Control circuit board surface chemical immersion gold device

Abstract

The invention discloses a control circuit board surface chemical immersion gold device, which belongs to the technical field of circuit board processing, and comprises a supporting bottom plate, a bottom supporting nail arranged on the upper side of the supporting bottom plate, a top plate arranged above the supporting bottom plate in parallel, a pressing nail arranged on the lower side of the top plate, and a pressing device for controlling the top plate to move along the normal direction of the pressing device, the bottom supporting nails and the pressing nails are matched to be used for pressing the control circuit board. A plurality of plugging assemblies corresponding to holes in the control circuit board are further installed on the supporting bottom plate, each plugging assembly comprises a base, a plugging column, a limiting table and a lifting device, the bases are installed on the supporting bottom plate, openings are formed in the upper sides of the bases, the plugging columns are installed in the openings in a sliding mode in the vertical direction, and the lifting devices are installed at the bottoms of the openings; the output end of the lifting device is connected to the plugging column. The device can effectively avoid bubbles generated at the holes in the control circuit board, and ensures the gold immersion effect of the control circuit board.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a device for controlling chemical gold deposition on the surface of a circuit board. Background Art

[0002] The gold immersion process for control circuit boards is to immerse the circuit boards in a chemical solution containing gold ions, and reduce the gold ions to metal through electrochemical reactions and deposit them on the surface of the circuit boards, forming a uniform metal film protective layer. This protective layer can effectively prevent metal corrosion, thereby improving the corrosion resistance of the circuit boards. At present, the electronic manufacturing industry is developing towards miniaturization and high density, and the circuit spacing of circuit boards is becoming narrower and narrower, which places almost stringent requirements on the uniformity and density of the gold immersion layer. During the gold immersion process, bubbles are easily generated in the holes on the control circuit board at the moment when the control circuit board comes into contact with the chemical solution containing gold ions or during gold immersion, which will make it difficult for the control circuit board to fully contact with the chemical solution containing gold ions, affecting the gold immersion effect of the control circuit board. Summary of the invention

[0003] In view of this, the purpose of the present invention is to provide a device for chemically immersing gold on the surface of a control circuit board, which can effectively avoid bubbles generated in the holes on the control circuit board and ensure the immersion gold effect of the control circuit board.

[0004] In order to achieve the above object, the present invention provides the following technical solutions: The present invention discloses a control circuit board surface chemical gold deposition device, comprising a supporting base plate, a bottom supporting nail installed on the upper side of the supporting base plate, a top plate arranged parallel to the supporting base plate, a pressing nail installed on the lower side of the top plate, and a pressing device for controlling the top plate to move along its normal direction, wherein the bottom supporting nail and the pressing nail cooperate to press the control circuit board; the supporting base plate is also provided with a plurality of plugging components corresponding to the holes on the control circuit board, the plugging components comprising a base, a blocking column, a limit platform, and a lifting device, the base is installed on the supporting base plate, an opening is formed on the upper side of the base, the blocking column is installed in the opening along a vertical sliding manner, a lifting device is installed at the bottom of the opening, an output end of the lifting device is connected to the blocking column, the limit platform is fixed at the opening of the base, a through hole is formed in the middle part of the limit platform for the blocking column to extend out, and the upper end of the limit platform is used to limit the control circuit board.

[0005] In this embodiment, the blocking column includes a cylindrical column body, a column base integrally formed at the lower end of the column body, a base for supporting the column base, and a plurality of arc-shaped support plates evenly spaced inside the column body, and the column body and the column base are both made of elastic material; the arc-shaped support plate extends along the axial direction of the column body, and a slider is fixedly connected to the lower end of the arc-shaped support plate, and the slider is radially slidably arranged in a slide groove provided on the base; a pressure plate is slidably arranged on the lower side of the top plate, and the top plate is connected to the pressure plate by a telescopic device, and the lower side of the pressure plate is connected to a conical nail by a support rod, and the conical nail cooperates with the arc-shaped support plate in the column body.

[0006] In this embodiment, an embedding groove is provided on the lower side of the sliding block, a ball is rotatably installed in the embedding groove, and the sliding block cooperates with the sliding groove through the ball.

[0007] In this embodiment, a guide column is fixed to the outer side of the arc-shaped support plate, and the guide column extends radially. An expansion hole corresponding to the guide column is opened on the column body, and the outer end of the guide column is connected to a limiting member, and the outer end of the expansion hole forms a recessed groove for installing the limiting member.

[0008] In this embodiment, the limiting platform is made of elastic material, and the through hole of the limiting platform is tightly matched with the outer side of the column.

