A temperature and humidity feedback module, manufacturing method and system application

Abstract

This invention relates to the field of temperature and humidity sensing technology, specifically a temperature and humidity feedback module, manufacturing method, and system application. The temperature and humidity feedback module includes: a temperature wireless switch and a humidity wireless switch, each connected to a power source via conductive lines to form a circuit controlled by a flexible temperature and humidity sensor; the flexible temperature and humidity sensor has at least three different states: an initial state, an over-temperature state, and an over-humidity state; when in the over-temperature state, it contacts and is electrically connected to a first contact line, the power source supplies power to the temperature wireless switch, and activates relevant cooling equipment; when in the over-humidity state, it contacts and is electrically connected to a second contact line, the power source supplies power to the humidity wireless switch, and activates relevant dehumidification equipment; both the flexible temperature and humidity sensor and the conductive lines are made of flexible non-metallic conductive film; this invention solves the problems of traditional temperature and humidity control systems or sensors being unable to adapt to the high humidity environment of plant cultivation, changes in plant growth morphology, being environmentally unfriendly, and being unable to be applied on a large scale.

Description

Technical Field

[0001] This invention relates to the field of temperature and humidity sensing technology, and in particular to a temperature and humidity feedback module, manufacturing method, and system application. Background Technology

[0002] Temperature and humidity control plays a crucial role in industrial workshops, agricultural greenhouses, and smart home devices. Especially in the process of plant cultivation, plants may exhibit growth stagnation or quality decline under high temperature or high humidity conditions, which in turn affects the efficiency and growth quality of plant cultivation. Therefore, temperature and humidity control plays a decisive role in the healthy growth of plants and the cultivation of plants.

[0003] Traditional temperature and humidity control systems mainly rely on electronic sensors to monitor changes in temperature and humidity in the environment in real time. They often use metal oxide sensors or polymer sensors and control related equipment (such as dehumidifiers and air conditioners) to regulate the temperature and humidity of the environment through circuit feedback mechanisms.

[0004] However, in agricultural applications, traditional temperature and humidity control systems have the following drawbacks:

[0005] (1) Due to the high humidity in the plant cultivation environment, it is easy to cause faults such as leakage or short circuit. In addition, metal materials and PCB boards in ordinary circuits may be oxidized, corroded or aged in this environment, which will lead to the degradation or even failure of the temperature and humidity control system, especially the electronic sensors (equivalent to temperature and humidity feedback modules) set close to the plants for monitoring temperature and humidity.

[0006] (2) Traditional temperature and humidity control systems are usually designed as circuit boards that cannot be bent. When the sensor or circuit board is installed on the plant, it cannot adapt to the changes in the plant's growth form and may fall off, causing errors in temperature and humidity detection. Or, because the circuit board or sensor is heavy, it will put pressure on the plant, which will restrict the plant's growth and is not conducive to fitting the plant to achieve one-to-one monitoring.

[0007] (3) Traditional temperature and humidity control systems and their sensors usually require continuous power supply to work. Long-term monitoring consumes a lot of power and requires frequent battery replacements. In addition, the circuit boards and sensors are complex and difficult to manufacture, resulting in high costs. They do not meet the requirements of energy conservation and environmental protection and the needs of large-scale applications. Summary of the Invention

[0008] To address the aforementioned shortcomings, the present invention aims to provide a temperature and humidity feedback module, manufacturing method, and system application, which solves the problems that traditional temperature and humidity control systems or sensors cannot adapt to the high humidity environment of plant cultivation, changes in plant growth morphology, are not environmentally friendly, and cannot be applied on a large scale.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] A temperature and humidity feedback module includes a flexible temperature and humidity sensor, conductive lines, a wireless temperature switch, a wireless humidity switch, and a power supply.

[0011] The flexible temperature and humidity sensor has at least three different states: an initial state, an over-temperature state, and an over-humidity state. The three different states are affected by the current temperature and the current external humidity and are subject to deformation switching. When the temperature / humidity sensed by the flexible temperature and humidity sensor is within the range of the trigger temperature / trigger humidity, the flexible temperature and humidity sensor is in the initial state. When the temperature sensed by the flexible temperature and humidity sensor exceeds the trigger temperature, the flexible temperature and humidity sensor is in the over-temperature state. When the humidity sensed by the flexible temperature and humidity sensor exceeds the trigger humidity, the flexible temperature and humidity sensor is in the over-humidity state.

[0012] One end of the temperature wireless switch and one end of the humidity wireless switch are electrically connected to one end of the power supply. The other end of the power supply is electrically connected to one end of the flexible temperature and humidity sensor. A first contact line is led out from the other end of the temperature wireless switch, and a second contact line is led out from the other end of the humidity wireless switch.

[0013] When the flexible temperature and humidity sensor is in an over-temperature state, the flexible temperature and humidity sensor makes contact with and is electrically connected to the first contact line, and the power supply powers the temperature wireless switch; the temperature wireless switch is used to activate the cooling device.

[0014] When the flexible temperature and humidity sensor is in an ultra-humid state, the flexible temperature and humidity sensor makes contact with and is electrically connected to the second contact line, and the power supply powers the humidity wireless switch; the humidity wireless switch is used to start the dehumidification device.

[0015] When the flexible temperature and humidity sensor is in its initial state, the flexible temperature and humidity sensor is not in contact with either the first contact line or the second contact line;

[0016] The first contact line, the second contact line, and the electrical connection all use the conductive line; the conductive line is a flexible non-metallic conductive film.

[0017] Furthermore, the flexible temperature and humidity sensor includes a humidity-sensitive layer, a sensing transition layer, and a temperature-sensitive conductive layer; the flexible temperature and humidity sensor is formed by stacking the humidity-sensitive layer, the sensing transition layer, and the temperature-sensitive conductive layer from top to bottom, with the humidity-sensitive layer facing the first contact line and the temperature-sensitive conductive layer facing the second contact line.

