Display modules and display devices

Abstract

The application provides a display module and a display device, and relates to the technical field of display, and is used for solving the problem of mold printing of display products. The display module comprises a display panel, a flexible circuit board, a heat dissipation film and a buffer layer. The flexible circuit board is located on the non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board and the display panel. The flexible circuit board comprises a main body part and a bending part connected with each other. The main body part is connected with the heat dissipation film, the buffer layer is located between the bending part and the heat dissipation film, and the buffer layer is connected with the heat dissipation film.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the continuous development of display technology, the application fields of display products are becoming increasingly widespread. Currently, in order to match the overall design of the device, the flexible circuit board is designed with a "long neck" structure and is not bonded to other components. However, during logistics storage and daily touch screen use, the unfixed "long neck" will be vibrated and constantly knock on other nearby structures, causing slight deformation of the module structure at the corresponding position. When the deformation accumulates to a certain extent, it will appear as unevenness on the front of the module. This display defect is called mold mark, which will greatly reduce the user experience. Summary of the Invention

[0003] The purpose of this invention is to provide a display module and display device to solve the molding problem of display products.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A first aspect of the present invention provides a display module, comprising: a display panel, a flexible circuit board, a heat dissipation film, and a buffer layer; wherein the flexible circuit board is located on the non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board and the display panel; the flexible circuit board includes a main body portion and a curved portion connected to each other; the main body portion is connected to the heat dissipation film, and the buffer layer is located between the curved portion and the heat dissipation film, and the buffer layer is connected to the heat dissipation film.

[0006] Optionally, the display module further includes an enhanced heat dissipation structure, which includes an enhanced heat dissipation layer. At least a portion of the enhanced heat dissipation layer is located between the heat dissipation film and the buffer layer. The enhanced heat dissipation layer is connected to the heat dissipation film. The main body is connected to the heat dissipation film through the enhanced heat dissipation layer. The buffer layer is connected to the heat dissipation film through the enhanced heat dissipation layer. The thermal conductivity of the enhanced heat dissipation layer is higher than that of the heat dissipation film.

[0007] Optionally, the enhanced heat dissipation layer includes a full-coverage film layer, and the orthographic projection of the flexible circuit board on the display panel at least partially overlaps with the orthographic projection of the enhanced heat dissipation layer on the display panel.

[0008] Optionally, the enhanced heat dissipation layer includes a first enhanced heat dissipation pattern and a second enhanced heat dissipation pattern, wherein the cohesive force of the first enhanced heat dissipation pattern is less than that of the second enhanced heat dissipation pattern, and the thermal conductivity of the first enhanced heat dissipation pattern is higher than that of the heat dissipation film.

[0009] The display panel includes a panel body and a panel bending portion. The panel bending portion is bent to the non-light-emitting side of the panel body. The panel bending portion is located on the side of the second enhanced heat dissipation pattern that faces away from the panel body. The orthographic projection of the panel bending portion on the panel body at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern on the panel body.

[0010] Optionally, the orthographic projection of the main body portion on the panel body at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern on the panel body; and / or, the orthographic projection of the main body portion on the panel body at least partially overlaps with the orthographic projection of the first enhanced heat dissipation pattern on the panel body.

[0011] Optionally, the enhanced heat dissipation structure further includes a first double-sided adhesive layer, an edge-sealing adhesive layer, and a second double-sided adhesive layer stacked sequentially along a direction away from the display panel. The edge-sealing adhesive layer is disposed in the same layer as the enhanced heat dissipation layer and surrounds the enhanced heat dissipation layer.

[0012] Optionally, the heat dissipation film includes trenches, and the enhanced heat dissipation layer is located within the trenches.

[0013] Optionally, the display module further includes a planarization layer, wherein the enhanced heat dissipation structure, the planarization layer, and the buffer layer are stacked sequentially along a direction away from the display panel.

[0014] Optionally, the planarization layer includes a heat-dissipating metal material layer.

[0015] Based on the above-described display module technical solution, a second aspect of the present invention provides a display device including the above-described display module.

