Electrostatic imaging method and device based on array type electrostatic sensor

Abstract

The invention provides an electrostatic imaging method and device based on an array type electrostatic sensor, and the method comprises the steps: enabling each electric field sensitive element in the array type electrostatic sensor to sense a charge signal of the surface of a detected object, so as to obtain each analog charge signal; after digital charge signal values corresponding to the analog charge signals are obtained, the digital charge signal values are stored according to the corresponding relation; obtaining a sensitive element surface electric field value of each electric field sensitive element according to each digital charge signal value; and according to the physical address of each electric field sensitive element, inputting the corresponding surface electric field value of each sensitive element or each digital charge signal value into an electric field intensity-position distribution table so as to obtain an electrostatic distribution image of the measured object. The static electricity distribution information can be accurately obtained, the problem that static charges on the surface of an insulator are not uniformly distributed and are difficult to accurately measure is solved, the static electricity eliminator can be installed in a targeted mode according to the charge distribution condition in an electric field image, and waste caused by excessive use of the static electricity eliminator is avoided.

Description

Technical Field

[0001] The present invention relates to the field of sensor imaging, and in particular to an electrostatic imaging method and device based on an array type electrostatic sensor. Background Art

[0002] In industry and daily life, the surface of the object being measured will carry a certain amount of static electricity due to friction, contact, induction, and polarization. Especially in industrial production lines, the hazards of static electricity mainly include fire and explosion hazards, electric shock injuries, electronic equipment failures, equipment damage, product quality degradation, and personal safety hazards.

[0003] For example, when film application and film tearing operations are performed in the production line, static electricity will accumulate or remain on the surface of the film. In order to prevent static electricity from affecting the quality of the film, it is necessary to eliminate the static electricity on the film through an electrostatic eliminator. However, since the existing electrostatic field testing equipment can usually only obtain the electric field value on the surface of the film, it is difficult to obtain the static electricity distribution on the surface of the film. Only a number of static electricity eliminators can be set above the film to eliminate the accumulated or residual static electricity at various positions, but it is impossible to install static electricity eliminators in a targeted manner according to the charge distribution, resulting in material consumption of static electricity eliminators.

[0004] Therefore, how to obtain the charge distribution on the surface of the object being measured and install the static elimination device in a targeted manner according to the charge distribution to avoid waste caused by excessive use of the static elimination device is an urgent problem to be solved. Summary of the invention

[0005] In response to the shortcomings existing in the above-mentioned problems, the present invention provides an electrostatic imaging method and device based on an array electrostatic sensor, which can accurately obtain the corresponding electric field image and install the electrostatic elimination device in a targeted manner according to the charge distribution in the electric field image to avoid excessive consumption of the electrostatic elimination device.

[0006] To achieve the above object, in a first aspect, the present invention provides an electrostatic imaging method based on an array electrostatic sensor, comprising the following steps:

[0007] Each electric field sensitive element in the array electrostatic sensor senses the charge signal on the surface of the object to be measured to obtain each analog charge signal;

[0008] After obtaining the digital charge signal value corresponding to each of the analog charge signals, each of the digital charge signal values ​​is stored in a corresponding storage area according to the corresponding relationship;

[0009] Obtaining a surface electric field value of each electric field sensitive element according to each digital charge signal value;

[0010] According to the physical address of each electric field sensitive element, the corresponding surface electric field value of each sensitive element or each digital charge signal value is input into the electric field strength-position distribution table to obtain the electric field image of the object to be measured.

[0011] In one embodiment, after obtaining each digital charge signal value according to each analog charge signal, and saving each digital charge signal value into a corresponding storage area according to a corresponding relationship, the method includes:

[0012] Converting each of the analog charge signals into a corresponding digital charge signal;

[0013] Filtering each of the digital charge signals to eliminate interference signals in each of the digital charge signals to obtain each of the digital charge signal values;

[0014] According to the physical address of each electric field sensitive element in the array electrostatic sensor, the digital charge signal value corresponding thereto is stored in a storage area corresponding to the physical address in the memory.

[0015] In one of the embodiments, obtaining the element surface electric field value of each of the electric field sensitive elements according to each of the digital charge signal values ​​includes:

[0016] Calibrate the array electrostatic sensor to obtain the sensor surface electric field value of the array electrostatic sensor;

[0017] Obtaining a sensitivity coefficient corresponding to a current digital charge signal value according to the sensor surface electric field value and each digital charge signal value;

[0018] Obtaining the surface electric field value of each of the electric field sensitive elements according to the corresponding digital charge signal value and the sensitivity coefficient;

[0019] According to the physical address of each electric field sensitive element in the array electrostatic sensor, the surface electric field value of the sensitive element corresponding thereto is stored in a storage area corresponding to the physical address in the memory.

[0020] In one embodiment, the step of calibrating the array electrostatic sensor to obtain the sensor surface electric field value of the array electrostatic sensor includes:

[0021] The array type electrostatic sensor is calibrated by using a flat plate capacitor, and the electric field value on the sensor surface is obtained after the array type electrostatic sensor passes through the flat plate capacitor along the moving axis.

[0022] In one of the embodiments, the storage area stores the digital charge signal value corresponding to the electric field sensitive element and the surface electric field value of the sensitive element.

