Optical fiber device and optical device

Abstract

The invention provides an optical fiber device and an optical device, and belongs to the technical field of optical fibers. The optical fiber device comprises an optical fiber module and a radiator; the optical fiber module comprises an optical fiber plate and a gain optical fiber, and the gain optical fiber is fixed on the surface of the optical fiber plate; the optical fiber module is installed on the radiator, and the gain optical fiber is close to the radiator. According to the invention, the heat of the gain fiber is dissipated through the radiator, the condition that the gain fiber is burnt out due to too high temperature can be avoided, the gain fiber is fixed on the radiator through the fiber plate, and the assembly efficiency between the gain fiber and the radiator can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of optical fiber technology, and in particular to an optical fiber device and an optical component. Background Art

[0002] Gain fiber is a special optical fiber formed by doping some trivalent rare earth metal elements, such as Er (erbium), Pr (praseodymium) or Tm (thulium), into the core of quartz optical fiber.

[0003] Gain fiber, as a gain medium, is used in optical devices such as fiber lasers and optical amplifiers. It can absorb the energy provided by the pump source and amplify the light.

[0004] However, when the pump source inputs relatively high energy into the gain fiber, the temperature of the gain fiber will be relatively high, and the gain fiber may be at risk of burning out. Summary of the invention

[0005] The present disclosure provides an optical fiber device and an optical device, the optical fiber device includes an optical fiber module and a heat sink, the optical fiber module includes an optical fiber plate and a gain optical fiber, the gain optical fiber is fixed on the optical fiber plate to form an optical fiber module, the optical fiber module is fixed on the heat sink, and the heat sink is used to dissipate heat for the gain optical fiber, which can avoid the situation that the gain optical fiber is burned due to excessive temperature. Moreover, the gain optical fiber is fixed on the heat sink through the optical fiber plate, which can obviously improve the assembly efficiency between the gain optical fiber and the heat sink compared with the gain optical fiber with a longer length directly coiled on the heat sink. In addition, a first heat-conducting buffer layer is fixed on the surface of the heat sink, and the first heat-conducting buffer layer is flexible. The gain optical fiber can be embedded in the first heat-conducting buffer layer. In this way, on the one hand, the contact area between the gain optical fiber and the first heat-conducting buffer layer can be increased, and the heat transfer between the gain optical fiber and the first heat-conducting buffer layer can be accelerated. On the other hand, the first heat-conducting buffer layer protects the gain optical fiber to prevent the gain optical fiber from being crushed by the heat sink.

[0006] In a first aspect, the present disclosure provides an optical fiber device, the optical fiber device comprising an optical fiber module and a heat sink;

[0007] The optical fiber module comprises an optical fiber plate and a gain optical fiber, and the gain optical fiber is fixed on the surface of the optical fiber plate;

[0008] The optical fiber module is mounted on the radiator, and the gain optical fiber is close to the radiator.

[0009] In the solution shown in the present disclosure, the gain optical fiber is fixed on the optical fiber board to form an optical fiber module, and the optical fiber module is fixed on the heat sink. The heat sink is used to dissipate heat for the gain optical fiber, which can avoid the gain optical fiber from being burned due to excessive temperature.

[0010] In the solution shown in the present disclosure, the gain fiber is fixed on the heat sink through the fiber plate. This can obviously improve the assembly efficiency between the gain fiber and the heat sink compared to a longer gain fiber directly coiled on the heat sink.

[0011] In a possible implementation, the optical fiber device further includes a first thermally conductive buffer layer, and the first thermally conductive buffer layer is located between the optical fiber module and the heat sink.

[0012] In the solution disclosed in the present invention, a first thermally conductive buffer layer is filled between the optical fiber module and the heat sink. The first thermally conductive buffer layer can absorb the gap between the optical fiber module and the heat sink. Since the thermal conductivity of air is relatively poor, the first thermally conductive buffer layer can absorb the gap between the optical fiber module and the heat sink, thereby accelerating the heat transfer between the optical fiber module and the heat sink, thereby improving the heat dissipation efficiency of the gain optical fiber heat dissipation.

[0013] In a possible implementation manner, the first thermally conductive buffer layer is flexible, and the gain optical fiber is embedded in the first thermally conductive buffer layer.

[0014] In the solution disclosed in the present invention, the first thermally conductive buffer layer is flexible, and the gain fiber is embedded in the first thermally conductive buffer layer. On the one hand, the contact area between the gain fiber and the first thermally conductive buffer layer can be increased, and the heat transfer between the gain fiber and the first thermally conductive buffer layer can be accelerated. On the other hand, the first thermally conductive buffer layer protects the gain fiber and prevents the gain fiber from being crushed by the heat sink.

[0015] In a possible implementation, the optical fiber module further includes a housing, the gain optical fiber is located in the housing, and an end of the gain optical fiber extends out of the housing.

[0016] In the solution disclosed in the present disclosure, the optical fiber module includes a housing, and the gain optical fiber is accommodated in the housing, with only the end exposed for external connection, and the housing can protect the gain optical fiber. Then, the gain optical fiber will not be damaged during storage and transportation of the mass-produced optical fiber module.

[0017] In a possible implementation, the optical fiber device further includes a first heat-conducting buffer layer, which is flexible and interference-clamped between the top wall of the housing and the heat sink.