[0016] In the technical solution provided by this invention, a buffer layer is provided between the bent portion of the flexible circuit board and the heat dissipation film. This buffer layer, with its excellent compressive resilience, counteracts the pressure exerted on the heat dissipation film by the vibration of the bent portion, fundamentally solving the problem of minute deformation in the module structure and effectively improving the molding issue. Furthermore, by adding an enhanced heat dissipation layer with a higher thermal conductivity, the excellent thermal conductivity of the enhanced heat dissipation layer allows for rapid heat transfer from the heat-generating components to the surrounding environment, thereby improving the heat dissipation efficiency of the display module. Simultaneously, the excellent thermal conductivity of the enhanced heat dissipation layer allows for rapid heat transfer from the heat-generating components to a larger but slightly lower thermal conductivity heat dissipation metal layer, achieving even faster heat dissipation to the environment and further improving the module's heat dissipation efficiency. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0018] Figure 1 This is a planar schematic diagram of the non-light-emitting side of the display module provided in an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of a first cross-section of a display module provided in an embodiment of the present invention;

[0020] Figure 3 For corresponding Figure 2 The first cross-sectional schematic diagram shows the layered structure of the display panel located on the non-light-emitting side;

[0021] Figure 4 This is a first planar schematic diagram of the enhanced heat dissipation structure provided in an embodiment of the present invention;

[0022] Figure 5 This is a second planar schematic diagram of the enhanced heat dissipation structure provided in an embodiment of the present invention;

[0023] Figure 6 This is a second cross-sectional schematic diagram of the display module provided in an embodiment of the present invention.

[0024] Figure label:

[0025] 1-Glass cover plate, 2-Optical adhesive,

[0026] 3-Polarizing film, 4-Panel body,

[0027] 41 - Panel bending section; 50 - Entire mask layer;

[0028] 51-Buffer bonding layer, 52-Heat dissipation metal layer,

[0029] 53 - First double-sided adhesive layer, 54 - Edge binding adhesive layer,

[0030] 55 - Second enhanced heat dissipation pattern, 56 - First enhanced heat dissipation pattern

[0031] 57 - Second double-sided adhesive layer; 58 - Planarization layer;

[0032] 59 - Buffer layer, 6 - Flexible circuit board

[0033] 61 - Main body, 62 - Curved part. Detailed Implementation

[0034] To further illustrate the display module and display device provided in the embodiments of the present invention, a detailed description is provided below with reference to the accompanying drawings.

[0035] Please see Figures 1 to 6 This invention provides a display module, comprising: a display panel (including a panel body 4 and a panel bending portion 41), a flexible circuit board 6, a heat dissipation film (including a buffer adhesive layer 51 and a heat dissipation metal layer 52), and a buffer layer 59; wherein, the flexible circuit board 6 is located on the non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board 6 and the display panel; the flexible circuit board 6 includes a main body portion 61 and a bending portion 62 connected to each other; the main body portion 61 is connected to the heat dissipation film, and the buffer layer 59 is located between the bending portion 62 and the heat dissipation film, and the buffer layer 59 is connected to the heat dissipation film.

[0036] For example, the display panel includes a panel body 4 and a panel bending portion 41, the panel bending portion 41 being bent to the non-light-emitting side of the panel body 4; the flexible circuit board 6 is connected to the panel bending portion 41 on the side of the panel bending portion 41 facing away from the panel body 4; at least a portion of the heat dissipation film is located between the panel body 4 and the panel bending portion 41; the buffer layer 59 is located between the bending portion 62 and the heat dissipation film, and the buffer layer 59 is disposed in the same layer as the panel bending portion 41.

[0037] For example, the orthographic projection of the curved portion 62 on the display panel is located inside the orthographic projection of the buffer layer 59 on the display panel.

[0038] For example, the heat dissipation film includes a buffer adhesive layer 51 and a heat dissipation metal layer 52. The buffer adhesive layer 51 is located between the panel body 4 and the heat dissipation metal layer 52 and is used to bond the panel body 4 and the heat dissipation metal layer 52. The buffer adhesive layer 51 also has a certain impact resistance and buffering capacity. The function of the heat dissipation metal layer 52 includes dissipating heat to the environment and resisting external impacts.

[0039] The display module also includes a glass cover plate 1, an optical adhesive 2, and a polarizer 3. The glass cover plate 1, the optical adhesive 2, and the polarizer 3 are all disposed on the light-emitting side of the panel body 4 and are stacked sequentially along the direction close to the panel body 4. The glass cover plate 1 is bonded to the panel body 4 through the optical adhesive 2 and the polarizer 3.

