Imaging driving device, camera module and assembling method of camera module

Abstract

The invention discloses an imaging driving device, a camera module and an assembling method of the camera module, the imaging driving device comprises a module circuit board, the module circuit board comprises an imaging circuit board and a driving circuit board, the imaging circuit board is used for being electrically connected with a photosensitive chip, the driving circuit board can flexibly extend from the outer side of the imaging circuit board, and the driving circuit board is electrically connected with the photosensitive chip. The driving circuit board is electrically connected to the imaging circuit board in a bendable manner; the base is formed on the imaging circuit board, and the base extends towards the light incident side from the imaging circuit board in the first direction; the driving circuit board is suitable for being bent towards the base from the outer side of the imaging circuit board, so that the driving circuit board and the side wall of the base are oppositely arranged in the second direction and / or oppositely arranged in the third direction, and the driving circuit board is located on the periphery of the base. The driving circuit board is electrically connected to the outer side of the imaging circuit board in a flexible bending manner, so that the arrangement of the driving circuit board and the imaging circuit board is more compact, and the imaging driving device can be miniaturized, light and thin.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to an imaging drive device, a camera module and an assembling method of the camera module. Background Art

[0002] In the field of consumer electronics, especially in the field of smart devices, miniaturized and lightweight camera modules are an indispensable component. Currently, at least one camera module is configured on the portable terminal body. The drive device is an indispensable component of the high-pixel camera module. During the operation of the camera module, the drive device can make the optical lens move in multiple directions to realize the AF function (Auto Focus) and OIS function (Optical Image Stabilization) during the shooting process.

[0003] In order to meet market demand, the requirements for the imaging quality and imaging function of camera modules are getting higher and higher, and the number of lenses in the optical lens is gradually increasing, resulting in the increasing size and weight of the optical lens. Correspondingly, the drive device needs to have a greater driving force to ensure that the optical lens moves quickly and smoothly.

[0004] In the related art, the structure of the driving device and the structure of the camera module are usually designed independently and installed separately. For example, the base of the driving device and the base of the camera module are two different devices. The base of the driving device is mainly used to carry a number of functional devices such as a driving circuit board and movable components; while the base of the camera module is mainly used to carry devices such as the driving device and optical lenses. The base of the camera module can also be used to attach filters. When installing the driving device on the base of the camera module, it is also necessary to consider avoiding resistors and containers. In other words, the base of the driving device and the base of the camera module need to consider their structural strength, the minimum wall thickness that can be injection molded, the flatness of the finished product and other factors, which ultimately results in the total height of the camera module being raised by the base of the driving device and the base of the camera module.

[0005] However, as electronic devices become increasingly lighter and thinner, the demand for miniaturization of camera modules has become increasingly stringent, especially the requirement for the shoulder height of camera modules. The shoulder height of a camera module refers to the vertical height from the mounting substrate of the camera module (such as an imaging circuit board, the bottom surface of the camera module) to the highest point (such as the top surface of the camera module housing, the top surface of the optical lens). The shoulder height of the camera module will directly affect the thickness of the electronic device and the appearance design of the entire machine. Therefore, the shoulder height of the camera module needs to be strictly limited to meet the requirements of the overall design of the electronic device.

[0006] Therefore, for the sub-components with execution functions of the driving device and optical lens, such as driving coils, driving magnets, guides, reeds, etc., it is necessary to reduce the size and occupy the space as much as possible, or move them closer to the mounting substrate (such as an imaging circuit board) to reduce the shoulder height of the camera module. Summary of the invention

[0007] One object of the present invention is to provide an imaging drive device, which integrates functional devices with electrical performance of a camera module into the module circuit board of the imaging drive device, so as to achieve the sinking or downward movement of the functional devices, thereby reducing the shoulder height of the camera module.

[0008] Another object of the present invention is to provide an imaging drive device, which directly connects the driving circuit board and the imaging circuit board of the camera module to form a module circuit board of the imaging drive device, thereby reducing welding operations, simplifying the conduction steps, and improving the reliability of electrical connection.

[0009] Another object of the present invention is to provide a camera module, wherein the base of the camera module is formed on the module circuit board of the imaging drive device, so that the base of the camera module can be lowered; the movable component is directly supported by the base, so that the movable component can sink or move downward, thereby reducing the shoulder height of the camera module.

[0010] Another object of the present invention is to provide a camera module that can reduce the number of components supported by the base, thereby alleviating the burden on the supporting area of ​​the base.

[0011] Another object of the present invention is to provide a camera module, which can integrate devices used for imaging and driving through an imaging drive device, thereby making the structure of the camera module more compact and reducing the size of the camera module.

[0012] Another object of the present invention is to provide an assembly method for assembling the above-mentioned camera module.

[0013] To achieve at least one of the above purposes, the technical solution adopted by the present invention is: an imaging drive device, comprising: a module circuit board, the module circuit board comprising an imaging circuit board and a driving circuit board, the imaging circuit board is used to be electrically connected to a photosensitive chip, the driving circuit board flexibly extends from the outer side of the imaging circuit board, so that the driving circuit board can be bendably electrically connected to the imaging circuit board; a base, the base is formed on the imaging circuit board, and the base extends from the imaging circuit board toward the light incident side along a first direction; wherein the driving circuit board is suitable for bending from the outer side of the imaging circuit board toward the base, so that the driving circuit board and the side wall of the base are arranged relative to each other along a second direction and / or arranged relative to each other along a third direction, and are located on the periphery of the base; wherein the first direction is parallel to the height direction of the imaging drive device, the second direction is parallel to the length direction of the imaging drive device, and the third direction is parallel to the width direction of the imaging drive device, and the first direction, the second direction and the third direction are orthogonal to each other.

[0014] Preferably, the imaging drive device further comprises a drive coil, which is electrically connected to the drive circuit board. When the drive circuit board is bent to be arranged on an eccentric surface with the imaging circuit board, the drive coil is located on the surface of the drive circuit board facing the base.

[0015] Preferably, the driving circuit board includes a mounting portion and a bending portion, wherein the bending portion flexibly and conductively connects the mounting portion and the imaging circuit board, and the bending portion is suitable for bending from the outer side of the imaging circuit board toward the base so that the mounting portion and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction.

[0016] Preferably, the width of the bending portion is smaller than the length of the edge of the mounting portion to which it is connected, the width of the bending portion is smaller than the length of the edge of the imaging circuit board to which it is connected, the bending portion is connected to the middle section of the edge of the mounting portion, and is connected to the middle section of the edge of the imaging circuit board.

[0017] Preferably, a groove is provided on the edge of the imaging circuit board, and the opening of the groove faces the outside of the imaging circuit board. The bending portion is connected to the bottom of the groove. When the driving circuit board and the imaging circuit board are placed on the same plane, at least part of the bending portion is accommodated in the groove. When the driving circuit board and the imaging circuit board are arranged on different planes, the projection of the bending portion along the first direction falls into the projection of the groove along the first direction.

[0018] Preferably, the mounting portion includes a first plate, a second plate and a third plate, and when the driving circuit board is bent to be arranged in an eccentric manner with the imaging circuit board, surfaces of the first plate, the second plate and the third plate are all parallel to a first direction, wherein the first plate and the third plate are arranged relatively to each other along a third direction, and the second plate is located between the first plate and the third plate, so that the first plate, the second plate and the third plate surround the outer periphery of the base.

[0019] As a preference, the imaging circuit board includes a first side, a second side, a third side and a fourth side arranged in sequence in a counterclockwise direction, and the bending portion includes a first soft board, a second soft board and a third soft board, wherein the first soft board can be flexibly bent to connect and conduct the first side and the first board body, the second soft board can be flexibly bent to connect and conduct the second side and the second board body, and the third soft board can be flexibly bent to connect and conduct the third side and the third board body, so that the first board body, the second board body and the third board body are suitable for bending from the outside of the imaging circuit board toward the base.

[0020] Preferably, the mounting portion defines a limited area, the base has a boss, the boss extends from the side wall of the base toward the mounting portion, and when the mounting portion and the side wall of the base are arranged relative to each other along a second direction and / or relative to each other along a third direction, the boss extends into the limited area, so that the mounting portion is fixed to the base.

[0021] Preferably, a through slot is provided in an area on the base corresponding to the drive coil, and when the drive circuit board is bent to be arranged on a different plane from the imaging circuit board, the drive coil can be accommodated in the through slot.

[0022] Preferably, the imaging drive device further comprises a reinforcing plate, and the reinforcing plate is arranged on a surface of the mounting portion which is away from the driving coil, so as to support the mounting portion.

[0023] Preferably, the driving coil includes a focusing coil, a first anti-shake coil and a second anti-shake coil, wherein the focusing coil is arranged on the first plate body, the first anti-shake coil is arranged on the second plate body, and the second anti-shake coil is arranged on the third plate body.

[0024] Preferably, the imaging drive device further comprises a connecting component, which extends from the outside of the imaging circuit board so that the connecting component is electrically connected to the imaging circuit board, and the connecting component and the driving circuit board are located on opposite sides of the imaging circuit board.

[0025] Preferably, the imaging drive device further comprises a sensing device for sensing the position of the optical lens. The sensing device is electrically connected to the driving circuit board. When the driving circuit board is bent to be arranged on a different plane from the imaging circuit board, the sensing device is located on the surface of the driving circuit board facing the base.

