Flexible interconnection structure of high-speed connector

Abstract

The invention belongs to the field of high-speed cable assembly design, and discloses a high-speed connector flexible interconnection structure, which comprises a shielding welding assembly, a plug shell and a socket shell, and is characterized in that the shielding welding assembly comprises a flexible welding assembly and a plurality of shielding shells; the flexible welding assembly comprises a flexible high-speed flat cable, a plug welding assembly and a socket welding assembly, and each of the plug welding assembly and the socket welding assembly comprises a high-speed transfer printed board and a high-speed connector. A mode of switching the printed board and the flexible high-speed flat cable is adopted, the high-speed connector and the high-speed flat cable are welded to the two ends of the printed board respectively, flexible interconnection between the high-speed printed board connectors is achieved to form the cable assembly, the cost is reduced, meanwhile, the layout flexibility of a product in the box body is improved, and the product quality is improved. And through a full-shielding metal shell welding protection means of the wire, full-angle shielding protection is carried out on the welding position of the high-speed wire, and the high-speed transmission and model shielding performance of the product is effectively improved.

Description

Technical Field

[0001] The invention belongs to the field of high-speed cable assembly design and relates to a high-speed connector flexible interconnection structure. Background Art

[0002] At present, the transmission of interconnection signals between high-speed connectors of printed circuit boards is often realized through PCB boards, and rigid interconnection is formed between PCB boards. In actual use, the cost is high and it is difficult to achieve flexible distribution. There are also flexible interconnections using FPC (i.e. flexible circuit board, which is made of polyimide or polyester film as a substrate and has high reliability and excellent flexibility. It can also be called soft board), but its cost is also high, and its flexibility is also affected by fixed wiring, and it is basically not maintainable. At the same time, because its relative dielectric constant is greater than that of high-speed wires, it is difficult to achieve low-delay transmission like high-speed wires. Summary of the invention

[0003] In order to solve the technical problems of difficulty in achieving flexible distribution and high cost caused by connecting high-speed connectors of printed circuit boards through PCB boards or FPC flexible boards, the present invention discloses a flexible interconnection structure of a high-speed connector, wherein the flexible interconnection structure includes a shielding welding assembly, one end of the shielding welding assembly is fixed to the plug housing, and the other end is fixed to the socket housing.

[0004] Among them, the shielding welding assembly includes a flexible welding assembly, the flexible welding assembly includes a flexible high-speed cable, one end of the flexible high-speed cable is provided with a plug welding assembly, and the other end is provided with a socket welding assembly, the plug welding assembly and the socket welding assembly both include a high-speed transfer printed board and a high-speed connector, and the high-speed connector is welded to the high-speed transfer printed board.

[0005] Furthermore, the flexible high-speed cable is a differential dual-coaxial high-speed flexible cable, and the signal line of the flexible high-speed cable is hot-pressed and welded on the top signal pad and the bottom signal pad of the high-speed adapter printed circuit board, and the shielding layer at the end of the flexible high-speed cable is connected to the top ground pad and the bottom ground pad of the high-speed adapter printed circuit board.

[0006] Furthermore, metal shielding shells are welded at the connection points between the shielding layer at the end of the flexible high-speed cable and the top-layer grounding pad and the bottom-layer grounding pad.

[0007] Furthermore, the high-speed connector includes a plug connector and a socket connector, the high-speed transfer printed board includes a plug high-speed transfer printed board and a socket high-speed transfer printed board, the plug connector and the plug high-speed transfer printed board are soldered by reflow soldering, and the socket connector and the socket high-speed transfer printed board are soldered by reflow soldering.

[0008] Furthermore, the high-speed transfer printed circuit board includes a top wiring layer and a bottom wiring layer, the top wiring layer is provided with the top ground pad, the top signal pad and the ground pin pad, and the bottom wiring layer is provided with the bottom signal pad and the bottom ground pad. Two intermediate shielding layers are provided between the top wiring layer and the bottom wiring layer, and the intermediate shielding layers include a substrate and a grounding copper on the substrate.

