Fingerprint identification module, packaging method, screen component and electronic equipment

Abstract

The invention relates to the technical field of fingerprint recognition, in particular to a fingerprint recognition module, a packaging method, a screen assembly and electronic equipment. The fingerprint identification module comprises a supporting piece, a conductive layer and an identification chip, wherein the conductive layer is provided with a fitting area. Wherein the supporting piece and the conductive layer are arranged in a stacked mode. And the identification chip is connected with the supporting piece in the fitting area. And the identification chip is electrically connected with the conductive layer. The beneficial effects are that the support member can support the identification chip and the conductive layer; the fitting area of the conductive layer can transmit the fingerprint information processed by the identification chip to other parts by being electrically connected with the identification chip, and can also accommodate the identification chip, so that the overall thickness of the fingerprint identification module is reduced, the size is reduced, and a fingerprint identification effect is achieved.

Description

Technical Field

[0001] The present application relates to the field of fingerprint recognition technology, and in particular to a fingerprint recognition module, a packaging method, a screen assembly and an electronic device. Background Art

[0002] The fingerprint recognition module is an identification device that verifies the user by collecting the user's fingerprint.

[0003] In the related art, the fingerprint recognition module is generally installed inside the electronic device, but the fingerprint recognition module is relatively large in size and occupies a relatively large space inside the electronic device. Summary of the invention

[0004] In view of this, the present application provides a fingerprint recognition module, a packaging method, a screen assembly and an electronic device to reduce their size.

[0005] Specifically, the following technical solutions are included:

[0006] The first aspect of the present application provides a fingerprint recognition module, the fingerprint recognition module comprising a support, a conductive layer and an identification chip, the conductive layer having a bonding area. The support and the conductive layer are stacked. The identification chip is connected to the support at the bonding area. The identification chip is electrically connected to the conductive layer.

[0007] Optionally, the support member includes a base and an elastic portion, the base is connected to the elastic portion, the elastic portion can be elastically deformed along the stacking direction, and the orthographic projection of the fitting area on the support member is located within the elastic portion.

[0008] Optionally, the elastic portion includes an elastic ring and a supporting area, the elastic ring connects the supporting area and the base, a first avoidance cavity is provided between the elastic ring and the base, a second avoidance cavity is provided between the elastic ring and the supporting area, and the fitting area is located within the supporting area in the orthographic projection of the supporting member.

[0009] Optionally, the support member further includes a first connecting rib, wherein the first connecting rib connects the elastic ring and the base in the first avoidance cavity.

[0010] Optionally, the support member further includes a second connecting rib, and the second connecting rib connects the elastic ring and the supporting area in the second avoidance cavity.

[0011] Optionally, the conductive layer includes a first wiring, the first wiring is arranged on the elastic ring, and the first wiring is electrically connected to the identification chip.

[0012] Optionally, the first wiring is symmetrically arranged along the length direction of the support member.

[0013] A second aspect of the present application provides a packaging method, which is applied to the fingerprint recognition module described in the above technical solution, and the method comprises:

[0014] stacking the support and the substrate;

[0015] Processing the substrate to form a conductive layer on the substrate;

[0016] Connecting the support member and the identification chip in the bonding area of ​​the conductive layer;

[0017] The conductive layer and the identification chip are connected.

[0018] Optionally, processing the substrate to form the conductive layer on the substrate includes:

[0019] The substrate is etched so that a portion of the substrate forms a first trace.

[0020] Optionally, the connecting the conductive layer and the identification chip includes:

[0021] Leading out a second wiring from the identification chip;

[0022] connecting the second wiring and the first wiring;

[0023] The second wiring is cured by dispensing glue.

[0024] A third aspect of the present application provides a screen assembly, which includes a screen, a middle frame, and a fingerprint recognition module as described in the above technical solution.

[0025] Wherein, the screen and the middle frame are stacked.

[0026] The fingerprint recognition module is located between the screen and the middle frame, and the recognition chip is closer to the screen than the support member.

[0027] Optionally, the middle frame has a deformation cavity, the support member is closer to the deformation cavity than the identification chip, and the orthographic projection of the support member on the middle frame at least partially overlaps with the deformation cavity.

[0028] A fourth aspect of the present application is an electronic device, which includes the screen assembly as described in the above technical solution.