[0018] In the solution shown in the present disclosure, in the solution where the optical fiber module includes a shell, the optical fiber device may also include a first thermally conductive buffer layer, and the first thermally conductive buffer layer is sandwiched between the top wall of the shell and the heat sink. The first thermally conductive buffer layer can absorb the gap between the shell and the heat sink, and the thermal conductivity of air is relatively poor. Therefore, by absorbing the gap between the shell and the heat sink through the first thermally conductive buffer layer, the heat transfer between the optical fiber module and the heat sink can be accelerated, thereby improving the heat dissipation efficiency of the gain optical fiber heat dissipation.

[0019] In a possible implementation, the optical fiber module further includes a second heat-conducting buffer layer, and the second heat-conducting buffer layer is located on the inner surface of the top wall of the housing;

[0020] The second heat-conducting buffer layer is flexible, and the gain optical fiber is embedded in the second heat-conducting buffer layer.

[0021] In the solution shown in the present disclosure, the gain fiber is embedded in the second heat-conducting buffer layer, and the second heat-conducting buffer layer can absorb the gap between the gain fiber and the inner surface of the top wall of the housing. In this way, on the one hand, the contact area between the gain fiber and the first heat-conducting buffer layer can be increased, and the heat transfer between the gain fiber and the first heat-conducting buffer layer can be accelerated. On the other hand, the first heat-conducting buffer layer protects the gain fiber and prevents the gain fiber from being crushed by the heat sink.

[0022] In a possible implementation manner, the shell has thermal conductivity.

[0023] In the solution disclosed in the present invention, the second thermally conductive buffer layer is interference-clamped between the gain fiber and the top wall of the shell, and the second thermally conductive buffer layer absorbs the gap between the gain fiber and the top wall of the shell, and the first thermally conductive buffer layer is interference-clamped between the top wall of the shell and the heat sink, and the first thermally conductive buffer layer absorbs the gap between the shell and the heat sink. The shell has thermal conductivity, which can greatly accelerate the heat transfer between the gain fiber and the heat sink, and improve the heat dissipation efficiency of the heat sink for the gain fiber.

[0024] In a possible implementation manner, the end of the gain optical fiber has an optical fiber connector.

[0025] In the solution shown in the present disclosure, the gain optical fiber can not only be connected to the input optical fiber and the output optical fiber by fusion splicing, but also can be connected to the input optical fiber and the output optical fiber by an optical fiber connector.

[0026] In the solution shown in the present disclosure, the gain optical fiber is pluggably connected to the external optical fiber through an optical fiber connector. Compared with fusion splicing, the connection is more convenient and helps to improve the connection efficiency between the gain optical fiber and the optical device.

[0027] In a possible implementation manner, the optical fiber connector extends out of the housing.

[0028] In a possible implementation, a side wall of the housing has a fiber port, the fiber optic connector is located in the fiber optic port, and an optical port of the fiber optic connector is exposed.

[0029] In a possible implementation, the optical fiber module further includes a dust cap, and the dust cap is sealed on an idle optical fiber connector.

[0030] In the solution disclosed in the present invention, when the optical fiber module is not used in an optical device, the optical fiber module is in an idle state, and its optical fiber connectors are also in an idle state. Dust caps can be used to seal these idle optical fiber connectors to prevent dust from entering the idle optical fiber connectors and affecting the optical transmission between the gain optical fiber and the input optical fiber and the output optical fiber.

[0031] In a possible implementation manner, the number of the gain optical fiber is at least one, and the at least one gain optical fiber is fixed on the surface of the optical fiber plate.

[0032] In the solution shown in the present disclosure, the optical fiber module may include multiple gain optical fibers, each of which can amplify laser light of one wavelength band. Therefore, multiple gain optical fibers can amplify laser light of multiple wavelength bands.

[0033] In a second aspect, an optical device is provided, wherein the optical device comprises the optical fiber device described in the first aspect.

[0034] In the solution shown in the present disclosure, the optical device can be a fiber laser or an optical amplifier. The optical device can include a pump source and the above-mentioned optical fiber device, the pump source is connected to the gain fiber of the optical fiber device, the pump source is used to input pump light to the gain fiber, and the gain fiber is used to amplify the light and output the gain light (i.e., high-power light) to the outside.

[0035] The optical fiber device of the optical device, as described above, has a gain optical fiber fixed on an optical fiber board to form an optical fiber module, and the optical fiber module is fixed on a heat sink. The heat sink dissipates heat for the gain optical fiber, which can prevent the gain optical fiber from burning due to excessive temperature.

[0036] Moreover, the gain optical fiber is fixed on the heat sink through the optical fiber plate, thus, compared with a longer gain optical fiber directly coiled on the heat sink, the assembly efficiency between the gain optical fiber and the heat sink can be obviously improved.

[0037] In addition, a first thermally conductive buffer layer is fixed on the surface of the heat sink. The first thermally conductive buffer layer is flexible, and the gain fiber can be embedded in the first thermally conductive buffer layer. On the one hand, the contact area between the gain fiber and the first thermally conductive buffer layer can be increased, and the heat transfer between the gain fiber and the first thermally conductive buffer layer can be accelerated. On the other hand, the first thermally conductive buffer layer protects the gain fiber to prevent the gain fiber from being crushed by the heat sink.

