Display module and display device

Abstract

The invention provides a display module and a display device, the display module comprises a display panel and a circuit board, and the circuit board is electrically connected with a first pin located in a non-display area of the display panel. The first pin comprises a first crimping part and a first transmission part electrically connected with the first crimping part, the width of the first crimping part is larger than that of the first transmission part, and the pins in the display module are subjected to widening special-shaped design, so that the crimping area between the display panel pins and the circuit board pins is increased; and the burn risk caused by abnormal crimping between the display panel and the circuit board is reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] At present, in the production and testing of flexible display products, the panel needs to be aged to reduce the leakage current of the array substrate in the product, thereby achieving the purpose of eliminating bright spots in the display screen. However, the problem of product burns often occurs during the product aging process. Summary of the invention

[0003] The purpose of the present invention is to provide a display module and a display device to solve the problem that products in the existing display technology are easily burned during the aging process.

[0004] To achieve the above object, the present invention provides a display module, the display module comprising a display panel and a circuit board. The display panel has a display area and a non-display area connected to the display area. The circuit board is electrically connected to the non-display area of ​​the display panel. The display panel comprises a first pin, the first pin is located in the non-display area, and the circuit board is electrically connected to the first pin. The first pin comprises a first crimping portion and a first transmission portion electrically connected to the first crimping portion, and the width of the first crimping portion is greater than the width of the first transmission portion.

[0005] Furthermore, the circuit board further comprises a first routing layer and a substrate layer. The first routing layer is arranged on a side of the substrate layer close to the display panel and is electrically connected to the first pin. The substrate layer is arranged on a side of the first routing layer away from the display panel. The first routing layer comprises a plurality of second pins, and the second pins are respectively electrically connected to the driving circuit of the circuit board and at least part of the first pins.

[0006] Further, the second pin includes a second crimping portion and a second transmission portion. The second crimping portion is electrically connected to the first crimping portion. The second transmission portion is electrically connected to the second crimping portion and the driving circuit. The width of the second crimping portion is greater than the width of the second transmission portion. Preferably, the orthographic projection of the second crimping portion on the display panel at least partially overlaps with the orthographic projection of the corresponding first crimping portion on the display panel. Preferably, the orthographic projection of the second crimping portion on the display panel is located within the orthographic projection range of the corresponding first crimping portion on the display panel.

[0007] Furthermore, the first routing layer further includes a plurality of first signal lines and a plurality of third pins. One end of the first signal line is electrically connected to the drive circuit. The third pin is arranged in a staggered manner with the second pin and is located on a side of the first signal line away from the drive circuit, and the third pin is electrically connected to at least part of the first pins.

[0008] Furthermore, the circuit board further comprises a second wiring layer, which is arranged on a side of the substrate layer away from the first wiring layer. The second wiring layer comprises a plurality of second signal lines, and two ends of the second signal lines are electrically connected to the first signal line and the third pin respectively.

[0009] Furthermore. The third pin includes a third crimping portion and a third transmission portion. The third crimping portion is electrically connected to the first crimping portion. The third transmission portion is located on a side of the third crimping portion away from the first signal line, and is electrically connected to the third crimping portion. The third pin is arranged along a first direction, and extends along a second direction perpendicular to the first direction. In the first direction, the width of the third crimping portion is greater than the width of the third transmission portion. Preferably, the orthographic projection of the third crimping portion on the display panel at least partially overlaps with the orthographic projection of the corresponding first crimping portion on the display panel. Preferably, the orthographic projection of the third crimping portion on the display panel is located within the orthographic projection range of the corresponding first crimping portion on the display panel.

[0010] Furthermore, the substrate layer is provided with a plurality of connection holes, the second wiring layer covers and fills the connection holes, and at least one connection hole is provided at each end of each second signal line. The orthographic projections of the plurality of connection holes corresponding to the same second signal line on the first wiring layer are respectively located on the first signal line and on the third pin. Preferably, the orthographic projection of the connection hole on the third pin is located on the third transmission portion.

[0011] Furthermore, the distance between the first crimping portion corresponding to the second pin and the display area is greater than the distance between the first crimping portion corresponding to the third pin and the display area. Preferably, the first crimping portions of two adjacent first pins are arranged in a staggered manner.

[0012] Further, the first signal line and the second pin are arranged one by one in the first direction and extend along a second direction perpendicular to the first direction. Preferably, in the second direction, the length of the first signal line is less than the length of the second pin. Preferably, the spacing between the third crimping portion and the drive circuit is greater than the spacing between the second crimping portion and the drive circuit.