[0023] In one embodiment, the step of inputting the corresponding surface electric field values ​​of each of the electric field sensitive elements or the digital charge signal values ​​into an electric field strength-position distribution table according to the physical addresses of each of the electric field sensitive elements to obtain an electric field image of the object under test comprises:

[0024] In the electric field strength-position distribution table, a corresponding designated color block is obtained according to the electric field value on the surface of each of the sensitive elements or the value of each of the digital charge signals;

[0025] Performing gradient processing on the designated color block to form a designated gradient color block;

[0026] According to the physical address of each electric field sensitive element in the array electrostatic sensor, the corresponding designated gradient color blocks are sequentially stored in the electric field image template to form an electric field image corresponding to the charge distribution of the object under test.

[0027] In one of the embodiments, the step of performing a gradient process on the designated color block to form a designated gradient color block includes:

[0028] Divide the designated color block into N unit designated color blocks, where N≥2;

[0029] Divide at least one coordinated color block into N' unit coordinated color blocks, where N'=N;

[0030] The N unit designated color blocks and the N' unit gradient color blocks are superimposed and merged in sequence to form a designated gradient color block.

[0031] In a second aspect, the present invention further provides a device for implementing the above-mentioned electrostatic imaging method based on an array electrostatic sensor, comprising:

[0032] An array electrostatic sensor includes a plurality of electric field sensitive elements, an analog-to-digital conversion module, a processor and a data communication module, wherein:

[0033] Each of the electric field sensitive elements is used to sense the charge signal on the surface of the object to be measured to obtain each analog charge signal;

[0034] The analog-to-digital conversion module is connected to each of the electric field sensitive elements and is used to convert each of the analog charge signals into each digital charge signal;

[0035] The processor is connected to the analog-to-digital conversion module, and is used to obtain each digital charge signal value of each electric field sensitive element and each surface electric field value of each sensitive element, and save the digital charge signal value and the surface electric field value of each electric field sensitive element corresponding to the physical address of each electric field sensitive element;

[0036] The data communication module is connected to the processor and is used to read each of the digital charge signal values ​​or each of the surface electric field values ​​of the sensitive elements stored in the processor;

[0037] The imaging module is connected to the data communication module, inputs the read digital charge signal values ​​or the surface electric field values ​​of the sensitive elements into the electric field strength-position distribution table, and processes the surface electric field values ​​of the sensitive elements or the digital charge signal values ​​to obtain an electric field image of the object under test.

[0038] In one embodiment, the processor includes:

[0039] A filtering unit, used to filter each of the digital charge signals to eliminate interference signals in each of the digital charge signals to obtain a value of each of the digital charge signals;

[0040] A calculation module, used to obtain a sensitivity coefficient corresponding to each of the digital charge signal values, and to obtain a surface electric field value of each of the electric field sensitive elements;

[0041] The memory includes a plurality of storage areas, and is used for storing the surface electric field value of each electric field sensitive element and the digital charge signal value corresponding to the physical address of each electric field sensitive element.

[0042] In one embodiment, the electric field strength-position distribution table includes:

[0043] An analysis module, used for obtaining a corresponding designated color block according to the surface electric field value of each of the sensitive elements or the value of each of the digital charge signals;

[0044] A pattern generation module, used for performing gradient processing on each of the designated color blocks to form each designated gradient color block;

[0045] An electric field image template, used for receiving each of the specified gradient color blocks;

[0046] The pattern synthesis module is used to synthesize the designated gradient color blocks in the electric field image template to form an electric field image corresponding to the charge distribution of the object under test.

[0047] In one embodiment, the pattern generation module includes:

[0048] A division unit, used to divide the designated color block into N unit designated color blocks, and to divide at least one coordinated color block into N' unit coordinated color blocks, wherein N≥2, and N'=N;

[0049] The gradient pattern color block unit is used to superimpose and merge N unit designated color blocks and N' unit gradient color blocks in sequence to form the designated gradient color block.

[0050] Compared with the prior art, the present invention has one of the following advantages:

[0051] The present invention calculates the charge signals collected by each electric field sensitive element and arranges them according to the physical position of each electric field sensitive element, so as to accurately obtain the corresponding electrostatic gradient color block image, intuitively display the charge distribution information of the measured object, and solve the problem that the non-uniform distribution of static charge on the surface of the insulator is difficult to accurately measure. In practical applications, the active static eliminator can be installed in a targeted manner according to the charge distribution in the electric field image, so as to avoid the waste caused by excessive use of static eliminators.

[0052] The electric field strength-position distribution table can be used to generate a corresponding electric field image according to each digital charge signal value or each surface electric field value of each sensitive element; since the setting conditions in the electric field strength-position distribution table can be modified, the corresponding electric field image can be generated according to different requirements;

[0053] The electric field image is formed by merging multiple specified gradient color blocks, which makes the electric field image appear softer and allows for more intuitive observation of the charge distribution on the surface of the object being measured.

[0054] The data analysis model can determine whether to generate a warning instruction based on the analysis results, or generate a fault instruction when it is determined that the electric field sensitive element has a fault and the collected analog charge signals are incorrect;

[0055] By comparing the physical address of the area with too high electric field amplitude in the object under test with the physical address of the dark area in the electric field image, it can be determined whether the collection and analysis results of the charge signal on the surface of the object under test are accurate;

[0056] By solidifying the electric field sensing elements, analog-to-digital conversion modules, processors and data communication modules on the same circuit board, the volume of the array-type electrostatic sensor can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 is a flow chart of the electrostatic imaging method of the present invention;

[0058] Figure 2 is a flow chart of the electrostatic imaging method in this embodiment;

[0059] Figure 3 is another flow chart of the electrostatic imaging method in this embodiment;

[0060] Figure 4 is a structural block diagram of the electrostatic imaging device in the present invention;

[0061] Figure 5 for Figure 4 Schematic diagram of the structure;

[0062] Figure 6 for Figure 4 The structural block diagram of the array electrostatic sensor;

[0063] Figure 7 for Figure 4 The structural block diagram of the main control module;

[0064] Figure 8 for Figure 4 The structural block diagram of the imaging module;

[0065] Fig. 9 It is an electric field image obtained by an electrostatic imaging method and an electrostatic imaging device.

