Semiconductor abnormity batch processing method, device and equipment and storage medium

Abstract

The invention discloses a semiconductor abnormity batch processing method and device, equipment and a storage medium. The method comprises the steps that an abnormal batch list display page is displayed, the abnormal batch list display page comprises a first list display area, and the first list display area comprises basic information of multiple semiconductor abnormal batches; in response to a viewing operation for the semiconductor abnormal batch on the abnormal batch list display page, displaying a semiconductor information display page, the semiconductor information display page comprising a corresponding semiconductor abnormal batch detailed information display area and a plurality of processing controls for the abnormal batch; and in response to a confirmation operation for a processing control on the semiconductor information display page, completing processing of the abnormal batch of the semiconductor. According to the method, the efficiency of processing the abnormal batches of the semiconductors can be improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of semiconductor technology, and in particular to a method, device, equipment and storage medium for processing abnormal semiconductor batches. Background Art

[0002] Semiconductor manufacturing is a high-precision, high-demand industry involving complex process flows and strict quality control. During the manufacturing process, any slight deviation may lead to product quality problems, so the production process needs to be monitored in real time and exceptions handled. Abnormal batches refer to batches in which product quality does not meet requirements or has potential risks due to equipment failure, improper process parameter settings, raw material problems, etc. during the semiconductor production process. By identifying and handling abnormal batches in a timely manner, defective products can be prevented from entering the market and the overall quality of the product can be improved. Abnormal batch handling can reduce scrap and rework rates and reduce production costs.

[0003] Traditional semiconductor abnormal batch processing often relies on online or offline documents, which faces huge challenges in resource management and investment. If the abnormality is not handled properly or the processing time is too long, it may cause production delays, affect customer contract delivery and customer satisfaction. In order to effectively handle abnormal batches, companies need to invest more manpower, material and financial resources, including testing equipment, analysts, improvement plans, etc., which increases the company's operating costs and related technical challenges.

[0004] Therefore, how to efficiently process abnormal batches of semiconductors is a problem that needs to be solved in the prior art. Summary of the invention

[0005] The present invention provides a method, device, equipment and storage medium for processing abnormal batches of semiconductors, so as to solve the problem that abnormal batches of semiconductors cannot be processed efficiently in the prior art.

[0006] According to one aspect of the present invention, a method for processing abnormal semiconductor batches is provided, the method comprising:

[0007] Displaying an abnormal batch list display page, the abnormal batch list display page comprising a first list display area, the first list display area comprising a plurality of basic information of abnormal semiconductor batches;

[0008] In response to a viewing operation on the abnormal semiconductor batch on the abnormal batch list display page, displaying a semiconductor information display page, the semiconductor information display page including a corresponding abnormal semiconductor batch detailed information display area and a plurality of processing controls for the abnormal batch;

[0009] In response to a confirmation operation on a processing control on the semiconductor information display page, processing of the abnormal semiconductor batch is completed.

[0010] According to another aspect of the present invention, a semiconductor abnormal batch processing device is provided, the device comprising:

[0011] A first display module, used to display an abnormal batch list display page, wherein the abnormal batch list display page includes a first list display area, and the first list display area includes a plurality of basic information of abnormal semiconductor batches;

[0012] A second display module, configured to display a semiconductor information display page in response to a viewing operation on the semiconductor abnormal batch on the abnormal batch list display page, wherein the semiconductor information display page includes detailed information of the corresponding semiconductor abnormal batch and a plurality of processing controls for the abnormal batch;

[0013] The processing module is used to complete the processing of the abnormal semiconductor batch in response to the confirmation operation on the processing control on the semiconductor information display page.

[0014] According to another aspect of the present invention, there is provided an electronic device, the electronic device comprising: at least one processor; and

[0015] a memory communicatively connected to the at least one processor; wherein,

[0016] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the semiconductor abnormal batch processing method described in any embodiment of the present invention.

[0017] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the semiconductor abnormal batch processing method described in any embodiment of the present invention when executed.

