Display module, display device and preparation method of display module

Abstract

The invention provides a display module, a display device and a preparation method of the display module. The display module comprises a first substrate, a second substrate and electronic ink which are oppositely arranged. The first substrate comprises a first substrate and a retaining wall structure located on the side, facing the second substrate, of the first substrate, the retaining wall structure is provided with a plurality of containing cavities, and the containing cavities are filled with the electronic ink. One of the first substrate and the second substrate is provided with a bonding structure, and the orthographic projection of the bonding structure on the first substrate covers at least part of the area of the orthographic projection of the retaining wall structure on the first substrate. And the orthographic projection of the bonding structure on the first substrate is at least not overlapped with the orthographic projection of the central area of the accommodating cavity on the substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, a display device, and a method for preparing the display module. Background Art

[0002] Electronic paper display modules have the advantages of being easy to read, easy to carry, resource-saving, low energy consumption, and fast transmission speed, and therefore have broad development prospects.

[0003] After the adhesive layer of the existing electronic paper display module is cured, some particles in the ink will be fixed, and these particles cannot be driven, resulting in poor display of the electronic paper display module. Summary of the invention

[0004] The present application provides a display module, a display device and a method for manufacturing the display module.

[0005] A first aspect of the present application provides a display module, the display module comprising a first substrate, a second substrate and electronic ink arranged opposite to each other; the first substrate comprises a first substrate and a retaining wall structure located on a side of the first substrate facing the second substrate, the retaining wall structure is provided with a plurality of accommodating cavities, the electronic ink is filled in the accommodating cavities;

[0006] One of the first substrate and the second substrate is provided with a bonding structure; the orthographic projection of the bonding structure on the first substrate covers at least a partial area of ​​the orthographic projection of the retaining wall structure on the first substrate, and the orthographic projection of the bonding structure on the first substrate has no overlap with at least the orthographic projection of the central area of ​​the accommodating cavity on the substrate.

[0007] In one embodiment, a surface of the retaining wall structure facing the second substrate is provided with a groove; and the bonding structure is at least partially located in the groove;

[0008] The second substrate is provided with a protruding structure extending toward the first substrate; the protruding structure extends into the groove and is covered by the bonding structure.

[0009] In one embodiment, at least one of the side surface of the groove and the side surface of the protruding structure is a guiding surface, and the guiding surface is configured to guide the protruding structure into the groove; the guiding surface is a curved surface or an inclined surface.

[0010] In one embodiment, the second substrate includes a second substrate and a color filter layer located on the side of the second substrate facing the first substrate, the color filter layer includes a plurality of color resist units arranged at intervals, and the orthographic projection of each color resist unit on the first substrate is located within the orthographic projection of one of the accommodating cavities on the first substrate; the bonding structure is located between adjacent color resist units; and the end of the retaining wall structure away from the first substrate is covered by the bonding structure.

[0011] In one embodiment, the bonding structure comprises a light absorbing material.

[0012] A second aspect of the present application provides a display device, which includes the above-mentioned display module.

[0013] A third aspect of the present application provides a method for preparing a display module, the method comprising:

[0014] Prepare a first substrate and a second substrate, wherein the first substrate comprises a first substrate and a retaining wall structure located on a side of the first substrate facing the second substrate, wherein the retaining wall structure is provided with a plurality of accommodating cavities; and one of the first substrate and the second substrate is provided with an adhesive material;

[0015] Filling the containing cavity with electronic ink;

[0016] Aligning the second substrate with the first substrate, so that the second substrate and the first substrate are bonded by the adhesive material; the orthographic projection of the adhesive material on the first substrate covers at least a part of the orthographic projection of the retaining wall structure on the first substrate, and the orthographic projection of the adhesive material on the first substrate at least does not overlap with the orthographic projection of the central area of ​​the accommodating cavity on the first substrate;

[0017] The bonding material is cured to form a bonding structure.