[0066] The main reference numerals are as follows:

[0067] 1-electric field sensitive element; 2-analog-to-digital conversion module; 3-processor; 4-data communication module; 5-imaging module; 501-analysis module; 502-pattern generation module; 503-electric field image template; 504-pattern synthesis module; 6-main control module; 7-shielding shell. DETAILED DESCRIPTION

[0068] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] like Figure 1 As shown, the present invention provides an electrostatic imaging method based on an array electrostatic sensor, comprising the following steps:

[0070] Each electric field sensitive element in the array electrostatic sensor senses the charge signal on the surface of the object to be measured to obtain each analog charge signal;

[0071] After obtaining the digital charge signal value corresponding to each analog charge signal, each digital charge signal value is saved in a corresponding storage area according to the corresponding relationship;

[0072] Obtaining the surface electric field value of each electric field sensitive element according to each digital charge signal value;

[0073] According to the physical address of each electric field sensitive element, the corresponding surface electric field value of each sensitive element or each digital charge signal value is input into the electric field strength-position distribution table to obtain the electric field image of the object under test.

[0074] The present invention calculates the charge signals collected by each electric field sensitive element and arranges them according to the physical position of each electric field sensitive element, so as to accurately obtain the corresponding electrostatic gradient color block diagram, thereby more intuitively displaying the charge distribution of the object under test, and installing the electrostatic eliminator in a targeted manner according to the charge distribution to avoid excessive consumption of the electrostatic eliminator.

[0075] Embodiment 1

[0076] like Figure 2 As shown, this embodiment provides an electrostatic imaging method based on an array electrostatic sensor, comprising the following steps:

[0077] S101. Each electric field sensitive element in the array electrostatic sensor senses a charge signal on the surface of the object to be measured to obtain each analog charge signal.

[0078] Specifically, the array electrostatic sensor includes a circuit board, electric field sensitive elements solidified thereon, analog-to-digital conversion modules and a processor, wherein each electric field sensitive element is electrically connected to each analog-to-digital conversion module, and each analog-to-digital conversion module is electrically connected to the processor.

[0079] In this embodiment, each electric field sensitive element is solidified on the same side of the circuit board and arranged at equal intervals to form a collection array. When the array electrostatic sensor contacts the object to be measured along the motion axis, each electric field sensitive element can sense the analog charge signal of the area on the object to be measured corresponding to the position of each electric field sensitive element, wherein the number of analog charge signals obtained is the same as the number of electric field sensitive elements.

[0080] Furthermore, the plurality of electric field sensitive elements may be divided into a plurality of groups, and each electric field sensitive element in each group is defined with a physical address.

[0081] In this embodiment, a plurality of electric field sensitive elements are divided into three groups (i.e., the first group, the second group, and the third group), and the three groups of electric field sensitive elements are arranged in parallel. Each group includes six electric field sensitive elements arranged in parallel (i.e., the first electric field sensitive element to the sixth electric field sensitive element), wherein the physical address of each electric field sensitive element can be selected from the position number, for example: the second electric field sensitive element of the first group can be defined as "1-2", wherein "1" represents the group name (i.e., the first group), "2" represents the position (i.e., the second electric field sensitive element), and "-" represents the separator.

[0082] Furthermore, the contact between the array-type electrostatic sensor and the object to be measured specifically refers to that when the array-type electrostatic sensor moves along the movement axis and passes through the upper area of ​​the object to be measured, the array-type electrostatic sensor is in contact with the object to be measured.

[0083] Preferably, the closer the distance between the two is, the more accurate the charge signal of the object being measured is sensed.

[0084] S102, converting each analog charge signal into a corresponding digital charge signal.

[0085] Specifically, each analog charge signal is converted into a corresponding digital charge signal through an analog-to-digital conversion module.

[0086] In this embodiment, there are three analog-to-digital conversion modules, wherein the three analog-to-digital conversion modules are arranged in parallel, and each analog-to-digital conversion module is electrically connected to a group of electric field sensitive elements to receive the analog charge signals obtained by each electric field sensitive element in the group of electric field sensitive elements and convert them into corresponding digital charge signals.

[0087] Among them, when each electric field sensitive element obtains the analog charge signal and sends the analog charge signal to the analog-to-digital conversion module, its position number (i.e., physical address) is added at the position before the analog charge signal or at the position after the analog charge signal, so that in subsequent operation steps, its position in the object under test can always be known according to the position number.

[0088] S103 , filtering each digital charge signal to obtain each digital charge signal value.

[0089] Specifically, each digital charge signal is filtered to eliminate interference signals in each digital charge signal to obtain each digital charge signal value.

[0090] In this embodiment, a programmable sliding average filter is used, and the filtering effect is controlled by adjusting the size of the sliding window.

[0091] Exemplarily, each digital charge signal is filtered using the following formula to obtain each digital charge signal value:

[0092]

[0093] Where y[n] is the output of the sliding average filter (ie, the digital charge signal value), x[n] is the input signal, and N is the size of the sliding window.

[0094] The main features of the sliding average filter include fast speed, good real-time performance and high smoothness, and it has a good inhibitory effect on periodic interference.

[0095] Furthermore, when filtering the digital charge signal, corresponding digital charge signal values ​​may be obtained according to the group and the arrangement order of each electric field sensitive element in the group.

