Power failure reporting circuit and device based on communication module

Abstract

The invention discloses a power failure reporting circuit and device based on a communication module, which are used for quickly and accurately detecting a power failure condition and sending out power failure information through the communication module. The system comprises a power supply monitoring module, a main control chip, a boost module, a super capacitor module and a communication module. The power supply monitoring module monitors the power supply voltage of the equipment in real time and inputs the monitoring result into the main control chip; if the monitoring result is lower than a preset threshold value in the main control chip, the main control chip generates a report signal, and the report signal comprises a sending instruction and power failure information; the main control chip controls the boosting module to boost the working voltage to a preset voltage value, wherein the working voltage is the voltage required by the communication module for working; after it is determined that the working voltage is boosted to a preset voltage value, the boosting module sends a report signal to the communication module and provides the working voltage for the communication module; based on the large current provided by the super capacitor module and the sending instruction, the communication module reports the power failure information to the terminal.

Description

Technical Field

[0001] The present application relates to the field of circuit design, and in particular to a power-off reporting circuit and device based on a communication module. Background Art

[0002] With the rapid development of electronic technology and the power industry, intelligent devices have penetrated into all walks of life and become an indispensable part of modern production and life. These intelligent devices, whether they are security systems and entertainment equipment in smart homes, or automated control systems and data acquisition terminals in the industrial field, all rely on a stable power supply to maintain normal operation.

[0003] However, in actual applications, the device may suddenly lose power due to various reasons such as power failure, line problems or device aging. If this power failure is not detected in time and reported to the corresponding monitoring system, the power failure may cause data loss or damage to the data or tasks being processed. Secondly, the power failure of the device may also trigger system failures. If these failures are not discovered and repaired in time, they may even cause the entire system to fail. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a power-off reporting circuit and device based on a communication module.

[0005] The technical solution provided in this application is described below:

[0006] The first aspect of the present application provides a power-off reporting circuit based on a communication module, comprising:

[0007] Power monitoring module, main control chip, boost module, super capacitor module and communication module;

[0008] The power monitoring module monitors the power supply voltage of the device in real time and inputs the monitoring results into the main control chip;

[0009] If the monitoring result is lower than a preset threshold in the main control chip, the main control chip generates a reporting signal, and the reporting signal includes a sending instruction and power-off information;

[0010] The main control chip controls the boost module to boost the working voltage to a preset voltage value, and the working voltage is the voltage required for the communication module to work;

[0011] After determining that the working voltage is boosted to a preset voltage value, the boost module sends the reporting signal to the communication module and provides the working voltage to the communication module;

[0012] Based on the large current provided by the supercapacitor module and the sending instruction, the communication module reports the power-off information to the terminal.

[0013] Optionally, the power detection module includes a first power monitoring module and a second power monitoring module, the power supply voltage includes an external power supply voltage and a built-in power supply voltage, and the monitoring result includes a first monitoring result and a second monitoring result;

[0014] The power supply monitoring module monitors the power supply voltage of the device in real time and inputs the monitoring results into the main control chip, including:

[0015] The first power supply monitoring module monitors the external power supply voltage of the device in real time and inputs the first monitoring result into the main control chip;

[0016] The second power supply monitoring module monitors the built-in power supply voltage of the device in real time, and inputs the second monitoring result into the main control chip.

[0017] Optionally, the preset threshold includes a first preset threshold and a second preset threshold, and the reporting signal includes a first reporting signal, a second reporting signal and a third reporting signal;

[0018] If the monitoring result is lower than a preset threshold in the main control chip, the main control chip generates a reporting signal, including:

[0019] If the first monitoring result is lower than a first preset threshold in the main control chip, the main control chip generates a first reporting signal;

[0020] If the second monitoring result is lower than a second preset threshold in the main control chip, the main control chip generates a second reporting signal;

[0021] If the first monitoring result is lower than a first preset threshold in the main control chip and the second monitoring result is lower than a second preset threshold in the main control chip, the main control chip generates a third reporting signal.

[0022] Optionally, it also includes: a working voltage monitoring module;

[0023] After determining that the working voltage is boosted to a preset voltage value, before the boost module sends the reporting signal to the communication module and provides the working voltage to the communication module, the further comprising:

[0024] The working voltage monitoring module monitors the working voltage in real time and inputs the third monitoring result into the main control chip;

[0025] The main control chip compares the third monitoring result with the preset voltage value;

[0026] If the third monitoring result is greater than or equal to the preset voltage value, the main control chip determines that the working voltage is boosted to the preset voltage value.

