Multifunctional earphone circuit and earphone

Abstract

The invention discloses a multifunctional earphone circuit and an earphone, and the earphone circuit comprises a connector which is used for connecting audio equipment; the first headset interface is connected with the connector; the second headset interface is connected with the connector and comprises a microphone input detection signal path and a microphone input signal path; wherein when the first headset interface and the second headset interface are connected with the four-section type earphone, sound input is carried out through a left sound channel input path and a right sound channel input path in the first headset interface. The technical problems that an existing earphone circuit cannot be compatible with access of a three-section type earphone and a four-section type earphone at the same time, LINE IN recording input cannot be accessed when the four-section type earphone is accessed, and then the application range of audio input equipment is limited are solved, the three-section type earphone input and the four-section type earphone input are compatible, and when the four-section type earphone is accessed, the application range of the audio input equipment is limited. LINE IN recording input can be accessed, and the application range of the audio input equipment is widened.

Description

Technical Field

[0001] The present application relates to the technical field related to audio devices, and in particular to a multifunctional earphone circuit and earphone. Background Art

[0002] With the popularity of multimedia devices, headphones have become an indispensable audio device in daily life. Headphones are divided into combined and independent types. Traditional headphone interfaces are mainly divided into three-band (TRS) and four-band (TRRS). Among them, three-band (without mic) headphones are usually used for pure audio playback and have 3 contacts, starting from the top section, they are left channel, right channel and common ground. The headphone plugs are divided into 3.5mm and 2.5mm. At present, most headphone interfaces use 3.5mm, but the two are not universal. 3.5mm headphones need an adapter to be used on 2.5mm headphone port devices; while four-band (with mic) headphones have four contacts, that is, on this basis, the grounding section is split into two parts, and a microphone channel is added to support voice input and call functions. The four-band headphones are left channel, right channel, common ground, and Mic (digital signal) starting from the top section. Due to compatibility issues between different devices, the prior art often has the problem that headphones are not compatible with both three-band and four-band headphones. Especially when supporting microphone functions, signal loss or limited functions may occur, affecting the adaptability of the headphones and failing to meet user needs in a variety of scenarios, such as voice calls, recordings, and high-quality audio playback.

[0003] However, the inventors of this application found that the above technology has at least the following technical problems in the process of implementing the technical solution of the invention in the embodiment of this application:

[0004] The existing headphone circuit is not compatible with both three-segment headphones and four-segment headsets, and the LINE IN recording input cannot be connected when a four-segment headset is connected, which leads to a technical problem that the application scope of the audio input device is limited. Summary of the invention

[0005] The present application provides a multifunctional headphone circuit and headphone, which solves the technical problem in the prior art that the headphone circuit cannot be compatible with both three-stage headphone and four-stage headset input, and cannot be connected to LINE IN recording input when connected to a four-stage headset, thereby limiting the application scope of the audio input device. The application achieves the technical effect of being compatible with three-stage headphone and four-stage headset input, and being able to connect to LINE IN recording input when connected to a four-stage headset, thereby improving the application scope of the audio input device.

[0006] A multifunctional headphone circuit provided in an embodiment of the present application includes: a connector for connecting an audio device; a first earphone interface connected to the connector; a second earphone interface connected to the connector, including a microphone input detection signal path and a microphone input signal path; wherein, when the first earphone interface and the second earphone interface are connected to a four-segment headphone, sound input is performed through a left channel input path and a right channel input path in the first earphone interface.

[0007] Preferably, the connector is connected to a CODEC signal, and the CODEC signal includes a first signal path set and a second signal path set, wherein the first signal path set is connected to the first headset interface, including the left channel input path and the right channel input path, and the second signal path set is connected to the second headset interface, including the microphone input detection signal path and the microphone input signal path.

[0008] Preferably, the first earphone interface includes: a sound input detection signal path, a left channel input path, and a right channel input path; wherein, when a four-segment earphone is connected, the sound input signal is detected through the sound input detection signal path, and sound input is performed through the left channel input path and the right channel input path in the first earphone interface.

