Device and method for coupling and packaging MZI network and optical amplifier

Abstract

The invention discloses a device and a method for coupling and packaging an MZI network and an optical amplifier. The method comprises the following steps: selecting refractive index matching oil; etching a microgroove on the MZI network chip; coating glue in the microgroove, and etching a gap between the microgroove and the MZI network; depositing an active part of the optical amplifier; depositing a passive part of the optical amplifier, and depositing a cladding and an electrode; the optical amplifier chip is arranged in the microgroove, and refractive index matching oil is filled in the gap. Microgroove etching, MBE and thermal evaporation technologies are adopted, efficient coupling packaging of the MZI network and the optical amplifier is achieved, and the method has the advantages of being low in loss, high in precision and high in stability.

Description

Technical Field

[0001] The present invention relates to the field of optical packaging, and in particular to a device and method for coupling packaging of an MZI network and an optical amplifier. Background Art

[0002] In modern optoelectronic technology, optical integrated circuits have become a key technology to promote the development of optical communications, optical computing and optical sensing. As an important component in optical integrated circuits, MZI networks are widely used in wavelength selection, signal modulation, phase control and other functions. Due to the good optical properties and programmability of MZI networks, they play an important role in large-scale optical integration. At the same time, optical amplifiers, as core components to improve the intensity and transmission distance of optical signals, are also an indispensable part of optical communication systems. In order to improve the performance of the system, the close coupling of optical amplifiers and MZI networks is crucial. The quality of optical coupling between the two directly affects the optical signal transmission efficiency and stability of the entire system.

[0003] However, in the prior art, there are several technical difficulties in the coupling packaging between the MZI network and the optical amplifier, which seriously restricts the performance improvement of the optoelectronic system. Traditional coupling packaging methods usually rely on manual alignment, which makes it difficult to ensure high-precision docking. This leads to problems such as optical loss and signal attenuation, affecting the overall efficiency and stability of the system. Especially when there is a slight displacement or misalignment between the optical amplifier and the MZI network, the transmission efficiency of the optical signal will drop significantly, thus affecting the performance of the entire system.

[0004] In the traditional optical amplifier and MZI network coupling packaging technology, one of the common defects is the low coupling alignment efficiency, which leads to the transmission loss of the optical signal. In most existing technologies, the docking process of the optical amplifier and the MZI network usually relies on manual or semi-automatic operations, and precise optical alignment cannot be achieved. Especially in high-density integrated optoelectronic systems, precise alignment becomes particularly difficult due to space and size limitations. Insufficient alignment accuracy will cause large reflections and scattering of optical signals at the contact surface, causing signal loss and system performance degradation. This inefficient docking process not only reduces the coupling efficiency of the optical signal, but also increases the optical loss of the system, affecting the gain effect of the optical amplifier.

[0005] In addition, existing packaging methods usually lack sufficient optimization means to reduce the reflection loss of optical signals. During the coupling process, there is a difference in refractive index at the contact surface between the MZI network and the optical amplifier, which leads to reduced reflection and transmission efficiency of optical signals. Although refractive index matching oil has been widely used to reduce optical loss, existing technologies have failed to effectively solve the problem of unevenness in the filling process of refractive index matching oil. The refractive index mismatch or uneven filling of the filling oil will cause more loss of optical signals during transmission, which in turn affects the stability and performance of the entire optoelectronic system.

[0006] Packaging cost and packaging efficiency are also another prominent problem in the existing technology. Traditional packaging methods for coupling MZI networks with optical amplifiers usually involve complex operations and expensive materials, such as high-precision optical alignment equipment and expensive refractive index matching oil. These factors not only increase production costs, but also extend the production cycle of products. For the commercial application of optoelectronic systems, the control of packaging costs and the improvement of packaging efficiency are crucial. However, the existing technology has failed to provide an efficient and low-cost packaging solution, which has caused the production process of many optoelectronic devices to become cumbersome and expensive, thus affecting the overall market competitiveness.