[0027] Optionally, the first power supply monitoring module includes a first resistor, a second resistor and a first capacitor;

[0028] One end of the first resistor is connected to the positive electrode of the external power supply and the main control chip;

[0029] The other end of the first resistor is connected to one end of the second resistor, and a first output end is arranged at the connection;

[0030] The first output terminal, one end of the first capacitor and the main control chip are connected;

[0031] The other end of the second resistor, the other end of the first capacitor and the negative electrode of the external power supply are connected and grounded.

[0032] Optionally, the second power supply monitoring module includes a third resistor, a fourth resistor and a second capacitor;

[0033] One end of the third resistor is connected to the positive electrode of the built-in power supply and the main control chip;

[0034] The other end of the third resistor is connected to one end of the fourth resistor, and a second output end is arranged at the connection;

[0035] The second output terminal, one end of the second capacitor and the main control chip are connected;

[0036] The other end of the fourth resistor, the other end of the second capacitor and the negative electrode of the built-in power supply are connected and grounded.

[0037] Optionally, the working voltage monitoring module includes an eighth resistor, a ninth resistor and a sixth capacitor;

[0038] One end of the eighth resistor is connected to one end of the ninth resistor, and a third output end is arranged at the connection;

[0039] The other end of the ninth resistor is connected to one end of the sixth capacitor and is grounded;

[0040] The other end of the sixth capacitor, the third output end and the main control chip are connected.

[0041] Optionally, the boost module includes a fifth resistor, a sixth resistor, a seventh resistor, a second transistor, a third transistor, a first inductor, a fourth capacitor, a fifth capacitor, a fourth diode, a fifth diode and a power chip; the power chip includes a power chip input terminal, a power chip output terminal and a power chip ground terminal;

[0042] One end of the seventh resistor is connected to the main control chip, and the other end of the seventh resistor is connected to the base of the third transistor;

[0043] The collector of the third triode is connected to one end of the sixth resistor, and the emitter of the third triode is connected to one end of the fourth capacitor and grounded;

[0044] The other end of the sixth resistor is connected to the base of the second triode, and the other end of the fourth capacitor, the collector of the second triode and one end of the first inductor are connected;

[0045] One end of the fifth resistor is connected to the power supply, and the other end of the fifth resistor is connected to the emitter of the second transistor;

[0046] The other end of the first inductor, the anode of the fourth diode and the input end of the power chip are connected;

[0047] The cathode of the fourth diode, the anode of the fifth diode, the output terminal 1 of the power chip and the anode of the fifth capacitor are connected, and the cathode of the fifth capacitor and the ground terminal of the power chip are grounded;

[0048] The cathode of the fifth diode is connected to the other end of the eighth resistor, the super capacitor module and the communication module.

[0049] Optionally, the supercapacitor module includes a seventh capacitor and an eighth capacitor;

[0050] The positive electrode of the seventh capacitor is connected to the power supply, the negative electrode of the fifth diode, the other end of the eighth resistor and the communication module;

[0051] The negative electrode of the seventh capacitor is connected to the positive electrode of the eighth capacitor, and the negative electrode of the eighth capacitor is grounded.

[0052] A second aspect of the present application provides a gas valve control device, comprising:

[0053] The power supply monitoring module is used to monitor the power supply voltage of the device in real time and output the monitoring results to the main control chip;

[0054] A main control chip, used to receive the output of the power monitoring module, compare the monitoring result with a preset threshold, receive the output of the working voltage monitoring module, compare the third monitoring result with a preset voltage value, and generate and send a reporting signal;

[0055] The boost module is used to receive instructions from the main control chip and perform a boost operation on the working voltage according to the instructions;

[0056] A communication module, used for receiving a reporting signal and sending power-off information to a terminal;

[0057] The supercapacitor module is used to provide instantaneous large current to the communication module to complete the reporting of power-off information.

[0058] Specifically, it also includes a working voltage monitoring module;

[0059] The working voltage detection module is used to monitor the working voltage in real time and input the third monitoring result into the main control chip.

