Cooling channel structure and packaging structure

Abstract

The invention discloses a cooling channel structure and a packaging structure, the cooling channel structure comprises a plurality of turning parts, and at least part of the turning parts comprise turning inlet sections extending in the first direction; the turning outlet section extends in the second direction; the shunting filtering section is positioned between the turning inlet section and the turning outlet section, and is respectively communicated with the turning inlet section and the turning outlet section; a plurality of partition bodies which are arranged in the flow dividing and filtering section in parallel are arranged in the flow dividing and filtering section, the length sizes of the partition bodies are gradually reduced in the direction from the position close to the turning inlet section to the position far away from the turning inlet section, the length sizes of the partition bodies are increased at the positions where the fluid is subjected to large centrifugal force, and then frictional contact between the partition bodies and the fluid is increased. Therefore, the effect of centrifugal force on the fluid is reduced, the pressure of the fluid flowing through all positions of the turning part is approximate, vortexes are reduced, and circulation resistance is further reduced. In addition, as the vortex is reduced, the foreign matters can circulate more smoothly, and the blockage of the turning part is further reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a cooling channel structure and a packaging structure. Background Art

[0002] At present, Moore's Law is slowing down. 2.5D packaging is an on-chip stacking technology that can expand multiple complex chips, allowing the industry to embark on a new path that can surpass Moore's Law, quickly provide large-scale complex chip integration, and reduce power consumption and costs. In order to solve the problem of insufficient wiring density of organic substrates, interposer technology with vertical interconnection through silicon vias (TSV) and high-density metal wiring came into being.

[0003] With the maturity and widespread use of multi-chipset interposer packaging technology, the number of integrated chips on the interposer continues to increase, resulting in a continuous increase in the unit heat density on the substrate; and due to the different heat generation powers of the chips, the heat distribution of the substrate carrying the chips is uneven. If this local heat cannot be dissipated in a targeted and timely manner, it is very likely to reduce the performance of the entire system or even cause the entire system to fail. Although the external cooling heat dissipation structure is mature in structure, its low dissipation efficiency cannot meet the problem of a significant increase in heat density brought about by the continuous increase in integration. Therefore, it is necessary to provide a cooling channel with strong heat dissipation capabilities in a specific area of ​​the interposer.

[0004] However, the cooling channel structure of the interposer in the prior art still has many problems. Summary of the invention

[0005] The technical problem solved by the present invention is to provide a cooling channel structure and a packaging structure to reduce the flow resistance and blockage of the turning part.

[0006] In order to solve the above problems, the present invention provides a cooling channel structure, comprising: a plurality of turning portions, wherein at least part of the turning portions include: a turning inlet section extending along a first direction; a turning outlet section extending along a second direction, the first direction is different from the second direction; a diverter filter section located between the turning inlet section and the turning outlet section, the diverter filter section being respectively connected to the turning inlet section and the turning outlet section; and a plurality of parallel arranged partition bodies arranged in the diverter filter section, the length dimensions of the partition bodies gradually decreasing from the direction close to the turning inlet section to the direction away from the turning inlet section.

[0007] Optionally, the number of the partition bodies is 2N, and the spacing dimension between adjacent partition bodies is 1 / N of the width dimension of the turning entrance section.

[0008] Optionally, the diversion filtration section includes a first inner side wall and a second inner side wall connected to each other, the first inner side wall is connected to the turning inlet section, the second inner side wall is connected to the turning outlet section, and the angle between the first inner side wall and the second inner side wall is an obtuse angle.

[0009] Optionally, a plurality of partition segments are respectively parallel to the first inner side wall.

[0010] Optionally, when the first direction is perpendicular to the second direction, the cooling liquid in the turning entrance section has a first flow direction, the cooling liquid between adjacent partition bodies has a second flow direction, and the angle between the first flow direction and the second flow direction is an obtuse angle.

[0011] Optionally, along the extension direction of the partition body, the partition body has a first end and a second end opposite to each other, and the first end and the second end are respectively convex pointed structures.

[0012] Correspondingly, the technical solution of the present invention also provides a packaging structure, including: a substrate; an intermediary layer located on the substrate, the intermediary layer having a cooling channel structure described in any of the above technical solutions; and a plurality of chips located on the intermediary layer, the chips being electrically connected to the intermediary layer and the substrate respectively.

[0013] Optionally, a metal interconnection structure is provided in the interposer, and the metal interconnection structure is used for high-speed signal transmission between the chips.

[0014] Optionally, it also includes: a plurality of through silicon via structures, wherein the through silicon via structures penetrate the interposer and are electrically connected to the chip and the substrate respectively, and the through silicon via structures are used to transmit external signals of the chip to the substrate.