[0018] The coefficient of thermal expansion of the temperature-sensitive conductive layer is greater than that of the humidity-sensitive layer and the sensing transition layer.

[0019] When the temperature sensed by the temperature-sensitive conductive layer exceeds the trigger temperature, the temperature-sensitive conductive layer expands and stretches in a positive correlation with the sensed temperature, causing the sensing transition layer and the humidity-sensitive layer to curl towards the humidity-sensitive layer; when the temperature-sensitive conductive layer is electrically connected to the first contact line, the power supply provides power to the temperature wireless switch.

[0020] When the humidity sensed by the humidity-sensitive layer exceeds the trigger humidity, the humidity-sensitive layer expands and stretches in a positive correlation with the sensed humidity, causing the sensing transition layer and the temperature-sensitive conductive layer to curl towards the temperature-sensitive conductive layer; when the temperature-sensitive conductive layer is electrically connected to the second contact line, the power supply provides power to the humidity wireless switch.

[0021] Furthermore, the conductive circuit includes a circuit base layer and a conductive layer; the conductive circuit is formed by stacking the circuit base layer and the conductive layer, the humidity-sensitive layer and the sensing transition layer are both connected to the circuit base layer, and the temperature-sensitive conductive layer is electrically connected to the conductive layer.

[0022] Furthermore, the humidity-sensitive layer contains hydrophilic groups, and the humidity-sensitive layer expands and stretches itself by combining with water molecules through the hydrophilic groups.

[0023] Furthermore, the humidity-sensitive layer is a flexible hydrophilic material, the sensing transition layer and the circuit base layer are both flexible materials, and the temperature-sensitive conductive layer and the conductive layer are both flexible conductive materials;

[0024] Both the flexible hydrophilic material and the flexible conductive material are derived from the flexible material.

[0025] The other end of the power supply and one end of the flexible temperature and humidity sensor are electrically connected and integrally formed.

[0026] Furthermore, the other end of the temperature wireless switch extends from the first contact line to the top of the flexible temperature and humidity sensor; the distance between the first contact line and the flexible temperature and humidity sensor is positively correlated with the trigger temperature of the temperature wireless switch.

[0027] The other end of the humidity wireless switch leads out the second contact line to the bottom of the flexible temperature and humidity sensor; the distance between the second contact line and the flexible temperature and humidity sensor is positively correlated with the trigger humidity of the humidity wireless switch.

[0028] The flexible temperature and humidity sensor, the first contact line, and the second contact line are mounted on the same substrate.

[0029] A method for manufacturing a temperature and humidity feedback module, used to manufacture the aforementioned temperature and humidity feedback module; comprising the following steps:

[0030] A1: Based on the circuit path of the temperature and humidity feedback module circuit diagram and the preset shape of the flexible temperature and humidity sensor, the flexible non-metallic conductive film is cut to obtain a circuit layout in which the flexible temperature and humidity sensor and the conductive circuit are integrally formed.

[0031] A2: In the circuit layout, the lower surface of the flexible non-metallic conductive film is processed to make the flexible non-metallic conductive film layered to form conductive lines; the upper layer is used as the base layer of the line, and the lower layer is used as the conductive layer.

[0032] A3: In the circuit layout, the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensor are broken, so that the flexible non-metallic conductive film at this location is layered into upper, middle and lower layers to form a flexible temperature and humidity sensor; wherein the upper layer is used as a humidity-sensitive layer, the middle layer is used as a sensing transition layer, and the lower layer is used as a temperature-sensitive conductive layer.

[0033] A4: Connect the temperature wireless switch, humidity wireless switch, and power supply at the corresponding positions in the circuit layout.

[0034] Furthermore, in step A1: a laser device is used to cut the flexible non-metallic conductive film;

[0035] In step A2: the lower surface of the flexible non-metallic conductive film is irradiated with a laser device to perform conversion processing.

[0036] Furthermore, in step A3: a strong alkaline solution is used to break the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensor.

[0037] A plant growth environment control system includes at least one of the above-mentioned temperature and humidity feedback modules; it also includes a central controller, at least one dehumidifier and at least one cooling device;

[0038] The temperature and humidity feedback module and the central controller are wirelessly connected, and the dehumidification device and the cooling device are both electrically connected to the central controller.

[0039] Each of the temperature and humidity feedback modules establishes a trigger association with at least one of the dehumidification devices and one of the cooling devices;

[0040] The central controller is used to activate the cooling device or the cooling device for the corresponding cultivated plant when it receives a feedback signal from the temperature wireless switch; it is also used to activate the dehumidification device or the dehumidification device for the corresponding cultivated plant when it receives a feedback signal from the humidity wireless switch.

[0041] The technical solution provided by this invention can include the following beneficial effects: the flexible temperature and humidity sensing element and conductive circuit in the circuit construction based on the temperature and humidity feedback module are both sampled with flexible non-metallic conductive film, making the entire circuit lightweight and flexible. The temperature and humidity feedback module can be installed one-to-one with the plant and adapt to the changes in the plant's growth morphology (specifically, the flexible non-metallic conductive film is reserved with some length / curvature during installation to adapt to the changes in the plant's growth morphology, such as the circuit being arched when the branches are thin and flexible and flattened as the branches become thicker), improving the accuracy of temperature and humidity monitoring.

[0042] Furthermore, since the flexible temperature and humidity sensors and conductive circuits are all made of non-metallic materials, they are not afraid of high humidity environments. Only simple waterproofing protection is needed for small components such as temperature wireless switches, humidity wireless switches, and power supplies (such as button batteries) (or they are waterproof themselves and do not require protection). This can resist the influence of high humidity environments in plant cultivation on the circuit, greatly extending the service life of the temperature and humidity feedback module.