[0018] A method, device, equipment and storage medium for processing abnormal batches of semiconductors according to an embodiment of the present invention, the method comprises: displaying an abnormal batch list display page, the abnormal batch list display page comprising a first list display area, the first list display area comprising a plurality of basic information of abnormal semiconductor batches; in response to a viewing operation on the abnormal semiconductor batch on the abnormal batch list display page, displaying a semiconductor information display page, the semiconductor information display page comprising a corresponding abnormal semiconductor batch detailed information display area and a plurality of processing controls for the abnormal batch; in response to a confirmation operation on the processing control on the semiconductor information display page, completing the processing of the abnormal semiconductor batch. By displaying the abnormal batch list display page and the semiconductor information display page, the method enables the user to directly click on the required operation on the page when processing abnormal batches of semiconductors, thereby improving the efficiency of processing abnormal batches of semiconductors and solving the problem that abnormal batches of semiconductors cannot be efficiently processed in the prior art.

[0019] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic flow chart of a method for processing semiconductor abnormal batches provided in Embodiment 1 of the present invention;

[0022] Figure 2 A schematic diagram of an abnormal batch list display page provided by an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of a semiconductor information display page provided by an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of a page for a first user to request departmental opinions provided by an embodiment of the present invention;

[0025] Figure 5 A schematic diagram of a semiconductor abnormal batch detailed information display area provided by an embodiment of the present invention;

[0026] Figure 6A schematic diagram of a process flow of a semiconductor abnormal batch processing method provided in Embodiment 2 of the present invention;

[0027] Figure 7 A schematic diagram of a first user processing page provided by an embodiment of the present invention;

[0028] Figure 8 A schematic diagram of an abnormal batch processing completion page provided by an embodiment of the present invention;

[0029] Fig. 9 A schematic diagram of an abnormal batch list display page provided in an embodiment of the present invention;

[0030] Fig.10 A schematic diagram of a semiconductor information display page provided by an embodiment of the present invention;

[0031] Fig.11 A schematic diagram of a first user processing page provided by an embodiment of the present invention;

[0032] Fig.12 A schematic diagram of a second user approval page provided by an embodiment of the present invention;

[0033] Fig.13 A schematic diagram of an approval opinion return page provided in an embodiment of the present invention;

[0034] Fig.14 A schematic diagram of an abnormal batch processing completion page provided by an embodiment of the present invention;

[0035] Fig.15 A schematic diagram of the structure of a semiconductor abnormal batch processing device provided in Embodiment 3 of the present invention;

[0036] Fig.16 Schematic diagram of the structure of an electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only an embodiment of a part of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work should belong to the scope of protection of the present invention. It should be understood that the various steps recorded in the method implementation of the present invention can be performed in different orders and / or in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.

[0038] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, any variations of the terms "including" and "having" are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0040] It should be noted that the modifications of "one" and "plurality" mentioned in the present invention are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0041] The names of the messages or information exchanged between multiple devices in the embodiments of the present invention are only used for illustrative purposes, and are not used to limit the scope of these messages or information.

[0042] Embodiment 1

[0043] Figure 1 A flow chart of a method for processing abnormal batches of semiconductors provided in Embodiment 1 of the present invention is applicable to the case where abnormal batches of semiconductors are processed after receiving relevant information of abnormal batches of semiconductors. The method can be executed by a semiconductor abnormal batch processing device, wherein the device can be implemented by software and / or hardware and is generally integrated on an electronic device. In this embodiment, the electronic device includes but is not limited to: computers and other devices.

[0044] like Figure 1 As shown, a method for processing abnormal semiconductor batches provided by Embodiment 1 of the present invention includes the following steps:

[0045] S110, displaying an abnormal batch list display page, wherein the abnormal batch list display page includes a first list display area, and the first list display area includes a plurality of basic information of abnormal semiconductor batches.

[0046] The abnormal batch list display page may be a page for displaying basic information of one or more abnormal batches of semiconductors, and the abnormal batch list display page may display multiple or all abnormal batches at a time. The first list display area may be an area for displaying abnormal batches in the form of a list. The basic information may be basic information of abnormal batches of semiconductors.

[0047] In this embodiment, when an abnormal batch of semiconductors needs to be processed, an abnormal batch list display page can be displayed, and basic information of multiple abnormal semiconductor batches can be viewed through the first list display area of ​​the abnormal batch list display page. Figure 2 A schematic diagram of an abnormal batch list display page provided by an embodiment of the present invention, such as Figure 2 As shown, the abnormal batch list display page includes a first list display area 1, and the first list display area 1 can display the column name of each piece of information in the basic information, as well as n pieces of basic information of the semiconductor abnormal batch. The basic information may include information such as the test phase, the held wafer list, and the test items of the semiconductor abnormal batch, which is not limited in this embodiment.