[0096] S104, storing each digital charge signal value in a corresponding storage area of ​​the memory.

[0097] Specifically, the memory includes several storage areas, and the physical address of each storage area in the memory corresponds to the physical address of each electric field sensitive element, so that each digital charge signal can be stored in the corresponding storage area according to its physical address.

[0098] The form of the physical address of the storage area in the memory is not limited in this application, and it is only necessary that the physical address of the electric field sensitive element can correspond to the physical address of the storage area.

[0099] S105 , calibrating the array electrostatic sensor to obtain the electric field value on the sensor surface.

[0100] Specifically, a flat plate capacitor is used to calibrate the array electrostatic sensor, and the electric field value on the sensor surface is obtained after the array electrostatic sensor passes through the flat plate capacitor along the moving axis.

[0101] In this embodiment, the flat plate capacitor includes an upper metal plate and a lower metal plate spaced apart from each other, wherein the spacing between the two metal plates is approximately 20 cm. When calibrating the array electrostatic sensor, a voltage is applied to the lower metal plate, and the upper metal plate is grounded, so that an electric field is formed between the upper metal plate and the lower metal plate. When the array electrostatic sensor passes between the upper metal plate and the lower metal plate, the electric field value on the sensor surface is obtained using the following formula:

[0102]

[0103] Wherein, E is the electric field value on the sensor surface, U is the voltage value of the lower metal plate, and d is the distance value between the upper metal plate and the lower metal plate.

[0104] S106. Obtain a sensitivity coefficient corresponding to the current digital charge signal value.

[0105] Specifically, the following formula is used to obtain the sensitivity coefficient value of each digital charge signal value based on the sensor surface electric field value and each digital charge signal value obtained above:

[0106]

[0107] Where K is the sensitivity coefficient value, y[n] is the value of each digital charge signal obtained above, and v 0 are the digital charge signal values ​​obtained when both the upper metal plate and the lower metal plate are grounded, and E is the electric field value on the sensor surface.

[0108] In one embodiment, the sensitivity coefficient value corresponds to the digital charge signal value. When the charge signals collected by the electric field sensitive elements are different, the obtained digital charge signal values ​​are also different, so that the sensitivity coefficient values ​​finally obtained are also different.

[0109] In one possible embodiment, the sensitivity coefficient value corresponds to the digital charge signal value. When the charge signals collected by the electric field sensitive elements are the same, the obtained digital charge signal values ​​are also the same, so that the sensitivity coefficient values ​​finally obtained are also the same.

[0110] S107, obtaining the surface electric field value of each electric field sensitive element.

[0111] Specifically, the following formula is used to obtain the surface electric field value of each electric field sensitive element according to the sensitivity coefficient values ​​and the digital charge signal values ​​obtained above:

[0112]

[0113] Where E' is the surface electric field value of the sensitive element, K is the sensitivity coefficient value, y[n] is the digital charge signal value obtained above, and v 0 These are the digital charge signal values ​​obtained when both the upper metal plate and the lower metal plate are grounded.

[0114] S108. Store the surface electric field value of each sensitive element in a corresponding storage area of ​​the memory.

[0115] Specifically, after obtaining the surface electric field value of each sensitive element, since the surface electric field value of the sensitive element corresponds to the digital charge signal value, the surface electric field value of the sensitive element can be stored in a corresponding storage area according to the physical address contained in the digital charge signal value.

[0116] S109. The serial data communication module calls the stored surface electric field value of the sensitive element or each digital charge signal value according to the physical address of the storage area, and inputs the stored value into the electric field strength-position distribution table.

[0117] S110 , querying the corresponding designated color block according to the surface electric field value of each sensitive element or the value of each digital charge signal.

[0118] Preferably, in the electric field strength-position distribution table, a designated color block corresponding to the electric field value on the surface of the sensitive element is obtained according to a preset corresponding relationship.

[0119] Furthermore, after querying the electric field value on the surface of each sensitive element, a designated color block corresponding to the electric field value on the surface of each sensitive element is obtained.

[0120] Exemplarily, in the electric field strength-position distribution table, when the surface electric field value of the sensitive element is set to 0-2KV / M, the color of the corresponding designated color block is green, when the surface electric field value of the sensitive element is 2.1-4KV / M, the color of the corresponding designated color block is blue, when the surface electric field value of the sensitive element is 4.1-6KV / M, the color of the corresponding designated color block is yellow, when the surface electric field value of the sensitive element is 6.1-8KV / M, the color of the corresponding designated color block is purple, and when the surface electric field value of the sensitive element is 8.1-10KV / M, the color of the corresponding designated color block is red.

[0121] When the surface electric field value of the sensitive element input into the electric field strength-position distribution table by the serial data communication module is 3KV / M, the color of the corresponding designated color block is blue.

[0122] S111 . Perform gradient processing on a designated color block to form a designated gradient color block.

[0123] Specifically, the designated color block is divided into N unit designated color blocks, where N≥2.

[0124] Furthermore, the sensitive element is divided into N unit designated color blocks according to the electric field value on the surface of the sensitive element, wherein the larger the electric field value on the surface of the sensitive element is, the fewer the number of unit designated color blocks into which the designated color block corresponding to it is divided, the less obvious the gradient effect in the designated gradient color block is, and the more the original color of the designated color block can be highlighted. This design can highlight the color of the designated color block, so that the charge distribution of the designated area in the object to be measured can be more intuitively known through the color.