[0007] Furthermore, existing packaging technologies are often unable to achieve large-scale production in highly integrated optoelectronic systems. Traditional manual or semi-automated packaging methods cannot meet the requirements of large-scale production, so production efficiency is low and product consistency and stability are difficult to guarantee. Especially in the parallel integration of multiple optoelectronic devices, the packaging efficiency and quality of existing technologies are difficult to meet the needs of actual applications, resulting in low product output, long production cycle, and slow market response. Therefore, the existing MZI network and optical amplifier coupling packaging method cannot effectively solve the above technical problems, and a new packaging solution is urgently needed to improve coupling efficiency, reduce optical loss, reduce production costs and improve production efficiency.

[0008] In summary, the existing MZI network and optical amplifier coupling packaging method has significant deficiencies in docking accuracy, optical loss control, packaging cost and packaging efficiency, etc. The present invention solves these problems by optimizing the packaging technology, and has important technical breakthroughs and application value. Summary of the invention

[0009] One purpose of the present invention is to propose a method for coupling and packaging an MZI network and an optical amplifier. The present invention can not only significantly improve the transmission efficiency of optical signals, but also effectively reduce the optical loss of the system by optimizing the optical path design, improving the docking accuracy and simplifying the packaging process. In addition, refractive index matching oil and automated equipment are used to achieve high-precision docking of the optical amplifier and the MZI network, improve the packaging efficiency, reduce the optical loss, and make the entire packaging process more stable and reliable.

[0010] A method for coupling and packaging an MZI network and an optical amplifier according to an embodiment of the present invention includes the following steps:

[0011] S1. Determine the emission height and spot size of the MZI network, and select appropriate refractive index matching oil according to the MZI network and optical amplifier materials;

[0012] S2, etching microgrooves on the MZI network chip according to the core layer position and chip height of the optical amplifier chip;

[0013] S3, coating the microgrooves with glue and etching a gap between the microgrooves and the MZI network;

[0014] S4, using MBE technology to deposit the active part of the optical amplifier;

[0015] S5. Depositing the passive part of the optical amplifier by thermal evaporation technology, and depositing the cladding and electrodes;

[0016] S6. Place the optical amplifier chip in the microgroove using an adsorption gripper and fill the gap with refractive index matching oil.

[0017] Optionally, the S1 specifically includes:

[0018] S11, determining the output height of the MZI network, where the output height is the vertical distance from the output end of the MZI network to the receiving surface of the optical amplifier, and is determined by analyzing the waveguide size of the MZI network, the thickness of the optical waveguide, and the height of the receiving surface of the optical amplifier;

[0019] S12, determining the spot size of the MZI network output, where the spot size is the lateral size of the light beam output by the optical waveguide, and is determined by the waveguide mode of the MZI network and the light source characteristics, where the light source characteristics include wavelength and divergence angle;

[0020] S13. Select appropriate refractive index matching oil according to the refractive index of the material of the MZI network and the optical amplifier:

[0021]

[0022] Among them, n MZI is the refractive index of the MZI network, n amp is the refractive index of the optical amplifier, n oil To match the refractive index of the oil;

[0023] S14. When selecting refractive index matching oil, viscosity and surface tension must be considered to ensure the stability of the oil layer.

[0024] Optionally, the height of the microgroove is lower than the height of the optical amplifier chip, so as to ensure the connection between the optical amplifier and the MZI network.

[0025] Optionally, the S4 specifically includes:

[0026] S41, placing the substrate of the optical amplifier in the MBE cavity, and performing a vacuum evacuation process on the MBE cavity;

[0027] S42, cleaning and preheating the surface of the substrate material to remove surface oxides, with the preheating temperature being set between 300° C. and 500° C.;

[0028] S43. Turn on the beam source switch of the molecular beam source, control the beam intensity and deposition rate, and deposit the required material on the substrate surface.

