Fiber-submerged vapor chamber structure

Abstract

The invention relates to a fiber submerged vapor chamber structure, which comprises a lower plate, an upper plate and a plurality of support columns, the lower plate is provided with a sealing edge surrounding the periphery of the lower plate and a concave area located on the inner face of the lower plate and surrounded by the sealing edge, and a lower capillary layer is arranged on the inner wall of the concave area. An upper capillary layer is arranged on one surface, corresponding to the lower plate, of the upper plate; the supporting columns are located in the concave area and extend towards the lower plate and the upper plate from the concave area so as to abut against the lower capillary layer and the upper capillary layer. Wherein a strip-shaped fiber layer is arranged in the sunken area, and the fiber layer is flatly laid on the lower capillary layer or the upper capillary layer and pressed by part of the supporting columns. Therefore, the space of the concave area between the supporting columns is vacated so as to meet the requirement of steam circulation.

Description

Technical Field

[0001] The present application is related to a heat conduction component and relates to a fiber-embedded temperature homogenizing plate structure. Background Art

[0002] The existing vapor chamber is mainly composed of upper and lower plates with good thermal conductivity that are welded together to form a vacuum chamber. The interior of the chamber contains high-efficiency heat transfer materials such as capillary structures and working fluids. This allows the vapor chamber to quickly conduct and diffuse heat to its large surface area for cooling after contacting the heat source. It has become one of the indispensable heat dissipation components today.

[0003] In order to improve the heat exchange efficiency inside the temperature equalizer, the capillary structure inside the temperature equalizer is not only sintered powder and metal mesh, but also has additional fibers for rapid transfer of liquid working fluid. However, the temperature equalizer is often equipped with a support structure to maintain the space in its cavity, and after the support structure is spread throughout the temperature equalizer, the aforementioned fibers can only be arranged in the space between the support columns, so that the space that is already insufficient for vapor flow is further reduced, resulting in insufficient air filling flow space for phase change transfer of the vaporized working fluid.

[0004] In view of this, in order to improve and solve the above-mentioned deficiencies, the applicant has devoted himself to research and applied scientific theories, and finally proposed an application with a reasonable design that effectively improves the above-mentioned deficiencies. Summary of the invention

[0005] The main purpose of the present application is to provide a fiber-embedded temperature equalizing plate structure, in which fibers are arranged below some support columns to leave space between the support columns for steam circulation, thereby maintaining sufficient steam space.

[0006] In order to achieve the above-mentioned purpose, the present application provides a fiber-embedded temperature equalizing plate structure, including a lower plate, an upper plate covering the lower plate, and a plurality of support columns arranged between the lower plate and the upper plate; the lower plate has a sealing edge framed on its periphery, and a recessed area located on the inner surface of the lower plate and surrounded by the sealing edge, and a lower capillary layer is arranged on the inner wall of the recessed area; and the upper plate is provided with an upper capillary layer on a surface corresponding to the lower plate, and the sealing edges of the upper plate and the lower plate correspond to each other and are sealed tightly, so that the upper plate is sealed on the recessed area of ​​the lower plate; each support column is located in the recessed area, and extends from the recessed area toward the lower plate and the upper plate respectively, so as to abut against the lower capillary layer and the upper capillary layer; wherein, at least one strip-shaped fiber layer is arranged in the recessed area, and the fiber layer is laid flat on the lower capillary layer or the upper capillary layer and is pressed by part of the support columns. The fiber layer can be hidden under or above a portion of the support pillars, thereby leaving a recessed area between the support pillars for steam circulation.

[0007] In one embodiment of the present application, the lower plate and the upper plate are made of aluminum or copper in a plate-like body.

[0008] In one embodiment of the present application, a lower degassing end is protrudingly provided on either side of the lower plate, and an upper degassing end is protrudingly provided on either side of the upper plate, and the lower degassing end corresponds to the upper degassing end.

[0009] In one embodiment of the present application, the lower capillary layer is composed of a first lower capillary layer and a second lower capillary layer, and the fiber layer is sandwiched between the first lower capillary layer and the second lower capillary layer.