[0125] Furthermore, when dividing the designated color blocks, the average value of the surface electric field value of the sensitive element can be obtained according to the number of the unit designated color blocks to be divided, so as to obtain the display effect of the designated gradient color blocks from light to dark.

[0126] Exemplarily, when the surface electric field value of the sensitive element is 0-2KV / M, the designated green color block is divided into 10 unit designated color blocks, when the surface electric field value of the sensitive element is 2.1-4KV / M, the designated blue color block is divided into 8 unit designated color blocks, when the surface electric field value of the sensitive element is 4.1-6KV / M, the designated blue color block is divided into 6 unit designated color blocks, when the surface electric field value of the sensitive element is 2.1-8KV / M, the designated blue color block is divided into 4 unit designated color blocks, and when the surface electric field value of the sensitive element is 8.1-10KV / M, the designated blue color block is divided into 2 unit designated color blocks.

[0127] In addition, in another embodiment, in order to allow the designated gradient color block to present a softer display effect, the designated gradient color block may be overlapped with the matching color block, thereby presenting a different display effect.

[0128] Specifically, at least one coordinated color block is divided into N' unit coordinated color blocks, where N'=N.

[0129] The N unit specified color blocks and the N' unit matching color blocks are superimposed and merged in sequence to form a specified gradient color block.

[0130] Furthermore, the color of the matching color block should be a light color to avoid excessive changes in the color of the designated color block after overlapping or merging due to the matching color block being too dark, thereby affecting the color judgment.

[0131] Exemplarily, the matching color block is light gray, and after being subjected to gradient processing, superimposing and merging it with the specified gradient color block will not change the color of the specified color block, thereby affecting the color judgment.

[0132] S112, sequentially saving the corresponding designated gradient color blocks in the electric field image template to form an electric field image.

[0133] Specifically, after obtaining each designated gradient color block, it is placed in the corresponding electric field image template according to its physical address, so as to be used to synthesize each designated gradient color block in the electric field image template to form an electric field image corresponding to the charge distribution of the object under test, and the electric field image is displayed through the imaging module.

[0134] After the electric field image is generated, the digital charge signal values ​​and the surface electric field values ​​of the sensitive elements corresponding to the electric field sensitive elements stored in the memory are cleared, thereby waiting to receive and store the next batch of digital charge signal values ​​and surface electric field values ​​of the sensitive elements.

[0135] In addition, in step S109, an electric field strength-position distribution table is also included, wherein the electric field strength-position distribution table can implement the steps in the above steps S109 to S111.

[0136] Before the implementation of step S109, it also includes constructing an electric field strength-position distribution table according to preset conditions, wherein the preset conditions at least include setting the corresponding designated color block color according to the electric field value on the surface of the sensitive element, setting the number of unit designated color blocks according to the size of the electric field value on the surface of the sensitive element, and setting the style of the electric field image template according to the number and arrangement order of designated gradient color blocks.

[0137] Embodiment 2

[0138] like Figure 3 As shown, this embodiment provides an electrostatic imaging method based on an array electrostatic sensor, wherein the implementation steps of steps S201 to S212 in this embodiment are the same as Figure 2 The implementation steps of step S101 to step S112 in the embodiment 1 recorded in are the same, except that, in this embodiment, step S213 to step S216 are also included.

[0139] S213: Determine whether the digital charge signal value is greater than a preset threshold.

[0140] Specifically, according to the order of each digital charge signal value obtained in step S203, each digital charge signal value is analyzed in the input data analysis model to determine whether each digital charge signal value is greater than a preset threshold.

[0141] Furthermore, after obtaining each digital charge signal value according to the filtering order in the above step S203, each digital charge signal value is analyzed in the input data analysis model respectively. If the digital charge signal value is greater than the preset threshold, it is determined that the electric field amplitude of the corresponding area of ​​the object under test corresponding to the digital charge signal value and the electric field sensitive element is too high.

[0142] After analyzing each digital charge signal value and obtaining a corresponding result, the corresponding area of ​​the measured object where the electric field amplitude is too high can be known according to the physical address.

[0143] S214: When it is determined that the digital charge signal value is greater than a preset threshold, a warning instruction is generated.

[0144] After judgment, after knowing the corresponding area and electric field image where the electric field amplitude is too high in the object under test, the physical address of the area where the electric field amplitude is too high in the object under test is compared with the physical address of the dark area in the electric field image. If the physical addresses are the same, it is determined that the collection and analysis results are accurate.

[0145] S215 , determining whether a difference between a digital charge signal value greater than a preset threshold and an adjacent mathematical charge signal is greater than a preset difference.

[0146] Specifically, after obtaining a digital charge signal value greater than a preset threshold, the digital charge signal values ​​of other physical addresses adjacent to the digital charge signal value are extracted according to the physical address of the digital charge signal value, and the difference between the digital charge signal value and other digital charge signal values ​​is obtained respectively. Each difference is compared with a preset difference, and if each difference is greater than the preset difference, it is determined that the electric field sensitive element corresponding to the digital charge signal value is faulty, or each collected analog charge signal is incorrect.

[0147] S216. When it is determined that the electric field sensitive element corresponding to the digital charge signal value is faulty, or the collected analog charge signals are incorrect, a fault instruction is generated. At this time, the state of the incorrect electric field sensitive element in the array electrostatic sensor can be checked, or the object under test can be collected again.

[0148] In addition, in another possible embodiment, each digital charge signal value is superimposed to obtain a charge superposition value of the surface of the object being measured. When it is determined that the charge superposition value is greater than a preset threshold, an early warning instruction is generated, indicating that the electric field amplitude of the surface of the object being measured is too high.