[0029] Optionally, the S5 specifically includes:

[0030] S51, preparing a deposition material for the passive part, and placing the deposition material in a vapor deposition boat;

[0031] S52, installing the substrate material in the evaporation cavity, and evacuating the evaporation cavity;

[0032] S53, controlling the substrate temperature between 200° C. and 400° C. to promote the adhesion of the deposited material on the substrate and form a uniform thin film;

[0033] S54, adjusting the evaporation rate and evaporation time to control the cladding thickness;

[0034] S55, after the evaporation is completed, the substrate is cooled to room temperature, and the cavity is kept clean;

[0035] S56, depositing an electrode;

[0036] S57, after the deposition step is completed, the optical amplifier is subjected to heat treatment and annealing treatment.

[0037] Optionally, the S6 specifically includes:

[0038] S61, picking up the optical amplifier chip by using an adsorption gripper, and moving the optical amplifier chip from the storage position to above the MZI network microgroove;

[0039] S62, adjusting the positioning of the optical amplifier chip so that the optical amplifier chip and the butt joint surface of the micro groove of the MZI network chip are aligned;

[0040] S63, lowering the height of the adsorption gripper to embed the optical amplifier chip into the microgroove;

[0041] S64, adjusting the gripping strength of the adsorption gripper to release the optical amplifier chip until the optical amplifier chip is completely placed in the microgroove and ensures that it is in full contact with the refractive index matching oil;

[0042] S65, filling the gap with refractive index matching oil to ensure that the oil layer is evenly distributed in the gap between the optical amplifier and the microgroove;

[0043] S66. Use a microscope to check the position of the optical amplifier chip and the filling state of the refractive index matching oil to ensure that the positioning accuracy of the optical amplifier chip in the microgroove meets the requirements.

[0044] According to an embodiment of the present invention, a device for coupling and packaging an MZI network and an optical amplifier includes:

[0045] A deposition module, used for depositing the active part, passive part, cladding and electrodes of the optical amplifier chip;

[0046] Adsorption gripper module, used to place the optical amplifier chip into the micro-groove of the MZI network chip;

[0047] High-precision positioning module, used to position the optical amplifier chip so that it is aligned with the micro-groove interface of the MZI network chip;

[0048] An optical amplifier embedding module is used to control the embedding process of the optical amplifier chip into the microgroove, ensuring that the optical amplifier chip and the microgroove are connected stably and without deviation;

[0049] A refractive index matching oil filling module is used to fill the gap between the optical amplifier chip and the microgroove with refractive index matching oil to control the thickness and uniformity of the oil layer;

[0050] The detection and adjustment module is used to check the position of the optical amplifier chip, the filling status of the refractive index matching oil and the accuracy of the optical docking, and to calibrate the position of the optical amplifier chip through fine-tuning.

[0051] The beneficial effects of the present invention are:

[0052] The present invention achieves a series of significant beneficial effects by improving the coupling packaging technology of the MZI network and the optical amplifier. First, by etching microgrooves on the MZI network chip and optimizing its size, the optical amplifier chip can be embedded in the microgrooves with high precision, ensuring that the docking position between the two is accurate. Compared with the traditional method, this design avoids the damage that may be caused by direct contact, and significantly improves the coupling stability and the transmission efficiency of the optical signal through the precise control of the physical structure. At the same time, by reasonably designing the difference between the depth of the microgroove and the height of the optical amplifier chip, the mechanical stress during the docking process is effectively reduced, thereby extending the service life of the device.

[0053] Secondly, the present invention introduces MBE technology and thermal evaporation technology to perform step-by-step deposition on the active and passive parts of the optical amplifier. This method ensures that the material properties of the active gain region and the passive coupling region can fully meet the needs of optical signal amplification and transmission, and avoids performance losses caused by uneven deposition quality or material incompatibility in traditional processes. By precisely controlling the deposition thickness and rate, the present invention achieves high-quality preparation of the gain layer and waveguide layer of the optical amplifier, significantly improving the amplification effect of the optical signal. In addition, the optimized design of the passive cladding and electrodes by the thermal evaporation process not only improves the structural integrity of the optical amplifier, but also enhances the stability of the electro-optical coupling.