[0029] The beneficial effects of the technical solution provided by the embodiment of the present application include at least: the support member can support the identification chip and the conductive layer. The bonding area of ​​the conductive layer can transmit the fingerprint information processed by the identification chip to other components by being electrically connected to the identification chip, and can also accommodate the identification chip, thereby reducing the overall thickness of the fingerprint identification module of the present application to reduce the volume and play a role in fingerprint identification. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic cross-sectional view of a fingerprint recognition module provided in an embodiment of the present application;

[0032] Figure 2 A full cross-sectional schematic diagram of the assembly of the support member and the conductive layer provided in an embodiment of the present application;

[0033] Figure 3 A schematic front view of a support member provided in an embodiment of the present application;

[0034] Figure 4 A front view schematic diagram of a fingerprint recognition module provided in an embodiment of the present application;

[0035] Figure 5 A schematic diagram of a packaging method according to an embodiment of the present application;

[0036] Figure 6 A schematic diagram of the connection process between the identification chip and the first wiring provided in an embodiment of the present application;

[0037] Figure 7 A full cross-sectional schematic diagram of a screen assembly provided in an embodiment of the present application.

[0038] The reference numerals in the figures represent respectively:

[0039] 1. Support member; 11. Base; 12. Elastic part; 121. Elastic ring; 122. Support area; 1201. First avoidance cavity; 1202. Second avoidance cavity; 13. First connecting rib; 14. Second connecting rib;

[0040] 2. Conductive layer; 21. First trace; 201. Lamination area;

[0041] 3. Identify chip;

[0042] 41. second wiring; 42. insulation layer; 43. protection layer;

[0043] 5. Screen;

[0044] 6. Middle frame; 601. Deformation cavity.

[0045] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0047] The directional nouns involved in the embodiments of the present application, such as "upper", "lower", "side", etc., are generally represented by Figure 1 The relative relationship of the orientation shown in the figure is used as the basis, and these orientation terms are used only to more clearly describe the relationship between structures, not to describe absolute orientation. When the product is placed in different postures, the orientation may change, for example, "up" and "down" may be interchangeable.

[0048] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as commonly understood by those of ordinary skill in the art.

[0049] In order to make the technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0050] The first aspect of the present application provides a fingerprint recognition module, such as Figure 1 , Figure 2 and Figure 3 As shown, the fingerprint recognition module includes a support member 1, a conductive layer 2 and an identification chip 3, wherein the conductive layer 2 has a bonding area 201. The support member 1 and the conductive layer 2 are stacked. The identification chip 3 is connected to the support member 1 in the bonding area 201. The identification chip 3 is electrically connected to the conductive layer 2.

[0051] It can be understood that the support member 1 can support the identification chip 3 and the conductive layer 2. The bonding area 201 of the conductive layer 2 can transmit the fingerprint information processed by the identification chip 3 to other components through electrical connection with the identification chip 3 to play the role of fingerprint identification, and can also accommodate the identification chip 3, thereby reducing the overall thickness of the fingerprint identification module of the present application to reduce the volume.

[0052] In some embodiments of the present application, the support member 1 serves as a component for supporting the identification chip 3 and the conductive layer 2, and can be directly connected to other products, such as a screen 5, a smart phone, a tablet, etc., so as to support the identification chip 3 and the conductive layer 2, so that the two can maintain a relatively fixed position with other products to play the role of identifying fingerprints.

[0053] Optionally, the support member 1 can be connected to other components by bonding, clamping, bolting, etc.

[0054] In some embodiments of the present application, the conductive layer 2 is used to transmit the processed fingerprint information to other components. When packaging the fingerprint recognition module of the present application, the conductive layer 2 can be directly processed into a wire that transmits current. This can improve the packaging efficiency of the fingerprint recognition module.

[0055] Optionally, the conductive layer 2 may be made entirely of a conductive material, or may be partially made of a conductive material. The conductive material may be a conductive metal such as copper or silver, or may be an alloy whose substrate is a conductive metal.

[0056] In some embodiments of the present application, the identification chip 3 may include an identification module and a wake-up module. The wake-up module is used to detect user operations, such as touch, press, etc. When receiving relevant operations, the wake-up module collects fingerprint information and sends it to the identification module. The identification module matches the received fingerprint information and then completes the identification. The structure of the identification chip 3 can also be adaptively improved according to factors such as application scenarios and working environments. The above content is an example and is not limited to the identification chip 3 must include an identification module and a wake-up module.