[0009] Preferably, the first headset interface further includes: a first sound output detection signal path, a first left channel output path, a first right channel output path, a microphone input detection signal path, a second left channel output path, and a second right channel output path.

[0010] Preferably, the second headset interface further includes: a third left channel output path, a third right channel output path, and a headset access detection signal path.

[0011] Preferably, each signal path in the first headset interface and the second headset interface is connected to a TVS diode and a filter capacitor.

[0012] Preferably, the digital signals in the first headset interface and the second headset interface use the digital ground as a reference ground, and the analog signals use the analog ground as a reference ground, and the digital ground and the reference ground are connected via a capacitor.

[0013] The present application also provides an earphone, comprising any one of the multifunctional earphone circuits.

[0014] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0015] The embodiment of the present application provides a multifunctional earphone circuit and earphone, a connector for connecting an audio device; a first earphone interface connected to the connector; a second earphone interface connected to the connector, including a microphone input detection signal path and a microphone input signal path; wherein, when the first earphone interface and the second earphone interface are connected to a four-segment earphone, sound input is performed through the left channel input path and the right channel input path in the first earphone interface. The technical problem that the existing earphone circuit cannot be compatible with both three-segment earphones and four-segment earphones at the same time, and cannot access the LINE IN recording input when accessing a four-segment earphone, thereby limiting the scope of application of the audio input device, is solved, and the technical effect of being compatible with the three-segment earphone and four-segment earphone inputs, and being able to access the LINE IN recording input when accessing a four-segment earphone, and improving the scope of application of the audio input device is achieved.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present application or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic diagram of a connector for a multifunctional headphone circuit provided in an embodiment of the present application.

[0019] Figure 2 A schematic diagram of a first headphone interface of a multi-functional headphone circuit provided in an embodiment of the present application.

[0020] Figure 3 A schematic diagram of a second headphone interface of a multi-function headphone circuit provided in an embodiment of the present application.

[0021] Figure 4 A schematic diagram of a signal path connection reference ground of a multi-function headphone circuit provided in an embodiment of the present application.

[0022] Figure 5 A schematic diagram of the connection of the digital ground and analog ground of a multi-function headphone circuit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned purposes, features, and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments of the present application. It should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application. It should also be noted that, for the convenience of description, only the parts related to the present application are shown in the accompanying drawings, rather than all of them.

[0024] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "multiple" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0025] In the description of the present application, it should be understood that the terms "vertical", "horizontal", "perpendicular", "parallel", "clockwise", "counterclockwise", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Example 1

[0028] The present application provides a multifunctional earphone circuit, the earphone circuit comprising:

[0029] A connector for connecting an audio device; a first earphone interface connected to the connector; a second earphone interface connected to the connector, including a microphone input detection signal path and a microphone input signal path; wherein, when the first earphone interface and the second earphone interface are connected to a four-segment headset, sound input is performed through the left channel input path and the right channel input path in the first earphone interface.

[0030] Furthermore, the first headset interface includes: a sound input detection signal path, a left channel input path, and a right channel input path; wherein, when a four-stage headset is connected, the sound input signal is detected through the sound input detection signal path, and sound input is performed through the left channel input path and the right channel input path in the first headset interface.

[0031] Furthermore, the first headset interface also includes: a first sound output detection signal path, a first left channel output path, a first right channel output path, a microphone input detection signal path, a second left channel output path, and a second right channel output path.

[0032] Furthermore, the second headset interface also includes: a third left channel output path, a third right channel output path, and a headset access detection signal path.