[0054] The optimal selection and reasonable filling of refractive index matching oil is also a highlight of the present invention. By considering parameters such as refractive index, viscosity and surface tension, it is ensured that the oil layer is evenly distributed in the microgroove and the thickness meets the design requirements. This improvement greatly reduces the reflection and scattering losses of the optical signal at the interface, further improving the coupling efficiency. In addition, using the adsorption gripper module and the high-precision positioning module, the optical amplifier chip can be accurately placed in the microgroove, and the docking operation can be completed without multiple adjustments. This automated operation not only reduces the errors caused by human factors, but also significantly improves the packaging efficiency and reduces the overall production cost.

[0055] Through the above technical innovations, the present invention realizes the efficient integration of MZI network and optical amplifier, significantly reduces the loss of optical signal at the coupling interface, and improves the reliability and efficiency of packaging. This improvement not only meets the demand for high-precision optical coupling, but also provides an effective solution for simplifying packaging process and improving performance in the field of optical communication and optical signal processing, which has broad application prospects and industrial value. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0057] Figure 1 A flow chart of a method for coupling and packaging an MZI network and an optical amplifier proposed by the present invention;

[0058] Figure 2 The simulation results of MZI network and optical amplifier coupling at different wavelengths are shown;

[0059] Figure 3 Schematic diagram of coupling between MZI network and optical amplifier;

[0060] Figure 4 This is the process diagram of the optical amplifier;

[0061] Figure 5This is a diagram of the passive waveguide coupling part of the optical amplifier;

[0062] Figure 6 It is a top view of the passive waveguide coupling part of the optical amplifier;

[0063] Figure 7 It is a schematic diagram of the MZI network structure;

[0064] Figure 8 This is a top view of the MZI network. DETAILED DESCRIPTION

[0065] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0066] refer to Figure 1 and Figure 2 , a method for coupling and packaging an MZI network and an optical amplifier, comprising the following steps:

[0067] S1. Determine the emission height and spot size of the MZI network, and select appropriate refractive index matching oil according to the MZI network and optical amplifier materials;

[0068] S2, etching microgrooves on the MZI network chip according to the core layer position and chip height of the optical amplifier chip;

[0069] S3, coating the microgrooves with glue and etching a gap between the microgrooves and the MZI network;

[0070] S4, using MBE technology to deposit the active part of the optical amplifier;

[0071] S5. Depositing the passive part of the optical amplifier by thermal evaporation technology, and depositing the cladding and electrodes;

[0072] S6. Place the optical amplifier chip in the microgroove using an adsorption gripper and fill the gap with refractive index matching oil.

[0073] In this implementation manner, the S1 specifically includes:

[0074] S11, determining the output height of the MZI network, where the output height is the vertical distance from the output end of the MZI network to the receiving surface of the optical amplifier, and is determined by analyzing the waveguide size of the MZI network, the thickness of the optical waveguide, and the height of the receiving surface of the optical amplifier;

[0075] S12, determining the spot size of the MZI network output, where the spot size is the lateral size of the light beam output by the optical waveguide, and is determined by the waveguide mode of the MZI network and the light source characteristics, where the light source characteristics include wavelength and divergence angle;

[0076] S13. Select appropriate refractive index matching oil according to the refractive index of the material of the MZI network and the optical amplifier:

[0077]

[0078] Among them, n MZI is the refractive index of the MZI network, n amp is the refractive index of the optical amplifier, n oil To match the refractive index of the oil;

[0079] S14. When selecting refractive index matching oil, viscosity and surface tension must be considered to ensure the stability of the oil layer.

[0080] In this implementation manner, the height of the microgroove is lower than the height of the optical amplifier chip, thereby ensuring the connection between the optical amplifier and the MZI network.

[0081] In this implementation manner, the S4 specifically includes:

[0082] S41, placing the substrate of the optical amplifier in the MBE cavity, and performing a vacuum evacuation process on the MBE cavity;

[0083] S42, cleaning and preheating the surface of the substrate material to remove surface oxides, with the preheating temperature being set between 300° C. and 500° C.;

[0084] S43. Turn on the beam source switch of the molecular beam source, control the beam intensity and deposition rate, and deposit the required material on the substrate surface.