[0048] S120. In response to a viewing operation on the abnormal semiconductor batch on the abnormal batch list display page, a semiconductor information display page is displayed, wherein the semiconductor information display page includes a corresponding abnormal semiconductor batch detailed information display area and a plurality of processing controls for the abnormal batch.

[0049] The triggering of the viewing operation may be triggered by clicking on the viewing control, or by directly clicking on the basic information of the semiconductor abnormal batch to be viewed. The viewing control may be located on one side of the basic information of the semiconductor abnormal batch. The semiconductor information display page may be a page for displaying the basic information and detailed information of the semiconductor abnormal batch. The semiconductor abnormal batch detailed information display area may be an area for displaying the detailed information of the semiconductor abnormal batch, and the processing control may be used to trigger the processing operation of the semiconductor abnormal batch.

[0050] In this embodiment, when an abnormal semiconductor batch that needs to be processed is confirmed, the semiconductor information display page corresponding to the abnormal semiconductor batch can be displayed by triggering a viewing operation, and the corresponding processing method can be selected through the processing control in the semiconductor information display page. Figure 3 A schematic diagram of a semiconductor information display page provided by an embodiment of the present invention, such as Figure 3 As shown, the semiconductor abnormal batch detailed information display area 2 can display all basic information data of this batch of semiconductor abnormal batches, and the abnormal batch list display page can also display multiple processing controls.

[0051] S130. In response to a confirmation operation on a processing control on the semiconductor information display page, completing processing of the abnormal semiconductor batch.

[0052] The confirmation operation may be an operation triggered by clicking a processing control.

[0053] In this embodiment, the abnormal batch of semiconductors can be processed by clicking the processing control in the semiconductor information display page. For example, when the operation of the clicked processing control is release, the abnormal batch of semiconductors does not need to be processed, and when the operation of the clicked processing control is scrap, the abnormal batch of semiconductors needs to be scrapped.

[0054] A method for processing abnormal semiconductor batches provided in a first embodiment of the present invention includes: displaying an abnormal batch list display page, the abnormal batch list display page includes a first list display area, the first list display area includes a plurality of basic information of abnormal semiconductor batches; in response to a viewing operation on the abnormal semiconductor batch on the abnormal batch list display page, displaying a semiconductor information display page, the semiconductor information display page includes a corresponding abnormal semiconductor batch detailed information display area and a plurality of processing controls for the abnormal batch; in response to a confirmation operation on the processing control on the semiconductor information display page, completing the processing of the abnormal semiconductor batch. By displaying the abnormal batch list display page and the semiconductor information display page, the method enables the user to directly click on the required operation on the page when processing abnormal semiconductor batches, thereby improving the efficiency of processing abnormal semiconductor batches and solving the problem that abnormal semiconductor batches cannot be efficiently processed in the prior art.

[0055] Based on the above embodiment, a variant embodiment of the above embodiment is proposed. It should be noted that in order to make the description concise, only the differences from the above embodiment are described in the variant embodiment.

[0056] In one embodiment, the processing control includes a further processing control, and accordingly, in response to a confirmation operation on the processing control on the semiconductor information display page, the processing of the abnormal semiconductor batch is completed, including:

[0057] In response to a confirmation operation on the further processing control on the semiconductor information display page, displaying a first user request department opinion page, the first user request department opinion page including requested department information to be filled in and processing suggestions for abnormal semiconductor batches;

[0058] In response to a submission operation on the first user's request for department opinion page, displaying a waiting department opinion page, the waiting department opinion page including department information to be requested;

[0059] According to the response information on the waiting department opinion page, a corresponding processing control is selected on the semiconductor information display page to complete the processing of the abnormal semiconductor batch.

[0060] Among them, the further processing control can be a control that indicates that it is necessary to determine the processing method of the abnormal batch in combination with the processing opinions of personnel in other departments. The first user requests department opinions page can be used to display relevant information of the first user requesting processing opinions from other departments for abnormal batches. The first user can be a user who can directly process abnormal batches of semiconductors, and users from other departments only give processing opinions. The department information to be requested may include information such as department name, recipient, recipient email address, etc. The processing suggestion can be the processing method proposed by the first user for the abnormal batch of semiconductors and the corresponding reasons. The submission operation can be an operation of submitting the information filled in the first user request department opinions page.