[0038] In a third aspect, a method for manufacturing an optical fiber device is provided. The optical fiber device is the optical fiber device described in the first aspect, and the method comprises: step 1, fixing a gain optical fiber on a surface of an optical fiber plate to form an optical fiber module;

[0039] Step 2: fix the optical fiber module on the heat sink, wherein the gain optical fiber is close to the heat sink.

[0040] In the scheme disclosed in the present disclosure, the optical fiber device produced by the method has a gain optical fiber fixed on an optical fiber board to form an optical fiber module, and the optical fiber module is fixed on a heat sink. The heat sink is used to dissipate heat for the gain optical fiber, thereby preventing the gain optical fiber from being burned due to excessive temperature.

[0041] Moreover, the gain optical fiber is fixed on the heat sink through the optical fiber plate, thus, compared with a longer gain optical fiber directly coiled on the heat sink, the assembly efficiency between the gain optical fiber and the heat sink can be obviously improved.

[0042] In addition, a first thermally conductive buffer layer is fixed on the surface of the heat sink. The first thermally conductive buffer layer is flexible, and the gain fiber can be embedded in the first thermally conductive buffer layer. On the one hand, the contact area between the gain fiber and the first thermally conductive buffer layer can be increased, and the heat transfer between the gain fiber and the first thermally conductive buffer layer can be accelerated. On the other hand, the first thermally conductive buffer layer protects the gain fiber to prevent the gain fiber from being crushed by the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 is a schematic structural diagram of an optical fiber device without an optical fiber module and a heat sink provided by an exemplary embodiment of the present disclosure;

[0044] Figure 2 is a schematic structural diagram of an optical fiber device provided by an exemplary embodiment of the present disclosure;

[0045] Figure 3 is a schematic structural diagram of an optical fiber device including a first heat conductive buffer layer provided by an exemplary embodiment of the present disclosure;

[0046] Figure 4 It is a schematic structural diagram of an optical fiber device provided by an exemplary embodiment of the present disclosure, in which a first heat conductive buffer layer and a fixing glue layer surround a gain optical fiber;

[0047] Figure 5 It is a structural schematic diagram of an optical fiber device including a housing and an optical fiber module provided by an exemplary embodiment of the present disclosure;

[0048] Figure 6 It is a structural schematic diagram of an optical fiber device including a first heat conductive buffer layer and an optical fiber module including a housing provided by an exemplary embodiment of the present disclosure;

[0049] Figure 7 It is a structural schematic diagram of an optical fiber device including a first heat-conducting buffer layer, and an optical fiber module including a housing and a second heat-conducting buffer layer provided by an exemplary embodiment of the present disclosure;

[0050] Figure 8It is a structural schematic diagram of an optical fiber module provided by an exemplary embodiment of the present disclosure, including a housing, and an end portion of a gain optical fiber extending out of the housing;

[0051] Fig. 9 It is a structural schematic diagram of an optical fiber device provided by an exemplary embodiment of the present disclosure, in which an optical fiber module does not include a housing and the end of a gain optical fiber has an optical fiber connector;

[0052] Fig.10 It is a schematic structural diagram of an optical fiber device provided by an exemplary embodiment of the present disclosure, including a first heat conductive buffer layer and an optical fiber connector of a gain optical fiber fixed to a side wall of a housing.

[0053] Description of Reference Numerals

[0054] 1. Optical fiber module; 10. Fixed adhesive layer; 11. Optical fiber board; 12. Gain optical fiber; 13. Shell; 14. Second thermal conductive buffer layer; 121. Optical fiber connector.

[0055] 2. Radiator. 3. First thermal conductive buffer layer. DETAILED DESCRIPTION

[0056] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0057] The embodiments of the present disclosure relate to an optical fiber device, specifically an optical fiber device including a gain fiber, which is used as a gain medium and is mainly used in optical devices such as fiber lasers and optical amplifiers. For example, a pump source (also called a pump light source), such as a semiconductor laser, provides a light source, and after the gain fiber absorbs the energy provided by the pump source, it amplifies the light and outputs high-power laser light.

[0058] Since the energy provided by the pump source to the gain fiber is relatively high, the local temperature of the gain fiber will be relatively high. Once the local temperature of the gain fiber is high, the performance of the gain fiber is likely to deteriorate, and the gain fiber may even burn out.

[0059] The heat sink can be used to dissipate heat for the gain fiber, but because the gain fiber is relatively long, it needs to be coiled on the surface of the heat sink. And because the gain fiber is not flexible enough, it is not easy to coil on the heat sink.

[0060] Therefore, the current method of assembling the gain fiber on the heat sink is usually to carve some grooves on the surface of the heat sink, and the gain fiber can be located in the grooves and coiled on the surface of the heat sink along the grooves. However, although the gain fiber is located in the groove, it is still easy for the gain fiber to pop out of the groove. To avoid this situation, it is usually necessary to dispense glue at the bottom of the groove so that the gain fiber can be fixed in the groove.

