Lens assembly for optical module coupling and coupling system thereof

Abstract

The invention relates to the technical field of optical module packaging, in particular to a lens assembly for optical module coupling and a coupling system thereof.The lens assembly comprises a PCBA board, a surface-mounted chip is installed on the outer wall of the PCBA board, a PE I coupling lens is arranged on the outer surface of the PCBA board and located above the surface-mounted chip, and an MT short jumper wire is connected to the outer wall of the PE I coupling lens and located on the front face of the PCBA board; a golden finger is arranged on the outer wall of the PCBA board and is far away from the MT short jumper wire; the PE I coupling lens comprises a first lens array, the lens assembly used for optical module coupling and the coupling system of the lens assembly are designed, the PE I coupling lens in the device is used for emergent light coupling, and the problems that an existing optical module lens assembly needs an external light source in the coupling process, and the coupling efficiency is high are solved. In the production process, the light source needs to be calibrated frequently to prevent the problems of responsivity distortion of the detector at the coupling receiving end and time-consuming and labor-consuming calibration operation caused by reduction of the optical power of the external light source.

Description

Technical Field

[0001] The present invention relates to the technical field of optical module packaging, and in particular to a lens assembly for optical module coupling and a coupling system thereof. Background Art

[0002] The optical module is a transceiver module consisting of a transmitter and a receiver. The transmitter couples the laser light into the optical fiber, and the receiver needs to transmit the external light signal through the optical fiber and couple it into the detector at the optical module receiver through the lens. Therefore, coupling is one of the most critical processes in optical module packaging. The traditional optical module coupling receiver requires an external light source. The light coupled through the lens enters the receiver PD (detector) to generate a photocurrent. The photocurrent forms a voltage through the TIA (transimpedance amplifier) ​​connected to the PD, and then is restored by sampling on the circuit board PCBA, and finally the responsiveness of the PD (detector) is calculated.

[0003] However, the existing optical module coupling lens assembly still has shortcomings. Specifically, the existing optical module lens assembly requires an external light source during the coupling process. The light source needs to be calibrated frequently during the production process to prevent the distortion of the response of the coupled receiving end detector due to the decrease in the optical power of the external light source. The calibration operation is time-consuming and labor-intensive.

[0004] Therefore, a lens assembly for optical module coupling and a coupling system thereof are needed to solve the problems raised in the above background technology. Summary of the invention

[0005] The object of the present invention is to provide a lens assembly for optical module coupling and a coupling system thereof, so as to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A lens assembly for optical module coupling and a coupling system thereof, comprising a PCBA board, a mounting chip is installed on the outer wall of the PCBA board, a PE I coupling lens is arranged on the outer surface of the PCBA board and above the mounting chip, an MT short jumper is connected to the outer wall of the PE I coupling lens and on the front of the PCBA board, and a gold finger is installed on the outer wall of the PCBA board and at a position away from the MT short jumper;

[0008] The PE I coupling lens includes a first lens array, positioning columns are installed on both sides of the first lens array, a second lens array is installed below the first lens array, a roof prism is installed directly above the first lens array, and a third lens array is installed at the bottom of the roof prism.

[0009] As a preferred solution of the present invention, the mounting chip includes a TX optical chip VCSEL array installed on the outer wall of the PCBA board, a TX electrical chip Dr i ver array is installed on the outer wall of the PCBA board and on the left side of the TX optical chip VCSEL array, an RX electrical chip T IA array is installed on the outer wall of the PCBA board and below the TX electrical chip Dr i ver array, and an RX optical chip PD array is arranged on the outer wall of the PCBA board and on the right side of the RX electrical chip T IA array.

[0010] As a preferred solution of the present invention, the mounting chip is mounted on the COB area of ​​the PCBA board, and the PE I coupling lens is located above the COB area of ​​the PCBA board.

[0011] As a preferred solution of the present invention, the first lens array is a 45-degree reflective surface lens, and the first lens array is formed into a partially transmissive and partially reflective surface through coating.

[0012] As a preferred solution of the present invention, the roof prism is bonded to the upper surface of the PE I by optical glue, the positioning column is connected to the MT short jumper through the mini MT, and the mini MT has two through holes adapted to the positioning column.

[0013] As a preferred solution of the present invention, the TX optical chip VCSEL array and the TX electrical chip Dr i ver array, the RX optical chip PD array and the RX electrical chip T IA array, the RX electrical chip T IA array and the PCBA board, and the TX electrical chip Dr i ver array and the PCBA board are all connected by gold wire.