[0057] It is understandable that the identification chip 3 occupies a certain space in the fingerprint identification module of the present application. By setting the fitting area 201, the conductive layer 2 can accommodate the identification chip 3. Since the identification chip 3 is connected to the support member 1 in the fitting area 201, the thickness of the fingerprint identification module of the present application is the sum of the thickness of the identification chip 3 and the thickness of the support member 1, or the sum of the thickness of the conductive layer 2 and the thickness of the support member 1. The thinning of the thickness and the setting of the fitting area 201 reduce the volume of the fingerprint identification module of the present application, which is conducive to the arrangement of the fingerprint identification module among other products.

[0058] Optionally, the identification chip 3 is in the bonding area 201 and is spaced apart from the sidewall of the bonding area 201 to prevent the identification chip 3 from being electrically connected to the conductive layer 2 through the sidewall of the bonding area 201 , which would be detrimental to the normal operation of the identification chip 3 .

[0059] Optionally, the identification chip 3 and the support member 1 may be connected by bonding, clamping, bolting, or the like.

[0060] Optionally, the shape of the identification chip 3 may be a regular shape such as a rectangle, a triangle, a circle, etc., or a combination of two or more regular shapes, or an irregular shape.

[0061] Optionally, the shape of the bonding area 201 may be a regular shape such as a rectangle, a triangle, a circle, etc., or a combination of two or more regular shapes, or an irregular shape.

[0062] Optionally, the shape of the bonding area 201 can match the shape of the identification chip 3 to improve the efficiency of the fingerprint identification module of the present application during packaging. Exemplarily, the shape of the bonding area 201 is a rectangle, and the shape of the identification chip 3 is also a rectangle.

[0063] Optionally, the thickness of the identification chip 3 may be greater than the depth of the bonding area 201, so that the thickness of the fingerprint identification module is the sum of the thickness of the identification chip 3 and the thickness of the support 1. The thickness of the identification chip 3 may also be less than the depth of the bonding area 201, so that the thickness of the fingerprint identification module is the sum of the thickness of the conductive layer 2 and the thickness of the support 1.

[0064] In some embodiments of the present application, the support member 1 and the conductive layer 2 are stacked. The support member 1 and the conductive layer 2 may be directly connected or indirectly connected.

[0065] Exemplarily, when the support member 1 is directly connected to the conductive layer 2, the support member 1 and the conductive layer 2 may be connected by bonding, clamping, bolting, or the like.

[0066] When the support member 1 is indirectly connected to the conductive layer 2, the support member 1 and the conductive layer 2 may be connected via a structure such as an insulating layer 42. Figure 2 As shown, there is an insulating layer 42 between the support member 1 and the conductive layer 2 , and the orthographic projection of the insulating layer 42 on the support member 1 is staggered from the bonding area 201 .

[0067] In some embodiments of the present application, the identification chip 3 is electrically connected to the conductive layer 2. The identification chip 3 can be electrically connected to the conductive layer 2 through the side wall of the bonding area 201, or the identification chip 3 can be electrically connected to the conductive layer 2 through a wire.

[0068] Alternatively, if Figure 2 As shown, a protective layer 43 is provided on one side of the conductive layer 2 away from the support member 1 , and the orthographic projection of the protective layer 43 on the support member 1 is staggered from the bonding area 201 .

[0069] In summary, the fingerprint recognition module of the present application transmits the fingerprint information of the recognition chip 3 through the conductive layer 2, and reduces the overall thickness through the bonding area 201 of the conductive layer 2 to reduce the volume.

[0070] In some embodiments of the present application, the identification chip 3 may be squeezed by other components when it is working. Such squeezing will directly generate pressure on the identification chip 3, causing damage to the identification chip 3. Figure 3 and Figure 4 As shown, the support member 1 includes a base 11 and an elastic portion 12, the base 11 is connected to the elastic portion 12, the elastic portion 12 can be elastically deformed along the stacking direction, and the positive projection of the fitting area 201 on the support member 1 is located in the elastic portion 12. Such a setting can improve the working safety of the identification chip 3.