[0060] It can be seen from the above technical solutions that this application has the following advantages:

[0061] The power monitoring module can detect the power supply voltage status in real time. Once it detects that the power supply voltage is lower than the preset threshold (i.e. power failure), it immediately triggers the main control chip to start the power failure reporting process, ensuring that the device can respond quickly when encountering a power failure, and promptly notify relevant personnel or systems to take countermeasures, effectively reducing the risk of equipment damage or data loss caused by power interruption.

[0062] After the main control chip starts the reporting process, the main control chip can control the boost module to boost the voltage to activate the supercapacitor module to release the stored energy, providing temporary power support for the communication module, ensuring that even in the event of a power failure, the communication module can still maintain normal operation for a certain period of time, complete the sending of power-off information, ensure the complete transmission of power-off information, and enhance the reliability and stability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the technical solution in the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0064] Figure 1 This is a flow chart of an embodiment of a power failure reporting circuit based on a communication module of the present application;

[0065] Figure 2 A flow chart of an embodiment of a method for monitoring the power supply voltage of a device for the present application;

[0066] Figure 3 A flow chart of an embodiment of a method for generating a reporting signal for the present application;

[0067] Figure 4 A flow chart of an embodiment of a method for monitoring working voltage of the present application;

[0068] Figure 5 This is a circuit diagram of a power-off reporting circuit based on a communication module in this application;

[0069] Figure 6 This is a structural diagram of an embodiment of a power failure reporting device based on a communication module of the present application. DETAILED DESCRIPTION

[0070] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0071] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0072] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0073] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0074] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0075] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0076] Based on this, the present application discloses a power failure reporting circuit and device based on a communication module, which is used to quickly and accurately detect power failures and send the power failure information through the communication module.

[0077] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0078] See also Figure 1 The present application first provides an embodiment of a power-off reporting circuit based on a communication module, and the embodiment includes:

[0079] S101, the power supply monitoring module monitors the power supply voltage of the device in real time and inputs the monitoring result into the main control chip;

[0080] The power monitoring module monitors the power supply voltage of the device in real time to ensure that any changes in voltage can be captured in real time. Monitoring is achieved through a high-precision voltage detection circuit that can accurately convert the detected voltage value into a digital signal or other easy-to-process signal form.

[0081] Once the voltage value is monitored, the power monitoring module will immediately input the monitoring result (ie, voltage signal) into the main control chip, which is responsible for receiving and processing the monitoring result.

[0082] S102, if the monitoring result is lower than the preset threshold in the main control chip, the main control chip generates a reporting signal, and the reporting signal includes a sending instruction and power-off information;

[0083] After receiving the monitoring result input by the power monitoring module, the main control chip will immediately compare it with the preset voltage threshold in the main control chip. This preset threshold is set based on the normal operating voltage range of the device and safety considerations. If the monitored monitoring result (voltage value) is lower than this preset threshold, it means that the device may be powered off.

[0084] At this time, the main control chip will generate a reporting signal, which includes: first, a sending instruction to instruct the communication module to report the power-off information to the terminal; second, the power-off information itself, which records the current voltage status and possible reasons for the power-off.

[0085] S103, the main control chip controls the boost module to boost the working voltage to a preset voltage value, where the working voltage is the voltage required for the communication module to work;

[0086] After confirming that the device may have a power failure risk, the main control chip will immediately take action to ensure that the communication module can work normally and report the power failure information. The action taken is to control the boost module to boost the working voltage to the preset voltage value. This preset voltage value is the minimum voltage required to ensure that the communication module can work normally, ensuring that the communication module can still work stably in the case of insufficient voltage. The boost module converts the current low voltage value into the required high voltage value through the boost circuit, and stably provides it to the communication module for use.

[0087] S104, after determining that the working voltage is boosted to a preset voltage value, the boost module sends a reporting signal to the communication module and provides the working voltage to the communication module;

[0088] Once it is confirmed that the working voltage is stable and meets the requirements, the boost module will send the reporting signal generated by the main control chip to the communication module. At the same time, the boost module will continue to provide a stable working voltage to the communication module to ensure that the communication module can successfully report the power-off information to the terminal.

[0089] S105: Based on the high current provided by the supercapacitor module and the sending instruction, the communication module reports the power-off information to the terminal.

[0090] The supercapacitor module is specially designed for the communication module to provide a strong instantaneous current reserve. The communication module is used to report power failure information to the remote monitoring system.