[0026] In order to achieve at least one of the above purposes, the technical solution adopted by the present invention is: a camera module, comprising: an imaging drive device as described in any one of the above; a photosensitive component, the photosensitive component includes a photosensitive chip, and the photosensitive chip is electrically connected to the imaging circuit board of the imaging drive device for imaging; a movable component, the movable component is movably arranged on the base of the imaging drive device; and an optical lens, the optical lens is carried by the movable component so as to be movably maintained on the light-sensitive path of the photosensitive component.

[0027] Preferably, the camera module further comprises a shell, which is suitable for covering the outer side of the base so that the driving circuit board of the imaging driving device is maintained between the shell and the base; an avoidance zone is provided at the lower edge of the shell, and the opening of the avoidance zone faces the imaging circuit board of the imaging driving device to avoid the driving circuit board.

[0028] Preferably, the camera module further includes a driving magnet, which is arranged on the movable component. The driving magnet and the driving coil of the imaging driving device are arranged relative to each other along the second direction and / or along the third direction, so as to drive the movable component to move relative to the base.

[0029] As a preferred embodiment, the driving magnet includes a focusing magnet, a first anti-shake magnet and a second anti-shake magnet, wherein the focusing magnet and the focusing coil of the imaging drive device are relatively arranged along a third direction to drive the movable component to move relative to the base along the first direction, the first anti-shake magnet and the first anti-shake coil of the imaging drive device are relatively arranged along the second direction to drive the movable component to move relative to the base along the second direction, and the second anti-shake magnet and the second anti-shake coil of the imaging drive device are relatively arranged along the third direction to drive the movable component to move relative to the base along the third direction.

[0030] In order to achieve at least one of the above purposes, the technical solution adopted by the present invention is: an assembly method for assembling any of the above-mentioned camera modules, comprising the steps of: S1. Provide an imaging drive device, a photosensitive component and a movable component, install the photosensitive component on an imaging circuit board of the imaging drive device, and install the movable component on a base of the imaging drive device; S2, providing an optical lens, and installing the optical lens on the movable component, wherein an external coil semi-finished product jig and the photosensitive component are energized to assist in calibrating and installing the optical lens; S3, providing a driving coil and a sensing device, and fixing the driving coil and the sensing device to a driving circuit board of the imaging driving device respectively and conducting the driving circuit board; S4. Bend the driving circuit board so that the driving circuit board and the side wall of the base are arranged opposite to each other along the second direction and / or along the third direction, and are located at the periphery of the base; provide a shell, and cover the periphery of the driving circuit board with the shell.

[0031] Compared with the prior art, the present invention has the following beneficial effects: (1) The functional components with electrical performance of the camera module are integrated into the module circuit board of the imaging drive device, and the base of the camera module is imaged on the module circuit board of the imaging drive device, so that the arrangement of the functional components is more centralized and the structure of the camera module is more compact, thereby reducing the shoulder height of the camera module, which is conducive to realizing the thinness of the camera module.

[0032] (2) The driving circuit board of the camera module and the imaging circuit board of the camera module are directly connected to form a module circuit board of the imaging driving device, so that the driving circuit board and the imaging circuit board are directly electrically connected, which reduces welding operations, simplifies the conduction steps, and improves the reliability of electrical connection. It also makes the arrangement of the driving circuit board and the imaging circuit board more compact, which is conducive to the miniaturization of the camera module.

[0033] (3) The base of the camera module is formed on the module circuit board of the imaging drive device, and the drive circuit board is suitable for bending from the imaging circuit board toward the base, so that the drive circuit board and the side wall of the base are arranged relative to each other along the second direction and / or arranged relative to each other along the third direction, which is beneficial to further reduce the shoulder height of the camera module and facilitate the assembly of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a three-dimensional structural diagram of an imaging drive device and a movable component according to some embodiments of the present application.

[0035] Figure 2 is an exploded view of an imaging drive device and a movable component according to some embodiments of the present application.

[0036] Figure 3 It is a three-dimensional structural diagram of a module circuit board according to some embodiments of the present application.

[0037] Figure 4 This is a schematic diagram of a driving coil and a sensing device disposed on a driving circuit board according to some embodiments of the present application.

[0038] Figure 5 This is an exploded view of a drive coil and a photosensitive component arranged on a module circuit board according to some embodiments of the present application.

[0039] Figure 6 It is a three-dimensional structural diagram of a base according to some embodiments of the present application.

[0040] Figure 7 It is a three-dimensional structural diagram of a focusing carrier according to some embodiments of the present application.

[0041] Figure 8 It is a three-dimensional structural diagram of an anti-shake carrier according to some embodiments of the present application.

[0042] Fig. 9 It is a three-dimensional structural diagram of a stop assembly according to some embodiments of the present application.

[0043] Fig.10 This is a three-dimensional structural diagram of a camera module according to some embodiments of the present application.

[0044] Fig.11 is a cross-sectional view of a camera module according to some embodiments of the present application.

[0045] Fig.12 yes Fig.11 Enlarged view of part A.

[0046] In the figure: 1, imaging driving device; 10, base; 11, first side wall; 12, second side wall; 13, third side wall; 14, fourth side wall; 15, accommodating space; 16, convex column; 17, through groove; 18, base guide groove; 20, module circuit board; 21, imaging circuit board; 211, first side edge; 212, second side edge; 213, third side edge; 214, fourth side edge; 215, groove; 216, through hole; 22, driving circuit board; 221 , mounting portion; 2211, first plate; 2212, second plate; 2213, third plate; 2214, limiting area; 222, bending portion; 2221, first soft board; 2222, second soft board; 2223, third soft board; 30, connecting assembly; 31, connecting belt; 32, connector; 40, reinforcing plate; 41, first reinforcing plate; 42, second reinforcing plate; 43, third reinforcing plate; 50, driving coil; 51, focusing coil; 52, first Anti-shake coil; 53, second anti-shake coil; 60, sensing device; 2, camera module; 70, driving magnet; 71, focus magnet; 72, first anti-shake magnet; 73, second anti-shake magnet; 80, movable component; 81, focus carrier; 811, focus receiving groove; 812, open area; 813, focus guide groove; 82, anti-shake carrier; 821, first anti-shake receiving groove; 822, second anti-shake receiving groove; 823, anti-shake guide groove; 83, focus guide ; 84. Anti-shake guide; 85. Focus magnetic member; 86. Anti-shake magnetic member; 90. Housing; 91. Avoidance area; 92. Recess; 93. Gap; 101. Stop assembly; 1011. Bracket; 1012. Buffer; 102. Photosensitive assembly; 1021. Photosensitive chip; 1022. Electronic component; 1023. Filter; 1024. Glue layer; 1025. Support plate; 103. Optical lens; 1031. Lens barrel; 1032. Lens. DETAILED DESCRIPTION

[0047] The present invention is further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0048] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present invention.

[0049] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0050] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0051] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection, or an indirect connection through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] The present application provides a camera module, such as Figure 1-Figure 12 As shown, the camera module 2 includes an imaging drive device 1, a photosensitive component 102, a movable component 80 and an optical lens 103. The imaging drive device 1 is suitable for driving the movable component 80 to carry the optical lens 103 and move relative to the photosensitive component 102 to achieve the adjustment of optical performance. The camera module 2 includes functional devices and structural devices with electrical performance. The functional devices with electrical performance are integrated into the imaging drive device 1 to achieve the sinking or downward movement of the functional devices, thereby reducing the shoulder height of the camera module 2. Further, the base 10 is formed on the module circuit board 20 of the imaging drive device 1, so as to integrate the functions of the base of the camera module and the base of the driving device in the related technology, thereby achieving the lowering of the base 10 of the camera module 2; the movable component 80 is directly supported by the base 10 of the imaging drive device 1, so as to achieve the sinking or downward movement of the movable component 80, further reducing the shoulder height of the camera module 2. In addition, the imaging driving device 1 can integrate the components used for imaging and driving, making the structure of the camera module 2 more compact and reducing the components supported by the base 10, thereby reducing the burden on the supporting area of ​​the base 10.

[0053] Specifically, the present application provides an imaging driving device 1 of a camera module 2, wherein the imaging driving device 1 is capable of integrating functional devices with electrical performance of the camera module 2 and a photosensitive component 102 of the camera module 2. Figure 1-Figure 12As shown, the imaging driving device 1 includes a module circuit board 20 and a base 10. The module circuit board 20 includes an imaging circuit board 21 and a driving circuit board 22. The imaging circuit board 21 is used to be electrically connected to the photosensitive chip 1021, so as to convert the optical signal captured by the photosensitive chip 1021 into an electrical signal and process it. The driving circuit board 22 flexibly extends from the outer side of the imaging circuit board 21, so that the driving circuit board 22 can be electrically connected to the imaging circuit board 21 in a bendable manner.

[0054] It should be understood that the driving circuit board 22 is used to set functional devices with electrical properties such as the driving coil 50 and the sensing device 60 of the camera module 2, so that the module circuit board 20 can integrate the driving coil 50, the sensing device 60 and other functional devices with electrical properties and the photosensitive component 102. In other words, the imaging drive device 1 can integrate the photosensitive component 102 for imaging and the functional devices for driving, so as to realize the sinking or downward movement of the functional devices, thereby reducing the shoulder height of the camera module 2.