[0043] More importantly, both temperature and humidity feedback in the temperature and humidity feedback module are triggered by the deformation of a flexible temperature and humidity sensor. Only after reaching the trigger temperature or humidity level will the flexible temperature and humidity sensor make contact with the first or second contact line to provide power to the wireless temperature or humidity switch, enabling it to send feedback signals to relevant systems and equipment, directly or indirectly activating the relevant cooling or dehumidifying equipment. The flexible temperature and humidity sensor returns to its initial shape to disconnect when the temperature or humidity level drops below the trigger temperature or humidity level. As a result, the temperature and humidity feedback module consumes little power and does not require frequent power supply replacements. In addition, the simple circuit structure of the temperature and humidity feedback module greatly reduces manufacturing difficulty and cost, meeting the requirements of energy conservation and environmental protection and the needs of large-scale applications. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of a temperature and humidity feedback module according to one embodiment of the present invention.

[0045] Figure 2 Is it like this? Figure 1 The diagram shows the schematic of a flexible temperature and humidity sensor.

[0046] Figure 3 Is it like this? Figure 2 The diagram shows the expansion and stretching of the temperature-sensitive conductive layer.

[0047] Figure 4 Is it like this? Figure 2 The diagram shows the expansion and stretching of the humidity-sensitive layer.

[0048] Figure 5 Is it like this? Figure 1 The schematic diagram of the conductive circuit shown.

[0049] Figure 6 This is a flowchart of a method for manufacturing a temperature and humidity feedback module according to one embodiment of the present invention.

[0050] Figure 7 Is it like this? Figure 6 A schematic diagram of the circuit layout in step A1 is shown.

[0051] Figure 8 This is a schematic diagram of a plant growth environment regulation system according to one embodiment of the present invention.

[0052] Among them: flexible temperature and humidity sensing element 1, conductive circuit 2, temperature wireless switch 3, humidity wireless switch 4, power supply 5, humidity sensitive layer 11, sensing transition layer 12, temperature sensitive conductive layer 13, circuit base layer 21, and conductive layer 22.

[0053] Temperature and humidity feedback module 10, central controller 20, dehumidification equipment 30, cooling equipment 40. Detailed Implementation

[0054] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0055] In the description of this invention, it should be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of these features, used to distinguish and describe features, without any order or emphasis.

[0056] In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0057] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0058] The following combination Figures 1 to 8 This invention describes a temperature and humidity feedback module, its manufacturing method, and its system application according to an embodiment of the present invention.

[0059] A temperature and humidity feedback module includes a flexible temperature and humidity sensor 1, a conductive circuit 2, a temperature wireless switch 3, a humidity wireless switch 4, and a power supply 5.

[0060] The flexible temperature and humidity sensor 1 has at least three different states: initial state, over-temperature state, and over-humidity state. The three different states are affected by the current temperature and the current external humidity and are deformed and switched. When the temperature / humidity sensed by the flexible temperature and humidity sensor 1 is within the range of the trigger temperature / trigger humidity, the flexible temperature and humidity sensor 1 is in the initial state. When the temperature sensed by the flexible temperature and humidity sensor 1 exceeds the trigger temperature, the flexible temperature and humidity sensor 1 is deformed and is in the over-temperature state. When the humidity sensed by the flexible temperature and humidity sensor 1 exceeds the trigger humidity, the flexible temperature and humidity sensor 1 is deformed and is in the over-humidity state.

[0061] One end of the temperature wireless switch 3 and one end of the humidity wireless switch 4 are electrically connected to one end of the power supply 5. The other end of the power supply 5 is electrically connected to one end of the flexible temperature and humidity sensor 1. The other end of the temperature wireless switch 3 leads out a first contact line, and the other end of the humidity wireless switch 4 leads out a second contact line.

[0062] When the flexible temperature and humidity sensor 1 is in an over-temperature state, the flexible temperature and humidity sensor 1 makes contact with the first contact line and is electrically connected, and the power supply 5 supplies power to the temperature wireless switch 3; the temperature wireless switch 3 is used to start the cooling equipment.

[0063] When the flexible temperature and humidity sensor 1 is in an ultra-humid state, the flexible temperature and humidity sensor 1 makes contact with the second contact line and is electrically connected, and the power supply 5 supplies power to the humidity wireless switch 4; the humidity wireless switch 4 is used to start the dehumidification equipment.

[0064] When the flexible temperature and humidity sensor 1 is in its initial state, the flexible temperature and humidity sensor 1 is not in contact with either the first contact line or the second contact line.

[0065] The first contact line, the second contact line, and the electrical connection all use conductive line 2; conductive line 2 is a flexible non-metallic conductive film.

[0066] This invention proposes a temperature and humidity feedback module, a manufacturing method, and a preferred embodiment of the system application, such as... Figure 1 As shown, in the circuit construction based on the temperature and humidity feedback module, both the flexible temperature and humidity sensor 1 and the conductive line 2 are sampled using flexible non-metallic conductive films, making the entire circuit lightweight and flexible. The temperature and humidity feedback module can be installed one-to-one with the plant and adapt to the changes in the plant's growth morphology (specifically, the flexible non-metallic conductive film is reserved with some length / curvature during installation to adapt to changes in the plant's growth morphology, such as the circuit being arched when the branches are thin and flexibly flattened as the branches thicken), thus improving the accuracy of temperature and humidity monitoring.

[0067] Furthermore, since the flexible temperature and humidity sensor 1 and the conductive circuit 2 are both non-metallic materials, they are not afraid of high humidity environments. Only simple waterproof protection is needed for small components such as the temperature wireless switch 3, humidity wireless switch 4, and power supply 5 (such as a button battery) (or they are waterproof themselves and do not require protection). This can resist the influence of high humidity environment on the circuit, greatly extending the service life of the temperature and humidity feedback module.