[0033] Specifically, the connector is a four-section plug (TRRS) used to connect external audio devices (such as mobile phones, computers or players), which contains the following four signal channels: Tip (T), left channel audio signal (L); Ring 1 (R1), right channel audio signal (R); Ring 2 (R2), microphone signal (MIC); Sleeve (S), common ground (GND); The function of the connector is to pass the signal of the audio device to the headset through the circuit to ensure that the input and output functions of the audio signal work normally. The first headset interface is directly connected to the connector, which is mainly used to process the audio signal input of the headset, including the left channel input path and the right channel input path, that is, through the Tip (T) of the connector, the audio signal is passed to the left channel speaker of the headset; through the Ring 1 (R1) of the connector, the audio signal is passed to the right channel speaker of the headset. The second headset interface is connected to Ring 2 (R2) and Sleeve (S) of the connector, and focuses on processing the microphone-related functions of the headset, including determining whether the headset supports the microphone function (i.e., whether it is a four-band headset) by detecting the voltage or impedance changes in the microphone signal path; transmitting the microphone audio signal from the headset to the audio device for voice input (such as recording or calling).

[0034] Specifically, when a four-segment headset is connected, the left channel input path of the first headset interface is led out from the Tip of the four-segment headset to transmit the audio signal of the left channel, and the right channel input path of the first headset interface is led out from Ring 1 of the four-segment headset to transmit the audio signal of the right channel. The left channel and right channel signals are transmitted to the audio device through these paths to complete the input of the stereo sound signal. The first left channel output path and the first right channel output path are responsible for transmitting the left channel and right channel audio signals output by the audio processing device to the headset respectively. The left channel signal is transmitted to the left channel speaker of the headset through the first left channel output path, and the right channel signal is transmitted to the right channel speaker of the headset through the first right channel output path; the second left channel output path and the second right channel output path are the left channel and right channel audio signal paths provided for the second headset device. When the headset device has multiple output units (such as dual output speakers or parallel output), the audio signal is provided to the second output device. The second left channel output path transmits the left channel audio signal to the second device, and the second right channel output path transmits the right channel audio signal to the second device; the third left channel output path and the third right channel output path are used for transmitting the left channel and right channel audio signals of a third device (such as a backup headset or an external audio device), allowing multiple headsets or audio devices to be connected and used at the same time, the third left channel output path transmits the left channel audio signal to the external device, and the third right channel output path transmits the right channel audio signal to the external device, which is usually connected to the target device through an additional pin of the headphone interface (such as an expansion interface).

[0035] Specifically, the first left channel output path and the first right channel output path correspond to PORT-D_L and PORT-D_R respectively; the second left channel output path and the second right channel output path correspond to PORT-C_L and PORT-C_R respectively; the third left channel output path and the third right channel output path correspond to HP_OUT_L_1 and HP_OUT_R_1 respectively; the first sound output detection signal path and the microphone input detection signal path correspond to LINEO_SW_D and RMIC_SW_C respectively; the sound input detection signal path, the left channel input path and the right channel input path correspond to LINEIN_SW_E, PORT-E_L and PORT-E_R respectively; the headphone access detection signal path corresponds to HPOUT_JD; SLEEVE_R and RING2_R are both microphone input and output signal paths.

[0036] Specifically, if Figure 1As shown in the figure, the multi-function headphone circuit block diagram mainly realizes the signal input, output and switching functions between the headphone and the audio device. CON1 is the core connector module, which is used to realize the connection between the external audio device and the headphone circuit. It contains 40 pins, each of which corresponds to a specific signal path, which is used to receive and distribute the input signal from the audio device and output the audio signal to the headphone device; GND is the system ground, which is used to provide a current loop and signal stability for the circuit; AUGND is the audio-specific ground, which is used to reduce noise and interference in the audio signal and ensure audio quality.

[0037] Specifically, LINEIN_SW_E (line input switch) is connected to PORT-E_L and PORT-E_R through pins 11, 13, and 15, corresponding to the input paths of the left and right channels, respectively, for controlling the switching of line input signals; LINEO_SW_D (line output switch) is connected to PORT-D_L and PORT-D_R through pins 19, 21, and 23, corresponding to the output paths of the left and right channels, respectively, for controlling the switching of line output signals; RMIC_SW_C (microphone switch) is connected to PORT-E_L and PORT-E_R through pins 11, 13, and 15, corresponding to the input paths of the left and right channels, respectively, for controlling the switching of line output signals; 31, 33, and 35 are connected to PORT-C_L and PORT-C_R, corresponding to the left and right channels of the microphone signal respectively, and are used to detect and switch the microphone input signal; HPOUT_JD (headphone insertion type detection) is connected to the SLEEVE_R and RING2_R signal paths through pin 26, and is used to detect the type of headphone insertion (three-stage or four-stage); HP_OUT_L_1 and HP_OUT_R_1 are connected to the headphone output terminals of the left and right channels through pins 38 and 40 respectively, providing the left and right channel audio output signals of the headphone.

