VCSEL laser and preparation method thereof

Abstract

The invention discloses a VCSEL laser and a preparation method thereof, and the preparation method comprises the steps: providing a flexible substrate and a mounting base, the mounting base comprises a mounting groove, the mounting groove comprises a mounting bottom surface perpendicular to a first direction and a mounting side surface which is obliquely arranged relative to the mounting bottom surface, and the flexible substrate is welded with a plurality of VCSEL chips which are arranged at intervals; a flexible substrate is attached to the installation base, the flexible substrate is attached to the installation bottom face and the installation side faces, and VCSEL chips are attached to the installation bottom face and the installation side faces through the flexible substrate; and a refractor is installed at a notch of the installation groove, and the refractor is arranged corresponding to the VCSEL chip on the installation side surface and is used for refracting laser of the VCSEL chip on the installation side surface to a first direction. According to the VCSEL chip mounting structure, the flexible substrate on which the plurality of VCSEL chips are preassembled is provided, the mounting precision of the VCSEL chips and the mounting grooves is guaranteed, meanwhile, the flexible substrate is attached to the mounting bottom surface and the mounting side surfaces, the VCSEL chips are mounted on the mounting bottom surface and the mounting side surfaces through the flexible substrate, and the mounting density is improved.

Description

Technical Field

[0001] The present invention relates to the field of laser technology, and in particular to a VCSEL laser and a preparation method thereof. Background Art

[0002] VCSEL (Vertical Cavity Surface Emitting Laser) is one of many lasers. It uses a vertical cavity structure to emit laser vertically from the chip surface, thus having the advantages of high beam quality, low power consumption, and easy large-scale integration and packaging. It is widely used in optical communications, 3D sensing, face recognition, lidar, augmented reality, virtual reality and other fields; especially in scenarios such as smartphones and autonomous driving, VCSEL lasers play a vital role as the core light source.

[0003] Existing VCSEL lasers are usually packaged using a rigid substrate. The specific packaging method includes: mounting individual VCSEL chips one by one on the rigid substrate, and then completing the electrical connection between the VCSEL chips and the rigid substrate. This packaging method has been widely used in the production of VCSEL lasers. However, in actual application, the existing packaging method still has some difficult-to-solve problems, such as the cumulative error of mounting accuracy and the limited installation density of VCSEL chips.

[0004] Understandably, these two problems are difficult to solve simultaneously under conventional packaging methods: in order to reduce the impact of mounting errors, high-precision mounting equipment is usually required, and each VCSEL chip is precisely aligned and mounted independently, but this will limit the arrangement of the chips, making it difficult to increase the chip installation density. On the contrary, if you try to increase the chip installation density, such as by arranging the VCSEL chips more closely or installing them at an angle, you need to introduce multiple rigid substrates, and the precision between the rigid substrates will affect the accumulation of the above errors, causing the mounting errors to be further aggravated, affecting the optical performance.

[0005] In summary, the existing VCSEL laser packaging method has defects in mounting accuracy and chip mounting density, and it is difficult to optimize them simultaneously under the existing process. Therefore, a new VCSEL laser is urgently needed to improve the VCSEL chip mounting density while reducing the impact of mounting errors, thereby improving the overall performance and production quality stability of the VCSEL laser. Summary of the invention

[0006] The object of the present invention is to provide a VCSEL laser and a method for preparing the same, so as to solve the problem that it is difficult to simultaneously improve the production quality stability and the laser performance of the VCSEL laser packaging method in the prior art.

[0007] To achieve this object, the present invention adopts the following technical solutions: A method for preparing a VCSEL laser, comprising: Step S100, providing a flexible substrate and a mounting base, wherein the mounting base includes a mounting groove, the mounting groove includes a mounting bottom surface perpendicular to the first direction and a mounting side surface inclined relative to the mounting bottom surface, and a plurality of VCSEL chips spaced apart are welded on the flexible substrate; Step S200, attaching the flexible substrate to the mounting base, and attaching the flexible substrate to the mounting bottom surface and the mounting side surface, so that the VCSEL chip is mounted on the mounting bottom surface and the mounting side surface through the flexible substrate; Step S300: Install a refractor at the notch of the installation groove, the refractor being arranged corresponding to the VCSEL chip installed on the side surface, and being used to refract the laser of the VCSEL chip installed on the side surface to a first direction.