[0071] It is understandable that the base 11 plays a supporting role and can be connected to other components, while keeping the elastic part 12 relatively fixed with other components. The positive projection of the fitting area 201 on the support member 1 is located inside the elastic part 12, so that when the identification chip 3 is squeezed, the elastic part 12 can drive the identification chip 3 to move in the direction of the pressure through elastic deformation, so as to reduce the pressure on the identification chip 3.

[0072] It can be understood that elastic deformation means that the elastic part 12 will deform when subjected to external force, and the deformation will disappear when the external force is removed.

[0073] Taking the screen 5 as an example of a pressure source, when the user presses the screen 5, the screen 5 is deformed and generates pressure on the identification chip 3, and the pressure acts on the elastic part 12 accordingly. The elastic part 12 generates elastic potential energy due to the pressure, and drives the identification chip 3 to move from the initial position in the direction of the pressure. At the same time, the pressure is generated by the deformation of the screen 5, that is, the closer to the screen 5, the greater the pressure on the identification chip 3. Therefore, the pressure on the identification chip 3 after the movement will be reduced, thereby improving the working safety of the identification chip 3.

[0074] In addition, the user generally generates pressure by pressing the screen 5 with a finger. The fingerprint approaches the identification chip 3 as the screen 5 deforms, and the screen 5 can generate pressure on the identification chip 3, indicating that the distance between the screen 5 and the identification chip 3 is close enough. Therefore, the identification chip 3 moving with the elastic part 12 can also maintain a relatively close distance with the fingerprint, so that the amount of fingerprint information received by the identification chip 3 is increased, thereby improving the efficiency of identification.

[0075] When the pressure along the thickness direction is removed, the screen 5 recovers from the deformation, and the elastic potential energy of the elastic part 12 is converted into kinetic energy, which drives the identification chip 3 back to the initial position.

[0076] Optionally, the elastic portion 12 may be made entirely of an elastic material, or may be made partially of an elastic material, such as spring steel, rubber, or the like.

[0077] In some embodiments of the present application, a bonding portion is provided on one side of the support member 1 away from the conductive layer 2, and the bonding portion can be directly bonded to other components to form a gap between the elastic ring 121 and the other components to avoid interference between the elastic ring 121 and the component when elastic deformation occurs.

[0078] In some embodiments of the present application, the base 11 surrounds the outer side of the elastic part 12. When assembling the fingerprint recognition module of the present application, the base 11 is connected with other components to support the elastic part 12. The base 11 surrounds the outer side of the elastic part 12, which is beneficial for other components to support each position of the base 11 separately, thereby improving its stability.

[0079] In addition, the base 11 surrounds the outer side of the elastic part 12, which can protect the elastic part 12 and divide the activity area for the elastic deformation of the elastic part 12, which is beneficial for assemblers to arrange the fingerprint recognition module of the present application during assembly.

[0080] Alternatively, if Figure 3 As shown, a portion of the base 11 extends from one side of the elastic part 12 to the opposite side of the elastic part 12 along the length direction of the elastic part 12. When in use, the base 11 is located at two opposite sides of the elastic part 12 and connected to other components to support the elastic part 12.

[0081] Optionally, the base 11 is annular, and the elastic portion 12 is located inside the base 11 .

[0082] In some of the embodiments of this application, Figure 3 As shown, the elastic portion 12 includes an elastic ring 121 and a supporting area 122, the elastic ring 121 connects the supporting area 122 and the base 11, a first avoidance cavity 1201 is provided between the elastic ring 121 and the base 11, a second avoidance cavity 1202 is provided between the elastic ring 121 and the supporting area 122, and the orthographic projection of the fitting area 201 on the supporting member 1 is located within the supporting area 122.

[0083] It is understandable that the elastic ring 121 connects the support area 122 and the base 11, and can drive the identification chip 3 located in the support area 122 to move by elastic deformation, so as to reduce the pressure on the identification chip 3 when being squeezed. A first avoidance cavity 1201 is provided between the elastic ring 121 and the base 11, and a second avoidance cavity 1202 is provided between the elastic ring 121 and the support area 122, which can reduce the interference between the elastic ring 121 and the base 11 and the support area 122 when the elastic ring 121 is elastically deformed, so as to improve the reliability of the elastic deformation of the elastic ring 121.

[0084] Optionally, the shape of the first avoidance cavity 1201 may be a regular shape such as a ring or a rectangle, or a combination of two or more regular shapes, or an irregular shape.