[0055] Furthermore, the driving circuit board 22 can be bendably connected to the imaging circuit board 21, and can be bent relative to the imaging circuit board 21, so that the driving circuit board 22 is suitable for being arranged along the height direction of the camera module 2 and is located on the outside of the imaging circuit board 21, so that the arrangement of the driving circuit board 22 and the imaging circuit board 21 can be made more compact, which is beneficial to avoid the functional components with electrical properties of the camera module 2 occupying the space in the height direction of the camera module 2.

[0056] Furthermore, the driving circuit board 22 and the imaging circuit board 21 are directly connected, which is conducive to avoiding the need to set up an additional flexible printed circuit board for connecting the driving circuit board 22 and the imaging circuit board 21, thereby reducing the space required for setting up an additional flexible printed circuit board, which is conducive to miniaturization of the camera module 2. In addition, in the process of designing the camera module 2, there is no need to consider the installation position and installation method of the flexible printed circuit board, which is conducive to reducing the design difficulty and complexity of the camera module 2.

[0057] It is worth mentioning that the driving circuit board 22 is electrically connected to the imaging circuit board 21 as an integral unit, that is, there is no need to weld the imaging circuit board 21 and the driving circuit board 22 of the module circuit board 20, thereby improving the reliability of the electrical connection between the driving circuit board 22 and the imaging circuit board 21, and reducing the difficulty of conduction between the driving circuit board 22 and the imaging circuit board 21, thereby improving the production efficiency of the imaging driving device 1 and the camera module 2.

[0058] like Figure 1 and Figure 2As shown, the base 10 is formed on the imaging circuit board 21, and the base 10 extends from the imaging circuit board 21 toward the light incident side along the first direction. Furthermore, the driving circuit board 22 is suitable for bending from the outer side of the imaging circuit board 21 toward the base 10, so that the driving circuit board 22 and the side wall of the base 10 are arranged relative to each other along the second direction and / or relatively arranged along the third direction, and are located on the periphery of the base 10, which is conducive to further reducing the size of the camera module 2 along the first direction, that is, reducing the shoulder height of the camera module 2. It is worth noting that the driving circuit board 22 is suitable for bending from the outer side of the imaging circuit board 21 toward the base 10, which is conducive to reducing the difficulty of assembling the driving circuit board 22, thereby improving production efficiency.

[0059] It should be understood that the base 10 is molded on the imaging circuit board 21, so as to improve the connection strength and connection reliability between the base 10 and the imaging circuit board 21, which is beneficial to reduce the risk of loose connection due to vibration or external force impact; it is also possible to reduce the gap or support structure required for the additional installation of the base 10, so as to make the structure of the camera module 2 more compact, which is beneficial to reduce the size of the camera module 2.

[0060] It is worth mentioning that in the related art, the movable component is supported by the base of the driving device, and further, the driving device is supported by the base of the camera module. The base of the camera module not only needs to support the movable component, but also needs to support the base of the driving device. In the present application, through the imaging driving device 1, the base 10 is formed on the imaging circuit board 21 of the module circuit board 20, and the movable component 80 is directly supported by the base 10, so as to reduce the components supported by the base 10, thereby reducing the burden on the supporting area of ​​the base 10. In addition, the movable component 80 is directly supported by the base 10 of the imaging driving device 1, and the movable component 80 can also be sunk or moved downward, so that the structure of the camera module 2 is more compact, and the shoulder height of the camera module 2 can be further reduced.

[0061] Among them, the first direction is parallel to the height direction of the imaging drive device 1, that is, the optical axis direction of the camera module 2, the second direction is parallel to the length direction of the imaging drive device 1, and the third direction is parallel to the width direction of the imaging drive device 1. The first direction, the second direction and the third direction are orthogonal to each other.

[0062] In some embodiments, Figure 1 and Figure 2As shown, the imaging drive device 1 further includes a drive coil 50, which is electrically connected to the drive circuit board 22, and is used to drive the optical lens 103 to move relative to the base 10. It should be understood that when the drive circuit board 22 is bent to be arranged on a different plane from the imaging circuit board 21, the drive coil 50 is located on the surface of the drive circuit board 22 facing the base 10. In at least one embodiment, the drive coil 50 is arranged on the surface of the drive circuit board 22 facing the movable component 80, which is conducive to reducing the distance between the drive coil 50 and the drive magnet 70 of the camera module 2.

[0063] That is to say, when the driving coil 50 is installed on the driving circuit board 22, and when the base 10 is formed, the driving circuit board 22 is suitable for being arranged coplanar with the imaging circuit board 21, that is, the driving circuit board 22 is also able to extend in a plane perpendicular to the first direction, thereby facilitating the installation and conduction operation of the driving coil 50, and helping to reduce the interference of the driving circuit board 22 on the injection molding base 10. Further, after the driving coil 50 is installed on the driving circuit board 22 and the base 10 is formed, the driving circuit board 22 is suitable for bending from the imaging circuit board 21 toward the base 10, so that the driving circuit board 22 and the side wall of the base 10 are arranged relative to each other along the second direction and / or relative to each other along the third direction, that is, the driving circuit board 22 and the imaging circuit board 21 are arranged on different planes, and the driving coil 50 is able to be located on the side of the driving circuit board 22 facing the side wall of the base 10.

[0064] In some embodiments, Figure 2-Figure 5 As shown, the driving circuit board 22 includes a mounting portion 221 and a bending portion 222, the bending portion 222 flexibly and conductively connects the mounting portion 221 and the imaging circuit board 21, and the bending portion 222 is suitable for bending from the outer side of the imaging circuit board 21 toward the base 10, so that the mounting portion 221 and the side wall of the base 10 are arranged opposite to each other along the second direction and / or arranged opposite to each other along the third direction. Further, the driving coil 50 is arranged on the surface of the mounting portion 221 facing the base 10. In other words, the bending portion 222 can play the role of a connecting strip, so that the mounting portion 221 is mechanically and electrically connected to the imaging circuit board 21, that is, the driving circuit board 22 is electrically connected to the imaging circuit board 21 as a whole.

[0065] It should be understood that the bending portion 222 is flexible and can be bent, so that the mounting portion 221 and the imaging circuit board 21 are arranged on different planes. Specifically, when the driving coil 50 is installed on the driving circuit board 22, the mounting portion 221 is suitable for being arranged on the same plane as the imaging circuit board 21, so as to facilitate the installation and conduction operation of the driving coil 50, which is beneficial to improve the assembly accuracy of the driving coil 50. When molding the base 10, the mounting portion 221 and the imaging circuit board 21 are arranged on the same plane; or by bending the bending portion 222, the mounting portion 221 and the injection mold are respectively located on different planes of the imaging circuit board 21, which is beneficial to reduce the interference of the mounting portion 221 and the bending portion 222 on the injection molding base 10. Furthermore, after the drive coil 50 is installed on the drive circuit board 22 and the base 10 is formed, by bending the bending portion 222, the mounting portion 221 and the side wall of the base 10 can be arranged relative to each other along the second direction and / or relative to each other along the third direction, and the drive coil 50 can be located on the side of the side wall of the mounting portion 221 facing the base 10.

[0066] It is worth mentioning that the bending portion 222 is conducive to maintaining integrity when repeatedly bent in different directions, and then in the process of assembling and producing the camera module 2, the bending portion 222 can reliably maintain the integral connection and mutual conduction between the mounting portion 221 and the imaging circuit board 21, and also facilitate the repeated disassembly and maintenance of the camera module 2. For example, when the drive coil 50 needs to be repaired, the mounting portion 221 and the imaging circuit board 21 can be made coplanar through the bending portion 222, that is, the mounting portion 221 extends in a plane perpendicular to the first direction, so that the engineering personnel can repair the drive coil 50; after the maintenance is completed, the drive coil 50 can be re-arranged relative to the drive magnet 70 of the movable component 80 by bending the bending portion 222.

[0067] In some embodiments, Figure 2-Figure 5 As shown, the width of the bending portion 222 is smaller than the length of the edge of the mounting portion 221 connected thereto, and the width of the bending portion 222 is smaller than the length of the edge of the imaging circuit board 21 connected thereto, so that the bending portion 222 can have a smaller width on the basis of reliable mechanical connection and electrical connection between the mounting portion 221 and the imaging circuit board 21, thereby making the structure between the driving circuit board 22 and the imaging circuit board 21 more compact. It is worth mentioning that by making the bending portion 222 have a smaller width, it is also helpful to reduce the reaction force of the bending portion 222, that is, it makes the bending portion 222 easier to deform, thereby reducing the difficulty of bending the bending portion 222 when assembling the camera module 2, and it is also helpful to keep the mounting portion 221 relative to the side wall of the base 10.