[0091] When the power supply voltage is insufficient, the communication module can use the working voltage and current of the boost module and the supercapacitor module to support its operation; the working voltage and current provided by the boost module and the supercapacitor module can ensure that the communication module completes the reporting of power-off information.

[0092] In this embodiment, the power supply monitoring module can detect the power supply voltage status in real time. Once it detects that the power supply voltage is lower than the preset threshold (i.e., power failure), it immediately triggers the main control chip to start the power failure reporting process, ensuring that the device can respond quickly when encountering a power failure, and promptly notify relevant personnel or systems to take countermeasures, effectively reducing the risk of equipment damage or data loss due to power interruption.

[0093] After the main control chip starts the reporting process, the main control chip can control the boost module to boost the voltage to activate the supercapacitor module to release the stored energy, providing temporary power support for the communication module, ensuring that even in the event of a power failure, the communication module can still maintain normal operation for a certain period of time, complete the sending of power-off information, ensure the complete transmission of power-off information, and enhance the reliability and stability of the equipment.

[0094] See also Figure 2In a specific embodiment, the power detection module includes a first power monitoring module and a second power monitoring module, the power supply voltage includes an external power supply voltage and a built-in power supply voltage, the monitoring result includes a first monitoring result and a second monitoring result, and the present application provides an embodiment of a method for monitoring the power supply voltage of a device, including:

[0095] S201, a first power supply monitoring module monitors the external power supply voltage of the device in real time, and inputs a first monitoring result into a main control chip;

[0096] The external power supply voltage of the device is monitored in real time through the first power supply monitoring module.

[0097] If the voltage of the external power supply is too low, it may damage the device or cause the device to malfunction. Therefore, the first power supply monitoring module monitors the voltage in real time and transmits the monitoring result (ie, the first monitoring result) to the main control chip in real time.

[0098] S202: The second power supply monitoring module monitors the built-in power supply voltage of the device in real time, and inputs the second monitoring result into the main control chip.

[0099] Similar to step S201, this step monitors the voltage of the built-in power supply of the device. The built-in power supply usually refers to the battery or power module inside the device, which provides backup power for various components of the device.

[0100] The built-in power supply voltage of the device is monitored in real time through the second power supply monitoring module.

[0101] If the built-in power supply voltage is too low, it may also damage the device or cause the device to malfunction. Therefore, the second power supply monitoring module monitors the voltage in real time and transmits the monitoring result (ie, the second monitoring result) to the main control chip in real time.

[0102] In this embodiment, the first power supply monitoring module is specifically responsible for monitoring the external power supply voltage of the device. Real-time monitoring of the external power supply voltage can promptly detect fluctuations or abnormalities in the external power supply voltage, thereby avoiding damage or failure of the device caused by unstable external power supply voltage and ensuring stable operation of the device.

[0103] The second power supply monitoring module is dedicated to monitoring the built-in power supply voltage of the device. By monitoring the built-in power supply voltage in real time, it can ensure that the built-in power supply can provide power normally when needed, providing backup power supply guarantee for the operation of the device.

[0104] See also Figure 3In a specific embodiment, the preset threshold includes a first preset threshold and a second preset threshold, the reporting signal includes a first reporting signal, a second reporting signal and a third reporting signal, and the present application provides an embodiment of a method for generating a reporting signal, including:

[0105] S301: If the first monitoring result is lower than a first preset threshold in the main control chip, the main control chip generates a first reporting signal;

[0106] The main control chip stores one or more preset thresholds for judging whether the monitoring result is within the normal range. The first preset threshold is a threshold corresponding to the first monitoring result. When the main control chip receives the first monitoring result and judges that it is lower than the first preset threshold, it means that the monitored external power supply voltage has deviated from the normal range, which may indicate that the external power supply is powered off.

[0107] In order to notify the system or remote device in time, the main control chip will generate a first reporting signal, and the first reporting signal includes a sending instruction, the current voltage state of the external power supply, and a power-off condition.

[0108] S302: If the second monitoring result is lower than a second preset threshold in the main control chip, the main control chip generates a second reporting signal;

[0109] This step is similar to step S301, but involves another monitoring result and a corresponding preset threshold. A second preset threshold corresponding to the second monitoring result is stored inside the main control chip.

