Wafer boat and semiconductor process equipment

Abstract

The invention discloses a wafer boat and semiconductor process equipment, and belongs to the technical field of semiconductors. The wafer boat comprises a supporting frame, a wafer bearing space is arranged in the supporting frame, the supporting frame is provided with a central axis, and at least three supporting columns are arranged on the supporting frame at intervals in the direction surrounding the central axis and comprise the first supporting column, the second supporting column and the third supporting column. An opening for a wafer transmission device to pass through is formed between the first supporting column and the second supporting column, the opening is communicated with the wafer bearing space and is opposite to the third supporting column, each supporting column is provided with a wafer bearing surface, and the wafer bearing surfaces of the supporting columns can support the same wafer in the wafer bearing space. And the wafer bearing surface of the first supporting column and the wafer bearing surface of the second supporting column respectively extend along the direction surrounding the central axis. The semiconductor process equipment comprises a wafer transmission device and the wafer boat, wherein the wafer transmission device is used for taking and placing the wafer from the wafer boat. Therefore, the bearing stability of the wafer is improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a wafer boat and semiconductor process equipment. Background Art

[0002] In the field of semiconductor technology, a wafer boat is a device that directly contacts the wafer when the semiconductor process equipment is processing the wafer. The wafer boat is a key component of the semiconductor process equipment and directly affects the process quality of the wafer.

[0003] In the related art, the wafer boat used in semiconductor process equipment is a three-column short-tooth boat, that is, the three-column short-tooth boat is provided with three columns along the circumference, and each column has multiple tooth grooves along the vertical direction, and the wafer boat relies on the tooth grooves to carry the edge of the wafer. However, when the wafer boat carries the wafer, it is easy for the wafer to shift position due to the influence of the airflow during the process, and it is easy to warp under high temperature conditions, especially for thinned wafers (thickness is about 0.08mm). Since the thinned wafer is very thin, it is more likely to be affected by the airflow and shift position, and it is also more likely to warp under high temperature conditions, causing the wafer to collide and scratch with the wafer boat when the wafer transfer device transfers the wafer, affecting the wafer transfer process, and then affecting the wafer process effect, and even causing the wafer to be scrapped, reducing the wafer yield. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a wafer boat and semiconductor process equipment, which can solve the problem of wafer warping and position shifting in the related art.

[0005] In a first aspect, an embodiment of the present application provides a wafer boat, comprising a support frame, wherein a wafer carrying space is provided inside the support frame, and the support frame has a central axis, and the support frame is provided with at least three support columns spaced apart in a direction surrounding the central axis, wherein the support column comprises a first support column, a second support column, and a third support column, wherein an opening for a wafer transmission device to pass through is formed between the first support column and the second support column, the opening is communicated with the wafer carrying space, and the opening is opposite to the third support column, Each of the support columns is provided with a wafer carrying surface, and the wafer carrying surface of each of the support columns can support the same wafer in the wafer carrying space, and the wafer carrying surface of the first support column and the wafer carrying surface of the second support column extend respectively in a direction surrounding the central axis.

[0006] In the embodiment of the present application, the support frame of the wafer boat is provided with at least three support columns, and the wafer bearing surfaces of the multiple support columns simultaneously support the same wafer to ensure the bearing stability of the wafer. In the process that the wafer transmission device carries the wafer and enters the wafer bearing space through the opening, the wafer bearing surface of the first support column and the wafer bearing surface of the second support column located on both sides of the opening respectively support the wafer from both sides of the wafer to ensure the force balance of the wafer, and the wafer bearing surface of the first support column and the wafer bearing surface of the second support column respectively extend in the direction of surrounding the central axis, and the central axis corresponds to the center of the wafer, then, in the circumferential direction of the wafer, the contact area between the wafer bearing surface of the first support column and the wafer increases, and the contact area between the wafer bearing surface of the second support column and the wafer increases, and the stability of the wafer bearing surface carrying the wafer is further improved, effectively avoiding the position displacement of the wafer due to airflow, and effectively avoiding the warping of the wafer under high temperature conditions, avoiding the collision and scratching of the wafer with the wafer boat when the wafer transmission device transmits the wafer, ensuring the process effect of the wafer, and improving the yield of the wafer.

[0007] Optionally, in the height direction of the support frame, each support column is respectively provided with a plurality of tooth grooves at intervals, the groove wall surface of each tooth groove serves as the wafer bearing surface, and the tooth grooves of each support column correspond one by one to enable the support frame to support a plurality of wafers.

[0008] With such arrangement, each support column directly opens a tooth groove to form a wafer bearing surface, and the support column no longer needs to be provided with a plurality of protruding structures to form a wafer bearing surface, which is conducive to simplifying the support column and also conducive to simplifying the structure of the wafer boat.

[0009] Optionally, the support frame is provided with a guide hole, the guide hole extends along the circumference of the support frame, and the guide hole is located between two adjacent support columns.

[0010] In this way, by setting up guide holes, the cooling gas entering the wafer carrying space is guided so that the cooling gas flows in a direction parallel to the surface of the wafer, thereby preventing the cooling gas generated by the air supply device from exerting a large force on the wafer, thereby preventing the wafer from being displaced due to airflow.