[0008] Optionally, the mounting side surface comprises a first side surface and a second side surface which are sequentially arranged and connected in a direction away from the mounting bottom surface, and relative to the refractor, the first side surface is arranged to protrude from the second side surface; the first side surface and the second side surface are connected via a transition plane; The flexible substrate is bent at a position corresponding to the first side to form a first bending portion, the flexible substrate is bent at a position corresponding to the second side to form a second bending portion, and is bent at a position corresponding to the transition plane to form a transition bending portion.

[0009] Optionally, the step S200 includes: Step S210, attaching the middle part of the flexible substrate to the installation bottom surface; Step S220, performing a first bend on the flexible substrate to form a first bend portion attached to the first side surface, performing a second bend on the first bend portion to form a transition bend portion attached to the transition plane and a second bend portion attached to the second side surface.

[0010] Optionally, the step S100 includes: Step S101, a rigid substrate is arranged on the bonding surface of the flexible substrate, and the rigid substrate is arranged corresponding to the installation bottom surface; Step S102, providing a first positioning member, passing the first positioning member through the flexible substrate and the rigid substrate, and partially embedding the first positioning member into a first positioning hole on the mounting bottom surface; Step S103, symmetrically mounting the VCSEL chip on the bonding surface of the flexible substrate with the first positioning member as a reference; The step S200 includes: Step S211 , attaching the rigid substrate to the installation bottom surface, with the lower edge of the rigid substrate abutting against the installation side surface.

[0011] Optionally, the step S300 includes: Step S310, depositing a sealing layer on the edge of the groove of the installation groove; Step S320, stacking the refraction mirror on the sealing layer; Step S330, sleeve the packaging shell over the refractor and the mounting base, the first shell surface of the packaging shell presses the refractor onto the sealing layer, the second shell surface of the packaging shell abuts against the other side of the mounting base where the mounting groove is opened, and the first shell surface and the second shell surface are arranged opposite to each other.

[0012] Optionally, the second shell surface and the bottom surface of the mounting base are respectively provided with a second positioning hole, and the second positioning hole is connected to the first positioning hole; After step S330, the method further includes: Step S340: provide a second positioning member, insert the second positioning member into the second positioning hole from the second positioning hole and connect the second positioning member to the first positioning member.

[0013] Optionally, the first positioning hole is a first threaded hole, the first positioning member is provided with an external thread at a position corresponding to the first threaded hole, the first positioning member is provided with a second threaded hole, and the second positioning member is provided with an external thread at a position corresponding to the second threaded hole; In the step S102, the first positioning member is threadedly connected to the first threaded hole; In the step S340, the second positioning member is threadedly connected to the second threaded hole.

[0014] Optionally, the first positioning member is provided with a first edge portion whose size is larger than the first positioning hole, and the second positioning member is provided with a second edge portion whose size is larger than the second positioning hole.

[0015] Optionally, the step S100 further includes: An insulating bearing layer is deposited on the groove surface of the mounting groove.

[0016] A VCSEL laser is prepared by the method for preparing a VCSEL laser as described above, comprising a flexible substrate and a mounting base; the mounting base comprises a mounting groove, the mounting groove comprises a mounting bottom surface perpendicular to a first direction and a mounting side surface inclined relative to the mounting bottom surface, and a plurality of VCSEL chips arranged at intervals are welded on the flexible substrate; The flexible substrate is attached to the mounting base; a refractor is installed at the notch of the mounting groove, and the refractor is arranged corresponding to the VCSEL chip on the mounting side, and is used to refract the laser of the VCSEL chip on the mounting side to a first direction.