[0061] Among them, the page waiting for department opinions can be a page showing that the processing node of the current semiconductor abnormal batch is waiting for the opinions of other departments, and the page waiting for department opinions can display the information of the department to be requested. The response information may include the information returned by the department requesting the opinion. After receiving the response information, the page waiting for department opinions will display the opinions returned by the department. The first user can determine the final processing method of the semiconductor abnormal batch based on the opinions returned by the department, and process it by clicking the processing control in the semiconductor information display page. The page for the first user to request the department's opinion can be displayed in the semiconductor information display page, or it can be displayed as a separate page. This embodiment does not limit this.

[0062] In this embodiment, when the first user needs to combine the opinions of other departments to determine the final processing method, he can click the further processing control to obtain the opinions of other departments by filling in relevant information on the first user's request for department opinions page, thereby determining the final processing method and completing the processing of abnormal semiconductor batches. The solution of this embodiment allows users to easily communicate with other departments to jointly determine the processing method for abnormal semiconductor batches. Exemplary, Figure 4 A schematic diagram of a page for a first user requesting departmental opinions provided by an embodiment of the present invention, such as Figure 4 As shown, the first user requesting department opinions can display the department information 3 to be requested and the processing suggestions 4 that the first user needs to fill in. The first user requesting department opinions page can also include controls for this operation, such as a submit control, a cancel control, and an invalidate control. After the first user fills in the information, he can click the submit control to submit.

[0063] In one embodiment, the method further includes: the semiconductor abnormal batch detailed information display area includes a semiconductor material information display area and an abnormal material selection and display area.

[0064] The material information display area may be an area for displaying semiconductor material information. The abnormal material selection and display area may be an area for displaying the status of all wafers in an abnormal semiconductor batch and for selecting corresponding wafers.

[0065] In this embodiment, the semiconductor abnormal batch detailed information display area may also include a semiconductor material information display area and an abnormal material selection and display area. Figure 5 A schematic diagram of a semiconductor abnormal batch detailed information display area provided by an embodiment of the present invention, such as Figure 5 As shown, the semiconductor abnormal batch detailed information display area 2 may include a material information display area 5 and an abnormal material selection and display area 6. The material information display area 5 may include the abnormal order number, equipment, holding time and other information of the abnormal batch, and the abnormal material selection and display area 6 may display selectable wafers 7.

[0066] Embodiment 2

[0067] Figure 6 The flowchart of a semiconductor abnormal batch processing method provided by the second embodiment of the present invention is optimized on the basis of the above embodiments. For the contents not yet fully described in this embodiment, please refer to the first embodiment. Figure 6 As shown, a method for processing abnormal semiconductor batches provided by the second embodiment of the present invention, wherein the processing control includes a release control and a scrap control, and accordingly, the method includes the following steps:

[0068] S210, displaying an abnormal batch list display page, wherein the abnormal batch list display page includes a first list display area, and the first list display area includes a plurality of basic information of abnormal semiconductor batches.

[0069] S220. In response to a viewing operation on the abnormal semiconductor batch on the abnormal batch list display page, a semiconductor information display page is displayed, wherein the semiconductor information display page includes a corresponding abnormal semiconductor batch detailed information display area and a plurality of processing controls for the abnormal batch.

[0070] S230. In response to a confirmation operation on a release control / scrap control on the semiconductor information display page, a first user processing page is displayed, wherein the first user processing page includes processing information to be filled in.

[0071] The release control may be a control indicating a processing method for releasing an abnormal batch, and the scrap control may be a control indicating scrapping an abnormal batch. The first user processing page may be a page showing information filled in by the first user when processing an abnormal batch of semiconductors. The processing information to be filled in may include information such as a processing method and processing opinions.

[0072] In this embodiment, the processing control may also include a release control and a scrap control. When the first user decides not to process the abnormal batch, the release control may be clicked. When the first user decides to scrap the abnormal batch, the scrap control may be clicked. When responding to a confirmation operation for the release control or the scrap control in the semiconductor information display page, the first user processing page may be displayed, and the first user may fill in relevant information on the first user processing page. Exemplary, Figure 7 A schematic diagram of a first user processing page provided by an embodiment of the present invention, such as Figure 7 As shown, the first user processing page is similar to the first user requesting department opinion page, and can display the information that the first user needs to fill in and multiple controls.

[0073] S240. In response to the submission operation on the first user processing page, the processing of the abnormal semiconductor batch is completed.

[0074] In this embodiment, when responding to the submission operation in the first user processing page, if this operation does not require review by the approver, the processing of the abnormal batch of semiconductors can be completed directly. If review by the approver is required, the processing of the abnormal batch of semiconductors will continue after the review by the approver.