[0068] Further, such as Figure 2-Figure 5As shown, the bent portion 222 is connected to the middle section of the edge of the mounting portion 221 and the middle section of the edge of the imaging circuit board 21, which is conducive to avoiding the interference of the bent portion 222 with the two ends of the mounting portion 221 and the corner of the imaging circuit board 21, so that the structure of the mounting portion 221 and the imaging circuit board 21 is more compact. In addition, the bent portion 222 is connected to the middle section of the edge of the mounting portion 221. When the mounting portion 221 is arranged opposite to the side wall of the base 10, the bent portion 222 can support the mounting portion 221 more stably, so that the force on the mounting portion 221 is more balanced. In addition, the bent portion 222 is connected to the middle section of the edge of the mounting portion 221, so that the wiring on the mounting portion 221 extends from the middle to the two ends, which is conducive to avoiding the wiring being too long, and thus helping to avoid the occurrence of signal delay, signal reflection and crosstalk.

[0069] It is worth mentioning that, compared with the bending portion 222 connecting the entire edge of the mounting portion 221 and the entire edge of the imaging circuit board 21, in this embodiment, the bending portion 222 connects the middle section of the mounting portion 221 and the middle section of the imaging circuit board 21, which is beneficial to reducing the risk of twisting of the bending portion 222 due to improper bending angle or bending position, and reducing the risk of pulling and damage of the bending portion 222 due to twisting, which is beneficial to further improve the reliability and stability of the bending portion 222 mechanically and electrically connecting the mounting portion 221 and the imaging circuit board 21.

[0070] In some embodiments, Figure 3 As shown, a groove 215 is provided at the edge of the imaging circuit board 21, the opening of the groove 215 faces the outside of the imaging circuit board 21, and the bent portion 222 is connected to the bottom of the groove 215. It should be understood that when the driving circuit board 22 and the imaging circuit board 21 are placed on the same plane, at least part of the bent portion 222 is accommodated in the groove 215, and while ensuring that the bent portion 222 has a sufficient length, the structure between the imaging circuit board 21, the bent portion 222 and the mounting portion 221 is made more compact, which is conducive to reducing the overall size of the imaging circuit board 21 and the driving circuit board 22, so as to facilitate storage and improve transportation efficiency.

[0071] Further, when the driving circuit board 22 and the imaging circuit board 21 are arranged on different surfaces, the projection of the bending portion 222 along the first direction falls into the projection of the groove 215 along the first direction. In other words, when the mounting portion 221 of the imaging circuit board 21 is arranged relative to the side wall of the base 10, the projection of the bending portion 222 along the first direction falls into the projection of the groove 215 along the first direction. It is worth mentioning that at this time, the projection of the mounting portion 221 along the first direction falls into the projection of the imaging circuit board 21 along the first direction, which is conducive to reducing the size of the imaging driving device 1 and the camera module 2 along the second direction and the third direction.

[0072] In some embodiments, Figure 6As shown, the base 10 includes a first side wall 11, a second side wall 12, a third side wall 13 and a fourth side wall 14 which are arranged in sequence in a counterclockwise direction, defining a receiving space 15 between the first side wall 11, the second side wall 12, the third side wall 13 and the fourth side wall 14, and the receiving space 15 is used to accommodate the movable component 80 of the camera module 2.

[0073] Further, such as Figure 3 and Figure 5 As shown, the mounting portion 221 includes a first plate 2211, a second plate 2212 and a third plate 2213. When the driving circuit board 22 is bent to be arranged in an eccentric manner with the imaging circuit board 21, the surfaces of the first plate 2211, the second plate 2212 and the third plate 2213 are all parallel to the first direction, wherein the first plate 2211 and the third plate 2213 are arranged opposite to each other along the third direction, and the second plate 2212 is located between the first plate 2211 and the third plate 2213, so that the first plate 2211, the second plate 2212 and the third plate 2213 surround the outer periphery of the base 10. Specifically, the first plate 2211 is arranged opposite to the first side wall 11 of the base 10 along the third direction, the second plate 2212 is arranged opposite to the second side wall 12 of the base 10 along the second direction, and the third plate 2213 is arranged opposite to the third side wall 13 of the base 10 along the third direction.

[0074] In some embodiments, Figure 4 As shown, the driving coil 50 includes a focus coil 51, a first anti-shake coil 52 and a second anti-shake coil 53. The focus coil 51 is arranged on the first plate 2211, the first anti-shake coil 52 is arranged on the second plate 2212, and the second anti-shake coil 53 is arranged on the third plate 2213.

[0075] Specifically, the focus coil 51 is arranged on the surface of the first plate 2211 facing the movable component 80, and is accommodated in the through groove 17 on the first side wall 11 of the base 10. The focus coil 51 is used to drive the movable component 80 of the camera module 2 to move relative to the base 10 along the first direction. The first anti-shake coil 52 is arranged on the surface of the second plate 2212 facing the movable component 80, and is accommodated in the through groove 17 on the second side wall 12 of the base 10. The first anti-shake coil 52 is used to drive the movable component 80 of the camera module 2 to move relative to the base 10 along the second direction. The second anti-shake coil 53 is arranged on the surface of the third plate 2213 facing the movable component 80, and is accommodated in the through groove 17 on the third side wall 13 of the base 10. The second anti-shake coil 53 is used to drive the movable component 80 of the camera module 2 to move relative to the base 10 along the third direction.

[0076] In some embodiments, Figure 3As shown, the imaging circuit board 21 includes a first side 211, a second side 212, a third side 213 and a fourth side 214 which are arranged in sequence in a counterclockwise direction, and the bending portion 222 includes a first soft board 2221, a second soft board 2222 and a third soft board 2223, wherein the first soft board 2221 can be flexibly bent to connect the first side 211 and the first board body 2211, the second soft board 2222 can be flexibly bent to connect the second side 212 and the second board body 2212, and the third soft board 2223 can be flexibly bent to connect the third side 213 and the third board body 2213, so that the first board body 2211, the second board body 2212 and the third board body 2213 are suitable for bending from the outside of the imaging circuit board 21 toward the base 10.

[0077] It should be understood that the first plate 2211 is electrically connected to the first side 211 of the imaging circuit board 21 through the first soft plate 2221 that can be bent into one piece, the second plate 2212 is electrically connected to the second side 212 of the imaging circuit board 21 through the second soft plate 2222 that can be bent into one piece, and the third plate 2213 is electrically connected to the third side 213 of the imaging circuit board 21 through the third soft plate 2223 that can be bent into one piece, so that the focusing coil 51 on the first plate 2211, the first anti-shake coil 52 on the second plate 2212 and the second anti-shake coil 53 on the third plate 2213 are respectively connected to the imaging circuit board 21 to realize the integration of the driving coil 50 and the photosensitive component 102.

[0078] It is worth mentioning that in the process of assembling the camera module 2, the bending directions of the first soft board 2221, the second soft board 2222 and the third soft board 2223 are consistent, that is, each soft board is bent from the imaging circuit board 21 toward the light incident side of the camera module 2. The operation is simple, which is conducive to improving the efficiency of assembly.

[0079] In addition, when the driving coil 50 needs to be repaired, the independent plate can be separated from the base 10, and the corresponding soft plate can be bent so that the plate is in a plane perpendicular to the first direction, which is conducive to improving the convenience of maintenance. For example, when there is a problem with the AF function of the camera module 2, the first plate 2211 can be separated from the base 10, and the first soft plate 2221 can be bent so that the first plate 2211 is located in a horizontal plane, so as to facilitate the repair of the focus coil 51, and at the same time, it is conducive to avoiding the impact on the first anti-shake coil 52 on the second plate 2212 and the second anti-shake coil 53 on the third plate 2213.

[0080] It is worth mentioning that, according to the actual structure of the camera module 2, the first plate 2211 and the second plate 2212 can be connected by a soft board, and the second plate 2212 and the third plate 2213 can be connected by a soft board, so that the first plate 2211, the second plate 2212 and the third plate 2213 can be bent and electrically connected as a whole. Furthermore, one of the first plate 2211, the second plate 2212 and the third plate 2213 is connected and conducted to the imaging circuit board 21 through a soft board, so that the driving circuit board 22 is electrically connected to the imaging circuit board 21 as a whole. The present application does not impose any specific restrictions on this.

[0081] In some embodiments, Figure 1 and Figure 3 As shown, the mounting portion 221 is provided with a limited area 2214, and the base 10 has a boss 16, which extends from the side wall of the base 10 toward the mounting portion 221. When the mounting portion 221 and the side wall of the base 10 are arranged relative to each other along the second direction and / or relative to each other along the third direction, the boss 16 is extended into the limited area 2214, so that the mounting portion 221 is fixed to the base 10. In other words, through the cooperation between the limited area 2214 and the boss 16, the mounting portion 221 is fixed to the side wall of the base 10 according to the preset position, so as to improve the simplicity of assembly and improve production efficiency.

[0082] In at least one embodiment, Figure 3 As shown, the limiting area 2214 is implemented as a through hole extending along the thickness direction of the mounting portion 221. The through hole cooperates with the protrusion 16 to enable the mounting portion 221 to be supported by the base 10, which is beneficial to prevent the mounting portion 221 from being separated from the base 10 under vibration or external force impact. The cross-section of the through hole includes but is not limited to a circle or a rectangle, and the present application does not impose specific restrictions on this. In at least one other embodiment, as Figure 4 As shown, the limiting area 2214 is implemented as a gap opened on the edge of the mounting portion 221, which is beneficial to reducing the space occupied by the limiting area 2214 on the mounting portion 221, and reducing the impact of the limiting area 2214 on the wiring of the mounting portion 221 and the structural strength of the mounting portion 221.