[0110] When the main control chip determines that the second monitoring result is lower than the second preset threshold, it indicates that the monitored built-in power supply voltage has deviated from the normal range, which may indicate that the built-in power supply has a power failure. In response to this situation, the main control chip will generate a "second reporting signal", including a sending instruction, the current voltage status of the built-in power supply, and the power failure situation.

[0111] S303: If the first monitoring result is lower than a first preset threshold in the main control chip and the second monitoring result is lower than a second preset threshold in the main control chip, the main control chip generates a third reporting signal.

[0112] If the two monitoring results are both lower than their corresponding first preset threshold and second preset threshold, it means that both the external power supply and the built-in power supply are powered off.

[0113] When this happens, the main control chip will generate a third reporting signal. The third reporting signal usually contains more information than the first and second reporting signals because it involves two or more abnormal parameters. The third reporting signal includes the sending instruction, the current voltage status of the external power supply, the current voltage status of the internal power supply, and the power failure status of both.

[0114] In this embodiment, by setting multiple preset thresholds and comparing with the corresponding monitoring results, the system can quickly identify whether the voltage of the external power supply and the internal power supply deviates from the normal range. This helps to promptly discover potential power supply problems, such as power failures.

[0115] When an abnormality is detected in one of the external power supply and the built-in power supply or in both of them, the main control chip generates different reporting signals, which can trigger the system to take necessary countermeasures.

[0116] See also Figure 4 In a specific embodiment, the power-off reporting circuit based on the communication module further includes a working voltage monitoring module. The present application provides an embodiment of a method for monitoring working voltage, including:

[0117] S401, the working voltage monitoring module monitors the working voltage in real time, and inputs the third monitoring result into the main control chip;

[0118] After completing the boost operation, the boost module will use a working voltage monitoring module to confirm whether the working voltage has reached a preset voltage value.

[0119] The working voltage monitoring module monitors the working voltage output by the boost module in real time to ensure that any fluctuation or change in the working voltage can be captured in real time. The working voltage monitoring module can accurately convert the detected working voltage value into a digital signal or other signal form that is easy for the main control chip to process. The monitored voltage value is the third monitoring result.

[0120] The working voltage monitoring module will immediately input the third monitoring result into the main control chip.

[0121] S402, the main control chip compares the third monitoring result with the preset voltage value;

[0122] After receiving the third monitoring result input by the working voltage monitoring module, the main control chip will immediately compare it with the preset voltage value in the main control chip. This preset voltage value is set according to the normal working voltage range of the communication module and safety considerations, and it represents the minimum or optimal voltage value required for the communication module to work stably.

[0123] S403: If the third monitoring result is greater than or equal to the preset voltage value, the main control chip determines that the working voltage is boosted to the preset voltage value.

[0124] If the third monitoring result is greater than or equal to the preset voltage value, it means that the working voltage output by the current boost module has met the requirements for the normal operation of the communication module.

[0125] In this embodiment, the operating voltage output by the boost module is monitored in real time by the operating voltage monitoring module, and any fluctuation or change in the operating voltage can be captured in real time. The main control chip automatically compares the third monitoring result with the preset voltage value, and the main control chip can determine whether the operating voltage output by the current boost module meets the requirements for the normal operation of the communication module. If the operating voltage is insufficient, the communication module may not work properly. This embodiment ensures that the communication module can operate under a stable operating voltage through real-time monitoring and comparison.

[0126] See also Figure 5 , the present application provides a circuit diagram of a power-off reporting circuit based on a communication module, including:

[0127] The first power supply monitoring module includes a first resistor R1, a second resistor R2 and a first capacitor C1;

[0128] One end of the first resistor R1 is connected to the positive electrode of the external power supply BT1 and the main control chip U2;

[0129] The other end of the first resistor R1 is connected to one end of the second resistor R2, and a first output end is provided at the connection;

[0130] The first output end, one end of the first capacitor C1 and the main control chip U2 are connected;

[0131] The other end of the second resistor R2, the other end of the first capacitor C1 and the negative electrode of the external power supply BT1 are connected and grounded;

[0132] The second power supply monitoring module includes a third resistor R3, a fourth resistor R4 and a second capacitor C2;

[0133] One end of the third resistor R3 is connected to the positive electrode of the built-in power supply BT2 and the main control chip U2;

[0134] The other end of the third resistor R3 is connected to one end of the fourth resistor R4, and a second output end is provided at the connection;