[0017] Compared with the prior art, the present invention has the following beneficial effects: the VCSEL laser and the preparation method thereof provided by the present invention, by providing a flexible substrate pre-installed with a plurality of VCSEL chips, ensure the installation accuracy of the VCSEL chip on the flexible substrate, that is, after the flexible substrate is bonded to the installation groove in the subsequent step, the installation accuracy of the VCSEL chip and the installation groove is ensured; at the same time, the installation groove includes an installation bottom surface and an installation side surface, so that the VCSEL chip can be arranged in multiple dimensions in the subsequent steps, and more space can be utilized, so that multiple VCSEL chips can be arranged more compactly and reasonably, and the installation density is improved; then, with the setting of the refractor, each laser can finally be compactly emitted from each other along the first direction, without considering the alignment accuracy between multiple substrates, and the accuracy requirement is relatively low, thereby ensuring the stability of production quality. Therefore, the present VCSEL laser and the preparation method thereof can ensure the overall performance and production quality stability of the VCSEL laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0020] Figure 1 A schematic diagram of a process for preparing a VCSEL laser provided by the present invention; Figure 2 A schematic diagram of the local structure of the VCSEL laser provided by the present invention; Figure 3 A schematic diagram of the first state structure of the VCSEL laser provided by the present invention; Figure 4 A schematic diagram of the second state structure of the VCSEL laser provided by the present invention; Figure 5 A schematic diagram of the third state structure of the VCSEL laser provided by the present invention; Figure 6 A schematic diagram of the structure of the fourth state of the VCSEL laser provided by the present invention; Illustration: 100, rigid substrate; 200, flexible substrate; 201, first bending portion; 202, second bending portion; 203, transition bending portion; 300, mounting base; 301, mounting bottom surface; 3011, first positioning hole; 302, mounting side surface; 3021, first side surface; 3022, second side surface; 3023, transition plane; 310, insulating bearing layer; 320, sealing layer; 400, VCSEL chip; 500, refractor; 510, transmission part; 520, refraction part; 610, first positioning member; 611, first edge part; 612, second threaded hole; 620, second positioning member; 621, second edge part; 700, packaging shell; 701, first shell surface; 702, second shell surface; 7021, second positioning hole. DETAILED DESCRIPTION

[0021] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0023] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0024] Embodiment 1: An embodiment of the present invention provides a method for preparing a VCSEL laser. The method is suitable for preparing a VCSEL laser. In this embodiment, the preparation method is optimized to ensure the overall performance and production quality stability of the VCSEL laser.

[0025] like Figure 1 As shown, the method for preparing the VCSEL laser in this embodiment specifically includes: Step S100, providing a flexible substrate 200 and a mounting base 300, wherein the mounting base 300 comprises a mounting groove, wherein the mounting groove comprises a mounting bottom surface 301 perpendicular to a first direction and a mounting side surface 302 inclined relative to the mounting bottom surface 301, such as Figure 2 As shown, a plurality of VCSEL chips 400 arranged at intervals are welded on the flexible substrate 200; It can be understood that the first direction is a direction perpendicular to the mounting bottom surface 301. The welding method of the VCSEL chip 400 and the flexible substrate 200 includes, but is not limited to, spot welding, ultrasonic welding and other welding methods. The focus of this embodiment is to connect the VCSEL chip 400 and the flexible substrate 200. The specific welding method is not specifically expanded. At the same time, the VCSEL chip 400 and the flexible substrate 200 can also adopt other connection methods similar to the patch process. This solution provides a flexible substrate 200 and a mounting base 300 with an inclined mounting side 302, so that the VCSEL chip 400 can be arranged in multiple dimensions, and more space can be effectively used, so that multiple VCSEL chips 400 can be arranged more compactly and reasonably, and the mounting density is improved.