[0068] More importantly, both the temperature and humidity feedback of the temperature and humidity feedback module are triggered by the deformation of the flexible temperature and humidity sensor 1. Only after reaching the trigger temperature or trigger humidity will the flexible temperature and humidity sensor 1 make contact with the first or second contact line to supply power to the temperature wireless switch 3 or humidity wireless switch 4, so that it sends feedback signals to the relevant systems and equipment, directly or indirectly activating the relevant cooling or dehumidifying equipment. The flexible temperature and humidity sensor 1 returns to its initial shape to disconnect when the temperature or trigger humidity is lower than the trigger temperature or trigger humidity. Therefore, the temperature and humidity feedback module consumes less power and does not require frequent replacement of the power supply 5. In addition, the circuit structure of the temperature and humidity feedback module is simple, which greatly reduces the manufacturing difficulty and cost, and meets the requirements of energy conservation and environmental protection and the needs of large-scale application.

[0069] Specifically, the three different deformation switching relationships can be as follows: the other end of the temperature wireless switch 3 leads out a first contact line to the top of the temperature and humidity sensor 1, and the other end of the humidity wireless switch 4 leads out a second contact line to the bottom of the temperature and humidity sensor 1; when the temperature sensed by the flexible temperature and humidity sensor 1 exceeds the deformation temperature, the temperature and humidity sensor 1 curls upward in a positive correlation with the sensed temperature to switch to the over-temperature state. The upward curling of the flexible temperature and humidity sensor 1 makes it contact and electrically connected with the first contact line, and the power supply 5 supplies power to the temperature wireless switch 3; when the humidity sensed by the flexible temperature and humidity sensor 1 exceeds the deformation humidity, the temperature and humidity sensor 1 curls downward in a positive correlation with the sensed humidity to switch to the over-humidity state. The flexible temperature and humidity sensor 1 makes contact and electrically connected with the first contact line, and the power supply 5 supplies power to the temperature wireless switch 3.

[0070] Furthermore, the flexible temperature and humidity sensor 1 includes a humidity-sensitive layer 11, a sensing transition layer 12, and a temperature-sensitive conductive layer 13; the flexible temperature and humidity sensor 1 is formed by stacking the humidity-sensitive layer 11, the sensing transition layer 12, and the temperature-sensitive conductive layer 13 from top to bottom, with the humidity-sensitive layer 11 facing the first contact line and the temperature-sensitive conductive layer 13 facing the second contact line.

[0071] The coefficient of thermal expansion of the temperature-sensitive conductive layer 13 is greater than that of the humidity-sensitive layer 11 and the sensing transition layer 12.

[0072] When the temperature sensed by the temperature-sensitive conductive layer 13 exceeds the trigger temperature, the temperature-sensitive conductive layer 13 expands and stretches in a positive correlation with the sensed temperature, causing the sensing transition layer 12 and the humidity-sensitive layer 11 to curl toward the humidity-sensitive layer 11; when the temperature-sensitive conductive layer 13 is electrically connected to the first contact line, the power supply 5 supplies power to the temperature wireless switch 3.

[0073] When the humidity sensed by the humidity-sensitive layer 11 exceeds the trigger humidity, the humidity-sensitive layer 11 expands and stretches in a positive correlation with the sensed humidity, causing the sensing transition layer 12 and the temperature-sensitive conductive layer 13 to curl towards the temperature-sensitive conductive layer 13; when the temperature-sensitive conductive layer 13 is electrically connected to the second contact line, the power supply 5 supplies power to the humidity wireless switch 4.

[0074] In this embodiment, as Figure 2 As shown, to achieve the three different deformation switching relationships, the flexible temperature and humidity sensor 1 needs to be composed of a humidity-sensitive layer 11, a sensing transition layer 12, and a temperature-sensitive conductive layer 13. The temperature-sensitive conductive layer 13 is used to conduct electricity when the first or second contact line is released. Since the temperature-sensitive conductive layer 13 has the largest coefficient of thermal expansion among the three layers, it expands most dramatically when sensing temperature. Under the internal stress generated by the difference in thermal expansion coefficients, the three layers curl towards the humidity-sensitive layer 11, i.e., switching from the initial form to the over-temperature form (e.g., ...). Figure 3 As shown), it finally makes contact with the first contact line, realizing the electrical connection of the temperature wireless switch 3; while the humidity-sensitive layer 11, through its own expansion and stretching of the humidity-sensitive material, drives (or forces) the sensing transition layer 12 and the temperature-sensitive conductive layer 13 to curl towards the temperature-sensitive conductive layer 13, that is, switching from the initial form to the ultra-humid form (as shown). Figure 4 As shown), it eventually makes contact with the second contact line, realizing the electrical connection of the humidity wireless switch 4; thus enabling the flexible temperature and humidity sensor 1 to have temperature and humidity detection capabilities.

[0075] Furthermore, the conductive line 2 includes a base layer 21 and a conductive layer 22; the conductive line 2 is formed by stacking the base layer 21 and the conductive layer 22, the humidity-sensitive layer 11 and the sensing transition layer 12 are both connected to the base layer 21, and the temperature-sensitive conductive layer 13 is electrically connected to the conductive layer 22.

[0076] In this embodiment, as Figure 5 As shown, the conductive circuit 2 consists of a base layer 21 and a conductive layer 22. The conductive layer 22 provides a path for electrical energy conduction when forming a circuit, conducting the electrical energy of the power source 5 to the temperature wireless switch 3 or the humidity wireless switch 4. The base layer 21 mainly protects the conductive layer 22, preventing the conductive layer 22 from breaking and opening due to insufficient toughness.

[0077] Furthermore, the humidity-sensitive layer 11 contains hydrophilic groups, and the humidity-sensitive layer 11 expands and stretches itself by binding with water molecules through the hydrophilic groups.