[0013] Further, the material of the substrate layer includes a flexible insulating material. The materials of the first wiring layer and the second wiring layer include a conductive metal. Preferably, the flexible insulating material includes polyimide.

[0014] The present invention further provides a display device, which includes the display module as described above.

[0015] The advantages of the present invention are: a display module and a display device of the present invention increase the crimping area between the display panel pins and the circuit board pins by widening and shaping the pins in the display module, thereby improving the fault tolerance of the offset between the display panel and the circuit board, and reducing the risk of signal transmission abnormality or even burns due to crimping offset between the display panel and the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 is a schematic diagram of the structure of a display module in an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of the connection between the pins in the display panel and the pins in the circuit board in an embodiment of the present invention;

[0019] Figure 3 for Figure 2 The schematic diagram of the cross-sectional structure of the module at line AA' is shown in FIG.

[0020] Figure 4 for Figure 2 The cross-sectional structure diagram of the module at line BB' is shown in FIG.

[0021] Figure 5 is a schematic diagram of the structure of the first pin in an embodiment of the present invention;

[0022] Figure 6 Schematic diagram of the structure of the first wiring layer in an embodiment of the present invention;

[0023] Figure 7 A schematic diagram of connection between a second pin in a display panel and a pin in a circuit board in other embodiments of the present invention;

[0024] Figure 8 It is a schematic diagram of connection between the third pin in the display panel and the pin in the circuit board in other embodiments of the present invention.

[0025] The components in the figure are shown as follows:

[0026] Display module 1; Display panel 100;

[0027] Display area AA; Non-display area NA;

[0028] Circuit board 200; First wiring layer 201;

[0029] Substrate layer 202; Second wiring layer 203;

[0030] A first pin 10; A first crimping portion 11;

[0031] A first transmission portion 12; A second pin 20;

[0032] A second crimping portion 21; A second transmission portion 22;

[0033] A third pin 30; A third crimping portion 31;

[0034] The third transmission part 32; The first signal line 40;

[0035] Connecting hole 50; Second signal line 60;

[0036] Driving circuit 70. DETAILED DESCRIPTION

[0037] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0038] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0039] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0040] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0041] In the relevant AMOLED (Active-Matrix Organic Light-Emitting Diode) display products, LTPO (Low Temperature Polycrystalline Oxide) or LTPS (Low Temperature Poly-Silicon) is mainly used as a semiconductor material to make TFT (Thin Film Transistor) in the array substrate. TFT has a common problem of leakage, and TFT leakage will cause bright spots on the display screen. The main means to solve the bright spots on the display screen is to use a large voltage (1-10 times the normal lighting voltage) and a large current (5-20 times the normal lighting current) to age the TFT so that the leakage current of the TFT is reduced, thereby achieving the purpose of eliminating the bright spots on the display screen. During the aging process, the circuit board is generally used to press the product. If the product or circuit board is crimped abnormally or causes high voltage and high current, the product and circuit board will be burned, resulting in the scrapping of the product and circuit board. In addition, after one product is burned, the subsequent products will have the problem of continuous burning, causing batch abnormalities in the product, seriously affecting the qualified rate of the product, and also increasing the production cost.

[0042] Based on the technical problems mentioned in the above-mentioned related display technologies, an embodiment of the present invention provides a display module 1, such as Figure 1As shown in , the display module 1 includes a display panel 100 and a circuit board 200 electrically connected to the display panel 100. The display panel 100 is used to display an image, and the circuit board 200 is used to transmit a driving signal to a circuit in the display panel 100.

[0043] In an embodiment of the present invention, the circuit board 200 may be a FPCB (Flexible Printed Circuit Board), which is used to transmit high-voltage and high-current driving signals to the display panel 100 during the aging process. In other embodiments of the present invention, the circuit board 200 may also be other circuit boards such as COF (Chip On Film), PCB (Printed Circuit Board) and the like, which are also directly used as driving components in the display module 1 and are electrically connected to the display panel 100 through a bonding process, thereby transmitting display signals to the display panel 100.

[0044] like Figure 2 As shown in , the display panel 100 has a display area AA and a non-display area NA connected to the display area AA. In the display area AA, the display panel 100 includes TFTs, light-emitting devices and other circuit devices, and the coordinated driving of all devices causes the display area AA to present an image. In the non-display area NA, the display panel 100 is provided with a plurality of first pins 10, and the plurality of first pins 10 are regularly arranged along a first direction X parallel to the boundary of the display area AA, and are electrically connected to the device located in the display area AA through a signal line. The first pins 10 serve as the connection port of the display panel 100 to electrically connect the display panel 100 with a driving component outside the display panel 100, thereby realizing the driving or testing of the device in the display area AA.

