wafer leveling sucker is inserted into the flower basket to suck up the silicon wafer of H2-an, and the silicon wafer of H2-an is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-bn, and then the silicon wafer is inserted into the slot H2-bn to complete the nth wafer leveling. After n wafer leveling, the missing wafer positions of the flower basket H1 and the flower basket H2 are consistent; When S≠0, that is, there are the same missing chip slot positions in the flower basket H1 and the flower basket H2, the same missing chip slot positions are not sliced, and the slicing method for different missing chip slot positions is the same as the slicing method when S=0.

4. A method for slicing as claimed in claim 2, characterized in that: When ln1-n2l>0, that is, the number of missing pieces of the flower baskets H1 and H2 on the flower basket carrying platform differs by at least 1 piece, the pieces are evened according to whether ln1-n2l is an odd number or an even number and whether S is equal to 0.

5. A method for slicing as claimed in claim 4, characterized in that: When ln1-n2l is an odd number and S=0, suppose that basket H1 lacks a silicon wafers, and the missing wafers are located in grids H1-a1, H1-a2, ..., H1-an, respectively. The corresponding grids of basket H2 all have silicon wafers; basket H2 lacks b (b≠a) silicon wafers, and the missing wafers are located in grids H2-b1, H2-b2, ..., H2-bm, respectively. The corresponding grids of basket H1 all have silicon wafers; The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of the flower basket H1 and the flower basket H2, it randomly selects one of the flower baskets, such as the flower basket H2, for wafer leveling; the wafer leveling suction cup is driven by the XYZ three-axis motion mechanism to move to the top of the H2-a1 grid corresponding to the H1-a1 grid, the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of the H2-a1 grid, and the silicon wafer of the H2-a1 grid is taken out of the flower basket, and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafer is inserted into the slot H2-b1 to complete the first wafer leveling; and so on, when the wafer leveling times of the flower basket with fewer missing wafers reach the number of missing wafers, the number of silicon wafers temporarily stored on the flower basket temporary storage platform is judged according to the signal of the sensor to perform wafer leveling; When n3=0, the wafer leveling sucker moves to the top of the cell of another basket corresponding to the cell of the basket with more missing wafers, takes out the silicon wafers in the cell and puts them into the silicon wafer temporary storage platform to complete the wafer leveling; When n3≠0, the wafer leveling sucker moves to the top of the wafer temporary storage platform, inserts a wafer into the nearest wafer temporary storage platform, takes out a wafer, inserts it into the missing wafer grid of the flower basket with more missing wafers, and then determines whether n3 is equal to 0, until the wafer leveling is completed; When ln1-n2l is an odd number and S≠0, that is, flower baskets H1 and H2 have the same missing piece slots, because the same missing piece slots are not evenly sliced, the number of slots is considered to cancel each other out, and the slicing method is the same as when ln1-n2l is an odd number and S=0.

6. A method for slicing as claimed in claim 4, characterized in that: When ln1-n2l is an even number and S=0, suppose that flower basket H1 lacks a silicon wafers, and the missing wafers are located in H1-a1, H1-a2, ..., H1-an, respectively, and the corresponding H1-a1, H1-a2, ..., H1-an flower basket slots all have silicon wafers; flower basket H2 lacks b silicon wafers, b≠a, and the missing wafers are located in H2-b1, H2-b2, ..., H2-bm, respectively, and the corresponding H2-b1, H2-b2, ..., H2-bm flower basket slots all have silicon wafers; The wafer leveling method is as follows: after the wafer leveling machine obtains the missing wafer information of the flower baskets H1 and H2, it randomly selects one of the flower baskets, such as the flower basket H2, for wafer leveling; the wafer leveling suction cup is driven by the XYZ three-axis motion mechanism to move to the top of the H2-a1 grid corresponding to the H1-a1 grid, and the wafer leveling suction cup is inserted into the flower basket to absorb the silicon wafer of the H2-a1 grid, and the silicon wafer of the H2-a1 grid is taken out of the flower basket and transferred to the top of the nearest missing wafer slot H2-b1, and then the silicon wafer is inserted into the slot H2-b1 to complete the first step. Once the wafers are leveled; by analogy, when the number of times the flower basket with fewer missing wafers has reached the number of missing wafers, and the flower basket with more missing wafers still has an even number of missing wafer slots, the wafer leveling sucker is driven by the XYZ three-axis manipulator to move to the nearest slot of the missing wafer flower basket above the slot corresponding to the other flower basket, and then the wafer leveling sucker is inserted into the slot, takes out the silicon wafer in the slot, transfers it to the other slot of the missing wafer flower basket above the missing wafer, and inserts the silicon wafer into the slot until ln1-n2l=0, and the wafer leveling is completed; When ln1-n2l is an even number and S≠0, that is, flower basket H1 and flower basket H2 have the same missing piece slots, because the same missing piece slots are not evenly sliced, the number of slots is considered to cancel each other out, and the slicing method is the same as when ln1-n2l is an even number and S=0.

7. A method for slicing as claimed in any one of claims 1 to 6, characterized in that: A horizontal slice leveling machine is used, the structure of which comprises two groups of flower basket positioning mechanisms (1) arranged on a bearing platform plate (0) and a slice leveling sucker mechanism (3) arranged above the bearing platform plate, a flower basket is positioned in each group of flower basket positioning mechanisms (1), silicon wafers are regularly arranged in the flower basket to form a flower basket bearing platform, a silicon wafer temporary storage platform (6) is further provided at one end of the bearing platform plate (0), the bearing platform plate (0) is mounted on a mounting frame via an A fixing seat (8), the bearing platform plate (0) forms an angle of 3° with a horizontal plane of the mounting frame, and an angle adjustment mechanism (7) is provided on the A fixing seat (8).

8. A method for slicing as claimed in claim 7, characterized in that: The silicon wafer temporary storage platform (6) is provided with upper and lower gap slot blocks (61) arranged opposite to each other on both sides. The silicon wafer (5) is temporarily stored in the gap slots surrounded by the gap slot blocks (61) on both sides. The gap slot blocks (61) are connected to an X-direction fine-tuning mechanism. The silicon wafer temporary storage platform (6) is also provided with pneumatic regularization mechanisms (62) on both sides. A sensor (63) is arranged below the gap slot block (61) on the upper layer of one side, corresponding to each gap slot.

9. A method for slicing as claimed in claim 7, characterized in that: The film-leveling suction cup mechanism (3) comprises a film-leveling suction cup (31) made of ceramic material. The end of the film-leveling suction cup (31) is respectively connected to a vacuum generator and a negative pressure feedback element through an air path interface. The film-leveling suction cup mechanism (3) is mounted on a Z-direction driving mechanism (4). The Z-direction driving mechanism (4) is mounted on a Y-direction driving mechanism (5). The Y-direction driving mechanism (5) is mounted on an X-direction driving mechanism (2). The X-direction driving mechanism (2) is connected to a mounting frame through a B fixing seat (9). The X-direction driving mechanism (2), the Y-direction driving mechanism (5) and the Z-direction driving mechanism (4) form an XYZ three-axis motion mechanism. The XYZ three-axis motion mechanism forms an angle of 3° with the horizontal plane of the mounting frame.

Images