[0026] Step S200, attaching the flexible substrate 200 to the mounting base 300, and attaching the flexible substrate 200 to the mounting bottom surface 301 and the mounting side surface 302, so that the VCSEL chip 400 is mounted on the mounting bottom surface 301 and the mounting side surface 302 through the flexible substrate 200; It can be understood that, since the flexible substrate 200 has certain bendability and adaptability, it can be formed into a corresponding shape corresponding to the mounting base 300, and does not involve alignment between multiple substrates, so it can effectively reduce the accumulation of alignment errors, and avoid the error of mounting one by one from extending to the entire VCSEL array, so that the installation of the VCSEL chip 400 can be more precise, improve the optical performance of the VCSEL chip 400 array, and ensure the beam collimation of the VCSEL laser, which is particularly important in high-precision applications; Step S300, install a refractor 500 in the notch of the installation groove, and the refractor 500 is set corresponding to the VCSEL chip 400 on the installation side 302, and is used to refract the laser of the VCSEL chip 400 on the installation side 302 to the first direction. It can be understood that the refractor 500 is used in conjunction with the VCSEL chip 400 on the installation side 302, and the lasers emitted by all VCSEL chips 400 can be guided to the same direction, thereby optimizing the beam quality and avoiding beam diffusion caused by chip arrangement errors. Exemplarily, when the inclination angle of the installation side 302 relative to the installation bottom surface 301 is 45°, a refractor 500 with a refraction angle of 45° is selected, so that the laser emitted by the VCSEL chip 400 is deflected 45° and emitted along the first direction.

[0027] Specifically, the VCSEL laser and its preparation method provided by the present invention, by providing a flexible substrate 200 pre-installed with a plurality of VCSEL chips 400, ensure the installation accuracy of the VCSEL chip 400 on the flexible substrate 200, that is, after the flexible substrate 200 is bonded with the installation groove in the subsequent step, the installation accuracy of the VCSEL chip 400 and the installation groove is ensured; at the same time, the installation groove includes an installation bottom surface 301 and an installation side surface 302, so that the VCSEL chip 400 can be arranged in multiple dimensions in the subsequent steps, and more space can be used, so that the plurality of VCSEL chips 400 can be arranged more compactly and reasonably, and the installation density is improved; then, with the setting of the refractor 500, each laser can finally be compactly emitted from each other along the first direction, without considering the alignment accuracy between the multiple substrates, and the accuracy requirement is low, thereby ensuring the stability of production quality. Therefore, the present VCSEL laser and its preparation method can ensure the overall performance and production quality stability of the VCSEL laser.

[0028] Furthermore, if Figures 3 to 6 As shown, the mounting side surface 302 includes a first side surface 3021 and a second side surface 3022 which are sequentially arranged and connected in a direction away from the mounting bottom surface 301, and relative to the refractor 500, the first side surface 3021 is arranged to protrude from the second side surface 3022; the first side surface 3021 and the second side surface 3022 are connected via a transition plane 3023; the flexible substrate 200 is bent at a position corresponding to the first side surface 3021 to form a first bending portion 201, the flexible substrate 200 is bent at a position corresponding to the second side surface 3022 to form a second bending portion 202, and is bent at a position corresponding to the transition plane 3023 to form a transition bending portion 203.

[0029] It should be supplemented that, for the bending of the flexible substrate 200, it is first partially attached to the mounting bottom surface 301 to achieve preliminary positioning; then, with the first side surface 3021 as a support, it can cooperate with bending machines, hot pressing equipment, molding equipment, non-standard bonding equipment and other devices to complete the bending of the flexible substrate 200. It can be understood that the above-mentioned device is not limited, and can cooperate with the first side surface 3021 to achieve the bending of the flexible substrate 200 to form the first bending portion 201; similarly, other bending portions can also be formed by the same means. At the same time, it should be noted that since the first side surface 3021 protrudes from the second side surface 3022, it means that the second distance between the second side surface 3022, which is farther from the mounting bottom surface 301, and the refractor 500 is greater than the first distance between the first side surface 3021 and the refractor 500; for example, assuming Figure 2 and Figure 3In the embodiment, the distance between two adjacent VCSEL chips 400 is a, and the distance a is the minimum value that can be achieved in the mounting process or the welding process. Figure 4 As shown, since the second spacing is greater than the first spacing, it means that the flexible substrate 200 is folded inward, so that the spacing between two adjacent VCSEL chips 400 is reduced and is obviously smaller than a, thereby further improving the mounting density.