[0083] It should be understood that, on the basis of fixing the mounting portion 221 to the base 10 through the cooperation of the limiting area 2214 and the boss 16, the mounting portion 221 can be further bonded to the base 10 to improve the connection strength and connection reliability between the mounting portion 221 and the base 10; or the mounting portion 221 can be further detachably connected to the base 10 through fasteners to improve the connection strength between the mounting portion 221 and the base 10 and facilitate later disassembly and maintenance.

[0084] In some embodiments, Figure 1 and Figure 6As shown, a through slot 17 is provided in the area corresponding to the driving coil 50 on the base 10, and when the driving circuit board 22 is bent to be arranged on a different plane from the imaging circuit board 21, the driving coil 50 can be accommodated in the through slot 17. In other words, a through slot 17 is provided on the side wall of the base 10, and the through slot 17 extends along the thickness direction of the side wall of the base 10 to penetrate the side wall of the base 10. Furthermore, when the driving circuit board 22 is bent from the imaging circuit board 21 toward the base 10 so that the mounting portion 221 of the driving circuit board 22 is arranged opposite to the side wall of the base 10, the mounting portion 221 is able to fit against the side wall of the base 10, and the driving coil 50 on the mounting portion 221 is able to be accommodated in the through groove 17, so that the driving coil 50 is closer to the driving magnet 70 of the camera module 2, which is beneficial to enhance the driving force of the imaging driving device 1 and the camera module 2, and improve the driving stability; in addition, it is also beneficial to reduce the size of the camera module 2 along the second direction and along the third direction, which is beneficial to realize the miniaturization of the camera module 2.

[0085] In at least one embodiment, Figure 6 As shown, the cross section of the through slot 17 is implemented as a rectangle, and the side wall of the base 10 can play an auxiliary limiting role for the drive coil 50, which is beneficial to improve the structural reliability of the camera module 2. In at least one other embodiment, as Figure 6 As shown, the cross-section of the through groove 17 is implemented as a "U" shape, that is, the opening of the through groove 17 faces the upper edge of the side wall of the base 10, thereby reducing the difficulty of placing the driving coil 50 into the through groove 17 when the driving circuit board 22 is bent, which is beneficial to reducing the difficulty of assembling the camera module 2 and improving the production efficiency of the camera module 2.

[0086] In some embodiments, Figure 4 and Figure 5 As shown, the imaging drive device 1 also includes a reinforcing plate 40, which is arranged on the surface of the mounting portion 221 on the side away from the driving coil 50, so as to support the mounting portion 221, which is beneficial to improving the structural strength of the mounting portion 221 and improving the flatness of the mounting portion 221. It should be understood that the reinforcing plate 40 is located on the side of the mounting portion 221 away from the driving coil 50, which is also beneficial to resist external impact and protect the mounting portion 221, the driving coil 50, and even the side wall of the base 10 and the movable component 80. It is worth mentioning that the reinforcing plate 40 includes but is not limited to metal plates such as steel plates and copper plates, and plastic plates, and the present application does not make specific restrictions on this.

[0087] In at least one embodiment, the reinforcing plate 40 is implemented as a metal plate, and the reinforcing plate 40 can also play the role of a magnetic yoke. Specifically, the reinforcing plate 40 is located on the side of the driving coil 50 that is away from the driving magnet 70 of the camera module 2, and the reinforcing plate 40 can play a restraining role on the magnetic field of the driving magnet 70, which is conducive to reducing the diffusion of the magnetic field of the driving magnet 70 outside the camera module 2, thereby helping to improve the utilization efficiency of the magnetic field, thereby enhancing the driving force of the imaging driving device 1 and improving the driving stability.

[0088] It is worth mentioning that Figure 4 As shown, a through hole or a notch may also be provided in the area on the reinforcing plate 40 corresponding to the limiting area 2214, so that the boss 16 of the base 10 can pass through the mounting portion 221 and the reinforcing plate 40 in sequence, so as to improve the connection strength and connection reliability between the mounting portion 221, the reinforcing plate 40 and the base 10.

[0089] In some embodiments, Figure 5 As shown, the reinforcing plate 40 includes a first reinforcing plate 41, a second reinforcing plate 42 and a third reinforcing plate 43. The first reinforcing plate 41 is mounted on the surface of the first plate 2211 away from the focus coil 51, so as to support the first plate 2211. The second reinforcing plate 42 is mounted on the surface of the second plate 2212 away from the first anti-shake coil 52, so as to support the second plate 2212. The third reinforcing plate 43 is mounted on the surface of the third plate 2213 away from the second anti-shake coil 53, so as to support the third plate 2213.

[0090] In some embodiments, Fig.10 As shown, the imaging drive device 1 also includes a connecting component 30, which is used to be conductive with the mainboard of the smart device. The connecting component 30 is electrically connected to the outside of the imaging circuit board 21 as a whole. The connecting component 30 and the driving circuit board 22 are located on opposite sides of the imaging circuit board 21, which is beneficial to avoid interference between the connecting component 30 and the driving circuit board 22, and also simplifies the routing of the imaging drive device 1, thereby improving the electrical connection reliability and stability of the imaging drive device 1.

[0091] In at least one embodiment, Figure 3 and Fig.10As shown, the connection assembly 30 includes a connection belt 31 and a connector 32. The connection belt 31 is mechanically and electrically connected to the fourth side 214 of the imaging circuit board 21 and the connector 32, so that the connector 32 and the driving circuit board 22 are located on the opposite sides of the imaging circuit board 21. The connector 32 is used to conduct with the mainboard of the smart device, so that the driving coil 50 and the sensing device 60 on the driving circuit board 22, and the photosensitive chip 1021 and the electronic component 1022 on the imaging circuit board 21 can be conducted with the mainboard. It should be understood that the connection belt 31 is flexible so as to be suitable for bending and deformation, thereby reducing the difficulty of installing the camera module 2 on the smart device, which is conducive to improving the production efficiency of the smart device.

[0092] It is worth mentioning that the first board 2211, the second board 2212, the third board 2213 and the connector 32 are respectively connected to the first side 211, the second side 212, the third side 213 and the fourth side 214 of the imaging circuit board 21 through the first soft board 2221, the second soft board 2222, the third soft board 2223 and the connecting belt 31, which is conducive to making the wiring on the imaging circuit board 21 more uniform, thereby reducing the risk of defects such as short circuit and open circuit in the manufacturing process of the imaging circuit board 21; it is also conducive to reducing the stress concentration points on the imaging circuit board 21, reducing the risk of wiring breakage or even solder joint cracking due to temperature changes, mechanical vibrations, external impacts, etc., thereby improving the reliability of the imaging circuit board 21.

[0093] In some embodiments, Figure 5 As shown, the imaging drive device 1 further includes a sensing device 60, which is used to sense the position of the optical lens 103, thereby facilitating closed-loop control of the movable component 80. The sensing device 60 is electrically connected to the driving circuit board 22, and when the driving circuit board 22 is bent to be arranged on a different plane from the imaging circuit board 21, the sensing device 60 is located on the surface of the driving circuit board 22 facing the base 10.

[0094] In at least one embodiment, the sensing device 60 is located inside the driving coil 50, so that the arrangement of the driving coil 50 and the sensing device 60 on the driving circuit board 22 is more compact, which is conducive to further reducing the size of the camera module 2. In at least one other embodiment, the sensing device 60 is located outside the driving coil 50, which is conducive to reducing the magnetic interference of the driving coil 50 on the sensing device 60, making the detection result of the sensing device 60 more accurate, which is conducive to improving the accuracy of the camera module 2 in controlling the position of the optical lens 103.

[0095] A camera module 2, such as Figure 10-12As shown, it includes: the above-mentioned imaging drive device 1, a photosensitive component 102, a movable component 80, and an optical lens 103. The photosensitive component 102 includes a photosensitive chip 1021, and the photosensitive chip 1021 is electrically connected to the imaging circuit board 21 of the imaging drive device 1 for imaging. The movable component 80 is movably arranged on the base 10 of the imaging drive device 1. The optical lens 103 is carried by the movable component 80, and can be movably maintained on the photosensitive path of the photosensitive component 102 to collect external imaging light. The optical lens 103 defines an optical axis O. Specifically, the movable component 80 is suitable for carrying the optical lens 103, and driving the optical lens 103 to move along the first direction to realize the AF function, and move along the second direction and / or along the third direction to realize the OIS function.

[0096] In some embodiments, the optical lens 103 includes a lens barrel 1031 and at least one lens 1032 installed in the lens barrel 1031. In at least one embodiment, the lens barrel 1031 is integrally formed with the anti-shake carrier 82 of the imaging drive device 1, thereby improving the structural strength of the lens barrel 1031, and improving the connection strength and connection reliability between the lens barrel 1031 and the anti-shake carrier 82.

[0097] In some embodiments, Figure 1 and Figure 2 As shown, the motor of the camera module 2 also includes a driving magnet 70, which is arranged on the movable component 80 so as to be arranged relative to the driving coil 50 on the imaging drive device 1 along the second direction and / or along the third direction, so that the movable component 80 can be driven to move relative to the base 10 through the Lorentz force between the driving coil 50 and the driving magnet 70.