[0009] The high-speed transfer printed circuit board is provided with ground vias and signal vias that penetrate from the top layer to the bottom layer. The ground vias are sequentially connected to the ground pin pads, the top layer ground pads, the ground copper plating and the bottom layer ground pads to form a complete shielding structure. The signal vias are connected to the remote signal pin pads of the top layer routing layer and the signal routing of the bottom layer routing layer to achieve signal connectivity from the top layer to the bottom layer.

[0010] Furthermore, the top wiring layer is also provided with a proximal signal pin pad, a distal signal pin pad and a ground pin pad, the proximal signal pin pad is connected to the top signal pin pad via a surface differential microstrip line, and the distal signal pin pad is connected to the bottom signal pad via the signal via. At the same time, the proximal signal pin pad, the distal signal pin pad and the ground pin pad are respectively connected to the high-speed connector by welding.

[0011] Furthermore, the two intermediate shielding layers include a first intermediate shielding layer and a second intermediate shielding layer, the first intermediate shielding layer is located between the top routing layer and the second intermediate shielding layer, and the first intermediate shielding layer provides a reference return ground for the differential routing of the top routing layer; the second intermediate shielding layer is located between the first intermediate shielding layer and the bottom routing layer, and the second intermediate shielding layer provides a reference return ground for the differential routing of the bottom routing layer.

[0012] Furthermore, copper is removed from positions on the ground copper plating of the first intermediate shielding layer corresponding to the far-end signal pin pad and the near-end signal pin pad to form a non-ground copper plating area.

[0013] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above-mentioned technical solutions adopted in the embodiments of this specification include at least the following: the flexible interconnection structure of the high-speed connector of the present invention, by designing the shielding welding assembly, adopts the structure of a high-speed transfer printed board, a connector and a flexible high-speed cable, and realizes flexible interconnection between the high-speed printed board connectors by welding the connector and the flexible high-speed cable on the high-speed transfer printed board, while reducing the cost, effectively improving the flexibility of the product layout inside the box, and through the protective design of the shielding shell between the high-speed transfer printed board and the flexible high-speed cable, full-angle shielding protection is performed for the high-speed wire welding position, effectively improving the product's high-speed transmission and model shielding performance.

[0014] Furthermore, the design of the intermediate shielding layer in the high-speed transfer printed circuit board can meet the transfer between the high-speed printed circuit board connector and the high-speed wire, while ensuring the effective transmission and shielding of high-speed signals, which can effectively reduce the crosstalk between signal differential pairs, improve the impedance consistency of the high-speed differential wire welding position, and effectively improve the high-speed signal transmission performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A top view of a high-speed connector flexible interconnect structure disclosed in an embodiment of the present invention;

[0017] Figure 2 A cross-sectional view of a high-speed connector flexible interconnect structure disclosed in an embodiment of the present invention;

[0018] Figure 3 A top view of a shielding welding assembly disclosed in an embodiment of the present invention;

[0019] Figure 4 A front view of a shield welding assembly disclosed in an embodiment of the present invention;

[0020] Figure 5 A three-dimensional diagram of a shielding welding assembly disclosed in an embodiment of the present invention;

[0021] Figure 6 A top view of a flexible welding assembly disclosed in an embodiment of the present invention;

[0022] Figure 7 A schematic diagram of a first intermediate shielding layer disclosed in an embodiment of the present invention;

[0023] Figure 8A schematic diagram of a top wiring layer disclosed in an embodiment of the present invention;

[0024] Fig. 9 A schematic diagram of a bottom wiring layer disclosed in an embodiment of the present invention;

[0025] Fig.10 A schematic diagram of a metal shielding shell disclosed in an embodiment of the present invention;