[0030] Further, step S200 includes: Step S210, attaching the middle portion of the flexible substrate 200 to the mounting bottom surface 301; Step S220, performing a first bend on the flexible substrate 200 to form a first bend portion 201 attached to the first side surface 3021, performing a second bend on the first bend portion 201 to form a transition bend portion 203 attached to the transition plane 3023 and a second bend portion 202 attached to the second side surface 3022.

[0031] By analogy, when the mounting side surface 302 includes a plurality of side surfaces that are sequentially arranged and connected in a direction away from the mounting bottom surface 301, a plurality of VCSEL chips 400 are correspondingly arranged on the flexible substrate 200. For example, when the mounting side surface 302 includes three connected side surfaces, three VCSEL chips 400 can be correspondingly arranged on one end of the flexible substrate 200. Figure 4 , a plurality of VCSEL chips 400 may be arranged at intervals on the same side along a direction perpendicular to the plane in which they are located.

[0032] It is understandable that by bending in steps, the flexible substrate 200 can be precisely adjusted on multiple surfaces to ensure that each VCSEL chip 400 is installed at an appropriate angle and position, which can effectively eliminate errors caused by inappropriate substrate shapes, thereby improving the overall installation accuracy and optical performance of the laser. At the same time, since the flexible substrate 200 can be adaptively bent according to the angle of each side, the installation density of the VCSEL chip 400 is improved without sacrificing accuracy, and high-density installation can be achieved in a relatively small space, optimizing the design of the optical system.

[0033] Based on the above implementation, step S100 includes: Step S101, a rigid substrate 100 is arranged on the bonding surface of the flexible substrate 200, and the rigid substrate 100 is arranged corresponding to the mounting bottom surface 301; the rigid substrate 100 can be a plate member that is not easily deformed, such as a metal plate, a plastic plate, etc., and the arrangement method includes but is not limited to bonding, welding, etc.; Step S102, providing a first positioning member 610, passing the first positioning member 610 through the flexible substrate 200 and the rigid substrate 100, and partially embedding the first positioning member 610 into the first positioning hole 3011 on the mounting bottom surface 301; Step S103, symmetrically mounting the VCSEL chip 400 on the bonding surface of the flexible substrate 200 with the first positioning member 610 as a reference; Step S200 includes: Step S211 , attaching the rigid substrate 100 to the mounting bottom surface 301 , with the lower edge of the rigid substrate 100 abutting against the mounting side surface 302 .

[0034] First, in step S101, a flexible substrate 200 and a rigid substrate 100 are provided. The rigid substrate 100 is arranged corresponding to the mounting bottom surface 301 and is used in combination with the flexible substrate 200 to form a composite structure to ensure the precise positioning and stability of the flexible substrate 200 in subsequent steps, and the rigid substrate 100 can provide support for the flexible substrate 200 to ensure that unnecessary deformation will not occur during the subsequent bending and bonding process, thereby effectively improving the stability and accuracy of the installation process. Next, the first positioning member 610 in step S102 passes through the flexible substrate 200 and the rigid substrate 100, and is partially embedded in the first positioning hole 3011 on the mounting bottom surface 301, so that the first positioning member 610 serves as a positioning reference to ensure that the relative position of the flexible substrate 200 and the rigid substrate 100 does not shift, and as shown in FIG. Figure 1 As shown, during the welding process of the VCSEL chip 400, the first positioning member 610 can be used as a reference to ensure the accurate alignment of the VCSEL chip 400, and ensure that each VCSEL chip 400 can be accurately located at the designed position; specifically, the VCSEL chip 400 is symmetrically installed on the bonding surface of the flexible substrate 200 with the first positioning member 610 as a reference, ensuring that the spacing between each VCSEL chip 400 remains consistent, thereby optimizing the optical performance and avoiding the problem of uneven light beam caused by inconsistent spacing of the VCSEL chips 400.