[0098] It should be understood that, compared with the driving magnet 70 and the driving coil 50 being arranged relative to each other along the first direction, in this embodiment, the driving magnet 70 and the driving coil 50 are arranged relative to each other along the second direction and / or along the third direction, which is conducive to avoiding the stacking of the driving magnet 70 and the driving coil 50 in the first direction, thereby reducing the shoulder height of the camera module 2, and is conducive to catering to the trend of thin and light electronic equipment. In addition, compared with the driving coil 50 being arranged on the movable component 80 and the driving magnet 70 being arranged on the base 10, in this embodiment, the driving magnet 70 is arranged on the movable component 80 and the driving coil 50 is arranged on the base 10, so that the routing of the driving coil 50 can be simplified, that is, the driving coil 50 can be directly connected and conducted with the driving circuit board 22, and fixed to the base 10 through the driving circuit board 22; and the structure of the camera module 2 can be simplified, that is, it is conducive to avoiding the setting of other structures to fix the driving circuit board 22 and the driving coil 50 respectively, thereby making the structure of the camera module 2 more compact, so as to reduce the size of the camera module 2.

[0099] In some embodiments, Figure 2 As shown, the movable component 80 includes an anti-shake carrier 82 and a focus carrier 81, the anti-shake carrier 82 is used to carry the optical lens 103, and the focus carrier 81 is stacked between the anti-shake carrier 82 and the base 10 along the first direction. Specifically, the anti-shake carrier 82 can move along the second direction and / or along the third direction relative to the focus carrier 81 together with the optical lens 103 to realize the OIS function; the focus carrier 81 can move along the first direction relative to the base 10 together with the anti-shake carrier 82 and the optical lens 103 to realize the AF function.

[0100] It is worth mentioning that the focusing carrier 81 is stacked between the anti-shake carrier 82 and the base 10 along the first direction, which is beneficial to keep the size of the camera module 2 along the first direction small, so that the focusing carrier 81 has a relatively long focusing stroke, thereby making the camera module 2 have both a lower shoulder height and better focusing performance.

[0101] In some embodiments, Figure 2 As shown, the movable assembly 80 further includes a plurality of anti-shake guides 84, which are pressed between the anti-shake carrier 82 and the focus carrier 81 along the first direction, so as to support the anti-shake carrier 82 to move relative to the focus carrier 81 along the second direction and / or along the third direction to achieve the OIS function. It should be understood that the anti-shake guides 84 can reduce the friction force when the anti-shake carrier 82 and the focus carrier 81 move relative to each other, thereby reducing the driving force required to drive the anti-shake carrier 82, which is conducive to improving the flexibility and stability of the movement of the anti-shake carrier 82.

[0102] Further, such as Fig.12 As shown, the bottom surface of the anti-shake carrier 82 is provided with an anti-shake guide groove 823, and the anti-shake guide groove 823 is capable of accommodating the anti-shake guide member 84 to limit the anti-shake guide member 84, which is beneficial to prevent the anti-shake guide member 84 from being separated from the anti-shake carrier 82. In addition, by providing the anti-shake guide groove 823, it is also beneficial to make the structure between the anti-shake carrier 82, the anti-shake guide member 84 and the focus carrier 81 more compact, thereby reducing the shoulder height of the camera module 2. It should be understood that the anti-shake guide member 84 includes but is not limited to balls, rollers, etc., and the present application does not make specific restrictions on this.

[0103] In some embodiments, Fig.11 As shown, the movable assembly 80 further includes a focus guide 83, which is pressed between the focus carrier 81 and the first side wall 11 of the base 10 along the third direction, so as to support the focus carrier 81 to move relative to the base 10 along the first direction to achieve the AF function. It should be understood that the focus guide 83 can reduce the friction force when the focus carrier 81 and the base 10 move relative to each other, thereby reducing the driving force required to drive the focus carrier 81, which is conducive to improving the flexibility and stability of the movement of the focus carrier 81.

[0104] Further, such as Figure 6 and Figure 7 As shown, a focus guide groove 813 is provided on the focus carrier 81 on one side facing the first side wall 11, and a base guide groove 18 is provided on the first side wall 11 on one side facing the focus carrier 81. The focus guide groove 813 and the base guide groove 18 both extend along the first direction, and the opening of the focus guide groove 813 and the opening of the base guide groove 18 are arranged relative to each other along the third direction, so that the focus guide 83 is accommodated between the focus guide groove 813 and the base guide groove 18, so as to limit the focus guide 83, which is beneficial to prevent the focus guide 83 from being separated from the focus carrier 81. In addition, by providing the focus guide groove 813, it is also beneficial to make the mechanism between the base 10, the focus guide 83 and the focus carrier 81 more compact, which is beneficial to reduce the size of the camera module 2 along the third direction. It should be understood that the focus guide 83 includes but is not limited to balls, rollers, guide rods, etc., and the present application does not make specific restrictions on this.

[0105] In at least one embodiment, Figure 6 , Figure 7 and Fig.11 As shown, there are two pairs of base guide grooves 18 and focus guide grooves 813 between the first side wall 11 of the base 10 and the focus carrier 81, and the two pairs of base guide grooves 18 and focus guide grooves 813 are arranged at intervals along the second direction, and balls are respectively clamped between each pair of base guide grooves 18 and focus guide grooves 813, so as to reliably support the focus carrier 81 to move relative to the base 10 along the first direction. Further, a recess 92 is provided on the housing 90, and the recess 92 protrudes toward the ball along the first direction, so that the ball is limited between the recess 92 and the imaging circuit board 21 along the first direction, which is conducive to preventing the ball from being separated from the focus guide groove 813 and the base guide groove 18.

[0106] In some embodiments, Figure 2 and Figure 8As shown, the driving magnet 70 includes a first anti-shake magnet 72 and a second anti-shake magnet 73. Specifically, a first anti-shake receiving groove 821 is provided on the anti-shake carrier 82 on a side facing the second side wall 12 of the base 10, and the first anti-shake receiving groove 821 is suitable for accommodating the first anti-shake magnet 72, so that the first anti-shake magnet 72 and the through groove 17 on the second side wall 12 are arranged relative to each other along the second direction, and then the first anti-shake magnet 72 and the first anti-shake coil 52 on the imaging driving device 1 are arranged relative to each other along the second direction, so as to drive the anti-shake carrier 82 to move relative to the focus carrier 81 and the base 10 along the second direction. A second anti-shake accommodating groove 822 is opened on the anti-shake carrier 82 on one side of the third side wall 13 facing the base 10. The second anti-shake accommodating groove 822 is suitable for accommodating the second anti-shake magnet 73, so that the second anti-shake magnet 73 and the through groove 17 on the third side wall 13 are arranged relative to each other along the third direction, and then the second anti-shake magnet 73 and the second anti-shake coil 53 on the imaging drive device 1 are arranged relative to each other along the third direction, so as to drive the anti-shake carrier 82 to move relative to the focusing carrier 81 and the base 10 along the third direction.

[0107] Further, such as Figure 2 and Figure 7 As shown, the driving magnet 70 also includes a focusing magnet 71. A focusing accommodating groove 811 is opened on the side of the first side wall 11 of the focusing carrier 81 facing the base 10. The focusing accommodating groove 811 is suitable for accommodating the focusing magnet 71, so that the focusing magnet 71 and the through groove 17 on the first side wall 11 are arranged relative to each other along the third direction, and then the focusing magnet 71 and the focusing coil 51 on the imaging driving device 1 are arranged relative to each other along the third direction, so as to drive the movable component 80 to move relative to the base 10 along the first direction.

[0108] In some embodiments, Figure 7 As shown, an open area 812 is respectively provided on the focusing carrier 81 on the side of the second side wall 12 facing the base 10 and on the side of the third side wall 13 facing the base 10. The open area 812 allows the first anti-shake magnet 72 and the second anti-shake magnet 73 on the anti-shake carrier 82 to be exposed to the focusing carrier 81, which is beneficial to avoid the focusing carrier 81 being blocked between the first anti-shake coil 52 and the first anti-shake magnet 72, and is beneficial to avoid the focusing carrier 81 being blocked between the second anti-shake coil 53 and the second anti-shake magnet 73, and further helps to enhance the Lorentz force between the first anti-shake coil 52 and the first anti-shake magnet 72, and between the second anti-shake coil 53 and the second anti-shake magnet 73, thereby improving the driving force and stability of the anti-shake drive of the camera module 2.

[0109] In some embodiments, Figure 8As shown, the camera module 2 also includes an anti-shake magnetic conductive member 86, which is arranged on the groove wall of the first anti-shake accommodating groove 821 and the groove wall of the second anti-shake accommodating groove 822, so as to be located on the side of the first anti-shake magnet 72 away from the first anti-shake coil 52, and on the side of the second anti-shake magnet 73 away from the second anti-shake coil 53. It should be understood that the anti-shake magnetic conductive member 86 can constrain the magnetic field of the first anti-shake magnet 72 and the second anti-shake magnet 73, which is conducive to reducing the diffusion of the magnetic field toward the direction of the optical lens 103, and then is conducive to improving the utilization efficiency of the magnetic field, so as to further improve the driving force and stability of the anti-shake drive of the camera module 2. In at least one embodiment, the anti-shake magnetic conductive member 86 is embedded in the anti-shake carrier 82, which is conducive to improving the connection strength and connection reliability of the anti-shake magnetic conductive member 86 and the anti-shake carrier 82.