[0038] Specifically, if Figure 2As shown, the audio signal input / output circuit includes Line In (line input), Line Out (line output), and Mic In (microphone input) signal paths. Its main function is to process the input, output and protection of audio signals to ensure signal quality and stability. Line In (line input) is used to receive input signals from external audio devices and transmit them to the internal audio processor through PORT-E_L and PORT-E_R signal paths. PORT-E_LL and PORT-E_RR are filtered left / right channel signals respectively; Line Out (line output) is used to output the internally processed audio signals to external audio devices and transmit them through PORT-D_L and PORT-D_R signal paths. PORT-D_LL and PORT-D_RR are filtered left / right channel signals respectively; Mic In (microphone input) is used to receive the input signal of the external microphone and transmit it to the audio processor through the PORT-C_L and PORT-C_R signal paths. PORT-C_LL and PORT-C_RR are the filtered left / right channel signals respectively; specifically, FB58, FB59, FB61, FB62, FB63 and FB64 are inductor filters with specifications of 120Ω, 100MHz, 2.5A, FB_0603, which are used to suppress high-frequency interference signals and ensure the stability and integrity of signal transmission, especially in high-frequency noise environments (such as radio frequency interference); C1 263, C1264, C1270, C1271, C1272 and C1273 are filter capacitors with specifications of 100pF, 50V, NPO, C_0402 package, which are used for high-frequency filtering to further reduce the interference of noise signals on audio signals, thereby ensuring the stability of audio signals and improving signal quality; R811, R812, R813, R814, R815, R816, R817 and R818 are shunt resistors with specifications of 22kΩ, R0402 package, which are used for signal shunting to protect subsequent circuits and adjust signal levels to avoid signals that are too strong or too weak; Audio 1A2 is an audio connector that provides signal connections for interfaces such as Line In, Line Out, Mic In, and supports the transmission of audio input, output and microphone signals.

[0039] Specifically, if Figure 3As shown in the figure, the headphone output (HP OUT) is used to realize the transmission, protection and grounding management of the headphone audio signal, that is, it is responsible for outputting the audio signals of the left and right channels (HP_OUT_L and HP_OUT_R) to the headphone speakers, and supports the detection and transmission of microphone signals and ground (SLEEVE) signals. Filters and transient voltage suppression diodes (TVS) are used to protect the headphone signal path from damage by electrostatic discharge (ESD) or other voltage spikes. It also includes a detection signal path (HP_OUT_JD) for determining whether the headphone is connected and realizing the automatic switching function; specifically, SLEEVE_R is a ground signal path for audio grounding (AUGND), RING2_R is a microphone signal path, and RING2_R is used to detect or transmit microphone signals; HP_OUT_L_1 and HP_OUT_R_1 are the audio signal paths for the left channel and the right channel respectively, HP_OUT_L_1 is responsible for transmitting the left channel audio signal, and HP_OUT_R_1 is responsible for transmitting the right channel audio signal HP_OUT_JD is the detection signal path, which is used to determine whether the earphone is inserted. It can trigger the switch operation to automatically switch the audio signal output when the earphone is inserted. The specifications of the inductor filter (A_FB13~A_FB17) are all 100R, 3A (inductor), which is used to suppress high-frequency noise, ensure the integrity of the signal, and prevent interference signals from affecting the audio quality. A_C34, A_C35 and A_C44, A_C45, A_C46 are filter capacitors with specifications of 100 pF / 50V, used for high-frequency filtering, further eliminating high-frequency noise in the signal and ensuring the stability of the audio signal; A_D16, A_D17, A_D18, A_D19, A_D20 are transient voltage suppression diodes (TVS), model BV-D505ZC, SOD_523 package, used for electrostatic discharge (ESD) protection, when transient high voltage (such as electrostatic discharge) appears on the signal path, it quickly turns on and introduces overvoltage to the ground, thereby protecting subsequent circuits; AUDIO JACK2 (headphone jack) is used to connect the headphone plug,

[0040] Transmits audio signals and detects the insertion status of headphones.