[0011] Optionally, a plurality of the guide holes are arranged at intervals in the height direction of the support frame.

[0012] With such an arrangement, the number of guide holes increases in the height direction of the support frame. Then, each guide hole guides the cooling gas entering different areas of the wafer bearing space respectively, which is beneficial to improving the guide effect, further avoiding the cooling gas from exerting force on the wafer, thereby avoiding position shift of the wafer, and is more beneficial to improving the bearing stability of the wafer.

[0013] Optionally, in the height direction of the support frame, each of the support columns is respectively spaced apart from each other by a plurality of the wafer carrying surfaces, and the wafer carrying surfaces of each of the support columns correspond one to one, so that the support frame supports a plurality of the wafers, and the guide hole is located between two adjacent wafer carrying surfaces, and the distance between the guide hole and the adjacent wafer carrying surface above it is a first distance, and the distance between the guide hole and the adjacent wafer carrying surface below it is a second distance, and the second distance is greater than the first distance.

[0014] With such arrangement, when the wafer carrying surface carries a wafer, since the guide hole is closer to the wafer located above it, the gas flow rate on the lower surface of the wafer is greater than the gas flow rate on the upper surface of the wafer. Therefore, the air pressure on the lower surface of the wafer is lower than the air pressure on the upper surface of the wafer, so that a pressure difference is formed between the upper and lower surfaces of the same wafer. The wafer is subjected to vertical downward pressure, which is conducive to the wafer being stably located on the wafer carrying surface and reducing the risk of wafer slippage.

[0015] Optionally, a central angle corresponding to the wafer carrying surface of at least one of the first supporting column and the second supporting column is greater than 25°.

[0016] With such an arrangement, the extension length of the wafer carrying surface of at least one of the first support column and the second support column is further increased. Then, when the wafer boat carries the wafer, the contact area and support area between the wafer carrying surface and the edge of the wafer are larger in the circumferential direction of the wafer, which is more conducive to improving the carrying stability of the wafer.

[0017] Optionally, at least two third support columns are arranged at intervals along a direction surrounding the central axis.

[0018] With such an arrangement, the number of third support pillars increases, and thus the number of wafer bearing surfaces supporting the same wafer increases. In the circumferential direction of the wafer, the contact area between the support pillars and the wafer is further enlarged, which is more conducive to improving the bearing stability of the wafer.

[0019] In a second aspect, an embodiment of the present application further provides a semiconductor process equipment, including a wafer transfer device and the above-mentioned wafer boat, wherein the wafer transfer device is used to take and place the wafer from the wafer boat.

[0020] With such an arrangement, the wafer boat of the semiconductor process equipment adopts a first support column and a second support column of a special structure, so that in the circumferential direction of the wafer, the contact area between the wafer bearing surface of the first support column and the wafer is increased, and the contact area between the wafer bearing surface of the second support column and the wafer is increased, which is beneficial to improving the bearing stability of the wafer, effectively avoiding position displacement of the wafer due to airflow, and effectively avoiding warping of the wafer under high temperature conditions.

[0021] Optionally, the wafer transfer device comprises a first supporting arm and a second supporting arm opposite to each other, wherein the first supporting arm and the second supporting arm support the same wafer. The opening is provided with a first edge and a second edge. In the width direction of the opening, there is a third distance between the first edge and the third support column, and there is a fourth distance between the second edge and the third support column. The third distance is greater than the width of the first support arm, and the fourth distance is greater than the width of the second support arm.

[0022] With such arrangement, when the wafer transfer device extends into the wafer carrying space, the first support arm moves within the range corresponding to the third distance, and the second support arm moves within the range corresponding to the fourth distance. Therefore, the third distance is greater than the width of the first support arm, and the fourth distance is greater than the width of the second support arm. This is conducive to the first support arm moving smoothly within the range corresponding to the third distance without colliding with the third support column, and is also conducive to the second support arm moving smoothly within the range corresponding to the fourth distance without colliding with the third support column, which is more conducive to the wafer transfer device to smoothly transfer the wafer.

[0023] Optionally, the semiconductor process equipment further includes a process door and an air supply device, wherein the process door is connected to the wafer boat, and the process door can drive the wafer boat to switch between a first rotation position and a second rotation position, and the support frame is provided with a guide hole, and the guide hole extends along the circumference of the support frame. When the wafer boat is located at the first rotation position, the opening faces the wafer transfer device; When the wafer boat is located at the second rotation position, the air guide hole faces the air supply device.