[0010] In one embodiment of the present application, the fiber layer is sandwiched by the lower plate and the lower capillary layer.

[0011] In one embodiment of the present application, the lower capillary layer is composed of a first lower capillary layer and a second lower capillary layer, and the fiber layer is sandwiched between the first lower capillary layer and the second lower capillary layer.

[0012] In one embodiment of the present application, the fiber layer is sandwiched by the upper plate and the upper capillary layer.

[0013] In one embodiment of the present application, the lower capillary layer and the upper capillary layer are formed by powder sintering or woven mesh.

[0014] In one embodiment of the present application, a boss is provided on the lower plate further protruding outward from the recessed area, the interior of the boss is connected to the recessed area, and the fiber layer passes through the boss.

[0015] In one embodiment of the present application, the fiber layer further has a sunken section located in the boss.

[0016] In one embodiment of the present application, the portion of the fiber layer located in the recessed area is an upward sinking section, and the downward sinking section and the upward sinking section are bent to form a step difference and are connected as a whole.

[0017] In one embodiment of the present application, a support column is also provided in the boss, and the support column located in the boss is pressed on the sinking section.

[0018] In one embodiment of the present application, a sinking capillary layer is provided in the boss.

[0019] In one embodiment of the present application, the sinking capillary layer is powder sintered. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional exploded view of the first embodiment of the present application.

[0021] Figure 2 This is a plan view of the first embodiment of the present application.

[0022] Figure 3 Based on Figure 2Sectional view of section 3-3.

[0023] Figure 4 Based on Figure 2 Sectional view of section 4-4.

[0024] Figure 5 It is a three-dimensional exploded view of the second embodiment of the present application.

[0025] Figure 6 This is a plan view of the second embodiment of the present application.

[0026] Figure 7 Based on Figure 6 Sectional view of section 7-7.

[0027] Figure 8 It is a cross-sectional view of the third embodiment of the present application.

[0028] Fig. 9 It is a cross-sectional view of the fourth embodiment of the present application.

[0029] Fig.10 It is a cross-sectional view of the fifth embodiment of the present application.

[0030] Fig.11 It is a cross-sectional view of the sixth embodiment of the present application.

[0031] Fig.12 It is a cross-sectional view of the seventh embodiment of the present application.

[0032] Description of reference numerals:

[0033] 1: Lower the board;

[0034] 10: seal the edge;

[0035] 100: boss;

[0036] 11: Depression area;

[0037] 110: lower capillary layer;

[0038] 110a: first lower capillary layer;

[0039] 110b: second lower capillary layer;

[0040] 12: lower degassing end;

[0041] 2: Upper plate;

[0042] 20: Upper capillary layer;

[0043] 20a: first upper capillary layer;

[0044] 20b: second upper capillary layer;

[0045] 21: upper degassing end;

[0046] 3: Support column;

[0047] 4: fiber layer;

[0048] 40: sinking section;

[0049] 41: Sinking section. DETAILED DESCRIPTION

[0050] In order to further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the attached drawings are only provided for reference and illustration and are not intended to limit the present application.

[0051] See also Figure 1 and Figure 2 , are respectively a three-dimensional exploded view and a plane combined top view of the first embodiment of the present application. The present application provides a fiber submerged heat equalizing plate structure, comprising a lower plate 1, an upper plate 2 covering the lower plate, and a plurality of support columns 3 arranged between the lower plate 1 and the upper plate 2; wherein:

[0052] The lower plate 1 and the upper plate 2 can both be made of a plate-shaped body made of materials such as aluminum or copper. The lower plate 1 has a sealing edge 10 framed at its periphery, and a recessed area 11 located on the inner surface of the lower plate 1 and surrounded by the sealing edge 10, and a lower capillary layer 110 is provided on the inner wall of the recessed area 11. The lower capillary layer 110 can be made of powder sintering or woven mesh. A lower degassing end 12 can be protrudingly provided on either side of the lower plate 1.