[0085] In this implementation manner, S5 specifically includes:

[0086] S51, preparing a deposition material for the passive part, and placing the deposition material in a vapor deposition boat;

[0087] S52, installing the substrate material in the evaporation cavity, and evacuating the evaporation cavity;

[0088] S53, controlling the substrate temperature between 200° C. and 400° C. to promote the adhesion of the deposited material on the substrate and form a uniform thin film;

[0089] S54, adjusting the evaporation rate and evaporation time to control the cladding thickness;

[0090] S55, after the evaporation is completed, the substrate is cooled to room temperature, and the cavity is kept clean;

[0091] S56, depositing an electrode;

[0092] S57, after the deposition step is completed, the optical amplifier is subjected to heat treatment and annealing treatment.

[0093] In this implementation manner, S6 specifically includes:

[0094] S61, picking up the optical amplifier chip by using an adsorption gripper, and moving the optical amplifier chip from the storage position to above the MZI network microgroove;

[0095] S62, adjusting the positioning of the optical amplifier chip so that the optical amplifier chip and the butt joint surface of the micro groove of the MZI network chip are aligned;

[0096] S63, lowering the height of the adsorption gripper to embed the optical amplifier chip into the microgroove;

[0097] S64, adjusting the gripping strength of the adsorption gripper to release the optical amplifier chip until the optical amplifier chip is completely placed in the microgroove and ensures that it is in full contact with the refractive index matching oil;

[0098] S65, filling the gap with refractive index matching oil to ensure that the oil layer is evenly distributed in the gap between the optical amplifier and the microgroove;

[0099] S66. Use a microscope to check the position of the optical amplifier chip and the filling state of the refractive index matching oil to ensure that the positioning accuracy of the optical amplifier chip in the microgroove meets the requirements.

[0100] refer to Figure 3-Figure 8 , a device for coupling and packaging an MZI network and an optical amplifier, comprising:

[0101] A deposition module, used for depositing the active part, passive part, cladding and electrodes of the optical amplifier chip;

[0102] Adsorption gripper module, used to place the optical amplifier chip into the micro-groove of the MZI network chip;

[0103] High-precision positioning module, used to position the optical amplifier chip so that it is aligned with the micro-groove interface of the MZI network chip;

[0104] An optical amplifier embedding module is used to control the embedding process of the optical amplifier chip into the microgroove, ensuring that the optical amplifier chip and the microgroove are connected stably and without deviation;

[0105] A refractive index matching oil filling module is used to fill the gap between the optical amplifier chip and the microgroove with refractive index matching oil to control the thickness and uniformity of the oil layer;

[0106] The detection and adjustment module is used to check the position of the optical amplifier chip, the filling status of the refractive index matching oil and the accuracy of the optical docking, and to calibrate the position of the optical amplifier chip through fine-tuning.

[0107] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for coupling and packaging an MZI network and an optical amplifier, characterized in that: The steps include: S1. Determine the emission height and spot size of the MZI network, and select appropriate refractive index matching oil according to the MZI network and optical amplifier materials; S2, etching microgrooves on the MZI network chip according to the core layer position and chip height of the optical amplifier chip; S3, coating the microgrooves with glue and etching a gap between the microgrooves and the MZI network; S4, using MBE technology to deposit the active part of the optical amplifier; S5. Depositing the passive part of the optical amplifier by thermal evaporation technology, and depositing the cladding and electrodes; S6. Place the optical amplifier chip in the microgroove using an adsorption gripper and fill the gap with refractive index matching oil.