[0040] For example, the buffer layer 59 includes materials such as silicone, rubber, and foam. These materials have excellent compression resilience and can effectively absorb vibrations and impacts generated by the bending portion 62 of the flexible circuit board 6. When deformation occurs due to vibration and impact, the buffer layer 59 can generate a rebound force to offset the external force. At the same time, the buffer layer 59 also has strong toughness and can withstand long-term vibration and impact without breaking.

[0041] It should be noted that in the display module provided in the embodiments of the present invention, the connection between each film layer includes direct bonding or indirect bonding through adhesive layer, but is not limited to this.

[0042] It should be noted that the type and shape of the material of the buffer layer 59 are not limited. It is only required that the material has sufficient elasticity and toughness, and that it does not change or deform in the display module testing and usage environment. The material shape can cover the curved part 62.

[0043] It should be noted that the flexible circuit board 6 includes a main body portion 61 and a curved portion 62 connected to each other. The main body portion 61 is fixed to the non-light-emitting side of the panel body 4 by adhesive. The curved portion 62 cannot be fixed in the same way as the main body portion 61 because it needs to be fastened to a fixture for relevant testing. Therefore, during logistics transportation and touch screen use after installation, the curved portion 62 will be subjected to vibration and continuously collide with the heat dissipation metal layer, causing slight deformation at the corresponding position of the module. When the deformation accumulates to a certain extent, it will manifest as unevenness of the screen on the front of the module, thereby greatly reducing the user experience.

[0044] As can be seen from the specific structure of the display module described above, in the display module provided by the embodiment of the present invention, by providing a buffer layer 59 between the bent portion 62 of the flexible circuit board 6 and the heat dissipation film, the buffer layer 59 can offset the pressure generated by the vibration of the bent portion 62 on the heat dissipation film with its excellent compression and rebound characteristics, thereby fundamentally solving the cause of module structure deformation and effectively improving the molding problem.

[0045] As market demand for more feature-rich display devices grows, electronic products may run multiple demanding applications and games simultaneously. This increases the processor's workload and generates more heat. However, with the trend towards thinner and lighter display devices, it's no longer feasible to arbitrarily increase the device's thickness to achieve greater heat dissipation space. Therefore, higher demands are placed on the thermal design of the display module. Furthermore, the increasingly sophisticated functionality of display devices and the compact layout of power-consuming components lead to higher overall heat generation and reduced cooling efficiency, negatively impacting the user experience.

[0046] Please see Figures 1 to 6 In some embodiments, the display module further includes an enhanced heat dissipation structure, which includes an enhanced heat dissipation layer (including a first enhanced heat dissipation pattern 56 and a second enhanced heat dissipation pattern 55; or, including a full-film layer 50). At least a portion of the enhanced heat dissipation layer is located between the heat dissipation film and the buffer layer 59. The enhanced heat dissipation layer is connected to the heat dissipation film. The main body portion 61 is connected to the heat dissipation film through the enhanced heat dissipation layer. The buffer layer 59 is connected to the heat dissipation film through the enhanced heat dissipation layer. The thermal conductivity of the enhanced heat dissipation layer is higher than that of the heat dissipation film.

[0047] For example, the heat-reinforcing layer includes graphene, but is not limited to it. It is worth noting that the heat-reinforcing layer is not limited to graphene, as long as its thermal conductivity is significantly higher than that of the heat-reinforcing metal layer 52.

[0048] For example, the heat dissipation film, the enhanced heat dissipation layer, the buffer layer 59 and the flexible circuit board 6 are stacked sequentially in a direction away from the panel body 4.

[0049] In the display module provided in the above embodiments, by adding an enhanced heat dissipation layer with a higher thermal conductivity, the heat generated by the heat-generating components can be quickly conducted to the surrounding environment through the excellent thermal conductivity of the enhanced heat dissipation layer, thereby improving the heat dissipation efficiency of the display module. Simultaneously, the excellent thermal conductivity of the enhanced heat dissipation layer can also quickly conduct the heat generated by the heat-generating components to the larger but slightly lower thermal conductivity heat dissipation metal layer 52, thereby achieving faster heat dissipation to the environment and further improving the heat dissipation efficiency of the module.

