Module mounting structure and electronic apparatus

Abstract

The invention provides a module mounting structure which has good area efficiency and does not apply stress to a chip. The module mounting structure (12) has: a cover (36) that covers the surface of the memory module (26) on which the memory chip (32) is mounted; a relay connector board (42) which is provided between the substrate (28) and a rear-side portion of the memory module (26) where the memory chip (32) is mounted, and which brings a plurality of contact portions of the memory module (26) and the substrate (28) into contact with each other by means of a plurality of spring pins (42e); and screws (46) that fasten the cover (36), the module board (30), the relay connector board (42), and the substrate (28) in the Z direction. The cover (36) is provided with a plate support protrusion (48a) that protrudes toward the substrate (28) side and comes into contact with the module plate (30) at a position along the memory chip (32).

Description

Technical Field

[0001] The present invention relates to a module mounting structure for mounting a module having a chip on a module board relative to a substrate, and an electronic device in which the module having a chip on the module board is mounted on a substrate. Background Art

[0002] In electronic devices, a module having a chip on a module board is sometimes mounted on a substrate. As a module, a memory module is cited, for example. The module is preferably replaceable in order to improve performance or in case of failure. In the structure described in Patent Document 1, a relay connector board having a plurality of elastic pins is provided between the memory module and the substrate, and a plurality of contact portions on the back side of the memory module and the surface of the substrate are connected to each other by elastic pins. In such a structure, a plurality of contact portions can be provided in a relatively wide area on the back side of the module. In this example, the substrate, the relay connector board, and the substrate are stacked and fastened by a plurality of screws and nuts, and the memory module can be removed from the substrate and replaced by removing these screws and nuts.

[0003] Patent Document 1: U.S. Patent Application Publication No. 2023 / 309227

[0004] In the memory module of Patent Document 1, the memory chip and the relay connector board are mounted at different positions, and the area efficiency is poor. In contrast, if the relay connector board is provided on the back side of the portion where the memory chip is mounted in the memory module, the area efficiency becomes better. However, it is considered that a plurality of elastic pins are provided on the relay connector board, and if both ends thereof are fastened with screws, for example, the central portion is pushed up by the plurality of elastic pins, and the module board is bent in a warping manner, and there is a concern that stress is applied to the chip on the surface portion. Summary of the invention

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a module mounting structure and an electronic device which have good area efficiency and do not apply stress to a chip.

[0006] In order to solve the above-mentioned problems and achieve the purpose, the module mounting structure involved in the first mode of the present invention is a module mounting structure relative to a substrate mounting module, the module has a chip on the module board, and has: a cover, covering the surface of the module on which the chip is mounted; a relay connector board, arranged between the back side of the part of the module on which the chip is mounted and the substrate, and making the respective multiple contact parts of the module and the substrate contact each other through a plurality of elastic pins; and a fastening component, fastening the stacked cover, the module board, the relay connector board and the substrate in a stacking direction, the cover having a board supporting protrusion, the board supporting protrusion protruding toward the substrate side and abutting against the module board at a position along the chip.

[0007] The electronic device involved in the second mode of the present invention is an electronic device in which a module is mounted on a substrate, and the module has a chip on the module board, and comprises: a cover covering the surface of the module on which the chip is mounted; a relay connector board arranged between the back side of the portion of the module on which the chip is mounted and the substrate, and making the respective multiple contact portions of the module and the substrate contact each other through multiple elastic pins; and a fastening component fastening the stacked cover, the module board, the relay connector board and the substrate in a stacking direction, the cover having a board supporting protrusion, the board supporting protrusion protruding toward the substrate side and abutting against the module board along the periphery of the chip.

[0008] According to the above aspect of the present invention, the area efficiency is good and no stress is applied to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a perspective view of a notebook PC which is an electronic device according to an embodiment of the present invention.

[0010] Figure 2 is a perspective view of a memory module.

[0011] Figure 3 It is a three-dimensional diagram of the module installation structure.

[0012] Figure 4 It is an exploded perspective view of the module installation structure.

[0013] Figure 5 It is a partially enlarged sectional stereoscopic view of the module installation structure.

[0014] Figure 6 is a top view of the hood.

[0015] Figure 7 This is a perspective view of the cover viewed from the back.

[0016] Figure 8 It is a schematic cross-sectional view showing a threaded hole and a screw provided in the threaded hole.