[0035] In addition, in step S200, the rigid substrate 100 is attached to the mounting bottom surface 301, and the lower edge of the rigid substrate is in contact with the mounting side surface 302, that is, the size of the rigid substrate 100 matches the length of the mounting bottom surface 301. At this time, the rigid substrate 100 not only provides support for the flexible substrate 200, but also ensures the precise contact between the flexible substrate 200 and the mounting base 300, thereby improving the overall stability and accuracy of the VCSEL chip 400 during installation.

[0036] Further, step S300 includes: Step S310, depositing a sealing layer 320 on the edge of the groove of the installation groove; the material of the sealing layer 320 includes but is not limited to optical glue, epoxy resin, etc. The sealing layer 320 provides a stable foundation for the subsequent installation of the refractor 500 and plays a sealing role to prevent dust or pollutants from entering the optical system, thereby ensuring that the optical performance of the refractor 500 is not affected; Step S320, stacking the refractor 500 on the sealing layer 320; wherein the refractor 500 includes a transmissive portion 510 and a refractive portion 520, the transmissive portion 510 is arranged corresponding to the mounting bottom surface 301, and the refractive portion 520 is arranged corresponding to the mounting side surface 302; Step S330, the packaging shell 700 is sleeved on the outside of the refractor 500 and the mounting base 300, the first shell surface 701 of the packaging shell 700 presses the refractor 500 onto the sealing layer 320, the second shell surface 702 of the packaging shell 700 abuts against the other side of the mounting base 300 where the mounting groove is provided, and the first shell surface 701 and the second shell surface 702 are arranged opposite to each other; the packaging shell 700 can be a shell obtained in advance by injection molding, or a shell obtained by CNC processing, which is not limited in this embodiment, and the focus is on installing the refractor 500 in a pressing manner and fixing the above structure to avoid damage to the refractor 500.

[0037] It can be understood that the packaging shell 700 is sleeved on the outside of the refractor 500 and the mounting base 300, and the first shell surface 701 of the packaging shell 700 presses the refractor 500 onto the sealing layer 320, while the second shell surface 702 of the packaging shell 700 abuts against the other side of the mounting base 300 where the mounting groove is opened, ensuring the fastening and sealing of the overall structure, which not only protects the refractor 500 and the VCSEL chip 400 from external physical damage, but also has sealing and supporting functions, thereby enhancing the mechanical stability of the VCSEL laser.

[0038] It should be supplemented that the second shell surface 702 and the bottom surface of the mounting base 300 are respectively provided with a second positioning hole 7021, and the second positioning hole 7021 is connected to the first positioning hole 3011; After step S330, the method further includes: Step S340 , providing a second positioning member 620 , inserting the second positioning member 620 into the second positioning hole 7021 and connecting the second positioning member 610 .

[0039] Exemplarily, during the installation of the flexible substrate 200, the flexible substrate 200 is initially positioned and fixed by the first positioning member 610. After the steps of bending and installing the refractor 500 are completed, the packaging shell 700 is sleeved on the outside of the above structure, and the second positioning member 620 is connected to the first positioning member 610. In essence, the flexible substrate 200, the rigid substrate 100, the mounting base 300 and the packaging shell 700 are pressed together from both sides, so that the four are further positioned and fixedly connected. At the same time, the first shell surface 701 can be pressed and fixed to the refractor 500, avoiding the steps of punching the refractor 500, increasing the service life of the fragile refractor 500, and avoiding the problems of aging and non-removability caused by bonding and the like, so that the refractor 500 of the VCSEL laser can be replaced.

[0040] Specifically, the first positioning hole 3011 is a first threaded hole, the first positioning member 610 is formed with an external thread at a position corresponding to the first threaded hole, the first positioning member 610 is provided with a second threaded hole 612, and the second positioning member 620 is formed with an external thread at a position corresponding to the second threaded hole 612; In step S102, the first positioning member 610 is threadedly connected to the first threaded hole; In step S340 , the second positioning member 620 is threadedly connected to the second threaded hole 612 .