[0015] Optionally, the material of the intermediate layer includes: silicon.

[0016] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0017] In the cooling channel structure of the technical solution of the present invention, it includes: a flow-dividing filter section located between the turning inlet section and the turning outlet section, the flow-dividing filter section is connected with the turning inlet section and the turning outlet section respectively; a plurality of parallel arranged partition bodies arranged in the flow-dividing filter section, the length of which is gradually reduced from the direction close to the turning inlet section to the direction away from the turning inlet section. Since the fluid closer to the inner side wall of the flow-dividing filter section is subjected to greater centrifugal force, a low-pressure area is formed, and the fluid closer to the outer side wall of the flow-dividing filter section is subjected to less centrifugal force, a high-pressure area is formed, and the pressure difference between the high-pressure area and the low-pressure area makes it easy for the fluid to form vortices, thereby increasing the flow resistance. Therefore, by setting the length of the partition body to gradually reduce from the direction close to the turning inlet section to the direction away from the turning inlet section, the length of the partition body is increased at the position where the fluid is subjected to greater centrifugal force, thereby increasing the friction contact between the partition body and the fluid, thereby reducing the effect of centrifugal force on the fluid, so that the pressure of the fluid at each position flowing through the turning portion is similar, reducing vortices, and thereby reducing the flow resistance. In addition, since the eddy current is reduced, foreign matter can flow more smoothly, thereby reducing blockage in the turning part.

[0018] Furthermore, the number of the partition bodies is 2N, and the spacing dimension between adjacent partition bodies is 1 / N of the width dimension of the turning inlet section, so that the flow cross-sectional area of ​​the turning portion is larger than the flow cross-sectional area of ​​the turning inlet section, thereby reducing the flow velocity of the fluid in the turning portion, thereby reducing eddy currents and further reducing flow resistance.

[0019] Furthermore, along the extension direction of the partition body, the partition body has a first end and a second end opposite to each other, and the first end and the second end are respectively convex pointed structures. By setting the ends of each partition body to be convex pointed structures, it can play a certain guiding role on the fluid, thereby reducing fluid disturbance.

[0020] In the packaging structure of the technical solution of the present invention, by providing the cooling channel structure in the interposer, the pressure of the fluid flowing through each position of the turning portion can be made similar, thereby reducing eddy currents and thus reducing flow resistance. In addition, due to the reduction of eddy currents, foreign matter can flow more smoothly, thereby reducing blockage of the turning portion and thus effectively improving the heat dissipation effect of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a cooling channel structure;

[0022] Figure 2 is a schematic structural diagram of a cooling channel structure in an embodiment of the present invention;

[0023] Figure 3 It is a structural schematic diagram of a packaging structure in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] As described in the background art, the cooling channel structure of the intermediary layer in the prior art still has many problems, which will be described in detail below with reference to the accompanying drawings.

[0025] Figure 1 It is a structural schematic diagram of a cooling channel structure.

[0026] At present, the chip cooling technology mainly uses air cooling and liquid cooling. Liquid cooling uses liquid (water or other heat-conducting liquid medium) to dissipate heat. Since the thermal conductivity of liquid is greater than that of air, liquid cooling is usually more effective than air cooling. At present, liquid cooling technology uses cooling channels to optimize the heat distribution problem of the interposer. On the one hand, the distribution density of the cooling channel on the silicon substrate is adjusted according to the heat distribution characteristics. On the other hand, the cooling channel uses curved paths to increase the coverage area of ​​the cooling channel to improve the heat conduction effect (such as Figure 1 However, this will increase the length of the cooling channel and increase the number of channel elbows. Even if the right-angle structure of the elbow is changed to an arc, it is difficult to change the bend (such as Figure 1 As shown in the A part of the figure, there is a pressure difference between the inside and outside, which causes the whole liquid to form a vortex, resulting in a larger flow resistance. In addition, foreign matter is usually generated during the preparation and connection of the cooling channel. Due to the existence of the vortex, it is easy to encounter resistance at the bend and block the channel.

[0027] On this basis, the present invention provides a cooling channel structure and a packaging structure. Since the fluid closer to the inner wall of the diverter filter section is subjected to a greater centrifugal force, a low-pressure area is formed, and the fluid closer to the outer wall of the diverter filter section is subjected to a smaller centrifugal force, a high-pressure area is formed. The pressure difference between the high-pressure area and the low-pressure area makes it easy for the fluid to form vortices, thereby increasing the flow resistance. Therefore, by gradually reducing the length of the partition body from the direction close to the turning entrance section to the direction away from the turning entrance section, the length of the partition body is increased at the position where the fluid is subjected to a greater centrifugal force, thereby increasing the frictional contact between the partition body and the fluid, thereby reducing the effect of centrifugal force on the fluid, making the pressure of the fluid at each position of the turning portion similar, reducing vortices, and thereby reducing the flow resistance. In addition, due to the reduction of vortices, foreign matter can flow more smoothly, thereby reducing the blockage of the turning portion.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] Figure 2It is a structural schematic diagram of a cooling channel structure in an embodiment of the present invention.