[0078] In this embodiment, the humidity-sensitive layer 11 is preferably made sensitive to humidity by containing hydrophilic groups such as hydroxyl or carboxyl groups, which makes the manufacturing of the layer simple. Hydrophilic groups can be obtained by breaking the molecular bonds of a specific material (such as polyimide). Based on the fact that hydrophilic groups can easily combine with water molecules through hydrogen bonds, the humidity-sensitive layer 11 deforms more violently as the number of water molecules increases, thus achieving its own expansion and stretching.

[0079] Furthermore, the humidity-sensitive layer 11 is made of a flexible hydrophilic material, the sensing transition layer 12 and the circuit base layer 21 are both made of flexible materials, and the temperature-sensitive conductive layer 13 and the conductive layer 22 are both made of flexible conductive materials.

[0080] Both flexible hydrophilic materials and flexible conductive materials are transformed from flexible materials;

[0081] The other end of the power supply 5 is electrically connected to one end of the flexible temperature and humidity sensor 1 and integrally formed.

[0082] In this embodiment, since both the flexible temperature and humidity sensor 1 and the conductive circuit 2 are made of flexible non-metallic conductive film, and the sensing transition layer 12 and the circuit base layer 21 both serve to protect the conductive layer, and the temperature-sensitive conductive layer 13 and the conductive layer 22 both serve to conduct electricity, the flexible temperature and humidity sensor 1 and the conductive circuit 2 have the basis for integral molding. Therefore, the humidity-sensitive layer 11 is preferably polyimide (flexible hydrophilic material), the sensing transition layer 12 and the circuit base layer 21 are preferably polyimide (flexible material), and the temperature-sensitive conductive layer 13 and the conductive layer 22 are preferably graphene (flexible conductive material). Moreover, both polyimide (flexible hydrophilic material) and graphene (flexible conductive material) can be converted from polyimide (flexible material), so that the other end of the power supply 5 and one end of the flexible temperature and humidity sensor 1 can be integrally molded, so that the electrical connection between the other end of the power supply 5 and the flexible temperature and humidity sensor 1 is stable. After installation on the plant, the plant can grow due to its flexible characteristics and will not be stretched or broken due to the existence of connection points.

[0083] In a specific integrated molding method, when the flexible non-metallic conductive film is a polyimide film, graphene is obtained by converting and processing the lower surface of the polyimide film to form a conductive circuit 2; then, the molecular bonds of the upper surface of the polyimide film in the region of the flexible temperature and humidity sensor 1 are broken to obtain polyimide acid (containing hydrophilic groups), forming the flexible temperature and humidity sensor 1, and finally achieving integrated molding with electrical connection.

[0084] Furthermore, the other end of the temperature wireless switch 3 extends a first contact line to the top of the flexible temperature and humidity sensor 1; the distance between the first contact line and the flexible temperature and humidity sensor 1 is positively correlated with the trigger temperature of the temperature wireless switch 3.

[0085] The other end of the humidity wireless switch 4 leads out a second contact line to the bottom of the flexible temperature and humidity sensor 1; the distance between the second contact line and the flexible temperature and humidity sensor 1 is positively correlated with the trigger humidity of the humidity wireless switch 4.

[0086] The flexible temperature and humidity sensor 1, the first contact line and the second contact line are mounted on the same substrate.

[0087] In this embodiment, in order to facilitate the use of the deformation of the temperature and humidity sensor 1 to connect the temperature wireless switch 3 and the humidity wireless switch 4, the first contact line and the second contact line are respectively arranged above and below the temperature and humidity sensor 1, and the purpose of adjusting the trigger temperature / humidity can be achieved by adjusting the spacing.

[0088] Specifically, based on the premise that the sensitivity of the flexible temperature and humidity sensor 1 to temperature and humidity remains unchanged (i.e., the thickness of the humidity-sensitive layer 11 and the temperature-sensitive conductive layer 13 remains unchanged), within a certain range, the trigger thresholds (i.e., trigger temperature and trigger humidity) of the temperature wireless switch 3 and the humidity wireless switch 4 can be adjusted by adjusting the distance between the flexible temperature and humidity sensor 1 and the first contact line and the second contact line, respectively. If the distance is small, the flexible temperature and humidity sensor 1 can make contact with the first contact line or the second contact line with a small degree of curling, so that the switch is energized, which means that the trigger threshold is small, that is, a positive correlation exists.

[0089] Similarly, the thickness of the temperature-sensitive conductive layer 13 is negatively correlated with the trigger temperature of the temperature wireless switch 3, and the thickness of the humidity-sensitive layer 11 is negatively correlated with the trigger humidity of the humidity wireless switch 4. Given that the distance between the flexible temperature and humidity sensor 1 and the first and second contact lines remains constant, within a certain range, the trigger thresholds (i.e., trigger temperature and trigger humidity) of the temperature wireless switch 3 and the humidity wireless switch 4 can be adjusted by adjusting the sensitivity of the flexible temperature and humidity sensor 1 to temperature and humidity (i.e., the thickness of the humidity-sensitive layer 11 and the temperature-sensitive conductive layer 13). For example, a larger thickness makes it easier for the flexible temperature and humidity sensor 1 to curl and deform, thus accelerating contact with the first or second contact line and energizing the switch, indicating a smaller trigger threshold, i.e., a negative correlation.

[0090] It should be noted that the relative relationship between the temperature and humidity sensor 1, the first contact line, and the second contact line affects the trigger temperature / humidity. Therefore, the temperature and humidity sensor 1, the first contact line, and the second contact line are mounted on the same substrate (which can be a flexible substrate or a rigid plate) to prevent relative positional shift. Preferably, a flexible substrate with an initial semi-circular arc shape is used. The flexible substrate is placed over the trunk of the plant, with the center of the flexible substrate and the centerline of the trunk fixedly connected (either by nails). As the trunk grows, the flexible substrate fits closer to the trunk. When the trunk diameter exceeds the diameter of the flexible substrate in its semi-circular arc state (i.e., the initial state), the flexible substrate will expand as the trunk grows (i.e., the non-initial state). During this expansion, the lengths of the temperature and humidity sensor 1, the first contact line, and the second contact line relatively shrink, but their relative positional relationship remains unchanged, thus ensuring the stability of the trigger temperature / humidity.