[0017] Fig. 9 is a schematic cross-sectional view showing a memory module, a relay connector board, a substrate, and a backplane. Fig. 9 (a) is a diagram showing the state before assembly, Fig. 9 (b) is a diagram showing the assembled state.

[0018] Fig.10 It is an enlarged top view showing the corner of the cover.

[0019] Fig.11 It is a schematic cross-sectional view of the module installation structure.

[0020] Description of Reference Numerals

[0021] 10…notebook PC (electronic device); 12…module mounting structure; 26…memory module (module); 28…substrate; 28b, 30h…contact portion; 30…module board; 30a…surface; 30b…back surface; 30c…bulging portion; 32…memory chip (chip); 34…power chip; 36…cover; 36a…rectangular portion; 36b…bulging portion; 36c…threaded hole; 38…insulating sheet; 40…TIM; 42…relay connector board; 42e…elastic pin; 44…back plate; 44a…stud; 46…screw (fastening component); 47…flat portion; 48…edge protrusion; 48a…board support protrusion; 48b…wall portion; 50…module confirmation cutout. DETAILED DESCRIPTION

[0022] Hereinafter, examples of the module mounting structure and the electronic device according to the embodiment of the present invention will be described in detail based on the drawings. However, the present invention is not limited to the examples.

[0023] Figure 1 1 is a perspective view of an electronic device according to an embodiment of the present invention, namely, a notebook PC 10. The notebook PC 10 includes a module mounting structure 12 according to an embodiment of the present invention. The module mounting structure 12 is assembled inside a frame 14 of the notebook PC 10. The electronic device according to the present invention is not limited to the notebook PC 10, and may be, for example, a desktop PC, a mobile tablet terminal, etc.

[0024] The cover 16 of the notebook PC 10 can be opened and closed relative to the frame 14 by a hinge 18 , and the notebook PC 10 becomes compact by closing the cover 16 , which is suitable for mobile use.

[0025] The housing 14 is provided with a keyboard device 20 and a touch pad 22. The front surface of the cover 16 is provided with a display device 24 occupying most of the area thereof, and a speaker and a camera (not shown).

[0026] The module mounting structure 12 is assembled to the frame 14. The module mounting structure 12 includes a memory module 26 and a substrate 28. The substrate 28 is a main substrate in the notebook PC 10 and is provided substantially across both left and right ends inside the frame 14. A CPU 28a that controls the entire notebook PC 10 is mounted on the substrate 28.

[0027] Figure 22 is a perspective view of a memory module 26. The memory module 26 is a module in which four memory chips 32 and a power chip 34 are mounted on a module board 30 of a PCB. The memory module 26 is a module based on, for example, a CAMM (Compression Attached Memory Module). The memory chip 32 is a chip that is read and written by a CPU 28a. The present invention can also be applied to modules other than the memory module 26 (SSD, etc.) and semiconductor chips other than the memory chip 32 (CPU, etc.).

[0028] The module board 30 has a surface 30a on which the memory chip 32 and the power chip 34 are mounted, and the opposite side is a back surface 30b. The module board 30 is long in the X direction and short in the Y direction, and a trapezoidal bulge 30c is formed on one of the long sides for mounting the power chip 34. The X direction, the Y direction, and the Z direction described later are orthogonal to each other.

[0029] The four memory chips 32 are respectively roughly square and arranged in a straight line along the X direction. The memory chips 32 are arranged in groups of two and adjacent to each other, and a central threaded space 30d is ensured between each group. The end threaded space 30e is ensured at both ends of the module board 30 in the X direction. Stud holes 30f are formed in the approximate center of the Y direction in the central threaded space 30d and the end threaded space 30e. The width of the central threaded space 30d and the end threaded space 30e in the X direction is about 3 to 5 times that of the stud hole 30f. The stud 44a and the screw 46 described later are inserted into the stud hole 30f. In other words, the memory chips 32 in groups of two are arranged at a position clamped by the screws 46 on both sides of the X direction.