[0026] Among them, 10, fastening screws; 20, plug housing; 30, socket housing; 1, flexible high-speed cable; 2, metal shielding shell; 3, plug connector; 4, socket connector; 5, plug high-speed transfer printed circuit board; 6, socket high-speed transfer printed circuit board; 7, substrate; 71, grounding copper plating; 72, non-grounding copper plating area; 8, top routing layer; 81, top ground pad; 82, top signal pad; 9, bottom routing layer; 91, bottom ground pad; 92, bottom signal pad; 11, ground via; 12, signal via. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0028] The following describes the implementation methods of the present application through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and the features of the embodiments can be combined with each other in the absence of conflict. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0029] The embodiment of the present invention discloses a high-speed connector flexible interconnection structure, see Figure 1 and Figure 2 The flexible interconnection structure includes a shielding welding assembly, one end of which is fixed to the plug housing 20, and the other end is fixed to the socket housing 30. In specific implementation, the plug housing includes a plug front housing and a plug rear housing (also referred to as a plug upper housing and a plug lower housing), one end of the shielding welding assembly is inserted between the plug front housing and the plug rear housing, and then the front and rear housings are fixed by a fastening screw 10. The structure of the socket housing is the same as that of the plug housing, and will not be described in detail in this embodiment. By setting the plug housing and the socket housing, the components at both ends of the shielding welding assembly can be protected.

[0030] The shield welding assembly includes a flexible welding assembly, see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the flexible welding assembly includes a flexible high-speed cable 1, one end of the flexible high-speed cable 1 is provided with a plug welding assembly, and the other end is provided with a socket welding assembly, the plug welding assembly and the socket welding assembly both include a high-speed transfer printed circuit board and a high-speed connector, and the high-speed connector is welded to the high-speed transfer printed circuit board.

[0031] Furthermore, the flexible high-speed cable 1 is a differential dual coaxial high-speed flexible cable, the signal line of the flexible high-speed cable 1 is hot-pressed and welded on the top signal pad and the bottom signal pad of the high-speed transfer printed circuit board, and the shielding layer at the end of the flexible high-speed cable is connected to the top ground pad 81 and the bottom ground pad 91 of the high-speed transfer printed circuit board. The differential dual coaxial high-speed flexible cable can meet the requirements of high-speed signal transmission, and the characteristic impedance benchmark meets the characteristic impedance requirements of the high-speed connector.

[0032] When the signal line of the flexible high-speed cable is welded to the corresponding position of the high-speed transfer printed circuit board by hot pressing welding, the amount of solder at the signal welding point is required to be as small as possible, and the height of the welding point after welding is not greater than 1.2 times the diameter of the signal line core, and there is no residual root of the pad. After welding the ground pad, the welding surface is required to be flat to ensure a complete return ground line and thus ensure signal integrity.

[0033] Further, see Figure 3 , Figure 4 and Figure 5 As shown, a metal shielding shell 2 is welded at the connection between the shielding layer at the end of the flexible high-speed cable and the top grounding pad 81 and the bottom grounding pad 91. The metal shielding shell 2 can achieve full shielding between each group of high-speed signal pairs.

[0034] Further, see Figures 1 to 6 As shown, the high-speed connector includes a plug connector 3 and a socket connector 4, see Figure 8 and Fig. 9As shown, the high-speed transfer printed circuit board includes a plug high-speed transfer printed circuit board 5 and a socket high-speed transfer printed circuit board 6. The plug connector 3 is soldered to the plug high-speed transfer printed circuit board 5 by reflow soldering, and the socket connector 4 is soldered to the socket high-speed transfer printed circuit board 6 by reflow soldering. When the high-speed connector is soldered to the corresponding high-speed transfer printed circuit board by reflow soldering, in order to ensure impedance consistency, it is necessary to minimize the amount of solder used during the soldering process, and the thickness of the steel mesh used should not be greater than 0.1mm. At the same time, in order to ensure the reliability of soldering, the thickness of the steel mesh should not be less than 0.05mm.

[0035] After the socket connector 4 and the plug connector 3 are fixed respectively, it is necessary to ensure that the impedance between the differentials of the two is consistent. Since they both have high-speed differential pins and ground pins, the basic sizes of the pins of the two are consistent, and the same surface mount pad form and size can be used, and the signal integrity of the high-speed signal during transmission inside the connector is guaranteed.