[0135] The second output end, one end of the second capacitor C2 and the main control chip U2 are connected;

[0136] The other end of the fourth resistor R4, the other end of the second capacitor C2 and the negative electrode of the built-in power supply BT2 are connected and grounded;

[0137] The working voltage monitoring module includes an eighth resistor R8, a ninth resistor R9 and a sixth capacitor C6;

[0138] One end of the eighth resistor R8 is connected to one end of the ninth resistor R9, and a third output end is provided at the connection;

[0139] The other end of the ninth resistor R9 is connected to one end of the sixth capacitor C6 and is grounded;

[0140] The other end of the sixth capacitor C6, the third output end and the main control chip U2 are connected;

[0141] The boost module includes a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, a second transistor Q2, a third transistor Q3, a first inductor L1, a fourth capacitor C4, a fifth capacitor C5, a fourth diode D4, a fifth diode D5 and a power chip U3; the power chip U3 includes a power chip input terminal, a power chip output terminal and a power chip ground terminal;

[0142] One end of the seventh resistor R7 is connected to the main control chip U2, and the other end of the seventh resistor R7 is connected to the base of the third transistor Q3;

[0143] The collector of the third triode Q3 is connected to one end of the sixth resistor R6, and the emitter of the third triode Q3 is connected to one end of the fourth capacitor C4 and grounded;

[0144] The other end of the sixth resistor R6 is connected to the base of the second transistor Q2, and the other end of the fourth capacitor C4, the collector of the second transistor Q2 and one end of the first inductor L1 are connected;

[0145] One end of the fifth resistor R5 is connected to the power supply, and the other end of the fifth resistor R5 is connected to the emitter of the second transistor Q2;

[0146] The other end of the first inductor L1, the anode of the fourth diode D4 and the input end of the power chip are connected;

[0147] The cathode of the fourth diode D4, the anode of the fifth diode D5, the output terminal 1 of the power chip and the anode of the fifth capacitor C5 are connected, and the cathode of the fifth capacitor C5 and the grounding terminal of the power chip are grounded;

[0148] The cathode of the fifth diode D5 is connected to the other end of the eighth resistor R8, the super capacitor module and the communication module;

[0149] The supercapacitor module includes a seventh capacitor C7 and an eighth capacitor C8;

[0150] The positive electrode of the seventh capacitor C7 is connected to the power supply, the negative electrode of the fifth diode D5, the other end of the eighth resistor R8 and the communication module;

[0151] The negative electrode of the seventh capacitor C7 is connected to the positive electrode of the eighth capacitor C8, and the negative electrode of the eighth capacitor C8 is grounded.

[0152] Specifically, the power-off reporting circuit based on the communication module further includes a voltage stabilizing circuit and a third diode D3;

[0153] The voltage stabilizing circuit includes a linear voltage stabilizer U1, a first MOS tube Q1, a first diode D1, and a second diode D2;

[0154] The drain of the first MOS tube Q1 is connected to the first power monitoring module, the gate of the first MOS tube Q1 is connected to the main control chip U2 and the first power monitoring module, and the source of the first MOS tube Q1 is connected to the anode of the first diode D1;

[0155] The anode of the second diode D2 is connected to the first power supply monitoring module;

[0156] The cathode of the first diode D1 and the cathode of the second diode D2 are connected to the input end of the linear regulator U1, and the output end of the linear regulator U1 is connected to the main control chip U2;

[0157] The anode of the third diode D3 is connected to the voltage stabilizing circuit, and the cathode of the third diode D3 is connected to the communication module, so as to prevent the output working voltage from being too high and causing damage to the linear regulator U1.

[0158] Working principle of power-off reporting circuit based on communication module:

[0159] When the external power supply BT1 is supplying power normally, the ADCs of the P20 and P21 pins of the main control chip U2 detect that the output voltages of the first power monitoring module and the second power monitoring module are both normal, that is, the first monitoring result X>1.50V and the second monitoring result Y>1.02V. The main control chip U2 sets the P40 pin to 0, the second transistor Q2 and the third transistor Q3 are in the cut-off state, and the boost module is turned off. The supercapacitor module provides high current storage for the communication module.