[0110] Further, such as Figure 7 As shown, the camera module 2 also includes a focus magnetic conductive member 85, which is arranged on the groove wall of the focus accommodating groove 811, and is located on the side of the focus magnet 71 away from the focus coil 51. It should be understood that the focus magnetic conductive member 85 can restrain the magnetic field of the focus magnet 71, which is beneficial to reduce the diffusion of the magnetic field of the focus magnet 71 toward the direction of the optical lens 103, and then it is beneficial to improve the utilization efficiency of the magnetic field, so as to further improve the driving force and stability of the focus drive of the camera module 2. In at least one embodiment, the focus magnetic conductive member 85 is embedded in the focus carrier 81, which is beneficial to improve the connection strength and connection reliability between the focus magnetic conductive member 85 and the focus carrier 81.

[0111] In some embodiments, Figure 3 and Figure 4 As shown, the imaging circuit board 21 is provided with a through hole 216 for accommodating the photosensitive chip 1021. In at least one embodiment, the through hole 216 is similar in shape to the photosensitive chip 1021, and the through hole 216 is slightly larger than the photosensitive chip 1021, so as to accommodate the photosensitive chip 1021, which is beneficial to further reduce the shoulder height of the camera module 2. It is worth noting that the photosensitive chip 1021 and the imaging circuit board 21 can be connected and conducted by wire bonding, gold wire or other methods.

[0112] In some embodiments, Figure 5 As shown, the photosensitive component 102 further includes a support plate 1025, which is fixed to a side of the imaging circuit board 21 that is away from the base 10, so as to support the imaging circuit board 21, thereby facilitating improving the structural strength of the bottom of the imaging drive device 1. It is worth mentioning that the support plate 1025 includes but is not limited to metal plates such as steel plates and copper plates, and plastic plates, and the present application does not impose specific restrictions on this.

[0113] In at least one embodiment, Figure 5 As shown, an adhesive layer 1024 is provided between the imaging circuit board 21 and the support plate 1025, so that the imaging circuit board 21 is bonded to the support plate 1025. Further, the photosensitive chip 1021 is accommodated in the through hole 216 of the imaging circuit board 21, and is bonded to the support plate 1025 through the adhesive layer 1024. It should be understood that the support plate 1025 can provide a flatter surface for fixing the photosensitive chip 1021, which is conducive to improving the flatness of the photosensitive chip 1021.

[0114] In some embodiments, Fig.12 As shown, the photosensitive component 102 further includes a filter 1023, which is held on the photosensitive path of the photosensitive chip 1021 and is disposed between the optical lens 103 and the photosensitive chip 1021. The filter 1023 is used to filter the incident light entering the photosensitive chip 1021 to filter out the incident light, such as infrared light, and other stray light that is not necessary for imaging. It should be understood that the filter 1023 can be directly fixed on the base 10, or can be fixed on the base 10 through a support frame, and the present application does not impose specific restrictions on this.

[0115] In some embodiments, Fig.11 As shown, the photosensitive component 102 also includes a plurality of electronic components 1022 electrically connected to the imaging circuit board 21. It should be understood that the plurality of electronic components 1022 include but are not limited to passive electronic devices such as resistors and capacitors and / or driver chips, storage chips, etc., and the present application does not impose specific restrictions on this.

[0116] In some embodiments, Figure 10-12 As shown, the camera module 2 also includes a shell 90, which is suitable for covering the outer side of the base 10 so that the driving circuit board 22 can be maintained between the shell 90 and the base 10; an avoidance area 91 is opened on the lower edge of the shell 90, and the opening of the avoidance area 91 faces the imaging circuit board 21, so that the avoidance area 91 can avoid the driving circuit board 22.

[0117] It should be understood that when the driving circuit board 22 bends from the imaging circuit board 21 toward the base 10 so that the mounting portion 221 of the driving circuit board 22 is arranged opposite to the side wall of the base 10, the bent portion 222 may be bent and protrude toward the outer shell 90. In the present embodiment, by providing an avoidance area 91 at the lower edge of the outer shell 90, it is helpful to avoid the bending portion 222 from abutting against the outer shell 90, to avoid the bending portion 222 from lifting the outer shell 90, and to reduce the pulling force of the bending portion 222 on the mounting portion 221.

[0118] It is worth mentioning that Fig.12As shown, there is a gap 93 between the housing 90 and the base 10, and the gap 93 can accommodate the mounting portion 221 and the reinforcing plate 40, so that the mounting portion 221 and the reinforcing plate 40 are clamped between the housing 90 and the base 10. That is, the mounting portion 221 is fixed to the side wall of the base 10 by the stop area 2214 on the mounting portion 221 and the boss 16 on the base 10; after the housing 90 is assembled, the mounting portion 221 and the reinforcing plate 40 are clamped between the housing 90 and the base 10, which further fixes the mounting portion 221 and the reinforcing plate 40, and helps to prevent the mounting portion 221 from moving relative to the side wall of the base 10. In addition, clamping the mounting portion 221 and the reinforcing plate 40 by the housing 90 and the base 10 helps to reduce additional bonding, fastening and other operations, thereby simplifying the installation steps of the camera module 2 and improving the production efficiency of the camera module 2.

[0119] In some embodiments, Fig. 9 As shown, the camera module 2 also includes a stopper assembly 101, which is arranged on the focus carrier 81, and at least a part of the stopper assembly 101 is arranged relative to the anti-shake carrier 82 along the first direction, so that the anti-shake carrier 82 is maintained between the stopper assembly 101 and the focus member along the first direction, which is beneficial to avoid the anti-shake carrier 82 and the focus carrier 81 from being separated due to mechanical vibration, external force impact or inertia of moving along the first direction, and to improve the reliability of the anti-shake guide 84 being crimped between the anti-shake carrier 82 and the focus carrier 81.

[0120] In some embodiments, Fig. 9 As shown, the stopper assembly 101 includes a bracket 1011 and a plurality of buffers 1012. The bracket 1011 is mounted on the focus carrier 81. At least a portion of the bracket 1011 is located on the top surface of the focus carrier 81 and is bent and extended in a plane perpendicular to the first direction, so that the anti-shake carrier 82 is maintained between the bracket 1011 and the focus carrier 81. The plurality of buffers 1012 are arranged on the bracket 1011 at intervals. At least a portion of the buffers 1012 protrudes from the bracket 1011 toward the anti-shake carrier 82 along the first direction, so as to be located between the bracket 1011 and the anti-shake carrier 82, which is conducive to avoiding a hard collision between the anti-shake carrier 82 and the bracket 1011, thereby protecting the anti-shake carrier 82, reducing the risk of damage to the anti-shake carrier 82, and reducing the noise generated by the collision. At least another portion of the buffer member 1012 protrudes from the bracket 1011 toward the outer shell 90 along the first direction so as to be located between the bracket 1011 and the outer shell 90, which helps to avoid a hard collision between the focus carrier 81 and the outer shell 90, thereby protecting the focus carrier 81 and the outer shell 90, reducing the risk of damage to the focus carrier 81, and reducing noise generated by the collision, which helps to extend the service life of the camera module 2.

[0121] An assembly method for assembling any of the above camera modules 2 comprises the steps of: S1, providing an imaging driving device 1, a photosensitive component 102 and a movable component 80, installing the photosensitive component 102 on the imaging circuit board 21 of the imaging driving device 1, and installing the movable component 80 on the base 10 of the imaging driving device 1; S2, providing an optical lens 103, and installing the optical lens 103 on the movable component 80, wherein the external coil semi-finished fixture and the photosensitive component 102 are energized to assist in calibrating and installing the optical lens 103; S3, providing a driving coil 50 and a sensing device 60, fixing the driving coil 50 and the sensing device 60 to the driving circuit board 22 of the imaging driving device 1 and conducting the driving coil 50 and the sensing device 60; S4. Bend the driving circuit board 22 so that the driving circuit board 22 and the side wall of the base 10 are arranged opposite to each other along the second direction and / or along the third direction, and are located at the periphery of the base 10; provide a shell 90, and cover the shell 90 on the periphery of the driving circuit board 22.

[0122] It should be understood that in step S1, the photosensitive component 102 includes at least one of the photosensitive chip 1021, the electronic component 1022 and the filter 1023, that is, the photosensitive component 102 and other devices located below the movable component 80 in the camera module are first installed on the imaging circuit board 21 or the base 10, and then the movable component 80 is installed. It should be understood that completing the installation of the photosensitive component 102 in step S1 is conducive to the installation of the optical lens 103 through the imaging auxiliary calibration of the photosensitive chip 1021 in step S2, so as to improve the assembly efficiency of the camera module 2 and improve the yield of the camera module 2.

[0123] Furthermore, in step S2, the semi-finished coil jig is energized so that the coil on the semi-finished coil jig and the driving magnet 70 on the movable component 80 interact with each other to drive the movable component 80 to move relative to the base 10; the photosensitive component 102 is energized so that the imaging quality of the photosensitive chip 1021 can be intuitively reflected to assist in calibrating the installation position of the optical lens 103, thereby helping to improve the yield of the camera module 2. After the optical lens 103 of step S2 is completed, step S3 is performed, i.e., the drive coil 50 and the sensing device 60 are installed, which helps to avoid damage to the functional devices with electrical properties of the camera module 2 during the assembly process, such as the drive coil 50 and the sensing device 60, so as to reduce losses and reduce the cost of producing the camera module 2.