[0036] Further, see Figure 8 and Fig. 9 As shown, the high-speed transfer printed circuit board includes a top wiring layer 8 and a bottom wiring layer 9, the top wiring layer is provided with the top ground pad 81, the top signal pad 82 and the ground pin pad, the bottom wiring layer is provided with the bottom signal pad 92 and the bottom ground pad 91, two intermediate shielding layers are provided between the top wiring layer 8 and the bottom wiring layer 9, and the intermediate shielding layers include a substrate 7 and a ground copper plating 71 on the substrate 7.

[0037] See also Figure 8 and Fig. 9 As shown, the high-speed transfer printed circuit board (including the plug high-speed transfer printed circuit board 5 and the socket high-speed transfer printed circuit board 6) is provided with a ground via 11 and a signal via 12 that penetrates from the top layer to the bottom layer. The ground via 11 sequentially connects the ground pin pad, the top ground pad 81, the ground copper and the bottom ground pad 91 to form a complete shielding structure. The signal via 12 connects the remote signal pin pad of the top wiring layer and the signal wiring of the bottom wiring layer to achieve signal connectivity from the top layer to the bottom layer. Among them, the top ground pad 81 and the bottom ground pad 91 are respectively welded with a Fig.10 The metal shielding case shown.

[0038] Furthermore, in an embodiment without showing the accompanying drawings, the top wiring layer 8 is provided with a proximal signal pin pad, a distal signal pin pad and a ground pin pad, and the proximal signal pin pad is connected to the top signal pad via a surface differential microstrip line; the distal signal pin pad is connected to the bottom signal pad 92 via the signal via 12. At the same time, the proximal signal pin pad, the distal signal pin pad and the ground pin pad are connected to the connector by welding. Specifically, when designing a high-speed transfer printed circuit board, it is necessary to meet the pin packaging form of the corresponding high-speed connector. The proximal signal pin pad is connected to the top signal pad via a surface differential microstrip line, and the distal signal pin pad is connected to the bottom layer via a differential via, and then connected to the bottom signal pad via a bottom microstrip line and in a transition gradient manner. Various pads and microstrip lines are connected in a gradual transition manner to minimize the sudden change of characteristic impedance.

[0039] Furthermore, the two intermediate shielding layers include a first intermediate shielding layer and a second intermediate shielding layer, the first intermediate shielding layer is located between the top routing layer and the second intermediate shielding layer, and the first intermediate shielding layer provides a reference return ground for the differential routing of the top routing layer; the second intermediate shielding layer is located between the first intermediate shielding layer and the bottom routing layer, and the second intermediate shielding layer provides a reference return ground for the differential routing of the bottom routing layer.

[0040] Furthermore, the copper is removed from the positions corresponding to the far-end signal pin pads and the near-end signal pin pads on the grounding copper 71 of the first intermediate shielding layer to form a grounding copper-free area 72. Since the pads, solder, pins, etc. at the welding positions of the upper wiring layer will have a sudden drop in impedance, see Figure 1 As shown, the copper layer is removed from the positions corresponding to the ground copper plating 71 on the first intermediate shielding layer and the remote signal pin pad and the proximal signal pin pad to obtain a non-ground copper plating area 72 to compensate for the characteristic impedance of the welding position.

[0041] The high-speed connector flexible interconnection structure of the present invention designs a shielded welding component, adopts a structure of a high-speed transfer printed board, a high-speed connector and a flexible high-speed cable, and realizes flexible interconnection between the high-speed printed board connectors by welding the connector and the flexible high-speed cable on the high-speed transfer printed board. While reducing costs, the flexibility of the product layout inside the box is effectively improved. In addition, through the protective design of the shielding shell between the high-speed transfer printed board and the flexible high-speed cable, full-angle shielding protection is performed for the high-speed wire welding position, effectively improving the product's high-speed transmission and model shielding performance.