[0009] In this embodiment, a limiting groove is provided on the supporting bottom plate, the base is installed in the limiting groove, and the base is magnetically connected to the supporting bottom plate.

[0010] In this embodiment, the bottom supporting pins and the pressing pins correspond one to one.

[0011] In this embodiment, the supporting base plate is eccentrically fixed on a vertically placed turntable, the center of the turntable is connected to a central axis, the top plate rotates with the turntable, the turntable is connected to a rotation drive device through the central axis, and the rotation drive device is installed on a horizontal conveyor belt.

[0012] The beneficial effects of the present invention are: When the control circuit board contacts the chemical solution containing gold ions, the air in the holes is easily brought into the chemical solution. The present invention discloses a control circuit board surface chemical gold deposition device, which can block the holes on the control circuit board before the control circuit board contacts the chemical solution by setting a blocking column, so as to avoid the problem of bubbles being generated in the holes on the control circuit board when the control circuit board contacts the chemical solution containing gold ions, thereby ensuring the subsequent gold deposition effect of the control circuit board.

[0013] In the device disclosed in the present invention, after the control circuit board is completely immersed in the solution, the control circuit board can be pressed by the bottom support pins and the pressure pins, and then the sealing component can be retracted to expose the hole, so as to facilitate the subsequent gold sinking operation in the hole and avoid the sealing component from obstructing the inner wall of the hole.

[0014] Other advantages, objectives and features of the present invention will be described in the following description and will be apparent to those skilled in the art to some extent, or those skilled in the art may be taught from the practice of the present invention. The objectives and other advantages of the present invention may be realized and obtained through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to make the purpose, technical solution and beneficial effects of the present invention clearer, the present invention provides the following drawings for illustration: Figure 1 It is a structural schematic diagram of the chemical gold deposition device of the present invention; Figure 2 for Figure 1 The enlarged view of point A in the middle; Figure 3 is a schematic diagram of the structure of the plugging component; Figure 4 is a cross-sectional view of the plugging component; Figure 5 It is a schematic diagram of the structure of the chemical gold deposition device of the present invention when in use.

[0016] The markings in the accompanying drawings are as follows: supporting base plate 1, bottom supporting nails 2, top plate 3, pressing nails 4, clamping device 5, control circuit board 6, holes 7, blocking assembly 8, base 9, limiting platform 10, lifting device 11, column 12, column base 13, pedestal 14, arc support plate 15, slider 16, slide groove 17, pressure plate 18, telescopic device 19, support rod 20, conical nail 21, ball bearing 22, guide column 23, expansion hole 24, sink 25, limiting groove 26, turntable 27, center axis 28, rotation drive device 29, horizontal conveyor belt 30. DETAILED DESCRIPTION

[0017] like Figures 1 to 5 As shown, the present invention discloses a device for chemical gold deposition on the surface of a control circuit board, comprising a supporting base plate 1, a bottom supporting pin 2 installed on the upper side of the supporting base plate 1, a top plate 3 arranged parallel to the supporting base plate 1, a pressing pin 4 installed on the lower side of the top plate 3, and a pressing device 5 for controlling the top plate 3 to move along its normal direction. The supporting base plate 1 is a flat plate. When the control circuit board 6 is in a normal assembly state, the supporting base plate 1 is located on the upper side of the gold deposition tank. Therefore, the control circuit board 6 can be assembled on the upper side of the chemical solution, which can reduce the disturbance of the solution during assembly to generate bubbles.

[0018] The bottom supporting pins 2 and the pressing pins 4 are used together to press the control circuit board 6. A number of sealing components 8 corresponding to the holes 7 on the control circuit board 6 are also installed on the supporting base plate 1. By setting the supporting pins and the pressing pins 4, the gold-plating operation of the control circuit board 6 can be facilitated. When the control circuit board 6 is completely immersed in the solution and the first stage of the gold-plating process is completed, the control circuit board 6 can be pressed by the bottom supporting pins 2 and the pressing pins 4, and then the sealing components 8 are retracted to expose the holes 7, so as to facilitate the subsequent second stage of the gold-plating operation in the holes and avoid the blocking of the inner wall of the hole 7 by the sealing components 8.

[0019] Specifically, the blocking assembly 8 disclosed in the present invention includes a base 9, a blocking column, a limit platform 10, and a lifting device 11. The base 9 is installed on the supporting base plate 1. In some other embodiments, the connection method between the base 9 and the supporting base plate 1 can be various, such as the sliding fit method of the guide rail. However, if the above-mentioned mechanical connection is used, it is not easy to fine-tune the planar position of the base 9 on the supporting base plate 1, nor is it convenient to lock the position of the base 9.