[0045] like Figure 2 , Figure 3 and Figure 4As shown in the figure, the circuit board 200 is arranged on one side of the display panel 100, and includes a first wiring layer 201, a second wiring layer 203 and a substrate layer 202. The first wiring layer 201 is arranged on the surface of the substrate layer 202 facing the display panel 100, and the second wiring layer 203 is arranged on the surface of the substrate layer 202 away from the display panel 100. The first wiring layer 201 of the circuit board 200 contacts the first pin 10 of the display panel 100, so as to realize the signal transmission between the circuit board 200 and the display panel 100. The substrate layer 202 is used for insulating and isolating the first wiring layer 201 and the second wiring layer 203 to prevent a short circuit between the first wiring layer 201 and the second wiring layer 203. Among them, the materials of the first wiring layer 201 and the second wiring layer 203 include metals with excellent conductive properties, such as copper, silver, aluminum, titanium, molybdenum, nickel, etc.; the materials of the substrate layer 202 include flexible insulating materials, such as polyimide (PI), etc.

[0046] The first wiring layer 201 includes a plurality of second pins 20, a plurality of third pins 30 and a plurality of first signal lines 40. The second pins 20 and the first signal lines 40 are arranged one by one along the first direction X, and remain parallel to each other in the second direction Y perpendicular to the first direction X, so that they are both electrically connected to the driving circuit 70 in the circuit board 200. The third pin 30 is arranged on the side of the first signal line 40 away from the driving circuit 70, and the third pin 30 is arranged along the first direction X and extends along the second direction Y, and is arranged in a staggered manner with the second pin 20. The third pin 30 and the second pin 20 are respectively in contact with the surface of the corresponding first pin 10 away from the display panel 100. Among them, the signal types transmitted by the second pin 20 and the third pin 30 are different, the second pin 20 is directly electrically connected to the driving circuit 70 in the circuit board 200, and the third pin 30 is indirectly electrically connected to the driving circuit 70 in the circuit board 200 through the second wiring layer 203 and the first signal line 40, so as to realize the transmission of different types of signals.

[0047] The second wiring layer 203 includes a plurality of second signal lines 60, which are arranged along the first direction X and extend along the second direction Y. The orthographic projections of the two ends of the second signal line 60 on the substrate layer 202 overlap with the first signal line 40 and the third pin 30 respectively. A plurality of connection holes 50 are provided in the substrate layer 202, and at least one connection hole 50 is provided at each end of each second signal line 60, and the orthographic projections of the connection holes 50 located at both ends of the same second signal line 60 on the first wiring layer 201 are located on the first signal line 40 and the third pin 30 respectively, that is, one end of each connection hole 50 is connected to the second signal line 60, and the other end thereof is connected to the first signal line 40 or the third pin 30. The second signal line 60 covers and fills the corresponding connection hole 50, so as to realize electrical connection with the corresponding first signal line 40 and the third pin 30 through the connection hole 50. Preferably, the orthographic projection of the connection hole 60 on the third pin 30 is located on the third transmission portion 32. The first signal line 40 and the third pin 30 are bridged by the corresponding second signal line 60, thereby preventing the first pin 10 originally electrically connected to the second pin 20 from being electrically connected to the third pin 30 and causing a short circuit after the circuit board 200 is displaced. Even if a displacement occurs, the first pin 10 corresponding to the second pin 20 will only contact the surface of the substrate layer between the first signal line 40 and the third pin 30 and become disconnected, thereby reducing the risk of burns to the display panel 100 and the circuit board 200 due to a short circuit.

[0048] Specifically, Figure 5 As shown in , each first pin 10 has a first crimping portion 11 and two first transmission portions 12 electrically connected to the first crimping portion 11. The first crimping portion 11 is arranged between the two first transmission portions 12, and the first crimping portion 11 and the first transmission portion 12 are arranged along the second direction Y. Among them, the first crimping portion 11 is used to crimp with the second pin 20 or the third pin 30 in the circuit board 200, and the first transmission portion 12 is used to connect with the wiring in the display panel 100 and transmit electrical signals. Further, the width of the first crimping portion 11 in the first direction X is greater than the width of the first transmission portion 12 in the first direction X, thereby increasing the crimping area between the first pin 10 and the second pin 20 or the third pin 30, thereby improving the crimping stability between the display panel 100 and the circuit board 200, and at the same time, the larger crimping area can also increase the tolerance rate of displacement during crimping, reduce the accuracy requirements and error rate of crimping, thereby reducing the risk of abnormal signal transmission caused by crimping errors between the first pin 10 and the second pin 20, and thereby reducing the risk of burns caused by crimping offset.