[0091] A method for manufacturing a temperature and humidity feedback module, used to manufacture the aforementioned temperature and humidity feedback module; comprising the following steps:

[0092] A1: Based on the circuit path of the temperature and humidity feedback module circuit diagram and the preset shape of the flexible temperature and humidity sensor 1, the flexible non-metallic conductive film is cut to obtain the circuit layout of the flexible temperature and humidity sensor 1 and the conductive line 2 integrally formed.

[0093] A2: In the circuit layout, the lower surface of the flexible non-metallic conductive film is transformed and processed to form a conductive line 2 by layering the flexible non-metallic conductive film into upper and lower layers; wherein the upper layer is used as the circuit base layer 21 and the lower layer is used as the conductive layer 22.

[0094] A3: In the circuit layout, the molecular bonds of the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensor 1 are broken, so that the flexible non-metallic conductive film at this location is layered into upper, middle and lower layers to form the flexible temperature and humidity sensor 1; wherein the upper layer is used as a humidity sensitive layer 11, the middle layer is used as a sensing transition layer 12, and the lower layer is used as a temperature sensitive conductive layer 13.

[0095] A4: Connect the temperature wireless switch 3, humidity wireless switch 4, and power supply 5 to the corresponding positions in the circuit layout.

[0096] In this embodiment, a preferred embodiment of a method for manufacturing a temperature and humidity feedback module is also proposed, such as... Figure 6 As shown, for the sake of simplifying the manufacturing process, a flexible non-metallic conductive film (such as a polyimide film) that can be processed to obtain a flexible temperature and humidity sensor 1 and a conductive circuit 2 is selected. This film is then cut to obtain a circuit layout in which the flexible temperature and humidity sensor 1 and the conductive circuit 2 are integrally formed (e.g., ...). Figure 7 (The solid line in the diagram) simplifies the various processes in traditional circuit manufacturing, such as copper plating, circuit diagram transfer, and line etching. Then, the lower surface of the flexible non-metallic conductive film is transformed using methods such as chemical oxidation-reduction, pyrolysis, or plasma stripping to convert polyimide into conductive graphene, thus obtaining conductive circuit 2. The upper layer serves as the circuit base layer 21 (polyimide), and the lower layer serves as the conductive layer 22 (graphene). Next, the molecular bonds of the upper surface of the flexible non-metallic conductive film (now layered as polyimide and graphene) located at the flexible temperature and humidity sensor 1 are broken, resulting in hydrophilic groups on the upper surface. This creates a flexible temperature and humidity sensor 1 formed by layering the flexible non-metallic conductive film into upper, middle, and lower layers. The upper layer serves as the humidity-sensitive layer 11 (polyimide acid), the middle layer as the sensing transition layer 12 (polyimide), and the lower layer as the temperature-sensitive conductive layer 13 (graphene). Finally, a temperature wireless switch 3, a humidity wireless switch 4, and a power supply 5 are connected to the corresponding positions in the circuit layout to complete the manufacturing process.

[0097] It should be noted that the electrical connection between the temperature wireless switch 3, the humidity wireless switch 4, and the power supply 5 and the corresponding conductive line 2 can be achieved through connection methods such as soldering, plugging, or crimping the pins to the conductive layer 22 (graphene).

[0098] Furthermore, in step A1: a laser device is used to cut the flexible non-metallic conductive film;

[0099] In step A2: The lower surface of the flexible non-metallic conductive film is irradiated with a laser device to perform conversion processing.

[0100] In this embodiment, based on the selectable parameters of the laser device such as laser wavelength, scanning speed, and laser power, both steps A1 and A2 use laser equipment for cutting and conversion processing. The small diameter of the laser spot can be used to minimize the laser-affected area and improve processing accuracy, enabling precise cutting of the circuit layout of the temperature and humidity feedback module. At the same time, by selecting the laser parameters, the resistance value of the graphene generated on the polyimide surface can be precisely controlled (e.g., controlled below 0-20 ohms sheet resistance to achieve good conductivity). The thickness of the graphene layer can also be precisely controlled to adjust the thickness of the temperature-sensitive conductive layer 13.

[0101] It should be noted that the laser device works by irradiating the surface of polyimide with a laser, using photochemical and photothermal reactions to change the structure and properties of the polyimide surface, causing its molecules to decompose into multiple carbon ions, which are eventually deposited to form graphene.

[0102] Furthermore, in step A3: a strong alkaline solution is used to break the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensor 1.

[0103] In this embodiment, in step A3, a strongly alkaline solution is preferred to break the molecular bonds on the upper surface of the flexible non-metallic conductive film. The thickness of the humidity-sensitive layer 11 (or the degree of molecular bond breaking) can be controlled by using strongly alkaline solutions of different concentrations, thereby adjusting the sensitivity of the humidity-sensitive layer 11 to humidity (or water molecules).

[0104] Specifically, a method for manufacturing a temperature and humidity feedback module has the following parameter schemes:

[0105] Example 1

[0106] A1: Select a polyimide film with a thickness of 25μm, and cut the polyimide film with a laser scanning speed of 100m / s and a power of 2.867W to obtain the circuit layout;

[0107] A2: The lower surface of the circuit layout is processed using an ultraviolet picosecond laser with a laser scanning speed of 200m / s and a power of 2.867W. Graphene is generated by defocusing 5mm.

[0108] A3: Treat the unprocessed graphene-coated surface of a polyimide film with a 1 g / L KOH solution to achieve a surface area concentration of 1:1.5 (cm²). 2 / 10 -5 g), to obtain a flexible temperature and humidity sensor 1;

[0109] A4: The pins of the temperature wireless switch 3, humidity wireless switch 4, and power supply 5 are connected to the corresponding graphene via conductive silver paste.