[0061] It should be pointed out that the process of fixing the gain fiber on the surface of the heat sink through the above method is carried out on the production line of the optical device used by the gain fiber, and the heat sink has been assembled in the optical device. Because the space where the heat sink is located is relatively small, it is impossible to use tools to coil the gain fiber on the heat sink, and technicians are required to manually coil the gain fiber on the heat sink. For example, first dispense glue in the groove of the heat sink, and then gradually stick the gain fiber in the groove along the routing of the groove. The process of installing the gain fiber in the groove of the heat sink requires the collaboration of multiple technicians. It can be seen that the technicians manually fix the gain fiber on the heat sink, and it requires the collaboration of multiple people, resulting in low assembly efficiency of the gain fiber on the heat sink.

[0062] The present embodiment provides an optical fiber device, which includes an optical fiber module. The optical fiber module includes an optical fiber board and a gain optical fiber. The gain optical fiber is fixed on the optical fiber board. The optical fiber module is an independent module and can be directly assembled on the heat sink. Compared with fixing the gain optical fiber on the heat sink, it is obviously easier to assemble the optical fiber module on the heat sink, thereby improving the assembly efficiency of the gain optical fiber and the heat sink.

[0063] The optical fiber device shown in this embodiment is described below.

[0064] like Figure 1 and Figure 2 As shown, it is a schematic diagram of the structure of the optical fiber device. Figure 1 is a schematic diagram showing that the optical fiber module 1 is not fixed to the heat sink 2, Figure 2 is a schematic diagram of the optical fiber module 1 and the heat sink 2 after being fixed. Figure 1 and Figure 2 All are cross-sectional schematic diagrams of optical fiber devices.

[0065] refer to Figure 1 As shown, the optical fiber device includes an optical fiber module 1 and a heat sink 2. The optical fiber module 1 includes an optical fiber plate 11 and a gain optical fiber 12. The gain optical fiber 12 is fixed on the surface of the optical fiber plate 11. Figure 2 As shown, the optical fiber module 1 is mounted on the heat sink 2 , and the gain optical fiber 12 is close to the heat sink 2 , for example, the gain optical fiber 12 faces the heat sink 2 .

[0066] The gain fiber 12 may be any fiber with rare earth metal elements doped in the core, for example, an erbium-doped fiber with Er (erbium) doped in the core, or an ytterbium-doped fiber with ytterbium (Yb) doped in the core.

[0067] In one example, the gain fiber 12 is fixed on the fiber plate 11 to form a fiber module 1, and then the fiber module 1 is assembled on the heat sink 2. There is no need to wind the gain fiber 12 on the heat sink 2, nor is there any need to carve grooves on the heat sink 2, thereby improving the assembly efficiency between the gain fiber 12 and the heat sink 2.

[0068] In one example, since the gain optical fiber 12 is not directly fixed on the heat sink 2, but fixed on the optical fiber board 11 to form an independent optical fiber module 1, the optical fiber module 1 can be processed and produced in batches, and when applied to optical devices, it is only necessary to directly fix the optical fiber module 1 on the heat sink 2. It can be seen that fixing the gain optical fiber 12 on the optical fiber board 11 to form the optical fiber module 1 is conducive to batch production.

[0069] In one example, regarding the way in which the gain optical fiber 12 is fixed on the optical fiber plate 11, for example, Figure 1 As shown, glue can be dispensed on the surface of the fiber optic plate 11 to form a fixed glue layer 10 on the surface of the fiber optic plate 11, and then the gain fiber 12 is fixed to the surface of the fiber optic plate 11 through the fixed glue layer 10, such as the gain fiber 12 can be coiled on the surface of the fiber optic plate 11.

[0070] In another example, multiple circles of grooves may be engraved on the optical fiber plate 11, and then glue may be dispensed at the bottom of the grooves. The gain optical fiber 12 may be coiled in the grooves and fixed in the grooves by dispensing glue.

[0071] It should be pointed out that since the gain optical fiber 12 is fixed on the optical fiber board 11, and the process is not performed on the production line of the applied optical device, the assembly space of the gain optical fiber 12 and the optical fiber board 11 is large, so the process of fixing the gain optical fiber 12 on the optical fiber board 11 can be performed by tools instead of manual work. Therefore, the fixation of the gain optical fiber 12 on the optical fiber board 11 by tools can improve the fixing efficiency of the gain optical fiber 12.

[0072] In one example, the glue layer between the optical fiber plate 11 and the gain optical fiber 12 can act as a buffer layer to prevent the rigid contact between the optical fiber plate 11 and the gain optical fiber 12, thereby crushing the brittle gain optical fiber 12 and protecting the gain optical fiber 12. The glue layer between the optical fiber plate 11 and the gain optical fiber 12 also protects the gain optical fiber 12 when the optical fiber plate 11 and the heat sink 2 are fixed.

[0073] In one example, since the heat sink 2 is used to dissipate heat for the gain optical fiber 12, the optical fiber module 1 is fixed on the heat sink 2, and the gain optical fiber 12 faces the heat sink 2. Figure 2 As shown, the gain fiber 12 is sandwiched between the fiber plate 11 and the heat sink 2 , and the gain fiber 12 is in contact with the heat sink 2 .

[0074] In one example, in order to further accelerate the heat transfer between the gain fiber 12 and the heat sink 2, accordingly, as Figure 3 As shown, the optical fiber device may further include a first heat-conducting buffer layer 3 , and the first heat-conducting buffer layer 3 is sandwiched between the optical fiber module 1 and the heat sink 2 .