[0075] A semiconductor abnormal batch processing method provided in the second embodiment of the present invention specifically responds to the confirmation operation of the processing control on the semiconductor information display page to complete the processing of the semiconductor abnormal batch, including: responding to the confirmation operation of the release control / scrap control on the semiconductor information display page, displaying a first user processing page, the first user processing page including processing information to be filled in; responding to the submission operation on the first user processing page, completing the processing of the semiconductor abnormal batch. The method fills in the processing information for the semiconductor abnormal batch on the first user processing page, and completes the processing of the semiconductor abnormal batch in response to the submission operation, which can improve the processing efficiency of the semiconductor abnormal batch.

[0076] In one embodiment, when the processing control is a scrap control, or the processing control is a release control and the approval mode corresponding to the processing information in the submission operation is approval required, the method further includes:

[0077] Displaying a second user approval page, wherein the second user approval page includes approval opinions and handling opinions to be filled in;

[0078] In response to a submission operation on the second user approval page, a processing result corresponding to the abnormal semiconductor batch is displayed according to the approval opinion in the submission operation.

[0079] The approval method may include approval required and approval not required. The second user approval page may be a page for the second user to review the processing opinions, and the second user may be the approver who reviews the processing opinions of the first user. The approval opinions may include approval and rejection, and the processing opinions may be the opinions filled in by the approver according to the actual situation.

[0080] In this embodiment, when the selected processing control is a scrap control, or the processing control is a release control but the approval method corresponding to the processing information in the submission operation is approval required, the opinions filled in by the first user at this time need to be reviewed by the approver. The approver can view the information filled in by the first user on the second user approval page, and fill in the corresponding approval opinions and processing opinions. After filling in, by responding to the submission operation of the second user approval page, the processing results corresponding to the semiconductor abnormal batch are displayed according to the approval opinions in the submission operation.

[0081] In one embodiment, displaying the processing result corresponding to the abnormal semiconductor batch according to the approval opinion in the submission operation includes:

[0082] When the approval opinion in the submission operation is passed, a page for completing the abnormal batch processing is displayed, and the page for completing the abnormal batch processing includes the processing process of the abnormal batch;

[0083] When the approval opinion in the submission operation is rejected, an approval opinion return page is displayed, and the approval opinion return page includes the return information of the abnormal semiconductor batch.

[0084] The abnormal batch processing completion page may be a page showing that the approver has completed the approval, and the abnormal batch processing completion page may include the abnormal batch processing process. The approval opinion return page may be a page showing that the approval opinion has been returned to the first user, and the approval opinion return page may include the return information of the semiconductor abnormal batch, and the return information may refer to the approver's approval opinion and processing opinion.

[0085] In this embodiment, when responding to the submission operation on the second user's approval page, different pages can be displayed according to the type of approval opinion. When the approval opinion is passed, the abnormal batch processing completion page can be displayed to the first user or approver; when the approval opinion is rejected, the approval opinion return page can be displayed to the first user or approver. Figure 8A schematic diagram of an abnormal batch processing completion page provided by an embodiment of the present invention, such as Figure 8 As shown, after the approver completes the approval, each node in processing the abnormal semiconductor batch can be displayed in the abnormal batch processing completion page, for example, the initiating node when the first user initiates this processing, and the completed reviewer approval node.

[0086] In one embodiment, the method further comprises:

[0087] When the processing control is a release control, the processing information to be filled in includes the approval method, processing opinion, recipient information and countersignature type of the abnormal batch;

[0088] When the processing control is a scrapping control, the processing information to be filled in includes the detailed reason for scrapping, recipient information and countersignature type to be filled in.

[0089] The review and matching method may include review required and approval not required, and the processing opinion may be information filled in by the first user according to the actual situation. The recipient information may be relevant information of the recipient who can receive the processing opinion. The countersignature type may include or signature and countersignature, etc. The detailed reason for cancellation may be information filled in by the first user according to the actual situation.

[0090] In this embodiment, when the processing controls are different, the processing information that the first user needs to fill in is also different. When the processing control is a release control, it is necessary to fill in information such as the review and matching method, processing opinions, recipient information, and co-signature type of the abnormal batch; when the processing control is a scrap control, it must be reviewed by the approver, and it is necessary to fill in information such as the detailed reason for the scrapping, the recipient information, and the co-signature type.