[0049] like Figure 6As shown in , each second pin 20 has a second crimping portion 21 and a second transmission portion 22 electrically connected to the second crimping portion 21. The second crimping portion 21 corresponds to the first crimping portion 11, one end of the second transmission portion 22 is electrically connected to the first crimping portion 11, and the other end thereof is electrically connected to the driving circuit 70 in the circuit board 200. Among them, the second crimping portion 21 is used for crimping with the first crimping portion 11, and the second transmission portion 22 is used to connect the second crimping portion 21 with the driving circuit 70 in the driving circuit 70, thereby realizing signal transmission between the circuit board 200 and the display panel 100. Furthermore, the width of the second crimping portion 21 in the first direction X is greater than the width of the second transmission portion 22 in the first direction X, thereby further increasing the crimping area between the first pin 10 and the second pin 20, and at the same time, it can also reduce the metal wear generated by the second pin 20 during crimping, and improve the number of repeated uses and service life of the circuit board 200. Preferably, the orthographic projection of the second crimping portion 21 on the display panel 100 at least partially overlaps with the orthographic projection of the corresponding first crimping portion 11 on the display panel 100, and the orthographic projection of the second transmission portion 22 on the display panel 100 at least partially overlaps with the orthographic projection of the corresponding first transmission portion 12 on the display panel 100, so that accurate signals can be transmitted between the first pin 10 and the second pin 20 in a normal crimping state. Optionally, the orthographic projection of the second crimping portion 21 on the display panel 100 is located within the orthographic projection range of the corresponding first crimping portion 11 on the display panel 100.

[0050] Each third pin 30 has a third crimping portion 31 and a third transmission portion 32 electrically connected to the third crimping portion 31. The third crimping portion 31 corresponds to the first crimping portion 11, one end of the third transmission portion 32 is electrically connected to the third crimping portion 31, and the other end thereof is electrically connected to the second signal line 60 through the connection hole 50 in the substrate layer 202, so that the third pin 30 and the second pin 20 transmit different drive signals. Furthermore, the width of the third crimping portion 31 in the first direction X is greater than the width of the third transmission portion 32 in the first direction X, so as to further increase the crimping area between the first pin 10 and the third pin 30, and at the same time reduce the metal wear generated by the third pin 30 during crimping, thereby increasing the number of reuses and the service life of the circuit board 200. Preferably, the orthographic projection of the third crimping portion 31 on the display panel 100 overlaps at least partially with the orthographic projection of the corresponding first crimping portion 11 on the display panel 100, and the orthographic projection of the third transmission portion 32 on the display panel 100 overlaps with the orthographic projection of the corresponding first transmission portion 12 on the display panel 100, so that accurate signals can be transmitted between the first pin 10 and the third pin 30 in a normal crimping state. Optionally, the orthographic projection of the third crimping portion 31 on the display panel 100 is located within the orthographic projection range of the corresponding first crimping portion 11 on the display panel 100.

[0051] Furthermore, the spacing between the first crimping portion 11 corresponding to the second pin 20 and the display area AA is greater than the spacing between the first crimping portion 11 corresponding to the third pin 30 and the display area AA, which causes the first crimping portions 11 of two adjacent first pins 10 to be arranged in a staggered manner, so that when an offset occurs between the first pin 10 and the second pin 20 and the third pin 30, the phenomenon of simultaneously connecting different pins (i.e., the same first pin 10 is electrically connected to the second pin 20 and the third pin 30 at the same time) will not occur, and there is more room for error tolerance. Furthermore, the staggered first crimping portion 11 also causes the second crimping portion 21 and the third crimping portion 31 corresponding to the first crimping portion 11 to be staggered, i.e., the spacing between the third crimping portion 31 and the drive circuit 70 is greater than the spacing between the second crimping portion 21 and the drive circuit 70, and at the same time, the length of the first signal line 40 in the second direction Y is less than the length of the second pin 20 in the second direction Y.

[0052] In the display module 1 provided in the embodiment of the present invention, the first wiring layer 201 of the circuit board 200 is provided with two pins (i.e., the second pin 20 and the third pin 30) with different connection modes to realize the transmission of different signals. In the display module 1 provided in other embodiments of the present invention, for example Figure 7 and Figure 8 As shown in , the first wiring layer 201 of the circuit board 200 can only be provided with second pins 20 or third pins 30 of different lengths and arranged at intervals, and only electrically connected to the first pin 10 of the display panel 100 through a single connection method, and its connection structure is similar to the display module 1 provided in this embodiment, so it is not described in detail here. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0053] The embodiment of the present invention further provides a display device, which may be an AMOLED display device, comprising the display panel 100 as described above. The display device may be any display device with a display function, such as a mobile phone, a notebook computer, a tablet computer, and the like.