2. The method for coupling and packaging an MZI network and an optical amplifier according to claim 1, characterized in that: The S1 specifically includes: S11, determining the output height of the MZI network, where the output height is the vertical distance from the output end of the MZI network to the receiving surface of the optical amplifier, and is determined by analyzing the waveguide size of the MZI network, the thickness of the optical waveguide, and the height of the receiving surface of the optical amplifier; S12, determining the spot size of the MZI network output, where the spot size is the lateral size of the light beam output by the optical waveguide, and is determined by the waveguide mode of the MZI network and the light source characteristics, where the light source characteristics include wavelength and divergence angle; S13. Select appropriate refractive index matching oil according to the refractive index of the material of the MZI network and the optical amplifier: Among them, n MZI is the refractive index of the MZI network, n amp is the refractive index of the optical amplifier, n oil To match the refractive index of the oil; S14. When selecting refractive index matching oil, viscosity and surface tension must be considered to ensure the stability of the oil layer.

3. The method for coupling and packaging an MZI network and an optical amplifier according to claim 1, characterized in that: The height of the microgroove is lower than the height of the optical amplifier chip, ensuring the connection between the optical amplifier and the MZI network.

4. The method for coupling and packaging an MZI network and an optical amplifier according to claim 1, characterized in that: The S4 specifically includes: S41, placing the substrate of the optical amplifier in the MBE cavity, and performing a vacuum evacuation process on the MBE cavity; S42, cleaning and preheating the surface of the substrate material to remove surface oxides, with the preheating temperature being set between 300° C. and 500° C.; S43. Turn on the beam source switch of the molecular beam source, control the beam intensity and deposition rate, and deposit the required material on the substrate surface.

5. The method for coupling and packaging an MZI network and an optical amplifier according to claim 1, characterized in that: The S5 specifically includes: S51, preparing a deposition material for the passive part, and placing the deposition material in a vapor deposition boat; S52, installing the substrate material in the evaporation cavity, and evacuating the evaporation cavity; S53, controlling the substrate temperature between 200° C. and 400° C. to promote the adhesion of the deposited material on the substrate and form a uniform thin film; S54, adjusting the evaporation rate and evaporation time to control the cladding thickness; S55, after the evaporation is completed, the substrate is cooled to room temperature, and the cavity is kept clean; S56, depositing an electrode; S57, after the deposition step is completed, the optical amplifier is subjected to heat treatment and annealing treatment.

6. The method for coupling and packaging an MZI network and an optical amplifier according to claim 1, characterized in that: The S6 specifically includes: S61, picking up the optical amplifier chip by using an adsorption gripper, and moving the optical amplifier chip from the storage position to above the MZI network microgroove; S62, adjusting the positioning of the optical amplifier chip so that the optical amplifier chip and the butt joint surface of the micro groove of the MZI network chip are aligned; S63, lowering the height of the adsorption gripper to embed the optical amplifier chip into the microgroove; S64, adjusting the gripping strength of the adsorption gripper to release the optical amplifier chip until the optical amplifier chip is completely placed in the microgroove and ensures that it is in full contact with the refractive index matching oil; S65, filling the gap with refractive index matching oil to ensure that the oil layer is evenly distributed in the gap between the optical amplifier and the microgroove; S66. Use a microscope to check the position of the optical amplifier chip and the filling state of the refractive index matching oil to ensure that the positioning accuracy of the optical amplifier chip in the microgroove meets the requirements.

7. A device for coupling and packaging an MZI network and an optical amplifier, executing a method for coupling and packaging an MZI network and an optical amplifier as claimed in any one of claims 1 to 6, characterized in that: include: A deposition module, used for depositing the active part, passive part, cladding and electrodes of the optical amplifier chip; Adsorption gripper module, used to place the optical amplifier chip into the micro-groove of the MZI network chip; High-precision positioning module, used to position the optical amplifier chip so that it is aligned with the micro-groove interface of the MZI network chip; An optical amplifier embedding module is used to control the embedding process of the optical amplifier chip into the microgroove, ensuring that the optical amplifier chip and the microgroove are connected stably and without deviation; A refractive index matching oil filling module is used to fill the gap between the optical amplifier chip and the microgroove with refractive index matching oil to control the thickness and uniformity of the oil layer; The detection and adjustment module is used to check the position of the optical amplifier chip, the filling status of the refractive index matching oil and the accuracy of the optical docking, and to calibrate the position of the optical amplifier chip through fine-tuning.

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