[0024] By switching the rotation position of the wafer boat through the process door, the opening can be directly opposite to the wafer transmission device during the process of transferring the wafer, and the guide hole can be directly opposite to the air supply device during the cooling process. This setting can not only improve the transmission efficiency of the wafer transmission device, but also improve the guiding effect of the guide hole on the cooling gas, effectively avoiding the deviation of the wafer during the cooling process, which is conducive to improving the yield of the wafer and improving the production efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic diagram of the structure of a wafer boat disclosed in one embodiment of the present application; Figure 2 is a front view of a wafer boat disclosed in an embodiment of the present application; Figure 3 is a cross-sectional view of a wafer boat disclosed in one embodiment of the present application; Figure 4 It is a partial structural schematic diagram of a wafer boat disclosed in an embodiment of the present application; Figure 5 is a schematic structural diagram of a wafer boat disclosed in another embodiment of the present application; Figure 6 is a front view of a wafer boat disclosed in another embodiment of the present application; Figure 7 is a cross-sectional view of a wafer boat disclosed in another embodiment of the present application; Figure 8 is a schematic structural diagram of a wafer boat disclosed in another embodiment of the present application; Fig. 9 is a partial cross-sectional view of a wafer boat disclosed in yet another embodiment of the present application; Fig.10 It is one of the partial structural schematic diagrams of a wafer boat disclosed in another embodiment of the present application; Fig.11 This is the second partial structural schematic diagram of a wafer boat disclosed in another embodiment of the present application; Fig.12 This is the third partial structural schematic diagram of a wafer boat disclosed in another embodiment of the present application; Fig.13 This is the fourth partial structural schematic diagram of a wafer boat disclosed in another embodiment of the present application; Fig.14 is a schematic diagram of cooperation between a wafer boat and a wafer transfer device disclosed in another embodiment of the present application; Figure 15-16 They are respectively schematic diagrams of cooperation between a wafer boat and a wafer disclosed in another embodiment of the present application; Fig.17 is a structural schematic diagram of a semiconductor process equipment disclosed in an embodiment of the present application when the wafer boat is located at a first rotation position; Fig.18 is a top view of the semiconductor process equipment disclosed in an embodiment of the present application when the wafer boat is located at a first rotation position; Fig.19 is a structural schematic diagram of a semiconductor process equipment disclosed in an embodiment of the present application when the wafer boat is located at a second rotation position; Fig. 20 It is a top view of the semiconductor process equipment disclosed in an embodiment of the present application when the wafer boat is located at the second rotation position.

[0026] Description of reference numerals: 10-Jingzhou, 100-support frame, 110-support body, 111-guiding hole, 120-top plate, 130-bottom plate, 131-connecting hole, a-opening, 200-support column, 201-first support column, 202-second support column, 203-third support column, 210-tooth groove, 211-wafer bearing surface, S-wafer, 20-Craft door, 30-wafer transfer device, 31-first support arm, 32-second support arm, 30a-support area, 40-Wafer container opening device, 51-air supply device, 52-air duct, 60-chassis, 61-microenvironment, 70- reaction chamber, 80-Heating device. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0028] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0029] The wafer boat and semiconductor process equipment provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0030] Please refer to Figure 1-Figure 20 The wafer boat 10 disclosed in the embodiment of the present application is used to carry the wafer S. When the semiconductor process equipment is processing the wafer S, the wafer boat 10 is a device that directly contacts the wafer S.

[0031] The wafer boat 10 includes a support frame 100, which is the main component of the wafer boat 10 and the installation base of other components of the wafer boat 10. Optionally, the support frame 100 can be an annular structure or a columnar structure, and the embodiment of the present application does not limit the specific structure of the support frame 100.

[0032] The support frame 100 is provided with a wafer bearing space inside, and the support frame 100 is provided with a central axis. When the support frame 100 carries the wafer S, the central axis of the support frame 100 corresponds to the center position of the wafer S. The support frame 100 is provided with at least three support columns 200 at intervals along the direction surrounding the central axis, and each support column 200 is provided with a wafer bearing surface 211. The wafer bearing surface 211 of each support column 200 can support the same wafer S in the wafer bearing space. Optionally, each support column 200 can be a convex structure, and the surface of the convex structure forms the wafer bearing surface 211, or each support column 200 is provided with a groove, and the groove wall surface of the groove forms the wafer bearing surface 211. In this way, the support frame 100 is provided with a plurality of support columns 200 along the circumference of the wafer S, and the wafer bearing surfaces 211 of the plurality of support columns 200 respectively and simultaneously support different positions of the same wafer S to ensure the bearing stability of the wafer S.

[0033] The support frame 100 is provided with a plurality of support columns 200, including a first support column 201, a second support column 202 and a third support column 203. Figure 3 and Figure 7 As shown, an opening a for the wafer transfer device 30 to pass through is formed between the first supporting column 201 and the second supporting column 202 , the opening a is communicated with the wafer carrying space, and the opening a is opposite to the third supporting column 203 .

[0034] In this way, when the wafer transfer device 30 carries the wafer S and enters the wafer carrying space through the opening a, the wafer carrying surface 211 of the first support column 201 and the wafer carrying surface 211 of the second support column 202 located on both sides of the opening a respectively support the wafer S from both sides of the wafer S to ensure the force balance of the wafer S during the transfer process.

[0035] Moreover, the wafer bearing surface 211 of the first support column 201 and the wafer bearing surface 211 of the second support column 202 extend in the direction around the central axis respectively. When the wafer S is located in the wafer bearing space and the wafer bearing surface 211 carries the wafer S, the central axis of the support frame 100 corresponds to the center of the circle of the carried wafer S, so the wafer bearing surface 211 of the first support column 201 and the wafer bearing surface 211 of the second support column 202 extend in the circumferential direction of the wafer S respectively, that is, the wafer bearing surfaces 211 of the first support column 201 and the second support column 202 are both arc-shaped structures.