[0030] Pin holes 30g are formed in the central thread space 30d at the side opposite to the bulging portion 30c (hereinafter also referred to as the Y1 side) and in the end thread space 30e at the side close to the bulging portion 30c (hereinafter also referred to as the Y2 side). The width of the memory board 30 in the Y direction except for the bulging portion 30c is slightly larger than that of the memory chip 32. A plurality of contact portions 30h are provided in a matrix on the back side 30b of the module board 30 (see Fig. 9 ). In the case of this embodiment, the number of the contact portions 30h is greater than 600. The contact portions 30h are generally located at the back side of the memory chip 32. Therefore, the module board 30 has almost no wasted space on the surface 30a and the back side 30b, and the area efficiency is good, which contributes to the miniaturization of the memory module 26.

[0031] Figure 3 It is a perspective view of the module mounting structure 12 . Figure 4 It is an exploded perspective view of the module mounting structure 12 . Figure 5It is a partially enlarged sectional stereoscopic view of the module mounting structure 12 . Figure 6 It is a top view of the cover 36. Figure 7 This is a perspective view of the cover 36 as viewed from the back side.

[0032] The module mounting structure 12 includes, in addition to the memory module 26 and the substrate 28, a cover 36, an insulating sheet (insulating material) 38, a TIM (Thermal Interface Material) 40, a relay connector plate 42, a back plate 44, and three screws (fastening components) 46. The module mounting structure 12 is fastened by the screws 46 in a stacked state in the Z direction in the order of the cover 36, the TIM 40, the memory module 26, the relay connector plate 42, the substrate 28, and the back plate 44.

[0033] The cover 36 covers the side of the surface 30 a of the memory module 26 on which the memory chip 32 is mounted, and is formed by cutting or die-casting a metal material such as aluminum.

[0034] The cover 36 has a shape and size substantially the same as the module plate 30 when viewed from above, and includes a rectangular portion 36a and a trapezoidal bulge 36b. The bulge 36b covers the bulge 30c of the module plate 30, and the rectangular portion 36a covers the rest of the bulge. The bulge 30c is slightly thinner in the Z direction than the rectangular portion 36a. The rectangular portion 36a has a flat portion 47 and an edge protrusion 48. The edge protrusion 48 is formed to protrude from the edge of the rectangular portion 36a toward the substrate 28 side. The rectangular portion 36a has the edge protrusion 48 provided around it, so it has high rigidity and is less prone to buckling or twisting. Small module confirmation cutouts 50 are formed at the four corners of the rectangular portion 36a of the cover 36 to expose the four corners of the module plate 30.

[0035] The edge protrusion 48 has a two-stage shape, namely, a plate support protrusion 48a abutting along the edge of the surface 30a of the module plate 30 and a wall 48b protruding outward from the edge of the module plate 30. The plate support protrusion 48a and the wall 48b may be separated.

[0036] The plate support protrusion 48a is formed to slightly enter the edges at both ends of the rectangular portion 36a in the X direction, the entire length of the edge in the Y1 direction, and the boundary between the edge in the Y2 direction and the bulging portion 36b. The plate support protrusion 48a also has a portion 36e protruding from the edge in the Y1 direction to the Y2 direction at the middle position in the X direction, and a threaded hole 36c and a pin confirmation hole 36d are provided in the portion 36e and the edges at both ends in the X direction. The plate support protrusion 48a becomes an inner path that avoids the module confirmation cutout 50 at the four corners of the rectangular portion 36a. The plate support protrusion 48a is conceptually a shape formed by combining the angle C and E. The threaded hole 36c and the pin confirmation hole 36d are located at positions corresponding to the above-mentioned stud hole 30f and the pin hole 30g.

[0037] The wall portion 48b is in an angular C shape except for the boundary between the rectangular portion 36a and the bulging portion 36b. Although the wall portion 48b is conceptually in an angular C shape, it is discontinuous at the module confirmation cutouts 50 at the four corners of the rectangular portion 36a.

[0038] The board support protrusion 48a is in contact with the module board 30 via the insulating sheet 38 in a manner that it extends along each memory chip 32 and surrounds the four memory chips 32. The board support protrusion 48a is discontinuous at the portion of the bulge 36b because no load is applied to the wiring pattern of the memory chip 32 and the power chip 34. The board support protrusion 48a has an appropriate width so that no local load is applied to the module board 30. The insulating sheet 38 has the same shape as the board support protrusion 48a and is attached to the board support protrusion 48a. Holes and cutouts corresponding to the stud holes 30f and the pin holes 30g are provided in the insulating sheet 38. By providing the insulating sheet 38 between the board support protrusion 48a and the module board 30, short circuits of the patterns of the module board 30 and the like are prevented.