[0050] like Figure 5 and Figure 6 As shown, in some embodiments, the enhanced heat dissipation layer includes a full-surface film layer 50, and the orthographic projection of the flexible circuit board 6 on the display panel at least partially overlaps with the orthographic projection of the enhanced heat dissipation layer on the display panel.

[0051] For example, the orthographic projection of the flexible circuit board 6 on the display panel is located inside the orthographic projection of the enhanced heat dissipation layer on the display panel.

[0052] For example, the entire surface of the enhanced heat dissipation layer includes graphene, but is not limited to it.

[0053] If the conductive adhesive bonding width around the enhanced heat dissipation layer is large enough to avoid insufficient bonding strength of the edge adhesive, the heat dissipation effect can be better enhanced by laying the enhanced heat dissipation layer over the entire surface.

[0054] like Figures 2 to 4 As shown, in some embodiments, the enhanced heat dissipation layer includes a first enhanced heat dissipation pattern 56 and a second enhanced heat dissipation pattern 55, wherein the cohesive force of the first enhanced heat dissipation pattern 56 is less than that of the second enhanced heat dissipation pattern 55, and the thermal conductivity of the first enhanced heat dissipation pattern 56 is higher than that of the heat dissipation film.

[0055] The display panel includes a panel body 4 and a panel bending portion 41. The panel bending portion 41 is bent to the non-light-emitting side of the panel body 4. The panel bending portion 41 is located on the side of the second enhanced heat dissipation pattern 55 that is away from the panel body 4. The orthographic projection of the panel bending portion 41 on the panel body 4 at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4.

[0056] For example, the display panel includes a panel body 4 and a panel bending portion 41. The panel body 4 includes an array of pixel units and is used to realize the display function of the display panel. The panel bending portion 41 serves as the Pad area of ​​the display panel and is used to bond with the flexible circuit board 6.

[0057] For example, the first enhanced heat dissipation pattern 56 and the second enhanced heat dissipation pattern 55 are made of different materials. For instance, the first enhanced heat dissipation pattern 56 is made of graphene, and the second enhanced heat dissipation pattern 55 is made of a heat dissipation metal layer material, but it is not limited to this.

[0058] For example, the first enhanced heat dissipation pattern 56 and the second enhanced heat dissipation pattern 55 are independent of each other, and the area of ​​the first enhanced heat dissipation pattern 56 is larger than the area of ​​the second enhanced heat dissipation pattern 55.

[0059] For example, the heat dissipation film, the enhanced heat dissipation layer, and the panel bending portion 41 are stacked sequentially in a direction away from the panel body 4.

[0060] For example, the orthographic projection of the panel bending portion 41 on the panel body 4 does not overlap with the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4.

[0061] It should be noted that although graphene has a high thermal conductivity, it has low tensile strength and weak cohesion, making it prone to delamination under tension. Since the panel bending portion 41 bends 180° and adheres to the enhanced heat dissipation structure on the non-light-emitting side of the panel body 4, the bending portion 41 will generate deformation and rebound force after bending at a large angle. If the width of the adhesive tape near the adhesion area is narrow, the peeling force of the graphene layer adhesive will be insufficient, causing the adhesive tape to separate from the upper and lower layers due to insufficient adhesion. This leads to delamination of the graphene and the display module, indirectly causing graphene delamination and breakage.

[0062] In the display module provided in the above embodiments, the enhanced heat dissipation layer includes a first enhanced heat dissipation pattern 56 and a second enhanced heat dissipation pattern 55. The cohesive force of the first enhanced heat dissipation pattern 56 is less than that of the second enhanced heat dissipation pattern 55. Simultaneously, the orthographic projection of the panel bending portion 41 on the panel body 4 at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4. This ensures that, in the direction perpendicular to the panel body 4, the panel bending portion 41 can overlap with the second enhanced heat dissipation pattern 55, which has superior tensile strength. Furthermore, the bonding area between the second enhanced heat dissipation pattern 55 and the double-sided adhesive on its upper and lower layers is sufficiently large, preventing delamination due to insufficient adhesive strength. Therefore, including the second enhanced heat dissipation pattern 55 in the enhanced heat dissipation layer effectively improves the problem of graphene (olefin) and display module delamination caused by the bending spring force of the panel bending portion 41.