[0036] Optionally, the extension lengths of the wafer carrying surface 211 of the first supporting column 201 and the wafer carrying surface 211 of the second supporting column 202 may be equal or unequal.

[0037] By adopting this embodiment, in the direction around the central axis, that is, in the circumferential direction of the wafer S, the contact area between the wafer bearing surface 211 of the first support column 201 and the wafer S is increased, and the contact area between the wafer bearing surface 211 of the second support column 202 and the wafer S is increased. The stability of the wafer bearing surface 211 in carrying the wafer S is further improved, and the position displacement of the wafer S due to airflow is effectively avoided, and the warping of the wafer S under high temperature conditions is effectively avoided. When the wafer transfer device 30 transfers the wafer S, the wafer S is prevented from colliding and scratching with the wafer boat 10, thereby ensuring the process effect of the wafer S and improving the yield of the wafer S.

[0038] The wafer boat 10 is more conducive to carrying a thinned wafer S (with a thickness of about 0.08 mm). Since the thickness of the thinned wafer S is relatively small, the carrying stability can only be effectively guaranteed by supporting the edge of the thinned wafer S. However, it is difficult to maintain the stability of the thinned wafer S by only increasing the supporting area in the radial direction or other directions of the thinned wafer S. Therefore, increasing the contact area and the supporting area from the circumferential direction of the wafer S can effectively improve the carrying stability of the thinned wafer S.

[0039] Optionally, refer to Figure 1-Figure 2 As shown, the support frame 100 includes a support body 110, a bottom plate 130 and a top plate 120, the bottom plate 130 and the top plate 120 are respectively connected to the bottom end and the top end of the support body 110, the support body 110, the bottom plate 130 and the top plate 120 are together surrounded to form a wafer bearing space, the opening a is set in the support body 110, and the support body 110 can be an arc-shaped structure. Further optionally, the bottom plate 130 and the bottom end of the support body 110 can be connected by welding, bonding, etc., and the top plate 120 and the bottom and top ends of the support body 110 can be connected by welding, bonding, etc.; refer to Figure 3 and Figure 7 As shown, the bottom plate 130 is provided with a plurality of connection holes 131 , and the bottom plate 130 can be fixed to the process door 20 by using the connection holes 131 , so that the wafer boat 10 and the process door 20 are connected.

[0040] In an optional embodiment, in the height direction of the support frame 100, each support column 200 is provided with a plurality of wafer bearing surfaces 211 at intervals, and the wafer bearing surfaces 211 of each support column 200 correspond to each other one by one, so that the support frame 100 supports a plurality of wafers S. Optionally, each support column 200 is a support column 200, the first support column 201 and the second support column 202 are arc-shaped columns, and the third support column 203 can be a square column. Of course, the third support column 203 can also have the same structure as the first support column 201, that is, the third support column 203 is an arc-shaped column; the top end of each support column 200 is connected to the top plate 120, and the bottom end of each support column 200 is connected to the bottom plate 130.

[0041] With such configuration, the number of wafer carrying surfaces 211 of each support column 200 increases, and the wafer boat 10 can simultaneously transport and carry multiple wafers S, and then multiple wafers S simultaneously enter the reaction chamber 70 for processing, which is beneficial to improving process efficiency.

[0042] In a further embodiment, reference Figure 4 and Fig.13 As shown, in the height direction of the support frame 100, each support column 200 is provided with a plurality of tooth grooves 210 at intervals, and the edge of the wafer S can extend into the tooth groove 210, and the groove wall surface of each tooth groove 210 serves as a wafer bearing surface 211, and the tooth grooves 210 of each support column 200 correspond to each other one by one, so that the support frame 100 supports a plurality of wafers S. Moreover, the tooth grooves 210 of the first support column 201 and the tooth grooves 210 of the second support column 202 extend in a direction surrounding the central axis, so that the tooth grooves 210 of the first support column 201 and the tooth grooves 210 of the second support column 202 are arc-shaped, thereby forming an arc-shaped wafer bearing surface 211.

[0043] Optionally, the tooth groove 210 may be a square groove, and the tooth groove 210 includes a groove top wall, a groove side wall and a groove bottom wall which are connected in sequence, the groove top wall is opposite to the groove bottom wall, and the groove bottom wall serves as a wafer carrying surface 211 .

[0044] It should be noted that when the wafer S is located in the wafer carrying space and the wafer carrying surface 211 carries the wafer S, the height direction of the support frame 100 is the thickness direction of the wafer S.

[0045] In this embodiment, each support column 200 directly opens a tooth groove 210 to form a wafer carrying surface 211. The support column 200 does not need to be provided with multiple protrusion structures to form the wafer carrying surface 211, which is conducive to simplifying the support column 200 and the structure of the wafer boat 10.