[0018] In one embodiment, a groove is provided on the surface of the retaining wall structure facing the second substrate; the second substrate is provided with a protruding structure extending toward the first substrate; the adhesive material is at least partially located in the groove;

[0019] Aligning the second substrate with the first substrate so that the second substrate and the first substrate are bonded together by the bonding material comprises:

[0020] The second substrate is assembled with the first substrate, the protruding structure enters the groove, and the adhesive material covers the protruding structure.

[0021] In one embodiment, at least one of the side surface of the groove and the side surface of the protruding structure is a guiding surface, and the guiding surface is configured to guide the protruding structure into the groove; the guiding surface is an inclined surface or a curved surface.

[0022] In one embodiment, the second substrate includes a second substrate and a color filter layer located on a side of the second substrate facing the first substrate; the color filter layer includes a plurality of color resist units arranged at intervals; the adhesive material is located between adjacent color resist units;

[0023] Aligning the second substrate with the first substrate so that the second substrate and the first substrate are bonded together by the bonding material comprises:

[0024] The second substrate is assembled with the first substrate, the retaining wall structure enters the gap between the adjacent color-resistance units, and the adhesive material covers the retaining wall structure.

[0025] In one embodiment, the second substrate is provided with the adhesive material; and the steps of preparing the second substrate include:

[0026] Disposing an adhesive layer on one side of the second substrate, the adhesive layer comprising a first adhesive region and a plurality of second adhesive regions arranged at intervals;

[0027] The second bonding area is cured, and the portion of the bonding layer located in the first bonding area is the bonding material.

[0028] The orthographic projection of the adhesive structure of the display module provided in the embodiment of the present application on the first substrate does not overlap with the orthographic projection of the central area of ​​the accommodating cavity on the first substrate at least. Therefore, the adhesive structure will not contact the electronic ink located in the central area of ​​the accommodating cavity, and the charged particles in the electronic ink in the central area of ​​the accommodating cavity can be prevented from being adhered and fixed by the adhesive structure, thereby ensuring that the display module has a good display effect.

[0029] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0031] Figure 1 A schematic diagram of the structure of a display module provided in one embodiment of the present application;

[0032] Figures 2 to 4 A schematic diagram of the structure of a display module provided in other embodiments of the present application;

[0033] Figure 5 and Figure 6 A schematic diagram of the structure of a first substrate and a second substrate of a display module provided in an embodiment of the present application when they are assembled through a rolling process;

[0034] Figures 7 to 21 A process flow chart of a method for preparing a display module provided in one embodiment of the present application. DETAILED DESCRIPTION

[0035] Here, the technical solutions in the embodiments (or "implementations") of the present application will be described clearly and completely in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0036] If there are terms involving directional indications or positional relationships in the embodiments of the present application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first", "second", etc. involved in the embodiments of the present application are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance.

[0037] The electronic paper display module includes electronic ink, which includes electrophoretic liquid and charged particles. The charged particles may include black particles, white particles, and colored particles. When positive electricity is applied to the back panel of the electronic paper display module, since the black particles are negatively charged, the black particles will gather toward the back panel under the attraction of the positive charge of the back panel, while the white particles will gather above the electrophoretic capsule. At this time, under the reflection of natural light, the display module presents a white display effect; when negative electricity is applied to the back panel, the white particles will gather toward the back panel under the attraction of the negative charge, while the black particles will gather above the electrophoretic capsule. The light incident from above the display module is absorbed by the black particles, making the display module present a black display effect.

[0038] The electronic paper display module is bonded and encapsulated through an adhesive layer. When the adhesive layer is cured, some of the charged particles in the electronic ink in contact with the adhesive layer are fixed by the adhesive layer. These charged particles cannot move under the action of the electric field, resulting in fewer charged particles participating in the display changes. In addition, the charged particles adhering to the adhesive layer will reduce the transmittance of the display module, thereby reducing the display effect of the display module.