[0041] Furthermore, the first positioning member 610 is provided with a first edge portion 611 having a size larger than the first positioning hole 3011 , and the second positioning member 620 is provided with a second edge portion 621 having a size larger than the second positioning hole 7021 .

[0042] It can be understood that in the above arrangement, the first positioning member 610 and the second positioning member 620 respectively have edge portions that are larger than the size of the positioning hole (for example, the first edge portion 611 and the second edge portion 621). The design of these edge portions enables the positioning member to be firmly positioned in the positioning hole and provide effective supporting force, thereby avoiding the loosening problem that may occur during the installation process, and further ensuring the stability of the entire VCSEL laser structure. In particular, the positioning member can still maintain efficient alignment performance after repeated use or changes in the external environment.

[0043] Based on the above implementation, step S100 further includes: An insulating bearing layer 310 is deposited on the groove surface of the mounting groove. The insulating bearing layer 310 is disposed so that the mounting base 300 and the flexible substrate 200 are electrically separated.

[0044] On the basis of the above embodiment, the mounting base 300 is provided with first through holes corresponding to each side surface (the first side surface 3021 and the second side surface 3022), and the first through holes are extended along the first direction; correspondingly, the second shell surface 702 is provided with second through holes corresponding to the positions of each first through hole; Exemplarily, the first bending of the flexible substrate 200 also includes: Step S221, inserting a probe into the first through hole on the first side surface 3021; The flexible substrate 200 is first bent, and then the following steps are further included: Step S222, using a probe to detect whether the pins of the VCSEL chip 400 are in place; if so, performing a second bend on the flexible substrate 200; if not, marking the VCSEL laser as an NG product; Similarly, the second bending of the flexible substrate 200 also includes: Step S223, inserting the probe into the first through hole on the second side surface 3022; Step S224, using a probe to detect whether the pins of the VCSEL chip 400 are in place; if so, proceed to the subsequent steps; if not, mark the VCSEL laser as NG; It can be understood that, through the setting of the above steps, it is ensured that the VCSEL chip 400 can be accurately aligned after each bending, reducing the performance problems caused by the position error of the VCSEL chip 400. At the same time, the connected first through hole and the second through hole provide a heat dissipation channel for the subsequent use of the VCSEL laser, thereby improving the heat dissipation effect.

[0045] Embodiment 2: This embodiment also provides a VCSEL laser, which is prepared by the method for preparing the VCSEL laser in the first embodiment, and includes a flexible substrate 200 and a mounting base 300; the mounting base 300 includes a mounting groove, the mounting groove includes a mounting bottom surface 301 perpendicular to the first direction and a mounting side surface 302 inclined relative to the mounting bottom surface 301, and a plurality of VCSEL chips 400 arranged at intervals are welded on the flexible substrate 200; The flexible substrate 200 is attached to the mounting base 300; the refractor 500 is installed in the notch of the mounting groove, and the refractor 500 is arranged corresponding to the VCSEL chip 400 on the mounting side 302, so as to refract the laser of the VCSEL chip 400 on the mounting side 302 to the first direction.

[0046] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a VCSEL laser, characterized in that: include: Step S100, providing a flexible substrate and a mounting base, wherein the mounting base includes a mounting groove, the mounting groove includes a mounting bottom surface perpendicular to the first direction and a mounting side surface inclined relative to the mounting bottom surface, and a plurality of VCSEL chips spaced apart are welded on the flexible substrate; Step S200, attaching the flexible substrate to the mounting base, and attaching the flexible substrate to the mounting bottom surface and the mounting side surface, so that the VCSEL chip is mounted on the mounting bottom surface and the mounting side surface through the flexible substrate; Step S300: Install a refractor at the notch of the installation groove, the refractor being arranged corresponding to the VCSEL chip installed on the side surface, and being used to refract the laser of the VCSEL chip installed on the side surface to a first direction.