[0149] like Figure 4 As shown, the present invention provides an electrostatic imaging device for implementing Figure 1 The electrostatic imaging method based on an array electrostatic sensor as described in the invention comprises:

[0150] The array electrostatic sensor includes a plurality of electric field sensitive elements 1, an analog-to-digital conversion module 2, a processor 3 and a data communication module 4, wherein:

[0151] Each electric field sensitive element 1 is used to sense the charge signal on the surface of the object to be measured to obtain each analog charge signal;

[0152] The analog-to-digital conversion module 2 is connected to each electric field sensitive element 1 and is used to convert each analog charge signal into each digital charge signal;

[0153] The processor 3 is connected to the analog-to-digital conversion module 2, and is used to obtain each digital charge signal value of each electric field sensitive element and each surface electric field value of each sensitive element, and save the digital charge signal value and the surface electric field value of each electric field sensitive element corresponding to the physical address of each electric field sensitive element;

[0154] A data communication module 4, connected to the processor 3, for reading each digital charge signal value or each known component surface electric field value stored in the processor;

[0155] The imaging module 5 is connected to the data communication module 4, inputs the read digital charge signal values ​​or the surface electric field values ​​of each sensitive element into the electric field strength-position distribution table, and processes the surface electric field values ​​of each sensitive element or the digital charge signal values ​​to obtain the electric field image of the object under test.

[0156] The present invention calculates the charge signals collected by each electric field sensitive element and arranges them according to the physical position of each electric field sensitive element, so as to accurately obtain the corresponding electrostatic gradient color block diagram, thereby more intuitively displaying the charge distribution of the object under test, and installing the electrostatic eliminator in a targeted manner according to the charge distribution to avoid excessive consumption of the electrostatic eliminator.

[0157] Embodiment 3

[0158] like Figures 5 to 8 As shown, in the electrostatic imaging device provided in this embodiment, the array electrostatic sensor includes a shielding shell 7, a plurality of electric field sensitive elements 1, an analog-to-digital conversion module 2, a processor 3 and a data communication module 4, wherein the plurality of electric field sensitive elements 1, the analog-to-digital conversion module 2, the processor 3 and the data communication module 4 are all solidified on the same circuit board, and the analog-to-digital conversion module 2 and the processor 3 form a main control module 6 of the array electrostatic sensor. An exposed area and a non-exposed area are formed on the top end surface of the shielding shell 7, and the electric field sensing parts of the plurality of electric field sensitive elements 1 are all placed in the exposed area, so that the top end surface of each electric field sensitive element 1 faces the outside of the shielding shell 7, and the main control module 6 and the data communication module 4 are located inside the non-exposed area.

[0159] Optionally, the electric field sensitive element may be, but is not limited to, a field milling electric field sensor or a MEMS electric field sensor to sense the charge signal on the surface of the object being measured.

[0160] When the electric field sensitive element adopts a field-milling electric field sensor, since the outer side of the field-milling electric field sensor includes a metal shielding shell, no additional insulating layer is required between two adjacent field-milling electric field sensors, and electromagnetic interference will not be caused.

[0161] When the electric field sensitive element adopts a MEMS electric field sensor, since the sensing element in the MEMS electric field sensor is solidified on the surface of the MEMS electric field sensor, and the sensing element is convenient to accurately sense the charge signal on the surface of the object to be measured through the exposed area. In addition, since the sensing element is solidified in the central area of ​​the MEMS electric field sensor, and the distance from the edge of the sensing element to the edge of the circuit board in the MEMS electric field sensor is not less than 2.5 times the distance of the sensing element, the distance between two adjacent sensing elements is at least 5 times the distance of the sensing elements, so that the two adjacent sensing elements will not be affected by electromagnetic interference, and there is no need to set an additional insulating layer between the two adjacent sensing elements.

[0162] When the electric field sensitive element adopts a field grinding electric field sensor or a MEMS electric field sensor, since there is no need to set an additional insulating layer between two adjacent sensing elements, compared with the existing array sensors (for example: CN111289600B, CN106959325B), the processing cost and processing steps can be reduced.

[0163] When the electric field sensitive element adopts a field grinding electric field sensor or a MEMS electric field sensor, since a shielding cover does not need to be provided on the exposed area, the processing cost and processing procedures can be reduced compared with the existing array sensor (eg: CN111289600B).

[0164] Specifically, each electric field sensitive element implements the specific steps in step S101 recorded in the first embodiment to sense the charge signal on the surface of the object to be measured, so as to obtain each analog charge signal.

[0165] In this embodiment, each electric field sensitive element is solidified on the same side of the circuit board and arranged at equal intervals to form a collection array. When the array electrostatic sensor contacts the object to be measured along the motion axis, each electric field sensitive element can sense the analog charge signal of the area on the object to be measured corresponding to the position of each electric field sensitive element, wherein the number of analog charge signals obtained is the same as the number of electric field sensitive elements.

[0166] Furthermore, the plurality of electric field sensitive elements may be divided into a plurality of groups, and each electric field sensitive element in each group is defined with a physical address.

[0167] In this embodiment, a plurality of electric field sensitive elements are divided into three groups (i.e., the first group, the second group, and the third group), and the three groups of electric field sensitive elements are arranged in parallel. Each group includes six electric field sensitive elements arranged in parallel (i.e., the first electric field sensitive element to the sixth electric field sensitive element), wherein the physical address of each electric field sensitive element can be selected from the position number, for example: the second electric field sensitive element of the first group can be defined as "1-2", wherein "1" represents the group name (i.e., the first group), "2" represents the position (i.e., the second electric field sensitive element), and "-" represents the separator.