[0075] For example, the first heat conductive buffer layer 3 has flexibility, such as Figure 3 As shown, the gain fiber 12 can be embedded in the first thermal conductive buffer layer 3 .

[0076] In one example, if Figure 3 As shown, a portion of the gain optical fiber 12 is embedded in the fixed adhesive layer 10, and another portion is embedded in the first thermally conductive buffer layer 3. There may be a gap between the fixed adhesive layer 10 and the first thermally conductive buffer layer 3, or, as shown in FIG. Figure 4 As shown, there is no distance between the fixing glue layer 10 and the first heat-conducting buffer layer 3 , and the fixing glue layer 10 and the first heat-conducting buffer layer 3 surround the gain optical fiber 12 .

[0077] The larger the area of ​​the first thermally conductive buffer layer 3 surrounding the gain optical fiber 12 is, the larger the contact area between the first thermally conductive buffer layer 3 and the gain optical fiber 12 is, which is beneficial to accelerate the heat transfer between the first thermally conductive buffer layer 3 and the gain optical fiber 12 .

[0078] The first thermally conductive buffer layer 3 may be thermally conductive glue, or thermally conductive gel, or a soft thermally conductive pad, etc.

[0079] This gain fiber 12 is embedded in the first thermally conductive buffer layer 3. On the one hand, the contact area between the gain fiber 12 and the first thermally conductive buffer layer 3 is increased, and the heat transfer between the gain fiber 12 and the first thermally conductive buffer layer 3 is accelerated. On the other hand, when the optical fiber module 1 is assembled on the heat sink 2, the first thermally conductive buffer layer 3 can protect the gain fiber 12 to avoid direct contact between the rigid heat sink 2 and the brittle gain fiber 12 and damage to the gain fiber 12.

[0080] In one example, since the optical fiber module 1 can be mass-produced, the optical fiber module 1 processed in batches is stored in a warehouse, in order to protect the gain optical fiber 12, such as Figure 5 As shown, the optical fiber module 1 may further include a shell 13 , and the gain optical fiber 12 may be located in the shell 13 . Since the gain optical fiber 12 needs to be connected to the outside, such as a pump source and a transmission optical fiber, the end of the gain optical fiber 12 is located outside the shell 13 .

[0081] The end of the gain optical fiber 12 is located outside the housing 13. For example, both ends of the gain optical fiber 12 are located outside the housing 13 to be connected to the outside. Figure 5FIG. 1 shows that one end of the gain optical fiber 12 extends out of the housing 13 , and the other end is not shown.

[0082] For example, the side wall of the housing 13 has a through hole that matches the diameter of the gain optical fiber 12 , and the end of the gain optical fiber 12 can pass through the through hole on the side wall of the housing 13 and extend out of the housing 13 .

[0083] In one example, the two ends of the gain optical fiber 12 may be located on the same side of the housing 13, or may be located on different sides of the housing 13, for example. Figure 8 As shown, two ends of the gain optical fiber 12 are located at opposite sides of the housing 13 .

[0084] In one example, if Figure 5 As shown, the housing 13 may be in the shape of a cover, covering the surface of the optical fiber plate 11 and covering the gain optical fiber 12 therein.

[0085] In another example, the housing 13 may also cover both the optical fiber plate 11 and the gain optical fiber 12 therein.

[0086] In another example, the housing 13 may also be in a box shape, and the optical fiber plate 11 and the gain optical fiber 12 are both located in the housing 13 .

[0087] The present embodiment does not limit the specific structure of the housing 13. Figure 5 In the figure, a cover shape in which the gain optical fiber 12 is covered is exemplified.

[0088] In one example, continue to refer to Figure 5 As shown, the top wall of the shell 13 is fixed to the heat sink 2, so the heat transfer between the gain fiber 12 and the heat sink 2 needs to pass through the top wall of the shell 13. In order to accelerate the heat transfer between the gain fiber 12 and the heat sink 2, the shell 13 has thermal conductivity to accelerate the heat transfer between the gain fiber 12 and the heat sink 2.

[0089] In one example, in order to further accelerate the heat transfer between the gain optical fiber 12 and the heat sink 2, as described above, the optical fiber device further includes a first heat conductive buffer layer 3. Then, Figure 6 As shown, the first thermally conductive buffer layer 3 can be interference-clamped between the top wall of the shell 13 and the heat sink 2, so that the first thermally conductive buffer layer 3 can fill the air gap between the top wall of the shell 13 and the heat sink 2, thereby accelerating the heat transfer between the gain fiber 12 and the heat sink 2.

[0090] In one example, in order to further accelerate the heat transfer between the gain fiber 12 and the heat sink 2, accordingly, Figure 7As shown, the optical fiber module 1 may further include a second thermally conductive buffer layer 14 , which is located on the inner surface of the top wall of the housing 13 . The second thermally conductive buffer layer 14 is flexible, and the gain optical fiber 12 is embedded in the second thermally conductive buffer layer 14 .

[0091] The second thermally conductive buffer layer 14 may be thermally conductive glue, or thermally conductive gel, or a soft thermally conductive pad, etc.