2. The method for preparing a VCSEL laser according to claim 1, characterized in that: The mounting side surface comprises a first side surface and a second side surface which are sequentially arranged and connected in a direction away from the mounting bottom surface, and relative to the refractor, the first side surface is arranged to protrude from the second side surface; the first side surface and the second side surface are connected via a transition plane; The flexible substrate is bent at a position corresponding to the first side to form a first bending portion, the flexible substrate is bent at a position corresponding to the second side to form a second bending portion, and is bent at a position corresponding to the transition plane to form a transition bending portion.

3. The method for preparing a VCSEL laser according to claim 2, characterized in that: The step S200 includes: Step S210, attaching the middle part of the flexible substrate to the installation bottom surface; Step S220, performing a first bend on the flexible substrate to form a first bend portion attached to the first side surface, performing a second bend on the first bend portion to form a transition bend portion attached to the transition plane and a second bend portion attached to the second side surface.

4. The method for preparing a VCSEL laser according to claim 2, characterized in that: The step S100 includes: Step S101, a rigid substrate is arranged on the bonding surface of the flexible substrate, and the rigid substrate is arranged corresponding to the installation bottom surface; Step S102, providing a first positioning member, passing the first positioning member through the flexible substrate and the rigid substrate, and partially embedding the first positioning member into a first positioning hole on the mounting bottom surface; Step S103, symmetrically mounting the VCSEL chip on the bonding surface of the flexible substrate with the first positioning member as a reference; The step S200 includes: Step S211 , attaching the rigid substrate to the installation bottom surface, with the lower edge of the rigid substrate abutting against the installation side surface.

5. The method for preparing a VCSEL laser according to claim 4, characterized in that: The step S300 includes: Step S310, depositing a sealing layer on the edge of the groove of the installation groove; Step S320, stacking the refraction mirror on the sealing layer; Step S330, sleeve the packaging shell over the refractor and the mounting base, the first shell surface of the packaging shell presses the refractor onto the sealing layer, the second shell surface of the packaging shell abuts against the other side of the mounting base where the mounting groove is opened, and the first shell surface and the second shell surface are arranged opposite to each other.

6. The method for preparing a VCSEL laser according to claim 5, characterized in that: The second shell surface and the bottom surface of the mounting base are respectively provided with a second positioning hole, and the second positioning hole is connected to the first positioning hole; After step S330, the method further includes: Step S340: provide a second positioning member, insert the second positioning member into the second positioning hole from the second positioning hole and connect the second positioning member to the first positioning member.

7. The method for preparing a VCSEL laser according to claim 6, characterized in that: The first positioning hole is a first threaded hole, the first positioning member is provided with an external thread at a position corresponding to the first threaded hole, the first positioning member is provided with a second threaded hole, and the second positioning member is provided with an external thread at a position corresponding to the second threaded hole; In the step S102, the first positioning member is threadedly connected to the first threaded hole; In the step S340, the second positioning member is threadedly connected to the second threaded hole.

8. The method for preparing a VCSEL laser according to claim 7, characterized in that: The first positioning member is provided with a first edge portion whose size is larger than the first positioning hole, and the second positioning member is provided with a second edge portion whose size is larger than the second positioning hole.

9. A method for preparing a VCSEL laser according to any one of claims 1 to 8, characterized in that: The step S100 further includes: An insulating bearing layer is deposited on the groove surface of the mounting groove.

10. A VCSEL laser, characterized in that: The method for preparing a VCSEL laser according to any one of claims 1 to 9 comprises a flexible substrate and a mounting base; the mounting base comprises a mounting groove, the mounting groove comprises a mounting bottom surface perpendicular to a first direction and a mounting side surface inclined relative to the mounting bottom surface, and a plurality of VCSEL chips spaced apart are welded on the flexible substrate; The flexible substrate is attached to the mounting base; a refractor is installed at the notch of the mounting groove, and the refractor is arranged corresponding to the VCSEL chip on the mounting side, and is used to refract the laser of the VCSEL chip on the mounting side to a first direction.

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