[0046] In the scheme of this application, reference is made to Figure 8-Figure 13 As shown, the support frame 100 is provided with a guide hole 111, which is a strip-shaped structure, extends along the circumference of the support frame 100, and is located between two adjacent support columns 200. Optionally, the guide hole 111 is provided on the support body 110, and in an embodiment in which the support body 110 is an arc-shaped structure, the guide hole 111 may be an arc-shaped hole, and in an embodiment in which the support body 110 is a square structure with an opening a, the guide hole 111 may be a linear strip-shaped hole. In short, the guide hole 111 extends in the horizontal direction.

[0047] Optionally, the guide hole 111 may be provided only between the first support column 201 and the third support column 203 , or only between the second support column 202 and the third support column 203 , or between any two adjacent support bodies 110 .

[0048] Semiconductor process equipment usually uses an air supply device 51 to generate cooling gas, and the cooling gas flows to the wafers S carried by the wafer boat 10 to cool the wafers S. In this embodiment, by providing the guide holes 111, the cooling gas entering the wafer carrying space is guided so that the cooling gas flows in a direction parallel to the surface of the wafer S, thereby preventing the cooling gas from exerting a large force on the wafer S, thereby preventing the wafer S from being displaced due to the airflow.

[0049] Of course, in other embodiments, the support frame 100 may not be provided with the guide hole 111, and the cooling gas blown out by the air supply device 51 may be controlled to flow in a horizontal direction.

[0050] In an optional embodiment, only one guide hole 111 may be provided between two adjacent support columns 200. Optionally, one guide hole 111 is provided between the first support column 201 and the third support column 203, and one guide hole 111 is provided between the second support column 202 and the third support column 203.

[0051] In another embodiment, a plurality of guide holes 111 are arranged at intervals in the height direction of the support frame 100. When the wafer boat 10 carries the wafer S, the height direction of the support frame 100 is the thickness direction of the wafer S. Optionally, a plurality of guide holes 111 may be provided only between the first support column 201 and the third support column 203, or a plurality of guide holes 111 may be provided only between the second support column 202 and the third support column 203, or a plurality of guide holes 111 may be provided between any two adjacent support columns 200; the extension lengths of the guide holes 111 may be equal or unequal, and the structures of the guide holes 111 may be the same or different.

[0052] By adopting this embodiment, the number of the guide holes 111 is increased in the height direction of the support frame 100. Then, each guide hole 111 guides the cooling gas entering different areas in the wafer bearing space respectively, which is beneficial to improving the guide effect, further avoiding the cooling gas from exerting force on the wafer S, thereby avoiding the position shift of the wafer S, and is more beneficial to improving the bearing stability of the wafer S.

[0053] In a further embodiment, in the height direction of the support frame 100, each support column 200 is provided with a plurality of wafer bearing surfaces 211 at intervals, and the wafer bearing surfaces 211 of each support column 200 correspond to each other one by one, so that the support frame 100 supports a plurality of wafers S. In other words, the support frame 100 supports a plurality of wafers S at the same time, and the height direction of the support frame 100 is the arrangement direction of the wafers S, so in the arrangement direction of the wafers S, a plurality of guide holes 111 are provided at intervals.

[0054] With such an arrangement, the cooling gas entering the wafer carrying space flows horizontally toward different wafers S through the guiding effect of the multiple guide holes 111, thereby preventing the cooling gas in different areas from exerting force on each wafer S respectively, effectively preventing the position of each wafer S from being shifted, and helping to improve the carrying stability of each wafer S.

[0055] In an optional embodiment, reference Fig.13 As shown, in the height direction of the support frame 100, the width of the guide hole 111 is H, the distance between two adjacent wafer bearing surfaces 211 is P, the guide hole 111 is located between two adjacent wafer bearing surfaces 211, and the distance between the guide hole 111 and the adjacent wafer bearing surface 211 above it is a first distance H1, and the distance between the guide hole 111 and the adjacent wafer bearing surface 211 below it is a second distance H2, and the second distance H2 is less than or equal to the first distance H1. Wherein, the distance P = the width H of the guide hole 111 + the first distance H1 + the second distance H2.

[0056] In another embodiment, the second distance H2 is greater than the first distance H1. That is, the guide hole 111 is closer to the wafer supporting surface 211 above it, that is, the guide hole 111 is closer to the lower surface of the wafer S above it and farther from the upper surface of the wafer S below it.

[0057] With this embodiment, when the wafer carrying surface 211 carries the wafer S, since the guide hole 111 is closer to the wafer S located above it, the gas flow rate on the lower surface of the wafer S is greater than the gas flow rate on the upper surface of the wafer S. Therefore, the air pressure on the lower surface of the wafer S is less than the air pressure on the upper surface of the wafer S, so that a pressure difference is formed between the upper and lower surfaces of the same wafer S. The wafer S is subjected to vertical downward pressure, which is conducive to the wafer S being stably located on the wafer carrying surface 211 and reducing the risk of the wafer S slipping.