[0020] An opening is formed on the upper side of the base 9, and the blocking column is installed in the opening along the vertical sliding direction. A lifting device 11 is installed at the bottom of the opening, and the output end of the lifting device 11 is connected to the blocking column. The limit table 10 is fixed at the opening of the base 9. A through hole is formed in the middle of the limit table 10 for the blocking column to extend out, and the upper end of the limit table 10 is used to limit the control circuit board 6. In the device of the present invention, by setting the blocking column, the hole 7 on the control circuit board 6 can be blocked before the control circuit board 6 contacts the chemical solution, so as to avoid the problem of bubbles generated at the hole 7 on the control circuit board 6 when the control circuit board 6 contacts the chemical solution containing gold ions, thereby ensuring the subsequent gold immersion effect of the control circuit board 6.

[0021] In this embodiment, the blocking column includes a cylindrical column 12, a column base 13 integrally formed at the lower end of the column 12, a base 14 for supporting the column base 13, and four arc-shaped support plates 15 evenly spaced and distributed inside the column 12. The column 12 extends along the normal direction of the supporting base plate 1. The column 12 and the column base 13 are both made of rubber. The diameter of the column 12 is slightly larger than the diameter of the hole 7. Under the action of elastic force, it has a good blocking effect. The width of the arc-shaped support plate 15 is less than 1 / 4 of the inner circumference of the column 12, which can adapt to a certain radial displacement change.

[0022] The arc-shaped support plate 15 extends along the axial direction of the column 12, and the lower end of the arc-shaped support plate 15 is fixedly connected with a slider 16, which extends along the radial direction of the column 12, and the slider 16 is radially slidably set in a slide groove 17 opened on the pedestal 14; a pressure plate 18 is slidably set on the lower side of the top plate 3, and the top plate 3 is connected to the pressure plate 18 through a telescopic device 19, and the lower side of the pressure plate 18 is connected with a conical nail 21 through a support rod 20, and the conical nail 21 cooperates with the arc-shaped support plate 15 in the column 12.

[0023] The use process of the device of the present invention is as follows: The control circuit board 6 is mounted on the support base plate 1, and the control circuit board 6 is positioned and blocked by the blocking columns corresponding to the holes 7. After the bottom support pins 2 and the pressure pins 4 are used to press the control circuit board 6, the control circuit board 6 is immersed in the gold sink to perform the first stage of the gold sinking process. After the first stage of the gold sinking process is completed, the bottom support pins 2 and the pressure pins 4 ensure the stability of the control circuit board 6. At this time, the blocking component 8 can be retracted to expose the hole 7, which is convenient for the subsequent second stage of the gold sinking operation in the hole to avoid the blocking component 8 from obstructing the inner wall of the hole 7.

[0024] When the plugging column plugs the hole 7, the conical nail 21 is inserted into the inner hole of the column 12. During the continuous insertion of the conical nail 21, the outer side of the conical nail 21 cooperates with the inner side of the arc-shaped support plate 15, forcing the arc-shaped support plate 15 to expand outward to compress the hole 7. It can be understood that by moving the conical nail 21 to different lengths, the arc-shaped support plate 15 can expand the column 12 to different diameters to meet the needs of holes 7 with different diameters.

[0025] In this embodiment, an embedding groove is opened on the lower side of the slider 16, and a ball 22 is installed in the embedding groove for rolling. The slider 16 cooperates with the slide groove 17 through the ball 22. The ball 22 allows the slider 16 and the slide groove 17 to cooperate with each other, thereby reducing friction resistance and reducing the possibility of the arc support plate 15 getting stuck during movement.

[0026] In this embodiment, a guide post 23 is fixed to the outer side of the arc-shaped support plate 15, and the guide post 23 extends in the radial direction. An expansion hole 24 corresponding to the guide post 23 is opened on the column 12, and the outer end of the guide post 23 is connected to the limit member, and the outer end of the expansion hole 24 forms a sink 25 for installing the limit member. The expansion hole 24 is provided to limit the arc-shaped support plate 15, and when the column 12 expands under force, it will not affect the movement of the arc-shaped support plate 15.

[0027] In this embodiment, the limiting platform 10 is made of rubber, and the through hole of the limiting platform 10 is closely matched with the outer side of the column 12, so as to increase the sealing performance of the structure and reduce the entry of impurities.