[0091] The embodiments of the present invention provide several specific implementation methods based on the technical solutions of the above embodiments.

[0092] As a specific implementation method of this implementation, take the initiator clicking the release control as an example:

[0093] 1. The process submitter (first user) selects the abnormal batch data to be processed on the abnormal batch list display page. Fig. 9 A schematic diagram of an abnormal batch list display page provided by an embodiment of the present invention, such as Fig. 9As shown, the abnormal batch list display page may also include a filtering area. Through the multiple controls in the filtering area, the submitter can select the content to be filtered, filter the batch to be queried, and click the "View" button to enter the semiconductor information display page. The options that can be filtered in the filtering area may include device, test stage, lot id, test program, factory, factory result, rule result, lot status, submitter, person to be processed, hold time, and processing status, etc. The processing status may include all, unprocessed, submitted, pending approval, pending resolution, processing completed, and invalidated. The information displayed by each abnormal batch may include information such as tester, test stage, lot type, etc. The content displayed in the page can be set according to the actual situation, and this embodiment does not limit this.

[0094] 2. Enter the semiconductor information display page. Fig.10 A schematic diagram of a semiconductor information display page provided by an embodiment of the present invention, such as Fig.10 As shown, the semiconductor material information display area can display information such as the semiconductor abnormal order number, tester, total wafer list (Total Wafer List) and held wafer list (Hold Wafer List). The abnormal material selection and display area can display the wafers that can be selected. The submitter can view the specific details of the abnormal batch on the page.

[0095] 3. Select the wafer to be processed on the semiconductor information display page, and the first user processing page will be displayed. Fig.11 A schematic diagram of a first user processing page provided by an embodiment of the present invention, such as Fig.11 As shown, the first user processing page can be displayed on one side of the semiconductor information display page. The processing controls include: release control (release), scrap control (scrap) and further processing control (further action). Taking release as an example, after selecting the corresponding processing method, the submitter can fill in the processing opinions, recipient information, and signature type on the first user processing page.

[0096] 4. Click the Submit button, and the information of this batch will flow to the node that needs to be processed next. Fig.12 A schematic diagram of a second user approval page provided by an embodiment of the present invention, such as Fig.12As shown, the approver can fill in the approval opinions and processing opinions on the second user approval page, and the opinions will be returned to the submitter when the "Submit button" is clicked.

[0097] 5. If the approval opinion in step 4 is "rejected", the process node will be returned to the submitter, who will need to reprocess it. Fig.13 A schematic diagram of an approval opinion return page provided by an embodiment of the present invention, such as Fig.13 As shown, the process submitter needs to re-fill in the information. After re-filling in the information, the process node will flow to the approver's approval node again.

[0098] 6. If the approval opinion in step 4 is "approved", the process ends. Fig.14 A schematic diagram of an abnormal batch processing completion page provided by an embodiment of the present invention, such as Fig.14 As shown, the system will send the processing information to the corresponding factory for further processing of the abnormal batches.

[0099] The scrapping scenario in this embodiment is similar to the release scenario, except that more information needs to be filled in. The further acion scenario adds a node for departmental joint communication. After the submitter submits, the other departments need to process the opinions before continuing with other nodes. The specific processing steps of other nodes are similar to the release process. This embodiment will not be described in detail here.

[0100] The initiator determines whether the abnormal batch can be "released" or "scrapped" based on the cause analysis, or whether it needs approval from others, etc. The final processing conclusion after the countersignature or signing process is sent to the factory and the corresponding action is executed (such as sending an email to notify the corresponding personnel or triggering the notification of the customer's own system, and then proceeding to the next step of processing). If the initiator cannot directly determine the processing method of the abnormal batch based on the cause analysis, the process operation of requesting department opinions can be performed to communicate and determine the opinions across departments. After feedback from multiple departments, it can be finally decided whether the abnormal batch is "released" or "scrapped". This processing method can realize timely warning and efficient processing of abnormal batches in the production and manufacturing process of the semiconductor industry, and each step of the decision and operation will be recorded in detail to ensure the transparency and traceability of all processing results, providing strong data support for batch quality control and continuous improvement. Through the interactive operation of simple and easy-to-understand web pages, the corresponding processor fills in the processing information of each process, and concisely displays the review effect and processing opinions of each process stage, focusing on the convenience and versatility of semiconductor abnormal processing, and improving the efficiency and quality of semiconductor abnormal processing.