[0124] Furthermore, in step S3, when the drive coil 50 and the sensing device 60 are installed on the drive circuit board 22, the drive circuit board 22 is suitable for being arranged on the same plane as the imaging circuit board 21, thereby facilitating the installation and conduction operation of the drive coil 50 and helping to improve the assembly accuracy of the drive coil 50.

[0125] In some embodiments, step S1 includes step S11, providing a module circuit board 20, a photosensitive chip 1021 and an electronic component 1022, fixing and connecting the photosensitive chip 1021 and the electronic component 1022 to the imaging circuit board 21 of the module circuit board 20. Step S12, injection molding the module circuit board 20 to form the base 10. Step S13, providing a movable component 80, and installing the movable component 80 on the base 10.

[0126] It should be understood that when molding the base 10, the driving circuit board 22 is suitable for being arranged on the same plane as the imaging circuit board 21; or the driving circuit board 22 is suitable for being located on different surfaces of the imaging circuit board 21 with the injection mold, which is beneficial to reduce the interference of the driving circuit board 22 on the injection molding.

[0127] It is worth mentioning that, depending on the specific production situation of the camera module 2, the execution order of step S2 and step S3 can also be interchanged, and this application does not impose any specific restrictions on this.

[0128] The above describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention to be protected. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. An imaging driving device, characterized in that: include: A module circuit board, the module circuit board comprising an imaging circuit board and a driving circuit board, the imaging circuit board being used to be electrically connected to the photosensitive chip, the driving circuit board flexibly extending from the outer side of the imaging circuit board so that the driving circuit board can be bent and electrically connected to the imaging circuit board; A base, the base being formed on the imaging circuit board, and the base extending from the imaging circuit board toward the light incident side along a first direction; The driving circuit board is adapted to be bent from the outer side of the imaging circuit board toward the base, so that the driving circuit board and the side wall of the base are arranged opposite to each other along the second direction and / or opposite to each other along the third direction, and are located at the periphery of the base; The first direction is parallel to the height direction of the imaging drive device, the second direction is parallel to the length direction of the imaging drive device, and the third direction is parallel to the width direction of the imaging drive device. The first direction, the second direction and the third direction are orthogonal to each other.

2. The imaging driving device according to claim 1, characterized in that: The imaging driving device also includes a driving coil, which is electrically connected to the driving circuit board. When the driving circuit board is bent to be arranged on a different plane from the imaging circuit board, the driving coil is located on the surface of the driving circuit board facing the base.

3. The imaging driving device according to claim 2, characterized in that: The driving circuit board includes a mounting portion and a bending portion, wherein the bending portion flexibly and conductively connects the mounting portion and the imaging circuit board, and the bending portion is suitable for bending from the outer side of the imaging circuit board toward the base so that the mounting portion and the side wall of the base are arranged relative to each other along the second direction and / or relative to each other along the third direction.

4. The imaging driving device according to claim 3, characterized in that: The width of the bending portion is smaller than the length of the edge of the mounting portion to which it is connected, the width of the bending portion is smaller than the length of the edge of the imaging circuit board to which it is connected, the bending portion is connected to the middle section of the edge of the mounting portion, and is connected to the middle section of the edge of the imaging circuit board.

5. The imaging driving device according to claim 4, characterized in that: A groove is provided on the edge of the imaging circuit board, and the opening of the groove faces the outside of the imaging circuit board. The bent portion is connected to the bottom of the groove. When the driving circuit board and the imaging circuit board are placed on the same plane, at least part of the bent portion is accommodated in the groove. When the driving circuit board and the imaging circuit board are arranged on different planes, the projection of the bent portion along the first direction falls into the projection of the groove along the first direction.

6. The imaging driving device according to claim 3, characterized in that: The mounting portion includes a first plate, a second plate and a third plate. When the driving circuit board is bent to be arranged in an eccentric manner with the imaging circuit board, surfaces of the first plate, the second plate and the third plate are all parallel to a first direction, wherein the first plate and the third plate are arranged relatively to each other along a third direction, and the second plate is located between the first plate and the third plate, so that the first plate, the second plate and the third plate surround the outer periphery of the base.

7. The imaging driving device according to claim 6, characterized in that: The imaging circuit board includes a first side, a second side, a third side and a fourth side arranged in sequence in a counterclockwise direction, and the bending portion includes a first soft board, a second soft board and a third soft board, wherein the first soft board can be flexibly bent to connect and conduct the first side and the first board body, the second soft board can be flexibly bent to connect and conduct the second side and the second board body, and the third soft board can be flexibly bent to connect and conduct the third side and the third board body, so that the first board body, the second board body and the third board body are suitable for bending from the outside of the imaging circuit board toward the base.

8. The imaging driving device according to any one of claims 3 to 7, characterized in that: The mounting portion defines a limited area, the base has a boss, the boss extends from the side wall of the base toward the mounting portion, and when the mounting portion and the side wall of the base are arranged relative to each other along a second direction and / or relative to each other along a third direction, the boss extends into the limited area, so that the mounting portion is fixed to the base.

9. The imaging driving device according to any one of claims 2 to 7, characterized in that: A through slot is formed on the base in an area corresponding to the driving coil. When the driving circuit board is bent to be arranged in an eccentric plane with the imaging circuit board, the driving coil can be accommodated in the through slot.

10. The imaging driving device according to any one of claims 3 to 7, characterized in that: The imaging driving device further includes a reinforcing plate, which is disposed on a surface of the mounting portion that is away from the driving coil, so as to support the mounting portion.

11. The imaging driving device according to claim 6, characterized in that: The driving coil includes a focus coil, a first anti-shake coil and a second anti-shake coil, wherein the focus coil is arranged on the first plate body, the first anti-shake coil is arranged on the second plate body, and the second anti-shake coil is arranged on the third plate body.

12. The imaging driving device according to any one of claims 1 to 7, characterized in that: The imaging driving device further comprises a connecting component, which extends from the outer side of the imaging circuit board so that the connecting component is electrically connected to the imaging circuit board, and the connecting component and the driving circuit board are located on opposite sides of the imaging circuit board.

13. The imaging driving device according to any one of claims 1 to 7, characterized in that: The imaging drive device also includes a sensing device, which is used to sense the position of the optical lens. The sensing device is electrically connected to the driving circuit board. When the driving circuit board is bent to be arranged on a different plane from the imaging circuit board, the sensing device is located on the surface of the driving circuit board facing the base.

14. A camera module, characterized in that: include: The imaging driving device as claimed in any one of claims 1 to 13; A photosensitive component, the photosensitive component comprising a photosensitive chip, the photosensitive chip being electrically connected to an imaging circuit board of the imaging drive device for imaging; A movable component, wherein the movable component is movably disposed on a base of the imaging drive device; The optical lens is carried by the movable component so as to be movably held on the light-sensitive path of the photosensitive component.

15. The camera module according to claim 14, characterized in that: The camera module also includes a shell, which is suitable for covering the outer side of the base so that the driving circuit board of the imaging driving device can be maintained between the shell and the base; an avoidance area is opened on the lower edge of the shell, and the opening of the avoidance area faces the imaging circuit board of the imaging driving device to avoid the driving circuit board.

16. The camera module according to claim 14, characterized in that: The camera module also includes a driving magnet, which is arranged on the movable component. The driving magnet and the driving coil of the imaging drive device are arranged relative to each other along the second direction and / or along the third direction, so as to drive the movable component to move relative to the base.

17. The camera module according to claim 16, characterized in that: The driving magnet includes a focusing magnet, a first anti-shake magnet and a second anti-shake magnet, wherein the focusing magnet and the focusing coil of the imaging driving device are arranged relative to each other along a third direction, so as to drive the movable component to move relative to the base along a first direction, the first anti-shake magnet and the first anti-shake coil of the imaging driving device are arranged relative to each other along a second direction, so as to drive the movable component to move relative to the base along the second direction, and the second anti-shake magnet and the second anti-shake coil of the imaging driving device are arranged relative to each other along the third direction, so as to drive the movable component to move relative to the base along the third direction.

18. An assembly method for assembling a camera module as claimed in any one of claims 14 to 17, characterized in that: Includes steps: S1. Provide an imaging drive device, a photosensitive component and a movable component, install the photosensitive component on an imaging circuit board of the imaging drive device, and install the movable component on a base of the imaging drive device; S2, providing an optical lens, and installing the optical lens on the movable component, wherein an external coil semi-finished product jig and the photosensitive component are energized to assist in calibrating and installing the optical lens; S3, providing a driving coil and a sensing device, and fixing the driving coil and the sensing device to a driving circuit board of the imaging driving device respectively and conducting the driving circuit board; S4. Bend the driving circuit board so that the driving circuit board and the side wall of the base are arranged opposite to each other along the second direction and / or along the third direction, and are located at the periphery of the base; provide a shell, and cover the periphery of the driving circuit board with the shell.

Images