[0058] In an alternative embodiment, reference Fig.15 As shown, in the radial direction of the support frame 100, the size of the wafer bearing surface 211 is less than 15 mm. When the support frame 100 carries the wafer S, the radial direction of the support frame 100 is the radial direction of the wafer S, and the radial direction of the support frame 100 is perpendicular to the central axis, that is, in the radial direction of the wafer S, the size of the wafer bearing surface 211 is small, so the wafer bearing surface 211 is far from the central axis. Optionally, in the radial direction of the support frame 100, the size of the wafer bearing surface 211 of each support column 200 is less than 15 mm.

[0059] It should be noted that, in the radial direction of the support frame 100, the size of the wafer bearing surface 211 is not infinitely small. Optionally, in the radial direction of the support frame 100, the size range of the wafer bearing surface 211 is 5mm-15mm, or 10mm-15mm. Of course, it can also be a size range between other sizes (less than 15mm) and 15mm. In other words, in the radial direction of the support frame 100, the size of the wafer bearing surface 211 is within a certain size range to ensure that the edge of the wafer S can overlap the wafer bearing surface 211, so that the wafer bearing surface 211 can smoothly carry the wafer S.

[0060] In the radial direction of the wafer S, when the contact area between the wafer bearing surface 211 and the wafer S is large, if the wafer S is warped, the warped position of the wafer S is prone to friction or collision with the support column 200. In this embodiment, since the wafer bearing surface 211 is far from the central axis, and the central axis corresponds to the center of the wafer S, when the wafer bearing surface 211 carries the wafer S, the wafer bearing surface 211 is also far from the center of the wafer S. Then, in the radial direction of the wafer S, the contact area between the wafer bearing surface 211 and the wafer S is small. When the wafer S is warped, the warped position is not prone to friction or collision with the support column 200. At the same time, since the contact area between the wafer S and the wafer bearing surface 211 is large in the circumferential direction of the wafer S, the bearing stability of the wafer S will not be affected.

[0061] Of course, in other embodiments, in the radial direction of the support frame 100 , the size of the wafer carrying surface 211 may be greater than or equal to 15 mm.

[0062] In an optional embodiment, along the direction around the central axis, a central angle α corresponding to the wafer carrying surface 211 of at least one of the first supporting column 201 and the second supporting column 202 is smaller than 25°.

[0063] In another embodiment, reference Fig.16 As shown, along the direction around the central axis, the central angle α corresponding to the wafer carrying surface 211 of at least one of the first supporting column 201 and the second supporting column 202 is greater than 25°.

[0064] With this embodiment, the extension length of the wafer carrying surface 211 of at least one of the first support column 201 and the second support column 202 is further increased. Then, when the wafer boat 10 carries the wafer S, in the circumferential direction of the wafer S, the contact area and support area between the wafer carrying surface 211 and the edge of the wafer S are larger, which is more conducive to improving the carrying stability of the wafer S.

[0065] In an optional embodiment, reference Figure 1-Figure 4 As shown, the number of the third supporting column 203 is one.

[0066] In another embodiment, reference Figure 5-Figure 7 As shown, along the direction around the central axis, at least two third support columns 203 are arranged at intervals. Optionally, the number of the third support columns 203 is two, each of the third support columns 203 is a square column, each of the third support columns 203 is respectively provided with a plurality of tooth grooves 210 along the height direction of the support frame 100 to form a plurality of wafer bearing surfaces 211, and a plurality of guide holes 111 are provided between two adjacent third support columns 203.

[0067] By adopting this embodiment, the number of third support pillars 203 increases, so the number of wafer carrying surfaces 211 supporting the same wafer S increases. In the circumferential direction of the wafer S, the contact area between the support pillars 200 and the wafer S is further increased, which is more conducive to improving the bearing stability of the wafer S.

[0068] Based on the crystal boat 10 disclosed in this application, refer to Figure 17-Figure 20 As shown, the embodiment of the present application further discloses a semiconductor process equipment, which includes a wafer transfer device 30 and the wafer boat 10 in the above embodiment, and the wafer transfer device 30 is used to take and place wafers S from the wafer boat 10. The wafer transfer device 30 can be but is not limited to a robot.

[0069] Optionally, refer to Fig.16 As shown, the width of the opening a is X, and the width X of the opening a is greater than the width of the wafer transfer device 30, so as to ensure that the wafer transfer device 30 passes through the opening a smoothly, and avoids the wafer transfer device 30 from colliding with the first support column 201 and the second support column 202. Moreover, the distance Y between the groove sidewalls of the tooth groove 210 of the first support column 201 and the groove sidewalls of the tooth groove 210 of the second support column 202 is greater than the diameter of the wafer S, so as to ensure that the two side edges of the wafer S are smoothly extended into the tooth groove 210 of the first support column 201 and the tooth groove 210 of the second support column 202, respectively, and avoids the edge of the wafer S from colliding with the first support column 201 and the second support column 202.

[0070] In this embodiment, the wafer boat 10 of the semiconductor process equipment adopts a first support column 201 and a second support column 202 with a special structure, so that in the circumferential direction of the wafer S, the contact area between the wafer bearing surface 211 of the first support column 201 and the wafer S is increased, and the contact area between the wafer bearing surface 211 of the second support column 202 and the wafer S is increased, which is beneficial to improve the bearing stability of the wafer S, effectively avoid the position displacement of the wafer S due to airflow, and effectively avoid the warping of the wafer S under high temperature conditions.