[0054] In the embodiment of the present invention, the pins in the display module are widened and shaped to increase the crimping area between the display panel pins and the circuit board pins, thereby improving the tolerance for offset between the display panel and the circuit board, reducing the risk of abnormal signal transmission or even burns after the crimping offset between the display panel and the circuit board, and reducing the crimping wear between the display panel pins and the circuit board pins, thereby extending the service life of the product. At the same time, in the embodiment of the present invention, the widened parts of the pins in the display module are staggered to prevent the same pin from being electrically connected to two different pins at the same time, thereby further increasing the tolerance for offset between the display panel and the circuit board.

[0055] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display module, characterized in that: include: A display panel having a display area and a non-display area connected to the display area; A circuit board, electrically connected to a non-display area of ​​the display panel; The display panel comprises a first pin, the first pin is located in the non-display area, and the circuit board is electrically connected to the first pin; The first pin includes a first crimping portion and a first transmission portion electrically connected to the first crimping portion, and a width of the first crimping portion is greater than a width of the first transmission portion.

2. The display module according to claim 1, wherein: The circuit board also includes: substrate layer; A first wiring layer, provided on a side of the substrate layer close to the display panel and electrically connected to the first pin; The first wiring layer includes a plurality of second pins, and the second pins are respectively electrically connected to the driving circuit of the circuit board and at least part of the first pins.

3. The display module according to claim 2, wherein: The second pin comprises: a second crimping portion, which is electrically connected to the first crimping portion; a second transmission portion, which is electrically connected to the second crimping portion and the driving circuit; The width of the second crimping portion is greater than the width of the second transmission portion; Preferably, the orthographic projection of the second pressing portion on the display panel at least partially overlaps with the orthographic projection of the corresponding first pressing portion on the display panel; Preferably, the orthographic projection of the second pressing portion on the display panel is located within the orthographic projection range of the corresponding first pressing portion on the display panel.

4. The display module according to claim 3, wherein: The first routing layer further includes: a plurality of first signal lines, one end of which is electrically connected to the driving circuit; a plurality of third pins, arranged in a staggered manner with respect to the second pins and located on a side of the first signal line away from the driving circuit, wherein the third pins are electrically connected to at least some of the first pins; The circuit board also includes: A second wiring layer is provided on a side of the substrate layer away from the first wiring layer; The second wiring layer includes a plurality of second signal lines, and two ends of the second signal lines are electrically connected to the first signal line and the third pin, respectively.

5. The display module according to claim 4, characterized in that: The third pin comprises: a third crimping portion, which is electrically connected to the first crimping portion; A third transmission portion, located at a side of the third crimping portion away from the first signal line, and electrically connected to the third crimping portion; The third pins are arranged along a first direction and extend along a second direction perpendicular to the first direction; In the first direction, the width of the third crimping portion is greater than the width of the third transmission portion; Preferably, the orthographic projection of the third pressing portion on the display panel at least partially overlaps with the orthographic projection of the corresponding first pressing portion on the display panel; Preferably, the orthographic projection of the third pressing portion on the display panel is located within the orthographic projection range of the corresponding first pressing portion on the display panel.

6. The display module according to claim 5, characterized in that: The substrate layer is provided with a plurality of connection holes, the second wiring layer covers and fills the connection holes, and at least one connection hole is respectively provided at both ends of each of the second signal lines; The orthographic projections of the plurality of connection holes corresponding to the same second signal line on the first wiring layer are respectively located on the first signal line and the third pin; Preferably, the orthographic projection of the connecting hole on the third pin is located on the third transmission portion.

7. The display module according to claim 4, characterized in that: The distance between the first pressing portion corresponding to the second pin and the display area is greater than the distance between the first pressing portion corresponding to the third pin and the display area; Preferably, the first crimping portions in two adjacent first pins are arranged in a staggered manner.

8. The display module according to claim 5, wherein: The first signal line and the second pin are arranged one after the other in the first direction and extend along a second direction perpendicular to the first direction; Preferably, in the second direction, the length of the first signal line is shorter than the length of the second pin; Preferably, the distance between the third crimping portion and the driving circuit is greater than the distance between the second crimping portion and the driving circuit.

9. The display module according to claim 4, wherein: The material of the substrate layer includes a flexible insulating material; The materials of the first wiring layer and the second wiring layer include conductive metal; Preferably, the flexible insulating material comprises polyimide.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-9.

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