[0092] In one example, if Figure 7 As shown, a portion of the gain optical fiber 12 is embedded in the fixed adhesive layer 10, and another portion is embedded in the second thermally conductive buffer layer 14. There may be a distance between the fixed adhesive layer 10 and the second thermally conductive buffer layer 14, or there is no distance between the fixed adhesive layer 10 and the second thermally conductive buffer layer 14. The fixed adhesive layer 10 and the second thermally conductive buffer layer 14 surround the gain optical fiber 12.

[0093] In this way, the second thermally conductive buffer layer 14 is interference-clamped between the gain fiber 12 and the top wall of the shell 13, and the second thermally conductive buffer layer 14 absorbs the gap between the gain fiber 12 and the top wall of the shell 13. The first thermally conductive buffer layer 3 is interference-clamped between the top wall of the shell 13 and the heat sink 2, and the first thermally conductive buffer layer 3 absorbs the gap between the shell 13 and the heat sink 2, which can greatly accelerate the heat transfer between the gain fiber 12 and the heat sink 2 and improve the heat dissipation efficiency of the heat sink 2 for the gain fiber 12.

[0094] It should be noted that the materials of the first heat-conducting buffer layer 3 and the second heat-conducting buffer layer 14 may be the same or different, and this embodiment does not limit this.

[0095] In one example, in order to further enhance the heat dissipation for the gain fiber 12, the fiber plate 11 may also have thermal conductivity accordingly, so that the gain fiber 12 dissipates heat through the fiber plate 11 on the one hand and through the heat sink 2 on the other hand, thereby enhancing the heat dissipation for the gain fiber 12.

[0096] In one example, in a solution where the optical fiber plate 11 has thermal conductivity, the fixing adhesive layer 10 between the optical fiber plate 11 and the gain optical fiber 12 may also have thermal conductivity to accelerate heat transfer between the gain optical fiber 12 and the optical fiber plate 11. For example, the fixing adhesive layer 10 between the optical fiber plate 11 and the gain optical fiber 12 may be thermally conductive glue or thermally conductive gel.

[0097] The above is a heat dissipation solution for the gain optical fiber 12 , and the following introduces a solution for external connection of the gain optical fiber 12 .

[0098] In one example, the gain fiber 12 can be connected to an external optical fiber by fusion splicing.

[0099] For example, in the solution where the optical fiber module 1 includes a housing 13, Figure 7 As shown, the ends of the gain optical fiber 12 are extended out of the housing 13 to be fused with the external optical fiber. Figure 7 One end of the gain fiber 12 is shown, and the other end is not shown.

[0100] In another example, the gain optical fiber 12 can also be plugged and unplugged with an external optical fiber through an optical fiber connector. Figure 8 and Fig. 9 As shown, the end of the gain optical fiber 12 has an optical fiber connector 121, wherein: Figure 8 is a schematic diagram of an optical fiber module 1 including a housing 13, Fig. 9 It is a schematic diagram of the optical fiber module 1 excluding the housing 13 .

[0101] For example, Figure 8 As shown, in the solution where the optical fiber module 1 includes a housing 13 , the optical fiber connector 121 is located outside the housing 13 .

[0102] For example, Fig.10 As shown, in the solution where the optical fiber module 1 includes a housing 13 , the optical fiber connector 121 can be fixed to the side wall of the housing 13 , and the optical port of the optical fiber connector 121 is exposed.

[0103] In one example, in a scheme where the gain optical fiber 12 is connected to the outside through a fiber optic connector 121 , in order to prevent dust from getting on the fiber optic connector 121 of the idle gain optical fiber 12 , the fiber optic module 1 also includes a dust cap that is sealed on the idle fiber optic connector 121 .

[0104] It can be seen that when the optical fiber module 1 is not used in an optical device, the optical fiber module 1 is in an idle state, so its optical fiber connectors 121 are also in an idle state. Dust caps can be used to seal these idle optical fiber connectors 121 to prevent dust from entering the idle optical fiber connectors 121 and affecting the optical transmission between the gain optical fiber and the input optical fiber and the output optical fiber.

[0105] In one example, in order to prevent the dust cap from being lost, the dust cap can be tied to the gain optical fiber 12 at a position close to the optical fiber connector 121 by a rope.

[0106] As for the solution in which the optical fiber connector 121 is fixed to the side wall of the housing 13 , the dust cap can be fixed to the side wall of the housing 13 by means of a rope.

[0107] In one example, the optical fiber module 1 may include at least one gain optical fiber 12. For example, the optical fiber module 1 includes multiple gain optical fibers 12. The multiple gain optical fibers 12 are all fixed on the optical fiber board 11. The multiple gain optical fibers 12 can share the heat sink 2 and use the same heat sink 2 to dissipate heat.

[0108] Of course, it is also possible that one gain optical fiber 12 corresponds to one heat sink 2, and then the optical fiber device includes a plurality of heat sinks 2, and the gain optical fibers 12 and the heat sinks 2 correspond one to one.

[0109] Alternatively, one heat sink 2 may dissipate heat for multiple gain fibers 12 . For example, there may be multiple gain fibers 12 and multiple heat sinks 2 , the number of gain fibers 12 is greater than the number of heat sinks 2 , and each heat sink 2 dissipates heat for at least one gain fiber 12 .