[0014] As a preferred solution of the present invention, the TX optical chip VCSEL array, the TX electrical chip Driver array, the RX electrical chip TIA array and the RX optical chip PD array are all mounted on the PCBA board through conductive glue.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In the present invention, a lens assembly and a coupling system for optical module coupling are designed, and the PE in the device is used I coupling lens is used for light output coupling. The first lens array made of the coated 45-degree reflective surface lens can ensure that the light coming out of the TX optical chip VCSEL array array is converged by the second lens array through coating. Under the action of the 45-degree reflective surface of the first lens array, a part of the light enters the first lens array, and the remaining part enters the third lens array. The light entering the third lens array enters the MT short jumper, and a part is emitted from the top of the 45-degree reflective surface. The roof prism can ensure that the 45-degree reflective surface of the PEI lens is coated to ensure that a part of the light coming out of the TX optical chip is reflected into the MT short jumper. In the module production coupling process, no external light source and light source calibration are required, which greatly saves material production costs. At the same time, only the coupling of the transmitting end needs to be monitored to determine the responsivity of the receiving end, which saves coupling time and greatly improves coupling efficiency. The design of the lens transmitting end does not require additional attenuation film to reduce the optical power of the transmitting end, which reduces the material coating cost. The existing optical module lens assembly needs an external light source during the coupling process, and the light source needs to be calibrated frequently during the production process to prevent the external light source from causing the optical power of the external light source to decrease. The problem of distortion of the responsivity of the coupled receiving end detector, and the time-consuming and laborious calibration operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of the present invention;

[0018] Figure 2 This is a front view of the PCBA board of the present invention;

[0019] Figure 3 This is a front view of the patch chip of the present invention;

[0020] Figure 4 It is a front view of the PE I coupling lens of the present invention;

[0021] Figure 5 This is a schematic diagram of the conventional PE I lens coupling optical path of the present invention;

[0022] Figure 6 It is a side view of a conventional PE I lens of the present invention;

[0023] Figure 7 It is a side cross-sectional view of the PE I coupling lens of the present invention;

[0024] Figure 8 This is a schematic diagram of the PE I lens coupling optical path of the present invention;

[0025] Fig. 9 It is a front cross-sectional view of the PE I coupling lens of the present invention;

[0026] Fig.10 This is the optical path diagram of the PE I coupling lens of the present invention.

[0027] In the figure: 1, PCBA board; 2, mounting chip; 3, PE I coupling lens; 4, MT short jumper; 5, gold finger; 201, TX optical chip VCSEL array; 202, TX electrical chip Driver array; 203, RX electrical chip TIA array; 204, RX optical chip PD array; 301, first lens array; 302, positioning column; 303, second lens array; 304, roof prism; 305, third lens array. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0032] For examples, see Figure 1-10 , the present invention provides a technical solution:

[0033] A lens assembly for optical module coupling and a coupling system thereof, comprising a PCBA board 1, a mounting chip 2 is installed on the outer wall of the PCBA board 1, a PE I coupling lens 3 is arranged on the outer surface of the PCBA board 1 and above the mounting chip 2, an MT short jumper 4 is connected to the outer wall of the PE I coupling lens 3 and on the front of the PCBA board 1, and a gold finger 5 is installed on the outer wall of the PCBA board 1 and at a position away from the MT short jumper 4;

[0034] The mounting chip 2 is mounted on the COB area of ​​the PCBA board 1, and the PEI coupling lens 3 is located above the COB area of ​​the PCBA board 1;

[0035] In this embodiment, reference Figure 8 and Fig. 9 , the PEI coupling lens 3 includes a first lens array 301, positioning posts 302 are installed on both sides of the first lens array 301, a second lens array 303 is installed below the first lens array 301, a roof prism 304 is installed just above the first lens array 301, and a third lens array 305 is installed at the bottom of the roof prism 304;

[0036] The first lens array 301 is a 45-degree reflective surface lens, and the first lens array 301 forms a partially transmissive and partially reflective surface through coating, the roof prism 304 is bonded to the upper surface of PEI through optical glue, the positioning column 302 is connected to the MT short jumper 4 through the mini MT, and there are 2 through holes on the mini MT that are adapted to the positioning column 302, and the first lens array 301 made of the 45-degree reflective surface lens after coating can ensure that the light coming out of the TX optical chip VCSEL array 201 is converged by the second lens array 303 through the coating, and under the action of the 45-degree reflective surface of the first lens array 301, a part of the light enters the first lens array 301, and the remaining part enters the third lens array 305, the light entering the third lens array 305 enters the MT short jumper 4, and a part of the light is emitted from the top of the 45-degree reflective surface, and the roof prism 304 can ensure that the 45-degree reflective surface of the PEI lens is coated to ensure that a part of the light coming out of the TX optical chip VCSEL array 201 is reflected into the MT short jumper 4;

[0037] In this embodiment, reference Figure 2 and Figure 3The mounting chip 2 includes a TX optical chip VCSEL array 201 mounted on the outer wall of the PCBA board 1, a TX electrical chip Driver array 202 is mounted on the outer wall of the PCBA board 1 and on the left side of the TX optical chip VCSEL array 201, an RX electrical chip TIA array 203 is mounted on the outer wall of the PCBA board 1 and below the TX electrical chip Driver array 202, and an RX optical chip PD array 204 is arranged on the outer wall of the PCBA board 1 and on the right side of the RX electrical chip TIA array 203;

[0038] The TX optical chip VCSEL array 201 and the TX electrical chip Driver array 202, the RX optical chip PD array 204 and the RX electrical chip TIA array 203, the RX electrical chip TIA array 203 and the PCBA board 1, and the TX electrical chip Driver array 202 and the PCBA board 1 are all connected by gold wires, and the TX optical chip VCSEL array 201, the TX electrical chip Driver array 202, the RX electrical chip TIA array 203, and the RX optical chip PD array 204 are all mounted on the PCBA board 1 by conductive glue.