[0042] Furthermore, the design of the intermediate shielding layer in the high-speed transfer printed circuit board can meet the transfer between the high-speed printed circuit board connector and the high-speed wire, while ensuring the effective transmission and shielding of high-speed signals, which can effectively reduce the crosstalk between signal differential pairs, improve the impedance consistency of the high-speed differential wire welding position, and effectively improve the high-speed signal transmission performance of the product.

[0043] Obviously, those skilled in the art should understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the embodiments of the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-speed connector flexible interconnection structure, comprising a shield welding assembly, one end of which is fixed to a plug housing, and the other end of which is fixed to a socket housing, characterized in that: The shielding welding assembly includes a flexible welding assembly, the flexible welding assembly includes a flexible high-speed cable, one end of the flexible high-speed cable is provided with a plug welding assembly, and the other end is provided with a socket welding assembly, the plug welding assembly and the socket welding assembly both include a high-speed transfer printed board and a high-speed connector, and the high-speed connector is welded to the high-speed transfer printed board.

2. The high-speed connector flexible interconnection structure according to claim 1, characterized in that: The flexible high-speed cable is a differential dual-coaxial high-speed flexible cable. The signal line of the flexible high-speed cable is hot-pressed and welded on the top signal pad and the bottom signal pad of the high-speed transfer printed circuit board. The shielding layer at the end of the flexible high-speed cable is connected to the top ground pad and the bottom ground pad of the high-speed transfer printed circuit board.

3. The high-speed connector flexible interconnection structure according to claim 2, characterized in that: A metal shielding shell is welded to the connection between the shielding layer at the end of the flexible high-speed cable and the top-layer grounding pad and the bottom-layer grounding pad.

4. The high-speed connector flexible interconnection structure according to claim 1, characterized in that: The high-speed connector includes a plug connector and a socket connector, the high-speed transfer printed board includes a plug high-speed transfer printed board and a socket high-speed transfer printed board, the plug connector and the plug high-speed transfer printed board are soldered by reflow soldering, and the socket connector and the socket high-speed transfer printed board are soldered by reflow soldering.

5. The high-speed connector flexible interconnection structure according to claim 2, characterized in that: The high-speed transfer printed circuit board comprises a top wiring layer and a bottom wiring layer, the top wiring layer is provided with the top ground pad, the top signal pad and the ground pin pad, the bottom wiring layer is provided with the bottom signal pad and the bottom ground pad, two intermediate shielding layers are provided between the top wiring layer and the bottom wiring layer, and the intermediate shielding layers include a substrate and a grounding copper on the substrate; The high-speed transfer printed circuit board is provided with ground vias and signal vias that penetrate from the top layer to the bottom layer. The ground vias are sequentially connected to the ground pin pad, the top layer ground pad, the ground copper and the bottom layer ground pad to form a complete shielding structure. The signal vias are connected to the remote signal pin pad of the top layer routing layer and the signal routing of the bottom layer routing layer to achieve signal connectivity from the top layer to the bottom layer.

6. The high-speed connector flexible interconnection structure according to claim 5, characterized in that: The top wiring layer is also provided with a proximal signal pin pad, a distal signal pin pad and a ground pin pad, the proximal signal pin pad is connected to the top signal pad via a surface differential microstrip line, and the distal signal pin pad is connected to the bottom signal pad via the signal via; The proximal signal pin pad, the distal signal pin pad and the ground pin pad are respectively connected to the high-speed connector by welding.

7. The high-speed connector flexible interconnection structure according to claim 6, characterized in that: The two intermediate shielding layers include a first intermediate shielding layer and a second intermediate shielding layer, the first intermediate shielding layer is located between the top wiring layer and the second intermediate shielding layer, and the first intermediate shielding layer provides a reference return ground for the differential wiring of the top wiring layer; The second intermediate shielding layer is located between the first intermediate shielding layer and the bottom wiring layer, and the second intermediate shielding layer provides a reference return ground for the differential wiring of the bottom wiring layer.

8. The high-speed connector flexible interconnection structure according to claim 7, characterized in that: Copper is removed from positions on the ground copper plating of the first intermediate shielding layer corresponding to the far-end signal pin pad and the near-end signal pin pad to form a non-ground copper plating area.

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