[0110] The present embodiment does not limit the number of gain optical fibers 12 , and does not limit how many heat sinks 2 are used to dissipate the heat of all the gain optical fibers 12 .

[0111] In the disclosed embodiment, the gain fiber 12 is fixed on the fiber plate 11 to form a fiber module 1, and the fiber module 1 is fixed on the heat sink 2. The heat sink 2 dissipates heat for the gain fiber 12, which can prevent the gain fiber 12 from burning due to excessive temperature.

[0112] Moreover, the gain optical fiber 12 is fixed on the heat sink 2 through the optical fiber plate 11. Compared with the case where the longer gain optical fiber 12 is directly coiled on the heat sink 2, the assembly efficiency between the gain optical fiber 12 and the heat sink 2 can be obviously improved.

[0113] In addition, a first thermally conductive buffer layer 3 is fixed on the surface of the heat sink 2. The first thermally conductive buffer layer 3 is flexible, and the gain fiber 12 can be embedded in the first thermally conductive buffer layer 3. On the one hand, the contact area between the gain fiber 12 and the first thermally conductive buffer layer 3 can be increased, and the heat transfer between the gain fiber 12 and the first thermally conductive buffer layer 3 can be accelerated. On the other hand, the first thermally conductive buffer layer 3 protects the gain fiber 12 to prevent the gain fiber 12 from being crushed by the heat sink 2.

[0114] The present disclosure also provides a method for manufacturing an optical fiber device, wherein the optical fiber device is the optical fiber device described above, and the method comprises the following steps:

[0115] Step 1: fix the gain optical fiber 12 on the surface of the optical fiber plate 11 to form an optical fiber module 1.

[0116] For example, glue may be dispensed on the surface of the fiber plate 11 to form a fixed glue layer, and then the gain fiber 12 may be coiled and fixed on the surface of the fiber plate 11 , and the gain fiber 12 and the fiber plate 11 may be fixed by the fixed glue layer.

[0117] For another example, multiple grooves may be engraved on the optical fiber plate 11, the groove width of the groove being slightly larger than the diameter of the gain optical fiber, the groove bottom being coated with a glue layer, the gain optical fiber 12 being coiled in the groove and fixed in the groove by the glue layer at the groove bottom.

[0118] In one example, in a solution where the optical fiber module 1 includes a housing 13, step 1 may be that the gain optical fiber 12 is fixed on the optical fiber board 11, and the housing 13 is snapped onto the optical fiber board 11 to cover the gain optical fiber 12. The optical fiber module 1 may also include a second thermally conductive buffer layer 14, which is located on the inner surface of the top wall of the housing 13, and the gain optical fiber 12 is embedded in the second thermally conductive buffer layer 14.

[0119] Step 2: fix the optical fiber module 1 on the heat sink 2 , wherein the gain optical fiber 12 is close to the heat sink 2 .

[0120] For example, the optical fiber module 1 is fixed to the heat sink 2 via the optical fiber plate 11. Specifically, the optical fiber plate 11 and the heat sink 2 can be fixed together via screws or can be fastened together via buckles.

[0121] In one example, in a solution where the optical fiber module 1 does not include the shell 13, the optical fiber device also includes a first thermal conductive buffer layer 3, and step two may be to first fix the first thermal conductive buffer layer 3 on the surface of the heat sink 2, and then fix the optical fiber board 11 to the heat sink 2, wherein the gain optical fiber 12 is embedded in the first thermal conductive buffer layer 14.

[0122] In one example, in a scheme where the optical fiber module 1 includes a shell 13, the optical fiber device may also include a first thermally conductive buffer layer 3, and step two may be to first fix the first thermally conductive buffer layer 3 on the outer surface of the top wall of the shell 13, or to first fix the first thermally conductive buffer layer 3 on the surface of the heat sink 2, and then fix the optical fiber board 11 to the heat sink 2, wherein the first thermally conductive buffer layer 14 is squeezed between the top wall of the shell 13 and the heat sink 2.

[0123] In one example, in a solution where the optical fiber module 1 includes a housing 13 , the end of the gain optical fiber 12 extends out of the housing 13 for external connection.

[0124] For example, the side wall of the housing 13 has a through hole, the diameter of which is slightly larger than the diameter of the gain optical fiber 12 , so that the end of the gain optical fiber 12 can pass through the through hole and extend out of the housing 13 .

[0125] In one example, when connecting the gain fiber to the outside, one method may be to fuse the two ends of the gain fiber to the input fiber and the output fiber, respectively, wherein the input fiber is used to connect the pump source and the gain fiber, and the output fiber serves as the output optical path of the optical device.

[0126] In another example, in connecting the gain optical fiber to the outside, another method may be that both ends of the gain optical fiber have optical fiber connectors, and the two ends of the gain optical fiber are respectively connected to the input optical fiber and the output optical fiber in a pluggable manner through the optical fiber connector.

[0127] In the scheme where the optical fiber module 1 includes a shell 13, the optical fiber connector of the gain optical fiber can be located outside the shell, or the side wall of the shell has an optical fiber port, the optical fiber connector is located in the optical fiber port, and the optical port of the optical fiber connector is exposed.