[0168] Furthermore, the contact between the array-type electrostatic sensor and the object to be measured specifically refers to the array-type electrostatic sensor moving along the movement axis and passing through the upper area of ​​the object to be measured, and the array-type electrostatic sensor is in contact with the object to be measured.

[0169] Preferably, the closer the distance between the two is, the more accurate the charge signal of the object being measured is sensed.

[0170] Specifically, the analog-to-digital conversion module is connected to each electric field sensitive element, and implements the specific steps in step S102 recorded in the first embodiment to convert each analog charge signal into each digital charge signal.

[0171] In this embodiment, the number of analog-to-digital conversion modules is the same as the number of groups of electric field sensitive elements. Among them, three analog-to-digital conversion modules are arranged in parallel, and each analog-to-digital conversion module is electrically connected to a group of electric field sensitive elements to receive the analog charge signal obtained by each electric field sensitive element in the group of electric field sensitive elements and convert it into corresponding digital charge signals.

[0172] Among them, when each electric field sensitive element obtains the analog charge signal and sends the analog charge signal to the analog-to-digital conversion module, its position number (i.e., physical address) is added at the position before the analog charge signal or at the position after the analog charge signal, so that in subsequent operation steps, its position in the object under test can always be known according to the position number.

[0173] Specifically, the processor is connected to the analog-to-digital conversion module to obtain the digital charge signal value of each electric field sensitive element and the surface electric field value of each sensitive element, and save the digital charge signal value and the surface electric field value of each electric field sensitive element corresponding to the physical address of each electric field sensitive element.

[0174] In this embodiment, the processor implements the specific steps from step S103 to step S108 recorded in the first embodiment, including:

[0175] A filtering unit, used to filter each digital charge signal and eliminate interference signals in each digital charge signal to obtain each digital charge signal value;

[0176] A calculation module, used to obtain a sensitivity coefficient corresponding to each digital charge signal value, and to obtain a surface electric field value of each electric field sensitive element;

[0177] The memory includes a plurality of storage areas, and is used for storing the surface electric field value and the digital charge signal value corresponding to each electric field sensitive element according to the physical address of each electric field sensitive element.

[0178] Specifically, the data communication module is connected to the processor and the imaging module, and implements the specific steps in step S109 recorded in the above embodiment 1, so as to input each digital charge signal value or each surface electric field value of the sensitive element stored in the processor into the imaging module.

[0179] In addition, in another embodiment, the processor also includes a data analysis model for implementing the specific steps from step S213 to step S216 described in the above-mentioned second embodiment.

[0180] In this embodiment, the imaging module includes an electric field strength-position distribution table, and implements the specific steps from step S110 to step S112 recorded in the above embodiment 1, and implements the specific steps from step S210 to step S212 recorded in the above embodiment 2.

[0181] Specifically, the electric field strength-position distribution table includes:

[0182] The analysis module 501 is used to query the corresponding designated color block according to the surface electric field value of each sensitive element or the value of each digital charge signal.

[0183] The pattern generation module 502 is used to perform gradient processing on the specified color block to form a specified gradient color block, including a division unit and a gradient pattern color block unit, wherein:

[0184] The dividing unit is used to divide the designated color block into N unit designated color blocks, and to divide at least one coordinated color block into N' unit coordinated color blocks, wherein N≥2, and N'=N.

[0185] The gradient pattern color block unit is used to sequentially superimpose and merge N unit designated color blocks with N' unit gradient color blocks to form a designated gradient color block.

[0186] The electric field image template 503 is used to store the corresponding designated gradient color blocks in the electric field image template in sequence according to the physical addresses of the electric field sensitive elements in the array electrostatic sensor.

[0187] The pattern synthesis module 504 is used to synthesize the designated gradient color blocks in the electric field image template into an electric field image corresponding to the charge distribution of the object under test.

[0188] In the first embodiment, the second embodiment and the third embodiment, the generated electric field image is an electrostatic gradient color block image.

[0189] like Fig. 9 As shown, the formed electric field image includes several dividing lines, which divide the electric field image into specified gradient color blocks corresponding to the physical addresses of each electric field sensitive element. Each specified gradient color block includes the physical address (i.e., position number) of the electric field sensitive element and the digital charge signal value obtained by the electric field sensitive element.

[0190] The charge distribution of each area on the surface of the object being measured can be known through the corresponding physical address, digital charge signal value and specified gradient color block.

[0191] The above description is only a preferred embodiment of the present invention, which is only illustrative and not restrictive of the present invention. Those skilled in the art understand that many changes, modifications, and even equivalences may be made to the present invention within the spirit and scope defined by the claims of the present invention, but all of them will fall within the scope of protection of the present invention.

Claims

1. An electrostatic imaging method based on an array electrostatic sensor, characterized in that: The following steps are involved: Each electric field sensitive element in the array electrostatic sensor senses the charge signal on the surface of the object to be measured to obtain each analog charge signal; After obtaining the digital charge signal value corresponding to each of the analog charge signals, each of the digital charge signal values ​​is stored in a corresponding storage area according to the corresponding relationship; Obtaining a surface electric field value of each electric field sensitive element according to each digital charge signal value; According to the physical address of each electric field sensitive element, the corresponding surface electric field value of each sensitive element or each digital charge signal value is input into the electric field strength-position distribution table to obtain the electric field image of the object under test.