[0160] When the external power supply BT1 is abnormal, the P20 pin ADC of the main control chip U2 detects that the output voltage of the first power supply monitoring module is lower than the set threshold (the first monitoring result is 1.50V>X>1.32V), the power supply is automatically switched from the external power supply BT1 to the internal power supply BT2. If the P21 pin ADC of the main control chip U2 detects that the output voltage of the second power supply monitoring module is normal, that is, the second monitoring result Y>1.02V, the main control chip U2 sets the P40 pin to 1, the second transistor Q2 and the third transistor Q3 are in saturation state, the boost module is enabled, and the U3 chip starts working; the P43 pin ADC of the main control chip U2 detects that the working voltage of the positive electrode of the seventh capacitor C7 reaches or exceeds 5.4V after boosting, and then the communication module can be started to report power failure or low power information. The supercapacitor module provides large current storage for the communication module.

[0161] When the external power supply BT1 is normal and the internal power supply BT2 is abnormal (i.e. 1.32V>X>0V and Y>1.02V), the main control chip U2 immediately triggers the internal power failure alarm, and the main control chip U2 sets the P40 pin to 1, the transistors Q2 and Q3 are saturated, and the boost module is enabled. If the ADC detects the voltage Z>=5.4V, the communication module is started to report the external power failure, and the supercapacitor module provides large current storage for the communication module.

[0162] See also Figure 6 The present application also provides a power failure reporting device based on a communication module, comprising:

[0163] The power supply monitoring module 601 is used to monitor the power supply voltage of the device in real time and output the monitoring results to the main control chip;

[0164] The main control chip 602 is used to receive the output of the power monitoring module, compare the monitoring result with the preset threshold, receive the output of the working voltage monitoring module, compare the third monitoring result with the preset voltage value, and generate and send a reporting signal;

[0165] The boost module 603 is used to receive instructions from the main control chip and perform a boost operation on the working voltage according to the instructions;

[0166] The communication module 604 is used to receive the reporting signal and send the power failure information to the terminal;

[0167] The super capacitor module 605 is used to provide the communication module with an instantaneous large current so as to complete the reporting of power-off information.

[0168] Specifically, it also includes a working voltage monitoring module 606;

[0169] The working voltage detection module 606 is used to monitor the working voltage in real time and input the third monitoring result into the main control chip.

[0170] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0171] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0172] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0173] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0174] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, read-only memory), random access memory (RAM, random access memory), disk or optical disk and other media that can store program code.

Claims

1. A power failure reporting circuit based on a communication module, characterized in that: include: Power monitoring module, main control chip, boost module, super capacitor module and communication module; The power monitoring module monitors the power supply voltage of the device in real time and inputs the monitoring results into the main control chip; If the monitoring result is lower than a preset threshold in the main control chip, the main control chip generates a reporting signal, and the reporting signal includes a sending instruction and power-off information; The main control chip controls the boost module to boost the working voltage to a preset voltage value, and the working voltage is the voltage required for the communication module to work; After determining that the working voltage is boosted to a preset voltage value, the boost module sends the reporting signal to the communication module and provides the working voltage to the communication module; Based on the large current provided by the supercapacitor module and the sending instruction, the communication module reports the power-off information to the terminal.

2. The power-off reporting circuit based on the communication module according to claim 1, characterized in that: The power detection module includes a first power monitoring module and a second power monitoring module, the power supply voltage includes an external power supply voltage and a built-in power supply voltage, and the monitoring result includes a first monitoring result and a second monitoring result; The power supply monitoring module monitors the power supply voltage of the device in real time and inputs the monitoring results into the main control chip, including: The first power supply monitoring module monitors the external power supply voltage of the device in real time and inputs the first monitoring result into the main control chip; The second power supply monitoring module monitors the built-in power supply voltage of the device in real time, and inputs the second monitoring result into the main control chip.

3. The power-off reporting circuit based on the communication module according to claim 2, characterized in that: The preset threshold includes a first preset threshold and a second preset threshold, and the reporting signal includes a first reporting signal, a second reporting signal and a third reporting signal; If the monitoring result is lower than a preset threshold in the main control chip, the main control chip generates a reporting signal, including: If the first monitoring result is lower than a first preset threshold in the main control chip, the main control chip generates a first reporting signal; If the second monitoring result is lower than a second preset threshold in the main control chip, the main control chip generates a second reporting signal; If the first monitoring result is lower than a first preset threshold in the main control chip and the second monitoring result is lower than a second preset threshold in the main control chip, the main control chip generates a third reporting signal.