[0030] Please refer to Figure 2 A cooling channel structure 100 comprises: a plurality of turning portions 101, wherein at least part of the turning portions 101 comprises: a turning inlet section 1011 extending along a first direction X; a turning outlet section 1012 extending along a second direction Y, wherein the first direction X is different from the second direction Y; a diverter filter section 1013 located between the turning inlet section 1011 and the turning outlet section 1012, wherein the diverter filter section 1013 is respectively connected to the turning inlet section 1011 and the turning outlet section 1012; and a plurality of parallelly arranged partition bodies 1014 arranged in the diverter filter section 1013, wherein the length dimensions of the partition bodies 1014 gradually decrease from the direction close to the turning inlet section 1011 to the direction away from the turning inlet section 1011.

[0031] In this embodiment, the closer the fluid is to the inner wall of the diverter filter section 1013, the greater the centrifugal force is applied to the fluid, thus forming a low-pressure area, and the closer the fluid is to the outer wall of the diverter filter section 1013, the smaller the centrifugal force is applied to the fluid, thus forming a high-pressure area. The pressure difference between the high-pressure area and the low-pressure area makes it easy for the fluid to form eddies, thereby increasing the flow resistance. Therefore, by gradually reducing the length of the partition body 1014 from the direction close to the turning entrance section 1011 to the direction away from the turning entrance section 1011, the length of the partition body 1014 is increased at the position where the fluid is subjected to greater centrifugal force, thereby increasing the friction contact between the partition body 1014 and the fluid, thereby reducing the effect of centrifugal force on the fluid, making the pressure of the fluid at each position flowing through the turning portion 101 similar, reducing eddies, and thereby reducing the flow resistance. In addition, due to the reduction of eddies, foreign matter can flow more smoothly, thereby reducing the blockage of the turning portion 101.

[0032] In this embodiment, the number of the partition segments 1014 is 2N, and the spacing dimension d1 between adjacent partition segments 1014 is 1 / N of the width dimension w of the turning inlet section 1011, so that the flow cross-sectional area of ​​the turning portion 101 is larger than the flow cross-sectional area of ​​the turning inlet section 1011, thereby reducing the flow velocity of the fluid in the turning portion 101, thereby reducing eddy currents and further reducing flow resistance.

[0033] In this embodiment, the diversion filter section 1013 includes a first inner wall 1013a and a second inner wall 1013b connected to each other, the first inner wall 1013a is connected to the turning inlet section 1011, the second inner wall 1013b is connected to the turning outlet section 1012, and the angle α1 between the first inner wall 1013a and the second inner wall 1013b is an obtuse angle.

[0034] In this embodiment, a plurality of partition bodies 1014 are respectively parallel to the first inner side wall 1013 a .

[0035] In this embodiment, the first direction X is perpendicular to the second direction Y, the cooling liquid in the turning entrance section 1011 has a first flow direction S1, the cooling liquid between adjacent partition bodies 1014 has a second flow direction S2, and the angle α2 between the first flow direction S1 and the second flow direction S2 is an obtuse angle.

[0036] In other embodiments, the first direction and the second direction may not be perpendicular.

[0037] In this embodiment, along the extension direction of the partition body 1014, the partition body 1014 has a first end 1014a and a second end 1014b opposite to each other, and the first end 1014a and the second end 1014b are respectively convex pointed structures. By setting the ends of each partition body 1014 as convex pointed structures, it can play a certain guiding role on the fluid, thereby reducing fluid disturbance.

[0038] It should be noted that when all the turning parts 101 in the cooling channel structure 100 are improved, the process difficulty will be greatly increased; when only a few of the turning parts 101 in the cooling channel structure 100 are improved, the improved circulation effect will be poor. Therefore, according to the actual situation, the turning parts 101 that are prone to eddy currents can be improved, while other turning parts 101 that are not prone to eddy currents remain unchanged, which can reduce the process difficulty and improve the circulation effect.