[0028] In this embodiment, a limiting groove 26 is provided on the support bottom plate 1, and the base 9 is installed in the limiting groove 26. The base 9 is magnetically connected to the support bottom plate 1, which can facilitate the adjustment of the position of the base 9 and can also timely fix the position of the base 9. The bottom support pins 2 and the pressing pins 4 correspond one to one, which can ensure the pressing effect.

[0029] In this embodiment, the support base plate 1 is eccentrically fixed on a vertically placed turntable 27, the center of the turntable 27 is connected to a central axis 28, the top plate 3 is rotatably matched with the turntable 27, the turntable 27 is connected to a rotation drive device 29 through the central axis 28, and the rotation drive device 29 is installed on a horizontal conveyor belt 30, and the horizontal conveyor belt 30 can drive the rotation drive device 29 and the turntable 27 to move in the horizontal direction to achieve the gold sinking operation at different positions. When the positions of the support base plate 1 and the control circuit board 6 are determined, by setting a rotatable turntable 27, the control circuit board 6 located on the upper side can be tilted into the chemical solution, and the inclined immersion method is adopted to further reduce the generation of bubbles and ensure the quality of the subsequent gold sinking process.

[0030] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. A device for controlling chemical gold deposition on the surface of a circuit board, characterized in that: The support frame comprises a supporting base plate, a bottom supporting nail installed on the upper side of the supporting base plate, a top plate arranged parallel to the supporting base plate, a pressing nail installed on the lower side of the top plate, and a clamping device for controlling the normal displacement of the top plate, wherein the bottom supporting nail and the pressing nail cooperate to clamp the control circuit board; the supporting base plate is also provided with a plurality of blocking components corresponding to the holes on the control circuit board, and the blocking components comprise a base, a blocking column, a limiting platform, and a lifting device, wherein the base is installed on the supporting base plate, an opening is formed on the upper side of the base, the blocking column is installed in the opening along a vertical sliding manner, a lifting device is installed at the bottom of the opening, an output end of the lifting device is connected to the blocking column, the limiting platform is fixed at the opening of the base, a through hole is formed in the middle part of the limiting platform for the blocking column to extend out, and the upper end of the limiting platform is used to limit the control circuit board.

2. A device for chemical gold deposition on the surface of a control circuit board according to claim 1, characterized in that: The blocking column includes a cylindrical column body, a column base integrally formed at the lower end of the column body, a pedestal for supporting the column base, and a plurality of arc-shaped support plates evenly spaced inside the column body, wherein the column body and the column base are both made of elastic material; the arc-shaped support plate extends along the axial direction of the column body, and a slider is fixedly connected to the lower end of the arc-shaped support plate, and the slider is radially slidably arranged in a slide groove provided on the pedestal; a pressure plate is slidably arranged on the lower side of the top plate, and the top plate is connected to the pressure plate by a telescopic device, and a conical nail is connected to the lower side of the pressure plate by a support rod, and the conical nail cooperates with the arc-shaped support plate in the column body.

3. A device for chemical gold deposition on the surface of a control circuit board according to claim 2, characterized in that: An embedding groove is provided at the lower side of the sliding block, a ball is rotatably installed in the embedding groove, and the sliding block cooperates with the sliding groove through the ball.

4. A device for chemical gold deposition on the surface of a control circuit board according to claim 3, characterized in that: A guide column is fixed to the outer side of the arc support plate, and the guide column extends radially. An expansion hole corresponding to the guide column is opened on the column body, and the outer end of the guide column is connected to a limiting member, and the outer end of the expansion hole forms a recessed groove for installing the limiting member.

5. A device for chemical gold deposition on the surface of a control circuit board according to claim 2, characterized in that: The limiting platform is made of elastic material, and the through hole of the limiting platform is tightly matched with the outer side of the column.

6. A device for chemical gold deposition on the surface of a control circuit board according to claim 1, characterized in that: The support bottom plate is provided with a limiting groove, the base is installed in the limiting groove, and the base is magnetically connected to the support bottom plate.

7. A device for chemical gold deposition on the surface of a control circuit board according to claim 1, characterized in that: The bottom supporting nails and the pressing nails correspond to each other one by one.

8. A device for chemical gold deposition on the surface of a control circuit board according to any one of claims 1 to 7, characterized in that: The supporting base plate is eccentrically fixed on a vertically placed turntable, the center of the turntable is connected to a central axis, the top plate rotates in cooperation with the turntable, the turntable is connected to a rotation drive device via the central axis, and the rotation drive device is installed on a horizontal conveyor belt.

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