[0039] The display module, display device and display module manufacturing method of the embodiment of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementation methods can complement or combine with each other.

[0040] The present application embodiment provides a display module, such as Figures 1 to 4 As shown, the display module includes a first substrate 10, a second substrate 20 and an electronic ink 30 arranged opposite to each other. The first substrate 10 includes a first substrate 11 and a retaining wall structure 12 located on the side of the first substrate 11 facing the second substrate 20, and the retaining wall structure 12 is provided with a plurality of accommodating cavities 13, and the electronic ink 30 is filled in the accommodating cavities 13.

[0041] One of the first substrate 10 and the second substrate 20 is provided with a bonding structure 40, the orthographic projection of the bonding structure 40 on the first substrate 11 covers at least a partial area of ​​the orthographic projection of the retaining wall structure 12 on the first substrate 11, and the orthographic projection of the bonding structure 40 on the first substrate 11 does not overlap with at least the orthographic projection of the central area of ​​the accommodating cavity 13 on the first substrate 11.

[0042] The electronic ink 30 of the display module is filled in the receiving cavity 13, and the charged particles in the electronic ink 30 move under the action of the electric field, thereby achieving different display effects. The bonding structure 40 can bond the retaining wall structure 12 to the second substrate 20 to ensure the structural stability and sealing of the display module. Since the orthographic projection of the bonding structure 40 on the first substrate 11 at least does not overlap with the orthographic projection of the central area of ​​the receiving cavity 13 on the first substrate 11, the bonding structure 40 will not contact the electronic ink 30 located in the central area of ​​the receiving cavity 13, which can prevent the charged particles in the electronic ink 30 in the central area of ​​the receiving cavity 13 from being adhered and fixed by the bonding structure 40, thereby ensuring that the display module has a good display effect.

[0043] It should be noted that when the retaining wall structure 12 and the second substrate 20 are bonded together using the bonding structure 40, the bonding material of part of the bonding structure 40 may overflow from between the retaining wall structure 12 and the second substrate 20 and extend into the accommodating cavity 13. Since the volume of the bonding material entering the accommodating cavity 13 is small, the number of charged particles adhered to this part of the bonding structure 40 is also small, and therefore it has almost no effect on the display effect of the display module.

[0044] In one embodiment, Figure 1 As shown, the first substrate 11 can be a flexible substrate or a rigid substrate. The second substrate 21 can be a flexible substrate. The material of the flexible substrate can include triacetyl cellulose, polyimide or polyethylene terephthalate, etc.; the material of the rigid substrate can be glass.

[0045] In one embodiment, the first substrate 10 further includes a pixel driving circuit layer and a pixel electrode layer located above the first substrate 11. The pixel driving circuit layer and the pixel electrode layer can be used to control the charged particles in the electronic ink 30 so that the display module presents different grayscales and colors.

[0046] In one embodiment, Figure 2 and Figure 3 As shown, a groove 121 is provided on the surface of the retaining wall structure 12 facing the second substrate 20, and the bonding structure 40 is at least partially located in the groove 121. The second substrate 20 includes a second substrate 21, and the second substrate 21 is provided with a protruding structure 22 extending toward the first substrate 11, and the protruding structure 22 extends into the groove 121 and is covered by the bonding structure 40.

[0047] Before the first substrate 10 and the second substrate 20 are assembled, the uncured adhesive material is located in the groove 121. After the first substrate 10 and the second substrate 20 are assembled, the protruding structure 22 extends into the groove 121, and then the adhesive material is cured to form the adhesive structure 40. In this way, after the first substrate 10 and the second substrate 20 are assembled, no or only a small amount of adhesive material overflows from the groove 121 and enters the accommodating cavity 13, which can prevent the electronic ink 30 in the accommodating cavity 13 from contacting the adhesive material, and prevent the charged particles in the electronic ink 30 from being adhered and fixed by the adhesive structure 40.