[0085] Optionally, the shape of the second avoidance cavity 1202 may be a regular shape such as a ring or a rectangle, or a combination of two or more regular shapes, or an irregular shape.

[0086] For example, the first avoidance cavity 1201 may be a hollow area formed on the support member 1. For example, the second avoidance cavity 1202 may be a hollow area formed on the support member 1. For example, the first avoidance cavity 1201 and / or the second avoidance cavity 1202 may be formed by laser or etching on the support member 1.

[0087] Optionally, the material of the elastic ring 121 may be spring steel, rubber, etc.

[0088] Optionally, the distance between the connection position of the elastic ring 121 and the supporting area 122 and the connection position of the elastic ring 121 and the base 11 is at least greater than 3 mm.

[0089] In some embodiments of the present application, when the elastic ring 121 undergoes elastic deformation, the connection between the elastic ring 121 and the base 11 is subjected to a large pressure. When the pressure is greater than the tolerance of the elastic ring 121, the elastic ring 121 will break. Figure 4 As shown, the support member 1 further comprises a first connecting rib 13, and the first connecting rib 13 connects the elastic ring 121 and the base 11 in the first avoidance cavity 1201. Such a configuration can improve the adaptability of the elastic part 12.

[0090] It is understandable that the first connecting rib 13 can bear pressure together with the connection position between the elastic ring 121 and the base 11 to help the elastic ring 121 to undergo elastic deformation and avoid the elastic part 12 from breaking.

[0091] Optionally, the longitudinal cross-sectional shape of the first connecting rib 13 may be a regular shape such as a rectangle, a circle, etc., may be a combination of two or more regular shapes, or may be an irregular shape.

[0092] Optionally, the number of the first connecting ribs 13 is at least two, and two of them are symmetrically arranged along the length direction of the elastic portion 12 .

[0093] In some embodiments of the present application, when the elastic ring 121 undergoes elastic deformation, the connection between the elastic ring 121 and the support area 122 is subjected to greater pressure. When the pressure is greater than the tolerance of the elastic ring 121, the elastic ring 121 will break. Figure 4As shown, the support member 1 further comprises a second connecting rib 14, and the second connecting rib 14 connects the elastic ring 121 and the supporting area 122 in the second avoidance cavity 1202. Such a configuration can improve the adaptability of the elastic part 12.

[0094] It is understandable that the second connecting rib 14 can bear pressure together with the connection position between the elastic ring 121 and the supporting area 122 to help the elastic ring 121 to undergo elastic deformation and avoid the elastic part 12 from breaking.

[0095] Optionally, the longitudinal cross-sectional shape of the second connecting rib 14 may be a regular shape such as a rectangle, a circle, etc., may be a combination of two or more regular shapes, or may be an irregular shape.

[0096] Optionally, the number of the second connecting ribs 14 is at least two, and two of them are symmetrically arranged along the length direction of the elastic portion 12 .

[0097] In some of the embodiments of this application, Figure 4 As shown, the conductive layer 2 includes a first wiring 21, which is arranged on the elastic ring 121 and is electrically connected to the identification chip 3. Such an arrangement can realize the electrical connection between the conductive layer 2 and the identification chip 3.

[0098] It is understandable that the first wiring 21 is disposed on the elastic ring 121 and can be deformed along with the elastic ring 121 , which is beneficial for the elastic ring 121 to protect the first wiring 21 and reduce the possibility of collision between the first wiring 21 and other components.

[0099] Optionally, the width of the first wiring 21 needs to be greater than 50 um, and the thickness needs to be greater than 10 um. The material of the first wiring 21 can be rolled copper to prevent breakage during elastic deformation.

[0100] Optionally, the width of the elastic ring 121 may be increased according to the increase in the number of first traces 21. The minimum width of the elastic ring 121 is greater than 0.3 mm.

[0101] In some embodiments of the present application, the first trace 21 is formed by etching a portion of the conductive layer 2 .

[0102] In some of the embodiments of this application, Figure 4 As shown, the first wiring 21 is symmetrically arranged along the length direction of the support member 1.

[0103] It is understandable that such a configuration can improve the force uniformity of the elastic ring 121, and is conducive to the elastic ring 121 driving the support area 122 to move through elastic deformation.