[0039] The wall portion 48b protrudes beyond the edge of the module plate 30 but does not abut against the base plate 28 (see Figure 5 ). The wall portion 48b contacts the edge of the module plate 30 to position the cover 36. The wall portion 48b is thinner than the plate support protrusion 48a, and is approximately 1 / 5 in the present embodiment.

[0040] The memory chip 32 has a cover 36 on the upper side, is almost covered by the edge protrusion 48 on the side, and has a back plate 44 below via the substrate 28 and the like, so that electromagnetic leakage is small.

[0041] A TIM40 is provided between the cover 36 and the memory chip 32 to transfer the heat of the memory chip 32 to the cover 36 for heat dissipation. There are two TIM40, corresponding to two adjacent groups of memory chips 32. The TIM40 is, for example, a heat conducting sheet. In order to improve the heat dissipation effect, the area of ​​the cover 36 can be increased, or it can be in thermal contact with other heat conducting materials. In the case where heat dissipation of the memory chip 32 is not required, the TIM40 can also be omitted.

[0042] Figure 8 : is a schematic cross-sectional view showing a threaded hole 36c and a screw 46 provided in the threaded hole 36c. Countersunk holes 36ca are formed around the threaded hole 36c. The screw 46 is a fastening screw, and a neck 46c is provided between a head 46a and a threaded portion 46b. After the screw 46 is screwed into the threaded portion 46b and penetrates the internal threaded portion of the threaded hole 36c, it must be pulled out while rotating in the opposite direction. Therefore, the screw 46 basically cannot fall off, can prevent loss, and can prevent short circuits on the substrate 28, etc. A washer 46d is provided on the neck 46c.

[0043] Return to Figure 4 , the relay connector plate 42 becomes a rectangle slightly smaller than the rectangular portion 36a of the module board 30. The relay connector plate 42 is arranged between the portion of the memory module 26 where the memory chip 32 is mounted and the back side of the central threaded space 30d and the substrate 28. The relay connector plate 42 is arranged to cross the portion of the central threaded space 30d, but it can also be divided into two left and right parts with the portion of the central threaded space 30d as the boundary. The relay connector plate 42 ensures a central threaded space 42a and an end threaded space 42b that are the same as the above-mentioned central threaded space 30d and the end threaded space 30e, and stud holes 42c are formed respectively. In addition, in the central threaded space 42a and the end threaded space 42b, positioning pins 42d protruding up and down are provided at positions corresponding to the above-mentioned pin holes 30g.

[0044] In the relay connector plate 42, a plurality of elastic pins 42e are provided in the area other than the central thread space 42a and the end thread space 42b. The elastic pins 42e are located at the contact point 28b of the substrate 28 and the contact point 30h of the module plate 30 (see Fig. 9 ) corresponding to the position.

[0045] In addition, the base plate 28 is provided with a contact portion 28b at a position corresponding to the contact portion 30h. The base plate 28 is provided with a stud hole 28c at a position corresponding to the stud hole 30f described above, and a pin hole 28d at a position corresponding to the pin hole 30g.

[0046] Fig. 9 2 is a schematic cross-sectional view showing the memory module 26, the relay connector board 42, the substrate 28, and the backplane 44. Fig. 9 (a) is a diagram showing the state before assembly, Fig. 9 (b) is a diagram showing the assembled state.

[0047] like Fig. 9 As shown in (a), the elastic pin 42e of the relay connector plate 42 is substantially heart-shaped and protrudes up and down before assembling the module mounting structure 12. At this time, the parts of the elastic pin 42e protruding up and down are discontinuous and non-contacting at the middle positions between each other.

[0048] like Fig. 9 As shown in (b), at the stage after the module mounting structure 12 is assembled, the relay connector plate 42 is clamped and pressed by the substrate 28 and the back surface 30b of the module plate 30. As a result, the elastic pins 42e are elastically compressed from top to bottom, so that the contact portion 30h of the module plate 30 and the contact portion 28b of the substrate 28 are connected. At this time, the elastic pins 42e contact each other at the middle position and the resistance between the top and the bottom is reduced. In addition, the repulsive force on the contact portions 28b and 30h increases and the contact resistance decreases.