[0053] As mentioned above, the upper plate 2 covers the lower plate 1, and the upper plate 2 is in the shape of a flat plate, and the upper plate 2 is provided with an upper capillary layer 20 on a surface corresponding to the lower plate 1, and the upper capillary layer 20 can also be made of powder sintering or woven mesh. The sealing edges 10 of the upper plate 2 and the lower plate 1 correspond to each other and are sealed tightly, so that the upper plate 2 can be sealed on the recessed area 11 of the lower plate 1. In addition, an upper degassing end 21 can be protruding on either side of the upper plate 2, and corresponds to the lower degassing end 12 of the lower plate 1, so as to be required for degassing after the lower plate 1 and the upper plate 2 are sealed. After the degassing is completed, the working fluid (not shown) can be injected through the through hole formed between the lower degassing end 12 and the upper degassing end 21, so that the working fluid can transfer heat by phase change in the recessed area 11 between the lower plate 1 and the upper plate 2.

[0054] like Figures 2 to 4As shown, the equal number of support columns 3 are located in the recessed area 11 of the lower plate 1, and extend from the recessed area 11 toward the upper plate 2 to abut against the upper capillary layer 20 of the upper plate 2. The present application mainly provides at least one strip-shaped fiber layer 4 in the recessed area 11, and the fiber layer 4 is laid flat on the lower capillary layer 110 of the lower plate 1 and is suppressed by part of the support columns 3, so as to be hidden under the part of the support columns 3 suppressed by the fiber layer 4. In this way, not only can the setting of the fiber layer 4 be maintained to perform its transmission effect on the aforementioned working fluid in the liquid state, but also the space between the recessed area 11 and the support columns 3 can be vacated (i.e., Figure 4 As shown), to provide the space required for the aforementioned working fluid to circulate as vapor when it is in a vapor-liquid state.

[0055] Therefore, by means of the above-mentioned structural composition, the fiber submerged temperature equalizing plate structure of the present application can be obtained.

[0056] Furthermore, if Figures 5 to 7 As shown, in the second embodiment of the present invention, the lower plate 1 may further protrude a boss 100 from the recessed area 11, the inside of the boss 100 is connected to the recessed area 11, and a sinking capillary layer 111 is provided in the boss 100, and the support column 3a is also provided in the boss 100. The fiber layer 4 passes through the boss 100, and has a sinking section 40 located in the boss 100, and at least one sinking section 41 located in the recessed area 11. The sinking section 40 and the sinking section 41 can be connected as a whole by a step difference formed by bending, and the support column 3a provided in the boss 100 can also be pressed on the sinking section 40 of the fiber layer 4, and the sinking section 41 of the fiber layer 4 is also pressed by part of the support column 3 located in the recessed area 11. In this way, not only more steam space can be vacated in the recessed area 11, but also space can be vacated in the boss 100 for the vaporized working fluid to flow.

[0057] In addition, if Figure 8 As shown, in the third embodiment of the present application, the fiber layer 4 can also be laid flat under the lower capillary layer 110 of the lower plate 1, that is, sandwiched between the lower plate 1 and the lower capillary layer 110, and the support column 3 is still pressed against the fiber layer 4. Fig. 9 As shown, in the fourth embodiment of the present application, the lower capillary layer 110 can also be composed of a first lower capillary layer 110a and a second lower capillary layer 110b, wherein the first lower capillary layer 110a is arranged on the inner wall of the recessed area 11 of the lower plate 1, and the second lower capillary layer 110b and the first lower capillary layer 110a are sandwiched together with the fiber layer 4, and the support column 3 is still pressed against the fiber layer 4.

[0058] Furthermore, if Figures 10 to 12As shown, in the fifth to seventh embodiments of the present application, the fiber layer 4 can also be laid flat on the upper capillary layer 110 of the upper plate 2. Fig.10 As shown, the fiber layer 4 is laid flat under the upper capillary layer 20 of the upper plate 2 and is pressed by the support column 3 extending toward the upper plate 2. Fig.11 As shown, the upper capillary layer 20 can also be composed of a first upper capillary layer 20a and a second upper capillary layer 20b, wherein the first upper capillary layer 20a is arranged on the inner wall of the upper plate 2, and the second upper capillary layer 20b and the first upper capillary layer 20a sandwich the fiber layer 4, and the support column 3 is still arranged under the fiber layer 4 to press upward. Fig.12 As shown, the fiber layer 4 can also be laid flat between the upper plate 2 and the upper capillary layer 20 to sandwich the fiber layer 4, and the support column 3 still corresponds to the fiber layer 4 to press upward.