[0048] In one embodiment, Figure 2 As shown, the shape of the cross section of the groove 121 cut along its width direction is a rectangle, and the shape of the cross section of the protrusion structure 22 cut along its width direction is a rectangle. In some embodiments, the depth of the groove 121 is one third of the height of the retaining wall structure 12, the width of the groove 121 is half the width of the retaining wall structure 12, the height of the protrusion structure 22 is less than the depth of the groove 121, and the width of the protrusion structure 22 is less than the width of the groove 121.

[0049] Specifically, the height of the retaining wall structure 12 ranges from 30 μm to 50 μm, and the width ranges from 6 μm to 10 μm. The depth of the groove 121 ranges from 10 μm to 15 μm, and the width ranges from 3 μm to 15 μm. The height of the protrusion structure 22 ranges from 5 μm to 10 μm, and the width ranges from 3 μm to 5 μm.

[0050] In one embodiment, Figure 2 As shown, the width of the end of the protrusion structure 22 gradually decreases from the direction of the second substrate 20 to the first substrate 10. This arrangement is more conducive to making the protrusion structure 22 extend into the groove 121 when the first substrate 10 and the second substrate 20 are assembled.

[0051] In one embodiment, Figure 3 As shown, at least one of the side surface of the groove 121 and the side surface of the protruding structure 22 is a guide surface, and the guide surface is configured to guide the protruding structure 22 into the groove 121, and the guide surface is a curved surface or an inclined surface. Figure 5 and Figure 6 As shown, when the first substrate 10 and the second substrate 20 are aligned, there may be a certain offset between the position of the protrusion structure 22 and the groove 121. The protrusion structure 22 can also slide into the groove 121 along the guide surface under a certain pressure, which is beneficial to improve the assembly accuracy of the protrusion structure 22 and the groove 121 and reduce the difficulty of aligning the first substrate 10 and the second substrate 20.

[0052] exist Figure 3 In the illustrated embodiment, the cross-section of the groove 121 cut along its width direction is semicircular or semi-elliptical, and the cross-section of the protrusion 22 cut along its width direction is semicircular or semi-elliptical.

[0053] In one embodiment, a light-shielding layer is provided on a side of the second substrate away from the first substrate, and the light-shielding layer includes a plurality of light-shielding portions. The orthographic projection of each light-shielding portion on the first substrate overlaps with the orthographic projection of the retaining wall structure on the first substrate. The light-shielding portions can prevent the electronic ink in adjacent accommodating cavities from color crosstalk.

[0054] In another embodiment, if Figures 2 to 4 As shown, the bonding structure 40 includes a light absorbing material. For example, black particles can be added to the bonding material constituting the bonding structure 40 . In this case, the bonding structure 40 can be reused as a light shielding layer 50 of the display module without preparing a light shielding layer on the second substrate 21 .

[0055] In one embodiment, a color filter layer is provided on a side of the second substrate away from the first substrate, and the color filter layer includes a plurality of color resist units, and the orthographic projection of each color resist unit on the first substrate overlaps with an accommodation cavity. In some embodiments, the color filter layer includes a red color resist unit, a green color resist unit, and a blue color resist unit.

[0056] In another embodiment, if Figure 4 As shown, the color filter layer 60 is disposed on the side of the second substrate 21 facing the first substrate 11, and the color resist units 61 of the color filter layer 60 are arranged at intervals, and the orthographic projection of each color resist unit 61 on the first substrate 11 is located within the orthographic projection of one of the accommodating cavities 13 on the first substrate 11. The bonding structure 40 is located between adjacent color resist units 61, and the end of the retaining wall structure 12 away from the first substrate 11 is covered by the bonding structure 40.