[0110] Example 2

[0111] A1: Select a polyimide film with a thickness of 35μm, and cut the polyimide film with a laser scanning speed of 100m / s and a power of 2.867W to obtain the circuit layout;

[0112] A2: The lower surface of the circuit layout is processed using an ultraviolet picosecond laser with a laser scanning speed of 200m / s and a power of 2.867W. Graphene is generated by defocusing 5mm.

[0113] A3: Treat the unprocessed graphene-coated surface of a polyimide film with a 1 g / L KOH solution to achieve a surface area concentration of 1:1.2 (cm²). 2 / 10 -5 g), to obtain a flexible temperature and humidity sensor 1;

[0114] A4: The pins of the temperature wireless switch 3, humidity wireless switch 4, and power supply 5 are connected to the corresponding graphene via conductive silver paste.

[0115] Example 3

[0116] A1: Select a polyimide film with a thickness of 55μm, and cut the polyimide film with a laser scanning speed of 100m / s and a power of 2.867W to obtain the circuit layout;

[0117] A2: The lower surface of the circuit layout is processed using an ultraviolet picosecond laser with a laser scanning speed of 200m / s and a power of 2.867W. Graphene is generated by defocusing 5mm.

[0118] A3: Treat the unprocessed graphene-coated surface of a polyimide film with a 1 g / L KOH solution to achieve a surface area concentration of 1:1.5 (cm²). 2 / 10 -5 g), to obtain a flexible temperature and humidity sensor 1;

[0119] A4: The pins of the temperature wireless switch 3, humidity wireless switch 4, and power supply 5 are connected to the corresponding graphene via conductive silver paste.

[0120] A plant growth environment control system includes at least one of the above-mentioned temperature and humidity feedback modules 10; it also includes a central controller 20, at least one dehumidifier 30 and at least one cooling device 40;

[0121] The temperature and humidity feedback module 10 and the central controller 20 are wirelessly connected, and the dehumidification device 30 and the cooling device 40 are both electrically connected to the central controller 20.

[0122] A temperature and humidity feedback module 10 shall establish a trigger association with at least one dehumidifier and one cooling device;

[0123] The central controller 20 is used to activate the cooling device 40 or the corresponding cooling device 40 for the cultivated plant when it receives a feedback signal from the temperature wireless switch 3; it is also used to activate the dehumidification device 30 or the corresponding dehumidification device 30 for the cultivated plant when it receives a feedback signal from the humidity wireless switch 4.

[0124] In this embodiment, a preferred embodiment of a plant growth environment regulation system is also proposed, such as... Figure 8 As shown, based on the flexibility, light weight, environmental friendliness and low cost of the temperature and humidity feedback module, a plant growth environment control system can be built to collectively control the temperature and humidity of all cultivated plants in the same cultivation space (such as a cultivation room), providing the best growth environment for the cultivated plants.

[0125] Specifically, it can be applied in the following ways:

[0126] (1) In the same cultivation space, each cultivated plant is equipped with a temperature and humidity feedback module 10. The dehumidification device 30 is evenly distributed in the cultivation space according to the dehumidification range, and the cooling device 40 is evenly distributed in the cultivation space according to the cooling range. At this time, a temperature and humidity feedback module 10 corresponds to at least one dehumidification device 30 and one cooling device 40 around it. The temperature and humidity feedback module 10 triggers the start / stop of the corresponding cooling device 40 and dehumidification device 30 according to the sensing information (determining whether the trigger temperature or trigger humidity has been reached), thereby cooling or dehumidifying the environment around the cultivated plant where the temperature and humidity feedback module 10 is installed, so that the cultivated plant is in the best growth state.

[0127] (2) In the same cultivation space, each cultivated plant is equipped with a temperature and humidity feedback module 10 and at least one dehumidifier 30 and one cooling device 40. The temperature and humidity feedback module 10 triggers the start / stop of the cooling device 40 and the dehumidifier 30 based on the sensing information (determining whether the trigger temperature or trigger humidity has been reached), so as to cool or dehumidify the cultivated plant installed in the temperature and humidity feedback module 10 in a targeted manner, so that the cultivated plant is in the best growth state.

[0128] Other components and operations of the temperature and humidity feedback module, manufacturing method, and system application according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0129] In the description of this specification, references to terms such as "embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0130] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A temperature and humidity feedback module, characterized in that: Includes flexible temperature and humidity sensors, conductive circuits, wireless temperature switches, wireless humidity switches, and power supplies; The flexible temperature and humidity sensor has at least three different states: an initial state, an over-temperature state, and an over-humidity state. The three different states are affected by the current temperature and the current external humidity and are subject to deformation switching. When the temperature / humidity sensed by the flexible temperature and humidity sensor is within the range of the trigger temperature / trigger humidity, the flexible temperature and humidity sensor is in the initial state. When the temperature sensed by the flexible temperature and humidity sensor exceeds the trigger temperature, the flexible temperature and humidity sensor is in the over-temperature state. When the humidity sensed by the flexible temperature and humidity sensor exceeds the trigger humidity, the flexible temperature and humidity sensor is in the over-humidity state. One end of the temperature wireless switch and one end of the humidity wireless switch are electrically connected to one end of the power supply. The other end of the power supply is electrically connected to one end of the flexible temperature and humidity sensor. A first contact line is led out from the other end of the temperature wireless switch, and a second contact line is led out from the other end of the humidity wireless switch. When the flexible temperature and humidity sensor is in an over-temperature state, the flexible temperature and humidity sensor makes contact with the first contact line and is electrically connected, and the power supply provides power to the temperature wireless switch. The wireless temperature switch is used to activate the cooling equipment. When the flexible temperature and humidity sensor is in an ultra-humid state, the flexible temperature and humidity sensor is in contact with and electrically connected to the second contact line, and the power supply provides power to the humidity wireless switch. The wireless humidity switch is used to activate the dehumidification device. When the flexible temperature and humidity sensor is in its initial state, the flexible temperature and humidity sensor is not in contact with either the first contact line or the second contact line; The first contact line, the second contact line, and the electrical connection all use the conductive lines described above; The conductive circuit is a flexible non-metallic conductive film.