[0071] In an alternative embodiment, reference Fig.14As shown, the wafer transfer device 30 includes a first supporting arm 31 and a second supporting arm 32 relative to each other, and the first supporting arm 31 and the second supporting arm 32 support the same wafer S. Specifically, two supporting areas 30 a are respectively provided at the front end and the rear end of the first supporting arm 31 and the second supporting arm 32, and the four supporting areas 30 a are relied on to support different positions of the same wafer S, so as to ensure that the wafer transfer device 30 transfers the wafer S stably.

[0072] refer to Fig.16 As shown, the opening a is provided with a first edge and a second edge. In the width direction of the opening a, there is a third distance X1 between the first edge and the third support column 203, and there is a fourth distance X2 between the second edge and the third support column 203. The third distance X1 is greater than the width of the first support arm 31, and the fourth distance X2 is greater than the width of the second support arm 32.

[0073] Optionally, the width of the first support arm 31 and the width of the second support arm 32 may be 5 mm, and the third distance X1 and the fourth distance X2 are respectively greater than 5 mm. Of course, the third distance X1 and the fourth distance X2 may also be greater than other values.

[0074] By adopting this embodiment, when the wafer transfer device 30 extends into the wafer carrying space, the first support arm 31 moves within the range corresponding to the third distance X1, and the second support arm 32 moves within the range corresponding to the fourth distance X2. Therefore, the third distance X1 is greater than the width of the first support arm 31, and the fourth distance X2 is greater than the width of the second support arm 32. This is conducive to the first support arm 31 to move smoothly within the range corresponding to the third distance X1 without colliding with the third support column 203, and is also conducive to the second support arm 32 to move smoothly within the range corresponding to the fourth distance X2 without colliding with the third support column 203, which is more conducive to the wafer transfer device 30 to smoothly transfer the wafer S.

[0075] In this embodiment, the number of third support columns 203 is two. In the width direction of the opening a, the third distance X1 is the distance between the first edge and the third support column 203 adjacent to the first support column 201, and the fourth distance X2 is the distance between the second edge and the third support column 203 adjacent to the second support column 202.

[0076] In an alternative embodiment, reference Fig.17 and Fig.19As shown, the semiconductor process equipment also includes a process door 20 and an air supply device 51, wherein the process door 20 is connected to the wafer boat 10, and the process door 20 can drive the wafer boat 10 to switch between a first rotation position and a second rotation position. Optionally, the process door 20 can be connected to the bottom plate 130 of the wafer boat 10 by welding, bonding, etc.; the air supply device 51 is used to generate cooling gas, and the air supply device 51 can be but is not limited to a fan. Moreover, the support frame 100 is provided with a guide hole 111, and the guide hole 111 is a strip structure. The guide hole 111 extends along the circumference of the support frame 100, that is, the guide hole 111 extends in the horizontal direction, and the cooling gas can enter the interior of the wafer boat 10 through the guide hole 111.

[0077] refer to Fig.17 and Fig.18 As shown, when the wafer boat 10 is located at the first rotation position, the opening a faces the wafer transfer device 30, and the wafer transfer device 30 takes and places the wafer S from the wafer boat 10; Fig.19 and Fig. 20 As shown, when the wafer boat 10 is located at the second rotation position, the guide hole 111 faces the air supply device 51, and the cooling gas generated by the air supply device 51 enters the interior of the wafer boat 10 through the guide hole 111 to cool the wafer S carried by the wafer boat 10. Under the guiding effect of the guide hole 111, the cooling gas flows in a horizontal direction.

[0078] Optionally, the semiconductor process equipment further includes a reaction chamber 70 and a chassis 60. The reaction chamber 70 is used to provide a process environment for the wafer S. The reaction chamber 70 is heated by a heating device 80. The heating device 80 can be, but is not limited to, a furnace body. The chassis 60 is in a microenvironment 61. The reaction chamber 70 is connected to the microenvironment 61 of the chassis 60. The process door 20, the wafer boat 10, and the wafer transfer device 30 are all located in the chassis 60. Fig.17 and Fig.18 As shown, a wafer container opening device 40 is provided inside the chassis 60, and a wafer transfer device 30 is located between the wafer container opening device 40 and the wafer boat 10. The wafer transfer device 30 is used to transfer the wafer S between the wafer container opening device 40 and the wafer boat 10; Fig.19 and Fig. 20 As shown, an air supply device 51 and an air duct 52 are respectively disposed on two opposite sides of the chassis 60 . The cooling gas generated by the air supply device 51 flows into the air duct 52 after passing through the wafer boat 10 .