[0057] Before the first substrate 10 and the second substrate 20 are assembled, the uncured adhesive material is located between the color resist units 61. After the first substrate 10 and the second substrate 20 are assembled, the protruding structure 22 extends between the color resist units 61, and then the adhesive material is cured to form the adhesive structure 40. In this way, after the first substrate 10 and the second substrate 20 are assembled, only a small amount of adhesive material overflows from the gap between the color resist units 61 and enters the accommodating cavity 13. At this time, most of the electronic ink 30 is in contact with the color resist units, and only a small part of the electronic ink 30 is in contact with the adhesive material, which can alleviate the situation where the charged particles in the electronic ink 30 are adhered and fixed by the adhesive structure 40.

[0058] An embodiment of the present application further provides a display device, which includes the above-mentioned display module.

[0059] In one embodiment, the display device includes a housing, and the display module is disposed inside the housing.

[0060] The present application does not specifically limit the applicability of the display device, which can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a wearable display device, a mobile phone, an e-book, an electronic price tag, a digital photo frame, an advertising light box, etc.

[0061] The present application also provides a method for preparing a display module. Figures 7 to 21 As shown, the preparation method comprises:

[0062] Step S100: Figure 7 and Figure 8 As shown, a first substrate 10 and a second substrate 20 are prepared, wherein the first substrate 10 includes a first substrate 11 and a retaining wall structure 12 located on the side of the first substrate 11 facing the second substrate 20, wherein the retaining wall structure 12 is provided with a plurality of accommodating cavities 13, as shown in FIG. Fig. 9 As shown, one of the first substrate 10 and the second substrate 20 is provided with an adhesive material 41 .

[0063] Step S200: Fig.10 As shown, the accommodating cavity 13 is filled with electronic ink 30 .

[0064] Step S300: Fig.11 As shown, the second substrate 20 is assembled with the first substrate 10, so that the second substrate 20 and the first substrate 10 are bonded together by the bonding material 41. The orthographic projection of the bonding material 41 on the first substrate 11 covers at least a part of the orthographic projection of the retaining wall structure 12 on the first substrate 11, and the orthographic projection of the bonding material 41 on the first substrate 11 does not overlap with at least the orthographic projection of the central area of ​​the accommodating cavity 13 on the first substrate 11.

[0065] Step S400: Fig.12 As shown, the bonding material 41 is cured to form a bonding structure 40 .

[0066] In one embodiment, in step S100 , before preparing the retaining wall structure 12 , the preparation method further includes preparing a pixel driving circuit layer and a pixel electrode layer on one side of the first substrate 11 .

[0067] In one embodiment, in step S100, the method for preparing the second substrate 20 includes preparing a transparent electrode layer on one side of the second substrate 21, and the thickness of the transparent electrode layer ranges from

[0068] In one embodiment, in step S100 , the retaining wall structure 12 may be prepared by exposure and development or nano-imprinting process.

[0069] In one embodiment, in step S100, an adhesive material 41 is provided on one of the first substrate 10 and the second substrate 20, specifically including:

[0070] like Figure 7 and Figure 8 As shown, a groove 121 is provided on the surface of the retaining wall structure 12 facing the second substrate 21, the second substrate 20 is provided with a protruding structure 22 extending toward the first substrate 11, and the adhesive material 41 is at least partially located in the groove 121. In this embodiment, the adhesive material 41 can be filled into the groove 121 by inkjet printing, or the opening side of the groove 121 of the first substrate 10 is pressed on the substrate coated with the adhesive material, and the adhesive material fills the groove 121 under the capillary action, and the filling amount of the adhesive material 41 in the groove 121 is 80% to 100% of the volume of the groove 121.

[0071] The protrusion structure 22 can be prepared by a nano-imprinting process.