[0039] Figure 3 Schematic diagram of a packaging structure in an embodiment of the present invention

[0040] Accordingly, a packaging structure 200 is also provided in the embodiment of the present invention, please refer to Figure 3 And continue to combine reference Figure 2, comprising: a substrate 201; an interposer 202 located on the substrate 201, wherein the interposer 202 has a cooling channel structure 100 as described in any of the above embodiments; and a plurality of chips 203 located on the interposer 202, wherein the chips 203 are electrically connected to the interposer 202 and the substrate 201, respectively.

[0041] In this embodiment, by providing the cooling channel structure 100 in the interposer 202, the pressure of the fluid at each position flowing through the turning portion 101 can be made similar, thereby reducing eddy currents and thus reducing flow resistance. In addition, due to the reduction of eddy currents, foreign matter can flow more smoothly, thereby reducing the blockage of the turning portion 101, thereby effectively improving the heat dissipation effect of the chip 203.

[0042] It should be noted that, in this embodiment, the substrate 200 is a PCB substrate having an internal electrical connection layer, and electrical lead terminals for electrical connection, such as metal pads, are provided on two opposite sides of the substrate 200 to facilitate subsequent electrical connection of the substrate 200 with other devices.

[0043] In this embodiment, a metal interconnection structure (not shown) is provided in the interposer 202 , and the metal interconnection structure is used for high-speed signal transmission between the chips 203 .

[0044] In this embodiment, it also includes: a plurality of through silicon via structures 204 , which penetrate the interposer 202 and are electrically connected to the chip 203 and the substrate 201 respectively, and are used to transmit external signals of the chip 203 to the substrate 201 .

[0045] In this embodiment, the material of the intermediate layer 202 includes silicon.

[0046] It should be noted that, in this embodiment, the packaging structure 200 adopts 2.5D packaging technology to achieve homogeneous or heterogeneous integration of multiple chips 203. In the 2.5D packaging structure 200, the chip 203 can achieve high-density line interconnection through the interposer 202 (Interposer) of the through silicon via structure 204 (Through Silicon Via, TSV). In the 2.5D packaging technology, it is usually necessary to perform process steps such as processing the chip 203, ball planting (not shown), interconnection between the interposer 202 and the rewiring layer (not shown), bonding between the chip and the passive component (not shown), and plastic packaging.

[0047] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A cooling channel structure, characterized in that: include: A plurality of turns, wherein at least some of the turns include: a turning entrance section extending along a first direction; a turning exit section extending in a second direction, the first direction being different from the second direction; A flow diversion and filtering section located between the turning inlet section and the turning outlet section, wherein the flow diversion and filtering section are respectively connected to the turning inlet section and the turning outlet section; A plurality of parallel partition bodies are arranged in the diversion filter section, and the length dimensions of the partition bodies gradually decrease from the direction close to the turning inlet section to the direction away from the turning inlet section.

2. The cooling channel structure according to claim 1, characterized in that: The number of the partition bodies is 2N, and the spacing dimension between adjacent partition bodies is 1 / N of the width dimension of the turning entrance section.

3. The cooling channel structure according to claim 1, characterized in that: The diversion filtering section includes a first inner side wall and a second inner side wall connected to each other, wherein the first inner side wall is connected to the turning inlet section, and the second inner side wall is connected to the turning outlet section, and the angle between the first inner side wall and the second inner side wall is an obtuse angle.

4. The cooling channel structure according to claim 3, characterized in that: A plurality of partition bodies are respectively parallel to the first inner side wall.

5. The cooling channel structure according to claim 3, characterized in that: When the first direction is perpendicular to the second direction, the cooling liquid in the turning entrance section has a first flow direction, the cooling liquid between adjacent partition bodies has a second flow direction, and the angle between the first flow direction and the second flow direction is an obtuse angle.

6. The cooling channel structure according to claim 1, characterized in that: Along the extension direction of the partition body, the partition body has a first end and a second end opposite to each other, and the first end and the second end are respectively convex pointed structures.

7. A packaging structure, characterized in that: include: substrate; An interposer located on the substrate, wherein the interposer has a cooling channel structure according to any one of claims 1 to 6; A plurality of chips are located on the interposer, and the chips are electrically connected to the interposer and the substrate respectively.

8. The packaging structure according to claim 7, characterized in that: The interposer has a metal interconnection structure therein, and the metal interconnection structure is used for high-speed signal transmission between the chips.

9. The packaging structure according to claim 7, characterized in that: Also includes: A plurality of through silicon via structures are provided, wherein the through silicon via structures penetrate the interposer and are electrically connected to the chip and the substrate respectively, and the through silicon via structures are used to transmit external signals of the chip to the substrate.

10. The packaging structure according to claim 7, characterized in that: The material of the intermediate layer includes: silicon.

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