[0063] Moreover, in the display module provided in the above embodiments, the thermal conductivity of the first enhanced heat dissipation pattern 56 is set to be higher than that of the heat dissipation film, which improves the above problems while ensuring the overall heat dissipation performance of the display module.

[0064] like Figures 2 to 4 As shown, in some embodiments, the orthographic projection of the main body portion 61 on the panel body 4 is at least partially overlapped with the orthographic projection of the second heat dissipation enhancement pattern 55 on the panel body 4; and / or, the orthographic projection of the main body portion 61 on the panel body 4 is at least partially overlapped with the orthographic projection of the first heat dissipation enhancement pattern 56 on the panel body 4.

[0065] For example, the orthographic projection of the curved portion 62 on the panel body 4 at least partially overlaps with the orthographic projection of the first heat dissipation enhancement pattern 56 on the panel body 4; and / or, the orthographic projection of the curved portion 62 on the panel body 4 at least partially overlaps with the orthographic projection of the second heat dissipation enhancement pattern 55 on the panel body 4.

[0066] For example, the orthographic projection of the curved portion 62 on the panel body 4 is located inside the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4.

[0067] The above-mentioned arrangement ensures that the orthographic projection of the main body 61 on the panel body 4 and the orthographic projection of the second heat dissipation enhancement pattern 55 on the panel body 4 at least partially overlap, which can guarantee the adhesion performance between the main body 61 and the heat dissipation enhancement layer and avoid delamination problems between the main body 61 and the heat dissipation enhancement layer in the flexible circuit board 6.

[0068] The above-mentioned arrangement ensures that the orthographic projection of the main body 61 on the panel body 4 and the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4 at least partially overlap, which can ensure that the enhanced heat dissipation layer can better dissipate the heat generated by the flexible circuit board 6, thus ensuring the overall heat dissipation performance of the display module.

[0069] The above-mentioned arrangement ensures that the orthographic projection of the curved portion 62 on the panel body 4 at least partially overlaps with the orthographic projection of the first enhanced heat dissipation pattern 56 on the panel body 4, further ensuring that the enhanced heat dissipation layer can better dissipate the heat generated by the flexible circuit board 6, thus ensuring the overall heat dissipation performance of the display module.

[0070] The above-mentioned arrangement ensures that the orthographic projection of the curved portion 62 on the panel body 4 at least partially overlaps with the orthographic projection of the second enhanced heat dissipation pattern 55 on the panel body 4, further increasing the area of ​​the second enhanced heat dissipation pattern 55, improving the adhesion performance of the enhanced heat dissipation layer, and further avoiding the delamination problem of the enhanced heat dissipation layer.

[0071] like Figures 3 to 5 As shown, in some embodiments, the enhanced heat dissipation structure further includes a first double-sided adhesive layer 53, an edge-sealing adhesive layer 54, and a second double-sided adhesive layer 57, which are sequentially stacked along a direction away from the display panel. The edge-sealing adhesive layer 54 is disposed in the same layer as the enhanced heat dissipation layer and surrounds the enhanced heat dissipation layer.

[0072] Although graphene has excellent thermal conductivity, it has a low density, weak interlayer bonding through van der Waals forces, and low intermolecular interaction forces. As a result, it has low tensile strength and elongation, and is prone to fracture and breakage along the layers when subjected to external forces.

[0073] The aforementioned enhanced heat dissipation structure further includes a first double-sided adhesive layer 53, an edge-sealing adhesive layer 54, and a second double-sided adhesive layer 57 sequentially stacked along a direction away from the display panel. This allows the first double-sided adhesive layer 53 to bond the edge-sealing adhesive and the enhanced heat dissipation layer to the heat dissipation metal layer 52 in the heat dissipation film. The first double-sided adhesive layer 53, the edge-sealing adhesive layer 54, and the second double-sided adhesive layer 57 can confine the enhanced heat dissipation layer within a sealed space formed by the three layers, thereby effectively preventing the material in the enhanced heat dissipation layer from breaking, crumbling, or dropping foreign objects.

[0074] like Figure 6 As shown, in some embodiments, the heat dissipation film includes trenches, and the enhanced heat dissipation layer is located within the trenches.