[0128] In one example, in a solution where the end of the gain fiber has a fiber optic connector, the fiber optic module may further include a dust cap. When the fiber optic module is not used in an optical device, the fiber optic module is in an idle state, and its fiber optic connector is also in an idle state. The dust cap can be sealed on the fiber optic connector to prevent dust from entering the fiber optic connector and affecting the optical transmission between the gain fiber and the input fiber and the output fiber.

[0129] In the disclosed embodiment, the gain fiber 12 is fixed on the fiber plate 11 to form a fiber module 1, and the fiber module 1 is fixed on the heat sink 2. The heat sink 2 dissipates heat for the gain fiber 12, which can prevent the gain fiber 12 from burning due to excessive temperature.

[0130] Moreover, the gain optical fiber 12 is fixed on the heat sink 2 through the optical fiber plate 11. Compared with the case where the longer gain optical fiber 12 is directly coiled on the heat sink 2, the assembly efficiency between the gain optical fiber 12 and the heat sink 2 can be obviously improved.

[0131] In addition, a first thermally conductive buffer layer 3 is fixed on the surface of the heat sink 2. The first thermally conductive buffer layer 3 is flexible, and the gain fiber 12 can be embedded in the first thermally conductive buffer layer 3. On the one hand, the contact area between the gain fiber 12 and the first thermally conductive buffer layer 3 can be increased, and the heat transfer between the gain fiber 12 and the first thermally conductive buffer layer 3 can be accelerated. On the other hand, the first thermally conductive buffer layer 3 protects the gain fiber 12 to prevent the gain fiber 12 from being crushed by the heat sink 2.

[0132] The embodiment of the present disclosure also provides an optical device, which can be a fiber laser or an optical amplifier. The optical device can include a pump source and the above-mentioned optical fiber device, the pump source is connected to the gain fiber of the optical fiber device, the pump source is used to input pump light to the gain fiber, and the gain fiber is used to amplify the light and output the gain light (i.e., high-power light) to the outside.

[0133] The optical fiber device of the optical device, as described above, has a gain optical fiber 12 fixed on an optical fiber plate 11 to form an optical fiber module 1, and the optical fiber module 1 is fixed on a heat sink 2. The heat sink 2 dissipates heat for the gain optical fiber 12, which can prevent the gain optical fiber 12 from burning due to excessive temperature.

[0134] Moreover, the gain optical fiber 12 is fixed on the heat sink 2 through the optical fiber plate 11. Compared with the case where the longer gain optical fiber 12 is directly coiled on the heat sink 2, the assembly efficiency between the gain optical fiber 12 and the heat sink 2 can be obviously improved.

[0135] In addition, a first thermally conductive buffer layer 3 is fixed on the surface of the heat sink 2. The first thermally conductive buffer layer 3 is flexible, and the gain fiber 12 can be embedded in the first thermally conductive buffer layer 3. On the one hand, the contact area between the gain fiber 12 and the first thermally conductive buffer layer 3 can be increased, and the heat transfer between the gain fiber 12 and the first thermally conductive buffer layer 3 can be accelerated. On the other hand, the first thermally conductive buffer layer 3 protects the gain fiber 12 to prevent the gain fiber 12 from being crushed by the heat sink 2.

Claims

1. An optical fiber device, characterized in that: The optical fiber device comprises an optical fiber module (1) and a heat sink (2); The optical fiber module (1) comprises an optical fiber plate (11) and a gain optical fiber (12), wherein the gain optical fiber (12) is fixed on the surface of the optical fiber plate (11); The optical fiber module (1) is mounted on the heat sink (2), and the gain optical fiber (12) is close to the heat sink (2).

2. The optical fiber device according to claim 1, characterized in that The optical fiber device further comprises a first heat-conducting buffer layer (3), wherein the first heat-conducting buffer layer (3) is located between the optical fiber module (1) and the heat sink (2).

3. The optical fiber device according to claim 2, characterized in that: The first heat-conducting buffer layer (3) is flexible, and the gain optical fiber (12) is embedded in the first heat-conducting buffer layer (3).

4. The optical fiber device according to claim 1, characterized in that The optical fiber module (1) further comprises a housing (13), the gain optical fiber (12) being located in the housing (13), and the end of the gain optical fiber (12) protruding from the housing (13).

5. The optical fiber device according to claim 4, characterized in that: The optical fiber device further comprises a first heat-conducting buffer layer (3), wherein the first heat-conducting buffer layer (3) is flexible and is interference-clamped between the top wall of the housing (13) and the heat sink (2).

6. The optical fiber device according to claim 4, characterized in that: The optical fiber module (1) further comprises a second heat-conducting buffer layer (14), wherein the second heat-conducting buffer layer (14) is located on the inner surface of the top wall of the housing (13); The second heat-conducting buffer layer (14) is flexible, and the gain optical fiber (12) is embedded in the second heat-conducting buffer layer (14).

7. The optical fiber device according to any one of claims 4 to 6, characterized in that: The housing (13) has thermal conductivity.

8. The optical fiber device according to any one of claims 1 to 7, characterized in that: The end of the gain optical fiber (12) is provided with an optical fiber connector (121).

9. The optical fiber device according to claim 8, characterized in that: The optical fiber module (1) further comprises a dust cap, wherein the dust cap is sealed on the idle optical fiber connector (121).

10. An optical device, characterized in that: The optical device comprises the optical fiber device according to any one of claims 1 to 9.

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