[0072] Furthermore, after step 200, the preparation method further includes: aligning the second substrate 20 with the first substrate 10 so that the second substrate 20 and the first substrate 10 are bonded together by the bonding material 41, specifically including:

[0073] like Fig.11 and Fig.12As shown, the second substrate 20 is boxed with the first substrate 10, the protruding structure 22 enters the groove 121, and the adhesive material 41 covers the protruding structure 22. In this embodiment, the first substrate 10 and the second substrate 20 can be bonded by rolling. During the rolling process, the applied pressure gradually brings the two substrates closer, the electronic ink 30 is evenly spread between the first substrate 10 and the second substrate 20, the protruding structure 22 enters the groove 121, and part of the adhesive material 41 is squeezed out of the groove 121 and filled between the retaining wall structure 12 and the second substrate 21, thereby playing the role of bonding and packaging.

[0074] Furthermore, if Fig.13 and Fig.14 As shown, at least one of the side surface of the groove 121 and the side surface of the protruding structure 22 is a guiding surface, and the guiding surface is configured to guide the protruding structure 22 into the groove 121, and the guiding surface is an inclined surface or a curved surface. When there is a positional offset between the protruding structure 22 and the groove 121, under the action of pressure, the guiding surface will force the protruding structure 22 to enter the groove 121 along the track of the guiding surface. This guiding method is relatively smooth, which can reduce the jamming and resistance of the protruding structure 22 during the alignment process, and reduce the difficulty of alignment.

[0075] In one embodiment, in step S100, Fig.15 and Fig.16 As shown, the prepared second substrate 20 includes a second substrate 21 and a color filter layer 60 located on the side of the second substrate 21 facing the first substrate 10. The color filter layer 60 includes a plurality of color resist units 61 arranged at intervals, and the adhesive material 41 is located between adjacent color resist units 61. In some embodiments, the height of the color resist unit 61 ranges from 2 μm to 5 μm.

[0076] Further, after step 200, if Fig.16 and Fig.17 As shown, the preparation method further includes: aligning the second substrate 20 with the first substrate 10, so that the second substrate 20 and the first substrate 10 are bonded together by the bonding material 41, specifically including:

[0077] The second substrate 20 is assembled with the first substrate 10 , the retaining wall structure 12 enters the gap between the adjacent color resist units 61 , and the adhesive material 41 covers the retaining wall structure 12 .

[0078] In the above embodiment, black particles may be added to the adhesive material 41 filled in the groove 121 or between adjacent color resist units 61. After the adhesive material 41 is cured to form the adhesive structure 40, the adhesive structure 40 may be reused as a light shielding layer.

[0079] In one embodiment, in step S100, Fig.18 As shown, the steps of preparing the second substrate 20 include:

[0080] An adhesive layer 42 is disposed on one side of the second substrate 21, and the adhesive layer 42 includes a first adhesive region 421 and a plurality of second adhesive regions 422 arranged at intervals. The second adhesive regions 422 are cured, and the portion of the adhesive layer 42 located at the first adhesive region 421 is the adhesive material 41.

[0081] like Figures 19 to 21 As shown, since the second adhesive area 422 has been cured before the first substrate 10 and the second substrate 20 are assembled, the second adhesive area 422 will not adhere to the charged particles in the electronic ink 30 during and after the first substrate 10 and the second substrate 20 are assembled, and the display device will not have a display problem caused by the charged particles being fixed. The adhesive material 41 of the first adhesive area 421 is cured after the first substrate 10 and the second substrate 20 are assembled, which can ensure the bonding and packaging between the first substrate 10 and the second substrate 20.

[0082] In one embodiment, the bonding material 41 is an ultraviolet curing adhesive, which can undergo a curing reaction under ultraviolet light to form a bonding structure 40 .

[0083] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without causing conflicts. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the drawings; all modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application should be included in the scope of protection of this application.

Claims

1. A display module, characterized in that: The display module comprises a first substrate, a second substrate and electronic ink which are arranged opposite to each other; the first substrate comprises a first substrate and a retaining wall structure located on a side of the first substrate facing the second substrate, the retaining wall structure is provided with a plurality of accommodating cavities, and the electronic ink is filled in the accommodating cavities; One of the first substrate and the second substrate is provided with a bonding structure; the orthographic projection of the bonding structure on the first substrate covers at least a partial area of ​​the orthographic projection of the retaining wall structure on the first substrate, and the orthographic projection of the bonding structure on the first substrate has no overlap with at least the orthographic projection of the central area of ​​the accommodating cavity on the substrate.