[0041] Preferably, each signal path in the first headset interface and the second headset interface is connected to a TVS diode and a filter capacitor.

[0042] Specifically, if Figure 4As shown, the audio signal protection circuit protects the audio input and output signals (such as the left channel and the right channel) to prevent the circuit from being damaged by overvoltage or electrostatic discharge (ESD). The protection objects are PORT-A_L and PORT-A_R (the input signal paths of the left channel and the right channel) and PORT-B_L and PORT-B_R (the output signal paths of the left channel and the right channel). Through the ESD protection diode array (TVS diode) and grounding design, the signal path is protected against overvoltage to prevent the circuit from being damaged by transient voltage or external interference. VRA23, VRA24, VRA25, and VRA26 represent TVS diodes, which are used to suppress transient voltages (such as electrostatic discharge). Their model number is SEU0501P1, and they are transient voltage suppression devices. When overvoltage occurs on the signal path, the TVS diode will quickly turn on and introduce transient current into the common ground (GND), thereby protecting subsequent circuits from damage. R0402_TVS's R0402 represents the package size of the device (0402 package, approximately 1.0mm×0.5mm), and is used with TVS diodes to filter out transient spike signals or reduce high-frequency interference.

[0043] Specifically, if Figure 5 As shown, the decoupling capacitor array circuit provides power decoupling and filtering functions for the audio circuit, reduces the interference of power noise on the audio signal, thereby improving the audio signal quality and circuit stability. Specifically, power filtering and decoupling are achieved through multiple parallel capacitors to suppress power noise (such as high-frequency interference) and provide a stable power supply voltage for the audio circuit. The signal ground (GND) and the audio-only ground (AUGND) are connected separately to provide a clean reference point to prevent the audio signal from being affected by noise. AUGND represents the audio-only ground, which is mainly used for grounding audio signals to reduce the interference of power supply and other signals on the audio; GND represents the system common ground, the reference point of the circuit, and is used to provide a path for all current loops; the decoupling capacitor (A_C36, A_C37, A_C38, A_C39, A_C40, A_C41, A_C42, A_C43), all capacitors are 0.1μF, 16V, used to remove high-frequency interference on the power line (such as switching noise, radio frequency interference, etc.), provide local current reserve, reduce voltage fluctuations caused by transient current changes, ensure the stability of the power supply, and achieve a wider frequency band noise suppression effect through multiple parallel capacitors. The C_0402 package refers to the package size of the capacitor. 0402 means the size is 0.04 inches × 0.02 inches (about 1.0mm × 0.5mm). Each capacitor is connected in parallel with GND to form a low-pass filter, which can effectively filter out high-frequency noise signals on the power line.

[0044] Preferably, the connector is connected to a CODEC signal, and the CODEC signal includes a first signal path set and a second signal path set, wherein the first signal path set is connected to the first headset interface, including the left channel input path and the right channel input path, and the second signal path set is connected to the second headset interface, including the microphone input detection signal path and the microphone input signal path.

[0045] Specifically, the CODEC signal is introduced into the headphone circuit through the connector and is divided into two signal path sets. The first signal path set is connected to the first headset interface and is responsible for transmitting the audio output (left channel and right channel) of the headset to the headphone speaker, including the left channel input path (transmitting the left channel audio signal) and the right channel input path (transmitting the right channel audio signal); the second signal path set is connected to the second headset interface and is responsible for processing the input signal of the microphone, including detecting and transmitting the microphone signal, including the microphone input detection signal path, which is used to detect whether the microphone is connected and whether the headset is a four-segment headset (TRRS); the microphone input signal path transmits the voice signal of the microphone for processing.