[0104] like Figure 5As shown, the second aspect of the present application provides a packaging method, the method comprising:

[0105] 100: stacking the support member 1 and the substrate.

[0106] 200: Processing the substrate to form a conductive layer 2 on the substrate.

[0107] 300 : Connecting the support member 1 and the identification chip 3 in the bonding area 201 of the conductive layer 2 .

[0108] 400 : Connecting the conductive layer 2 and the identification chip 3 .

[0109] It is understandable that, through the above packaging method, the present application can realize the packaging of the above fingerprint recognition module. The stacked support member 1 and substrate can keep the support member 1 and the substrate relatively fixed in position during the packaging process to improve the accuracy and efficiency of the packaging.

[0110] In the embodiment of the present application, the substrate may be made entirely of a conductive material or partially of a conductive material. The conductive material may be a conductive metal such as copper or silver, or an alloy whose substrate is a conductive metal. For example, the substrate may be a copper foil.

[0111] In the embodiment of the present application, the support member 1 and the substrate can be attached to form a stacked structure. The support member 1 and the substrate can also be connected by other components to form a stacked structure.

[0112] In some embodiments of the present application, the processing of the substrate to form the conductive layer on the substrate includes:

[0113] The substrate is etched so that a portion of the substrate forms a first trace 21 .

[0114] It can be understood that by processing the substrate to form the first trace 21 during the packaging process, the packaging method of the present application does not require additional assembly of the first trace 21, which can reduce errors during assembly and thus improve packaging efficiency.

[0115] Optionally, the packaging method of the present application may form the first trace 21 by etching the substrate or processing the substrate with a laser.

[0116] In some embodiments of the present application, after the support member 1 and the substrate are attached, the support member 1 can be etched to form an elastic ring 121, a support area 122, a first avoidance cavity 1201 and a second avoidance cavity 1202 on the support member 1, so that when the identification chip 3 is squeezed, the support member 1 can elastically deform to drive the identification chip 3 to move in the direction of the pressure to reduce the pressure on the identification chip 3. For example, the first avoidance cavity 1201 and the second avoidance cavity 1202 can be hollow areas etched or formed by laser on the support member 1.

[0117] Optionally, the identification chip 3 is attached to the support member 1 by glue. The glue may be DAF glue (Die Attach Film).

[0118] In some of the embodiments of this application, Figure 6 As shown, the connecting of the conductive layer 2 and the identification chip 3 includes:

[0119] 401 : a second wiring 41 is led out from the identification chip 3 .

[0120] 402 : Connect the second wiring 41 and the first wiring 21 .

[0121] 403 : applying glue to solidify the second wiring 41 .

[0122] It is understandable that the identification chip 3 has multiple interfaces, and the electrical connection between the identification chip 3 and the first wiring 21 is realized by leading out the second wiring 41 from the identification chip 3, so as to improve the packaging efficiency. The second wiring 41 can be protected by glue curing, and the second wiring 41 can be prevented from colliding with other components and breaking.

[0123] The third aspect of the present application provides a screen assembly, such as Figure 7 As shown, the screen assembly includes a screen 5, a middle frame 6 and a fingerprint recognition module as described in the above embodiment. The screen 5 and the middle frame 6 are stacked. The fingerprint recognition module is located between the screen 5 and the middle frame 6, and the recognition chip 3 is closer to the screen 5 than the support 1.

[0124] It can be understood that, due to the adoption of the fingerprint recognition module of the above-mentioned embodiment, the screen assembly of the present application has the same technical effect as the above-mentioned embodiment, which will not be repeated here.

[0125] In some embodiments of the present application, the middle frame 6 has a deformation cavity 601 , the support member 1 is closer to the deformation cavity 601 than the identification chip 3 , and the orthographic projection of the support member 1 on the middle frame 6 at least partially overlaps with the deformation cavity 601 .

[0126] It can be understood that the deformation cavity 601 provides space for the deformation of the support member 1. When the support member 1 is subjected to pressure from the screen 5, it can drive the identification chip 3 into the deformation cavity 601 to avoid interference with the middle frame 6.

[0127] Optionally, the cross-sectional shape of the deformation cavity 601 may be a regular shape such as a rectangle or a circle, may be a combination of two or more regular shapes, or may be an irregular shape.

[0128] A fourth aspect of the present application provides an electronic device, which includes the screen assembly as described in the above embodiment.