[0075] For example, the heat dissipation film includes a buffer adhesive layer 51 and a heat dissipation metal layer 52. The buffer adhesive layer 51 is located between the panel body 4 and the heat dissipation metal layer 52. The heat dissipation metal layer 52 includes a hollow area, which, together with the buffer adhesive layer 51, forms the groove. The heat dissipation metal layer 52 serves as the groove wall, and the buffer adhesive layer 51 serves as the groove bottom. The enhanced heat dissipation layer is located within the groove and is disposed in the same layer as the heat dissipation metal layer 52, and is bonded to the buffer adhesive layer 51.

[0076] For example, the heat-dissipating metal layer 52 surrounds the enhanced heat-dissipating layer, but is not limited thereto.

[0077] When the enhanced heat dissipation layer is set in the above manner, it is only necessary to cut grooves in the heat dissipation film and directly attach the enhanced heat dissipation layer to the buffer adhesive layer. This not only improves the heat dissipation efficiency, but also achieves the thinning of the display module.

[0078] More specifically, the aforementioned heat dissipation film includes grooves, and the enhanced heat dissipation layer is located within the grooves, allowing the perimeter of the enhanced heat dissipation layer to be edged by the heat dissipation metal layer 52. Simultaneously, the surface of the enhanced heat dissipation layer facing the display panel can be directly bonded to the buffer adhesive layer 51, thereby eliminating the need for the original first double-sided adhesive layer 53 and the edge-sealing adhesive layer 54. This solution not only simplifies the manufacturing process of the display module but also fulfills the requirement for thinner display modules.

[0079] Moreover, the above-mentioned arrangement allows the orthographic projection of the panel bending portion 41 on the display panel to overlap with the orthographic projection of the heat dissipation metal layer 52 on the display panel, ensuring a light bond between the panel bending portion 41 and the heat dissipation metal layer 52. Therefore, the enhanced heat dissipation layer can be configured as a full-surface film structure, thereby further improving the heat dissipation performance of the display module.

[0080] like Figures 2 to 6 As shown, in some embodiments, the display module further includes a planarization layer 58, and the enhanced heat dissipation structure, the planarization layer 58, and the buffer layer 59 are stacked sequentially along a direction away from the display panel.

[0081] For example, the surface of the planarization layer 58 facing the panel body 4 is bonded to the second double-sided adhesive layer 57, and the surface of the planarization layer 58 facing away from the panel body 4 is bonded to the buffer layer 59, the main body portion 61 of the flexible circuit board 6, and the panel bending portion 41 of the display panel.

[0082] Since both the main body 61 of the flexible circuit board 6 and the panel bending portion 41 of the display panel need to be attached to the enhanced heat dissipation structure, the attachment surfaces need to maintain a certain degree of flatness. The display module further includes a flattening layer 58, which flattens the step difference of the enhanced heat dissipation structure on the surface away from the panel body 4, ensuring the flatness of the attachment surface of the enhanced heat dissipation structure on the side away from the panel body 4, thereby ensuring the effective attachment of the main body 61 of the flexible circuit board 6 and the panel bending portion 41 of the display panel.

[0083] like Figures 2 to 6 As shown, in some embodiments, the planarization layer 58 includes a heat-dissipating metal material layer.

[0084] The aforementioned planarization layer 58 includes a heat-dissipating metal material layer, which further improves the overall heat dissipation performance of the display module.

[0085] A second aspect of the present invention provides a display device including the display module provided in the above embodiments.

[0086] It should be noted that the display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board 6, a printed circuit board, and a backplate.

[0087] In the display module provided in the above embodiments, by providing a buffer layer 59 between the bent portion 62 of the flexible circuit board 6 and the heat dissipation film, the buffer layer 59 can offset the pressure generated by the vibration of the bent portion 62 on the heat dissipation film with its excellent compression resilience, thereby fundamentally solving the cause of module structure deformation and effectively improving the molding problem.

[0088] In the display module provided in the above embodiments, by adding an enhanced heat dissipation layer with a higher thermal conductivity, the heat generated by the heat-generating components can be quickly conducted to the surrounding environment through the excellent thermal conductivity of the enhanced heat dissipation layer, thereby improving the heat dissipation efficiency of the display module. Simultaneously, the excellent thermal conductivity of the enhanced heat dissipation layer can also quickly conduct the heat generated by the heat-generating components to a larger but slightly lower thermal conductivity heat dissipation metal layer, thereby achieving faster heat dissipation to the environment and further improving the heat dissipation efficiency of the module.