[0059] Therefore, by using the fiber-embedded heat absorbing plate structure of the present application, the fiber layer 4 is disposed below part of the support column 3, thereby leaving space between the support columns 3 and 3a in the recessed area 11 or the boss 10 for the steam flow to maintain sufficient steam space. At the same time, the transfer effect of the fiber layer 4 can also be maintained.

Claims

1. A fiber-immersed temperature-averaging plate structure, characterized in that: include: The lower plate has a sealing edge framed at its periphery, and a recessed area located on the inner surface of the lower plate and surrounded by the sealing edge, wherein a lower capillary layer is provided on the inner wall of the recessed area; An upper plate, covering the lower plate, wherein an upper capillary layer is provided on a surface of the upper plate corresponding to the lower plate, and the sealing edges of the upper plate and the lower plate correspond to each other and are sealed tightly, so that the upper plate is sealed on the concave area of ​​the lower plate; as well as A plurality of support columns are disposed between the lower plate and the upper plate and are located in the recessed area, and extend from the recessed area toward the lower plate and the upper plate respectively to abut against the lower capillary layer and the upper capillary layer; Wherein, at least a strip-shaped fiber layer is provided in the recessed area, and the fiber layer is laid flat on the lower capillary layer or the upper capillary layer and is pressed by a portion of the support column.

2. The fiber-immersed temperature equalizing plate structure according to claim 1, characterized in that: The lower plate and the upper plate are made of aluminum or copper in plate-like form.

3. The fiber-immersed temperature equalizing plate structure according to claim 1, characterized in that: A lower degassing end is protrudingly provided on either side of the lower plate, and an upper degassing end is protrudingly provided on either side of the upper plate, and the lower degassing end corresponds to the upper degassing end.

4. The fiber-immersed temperature equalizing plate structure according to claim 1, characterized in that: The lower capillary layer is composed of a first lower capillary layer and a second lower capillary layer, and the fiber layer is sandwiched between the first lower capillary layer and the second lower capillary layer.

5. The fiber-immersed temperature equalizing plate structure according to claim 1, characterized in that: The fiber layer is sandwiched by the lower plate and the lower capillary layer.

6. The fiber-immersed temperature equalizing plate structure according to claim 1, characterized in that: The lower capillary layer is composed of a first lower capillary layer and a second lower capillary layer, and the fiber layer is sandwiched between the first lower capillary layer and the second lower capillary layer.

7. The fiber-immersed temperature equalizing plate structure according to claim 1, characterized in that: The fiber layer is sandwiched by the upper plate and the upper capillary layer.

8. The fiber-immersed temperature equalizing plate structure according to claim 1, characterized in that: The lower capillary layer and the upper capillary layer are formed by powder sintering or woven mesh.

9. The fiber submerged temperature equalizing plate structure according to any one of claims 1 to 7, characterized in that: The lower plate is provided with a boss further protruding outward from the recessed area, the interior of the boss is connected with the recessed area, and the fiber layer passes through the boss.

10. The fiber-immersed temperature equalizing plate structure according to claim 9, characterized in that: The fiber layer also has a sunken section located within the boss.

11. The fiber-immersed temperature equalizing plate structure according to claim 10, characterized in that: The portion of the fiber layer located in the recessed area is an upward sinking section, and the downward sinking section and the upward sinking section are bent to form a step difference and are connected as a whole.

12. The fiber-immersed temperature equalizing plate structure according to claim 10, characterized in that: The support column is also arranged in the boss, and the support column located in the boss is pressed on the sinking section.

13. The fiber-immersed temperature equalizing plate structure according to claim 12, characterized in that: A sinking capillary layer is arranged in the boss.

14. The fiber-immersed temperature equalizing plate structure according to claim 13, characterized in that: The sinking capillary layer is powder sintered.

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