[0046] Preferably, the digital signals in the first headset interface and the second headset interface use the digital ground as a reference ground, and the analog signals use the analog ground as a reference ground, and the digital ground and the reference ground are connected via a capacitor.

[0047] Specifically, digital ground (GND) is a reference potential provided for digital signals (such as logic level signals, digital audio signals), and is usually used to drive high-frequency switching signals (such as I 2 S, SPI, I 2 C and other interface signals), digital ground is usually used in conjunction with digital power supply and is specifically used for digital signal parts; analog ground (AUGND) is a reference potential provided for analog signals (such as analog audio signals), and is used to process continuously changing low-frequency or high-quality audio signals (such as left and right channel audio signals, microphone signals). Analog ground is usually used in conjunction with analog power supply and is used to process high-fidelity audio signals.

[0048] Example 2

[0049] The present application also provides an earphone, comprising any multifunctional earphone circuit in Example 1.

[0050] The multifunctional earphone circuit and earphone provided in the embodiments of the present application have at least the following technical effects or advantages:

[0051] A multifunctional headphone circuit provided in an example of the present application includes: a connector for connecting an audio device; a first headset interface connected to the connector; a second headset interface connected to the connector, including a microphone input detection signal path and a microphone input signal path; wherein, when the first headset interface and the second headset interface are connected to a four-segment headset, sound input is performed through a left channel input path and a right channel input path in the first headset interface, thereby solving the technical problem that the existing headphone circuit is not compatible with both three-segment headsets and four-segment headsets, and is not able to access LINE IN recording input when connected to a four-segment headset, thereby limiting the scope of application of the audio input device, and achieving the technical effect of being compatible with three-segment headsets and four-segment headset inputs, and being able to access LINE IN recording input when connected to a four-segment headset, thereby improving the scope of application of the audio input device.

[0052] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0053] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A multifunctional earphone circuit, characterized in that: include: Connector for connecting audio equipment; A first headset interface connected to the connector; A second headset interface, connected to the connector, including a microphone input detection signal path and a microphone input signal path; When the first earphone interface and the second earphone interface are connected to a four-segment earphone, sound input is performed through a left channel input path and a right channel input path in the first earphone interface.

2. The multifunctional earphone circuit according to claim 1, characterized in that: The connector is connected to a CODEC signal, and the CODEC signal includes a first signal path set and a second signal path set, wherein the first signal path set is connected to the first headset interface, including the left channel input path and the right channel input path, and the second signal path set is connected to the second headset interface, including the microphone input detection signal path and the microphone input signal path.

3. The multifunctional earphone circuit according to claim 1, characterized in that: The first headset interface comprises: Sound input detection signal path, left channel input path, right channel input path; When a four-segment headset is connected, the audio input signal is detected through the audio input detection signal path, and the audio input is performed through the left channel input path and the right channel input path in the first headset interface.

4. The multifunctional earphone circuit according to claim 1, characterized in that: The first headset interface also includes: A first sound output detection signal path, a first left channel output path, a first right channel output path, a microphone input detection signal path, a second left channel output path, and a second right channel output path.

5. The multifunctional earphone circuit according to claim 1, characterized in that: The second headset interface also includes: The third left channel output path, the third right channel output path, and the headphone access detection signal path.

6. The multifunctional earphone circuit according to claim 1, characterized in that: Each signal path in the first headset interface and the second headset interface is connected to a TVS diode and a filter capacitor.

7. The multifunctional earphone circuit according to claim 1, characterized in that: The digital signals in the first headset interface and the second headset interface use the digital ground as a reference ground, and the analog signals use the analog ground as a reference ground. The digital ground and the reference ground are connected via a capacitor.

8. A headset, characterized in that: The earphone comprises the multifunctional earphone circuit according to any one of claims 1-7.

Images