[0039] The working process of the present invention is as follows: when the lens assembly and coupling system for optical module coupling designed by the present invention are in operation, the first lens array 301 made of coated 45-degree reflective surface lenses can ensure that the light from the TX optical chip VCSEL array 201 is converged by the second lens array 303 through coating, and under the action of the 45-degree reflective surface of the first lens array 301, a part of the light enters the first lens array 301, and the remaining part enters the third lens array 305. The third lens array 305 at the bottom of the roof prism 304 can realize the convergence of the light projected from the 45-degree reflective surface, and at the same time, the third lens array 305 is processed to ensure that the light between each channel The distance can correspond to the second lens array 303 one by one, the light entering the third lens array 305 enters the MT short jumper 4, and a part of it is emitted from the top of the 45-degree reflection surface. The roof prism 304 can ensure that a part of the light coming out of the TX optical chip VCSEL array 201 is reflected into the MT short jumper 4 through the coating of the 45-degree reflection surface of the PEI lens. In the coupling process, there is no need to use an external light source, which simplifies the coupling system and saves equipment investment costs in the production process. By using the chip's own light-emitting coupling, there is no need for coupling software to do the coupling at the receiving end, which greatly improves the coupling efficiency. The design of the lens emitting end does not require the coating of an attenuation film, which reduces the material coating cost.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A lens assembly for optical module coupling and a coupling system thereof, comprising a PCBA board (1), characterized in that: A mounting chip (2) is installed on the outer wall of the PCBA board (1); a PEI coupling lens (3) is arranged on the outer surface of the PCBA board (1) and above the mounting chip (2); an MT short jumper (4) is connected to the outer wall of the PEI coupling lens (3) and on the front of the PCBA board (1); and a gold finger (5) is installed on the outer wall of the PCBA board (1) and at a position away from the MT short jumper (4); The PEI coupling lens (3) comprises a first lens array (301), positioning columns (302) are installed on both sides of the first lens array (301), a second lens array (303) is installed below the first lens array (301), a roof prism (304) is installed directly above the first lens array (301), and a third lens array (305) is installed at the bottom of the roof prism (304).

2. The lens assembly for optical module coupling and the coupling system thereof according to claim 1, characterized in that: The mounting chip (2) comprises a TX optical chip VCSEL array (201) mounted on the outer wall of a PCBA board (1); a TX electrical chip Driver array (202) is mounted on the outer wall of the PCBA board (1) and on the left side of the TX optical chip VCSEL array (201); an RX electrical chip TIA array (203) is mounted on the outer wall of the PCBA board (1) and below the TX electrical chip Driver array (202); and an RX optical chip PD array (204) is arranged on the outer wall of the PCBA board (1) and on the right side of the RX electrical chip TIA array (203).

3. The lens assembly for optical module coupling and the coupling system thereof according to claim 1, characterized in that: The mounting chip (2) is mounted on the COB area of ​​the PCBA board (1), and the PEI coupling lens (3) is located above the COB area of ​​the PCBA board (1).

4. The lens assembly for optical module coupling and the coupling system thereof according to claim 1, characterized in that: The first lens array (301) is a 45-degree reflective surface lens, and the first lens array (301) forms a partially transmissive and partially reflective surface through coating.

5. The lens assembly for optical module coupling and the coupling system thereof according to claim 1, characterized in that: The roof prism (304) is bonded to the upper surface of PEI by optical glue, the positioning column (302) is connected to the MT short jumper (4) by mini MT, and the mini MT has two through holes adapted to the positioning column (302).

6. The lens assembly for optical module coupling and the coupling system thereof according to claim 2, characterized in that: The TX optical chip VCSEL array (201) and the TX electrical chip Driver array (202), the RX optical chip PD array (204) and the RX electrical chip TIA array (203), the RX electrical chip TIA array (203) and the PCBA board (1), and the TX electrical chip Driver array (202) and the PCBA board (1) are all connected using gold wires.

7. The lens assembly for optical module coupling and the coupling system thereof according to claim 2, characterized in that: The TX optical chip VCSEL array (201), the TX electrical chip Driver array (202), the RX electrical chip TIA array (203) and the RX optical chip PD array (204) are all mounted on the PCBA board (1) by means of conductive adhesive.

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