2. The temperature and humidity feedback module according to claim 1, characterized in that: The flexible temperature and humidity sensor includes a humidity-sensitive layer, a sensing transition layer, and a temperature-sensitive conductive layer; the flexible temperature and humidity sensor is formed by stacking the humidity-sensitive layer, the sensing transition layer, and the temperature-sensitive conductive layer from top to bottom, with the humidity-sensitive layer facing the first contact line and the temperature-sensitive conductive layer facing the second contact line. The coefficient of thermal expansion of the temperature-sensitive conductive layer is greater than that of the humidity-sensitive layer and the sensing transition layer. When the temperature sensed by the temperature-sensitive conductive layer exceeds the trigger temperature, the temperature-sensitive conductive layer expands and stretches in a positive correlation with the sensed temperature, causing the sensing transition layer and the humidity-sensitive layer to curl towards the humidity-sensitive layer; when the temperature-sensitive conductive layer is electrically connected to the first contact line, the power supply provides power to the temperature wireless switch. When the humidity sensed by the humidity-sensitive layer exceeds the trigger humidity, the humidity-sensitive layer expands and stretches in a positive correlation with the sensed humidity, causing the sensing transition layer and the temperature-sensitive conductive layer to curl towards the temperature-sensitive conductive layer; when the temperature-sensitive conductive layer is electrically connected to the second contact line, the power supply provides power to the humidity wireless switch.

3. The temperature and humidity feedback module according to claim 2, characterized in that: The conductive circuit includes a circuit base layer and a conductive layer; the conductive circuit is formed by stacking the circuit base layer and the conductive layer, the humidity-sensitive layer and the sensing transition layer are both connected to the circuit base layer, and the temperature-sensitive conductive layer is electrically connected to the conductive layer.

4. A temperature and humidity feedback module according to claim 2, characterized in that: The humidity-sensitive layer contains hydrophilic groups, and the humidity-sensitive layer expands and stretches itself by combining with water molecules through the hydrophilic groups.

5. A temperature and humidity feedback module according to claim 3, characterized in that: The humidity-sensitive layer is a flexible hydrophilic material, the sensing transition layer and the circuit base layer are both flexible materials, and the temperature-sensitive conductive layer and the conductive layer are both flexible conductive materials; Both the flexible hydrophilic material and the flexible conductive material are derived from the flexible material. The other end of the power supply and one end of the flexible temperature and humidity sensor are electrically connected and integrally formed.

6. The temperature and humidity feedback module according to claim 1, characterized in that: The other end of the temperature wireless switch leads out the first contact line to the top of the flexible temperature and humidity sensor; the distance between the first contact line and the flexible temperature and humidity sensor is positively correlated with the trigger temperature of the temperature wireless switch. The other end of the humidity wireless switch leads out the second contact line to the bottom of the flexible temperature and humidity sensor; the distance between the second contact line and the flexible temperature and humidity sensor is positively correlated with the trigger humidity of the humidity wireless switch. The flexible temperature and humidity sensor, the first contact line, and the second contact line are mounted on the same substrate.

7. A method for manufacturing a temperature and humidity feedback module, characterized in that: For manufacturing the temperature and humidity feedback module according to claim 3, the following steps are included: A1: Based on the circuit path of the temperature and humidity feedback module circuit diagram and the preset shape of the flexible temperature and humidity sensor, the flexible non-metallic conductive film is cut to obtain a circuit layout in which the flexible temperature and humidity sensor and the conductive circuit are integrally formed. A2: In the circuit layout, the lower surface of the flexible non-metallic conductive film is processed to make the flexible non-metallic conductive film layered to form conductive lines; the upper layer is used as the base layer of the line, and the lower layer is used as the conductive layer. A3: In the circuit layout, the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensor are broken, so that the flexible non-metallic conductive film at this location is layered into upper, middle and lower layers to form a flexible temperature and humidity sensor; wherein the upper layer is used as a humidity-sensitive layer, the middle layer is used as a sensing transition layer, and the lower layer is used as a temperature-sensitive conductive layer. A4: Connect the temperature wireless switch, humidity wireless switch, and power supply at the corresponding positions in the circuit layout.

8. A method for manufacturing a temperature and humidity feedback module according to claim 7, characterized in that: In step A1: a laser device is used to cut the flexible non-metallic conductive film; In step A2: the lower surface of the flexible non-metallic conductive film is irradiated with a laser device to perform conversion processing.

9. A method for manufacturing a temperature and humidity feedback module according to claim 7, characterized in that: In step A3: a strong alkaline solution is used to break the molecular bonds on the upper surface of the flexible non-metallic conductive film located at the flexible temperature and humidity sensor.

10. A plant growth environment regulation system, characterized in that: It includes at least one temperature and humidity feedback module according to any one of claims 1 to 6; it also includes a central controller, at least one dehumidifier and at least one cooling device; The temperature and humidity feedback module and the central controller are wirelessly connected, and the dehumidification device and the cooling device are both electrically connected to the central controller. Each of the temperature and humidity feedback modules establishes a trigger association with at least one of the dehumidification devices and one of the cooling devices; The central controller is used to activate the cooling device or the corresponding cooling device for the cultivated plant when it receives a feedback signal from the temperature wireless switch. It is also used to activate the dehumidification device or the dehumidification device for the corresponding cultivated plant when a feedback signal is received from the humidity wireless switch.

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