[0049] Return to Figure 4 The back plate 44 is made of a metal material, supports the substrate 28 from the back side, and has a substantially same rectangular shape as the rectangular portion 36a of the module plate 30. An insulating sheet may be provided between the back plate 44 and the substrate 28. The back plate 44 is provided with a stud 44a at a position corresponding to the stud hole 30f described above, and a pin hole 44b at a position corresponding to the pin hole 30g.

[0050] The upwardly protruding portions of the three positioning pins 42d of the relay connector plate 42 are respectively embedded in the pin holes 30g of the module plate 30 for positioning. This portion can be confirmed from the pin confirmation hole 36d of the cover 36. The downwardly protruding portions of the three positioning pins 42d of the relay connector plate 42 are respectively embedded in the pin holes 28d and 44b of the substrate 28 and the back plate 44 for positioning. The stud 44a is embedded in the stud holes 28c, 42c, and 30f of the substrate 28, the relay connector plate 42, and the module plate 30 for screwing with the screw 46 provided on the cover 36. Thus, the cover 36, the insulating sheet 38, the TM40, the memory module 26, the relay connector plate 42, the substrate 28, and the back plate 44 are fixed in a stacked state in the Z direction, forming the module mounting structure 12.

[0051] Fig.10 3 is an enlarged plan view showing a corner of the cover 36. In the assembled module mounting structure 12, the four corners of the module board 30 can be visually confirmed from the module confirmation notches 50 formed at the corners of the cover 36. Therefore, it can be confirmed that the memory module 26 is not missing and is fixed in the correct position.

[0052] Fig.11 is a schematic cross-sectional view of the module mounting structure 12. Fig.11 In the figure, the edge protrusion 48 is omitted at the left end so that other parts can be visually confirmed, and the wall part 48b is shown at the right end without being cut off. In addition, the plate support protrusion 48a is cut off at the boundary with the wall part 48b, but the hatching is omitted to avoid complexity. For parts other than the edge protrusion 48, the center part in the Y direction is cut off and hatched. TIM40 is omitted.

[0053] like Fig.11 As shown, the module board 30 is fixed by screwing three screws 46 into the studs 44a, and each two memory chips 32 are arranged at positions sandwiched by the two screws 46 on both sides and are accordingly stable. However, as described above, the contact portions 28b and 30h receive repulsive force from the elastic pins 42e, and since there are a plurality of elastic pins 42e, the entire module board 30 receives a considerable force from the relay connector board 42, so that as shown by the imaginary lines, the middle portion between the two screws 46 is warped, and there is a concern that stress is applied to the memory chips 32 on the surface 30a.

[0054] In contrast, in the module mounting structure 12 and the electronic device 10 according to the present embodiment, the plate supporting protrusion 48a of the cover 36 protrudes toward the substrate 28 and abuts against the module plate 30 at a position along the memory chip 32, thereby preventing the module plate 30 from warping and preventing stress from being applied to the memory chip 32.

[0055] The board support protrusion 48a can be flexibly applied according to the configuration of the module board 30 and the memory chips 32. However, in the present embodiment, the four memory chips 32 are arranged in a straight line in the X direction. Accordingly, the board support protrusion 48a is at least on the Y1 side (refer to Figure 7 ) is set within the range of L3 which is longer than the total length L4 of the four memory chips 32 in the X direction, and the module board 30 can be maintained in a flat state at least on the Y1 side. The range of L3 is the approximate total length of the rectangular portion 36a excluding the range of the module confirmation cutout 50. If the interval between the screws 46 is L1, the range including the three screws 46, that is, the range of L1+L1, can more reliably maintain the module board 30 in a flat state.

[0056] It is considered that the module board 30 is subjected to the greatest force at the midpoint of the line segment L1 connecting the two screws 46, that is, at a distance L2 (= L1 / 2) from the screw 46. Therefore, it is preferred that the board support protrusion presses the module board 30 at least in this portion. In other words, the board support protrusion 48a can be provided at the perpendicular bisector L1 including the line segment L1 connecting at least two screws 46. M The location of Figure 7As shown, the plate supporting protrusion 48a is provided at a position including the perpendicular bisector LM on both sides of the Y1 side and the Y2 side of the rectangular portion 36a.