[0079] Specifically, when the semiconductor process equipment starts the process, the process door 20 first drives the wafer boat 10 to rotate to the first rotation position, so that the wafer transfer device 30 takes the wafer S from the wafer container opening device 40 and transfers it to the wafer boat 10, and then the process door 20 drives the wafer boat 10 to rise into the reaction chamber 70, so that the wafer S undergoes a process in the reaction chamber 70; when the process of the wafer S is completed, the process door 20 drives the wafer boat 10 to descend into the chassis 60, and drives the wafer boat 10 to rotate to the second rotation position, at this time the air supply device 51 is turned on, and the cooling gas generated by the air supply device 51 flows directly to the guide hole 111, under the guide effect of the guide hole 111, the cooling gas flows horizontally to the wafer S in the wafer boat 10, and then flows into the air duct 52; after the cooling process is completed, the process door 20 drives the wafer boat 10 to rotate to the first rotation position again, and the wafer transfer device 30 takes the wafer S from the wafer boat 10 and transfers it to the wafer container opening device 40. The above process is a complete process of the wafer S, and the above process can be repeated.

[0080] By switching the rotation position of the wafer boat 10 through the process door 20, the opening a can be directly opposite to the wafer transmission device 30 during the process of transferring the wafer S, and the guide hole 111 can be directly opposite to the air supply device 51 during the cooling process. Such a setting can not only improve the transmission efficiency of the wafer transmission device 30, but also improve the guide effect of the guide hole 111 on the cooling gas, effectively avoiding the deviation of the wafer S during the cooling process, which is beneficial to improving the yield of the wafer S and improving the production efficiency of the wafer S.

[0081] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A wafer boat, characterized in that: The invention comprises a support frame (100), wherein a wafer carrying space is provided inside the support frame (100), and the support frame (100) has a central axis, and the support frame (100) is provided with at least three support columns (200) spaced apart in a direction around the central axis, wherein the support frame (100) comprises a first support column (201), a second support column (202) and a third support column (203), and an opening (a) for a wafer transfer device (30) to pass through is formed between the first support column (201) and the second support column (202), and the opening (a) is communicated with the wafer carrying space, and the opening (a) is opposite to the third support column (203); Each of the support columns (200) is provided with a wafer carrying surface (211), and the wafer carrying surface (211) of each of the support columns (200) can support the same wafer (S) in the wafer carrying space, and the wafer carrying surface (211) of the first support column (201) and the wafer carrying surface (211) of the second support column (202) respectively extend in a direction surrounding the central axis.

2. The wafer boat according to claim 1, characterized in that: In the height direction of the support frame (100), each of the support columns (200) is provided with a plurality of tooth grooves (210) at intervals, the groove wall surface of each tooth groove (210) serves as the wafer bearing surface (211), and the tooth grooves (210) of each of the support columns (200) correspond to each other one by one, so that the support frame (100) supports a plurality of wafers (S).

3. The wafer boat according to claim 1, characterized in that: The support frame (100) is provided with a guide hole (111), the guide hole (111) extends along the circumference of the support frame (100), and the guide hole (111) is located between two adjacent support columns (200).

4. The wafer boat according to claim 3, characterized in that: In the height direction of the support frame (100), a plurality of the guide holes (111) are arranged at intervals.

5. The wafer boat according to claim 3, characterized in that: In the height direction of the support frame (100), each of the support columns (200) is provided with a plurality of wafer bearing surfaces (211) at intervals, and the wafer bearing surfaces (211) of each of the support columns (200) correspond to each other one by one, so that the support frame (100) supports a plurality of wafers (S), the guide hole (111) is located between two adjacent wafer bearing surfaces (211), and the distance between the guide hole (111) and the wafer bearing surface (211) adjacent thereto is a first distance, and the distance between the guide hole (111) and the wafer bearing surface (211) adjacent thereto is a second distance, and the second distance is greater than the first distance.

6. The wafer boat according to claim 1, characterized in that: The central angle α corresponding to the wafer carrying surface (211) of at least one of the first supporting column (201) and the second supporting column (202) is greater than 25°.

7. The wafer boat according to claim 1, characterized in that: Along the direction surrounding the central axis, at least two third support columns (203) are arranged at intervals.

8. A semiconductor process equipment, characterized in that: It comprises a wafer transfer device (30) and a wafer boat (10) according to any one of claims 1 to 7, wherein the wafer transfer device (30) is used for taking and placing the wafer (S) from the wafer boat (10).

9. The semiconductor process equipment according to claim 8, characterized in that: The wafer transfer device (30) comprises a first supporting arm (31) and a second supporting arm (32) which are opposite to each other, wherein the first supporting arm (31) and the second supporting arm (32) support the same wafer (S). The opening (a) is provided with a first edge and a second edge, and in the width direction of the opening (a), there is a third distance between the first edge and the third support column (203), and there is a fourth distance between the second edge and the third support column (203), the third distance is greater than the width of the first support arm (31), and the fourth distance is greater than the width of the second support arm (32).

10. The semiconductor process equipment according to claim 9, characterized in that: The semiconductor process equipment further comprises a process door (20) and an air supply device (51), wherein the process door (20) is connected to the wafer boat (10), and the process door (20) can drive the wafer boat (10) to switch between a first rotation position and a second rotation position, and the support frame (100) is provided with a guide hole (111), and the guide hole (111) extends along the circumference of the support frame (100). When the wafer boat (10) is located at the first rotation position, the opening (a) faces the wafer transfer device (30); When the wafer boat (10) is located at the second rotation position, the air guide hole (111) faces the air supply device (51).

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