[0089] Therefore, the display device provided in the embodiments of the present invention, when including the above-described display module, also has the above-described beneficial effects, which will not be repeated here.

[0090] It should be noted that the signal line extending in a certain direction means that the signal line includes a main part and a secondary part connected to the main part. The main part is a line, line segment, or strip-shaped body. The main part extends in a certain direction, and the length of the main part extending in a certain direction is greater than the length of the secondary part extending in other directions.

[0091] It should be noted that, in the embodiments of the present invention, "same layer" can refer to film layers located on the same structural layer. Alternatively, for example, film layers located on the same layer can be layer structures formed by using the same film deposition process to form a specific pattern, and then patterning the film layer using the same photomask through a single patterning process. Depending on the specific pattern, the single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0092] In the various method embodiments of the present invention, the sequence numbers of each step are not intended to limit the order of the steps. For those skilled in the art, any changes in the order of the steps without creative effort are also within the scope of protection of the present invention.

[0093] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the product embodiments, so the description is relatively simple, and the relevant parts can be referred to the description of the product embodiments.

[0094] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connection,” “coupled,” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0095] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0096] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0097] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A display module, characterized by The display module comprises a display panel, a flexible circuit board, a heat dissipation film and a buffer layer; the flexible circuit board is located on a non-light-emitting side of the display panel, and the heat dissipation film is located between the flexible circuit board and the display panel; the flexible circuit board comprises a main body part and a bending part connected to each other; the main body part is connected to the heat dissipation film, and the buffer layer is located between the bending part and the heat dissipation film, and the buffer layer is connected to the heat dissipation film. The display module further comprises a reinforced heat dissipation structure, and the reinforced heat dissipation structure comprises a reinforced heat dissipation layer; at least part of the reinforced heat dissipation layer is located between the heat dissipation film and the buffer layer; the reinforced heat dissipation layer is connected to the heat dissipation film; the main body part is connected to the heat dissipation film through the reinforced heat dissipation layer; the buffer layer is connected to the heat dissipation film through the reinforced heat dissipation layer; and the thermal conductivity of the reinforced heat dissipation layer is higher than that of the heat dissipation film. The reinforced heat dissipation layer comprises a first reinforced heat dissipation pattern and a second reinforced heat dissipation pattern; the cohesion of the first reinforced heat dissipation pattern is lower than that of the second reinforced heat dissipation pattern; and the thermal conductivity of the first reinforced heat dissipation pattern is higher than that of the heat dissipation film. The display panel comprises a panel main body and a panel bending part; the panel bending part is bent to a non-light-emitting side of the panel main body; the panel bending part is located on a side of the second reinforced heat dissipation pattern away from the panel main body; and the orthographic projection of the panel bending part on the panel main body at least partially overlaps the orthographic projection of the second reinforced heat dissipation pattern on the panel main body. The orthographic projection of the main body part on the panel main body at least partially overlaps the orthographic projection of the second reinforced heat dissipation pattern on the panel main body.

2. The display module of claim 1, wherein, The orthographic projection of the main body part on the panel main body at least partially overlaps the orthographic projection of the first reinforced heat dissipation pattern on the panel main body. The reinforced heat dissipation structure further comprises a first double-sided adhesive layer, an edge sealing adhesive layer and a second double-sided adhesive layer which are sequentially stacked in a direction away from the display panel; the edge sealing adhesive layer is arranged in the same layer as the reinforced heat dissipation layer; and the edge sealing adhesive layer surrounds the reinforced heat dissipation layer.

3. The display module of claim 1 or 2, wherein, The heat dissipation film comprises a groove, and the reinforced heat dissipation layer is located in the groove.

4. The display module of claim 1 or 2, wherein, The display module further comprises a flat layer; the reinforced heat dissipation structure, the flat layer and the buffer layer are sequentially stacked in a direction away from the display panel.

5. The display module of claim 1, wherein, The flat layer comprises a heat dissipation metal material layer.

6. The display module of claim 5, wherein, The display module comprises any one of the display modules according to claims 1-6.

7. A display device, characterized by comprising: ​

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