[0057] The board support protrusion 48a extends not only in the X direction but also in the Y direction, and can more reliably hold the module board 30 in a flat state. In particular, the board support protrusion 48a is provided over the entire length in the Y direction near the memory chip 32 at both ends in the X direction, and the X-direction extension portion and the end portion are connected to each other as a whole, so that the X-direction extension portion and the Y-direction extension portion complement each other in strength, and the module board 30 can be held more reliably.

[0058] Most of the memory chips 32 are roughly square, and a plurality of them are arranged in a straight line in the X direction, so that even if the total dimension L4 in the X direction becomes larger, the dimension in the Y direction is relatively small. Therefore, due to design constraints, even if the board support protrusion 48a cannot be provided on one of the Y1 side or the Y2 side, as long as it is provided along the entire length of the memory chip 32 in the Y direction, the warping of the module board 30 can be prevented accordingly. In addition, like the module board 30, the substrate 28 is also subjected to a large elastic force, but the substrate 28 is supported by the back plate 44, so there is no warping. In the case where the strength of the substrate 28 is high enough, the back plate 44 can be omitted and the stud 44a can be directly provided on the substrate 28.

[0059] The module board 30 is prevented from warping by the board support protrusion 48a, while the flat portion 47 (see Figure 7 ) has the functions of connecting the four-sided board support protrusions 48a to each other, preventing electromagnetic leakage and heat dissipation, but does not directly contribute to the warping of the module board 30. Therefore, according to the design conditions, the flat portion 47 does not need to cover the entire surface of the rectangular portion 36a, and a part of it can be exposed. In the above example, the pin confirmation hole 36d and the module confirmation notch 50 become the exposed part. A hole that can confirm the model or shape of the memory chip 32 can also be provided in the flat portion 47.

[0060] The present invention is not limited to the above-described embodiments, and can of course be freely modified within a scope not departing from the gist of the present invention.

Claims

1. A module mounting structure, which is a module mounting structure for mounting a module on a substrate, wherein the module has a chip on the module board, characterized in that: have: A cover covering a surface of the module on which the chip is mounted; A relay connector board is provided between the back side of the module where the chip is mounted and the substrate, and allows the plurality of contact points of the module and the substrate to contact each other through a plurality of elastic pins; and a fastening member for fastening the stacked cover, the module board, the relay connector board, and the substrate in a stacking direction, The cover includes a board support protrusion that protrudes toward the substrate and abuts against the module board at a position along the chip.

2. The module installation structure according to claim 1, characterized in that: The cover has a wall portion that protrudes outwardly from the edge of the module panel on the outer side of the panel support protrusion.

3. The module installation structure according to claim 2, characterized in that: The cover is positioned by the wall portion abutting against the edge of the module panel.

4. The module installation structure according to claim 1, characterized in that: The above-mentioned fastening components are provided in plurality. The chip is disposed at a position clamped by the plurality of fastening members.

5. The module installation structure according to claim 4, characterized in that: The plate supporting protrusion is provided along the entire length of a line segment connecting the two fastening members.

6. The module installation structure according to claim 4, characterized in that: The plate supporting protrusion is provided at a position including a perpendicular bisector of a line segment connecting at least two of the fastening members.

7. The module installation structure according to claim 1, characterized in that: Arrange a plurality of the above chips in a straight line, At least one of the plate supporting protrusions is provided over the total length of the plurality of chips in the arrangement direction.

8. The module installation structure according to claim 1, characterized in that: The fastening member is a captive screw that is inserted into the threaded hole of the cover in a manner that it cannot fall off.

9. The module installation structure according to claim 1, characterized in that: The cover is formed with a module confirmation notch for exposing a corner portion of the module plate.

10. The module installation structure according to claim 1, characterized in that: The cover is made of metal material.

11. The module installation structure according to claim 10, characterized in that: A TIM is provided between the cover and the chip.

12. The module installation structure according to claim 1, characterized in that: An insulating material is provided between the panel support projection and the module panel.

13. A modular electronic device, which is an electronic device in which a module is mounted on a substrate, wherein the module has a chip on the module board, characterized in that: have: A cover covering a surface of the module on which the chip is mounted; A relay connector board is provided between the back side of the module where the chip is mounted and the substrate, and allows the plurality of contact points of the module and the substrate to contact each other through a plurality of elastic pins; and a fastening member for fastening the stacked cover, the module board, the relay connector board, and the substrate in a stacking direction, The cover includes a board support protrusion that protrudes toward the substrate and contacts the module board along the periphery of the chip.

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