[0101] Embodiment 3

[0102] Fig.15 This is a schematic diagram of the structure of a semiconductor abnormal batch processing device provided in Example 3 of the present invention. The device can be used to process abnormal batches of semiconductors after receiving relevant information about abnormal batches of semiconductors, wherein the device can be implemented by software and / or hardware and is generally integrated on an electronic device.

[0103] like Fig.15 As shown, the device comprises:

[0104] A first display module 310, for displaying an abnormal batch list display page, wherein the abnormal batch list display page includes a first list display area, wherein the first list display area includes a plurality of basic information of abnormal semiconductor batches;

[0105] A second display module 320, for displaying a semiconductor information display page in response to a viewing operation on the semiconductor abnormal batch on the abnormal batch list display page, wherein the semiconductor information display page includes detailed information of the corresponding semiconductor abnormal batch and a variety of processing controls for the abnormal batch;

[0106] The processing module 330 is used to complete the processing of the abnormal semiconductor batch in response to the confirmation operation on the processing control on the semiconductor information display page.

[0107] The present embodiment provides a semiconductor abnormal batch processing device, including: a first display module, used to display an abnormal batch list display page, the abnormal batch list display page includes a first list display area, the first list display area includes a plurality of basic information of semiconductor abnormal batches; a second display module, used to display a semiconductor information display page in response to a viewing operation on the semiconductor abnormal batch on the abnormal batch list display page, the semiconductor information display page includes detailed information of the corresponding semiconductor abnormal batch and a variety of processing controls for the abnormal batch; a processing module, used to complete the processing of the semiconductor abnormal batch in response to a confirmation operation on the processing control on the semiconductor information display page. By displaying the abnormal batch list display page and the semiconductor information display page, the user can directly click on the required operation on the page when processing the abnormal batch of semiconductors, thereby improving the efficiency of processing the abnormal batch of semiconductors and solving the problem that the abnormal batch of semiconductors cannot be processed efficiently in the prior art.

[0108] Furthermore, the processing control includes a release control and a scrap control. Accordingly, the processing module 330 is specifically used for:

[0109] In response to a confirmation operation on a release control / scrap control on the semiconductor information display page, displaying a first user processing page, wherein the first user processing page includes processing information to be filled in;

[0110] In response to a submission operation on the first user processing page, processing of the abnormal semiconductor batch is completed.

[0111] Further, when the processing control is a scrapped control, or the processing control is a release control and the approval method corresponding to the processing information in the submission operation is approval required, the device is also used to:

[0112] Displaying a second user approval page, wherein the second user approval page includes approval opinions and handling opinions to be filled in;

[0113] In response to a submission operation on the second user approval page, a processing result corresponding to the abnormal semiconductor batch is displayed according to the approval opinion in the submission operation.

[0114] Furthermore, the displaying of the processing result corresponding to the abnormal semiconductor batch according to the approval opinion in the submission operation includes:

[0115] When the approval opinion in the submission operation is passed, a page for completing the abnormal batch processing is displayed, and the page for completing the abnormal batch processing includes the processing process of the abnormal batch;

[0116] When the approval opinion in the submission operation is rejected, an approval opinion return page is displayed, and the approval opinion return page includes the return information of the abnormal semiconductor batch.

[0117] Furthermore, the device is also used for:

[0118] When the processing control is a release control, the processing information to be filled in includes the approval method, processing opinion, recipient information and countersignature type of the abnormal batch;

[0119] When the processing control is a scrapping control, the processing information to be filled in includes the detailed reason for scrapping, recipient information and countersignature type to be filled in.

[0120] Furthermore, the processing control includes a further processing control, and accordingly, the processing module 330 is specifically used for:

[0121] In response to a confirmation operation on the further processing control on the semiconductor information display page, displaying a first user request department opinion page, the first user request department opinion page including requested department information to be filled in and processing suggestions for abnormal semiconductor batches;

[0122] In response to a submission operation on the first user's request for department opinion page, displaying a waiting department opinion page, the waiting department opinion page including department information to be requested;

[0123] According to the response information on the waiting department opinion page, a corresponding processing control is selected on the semiconductor information display page to complete the processing of the abnormal semiconductor batch.

[0124] Furthermore, the device is also used for:

[0125] The semiconductor abnormal batch detailed information display area includes a semiconductor material information display area and an abnormal material selection and display area.