2. The electrostatic imaging method based on an array electrostatic sensor according to claim 1, characterized in that: After obtaining each digital charge signal value according to each analog charge signal, and saving each digital charge signal value into a corresponding storage area according to a corresponding relationship, the method includes: Converting each of the analog charge signals into a corresponding digital charge signal; Filtering each of the digital charge signals to eliminate interference signals in each of the digital charge signals to obtain each of the digital charge signal values; According to the physical address of each electric field sensitive element in the array electrostatic sensor, the digital charge signal value corresponding thereto is stored in a storage area corresponding to the physical address in the memory.

3. The electrostatic imaging method based on an array electrostatic sensor according to claim 2, characterized in that: In the step of obtaining the element surface electric field value of each of the electric field sensitive elements according to each of the digital charge signal values, the step includes: Calibrate the array electrostatic sensor to obtain the sensor surface electric field value of the array electrostatic sensor; Obtaining a sensitivity coefficient corresponding to a current digital charge signal value according to the sensor surface electric field value and each digital charge signal value; Obtaining the surface electric field value of each of the electric field sensitive elements according to the corresponding digital charge signal value and the sensitivity coefficient; According to the physical address of each electric field sensitive element in the array electrostatic sensor, the surface electric field value of the sensitive element corresponding thereto is stored in a storage area corresponding to the physical address in the memory.

4. The electrostatic imaging method based on an array electrostatic sensor according to claim 3, characterized in that: The step of calibrating the array electrostatic sensor to obtain the sensor surface electric field value of the array electrostatic sensor includes: The array type electrostatic sensor is calibrated by using a flat plate capacitor, and the electric field value on the sensor surface is obtained after the array type electrostatic sensor passes through the flat plate capacitor along the moving axis.

5. The electrostatic imaging method based on an array electrostatic sensor according to claim 3, characterized in that: The digital charge signal value corresponding to the electric field sensitive element and the surface electric field value of the sensitive element are stored in the storage area.

6. The electrostatic imaging method based on an array electrostatic sensor according to claim 1, characterized in that: In the step of inputting the corresponding surface electric field values ​​of each of the electric field sensitive elements or the digital charge signal values ​​into an electric field strength-position distribution table according to the physical addresses of each of the electric field sensitive elements to obtain an electric field image of the object under test, the method comprises: In the electric field strength-position distribution table, a corresponding designated color block is obtained according to the electric field value on the surface of each of the sensitive elements or the value of each of the digital charge signals; Performing gradient processing on the designated color block to form a designated gradient color block; According to the physical address of each electric field sensitive element in the array electrostatic sensor, the corresponding designated gradient color blocks are sequentially stored in the electric field image template to form an electric field image corresponding to the charge distribution of the object under test.

7. The electrostatic imaging method based on an array electrostatic sensor according to claim 6, characterized in that: The step of performing a gradient process on the designated color block to form a designated gradient color block includes: Divide the designated color block into N unit designated color blocks, where N≥2; Divide at least one coordinated color block into N' unit coordinated color blocks, where N'=N; The N unit designated color blocks and the N' unit gradient color blocks are superimposed and merged in sequence to form a designated gradient color block.

8. A device for implementing the electrostatic imaging method based on an array electrostatic sensor according to any one of claims 1 to 7, characterized in that: include: An array electrostatic sensor includes a plurality of electric field sensitive elements, an analog-to-digital conversion module, a processor and a data communication module, wherein: Each of the electric field sensitive elements is used to sense the charge signal on the surface of the object to be measured to obtain each analog charge signal; The analog-to-digital conversion module is connected to each of the electric field sensitive elements and is used to convert each of the analog charge signals into each digital charge signal; The processor is connected to the analog-to-digital conversion module, and is used to obtain each digital charge signal value of each electric field sensitive element and each surface electric field value of each sensitive element, and save the digital charge signal value and the surface electric field value of each electric field sensitive element corresponding to the physical address of each electric field sensitive element; The data communication module is connected to the processor and is used to read each of the digital charge signal values ​​or each of the surface electric field values ​​of the sensitive elements stored in the processor; The imaging module is connected to the data communication module, inputs the read digital charge signal values ​​or the surface electric field values ​​of the sensitive elements into the electric field strength-position distribution table, and processes the surface electric field values ​​of the sensitive elements or the digital charge signal values ​​to obtain an electric field image of the object under test.

9. The device according to claim 8, characterized in that The processor includes: A filtering unit, used to filter each of the digital charge signals to eliminate interference signals in each of the digital charge signals to obtain a value of each of the digital charge signals; A calculation module, used to obtain a sensitivity coefficient corresponding to each of the digital charge signal values, and to obtain a surface electric field value of each of the electric field sensitive elements; The memory includes a plurality of storage areas, and is used for storing the surface electric field value of each electric field sensitive element and the digital charge signal value corresponding to the physical address of each electric field sensitive element.

10. The device according to claim 8, characterized in that The electric field strength-position distribution table includes: An analysis module, used for obtaining a corresponding designated color block according to the surface electric field value of each of the sensitive elements or the value of each of the digital charge signals; A pattern generation module, used for performing gradient processing on each of the designated color blocks to form each designated gradient color block; An electric field image template, used for receiving each of the specified gradient color blocks; The pattern synthesis module is used to synthesize the designated gradient color blocks in the electric field image template to form an electric field image corresponding to the charge distribution of the object under test.

11. The device according to claim 10, characterized in that The pattern generation module includes: A division unit, used to divide the designated color block into N unit designated color blocks, and to divide at least one coordinated color block into N' unit coordinated color blocks, wherein N≥2, and N'=N; The gradient pattern color block unit is used to superimpose and merge N unit designated color blocks and N' unit gradient color blocks in sequence to form the designated gradient color block.

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