[0129] It can be understood that, since the screen assembly of the above-mentioned embodiment is adopted, the screen assembly of the present application has the same technical effect as the above-mentioned embodiment, which will not be repeated here.

[0130] Optionally, the electronic device may be a smart phone, a tablet or other products.

[0131] In summary, the first aspect of the present application provides a fingerprint recognition module, which transmits fingerprint information of the recognition chip 3 through the conductive layer 2, and thins the overall thickness through the bonding area 201 of the conductive layer 2 to reduce the volume.

[0132] A second aspect of the present application provides a packaging method to implement packaging of a fingerprint recognition module.

[0133] A third aspect of the present application provides a screen assembly.

[0134] A fourth aspect of the present application provides an electronic device.

[0135] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0136] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the present application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.

[0137] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A fingerprint recognition module, characterized in that: The fingerprint recognition module comprises a support member (1), a conductive layer (2) and an identification chip (3), wherein the conductive layer (2) has a bonding area (201), wherein: The support member (1) and the conductive layer (2) are stacked; The identification chip (3) is connected to the support member (1) in the bonding area (201); The identification chip (3) is electrically connected to the conductive layer (2).

2. The fingerprint recognition module according to claim 1, characterized in that: The support member (1) comprises a base (11) and an elastic portion (12), wherein the base (11) is connected to the elastic portion (12), the elastic portion (12) is capable of elastic deformation along the stacking direction, and the conforming area (201) is located within the elastic portion (12) in its orthographic projection on the support member (1).

3. The fingerprint recognition module according to claim 2, characterized in that: The elastic portion (12) comprises an elastic ring (121) and a supporting area (122); the elastic ring (121) connects the supporting area (122) and the base (11); a first avoidance cavity (1201) is provided between the elastic ring (121) and the base (11); a second avoidance cavity (1202) is provided between the elastic ring (121) and the supporting area (122); and the orthographic projection of the fitting area (201) on the supporting member (1) is located within the supporting area (122).

4. The fingerprint recognition module according to claim 3, characterized in that: The support member (1) further comprises a first connecting rib (13), wherein the first connecting rib (13) connects the elastic ring (121) and the base (11) in the first avoidance cavity (1201).

5. The fingerprint recognition module according to claim 3, characterized in that: The support member (1) further comprises a second connecting rib (14), wherein the second connecting rib (14) connects the elastic ring (121) and the supporting area (122) in the second avoidance cavity (1202).

6. The fingerprint recognition module according to claim 3, characterized in that: The conductive layer (2) comprises a first wiring (21), the first wiring (21) is arranged on the elastic ring (121), and the first wiring (21) is electrically connected to the identification chip (3).

7. The fingerprint recognition module according to claim 6, characterized in that: The first wiring (21) is symmetrically arranged along the length direction of the support member (1).

8. A packaging method, characterized in that: The method comprises: stacking a support member (1) and a substrate; Processing the substrate to form a conductive layer (2) on the substrate; Connecting the support member (1) and the identification chip (3) at the bonding area (201) of the conductive layer (2); The conductive layer (2) and the identification chip (3) are connected.

9. The packaging method according to claim 8, characterized in that: The step of processing the substrate so that the substrate forms the conductive layer (2) comprises: The substrate is etched so that a portion of the substrate forms a first trace (21).

10. The packaging method according to claim 9, characterized in that: The connecting of the conductive layer (2) and the identification chip (3) comprises: Leading out a second wiring (41) from the identification chip (3); connecting the second wiring (41) and the first wiring (21); The second wiring (41) is cured by glue dispenser.

11. A screen assembly, characterized in that: The screen assembly comprises a screen (5), a middle frame (6) and a fingerprint recognition module according to any one of claims 1 to 7, wherein: The screen (5) and the middle frame (6) are stacked; The fingerprint recognition module is located between the screen (5) and the middle frame (6), and the recognition chip (3) is closer to the screen (5) than the support member (1).

12. The screen assembly according to claim 11, characterized in that: The middle frame (6) has a deformation cavity (601), the support member (1) is closer to the deformation cavity (601) than the identification chip (3), and the orthographic projection of the support member (1) on the middle frame (6) at least partially overlaps with the deformation cavity (601).

13. An electronic device, characterized in that: The electronic device comprises the screen assembly as claimed in claim 11 or 12.

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