[0126] The above-mentioned semiconductor abnormal batch processing device can execute the semiconductor abnormal batch processing method provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0127] Embodiment 4

[0128] Fig.16 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0129] like Fig.16 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0130] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0131] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a semiconductor abnormal batch processing method.

[0132] In some embodiments, the semiconductor abnormal batch processing method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the semiconductor abnormal batch processing method described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute the semiconductor abnormal batch processing method in any other appropriate manner (for example, by means of firmware).

[0133] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0134] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0135] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0136] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0137] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0138] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0139] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0140] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for processing abnormal semiconductor batches, characterized in that: The method comprises: Displaying an abnormal batch list display page, the abnormal batch list display page comprising a first list display area, the first list display area comprising a plurality of basic information of abnormal semiconductor batches; In response to a viewing operation on the abnormal semiconductor batch on the abnormal batch list display page, displaying a semiconductor information display page, the semiconductor information display page including a corresponding abnormal semiconductor batch detailed information display area and a plurality of processing controls for the abnormal batch; In response to a confirmation operation on a processing control on the semiconductor information display page, processing of the abnormal semiconductor batch is completed.

2. The method according to claim 1, characterized in that The processing control includes a release control and a scrap control. Accordingly, in response to the confirmation operation on the processing control on the semiconductor information display page, the processing of the abnormal semiconductor batch is completed, including: In response to a confirmation operation on a release control / scrap control on the semiconductor information display page, displaying a first user processing page, wherein the first user processing page includes processing information to be filled in; In response to a submission operation on the first user processing page, processing of the abnormal semiconductor batch is completed.

3. The method according to claim 2, characterized in that When the processing control is a scrapped control, or the processing control is a release control and the approval mode corresponding to the processing information in the submission operation is approval required, the method further includes: Displaying a second user approval page, wherein the second user approval page includes approval opinions and handling opinions to be filled in; In response to a submission operation on the second user approval page, a processing result corresponding to the abnormal semiconductor batch is displayed according to the approval opinion in the submission operation.

4. The method according to claim 3, characterized in that The displaying of the processing result corresponding to the abnormal semiconductor batch according to the approval opinion in the submission operation includes: When the approval opinion in the submission operation is passed, a page for completing the abnormal batch processing is displayed, and the page for completing the abnormal batch processing includes the processing process of the abnormal batch; When the approval opinion in the submission operation is rejected, an approval opinion return page is displayed, and the approval opinion return page includes the return information of the abnormal semiconductor batch.

5. The method according to claim 2, characterized in that: The method further comprises: When the processing control is a release control, the processing information to be filled in includes the approval method, processing opinion, recipient information and countersignature type of the abnormal batch; When the processing control is a scrapping control, the processing information to be filled in includes the detailed reason for scrapping, recipient information and countersignature type to be filled in.

6. The method according to claim 1, characterized in that The processing control includes a further processing control. Accordingly, in response to a confirmation operation on the processing control on the semiconductor information display page, the processing of the abnormal semiconductor batch is completed, including: In response to a confirmation operation on the further processing control on the semiconductor information display page, displaying a first user request department opinion page, the first user request department opinion page including requested department information to be filled in and processing suggestions for abnormal semiconductor batches; In response to a submission operation on the first user's request for department opinion page, displaying a waiting department opinion page, the waiting department opinion page including department information to be requested; According to the response information on the waiting department opinion page, a corresponding processing control is selected on the semiconductor information display page to complete the processing of the abnormal semiconductor batch.

7. The method according to claim 1, characterized in that The method further comprises: The semiconductor abnormal batch detailed information display area includes a semiconductor material information display area and an abnormal material selection and display area.

8. A semiconductor abnormal batch processing device, characterized in that: The device comprises: A first display module, used to display an abnormal batch list display page, wherein the abnormal batch list display page includes a first list display area, and the first list display area includes a plurality of basic information of abnormal semiconductor batches; A second display module, configured to display a semiconductor information display page in response to a viewing operation on the semiconductor abnormal batch on the abnormal batch list display page, wherein the semiconductor information display page includes detailed information of the corresponding semiconductor abnormal batch and a plurality of processing controls for the abnormal batch; The processing module is used to complete the processing of the abnormal semiconductor batch in response to the confirmation operation on the processing control on the semiconductor information display page.

9. An electronic device, characterized in that: The device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the semiconductor abnormal batch processing method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the semiconductor abnormal batch processing method according to any one of claims 1 to 7 when executed.

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