2. The display module according to claim 1, characterized in that: The surface of the retaining wall structure facing the second substrate is provided with a groove; the bonding structure is at least partially located in the groove; The second substrate is provided with a protruding structure extending toward the first substrate; the protruding structure extends into the groove and is covered by the bonding structure.

3. The display module according to claim 2, characterized in that: At least one of the side surface of the groove and the side surface of the protruding structure is a guiding surface, and the guiding surface is configured to guide the protruding structure to enter the groove; the guiding surface is a curved surface or an inclined surface.

4. The display module according to claim 1, characterized in that: The second substrate comprises a second substrate and a color filter layer located on a side of the second substrate facing the first substrate, the color filter layer comprises a plurality of color resist units arranged at intervals, and the orthographic projection of each color resist unit on the first substrate is located within the orthographic projection of one of the accommodating cavities on the first substrate; The bonding structure is located between adjacent color resist units; The end of the retaining wall structure away from the first substrate is covered by the bonding structure.

5. The display module according to any one of claims 1 to 4, characterized in that: The bonding structure includes a light absorbing material.

6. A display device, characterized in that: Comprising the display module as described in any one of claims 1 to 5.

7. A method for preparing a display module, characterized in that: The preparation method comprises: Prepare a first substrate and a second substrate, wherein the first substrate comprises a first substrate and a retaining wall structure located on a side of the first substrate facing the second substrate, wherein the retaining wall structure is provided with a plurality of accommodating cavities; and one of the first substrate and the second substrate is provided with an adhesive material; Filling the containing cavity with electronic ink; Aligning the second substrate with the first substrate, so that the second substrate and the first substrate are bonded by the adhesive material; the orthographic projection of the adhesive material on the first substrate covers at least a part of the orthographic projection of the retaining wall structure on the first substrate, and the orthographic projection of the adhesive material on the first substrate at least does not overlap with the orthographic projection of the central area of ​​the accommodating cavity on the first substrate; The bonding material is cured to form a bonding structure.

8. The preparation method according to claim 7, characterized in that: A groove is provided on the surface of the retaining wall structure facing the second substrate; and the second substrate is provided with a protruding structure extending toward the first substrate; The bonding material is at least partially located within the groove; Aligning the second substrate with the first substrate so that the second substrate and the first substrate are bonded together by the bonding material comprises: The second substrate is assembled with the first substrate, the protruding structure enters the groove, and the adhesive material covers the protruding structure.

9. The preparation method according to claim 8, characterized in that: At least one of the side surface of the groove and the side surface of the protruding structure is a guiding surface, and the guiding surface is configured to guide the protruding structure to enter the groove; the guiding surface is an inclined surface or a curved surface.

10. The preparation method according to claim 7, characterized in that: The second substrate comprises a second substrate and a color filter layer located on the side of the second substrate facing the first substrate; the color filter layer comprises a plurality of color resist units arranged at intervals; the adhesive material is located between adjacent color resist units; Aligning the second substrate with the first substrate so that the second substrate and the first substrate are bonded together by the bonding material comprises: The second substrate is assembled with the first substrate, the retaining wall structure enters the gap between the adjacent color-resistance units, and the adhesive material covers the retaining wall structure.

11. The preparation method according to claim 7, characterized in that: The second substrate is provided with the adhesive material; The step of preparing the second substrate comprises: Disposing an adhesive layer on one side of the second substrate, the adhesive layer comprising a first adhesive region and a plurality of second adhesive regions arranged at intervals; The second bonding area is cured, and the portion of the bonding layer located in the first bonding area is the bonding material.

Images