4. The power failure reporting circuit based on the communication module according to claim 3, characterized in that: Also includes: Working voltage monitoring module; After determining that the working voltage is boosted to a preset voltage value, before the boost module sends the reporting signal to the communication module and provides the working voltage to the communication module, the further comprising: The working voltage monitoring module monitors the working voltage in real time and inputs the third monitoring result into the main control chip; The main control chip compares the third monitoring result with the preset voltage value; If the third monitoring result is greater than or equal to the preset voltage value, the main control chip determines that the working voltage is boosted to the preset voltage value.

5. The power failure reporting circuit based on the communication module according to claim 4, characterized in that: The first power supply monitoring module includes a first resistor, a second resistor and a first capacitor; One end of the first resistor is connected to the positive electrode of the external power supply and the main control chip; The other end of the first resistor is connected to one end of the second resistor, and a first output end is arranged at the connection; The first output terminal, one end of the first capacitor and the main control chip are connected; The other end of the second resistor, the other end of the first capacitor and the negative electrode of the external power supply are connected and grounded.

6. The power failure reporting circuit based on the communication module according to claim 5, characterized in that: The second power supply monitoring module includes a third resistor, a fourth resistor and a second capacitor; One end of the third resistor is connected to the positive electrode of the built-in power supply and the main control chip; The other end of the third resistor is connected to one end of the fourth resistor, and a second output end is arranged at the connection; The second output end, one end of the second capacitor and the main control chip are connected; The other end of the fourth resistor, the other end of the second capacitor and the negative electrode of the built-in power supply are connected and grounded.

7. The power failure reporting circuit based on the communication module according to claim 6, characterized in that: The working voltage monitoring module includes an eighth resistor, a ninth resistor and a sixth capacitor; One end of the eighth resistor is connected to one end of the ninth resistor, and a third output end is arranged at the connection; The other end of the ninth resistor is connected to one end of the sixth capacitor and is grounded; The other end of the sixth capacitor, the third output end and the main control chip are connected.

8. The power failure reporting circuit based on the communication module according to claim 7, characterized in that: The boost module includes a fifth resistor, a sixth resistor, a seventh resistor, a second transistor, a third transistor, a first inductor, a fourth capacitor, a fifth capacitor, a fourth diode, a fifth diode and a power chip; the power chip includes a power chip input terminal, a power chip output terminal and a power chip ground terminal; One end of the seventh resistor is connected to the main control chip, and the other end of the seventh resistor is connected to the base of the third transistor; The collector of the third triode is connected to one end of the sixth resistor, and the emitter of the third triode is connected to one end of the fourth capacitor and grounded; The other end of the sixth resistor is connected to the base of the second triode, and the other end of the fourth capacitor, the collector of the second triode and one end of the first inductor are connected; One end of the fifth resistor is connected to the power supply, and the other end of the fifth resistor is connected to the emitter of the second transistor; The other end of the first inductor, the anode of the fourth diode and the input end of the power chip are connected; The cathode of the fourth diode, the anode of the fifth diode, the output terminal 1 of the power chip and the anode of the fifth capacitor are connected, and the cathode of the fifth capacitor and the ground terminal of the power chip are grounded; The cathode of the fifth diode is connected to the other end of the eighth resistor, the super capacitor module and the communication module.

9. The power failure reporting circuit based on the communication module according to claim 8, characterized in that: The super capacitor module includes a seventh capacitor and an eighth capacitor; The positive electrode of the seventh capacitor is connected to the power supply, the negative electrode of the fifth diode, the other end of the eighth resistor and the communication module; The negative electrode of the seventh capacitor is connected to the positive electrode of the eighth capacitor, and the negative electrode of the eighth capacitor is grounded.

10. A gas valve control device, characterized in that: include: The power supply monitoring module is used to monitor the power supply voltage of the device in real time and output the monitoring results to the main control chip; A main control chip, used to receive the output of the power monitoring module, compare the monitoring result with a preset threshold, receive the output of the working voltage monitoring module, compare the third monitoring result with a preset voltage value, and generate and send a reporting signal; The boost module is used to receive instructions from the main control chip and perform a boost operation on the working voltage according to the instructions; A communication module, used for receiving a reporting signal and sending power-off information to a terminal; The supercapacitor module is used to provide instantaneous large current to the communication module to complete the reporting of power-off information.

Images